CN113049516A - Gas-sealed module and gas analyzer - Google Patents
Gas-sealed module and gas analyzer Download PDFInfo
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- CN113049516A CN113049516A CN202011426830.2A CN202011426830A CN113049516A CN 113049516 A CN113049516 A CN 113049516A CN 202011426830 A CN202011426830 A CN 202011426830A CN 113049516 A CN113049516 A CN 113049516A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 58
- 238000005538 encapsulation Methods 0.000 claims abstract description 51
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000004891 communication Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000005498 polishing Methods 0.000 description 15
- 238000010521 absorption reaction Methods 0.000 description 10
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical group O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 8
- 239000006061 abrasive grain Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 238000009864 tensile test Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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Abstract
The invention provides a gas-filled module and a gas analyzer, which can improve the bonding strength and inhibit gas leakage without consuming time and labor. A gas encapsulation module provided with two gas chambers in which gas is encapsulated, includes: a block-shaped main body portion; a through hole penetrating the main body; a first transmission window that blocks the through hole in the middle of the through hole and allows infrared light to pass therethrough; an annular member bonded to a peripheral edge of one end of the through hole; and a second transmission window that blocks the opening of the annular member and passes infrared light. One of the two gas chambers is a space sandwiched by the first transmission window and the second transmission window. A plurality of annular grooves surrounding the through hole are formed in at least one of portions where the body portion and the annular member are bonded to each other.
Description
Technical Field
The present invention relates to a gas analyzer and a gas encapsulation module provided in the gas analyzer using a flow sensor.
Background
Conventionally, non-dispersive infrared absorption methods have been used for analyzing the composition of a gas. One type of gas analyzer that analyzes a gas component is a gas analyzer that uses a flow sensor. The gas analyzer includes a gas encapsulation block in which a gas containing a specific gas component is encapsulated. The gas-sealed module has two gas chambers into which infrared light is externally incident, and in which gas is sealed and infrared light can be transmitted. The two gas chambers are communicated with each other, and infrared light from the outside is arranged to pass through one gas chamber and then pass through the other gas chamber. In addition, a flow sensor is provided in the gas encapsulation module.
The gas component contained in the gas enclosed in the gas chamber has a characteristic of absorbing a specific wavelength component of infrared light. In one of the gas chambers, infrared light is absorbed by the gas component, so that the temperature of the gas rises and the gas expands. In the other gas chamber, the infrared light having the wavelength component absorbed by the gas component passes through the other gas chamber, and therefore the amount of absorption of the infrared light is small and the expansion of the gas is small. Therefore, the gas flows from one gas chamber to the other gas chamber. The flow sensor measures the flow rate of the gas. The flow rate of the gas is a value corresponding to the absorption amount of the infrared light.
The infrared light passing through the gas to be analyzed is incident on the gas encapsulation block. When the gas to be analyzed contains a specific gas component, infrared light having a wavelength component absorbed by the gas component to some extent enters the gas-filled module, and the amount of absorption of the infrared light in the gas-filled module changes. The measurement value of the flow sensor changes as compared with the case where the gas to be analyzed does not contain a specific gas component. The concentration of a specific gas component contained in the gas to be analyzed is obtained in accordance with the change in the measured value. An example of such a gas analyzer is disclosed in Japanese patent laid-open publication No. 2002-131230.
The two gas chambers of the gas-enclosed module are made in the following way, namely: a through hole is provided in a body part of a gas-filled module, an annular member is bonded to one end of the through hole, a transmission window is bonded to the annular member, and the transmission window is bonded to the other end of the through hole. The contact portion between the body portion and the annular member is roughened to increase the bonding area.
Conventionally, polishing has been performed in which a contact portion is roughened with a polishing agent containing abrasive grains. However, a residue containing abrasive grains is generated by the polishing process. The residue causes a decrease in adhesive strength and gas leakage. In order to remove the residue, the operator needs to remove the residue by manual work, which results in time and labor consuming manufacturing of the gas encapsulation module.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a gas sealing module and a gas analyzer capable of improving adhesion strength and suppressing gas leakage without consuming time and labor.
The gas encapsulation module of the present invention includes two gas chambers in which gas is encapsulated, and is characterized by comprising: a block-shaped main body portion; a through hole penetrating the main body; a first transmission window that blocks the through hole in the middle of the through hole and allows infrared light to pass therethrough; an annular member bonded to a peripheral edge of one end of the through hole; and a second transmission window that closes an opening of the annular member and allows infrared light to pass therethrough, one of the two gas chambers being a space sandwiched between the first transmission window and the second transmission window, and a plurality of annular grooves surrounding the through-hole being formed in at least one of portions where the body portion and the annular member are bonded to each other.
