CN113048967B

CN113048967B - Method for manufacturing physical quantity detection device

Info

Publication number: CN113048967B
Application number: CN202110318966.XA
Authority: CN
Inventors: 西泽竜太; 山口啓一; 中川啓史
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2015-08-26
Filing date: 2016-08-24
Publication date: 2023-11-28
Anticipated expiration: 2036-08-24
Also published as: JP6733333B2; CN106482719A; CN106482719B; CN113048967A; JP2017044686A

Abstract

The application provides a physical quantity detection device capable of realizing miniaturization and improvement of productivity, a manufacturing method thereof, an electronic device and a moving body. A gyro vibration element (1) is provided with: a drive signal pattern (D1) including a drive electrode (130) to which a drive signal is applied, and a drive signal wiring (132) connected to the drive electrode (130); a first detection signal pattern (S1) which includes a first detection electrode (S1 a) outputting a first detection signal and a first detection signal wiring (S1 b) connected to the first detection electrode (S1 a), and which is capacitively coupled (C1) to the drive signal pattern (D1); and a second detection signal pattern (S2) which includes a second detection electrode (S2 a) that outputs a second detection signal that is opposite to the first detection signal, and a second detection signal wiring (S2 b) that is connected to the second detection electrode (S2 a), and which is capacitively coupled (C2) to the drive signal pattern (D1), wherein any one of the first detection signal pattern (S1), the second detection signal pattern (S2), and the drive signal pattern (D1) includes an adjustment pattern (P) that adjusts the area of the signal pattern.

Description

Method for manufacturing physical quantity detection device

The present application is a divisional application of patent application having application No. 201610719483.X, application day of 2016, 8 and 24, and the name of the application "physical quantity detection device and method for manufacturing the same, electronic apparatus, and moving object".

Technical Field

The present invention relates to a physical quantity detection device, a method for manufacturing the physical quantity detection device, an electronic apparatus including the physical quantity detection device, and a moving object.

Background

Conventionally, as a physical quantity detecting device, there has been known a vibrating gyroscope vibrator having a structure in which a movable portion for performing driving vibration and detecting vibration and a base portion for connecting the movable portion are integrally formed, driving electrodes and detecting electrodes are disposed on both front and back surfaces of the movable portion and the base portion, and a driving means for exciting the driving vibration and a detecting means for detecting the detecting vibration are provided, the movable portion and the base portion are made of a material transmitting laser light, adjusting electrodes are disposed on both front and back surfaces of the movable portion and the base portion, and all or a part of the adjusting electrodes are removed by the laser light so as not to face each other (for example, refer to patent document 1).

The vibrating gyroscope vibrator is configured to be capable of performing balance adjustment of crosstalk of a drive signal to a detection electrode due to electrostatic capacitance between wirings by removing all or a part of an adjustment electrode by laser light.

In the above-described vibrating gyroscope vibrator, the difference in capacitance between the plurality of detection signal wires extending from the detection electrodes is not known if not measured at the time of manufacture, and therefore the adjustment electrodes are provided in a plurality of comb teeth shape according to the number of detection signal wires.

In this way, in the vibrating gyroscope vibrator, a considerable space is required for the arrangement of the comb-shaped adjustment electrodes on both the front and back surfaces of the movable portion and the base portion, and therefore, further miniaturization may be difficult.

In the vibrating gyroscope vibrator, the comb teeth of the adjustment electrode are different from each other in that the comb teeth are irradiated with laser light according to the difference in capacitance between the plurality of detection signal wirings, and therefore, the laser irradiation position needs to be changed every time.

The productivity of the vibrating gyroscope vibrator may be reduced by each change of the laser irradiation position.

Patent document 1: japanese patent laid-open No. 2009-222666

Disclosure of Invention

The present invention has been made to solve at least some of the above problems, and can be implemented as the following modes or application examples.

Application example 1

The physical quantity detection device according to this application example is characterized by comprising: a drive signal pattern including a drive electrode to which a drive signal is applied and a drive signal wiring connected to the drive electrode; a first detection signal pattern including a first detection electrode outputting a first detection signal and a first detection signal wiring connected to the first detection electrode, and capacitively coupled to the driving signal pattern; and a second detection signal pattern including a second detection electrode outputting a second detection signal inverted from the first detection signal and a second detection signal wiring connected to the second detection electrode, and capacitively coupled to the drive signal pattern, wherein any one of the first detection signal pattern, the second detection signal pattern, and the drive signal pattern includes an adjustment pattern for adjusting an area of the signal pattern.

