CN115019636B - Flexible display module and electronic equipment - Google Patents
Flexible display module and electronic equipment Download PDFInfo
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- CN115019636B CN115019636B CN202111246620.XA CN202111246620A CN115019636B CN 115019636 B CN115019636 B CN 115019636B CN 202111246620 A CN202111246620 A CN 202111246620A CN 115019636 B CN115019636 B CN 115019636B
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- flexible display
- display module
- driving chip
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- recess
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a flexible display module and electronic equipment. The flexible display module assembly includes at least: the backboard comprises a first surface, a second surface and a first concave part, wherein the first surface and the second surface are oppositely arranged along the thickness direction of the backboard, and the first concave part is concave from the second surface to the first surface; the flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface; the driving chip is arranged on one side of the binding part, which is away from the display part; the support component is arranged on one side of the binding face towards the backboard, at least part of the support component is accommodated in the first concave part, and the driving chip, the support component and the first concave part are correspondingly arranged along the thickness direction. The flexible display module can reduce the possibility of breakage and damage of the driving chip and reduce the overall thickness of the flexible display module.
Description
Technical Field
The embodiment of the application relates to the technical field of terminals, in particular to a flexible display module and electronic equipment.
Background
The organic light emitting diode (Organic Light Emitting Display, OLED) display module has the performances of self-luminescence, low driving voltage, high luminous efficiency, high definition, high contrast and the like. The organic light-emitting diode display module can realize flexible display and large-area full-color display. The organic light emitting diode display module is a flexible display module. The full screen or the folding screen usually adopts an organic light emitting diode display module. The flexible display module has the characteristics of being bendable and easy to carry, and the application range of the flexible display module is wider and wider. The organic light emitting diode display module includes a display portion and a Driver IC. The driving chip is used for transmitting driving signals to the display part so that the display part displays corresponding images. In order to reduce the frame of the display module to realize overall display, the driving chip and the binding portion where the driving chip is disposed are generally bent to the back of the display portion. In the use process of the display module, the situation that the driving chip is broken and damaged exists, so that the display module cannot normally display. In order to reduce the possibility of damage to the driving chip, a support is provided between the driving chip and the display portion. The supporting piece can improve the rigidity of the binding area, and the possibility of damage to the driving chip caused by external impact or extrusion is reduced. However, the thickness of the display module is increased by the support member, which is not beneficial to the light and thin design of the display module.
Disclosure of Invention
The embodiment of the application provides a flexible display module and electronic equipment, which can reduce the possibility of breakage and damage of a driving chip, reduce the overall thickness of the flexible display module and are beneficial to the light and thin design of the flexible display module.
The first aspect of the present application provides a flexible display module, for an electronic device, which at least includes:
the backboard comprises a first surface, a second surface and a first concave part, wherein the first surface and the second surface are oppositely arranged along the thickness direction of the backboard, and the first concave part is concave from the second surface to the first surface;
the flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface;
the driving chip is arranged on one side of the binding part, which is away from the display part;
the support component is arranged on one side of the binding face towards the backboard, at least part of the support component is accommodated in the first concave part, and the driving chip, the support component and the first concave part are correspondingly arranged along the thickness direction.
In the flexible display module provided by the embodiment of the application, the driving chip, the supporting component, the back plate and the display part are stacked along the thickness direction of the back plate. The support component is arranged between the driving chip and the display part. The support assembly may form a shield for the driver chip. When the display part is pressed and the pressing area is depressed, the depressed part of the display part presses the back plate, and then the back plate transmits external force to the supporting component. The supporting component can apply a reaction force to the display part so as to effectively buffer external acting force, or the supporting component can wholly move downwards, so that the driving chip can be driven to wholly move downwards. Therefore, stress concentration on the driving chip is not easy to occur, and local bending deformation occurs. The supporting component can reduce the external acting force born by the whole driving chip, and the whole driving chip is uniformly stressed, so that the possibility of cracking and damaging the driving chip is effectively reduced. The backboard is provided with a first concave part, and the driving chip, the supporting component and the first concave part are correspondingly arranged. At least part of the supporting component is accommodated in the first concave part, so that the occupied space of the supporting component in the thickness direction is reduced, the whole thickness of the area corresponding to the flexible display module and the driving chip can be reduced, and the light and thin design of the flexible display module is facilitated.
In one possible embodiment, the back plate has a side surface facing the bending portion, and the first recess penetrates the side surface, or the first side wall of the first recess is spaced apart from the side surface.
In one possible embodiment, the shape of the support assembly matches the shape of the first recess.
In one possible embodiment, the forward projected area of the support assembly is greater than the forward projected area of the driver chip in the thickness direction.
In one possible embodiment, the support assembly includes a first support member and a connecting member, the connecting member connects the first support member and the first bottom wall of the first recess, the first support member includes a base portion and a protrusion, the protrusion is located on a side of the base portion facing away from the first surface, the base portion and the protrusion form an accommodating space, at least part of the binding portion is located in the accommodating space, the binding portion is connected to the base portion, and the driving chip is disposed corresponding to the accommodating space in a thickness direction.
In one possible embodiment, the protruding portion is disposed in a region of the base portion away from the bending portion, and the protruding portion is located on a side of the driving chip facing away from the bending portion.
In one possible embodiment, the protruding portion is provided in a region of the base portion near the bending portion, and the protruding portion is located on a side of the driving chip facing the bending portion.
In one possible embodiment, the length of the driving chip is smaller than or equal to the length of the protruding portion in the axial direction of the bent portion.
In one possible embodiment, the surface of the driving chip facing away from the back plate is higher than the surface of the protrusion facing away from the back plate in the thickness direction.