In one aspect of the present invention, the gas chamber of the gas encapsulation module is configured by: a first transmission window is provided in the middle of a through hole formed in the body, and an annular member closed by a second transmission window is bonded to the periphery of one end of the through hole. The main body and the annular member are bonded to each other to form a plurality of annular grooves surrounding the through hole. The bonding area between the main body and the annular member is increased, and the bonding strength between the main body and the annular member is increased. In addition, gas leakage through the annular groove is less likely to occur.
In the gas encapsulation module according to the present invention, the second transmission window is bonded to the annular member, and a plurality of annular grooves surrounding an opening of the annular member are formed in a portion of the annular member to which the second transmission window is bonded.
In one embodiment of the present invention, a plurality of annular grooves surrounding an opening of the annular member are formed in a portion of the annular member to which the second transmission window is bonded. The bonding area between the annular member and the second transmission window is increased, and the bonding strength between the annular member and the second transmission window is increased. In addition, gas leakage through the annular groove is less likely to occur.
The gas encapsulation module according to the present invention is characterized in that the gas encapsulation module further includes a third transmission window which is bonded to the peripheral edge of the other end of the through hole, blocks the through hole, and passes infrared light, the other of the two gas chambers is a space sandwiched between the first transmission window and the third transmission window, and a portion of the main body portion to which the third transmission window is bonded is formed with a plurality of annular grooves surrounding the through hole.
In one embodiment of the present invention, a third transmission window is bonded to a peripheral edge of the other end of the through hole, and a plurality of annular grooves surrounding the through hole are formed in a portion of the main body portion to which the third transmission window is bonded. The bonding area between the main body and the third transmission window is increased, and the bonding strength between the main body and the third transmission window is increased. In addition, gas leakage through the annular groove is less likely to occur.
In the gas encapsulation module according to the present invention, each of the plurality of annular grooves has an enlarged portion whose depth is larger than that of the other portion, and the plurality of enlarged portions included in the plurality of annular grooves are not arranged in a line shape including all of the enlarged portions.
In one embodiment of the present invention, the annular groove has an increased portion whose depth is increased as compared with other portions. The enlarged portions included in the annular grooves are not arranged in a line shape including all of the enlarged portions. This reduces the cause of gas leakage, and can suppress gas leakage in the gas chamber.
In the gas-filled module according to the present invention, the plurality of annular grooves are each formed by laser engraving.
In one embodiment of the present invention, since the plurality of annular grooves are engraved by laser engraving, a residue including abrasive grains generated when polishing is performed is not generated. Therefore, a decrease in bonding strength and gas leakage due to the residue containing the abrasive particles do not occur.
In the gas encapsulation module according to the present invention, the plurality of annular grooves are concentric and are formed in order from the inner annular groove toward the outer annular groove.
In one embodiment of the present invention, when the plurality of annular grooves are formed, the annular grooves are formed in order from the inner annular groove toward the outer annular groove. In comparison with the case where the annular grooves are formed in order from the outer annular groove toward the inner annular groove, powder of the material of the main body is less likely to remain at a position inside the annular groove. Therefore, the powder can be prevented from adhering to the inside of the gas chamber.
The gas encapsulation module of the present invention includes two gas chambers in which gas is encapsulated, and is characterized by comprising: a block-shaped main body portion; a through hole penetrating the main body; a first transmission window that blocks the through hole in the middle of the through hole and allows infrared light to pass therethrough; an annular member bonded to a peripheral edge of one end of the through hole; and a second transmission window that closes the opening of the annular member and allows infrared light to pass therethrough, one of the two gas chambers being a space sandwiched between the first transmission window and the second transmission window, at least one of portions where the body portion and the annular member are bonded to each other having a plurality of grooves formed around the through hole, the plurality of grooves being engraved with a laser.
In one embodiment of the present invention, a plurality of grooves are engraved by laser on a portion where the main body portion and the annular member are bonded to each other. The bonding area between the main body and the annular member is increased, and the bonding strength between the main body and the annular member is increased. Further, since a residue including abrasive grains is not generated in the case of performing polishing, a decrease in bonding strength and a gas leak due to the residue do not occur.
A gas analyzer according to the present invention is a gas analyzer for analyzing a concentration of a specific gas component contained in a gas to be analyzed, the gas analyzer including: the gas encapsulation module of the present invention; a light source emitting infrared light; and a cell through which a gas to be analyzed flows, wherein a gas containing the specific gas component is enclosed in two gas chambers provided in the gas encapsulation block, and the gas encapsulation block and the cell are arranged such that infrared light from the light source passes through the gas to be analyzed flowing through the cell, and infrared light having passed through the gas to be analyzed passes through the two gas chambers in this order, and the gas encapsulation block includes: a communication path communicating with the two gas chambers; and a flow rate sensor that measures a flow rate of the gas flowing between the two gas chambers through the communication path.
In one embodiment of the present invention, the bonding strength of the members of the gas-filled module is improved, and gas leakage in the gas chamber can be suppressed. Therefore, the durability of the gas analyzer is improved.