In this way, in the physical quantity detecting device, any one of the first detection signal pattern capacitively coupled to the drive signal pattern, the second detection signal pattern capacitively coupled to the drive signal pattern, and the drive signal pattern includes an adjustment pattern for adjusting the area of the signal pattern.

Accordingly, since the physical quantity detecting device includes the adjustment pattern in the specified one signal pattern, it is not necessary to provide the adjustment electrode in a plurality of comb teeth shape according to the number of the detection signal wirings as in the conventional technique (for example, patent document 1).

For example, by estimating the manufacturing variation in advance and giving a sufficient difference in capacitance to the first detection signal pattern and the second detection signal pattern, either the first detection signal pattern or the second detection signal pattern can be made to include the adjustment pattern.

As a result, the physical quantity detecting device can reduce the difference between the electrostatic capacitances of the first detection signal pattern and the second detection signal pattern by the adjustment pattern that adjusts the area of the signal pattern, thereby improving the detection accuracy, and realizing further miniaturization and improvement of productivity.

Application example 2

In the physical quantity detection device according to the above application example, the adjustment pattern preferably includes: a first pattern portion having a first width in a direction intersecting with an extending direction of the adjustment pattern; a second pattern portion having a second width in the direction that is narrower than the first width.

Thus, by providing a width-narrowed portion (second pattern portion) having a narrower width dimension in at least a part of the adjustment pattern, it is possible to adjust any capacitance of the detection signal pattern provided with the adjustment pattern. Thus, the difference between the electrostatic capacitances of the first detection signal pattern and the second detection signal pattern can be reduced, thereby improving the detection accuracy.

Application example 3

In the physical quantity detecting device according to the above application example, it is preferable that the device further includes a vibrating element having a base portion and a vibrating portion connected to the base portion, the driving electrode, the first detecting electrode, and the second detecting electrode are disposed on the vibrating portion, the driving signal wiring, the first detecting signal wiring, and the second detecting signal wiring are disposed on the base portion, and the adjustment pattern is disposed on the base portion.

In this way, since the physical quantity detecting device includes the vibrating element having the base portion and the vibrating portion connected to the base portion, the adjusting pattern is disposed on the base portion, for example, compared with a case where the adjusting pattern is disposed on the vibrating portion, the influence on the vibrating portion due to the adjustment of the area of the adjusting pattern can be reduced.

Application example 4

In the physical quantity detecting device according to the above application example, it is preferable that the device further includes a vibration element having a base, a vibration portion connected to the base, and a fixing portion connected to the base, the driving signal wiring, the first detection signal wiring, and the second detection signal wiring are disposed on both the base and the fixing portion, and the adjustment pattern is disposed on the fixing portion.

In this way, in the physical quantity detecting device, the vibration element includes the fixing portion connected to the base portion, and the adjustment pattern is disposed on the fixing portion, so that the influence of the adjustment pattern on the vibration portion can be further reduced.

In addition, the physical quantity detecting device can miniaturize the base portion as compared with the case where the adjustment pattern is arranged on the base portion.

Application example 5

In the physical quantity detection device according to the above application example, it is preferable that the device further includes a vibration element, a relay substrate, and an electronic element electrically connected to the vibration element via the relay substrate, the driving signal pattern, the first detection signal pattern, and the second detection signal pattern are arranged so as to span the vibration element and the relay substrate, and the adjustment pattern is arranged on the relay substrate.

Accordingly, the physical quantity detecting device includes the vibration element and the electronic element electrically connected to the vibration element through the relay substrate, and since the adjustment pattern is disposed on the relay substrate, each element can be miniaturized as compared with the case where the adjustment pattern is disposed on the vibration element or the electronic element.

Application example 6

The physical quantity detection device according to the above application example preferably includes: a vibrating element; and a container that houses the vibration element, wherein the vibration element and the container are electrically connected to each other by a connection portion, wherein the driving signal pattern, the first detection signal pattern, and the second detection signal pattern are disposed so as to span the vibration element and the container via the connection portion, and wherein the adjustment pattern is disposed on the container.