In one possible embodiment, the elastic modulus of the material of the first support is greater than 70GPa.
In one possible embodiment, the material of the first support is selected from any one of silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
In one possible embodiment, the flexible display module further includes a second support member disposed on a side of the binding portion opposite to the display portion, and the second support member is disposed at a distance from the driving chip.
In one possible embodiment, the thickness of the second support is smaller than the thickness of the driving chip in the thickness direction.
In one possible embodiment, the length of the driving chip is smaller than or equal to the length of the second support in the axial direction of the bending portion.
In one possible embodiment, the second support is located on the side of the drive chip facing the fold.
In one possible embodiment, the forward projected area of the support assembly is greater than the forward projected area of the second support in the thickness direction.
In one possible embodiment, the back plate further includes a second recess portion, the second recess portion is recessed from the second surface toward the first surface, the flexible display module further includes a flexible circuit board, the flexible circuit board is located on a side of the driving chip facing away from the bending portion, the flexible circuit board is connected to the binding portion and electrically connected to the driving chip, and at least part of the flexible circuit board is located in the second recess portion.
In one possible embodiment, the first side wall of the first recess and the second side wall of the second recess are disposed at intervals, and the second recess is located on a side of the first recess away from the bending portion.
In one possible embodiment, the flexible display member is a flexible screen; or, the flexible display part comprises a flexible screen and a flexible switching circuit board which are connected, the switching circuit board is positioned at the binding part, and the driving chip is arranged on the switching circuit board.
In one possible embodiment, the first surface and the second surface are both planar.
In one possible embodiment, the binding is bonded to the support assembly.
In one possible embodiment, the back plate includes a first supporting portion, an intermediate supporting portion and a second supporting portion, the first recess portion is disposed on the first supporting portion, the back plate has a folded state and an unfolded state, the back plate is used for driving the display portion to fold or unfold, the first supporting portion, the intermediate supporting portion and the second supporting portion are flush with each other in the unfolded state, and in the folded state, the first supporting portion and the second supporting portion are both folded toward the intermediate supporting portion.
The second aspect of the present application provides an electronic device, which at least includes the flexible display module set described above.
Drawings
FIG. 1 is a schematic view of an electronic device in an unfolded state;
FIG. 2 is a schematic view of the electronic device shown in FIG. 1 in a semi-folded state;
FIG. 3 is a schematic view of the electronic device of FIG. 1 in a folded state;
FIG. 4 is a partially exploded view of the electronic device of FIG. 1;
fig. 5 is a schematic view showing a partial structure of a back surface of a flexible display module according to the related art;
FIG. 6 is a schematic cross-sectional view taken along the direction A-A in FIG. 5;
FIG. 7 is a schematic view of a partial structure of a back surface of a flexible display module according to an embodiment of the application;
FIG. 8 is a schematic cross-sectional view of the structure of FIG. 7 taken along the direction B-B;
FIG. 9 is an enlarged schematic view of FIG. 8 at C;
FIG. 10 is a schematic view of a back structure of a back plate according to an embodiment of the present application;
FIG. 11 is a schematic view of a partial structure of a back surface of a flexible display module according to an embodiment of the application;
FIG. 12 is a schematic cross-sectional view of the structure of FIG. 11 taken along the direction D-D;
FIG. 13 is an enlarged schematic view of FIG. 12 at E;
fig. 14 is a schematic partial cross-sectional structure of a flexible display module according to an embodiment of the application;
Fig. 15 is a schematic view of a partial cross-sectional structure of a flexible display module according to another embodiment of the present application;
fig. 16 is a schematic view of a partially cross-sectional structure of a flexible display module according to still another embodiment of the present application;
FIG. 17 is a schematic view of a flexible display module according to another embodiment of the present application;
fig. 18 is a schematic view of a partially cross-sectional structure of a flexible display module according to still another embodiment of the present application;
fig. 19 is a schematic view of a partially cross-sectional structure of a flexible display module according to still another embodiment of the present application;
fig. 20 is a schematic partial cross-sectional view of a flexible display module according to still another embodiment of the present application.
Marking:
10. an electronic device; 11. a first housing; 12. a second housing; 13. a hinge;
20. a flexible display module; 201. a first display area; 202. a second display area; 203. a third display area;
30. a driving chip;
40. a support body;
50. a back plate; 501. a first surface; 502. a second surface; 503. a first concave portion; 5031. a first bottom wall; 5032. a first sidewall; 5032a, a first wall; 5032b, a second wall; 5032c, a third wall; 5032d, fourth wall surface; 5032e, fifth wall surface; 504. a side surface; 505. a second concave portion; 5051. a second bottom wall; 5052. a second sidewall; 51. a first support portion; 52. a second supporting part; 53. an intermediate support portion; 531. a slit;
60. A flexible display member; 601. a display unit; 602. a bending part; 603. a binding portion; 61. a flexible screen; 62. a switching circuit board;
70. a support assembly; 71. a first support; 71a, an accommodation space; 711. a base; 712. a convex portion; 72. a connecting piece;
80. a second support;
90. a flexible circuit board;
100. a shielding member;
x, thickness direction;
y, axial direction.
Detailed Description
The electronic device in the embodiment of the present application may be referred to as a User Equipment (UE) or a terminal (terminal), and the electronic device may be, for example, a tablet (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned (self driving), a wireless terminal in remote medical (remote media), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), or a mobile terminal or a fixed terminal. The form of the terminal device in the embodiment of the application is not particularly limited.