According to the present invention, excellent effects can be obtained such as an improvement in the adhesion strength of the members of the gas-sealed module and a suppression of gas leakage without requiring a long time and effort.
Drawings
Fig. 1 is a schematic cross-sectional view showing an example of a gas analyzer.
Fig. 2 is a block diagram showing the structure of a gas analyzer using a gas analyzer.
Fig. 3 is a perspective view schematically showing the appearance of the gas encapsulation module.
Fig. 4 is an exploded perspective view of a schematic gas encapsulation module.
Fig. 5 is a sectional view schematically showing the internal structure of the gas encapsulation module.
Fig. 6 is an exploded sectional view of a schematic gas encapsulation module.
Fig. 7 is a schematic front view showing an annular flat portion provided on the peripheral edge of the first end.
Fig. 8 is a schematic view showing a method of forming a plurality of annular grooves by laser processing.
Fig. 9 is a graph showing the results of measuring the adhesive strength by a tensile test.
Fig. 10 is a graph showing changes in the surface area of the annular flat surface portion due to laser processing and polishing processing.
Fig. 11 is an enlarged view of a portion including a plurality of enlarged portions shown in fig. 7.
Fig. 12 is a schematic front view showing an annular flat surface portion provided on the peripheral edge of the first end in an example in which the through-hole has a polygonal shape and the annular groove has a polygonal annular shape.
Fig. 13 is a schematic front view showing an annular flat surface portion provided on the peripheral edge of the first end in an example in which a plurality of linear grooves are formed.
Fig. 14 is a schematic front view showing an annular flat surface portion provided on the peripheral edge of the first end in an example in which a lattice-shaped groove is formed.
Description of the reference numerals
1. 2 gas encapsulation module
11. 12 gas chamber
13 flow path
14 flow sensor
15 main body part
151 through hole
152. 154, 156 annular plane part
161 first transmission window
162 second transmission window
163 third transmissive window
17 Ring component
174 annular flat part
3 gas analyzer
31 light source
32 chopper
33 pool
4 annular groove
41 enlarged part
44 groove
Detailed Description
The present invention will be specifically described below with reference to the drawings showing embodiments.
Fig. 1 is a schematic cross-sectional view showing an example of a gas analyzer 3. The gas analyzer 3 includes a light source 31 for infrared light, a chopper 32, a cell 33 in which a gas to be analyzed flows, and gas encapsulation modules 1 and 2. The chopper 32 has a blade rotating at a predetermined frequency, and intermittently blocks infrared light to turn the infrared light into intermittent light. The cell 33 is cylindrical, infrared light enters the cell 33 from the outside, and the infrared light passes through the gas inside the cell 33, and the infrared light after passing through the gas is emitted to the outside of the cell 33. In the figure, the flow of the gas flowing through the cell 33 is indicated by a broken-line arrow, and the infrared light is indicated by a solid-line arrow. The gas to be analyzed flowing through the cell 33 is, for example, an exhaust gas of an automobile.
The gas sealing module 1 has two gas chambers 11 and 12, and the two gas chambers 11 and 12 seal a gas containing a specific gas component. The gas chambers 11 and 12 are filled with the same gas. For example, the specific gas component is Nitric Oxide (NO), and a gas in which NO and air are mixed is sealed in the gas chambers 11 and 12. The infrared light that has passed through the cell 33 passes through the gas chamber 11 and then through the gas chamber 12. The gas chambers 11 and 12 communicate with each other via a flow path 13. A flow sensor 14 is provided in the flow path 13, and the flow sensor 14 measures the flow rate of the gas flowing through the flow path 13.
The gas components contained in the gas sealed in the gas chambers 11 and 12 have the characteristic of absorbing a specific wavelength component of infrared light. The gas component contained in the gas sealed in the gas chamber 11 absorbs a specific wavelength component of the infrared light passing through the gas chamber 11. The absorption of infrared light increases the temperature of the gas sealed in the gas chamber 11, and the gas expands. The infrared light having absorbed the specific wavelength component passes through the gas cell 12. Therefore, the absorption amount of infrared light absorbed in the gas chamber 12 is smaller than the absorption amount of infrared light absorbed in the gas chamber 11. The expansion of the gas in the gas chamber 12 is less than the expansion of the gas in the gas chamber 11. As a result, the gas flows from the gas chamber 11 to the gas chamber 12 via the flow path 13. The flow sensor 14 measures the flow rate of the gas. The flow rate of the gas is a value corresponding to the absorption amount of the infrared light. The chopper 32 functions to intermittently obtain measurement values from the flow sensor 14.