Accordingly, the physical quantity detecting device includes the vibrating element and the container, and the vibrating element and the container are electrically connected to each other by the connection portion, and since the adjustment pattern is disposed on the container, the vibrating element can be miniaturized as compared with the case where the adjustment pattern is disposed on the vibrating element.

Application example 7

In the physical quantity detecting device according to the above application example, it is preferable that the adjustment pattern and a signal pattern to be the object of the capacitive coupling among the drive signal pattern, the first detection signal pattern, and the second detection signal pattern are disposed so as to face each other, and a constant potential pattern is disposed between the adjustment pattern and the signal pattern.

Accordingly, the physical quantity detecting device is configured to have a constant potential pattern disposed between the adjustment pattern and the signal pattern to be capacitively coupled, and therefore, compared with a case where the constant potential pattern is not disposed, the capacitance between the adjustment pattern and the signal pattern due to capacitive coupling can be reduced.

Application example 8

In the physical quantity detecting device according to the above application example, it is preferable that the adjustment pattern and a signal pattern to be the object of the capacitive coupling among the driving signal pattern, the first detection signal pattern, and the second detection signal pattern are disposed so as to face each other, and a region that is not electrostatically shielded is present between the adjustment pattern and the signal pattern.

Accordingly, the physical quantity detecting device has a region which is not electrostatically shielded between the adjustment pattern and the signal pattern to be capacitively coupled, and therefore, by adjusting the area of the adjustment pattern, even in the same adjustment amount, the change in electrostatic capacitance can be increased as compared with the case where the constant potential pattern is arranged.

Application example 9

In the physical quantity detecting device according to the above application example, it is preferable that the adjustment pattern and a signal pattern to be the object of the capacitive coupling among the drive signal pattern, the first detection signal pattern, and the second detection signal pattern are disposed so as to face each other, and a region in which a constant potential pattern is disposed and a region in which the signal pattern is not electrostatically shielded are present between the adjustment pattern and the signal pattern.

In this way, the physical quantity detecting device can increase or decrease the change in electrostatic capacitance according to the difference in position of adjusting the area of the adjustment pattern, because there is a region where the constant potential pattern is arranged and a region where the constant potential pattern is not electrostatically shielded between the adjustment pattern and the signal pattern that is the object of capacitive coupling.

Application example 10

The electronic device according to the present application is characterized by comprising the physical quantity detection device according to any one of the above application.

Thus, the electronic device is provided with the physical quantity detection device according to any one of the above-described application examples, and therefore the effects according to any one of the above-described application examples can be achieved, and excellent performance can be exhibited.

Application example 11

The mobile body according to the present application is characterized by comprising the physical quantity detection device according to any one of the above application examples.

Thus, the moving body is provided with the physical quantity detection device according to any one of the above-described application examples, and therefore the effects according to any one of the above-described application examples can be achieved, and excellent performance can be exhibited.

Application example 12

The method for manufacturing a physical quantity detection device according to this application example is characterized by comprising: a drive signal pattern including a drive electrode to which a drive signal is applied and a drive signal wiring connected to the drive electrode; a first detection signal pattern including a first detection electrode outputting a first detection signal and a first detection signal wiring connected to the first detection electrode, and capacitively coupled to the driving signal pattern; a second detection signal pattern including a second detection electrode outputting a second detection signal inverted from the first detection signal and a second detection signal wiring connected to the second detection electrode, and capacitively coupled to the drive signal pattern, any one of the first detection signal pattern, the second detection signal pattern, and the drive signal pattern having an adjustment pattern, the method of manufacturing the physical quantity detection device including: and reducing a difference between an electrostatic capacitance generated by the capacitive coupling between the first detection signal pattern and the driving signal pattern and an electrostatic capacitance generated by the capacitive coupling between the second detection signal pattern and the driving signal pattern by changing an area of the adjustment pattern.

In this way, the method of manufacturing the physical quantity detecting device can reduce the difference between the capacitance between the first detection signal pattern and the drive signal pattern and the capacitance between the second detection signal pattern and the drive signal pattern by changing the area of the adjustment pattern, and thus can improve the detection accuracy of the physical quantity detecting device.

Further, in the method for manufacturing the physical quantity detecting device, since the adjustment pattern is provided in any one of the first detection signal pattern, the second detection signal pattern, and the drive signal pattern, further miniaturization and improvement in productivity of the physical quantity detecting device can be achieved as compared with the case where the adjustment pattern is provided in each of the signal patterns.