In an embodiment of the present application, fig. 1 schematically shows a structure of an electronic device. Referring to fig. 1, an electronic device 10 is illustrated as a handheld device having wireless communication capabilities. The handheld device of the wireless communication function may be a mobile phone, for example. For example, the handset may be a foldable handset including a flexible display module.
Fig. 2 schematically shows the structure of the electronic device 10 in a semi-folded state. Fig. 3 schematically shows the structure of the electronic device 10 in a folded state. Referring to fig. 2 and 3, the electronic device 10 includes a first housing 11, a second housing 12, and a hinge 13. The first housing 11 and the second housing 12 are located on both sides of the hinge 13, respectively. The first housing 11 and the second housing 12 are connected to a hinge 13, respectively. For example, the first housing 11 and the second housing 12 may be connected to the hinge 13 by welding or fastening, respectively. The first housing 11 and the second housing 12 are rotatable and foldable with respect to the hinge 13, respectively. When the first casing 11 and the second casing 12 are close to each other and stacked on each other, the electronic apparatus 10 is in a folded state. When the first housing 11 and the second housing 12 are away from each other from the stacked state and the first housing 11 and the second housing 12 are rotated to be unable to rotate, the electronic apparatus 10 is in the unfolded state. The process of the first housing 11 and the second housing 12 from the folded state to the unfolded state is an unfolding process, and the process from the unfolded state to the folded state is a folding process. Illustratively, the number of first housings 11 and second housings 12 may each be one. When the electronic apparatus 10 is in the folded state, the first casing 11 and the second casing 12 are laminated in a two-layer structure.
Fig. 4 schematically shows a partially exploded structure of the electronic device 10 of an embodiment. Referring to fig. 4, the electronic device 10 further includes a flexible display module 20. The flexible display module 20 has a display area for displaying image information. The flexible display module 20 may be disposed on the first housing 11, the hinge 13, and the second housing 12, and a display area of the flexible display module 20 is exposed so as to present image information to a user. The flexible display module 20 includes a first display area 201, a second display area 202, and a third display area 203. The first display area 201 is disposed corresponding to the first housing 11. The second display area 202 is disposed corresponding to the second housing 12. The third display area 203 is provided corresponding to the hinge 13. The flexible display module 20 has a bending property and can deform after being subjected to external force. When the first housing 11 and the second housing 12 are in the folded state, the flexible display module 20 is in the folded state. The first display area 201 and the second display area 202 of the flexible display module 20 are close to each other, and the third display area 203 may be bent into an arc state. When the first housing 11 and the second housing 12 are in the unfolded state, the flexible display module 20 is in the unfolded state, and the first display area 201, the second display area 202, and the third display area 203 are in the flat state.
The electronic device 10 may be folded or unfolded to change its overall size, and may have a larger display area in the unfolded state.
Fig. 5 schematically shows a partial structure of the back surface of the flexible display module 20 of an embodiment. Referring to fig. 5 and 6, the flexible display module 20 includes a driving chip 30. The driving chip 30 is used for transmitting a driving signal to the flexible display module 20 so that the display area of the flexible display module 20 displays a corresponding image. The driver chip 30 may be formed by wafer dicing. The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit. The main material of the driving chip 30 is silicon, so that the driving chip 30 has low rigidity and weak deformation resistance, and therefore the driving chip 30 is easy to break and damage when being subjected to external force. The driving chip 30 is generally arranged on the back surface of the flexible display module 20, so that the black frame area at the edge of the flexible display module 20 can be reduced, the display area can be increased, and the full-screen display effect of the flexible display module 20 can be realized.
The flexible display module 20 has a touch function. The user may touch the display area of the flexible display module 20 by hand to execute the corresponding operation instruction. Since the flexible display module 20 is soft, the display area is deformed and recessed downward when a large compressive stress is applied to the display area by the user's hand. If a user's hand applies a large pressure to the display area above the driving chip 30, the driving chip 30 is pressed after the display area is depressed. When the pressing force applied to the driving chip 30 is large, the driving chip 30 is at risk of breakage.
The flexible display module 20 includes a support body 40. The support 40 is disposed between the driving chip 30 and the display area. The support body 40 is a rigid structural member so as to have high rigidity and deformation resistance. For example, the support 40 may be an aluminum alloy having a thickness of 0.2 mm. The elastic modulus of the aluminum alloy may be 70GPa. The support 40 may form a protection for the driving chip 30. When the display area is recessed, the supporting body 40 can apply a reaction force to the display area to effectively buffer the external force, or the supporting body 40 moves down integrally, so that the supporting body 40 can drive the driving chip 30 to move down integrally, and the driving chip 30 is not easy to be broken and damaged due to stress concentration. The supporting body 40 can effectively reduce the external acting force applied to the whole driving chip 30 and ensure the whole driving chip 30 to be uniformly stressed, thereby effectively reducing the possibility of cracking and damaging the driving chip 30. However, the area corresponding to the driving chip 30 is generally the area with the greatest thickness of the flexible display module 20, so the thickness of the area is additionally increased by the support body 40, which results in an increase of the overall thickness of the flexible display module 20, and affects the light and thin design of the flexible display module 20.
The flexible display module 20 provided by the embodiment of the application can reduce the possibility of breakage and damage of the driving chip 30, and simultaneously can reduce the overall thickness of the flexible display module 20, thereby being beneficial to the light and thin design of the flexible display module 20.
The following describes an implementation manner of the flexible display module 20 according to the embodiment of the present application.