The internal structure of the gas encapsulation module 2 is the same as that of the gas encapsulation module 1. A gas containing a specific gas component is enclosed in the two gas chambers of the gas enclosing module 2. For example, a gas having a ratio of NO of 100% is enclosed in the two gas chambers of the gas enclosing module 2. The gas-filled modules 1 and 2 are disposed adjacent to each other. The gas encapsulation module 2 is configured to: the infrared light that has passed through the gas chambers 11, 12 of the gas-filled module 1 passes through the two gas chambers of the gas-filled module 2 in this order. Since almost all of the specific wavelength component of the infrared light is absorbed in the gas-sealed module 1, the specific wavelength component is hardly absorbed in the gas-sealed module 2. The flow rate sensor of the gas encapsulation block 2 measures a gas flow rate corresponding to the amount of absorption of infrared light by impurities contained in the gas. The impurity is mainly water. The influence of impurities on the measurement value of the flow sensor 14 can be removed using the measurement value of the flow sensor of the gas encapsulation module 2.
Fig. 2 is a block diagram showing the structure of a gas analyzer 35 using the gas analyzer 3. The gas analyzer 35 includes a gas analyzer 3 and a concentration calculating unit 34, and the gas analyzer 3 includes a light source 31, a chopper 32, a cell 33, and gas encapsulation modules 1 and 2. The concentration calculating unit 34 calculates the concentration of the gas component contained in the gas to be analyzed. The density calculating unit 34 is configured by using a processor and a memory, for example. The concentration calculating unit 34 is connected to the flow rate sensors of the gas encapsulation modules 1 and 2. Each flow sensor outputs a measurement value of the gas flow rate, and the concentration calculation unit 34 receives the measurement value.
When the gas to be analyzed contains a specific gas component, infrared light having absorbed a specific wavelength component to some extent by the gas to be analyzed enters the gas encapsulation module 1, and the absorption amount of the infrared light in the gas chamber 11 changes. The measurement value of the flow sensor 14 changes as compared with the case where the gas to be analyzed does not contain a specific gas component. The concentration calculating unit 34 calculates the concentration of a specific gas component contained in the gas to be analyzed in accordance with the change in the measured value. In this way, the concentration of a specific gas component contained in the gas to be analyzed is analyzed using the gas analyzer 3.
Fig. 3 is a perspective view schematically showing the appearance of the gas encapsulation module 1. Fig. 4 is an exploded perspective view of the exemplary gas encapsulation module 1. Fig. 5 is a sectional view schematically showing the internal structure of the gas encapsulation module 1. The cross section shown in fig. 5 is a cross section of the gas encapsulation module 1 cut by the line IV-IV in fig. 3. Fig. 6 is an exploded sectional view of the gas encapsulation module 1.
The gas-filled module 1 has a block-shaped main body 15. The body 15 is made of metal and has a rectangular parallelepiped shape. The main body 15 has a through hole 151. The through hole 151 is a stepped hole whose diameter changes by one step in the middle. One end of the through-hole 151 is a first end 153 and the other end is a second end 155. The diameter of the first end 153 is different from the diameter of the second end 155, and the diameter of the first end 153 is greater than the diameter of the second end 155. An annular flat surface portion 152 is formed at a stepped portion in the through hole 151.
The first, second, and third transmissive windows 161, 162, 163 are substantially parallel. As shown in fig. 5, the first, second, and third transmission windows 161, 162, and 163 divide the space inside the through hole 151 into two spaces, thereby forming two gas chambers 11, 12. The first, second, and third transmissive windows 161, 162, and 163 have a plate shape and are formed of a material that transmits infrared light. The first transmission window 161 is bonded to the annular planar portion 152 using an adhesive. The first transmission window 161 is bonded to the annular flat surface portion 152, whereby the through hole 151 is closed in the middle.
The gas-filled module 1 includes an annular member 17 bonded to the main body 15. The annular member 17 has a cylindrical portion 171 and a flange portion 172 having an outer diameter larger than that of the cylindrical portion 171. An annular flat portion 174 is formed at one end of the annular member 17, and the second transmissive window 162 is bonded to the annular flat portion 174 using an adhesive. By bonding the second transmissive window 162 to the annular flat surface portion 174, the opening of the annular member 17 is closed by the second transmissive window 162.
The other end of the annular member 17 is the end of the cylindrical portion 171. The cylindrical portion 171 is inserted into the through hole 151 from the first end 153 side and fitted into the through hole 151. The flange portion 172 has an outer diameter larger than the diameter of the first end 153, and the flange portion 172 contacts the peripheral edge of the first end 153. In the body portion 15, an annular flat surface portion 154 is formed at the peripheral edge of the first end 153. Flange portion 172 is bonded to annular flat portion 154 using an adhesive. In this way, the annular member 17 blocked by the second transmission window 162 is adhered to the peripheral edge of the first end 153. In the through hole 151, a space sandwiched by the first transmission window 161 and the second transmission window 162 serves as the gas chamber 11.