Application example 13

In the method for manufacturing a physical quantity detection device according to the above application example, the step of changing the area of the adjustment pattern preferably includes: and a step of preparing the first detection signal pattern or the second detection signal pattern, which includes the adjustment pattern, and which includes a physical quantity detection device in which the capacitance of one of the adjustment patterns is larger than the capacitance of the other, and which includes a step of reducing the area of the adjustment pattern by removing at least a part of the adjustment pattern with an energy line.

Thus, the method for manufacturing the physical quantity detecting device includes the step of preparing the physical quantity detecting device including the adjustment pattern in which the capacitance of one of the adjustment patterns is larger than the capacitance of the other, and removing at least a part of the adjustment pattern by the energy line to reduce the area of the adjustment pattern.

Thus, the method for manufacturing the physical quantity detecting device can improve the detection accuracy of the physical quantity detecting device.

Application example 14

In the method for manufacturing a physical quantity detection device according to the above application example, the step of changing the area of the adjustment pattern preferably includes: and a step of preparing the first detection signal pattern or the second detection signal pattern, which includes the adjustment pattern, and which includes a physical quantity detection device in which the capacitance of one of the adjustment patterns is smaller than the capacitance of the other, and which increases the area of the adjustment pattern by at least one of vapor deposition, sputtering, and ion beam.

Thus, the method for manufacturing the physical quantity detecting device includes the step of preparing the physical quantity detecting device including the adjustment pattern in which the capacitance of one of the adjustment patterns is smaller than the capacitance of the other, and increasing the area of the adjustment pattern by at least one of vapor deposition and sputtering, so that the difference between the two capacitances can be reliably reduced.

Drawings

Fig. 1 is a plan view showing a structure of one principal surface side of the gyro vibration element according to the first embodiment.

Fig. 2 is a plan view showing a structure of the gyro vibration device according to the first embodiment, which is seen from one principal surface side of the gyro vibration device.

Fig. 3A is an enlarged view of the center portion of fig. 1 for explaining the adjustment pattern.

Fig. 3B is an enlarged view of the center portion of fig. 1 for explaining another arrangement example 1 of the adjustment pattern.

Fig. 3C is an enlarged view of the center portion of fig. 2 for explaining another arrangement example 2 of the adjustment pattern.

Fig. 3D is an enlarged view of the center portion of fig. 1 for explaining another arrangement example 3 of the adjustment pattern.

Fig. 4 is a schematic plan view for explaining the operation of the gyro vibration device.

Fig. 5 is a schematic plan view for explaining the operation of the gyro vibration device.

Fig. 6 is a schematic diagram showing a circuit configuration related to driving and detection of the gyro vibration element.

Fig. 7A is an enlarged view of a main part for explaining a method of manufacturing the gyro vibration element.

Fig. 7B is an enlarged view of a main part of specific example 1 showing a method of adjusting the pattern for adjustment.

Fig. 7C is an enlarged view of a main part of specific example 2 showing a method of adjusting the pattern for adjustment.

Fig. 8 is a plan view showing a structure of one principal surface side of the gyro vibration element according to the modification of the first embodiment.

Fig. 9 is a plan view showing the structure of the physical quantity sensor unit according to the second embodiment.

Fig. 10 is a cross-sectional view taken along line E-E of fig. 9.

Fig. 11 is a plan view showing a structure of the gyro vibration device according to the third embodiment on one principal surface side.

Fig. 12 is a plan view showing a structure of the gyro vibration device according to the third embodiment, which is seen from one principal surface side of the gyro vibration device.

Fig. 13 is a schematic perspective view showing a driving vibration state of the gyro vibration element.

Fig. 14 is a schematic perspective view showing a detected vibration state of the gyro vibration element.

Fig. 15 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 1 of the third embodiment.

Fig. 16 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 2 of the third embodiment.

Fig. 17 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 3 of the third embodiment.

Fig. 18 is a plan view showing a structure of a gyro vibration device according to modification 4 of the third embodiment, seen from one principal surface side of the gyro vibration device.

Fig. 19 is a plan view showing the structure of a physical quantity sensor according to the fourth embodiment.

Fig. 20 is a cross-sectional view taken along line H-H of fig. 19.

Fig. 21 is a schematic perspective view showing the configuration of a portable (or notebook) personal computer as an electronic device provided with a physical quantity detecting device.