Fig. 7 schematically shows a partial structure of the back surface of the flexible display module 20 of an embodiment. Referring to fig. 7 to 9, the flexible display module 20 of the embodiment of the present application includes a back plate 50, a flexible display member 60, a driving chip 30, and a support assembly 70. The back plate 50 includes a first surface 501, a second surface 502, and a first recess 503. The first surface 501 and the second surface 502 are disposed opposite to each other in the thickness direction X of the back plate 50. The first recess 503 is recessed from the second surface 502 toward the first surface 501. The flexible display member 60 includes a display portion 601, a bending portion 602, and a binding portion 603. The bending portion 602 connects the display portion 601 and the binding portion 603. The display unit 601 displays image information. The portion of the flexible display member 60 beyond the display 601 is folded over towards the second surface 502 of the back plate 50. The flexible display member 60 has a bent portion 602 and a binding portion 603 formed at a portion thereof beyond the display portion 601. The flexible display member 60 itself is easily deformed by an external force. The display portion 601 of the flexible display member 60 is provided on the first surface 501 side of the back plate 50. The back plate 50 can provide good support for the display portion 601, so that the display portion 601 is guaranteed to have good flatness, the display portion 601 is not prone to dent deformation when being subjected to external force, and the dent deformation of the display portion 601 is reduced. Binding 603 is located on one side of second surface 502. The driving chip 30 is disposed on a side of the binding portion 603 facing away from the display portion 601, so that the driving chip 30 is located on the back surface of the flexible display module 20. The driving chip 30 is used to transmit a driving signal to the flexible display part 60 to cause the display part 601 to display corresponding image information. The support member 70 is disposed on a side of the binding portion 603 facing the back plate 50. At least a portion of the support assembly 70 is received within the first recess 503. A portion of the support assembly 70 may be received in the first recess 503, and another portion is located outside the first recess 503. Alternatively, the support assembly 70 is integrally received in the first recess 503. The driving chip 30, the supporting member 70 and the first recess 503 are disposed correspondingly along the thickness direction X of the back plate 50.
In the embodiment of the present application, the driving chip 30, the supporting member 70, the back plate 50 and the display portion 601 are stacked in the thickness direction X of the back plate 50. The support assembly 70 is disposed between the driving chip 30 and the display part 601. The support assembly 70 may form a shield for the driving chip 30. When the display part 601 is pressed and depressions occur in the pressed area, the depressed portions of the display part 601 press the back plate 50, and then the back plate 50 transmits external force to the support assembly 70. The supporting assembly 70 may apply a reaction force to the display part 601 to effectively buffer an external force, or the supporting assembly 70 may be moved downward entirely, so that the driving chip 30 may be driven to move downward entirely. Therefore, stress concentration is less likely to occur on the driving chip 30, and local bending deformation occurs. The support assembly 70 can reduce the external force applied to the whole driving chip 30 and make the whole driving chip 30 uniformly stressed, thereby effectively reducing the possibility of cracking and damaging the driving chip 30. The back plate 50 has a first recess 503, and the driving chip 30, the supporting component 70 and the first recess 503 are correspondingly disposed. At least a portion of the supporting component 70 is accommodated in the first recess 503, so that the space occupied by the supporting component 70 in the thickness direction X is reduced, and thus the overall thickness of the area corresponding to the flexible display module 20 and the driving chip 30 can be reduced, which is beneficial to realizing the light and thin design of the flexible display module 20.
In some implementations, the back plate 50 is a rigid structural member. The material of the back plate 50 may be copper, copper alloy, steel, titanium or titanium alloy. For example, the material of the back plate 50 may be titanium or a titanium alloy. The thickness of the back plate 50 is small, so that the back plate 50 can be bent and deformed, and when the flexible display module 20 is applied to the foldable electronic device 10, the back plate 50 can be folded or unfolded synchronously with the flexible display module 20. The back plate 50 itself has high rigidity, so that the first surface 501 of the back plate 50 is less likely to be concavely deformed when an external force is applied in the thickness direction X of the back plate 50.
In some examples, referring to fig. 7, the back plate 50 includes a first support 51, a second support 52, and an intermediate support 53. The display part 601 of the flexible display module 20 may cover the first support part 51, the second support part 52, and the intermediate support part 53. The first recess 503 is disposed on the first support 51. The back panel 50 has a folded state and an unfolded state. The back plate 50 is used for driving the display portion 601 of the flexible display module 20 to fold or unfold. The back plate 50 is in the unfolded state, and the first support portion 51, the second support portion 52 and the intermediate support portion 53 are flush with each other. In the folded state of the back plate 50, the first support portion 51 and the second support portion 52 are each folded toward the intermediate support portion 53. Illustratively, the intermediate support portion 53 is provided with a plurality of slits 531, so as to reduce the rigidity of the intermediate support portion 53, and facilitate bending and deformation of the intermediate support portion 53 under a smaller force. A slit 531 extends through the first surface 501 and the second surface 502.
In some examples, the first surface 501 and the second surface 502 of the back plate 50 are both planar. When the flexible display module 20 is disposed on the first surface 501, the first surface 501 may not locally support the flexible display module 20, so that a local stress concentration area occurs in the flexible display module 20 or a local bulge occurs in the flexible display module 20. Illustratively, the first surface 501 and the second surface 502 of the back plate 50 are parallel to each other.
Along the thickness direction X of the back plate 50, a perpendicular distance between the first bottom wall 5031 of the first recess 503 and the first surface 501 is smaller than a perpendicular distance between the second surface 502 and the first surface 501. In some examples, the predetermined region of the back plate 50 may be subjected to a subtractive process in a machining manner to form the first recess 503. For example, the machining may be milling or cutting. Alternatively, the predetermined region of the back plate 50 may be subjected to a subtractive process by means of an etching process to form the first recess 503.