In the main body portion 15, an annular flat surface portion 156 is formed on the peripheral edge of the second end 155. The third transmissive window 163 is bonded to the annular flat portion 156 using an adhesive. The second end 155 is closed by the third transmissive window 163 by adhering the third transmissive window 163 to the annular flat surface portion 156. In the through hole 151, a space sandwiched by the first transmission window 161 and the third transmission window 163 becomes the gas chamber 12. The gas chambers 11, 12 are adjacent to each other with the first transmission window 161 as a boundary.
A flow path 13 communicating with the gas chambers 11 and 12 is formed inside the body 15. The annular member 17 is formed with a hole 173 communicating with the flow path 13. A flow sensor 14 is provided in the middle of the flow path 13. The flow path 13 and the hole 173 correspond to the communication path.
Fig. 7 is a schematic front view showing an annular flat surface portion 154 provided on the peripheral edge of the first end 153. The annular flat surface portion 154 is formed with a plurality of annular grooves 4. The plurality of annular grooves 4 are different in size from each other and are formed in multiple layers. Each annular groove 4 is a closed curve around the through hole 151. Preferably, the plurality of annular grooves 4 are concentric without intersecting each other. In fig. 7, eight annular grooves 4 are shown, but actually, more annular grooves 4 are formed.
The flange portion 172 of the annular member 17 is bonded to the annular flat surface portion 154 in which the plurality of annular grooves 4 are formed, using an adhesive. By forming the plurality of annular grooves 4, the bonding area between the annular flat surface portion 154 and the flange portion 172 of the annular member 17 is increased, and the bonding strength between the body portion 15 and the annular member 17 is increased. Since each annular groove 4 is a closed curve, it is not connected to the outside of the annular flat surface portion 154, and gas is not likely to leak through the annular groove 4. In the polishing process, it is difficult to control the orientation of the grooves formed, and gas leakage may occur through the grooves. In this way, in the present embodiment, gas leakage in the gas chamber 11 can be suppressed.
The plurality of annular grooves 4 are formed by laser processing using a laser. Fig. 8 is a schematic view showing a method of forming a plurality of annular grooves 4 by laser processing. A manufacturing device for laser processing is provided with: a sample stage 54 on which the main body 15 is mounted, a laser light source 51, a mirror 52 for reflecting the laser light, and a lens 53 for condensing the laser light. The laser source 51 uses a laser such as a fiber laser that can efficiently excavate metal. The laser beam emitted from the laser light source 51 is reflected by the mirror 52, condensed by the lens 53, and irradiated onto the annular flat surface portion 154 of the main body portion 15. The laser light is indicated by solid arrows in fig. 8.
The body 15 is drilled by the laser beam. By operating the mirror 52, the position at which the main body 15 is irradiated with the laser beam is changed. Further, the irradiation position of the laser beam may be changed by moving the sample stage 54. By changing the laser irradiation position, the position of the excavation in the body 15 is moved, and the annular groove 4 is engraved. The irradiation position of the laser light moves around the through-hole 151, and the irradiation of the laser light is stopped at a timing of one cycle around the through-hole 151. The mirror 52 is controlled so that the start point and the end point of the irradiation position of the moving laser beam coincide with each other. When the starting point and the end point are matched, the annular groove 4 becomes a closed curve. Thus, the annular groove 4 is formed.
The irradiation position of the laser beam is changed, and the radius of the circumference of the through hole 151 is changed, so that the next annular groove 4 is formed. The annular grooves 4 are formed in a repeated manner, thereby forming a plurality of annular grooves 4. By changing the radius of one circle around the through-hole 151, a plurality of concentric annular grooves 4 can be easily formed. Further, a plurality of non-concentric annular grooves 4 or a plurality of intersecting annular grooves 4 may be formed. After the plurality of annular grooves 4 are formed in the annular flat portion 154, the flange portion 172 of the annular member 17 is bonded to the annular flat portion 154 using an adhesive.
The depth of the annular groove 4 corresponds to the output of the laser light source 51. By making the output of the laser light source 51 constant, the depth of the plurality of annular grooves 4 is uniform. In addition, the density of the annular grooves 4 is made uniform by controlling the reflecting mirror 52 so that the intervals of the annular grooves 4 are constant. Therefore, the bonding area between the annular flat surface portion 154 and the flange portion 172 of the annular member 17 is uniform. When the polishing process is performed, it is difficult to control the depth and density of the grooves formed, and therefore the bonding area is not uniform. When the bonding area is not uniform, peeling from a portion having a small bonding area may easily occur. In the present embodiment, since the bonding area is uniform, the bonding strength between the body 15 and the annular member 17 is improved.
Since the plurality of annular grooves 4 are engraved by the laser, a residue including abrasive grains formed when polishing is performed is not formed. Therefore, the bonding strength between the main body 15 and the annular member 17 is not reduced and gas does not leak due to the residue containing the abrasive grains. Therefore, the bonding strength between the body 15 and the annular member 17 is improved, and gas leakage in the gas chamber 11 can be suppressed. Further, the operator does not need to manually remove the residue, and the time and labor required for manufacturing the gas encapsulation module 1 can be reduced.