Fig. 22 is a schematic perspective view showing the structure of a mobile phone (including a PHS: personal Handy-phone System) as an electronic device provided with a physical quantity detecting device.

Fig. 23 is a schematic perspective view showing a configuration of a digital camera as an electronic device provided with a physical quantity detecting device.

Fig. 24 is a schematic perspective view showing an automobile as a moving body provided with a physical quantity detecting device.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First embodiment

First, a gyro vibration element as an example of the physical quantity detection device will be described.

Fig. 1 is a plan view showing a structure of one principal surface side of the gyro vibration element according to the first embodiment. Fig. 2 is a plan view showing a structure of the gyro vibration element seen from one principal surface side to the other principal surface side. Fig. 3A is an enlarged view of the center portion of fig. 1 for explaining the adjustment pattern. In addition, the following drawings are included, and for convenience of explanation, the dimensional ratios of the respective components are different from actual ones.

Examples of the material of the gyro vibration element 1 called a double-T type include materials such as crystal, lithium tantalate, and lithium niobate.

As shown in fig. 1 and 2, the gyro vibration device 1 has a width in the XY plane and a thickness in the Z axis direction, for example, according to the crystal axis of crystal. The gyro vibration element 1 has a first surface 101 (one main surface, see fig. 1) and a second surface 102 (the other main surface, see fig. 2) facing in opposite directions to each other, and a side surface 103 connecting the first surface 101 and the second surface 102. The first surface 101 and the second surface 102 are surfaces parallel to the XY plane, and the second surface 102 is a surface facing the inner bottom surface of a container (not shown) in which storage is performed.

The side surface 103 is a surface orthogonal to the first surface 101 and the second surface 102 and parallel to the Z axis.

As shown in fig. 1 and 2, the gyro vibration device 1 includes: a base 10; first and second connecting arms 20, 22; first and second detection vibrating arms 30, 32; first to fourth driving vibration arms 40, 42, 44, 46; first to fourth beams 50, 52, 54, 56; first and second support portions 60, 62.

The base 10 has a center point G of the gyro vibration element 1. The center point G is the center of gravity position of the gyro vibration element 1. The X axis, the Y axis and the Z axis are orthogonal to each other and take the center point G as an origin. Preferably, the gyro vibration element 1 is point-symmetrical with respect to the center point G. That is, it is preferable that gyro vibration device 1 is plane-symmetrical with respect to the XZ plane and plane-symmetrical with respect to the YZ plane.

The first and second connecting arms 20 and 22 extend from the base 10 along the X-axis in the positive and negative directions, respectively. The first and second detection vibration arms 30 and 32 extend from the base 10 in the positive and negative directions along the Y axis, respectively. The first and second driving vibration arms 40 and 42 extend from the first connecting arm 20 in the positive and negative directions along the Y-axis, respectively. The third and fourth driving vibration arms 44 and 46 extend from the second connecting arm 22 in the positive and negative directions along the Y axis, respectively.

The detection vibration arms 30 and 32 constitute a detection vibration system for detecting the angular velocity. Further, the coupling arms 20 and 22 and the driving vibration arms 40, 42, 44, and 46 constitute a driving vibration system for driving the gyro vibration device 1.

The distal ends 30a, 32a of the detection vibrating arms 30, 32 preferably have a substantially quadrangular shape having a larger width (a larger length in the X-axis direction) than other portions. Similarly, the distal ends 40a, 42a, 44a, 46a of the driving vibration arms 40, 42, 44, 46 preferably have a substantially quadrangular shape having a larger width than the other portions. The gyro vibration device 1 can improve the detection sensitivity of the angular velocity as the physical quantity by the tip portions 30a, 32a, 40a, 42a, 44a, 46a having such a shape.

The first support portion 60 as a fixing portion is disposed on the positive direction side of the Y axis with respect to the first detection vibration arm 30. The second support portion 62 as a fixing portion is disposed on the negative direction side of the Y axis with respect to the second detection vibration arm 32.

The length of the support portions 60, 62 in the X-axis direction is longer than the length of the distal end portions 30a, 32a of the detection vibration arms 30, 32 in the X-axis direction, and is, for example, the same as the sum of the lengths of the connecting arms 20, 22 and the base 10 in the X-axis direction. In the illustrated example, the support portions 60 and 62 have a substantially rectangular planar shape, but are not particularly limited. The support portions 60 and 62 are disposed separately from the detection vibration arms 30 and 32 and the driving vibration arms 40, 42, 44, and 46. The support portions 60 and 62 are fixed to a container or the like.