In some implementations, referring to fig. 9, the forward projected area of the support assembly 70 is greater than the forward projected area of the driver chip 30 along the thickness direction X of the back plate 50. The front projection of the driver chip 30 is located within the front projection of the support assembly 70. The support assembly 70 completely shields the driving chip 30 at one side of the driving chip 30. When the display portion 601 receives an external force and transmits the external force to the supporting component 70 through the back plate 50, the supporting component 70 can drive the driving chip 30 and the portion of the binding portion 603 around the driving chip 30 to move downward integrally, so that the supporting component 70 and the portion of the binding portion 603 around the driving chip 30 can be used for buffering the external force, which is beneficial to further reducing the possibility of breakage damage of the driving chip 30 caused by the external force acting on the driving chip 30. In some examples, the support assembly 70 includes a first support 71 and a connector 72. The first support 71 is a rigid structural member and thus has a high rigidity and deformation resistance. The connecting member 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. The front projection area of the first supporting member 71 is larger than the front projection area of the driving chip 30 along the thickness direction X of the back plate 50. The front projection of the driver chip 30 is located within the front projection of the first support 71. The first support 71 completely shields the driving chip 30 at one side of the driving chip 30.
In some implementations, fig. 10 schematically illustrates a partial structure of the back side of the back plate 50 of an embodiment. Referring to fig. 9 and 10, the back plate 50 is positioned inside the bent portion 602 so that the back plate 50 is shielded by the bent portion 602 when viewed from the outside of the bent portion 602. The back plate 50 has a side surface 504 facing the fold 602. The first concave portion 503 extends in the thickness direction X and is formed with an opening on the second surface 502. Meanwhile, the first concave portion 503 penetrates the side surface 504 of the back plate 50 facing the bent portion 602, so that an opening is also formed on the side surface 504. The wall surface of the first recess 503 facing the driving chip 30 is a first bottom wall 5031, and the wall surface intersecting the first bottom wall 5031 is a first side wall 5032. In some examples, the support assembly 70 includes a first support 71 and a connector 72. The connecting piece 72 is disposed between the first support piece 71 and the first bottom wall 5031 of the first recess 503. The connecting member 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. Illustratively, the connecting member 72 may be an adhesive member, so that the first supporting member 71 and the first bottom wall 5031 of the first recess 503 are connected by an adhesive manner, and the first supporting member 71 and the binding portion 603 may also be connected by an adhesive manner, thereby being beneficial to reducing the number of components and parts, reducing the assembly difficulty, and also ensuring the structural integrity of the first supporting member 71, the back plate 50 and the binding portion 603. In some examples, along the axial direction Y of the bend 602, the back plate 50 has opposite side surfaces 504, while the first recess 503 does not extend through the two side surfaces 504 of the back plate 50. The axial direction Y of the bending portion 602 is a direction perpendicular to the bending direction of the bending portion 602. The axial direction Y of the bent portion 602 is perpendicular to the thickness direction X of the back plate 50.
In some implementations, the shape of the support assembly 70 matches the shape of the first recess 503, thereby facilitating accurate placement of the support assembly 70 within the first recess 503. In some examples, at least a portion of the first support 71 is located within the first recess 503. The shape of the first support 71 is matched with the shape of the first recess 503, so that it is easy to accurately place the first support 71 in the first recess 503. The first side wall 5032 of the first recess 503 may form a limit constraint on the first support 71 from different directions, so as to reduce the possibility that the first support 71 is easy to shift in position in the first recess 503, so that the first support 71 is in a predetermined position and is connected with the first bottom wall 5031 of the first recess 503.
In some examples, the first recess 503 extends through a side surface 504 of the back plate 50 facing the bend 602. The first side wall 5032 of the first recess 503 includes a first wall 5032a, a second wall 5032b, a third wall 5032c, a fourth wall 5032d, and a fifth wall 5032e that are disposed in series. The third wall 5032c is located on a side of the first support 71 facing away from the bending portion 602. The angle between the second wall 5032b and the third wall 5032c is equal to the angle between the fourth wall 5032d and the third wall 5032 c. The angle between the first wall 5032a and the second wall 5032b is equal to the angle between the fifth wall 5032e and the fourth wall 5032 d. The first support 71 has five outer wall surfaces provided in one-to-one correspondence with the first wall surface 5032a, the second wall surface 5032b, the third wall surface 5032c, the fourth wall surface 5032d, and the fifth wall surface 5032e.
In some implementations, fig. 11 schematically illustrates a partial structure of the back side of the flexible display module 20 of an embodiment. Referring to fig. 11 to 13, the first side wall 5032 of the first recess 503 is spaced apart from the side surface 504 of the back plate 50 facing the bent portion 602. The first recess 503 does not penetrate the side surface 504 of the back plate 50 facing the bent portion 602. The size of the first support 71 may be designed to be smaller, thereby reducing the weight of the first support 71. Therefore, the weight of the flexible display module 20 can be reduced while the thickness of the flexible display module 20 as a whole is reduced. The first recess 503 for accommodating the first support 71 is also designed to be small in size. When the size of the first concave portion 503 is designed smaller, the area occupied by the area with reduced thickness due to the formation of the first concave portion 503 on the back plate 50 becomes smaller, so that the possibility of adverse effect on the overall rigidity of the back plate 50 due to the formation of the first concave portion 503 by processing is reduced, and the overall rigidity of the back plate 50 is ensured to meet the requirement. In some examples, the first recess 503 does not extend through the side surface 504 of the back plate 50 facing the bend 602. For example, the first recess 503 may be rectangular, and the first support 71 is also rectangular. In some examples, binding 603 is connected to a region of back plate 50 between first recess 503 and side surface 504. Illustratively, the binding 603 and the area of the back plate 50 between the first recess 503 and the side surface 504 are adhesively attached.