Fig. 9 is a graph showing the results of measuring the adhesive strength by a tensile test. In the experiment, a tensile test was performed by bonding two test pieces and peeling the two test pieces. The horizontal axis in the figure indicates the difference between the samples used in the experiment. In the experiment, a sample in which the bonded portion of the test piece was not processed, a sample in which polishing was performed, and a sample in which a plurality of annular grooves 4 were formed by laser processing were used. The vertical axis in the figure represents the average value of the load obtained until the test piece is broken by the tensile test. In addition, error bars indicate the standard deviation of the load.
According to the results of the tensile test, the sample in which the plurality of annular grooves 4 were formed by laser processing had a larger load than the unprocessed sample and the sample subjected to polishing. For example, in the example shown in fig. 9, the load of the sample on which the plurality of annular grooves 4 are formed by laser processing is approximately twice the load of the sample subjected to polishing processing. That is, in the present embodiment, the bonding strength between the body 15 and the annular member 17 is higher than that of the conventional art in which polishing is performed. One of the main causes of such increase in adhesive strength is: by forming a plurality of annular grooves 4 by laser processing, wettability in annular flat surface portion 154 is improved, and the adhesive can easily conform to annular flat surface portion 154.
Fig. 10 is a graph showing changes in the surface area of the annular flat surface portion 154 due to laser processing and polishing processing. Showing a specific surface area of 1.04mm2The annular flat surface portion 154 of (a) was subjected to laser processing and polishing processing, the surface area was measured, and the results obtained by averaging the surface areas measured for a plurality of samples were obtained. In the figure, the horizontal axis represents the difference between the samples, and the vertical axis represents the surface area. The surface areas of the samples were measured for each of the laser processing and the polishing processing, and the average value of the surface areas was shown. The surface area was significantly larger in the sample subjected to laser processing than in the sample subjected to polishing processing. Since the annular flat portion 154 has a large surface area, the bonding area between the annular flat portion 154 and the flange portion 172 of the annular member 17 is increased, and the bonding strength between the body portion 15 and the annular member 17 is increased. That is, in the present embodiment in which the laser processing is performed, the bonding strength between the body portion 15 and the annular member 17 is higher than that in the conventional technique in which the polishing processing is performed.
When one annular groove 4 having a closed curve is formed, the start point and the end point of the irradiation position of the laser light coincide with each other. The point where the start point and the end point of the irradiation position coincide is an enlarged portion 41 whose depth is larger than the other portion of the annular groove 4. In fig. 7, portions 42, 43 including a plurality of enlarged portions 41 are indicated by being surrounded by broken lines. Fig. 11 is an enlarged view of portions 42, 43 including the plurality of enlarged portions 41 shown in fig. 7. Each annular groove 4 comprises an enlarged portion 41. At the point where the start point and the end point of the irradiation position coincide, the laser irradiation time is longer than that of the other portion of the annular groove 4, and therefore, the depth is increased than that of the other portion to form the increased portion 41. Also, at the enlarged portion 41, the width of the annular groove 4 is increased as compared with other portions.
The enlarged portions 41 included in the annular grooves 4 are not arranged in a line shape including all the enlarged portions 41 and are adjacent to and continuous with each other. For example, the plurality of enlarged portions 41 are dispersed at a plurality of positions in the circumferential direction. In the example shown in fig. 7 and 11, the plurality of enlarged portions 41 are arranged at two positions in the circumferential direction in a dispersed manner. When forming the plurality of annular grooves 4, the start point and the end point of the irradiation position of the laser beam are adjusted so that the start point and the end point of the irradiation position of the laser beam are not formed in a linear shape crossing all of the plurality of annular grooves 4. For example, when the next annular groove 4 is formed after one annular groove 4 is formed, the start point and the end point of the irradiation position are changed in the circumferential direction compared to the previous annular groove 4. In the case where all the enlarged portions 41 are connected and arranged in a line, the connection of the plurality of enlarged portions 41 may form a path of leaking gas. By not arranging the plurality of enlarged portions 41 in a line shape including all of the enlarged portions 41, the cause of gas leakage is reduced, and gas leakage in the gas chamber 11 can be suppressed. At least one of the enlarged portions 41 may be shifted from the linear rows formed by the other enlarged portions 41.
In addition, when the plurality of annular grooves 4 are formed, the annular grooves 4 are preferably formed in sequence from the inner annular groove 4 toward the outer annular groove 4. With laser processing, powder of the material of the body portion 15 may be generated and adhere to the inner surface of the through-hole 151. In the case where the annular grooves 4 are formed in order from the inner annular groove 4 toward the outer annular groove 4, powder of the material of the main body portion 15 is less likely to remain at a position inside the plurality of annular grooves 4 than in the case where the annular grooves 4 are formed in order from the outer annular groove 4 toward the inner annular groove 4. Therefore, the powder is not easily attached to the inner surface of the through-hole 151. As a result, the powder can be prevented from adhering to the inside of the gas chamber 11.