As shown in fig. 1 and 2, the first beam 50 extends from the base 10, between the first detection vibration arm 30 and the first driving vibration arm 40, and extends to the first support portion 60. The second beam 52 extends from the base 10, passes between the second detection vibration arm 32 and the second driving vibration arm 42, and extends to the second support portion 62. The third beam 54 extends from the base 10, passes between the first detection vibration arm 30 and the third drive vibration arm 44, and extends to the first support portion 60. The fourth beam 56 extends from the base 10, passes between the second detection vibration arm 32 and the fourth drive vibration arm 46, and extends to the second support portion 62.

In this way, the first and third beams 50, 54 are connected to the first support portion 60, and the second and fourth beams 52, 56 are connected to the second support portion 62, and support the base 10. Preferably, the beams 50, 52, 54, 56 have S-shaped portions 50a, 52a, 54a, 56a, respectively.

In the illustrated example, for example, the first beam 50 extends in the positive direction of the X-axis from the base 10, then extends in the positive direction of the Y-axis, then extends in the negative direction of the X-axis, then extends in the positive direction of the Y-axis, then extends in the positive direction of the X-axis, then extends in the positive direction of the Y-axis, and is connected to the first support portion 60. That is, in the illustrated example, the first beam 50 has three portions parallel to the X-axis direction in the S-shaped portion 50 a.

Also, the second to fourth beams 52, 54, 56 each have three portions parallel to the X-axis direction in the S-shaped portions 52a, 54a, 56 a. The S-shaped portions 50a, 52a, 54a, 56a can provide elasticity to the beams 50, 52, 54, 56 in the X-axis direction and the Y-axis direction.

As shown in fig. 1 and 2, the gyro vibration element 1 includes a detection signal electrode 110, a detection signal wiring 112, a detection signal terminal 114, a detection ground electrode 120, a detection ground wiring 122, a detection ground terminal 124, a drive signal electrode 130, a drive signal wiring 132, a drive signal terminal 134, a drive ground electrode 140, a drive ground wiring 142, and a drive ground terminal 144.

For convenience, in fig. 1 and 2, the detection signal electrode 110, the detection signal wiring 112, and the detection signal terminal 114 are indicated by lower right oblique lines, the detection ground electrode 120, the detection ground wiring 122, and the detection ground terminal 124 are indicated by cross oblique lines, the drive signal electrode 130, the drive signal wiring 132, and the drive signal terminal 134 are indicated by lower left oblique lines, and the drive ground electrode 140, the drive ground wiring 142, and the drive ground terminal 144 are indicated by cross vertical lines. In fig. 1 and 2, the electrodes, wirings, and terminals formed on the side surface 103 of the gyro vibration element 1 are indicated by thick lines.

As the materials of the electrodes 110, 120, 130, 140, the wirings 112, 122, 132, 142, and the terminals 114, 124, 134, 144, for example, a material laminated in order of chromium and gold from the gyro vibration element 1 side is preferably used. The electrodes 110, 120, 130, 140 are electrically separated from each other. The wirings 112, 122, 132, 142 are electrically separated from each other. The terminals 114, 124, 134, 144 are electrically separated from each other.

The electrodes, wirings, and terminals will be described in order.

(1) Detection signal electrode, detection signal wiring, and detection signal terminal

As shown in fig. 1 and 2, the detection signal electrode 110 is formed on the first and second detection vibrating arms 30, 32. However, in the illustrated example, the detection signal electrode 110 is not formed on the distal end portions 30a, 32a of the first and second detection vibrating arms 30, 32. More specifically, the detection signal electrode 110 is formed on the first surface 101 and the second surface 102 of the first and second detection vibrating arms 30, 32. The detection signal electrode 110 is configured to be plane-symmetrical with respect to the XZ plane. The detection signal electrode 110 is an electrode for detecting deformation of the piezoelectric material caused by the detection vibrations of the first and second detection vibration arms 30 and 32 when the vibrations are excited.