In some realizable forms, fig. 14 schematically illustrates a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 14, the first support 71 is an integrally formed structure. The first support 71 includes a base 711 and a convex 712. In the thickness direction X, the convex portion 712 is located on a side of the base 711 facing away from the first surface 501. Since the convex portion 712 protrudes from the surface of the base portion 711, an accommodating space 71a is formed between the base portion 711 and the convex portion 712. At least part of the binding portion 603 is located in the accommodating space 71a. Binding 603 is connected to base 711. Specifically, the binding portion 603 is connected to a surface of the base 711 facing the binding portion 603. For example, the binding portion 603 and the base portion 711 may be connected by adhesion. The driving chip 30 is disposed corresponding to the accommodation space 71a in the thickness direction X of the back plate 50.
The thickness of the region of the first support 71 corresponding to the protrusion 712 is greater than the thickness of the other regions of the first support 71. The first support 71 forms a locally thickened structure where the protrusions 712 are located. The arrangement of the unequal-thickness structures of the first supporting members 71 is beneficial to improving the rigidity of the first supporting members 71 and further enhancing the deformation resistance of the first supporting members 71. In some examples, along the thickness direction X of the back plate 50, the surface of the driving chip 30 facing away from the back plate 50 is higher than the surface of the protrusion 712 facing away from the back plate 50, so that the first supporting member 71 can fully utilize the space to provide the protrusion 712, and the provided protrusion 712 does not affect the overall thickness of the flexible display module 20 while improving the rigidity of the first supporting member 71. In some examples, the deformation resistance of the region of the first support 71 corresponding to the protrusion 712 is higher than the deformation resistance of other regions of the first support 71. Along the axial direction Y of the bent portion 602, the length of the driving chip 30 is less than or equal to the length of the protrusion 712, so that the protrusion 712 of the first support 71 may be disposed corresponding to the entire driving chip 30. When the external force acts on the region corresponding to the first support 71 and the protrusion 712, the deformation amount of the region corresponding to the first support 71 and the protrusion 712 is small, thereby ensuring that the force transmitted to the driving chip 30 is small.
Illustratively, the protrusion 712 is disposed at an area of the base 711 remote from the bend 602. The protruding portion 712 is located at a side of the driving chip 30 facing away from the bending portion 602. The wall surface of the protrusion 712 facing the accommodation space 71a and the wall surface of the base 711 facing the accommodation space 71a may be perpendicular to each other. A chamfer structure, for example, a rounded corner structure, is provided on the top of the protrusion 712 at a corner away from the receiving space 71a, reducing the likelihood that the corner will press against an adjacent structure, resulting in a stress concentrating area on the adjacent structure.
Illustratively, fig. 15 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. As shown in fig. 15, the convex portion 712 is provided in a region of the base portion 711 near the bent portion 602. The convex portion 712 is located on a side of the driving chip 30 facing the bending portion 602. The wall surface of the convex portion 712 facing the accommodation space 71a is a slope. The angle between the wall surface of the convex portion 712 facing the accommodating space 71a and the wall surface of the base portion 711 facing the accommodating space 71a may be an obtuse angle. A chamfer structure, for example, a rounded corner structure, is provided on the top of the protrusion 712 near the corner of the accommodating space 71a, to reduce the possibility that the corner will press against the binding portion 603, resulting in a stress concentration area on the binding portion 603.
In some realizable forms, the elastic modulus of the material of the first support 71 is greater than 70GPa. Since the thickness of the area of the back plate 50 where the first concave portion 503 is disposed is reduced, the stiffness of the area of the back plate 50 corresponding to the first concave portion 503 is reduced, so that the area corresponding to the first concave portion 503 is prone to concave deformation when the back plate 50 receives the same external force. The first supporting member 71 uses a material with a larger elastic modulus, so that the first supporting member 71 can improve its deformation resistance without increasing the thickness, thereby being beneficial to stably supporting the reduced thickness area of the back plate 50 and reducing the possibility of the area corresponding to the first concave portion 503 being concavely deformed. Meanwhile, when the first support 71 itself receives the same external force, the amount of deformation of the first support 71 is smaller, so that the force transmitted to the driving chip 30 is smaller.
In some examples, the elastic modulus of the material of the first support 71 is greater than or equal to 105GPa. The material of the first support 71 is selected from any one of silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
In some realizable forms, fig. 16 schematically illustrates a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 16, the flexible display module 20 further includes a second support 80. The second supporting member 80 is disposed on a side of the binding portion 603 facing away from the display portion 601. In some examples, the second support 80 is adhesively coupled to the binding 603. The second support 80 is a rigid structural member with good resistance to deformation. The second support 80 is spaced apart from the driving chip 30. The second supporting member 80 may further increase the overall rigidity of the binding portion 603, and reduce the possibility of the binding portion 603 deforming and transmitting a force to the driving chip 30 to cause breakage damage to the driving chip 30.
When the display portion 601 of the flexible display module 20 is subjected to the pressing force, the pressing force is transmitted to the back plate 50, the first support 71, the binding portion 603 and the second support 80. Under the effect of extrusion force, the area of the first supporting piece 71, the second supporting piece 80 and the binding part 603 corresponding to the driving chip 30 can effectively buffer extrusion force or can wholly move downwards, so that the binding part 603 is not easy to deform, the extrusion force is not easy to be transmitted to the driving chip 30 through the binding part 603, the driving chip 30 is not deformed or the deformation is small, and the possibility of breakage damage of the driving chip 30 caused by the action of large external force is effectively reduced. In some examples, the second support 80 is located on a side of the driver chip 30 facing the bend 602. In some examples, the material of the second support 80 is selected from any one of aluminum, aluminum alloy, silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
The thickness of the second support 80 is smaller than the thickness of the driving chip 30 along the thickness direction X of the back plate 50. The surface of the driving chip 30 facing away from the back plate 50 is higher than the surface of the second supporting member 80 facing away from the back plate 50, so that the space can be fully utilized to arrange the second supporting member 80, and the arranged second supporting member 80 can not influence the overall thickness of the flexible display module 20 while improving the rigidity of the binding portion 603.