The annular flat surface portion 174 formed at one end of the annular member 17 is also formed with a plurality of annular grooves surrounding the opening of the annular member 17. The second transmission window 162 is bonded to the annular flat surface portion 174 formed with the plurality of annular grooves using an adhesive. The plurality of annular grooves formed in the annular flat surface portion 174 have the same structure as the plurality of annular grooves 4 formed in the annular flat surface portion 154, and are formed in the same manner. After the plurality of annular grooves are formed in the annular flat surface portion 174, the second transmissive window 162 is bonded to the annular flat surface portion 174 using an adhesive. By forming the plurality of annular grooves, the bonding area between the annular flat surface portion 174 and the second transmissive window 162 is increased, and the bonding strength between the annular member 17 and the second transmissive window 162 is improved. In addition, gas leakage in the gas chamber 11 can be suppressed.
Further, a plurality of annular grooves surrounding the through-hole 151 are also formed in the annular flat surface portion 156 formed on the periphery of the second end 155. The third transmissive window 163 is bonded to the annular flat surface portion 156 in which the plurality of annular grooves are formed, using an adhesive. The plurality of annular grooves formed in the annular flat surface portion 156 have the same structure as the plurality of annular grooves 4 formed in the annular flat surface portion 154, and are formed in the same manner. After the plurality of annular grooves are formed in the annular flat surface portion 156, the third transmissive window 163 is bonded to the annular flat surface portion 156 using an adhesive. By forming the plurality of annular grooves, the bonding area between the annular flat surface portion 156 and the third transmission window 163 is increased, and the bonding strength between the body portion 15 and the third transmission window 163 is improved. In addition, gas leakage in the gas chamber 12 can be suppressed.
As described above in detail, in the present embodiment, the bonding strength of the members of the gas encapsulation modules 1 and 2 is improved, and gas leakage in the gas chambers 11 and 12 can be suppressed. Therefore, the durability of the gas analyzer 3 is improved. In addition, in the present embodiment, the time and labor required for manufacturing the gas encapsulation module 1 can be reduced. Therefore, the cost of the gas analyzer 3 can be suppressed.
In the present embodiment, the through-hole 151 is shown as being circular in the front view, but the through-hole 151 may have another shape. The annular groove 4 may have a shape other than an annular shape as long as it is an annular closed curve. Fig. 12 is a schematic front view showing an annular flat surface portion 154 provided on the peripheral edge of the first end 153 in an example in which the through-hole 151 has a polygonal shape and the annular groove 4 has a polygonal annular shape. In the example shown in fig. 12, the through-hole 151 has a quadrangular shape in front view, and the annular groove 4 has a quadrangular annular shape. The through hole 151 may have another polygonal shape, and the annular groove 4 may have another polygonal annular shape. The shape of the plurality of annular grooves formed in the annular flat surface portion 174 and the annular flat surface portion 156 may have a shape other than a polygonal ring shape. In these embodiments, the bonding strength of the members of the gas encapsulation modules 1 and 2 is also improved, and gas leakage in the gas chambers 11 and 12 can be suppressed.
In the present embodiment, the annular groove 4 is shown as a closed curve, but the annular groove 4 may be formed so that a part of the ring is discontinuous. Alternatively, the gas encapsulation module 1 may be formed into a groove other than a ring shape by laser processing. Fig. 13 is a schematic front view showing an annular flat surface portion 154 provided on the peripheral edge of the first end 153 in an example in which a plurality of linear grooves 44 are formed. In the example shown in fig. 13, a plurality of substantially parallel linear grooves 44 are formed in the annular flat surface portion 154 by laser processing. Fig. 14 is a schematic front view showing an annular flat surface portion 154 provided on the periphery of the first end 153 in the example where the lattice-shaped grooves 44 are formed. In the example shown in fig. 14, lattice-shaped grooves 44 are formed in the annular flat surface portion 154 by laser processing. The same groove 44 may be formed in the annular flat portion 174 and the annular flat portion 156. In these methods, since the grooves 44 are engraved by laser, a reduction in bonding strength and gas leakage due to the residue containing abrasive grains do not occur. Therefore, the bonding strength of the members of the gas encapsulation modules 1 and 2 is improved, and gas leakage in the gas chambers 11 and 12 can be suppressed.