As shown in fig. 1, the detection signal wiring 112 is formed on the first and second beams 50, 52. More specifically, the detection signal wiring 112 is formed on the first surface 101 of the first and second beams 50, 52. As shown in fig. 1 and 2, the detection signal wiring 112 is formed on the side 103a of the joint portion where the first beam 50 is joined to the base 10, the side 103b of the joint portion where the second beam 52 is joined to the base 10, and the first and second surfaces 101 and 102 of the base 10.

The detection signal terminal 114 is formed on the first and second supporting portions 60, 62. More specifically, the detection signal terminals 114 are formed on the first and second surfaces 101, 102 of the first and second support portions 60, 62, and on the side surface 103. The detection signal terminals 114 formed on the surfaces 101, 102 and the side surfaces 103 of the first support portion 60 are electrically connected to each other. The detection signal terminals 114 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other.

In the illustrated example, the detection signal terminal 114 formed on the first support portion 60 is disposed on the positive direction side of the Y axis with respect to the tip end portion 40a of the first driving vibration arm 40 on which the driving ground electrode 140 is formed as described later. That is, it can be said that the detection signal terminal 114 formed on the first support portion 60 and the driving ground electrode 140 formed on the tip portion 40a face each other in the Y-axis direction.

The detection signal terminal 114 formed on the second support portion 62 is arranged on the negative side of the Y axis with respect to the distal end portion 42a of the second driving vibration arm 42 on which the driving ground electrode 140 is formed as described later. That is, it can be said that the detection signal terminal 114 formed on the second support portion 62 is opposed to the driving ground electrode 140 formed on the tip portion 42a in the Y-axis direction.

As shown in fig. 1, the detection signal terminal 114 formed on the first support portion 60 is electrically connected to the detection signal electrode 110 formed on the first detection vibrating arm 30 via the detection signal wiring 112 formed on the first beam 50.

More specifically, as shown in fig. 1 and 2, the detection signal terminal 114 formed on the first support portion 60 is connected to the detection signal wiring 112 formed on the first surface 101 of the first beam 50, and the detection signal wiring 112 is connected to the detection signal electrode 110 formed on the first and second surfaces 101, 102 of the first detection vibrating arm 30 from the first surface 101 of the first beam 50, through the side surface 103a of the joint portion where the first beam 50 is joined to the base portion 10, and through the first and second surfaces 101, 102 of the base portion 10. As a result, the first detection signal generated by the vibration of the first detection vibration arm 30 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the first support portion 60.

As shown in fig. 1 and 3A, the first vibration sensor includes a detection signal terminal 114 formed on the first support portion 60, a detection signal wire 112 (first detection signal wire S1 b) formed on the first beam 50, and a detection signal electrode 110 (first detection electrode S1 a) formed on the first detection vibration arm 30, which are defined as a first detection signal pattern S1.

As shown in fig. 1, the detection signal terminal 114 formed on the second support portion 62 is electrically connected to the detection signal electrode 110 formed on the second detection vibrating arm 32 via the detection signal wiring 112 formed on the second beam 52.

More specifically, as shown in fig. 1 and 2, the detection signal terminal 114 formed on the second support portion 62 is connected to the detection signal wiring 112 formed on the first surface 101 of the second beam 52, and the detection signal wiring 112 is connected to the detection signal electrode 110 formed on the first and second surfaces 101, 102 of the second detection vibrating arm 32 from the first surface 101 of the second beam 52, through the side surface 103b of the joint portion where the second beam 52 is joined to the base portion 10, and through the first and second surfaces 101, 102 of the base portion 10. As a result, the second detection signal generated by the vibration of the second detection vibration arm 32 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the second support portion 62.

As shown in fig. 1 and 3A, the second vibration sensor includes a detection signal terminal 114 formed on the second support 62, a detection signal wire 112 (second detection signal wire S2 b) formed on the second beam 52, and a detection signal electrode 110 (second detection electrode S2 a) formed on the second detection vibration arm 32, and is also referred to as a second detection signal pattern S2.

(2) Detection ground electrode, detection ground wiring and detection ground terminal

As shown in fig. 1 and 2, the detection ground electrode 120 is formed on the tip end portions 30a, 32a on the tip end side of the detection signal electrodes 110 of the first and second detection vibration arms 30, 32.

More specifically, the detection ground electrode 120 is formed on the first and second surfaces 101, 102 of the tip portions 30a, 32 a. The detection ground electrode 120 is formed on the side surface 103 of the first and second detection vibrating arms 30 and 32. The detection ground electrodes 120 formed on the surfaces 101, 102 and the side surfaces 103 of the first detection vibrating arms 30 are electrically connected to each other.