Along the axial direction Y of the bent portion 602, the length of the driving chip 30 is less than or equal to the length of the second supporting member 80, so that the second supporting member 80 can be disposed corresponding to the entire driving chip 30. When the second supporting member 80 receives an external force, the second supporting member 80 can drive the area of the binding portion 603 corresponding to the driving chip 30 to move downward, so as to reduce the force transmitted to the driving chip 30.
In some implementations, the forward projected area of the support assembly 70 is greater than the forward projected area of the second support 80 along the thickness direction X of the back plate 50. In one example, the orthographic projection area of the first support 71 is larger than the orthographic projection area of the second support 80 along the thickness direction X of the back plate 50. The smaller size of the second support 80 is advantageous to ensure the light weight of the flexible display module 20, and the space occupation rate of the second support 80 can be reduced. In some examples, the length of the first support 71 and the length of the second support 80 are equal along the axial direction Y of the bend 602. The opposite edges of the second support 80 are aligned with the opposite edges of the first support 71.
In some realizable forms, fig. 17 schematically illustrates a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 17, the back plate 50 further includes a second recess 505. The second recess 505 is recessed from the second surface 502 toward the first surface 501. The second recess 505 includes a second bottom wall 5051 and a second side wall 5052. The flexible display module 20 further includes a flexible circuit board 90 (Flexible Printed Circuit, FPC). The flexible circuit board 90 is located at a side of the driving chip 30 facing away from the bending portion 602. The flexible circuit board 90 is connected to the binding portion 603 and electrically connected to the driving chip 30. The flexible circuit board 90 may be electrically connected with the motherboard to enable electrical signal interaction between the driver chip 30 and the motherboard. The flexible circuit board 90 itself is soft and easily bent. At least a portion of the flexible circuit board 90 is located in the second recess 505, so as to reduce the space occupied by the flexible circuit board 90 in the thickness direction X, and further effectively reduce the thickness of the area on the flexible display module 20 corresponding to the flexible circuit board 90. When the flexible display module 20 is applied to the electronic device 10, more space can be saved below the flexible circuit board 90 for setting a greater number of other devices or a greater volume of other devices. In some examples, the flexible circuit board 90 and the second bottom wall 5051 of the second recess 505 may be connected by an adhesive, so as to reduce the number of components, and meanwhile, there is no need to provide a corresponding connection structure on the flexible circuit board 90 or the back plate 50 due to the additional use of a connecting member, so as to reduce the assembly difficulty, and also ensure the structural integrity of the flexible circuit board 90 and the back plate 50.
In some examples, the first side wall 5032 of the first recess 503 and the second side wall 5052 of the second recess 505 are spaced apart. The first recess 503 and the second recess 505 may not communicate with each other. The second recess 505 is located at a side of the first recess 503 away from the bending portion 602. The thickness of the area of the back plate 50 for separating the first recess 503 from the second recess 505 is larger than the thickness of the area of the first recess 503 from the second recess 505, so that the area for separating the first recess 503 from the second recess 505 is ensured to have higher deformation resistance, and the possibility of excessively reducing the rigidity of the back plate 50 due to the arrangement of the first recess 503 and the second recess 505 on the back plate 50 is reduced.
In some implementations, the flexible display member 60 is a flexible screen. The portion of the flexible screen beyond the display portion 601 is used to form a bent portion 602 and a binding portion 603. The driver chip 30 is directly connected to the flexible screen. In other realizations, fig. 18 schematically illustrates a partial cross-sectional structure of a flexible display module 20 of an embodiment. Referring to fig. 18, the flexible display member 60 includes a flexible screen 61 and a flexible transit circuit board 62. The flexible interposer circuit board 62 itself is flexible and easily deformed. The interposer circuit board 62 is electrically connected to the flexible screen 61. The driving chip 30 is disposed on the switching circuit board 62. The driving chip 30 transmits a driving signal to the flexible screen 61 through the switching circuit board 62. In some examples, the connection of flexible screen 61 and interposer circuit board 62 is located at binding 603. A portion of the flexible screen 61 and the relay circuit board 62 form a binding portion 603.
In some realizable forms, fig. 19 schematically illustrates a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 19, the support assembly 70 includes a first support 71 and a connection 72. The connecting piece 72 is disposed between the first support piece 71 and the first bottom wall 5031 of the first recess 503. The connecting member 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. At least a portion of the connector 72 is disposed within the first recess 503.
In some implementations, fig. 20 schematically illustrates a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 20, the flexible display module 20 further includes a shielding member 100. The shielding member 100 is disposed on a side of the binding portion 603 facing away from the display portion 601. The shielding member 100 may cover the driving chip 30. The driving chip 30 is located in a space formed by the shielding member 100 and the binding portion 603. The shielding component 100 is used for shielding the driving chip 30, so as to effectively reduce the possibility of abnormal signals of the driving chip 30 caused by the interference of external signals on the driving chip 30.
In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through an intermediary, in communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.