In the present embodiment, the plurality of annular grooves 4 are formed in the annular flat surface portion 154 of the body portion 15, but the gas-filled module 1 may be formed with a plurality of annular grooves or grooves in the portion of the flange portion 172 of the annular member 17 that is bonded to the annular flat surface portion 154. Alternatively, the gas-filled module 1 may be configured such that a plurality of annular grooves or grooves are formed in both the annular flat portion 154 and the portion of the flange portion 172 bonded to the annular flat portion 154. Even in these embodiments, the adhesion strength between the main body 15 and the annular member 17 is improved. The gas-filled module 1 may be configured such that a plurality of annular grooves or grooves are formed in the annular flat surface portion 152. In this embodiment, the bonding strength between the first transmission window 161 and the annular flat surface portion 152 is improved, and gas leakage between the gas chambers 11 and 12 can be suppressed. The gas encapsulation module 1 may include two annular members 17.
In the present embodiment, the gas containing module 1 has a rectangular parallelepiped shape and the shape of the gas containing module 1 is rectangular in front view, but the gas containing module 1 may have another shape. For example, the shape of the gas encapsulation block 1 may be circular in front view. In the present embodiment, the gas analyzer 3 is described as including the cell 33 and the gas encapsulation modules 1 and 2, but the number of cells or gas encapsulation modules included in the gas analyzer 3 may be other numbers. For example, the gas analyzer 3 may have a plurality of cells, and the number of gas sealing modules included in the gas analyzer 3 may be singular.
The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope shown in the claims are also included in the technical scope of the present invention.
Claims (8)
1. A gas encapsulation module provided with two gas chambers in which gas is encapsulated, characterized by comprising:
a block-shaped main body portion;
a through hole penetrating the main body;
a first transmission window that blocks the through hole in the middle of the through hole and allows infrared light to pass therethrough;
an annular member bonded to a peripheral edge of one end of the through hole; and
a second transmission window that blocks the opening of the annular member and passes infrared light,
one of the two gas chambers is a space sandwiched by the first transmission window and the second transmission window,
a plurality of annular grooves surrounding the through hole are formed in at least one of portions where the body portion and the annular member are bonded to each other.
2. A gas enclosure module according to claim 1,
the second transmission window is bonded to the annular member,
the portion of the annular member to which the second transmission window is bonded is formed with a plurality of annular grooves surrounding an opening of the annular member.
3. A gas enclosure module according to claim 1 or 2,
the gas encapsulation module further includes a third transmission window which is bonded to the periphery of the other end of the through hole, blocks the through hole, and passes infrared light,
the other of the two gas chambers is a space sandwiched by the first transmission window and the third transmission window,
a plurality of annular grooves surrounding the through hole are formed in a portion of the main body portion to which the third transmission window is bonded.
4. A gas enclosure module according to any one of claims 1 to 3,
the plurality of annular grooves each have an increased portion having an increased depth compared to other portions,
the enlarged portions included in the plurality of annular grooves are not arranged in a line shape including all of the enlarged portions.
5. The gas enclosure module according to any one of claims 1 to 4, wherein each of the plurality of annular grooves is engraved by laser.
6. The gas enclosure module according to claim 5, wherein the plurality of annular grooves are concentric and are formed in order from an inner annular groove toward an outer annular groove.
7. A gas encapsulation module provided with two gas chambers in which gas is encapsulated, characterized by comprising:
a block-shaped main body portion;
a through hole penetrating the main body;
a first transmission window that blocks the through hole in the middle of the through hole and allows infrared light to pass therethrough;
an annular member bonded to a peripheral edge of one end of the through hole; and
a second transmission window that blocks the opening of the annular member and passes infrared light,
one of the two gas chambers is a space sandwiched by the first transmission window and the second transmission window,
a plurality of grooves are formed around the through hole in at least one of portions where the body portion and the annular member are bonded to each other,
the plurality of grooves are engraved using a laser.
8. A gas analyzer for analyzing a concentration of a specific gas component contained in a gas to be analyzed, the gas analyzer comprising:
a gas enclosing module according to any one of claims 1 to 7;
a light source emitting infrared light; and
a cell through which gas of the analysis object flows,
the gas containing the specific gas component is enclosed in two gas chambers provided in the gas enclosing module,
the gas-enclosing module and the cell are arranged so that infrared light from the light source passes through the gas to be analyzed flowing through the cell and the infrared light of the gas having passed through the gas to be analyzed passes through the two gas chambers in this order,
the gas encapsulation module includes:
a communication path communicating with the two gas chambers; and
and a flow rate sensor that measures a flow rate of the gas flowing between the two gas chambers through the communication path.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-238701 | 2019-12-27 | ||
| JP2019238701A JP7281397B2 (en) | 2019-12-27 | 2019-12-27 | Gas filling module and gas analyzer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113049516A true CN113049516A (en) | 2021-06-29 |
| CN113049516B CN113049516B (en) | 2024-05-28 |
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| Publication number | Publication date |
|---|---|
| JP7281397B2 (en) | 2023-05-25 |
| JP2021107775A (en) | 2021-07-29 |
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