The embodiments of the application may be implemented or realized in any number of ways, including as a matter of course, such that the apparatus or elements recited in the claims are not necessarily oriented or configured to operate in any particular manner. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless specifically stated otherwise.
The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The term "plurality" herein refers to two or more. The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship; in the formula, the character "/" indicates that the front and rear associated objects are a "division" relationship.
It will be appreciated that the various numerical numbers referred to in the embodiments of the present application are merely for ease of description and are not intended to limit the scope of the embodiments of the present application. It should be understood that, in the embodiment of the present application, the sequence number of each process does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present application.
Claims (18)
1. A flexible display module for an electronic device, comprising at least:
the backboard comprises a first surface, a second surface and a first concave part, wherein the first surface and the second surface are oppositely arranged along the thickness direction of the backboard, and the first concave part is concave from the second surface to the first surface;
The flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface;
the driving chip is arranged on one side of the binding part, which is away from the display part;
the support component is arranged on one side of the binding part facing the back plate, at least part of the support component is accommodated in the first concave part, and the driving chip, the support component and the first concave part are correspondingly arranged along the thickness direction;
the backboard comprises a first supporting part, a middle supporting part and a second supporting part, the first concave part is arranged on the first supporting part, the backboard is in a folding state and an unfolding state, and the backboard is used for driving the display part to fold or unfold;
in the folded state, the first supporting part and the second supporting part are bent relative to the middle supporting part; in the deployed state, the first support portion, the intermediate support portion, and the second support portion are flush with one another.
2. The flexible display module of claim 1, wherein the back plate has a side surface facing the bent portion, and the first recess extends through the side surface, or the first sidewall of the first recess is spaced apart from the side surface.
3. A flexible display module according to claim 1 or 2, wherein the shape of the support member matches the shape of the first recess.
4. A flexible display module according to claim 1 or 2, wherein the forward projected area of the support assembly is larger than the forward projected area of the driving chip in the thickness direction.
5. The flexible display module according to claim 1 or 2, wherein the support assembly comprises a first support member and a connecting member, the connecting member connects the first support member and the first bottom wall of the first recess portion, the first support member comprises a base portion and a protruding portion, the protruding portion is located on a side of the base portion facing away from the first surface, the base portion and the protruding portion form a receiving space, at least part of the binding portion is located in the receiving space, the binding portion is connected with the base portion, and the driving chip is disposed corresponding to the receiving space along the thickness direction.
6. The flexible display module of claim 5, wherein:
the convex part is arranged in a region of the base part far away from the bending part, and the convex part is positioned at one side of the driving chip, which is away from the bending part; or alternatively, the process may be performed,
The convex part is arranged in the area of the base part, which is close to the bending part, and the convex part is positioned at one side of the driving chip, which faces the bending part.
7. The flexible display module of claim 5, wherein:
the length of the driving chip is smaller than or equal to the length of the convex part along the axial direction of the bending part; or alternatively, the process may be performed,
and along the thickness direction, the surface of the driving chip, which is opposite to the backboard, is higher than the surface of the convex part, which is opposite to the backboard.
8. A flexible display module according to claim 5, wherein the material of the first support has an elastic modulus of greater than 70GPa.
9. The flexible display module of claim 8, wherein the material of the first support is selected from any one of silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
10. The flexible display module according to any one of claims 1-2 and 6-9, further comprising a second support member disposed on a side of the binding portion facing away from the display portion, the second support member being disposed at a distance from the driving chip.
11. The flexible display module according to claim 10, wherein a thickness of the second support member is smaller than a thickness of the driving chip in the thickness direction.
12. The flexible display module according to claim 10, wherein a length of the driving chip is less than or equal to a length of the second support member in an axial direction of the bending portion.
13. The flexible display module of claim 10, wherein:
the second supporting piece is positioned at one side of the driving chip facing the bending part; or alternatively, the process may be performed,
and the orthographic projection area of the supporting component is larger than that of the second supporting piece along the thickness direction.
14. The flexible display module according to any one of claims 1-2, 6-9, 11-13, wherein the back plate further comprises a second recess portion recessed from the second surface toward the first surface, the flexible display module further comprises a flexible circuit board located on a side of the driving chip facing away from the bent portion, the flexible circuit board being connected to the binding portion and electrically connected to the driving chip, and at least a portion of the flexible circuit board being located in the second recess portion.
15. The flexible display module of claim 14, wherein a first sidewall of the first recess and a second sidewall of the second recess are disposed at intervals, and the second recess is located at a side of the first recess away from the bending portion.
16. The flexible display module according to any one of claims 1-2, 6-9, 11-13, 15, wherein the flexible display component is a flexible screen; or the flexible display part comprises a flexible screen and a flexible switching circuit board which are connected, the switching circuit board is positioned at the binding part, and the driving chip is arranged on the switching circuit board.
17. The flexible display module according to any one of claims 1-2, 6-9, 11-13, 15, wherein:
the first surface and the second surface are both planar; alternatively, the binding is bonded to the support assembly.
18. An electronic device comprising at least a flexible display module according to any one of claims 1 to 17.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111246620.XA CN115019636B (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
| CN202210851639.5A CN116030713A (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| CN202111246620.XA CN115019636B (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| CN202210851639.5A Division CN116030713A (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| KR20180025358A (en) * | 2016-08-29 | 2018-03-09 | 삼성디스플레이 주식회사 | Rollable display device |
| US20190129229A1 (en) * | 2017-10-31 | 2019-05-02 | Wuhan China Star Cptoelectronics Technology Co., Ltd | Narrow frame display panel and display device |
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| CN116030713A (en) | 2023-04-28 |
| CN115019636A (en) | 2022-09-06 |
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