In addition, the detection ground electrodes 120 formed on the surfaces 101, 102 and the side surfaces 103 of the second detection vibrating arms 32 are electrically connected to each other. In the illustrated example, the detection ground electrode 120 is configured to be plane-symmetrical with respect to the XZ plane. The detection ground electrode 120 has a potential that is grounded with respect to the detection signal electrode 110.

The detection ground wiring 122 is formed on the first and second beams 50, 52. More specifically, the detection ground wiring 122 is formed on the second surfaces 102, side surfaces 103 of the first and second beams 50, 52. Further, the detection ground wiring 122 is formed on the first and second surfaces 101, 102 of the base 10. In the illustrated example, the detection ground wiring 122 is configured to be plane-symmetrical with respect to the XZ plane.

The detection ground terminal 124 is formed on the first and second support portions 60, 62.

More specifically, the detection ground terminal 124 is formed on the first and second surfaces 101, 102 of the first and second support portions 60, 62, and on the side surface 103. The detection ground terminals 124 formed on the surfaces 101, 102 and the side surface 103 of the first support portion 60 are electrically connected to each other. The detection ground terminals 124 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other.

In the illustrated example, the detection ground terminal 124 formed on the first support portion 60 is disposed on the positive direction side of the Y axis with respect to the tip end portion 30a of the first detection vibrating arm 30 on which the detection ground electrode 120 is formed. That is, it can be said that the detection ground terminal 124 formed on the first support portion 60 and the detection ground electrode 120 formed on the tip portion 30a face each other in the Y-axis direction.

The detection ground terminal 124 formed on the second support portion 62 is disposed on the negative direction side of the Y axis with respect to the distal end portion 32a of the second detection vibration arm 32 on which the detection ground electrode 120 is formed. That is, it can be said that the detection ground terminal 124 formed on the second support portion 62 and the detection ground electrode 120 formed on the tip portion 32a face each other in the Y-axis direction. In the illustrated example, the detection ground terminal 124 is configured to be plane-symmetrical with respect to the XZ plane.

The detection ground terminal 124 formed on the first support portion 60 is electrically connected to the detection ground electrode 120 formed on the first detection vibrating arm 30 via the detection ground wiring 122 formed on the first beam 50.

More specifically, the detection ground terminal 124 formed on the first support portion 60 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the first beam 50, and the detection ground wiring 122 is connected to the detection ground electrode 120 formed on the side surface 103 of the first detection vibrating arm 30 from the second surface 102 and the side surface 103 of the first beam 50 through the first and second surfaces 101 and 102 of the base portion 10.

The detection ground terminal 124 formed on the second support portion 62 is electrically connected to the detection ground electrode 120 formed on the second detection vibrating arm 32 via the detection ground wiring 122 formed on the second beam 52. More specifically, the detection ground terminal 124 formed on the second support portion 62 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the second beam 52, and the detection ground wiring 122 is connected to the detection ground electrode 120 formed on the side surface 103 of the second detection vibrating arm 32 from the second surface 102 and the side surface 103 of the second beam 52 through the first and second surfaces 101 and 102 of the base portion 10.

As described above, the detection signal electrode 110, the detection signal wiring 112, the detection signal terminal 114, the detection ground electrode 120, the detection ground wiring 122, and the detection ground terminal 124 are arranged. As a result, the detection vibration generated in the first detection vibration arm 30 is represented as electric charge between the detection signal electrode 110 and the detection ground electrode 120 formed on the first detection vibration arm 30, and can be taken out as a first detection signal from the detection signal terminal 114 and the detection ground terminal 124 formed on the first support portion 60. The detection vibration generated in the second detection vibration arm 32 is represented as electric charge between the detection signal electrode 110 and the detection ground electrode 120 formed on the second detection vibration arm 32, and can be taken out as a second detection signal from the detection signal terminal 114 and the detection ground terminal 124 formed on the second support portion 62.

(3) Drive signal electrode, drive signal wiring, and drive signal terminal

As shown in fig. 1 and 2, a drive signal electrode 130 as a drive electrode is formed on the first and second drive vibration arms 40, 42. However, in the illustrated example, the drive signal electrode 130 is not formed on the tip portions 40a, 42a of the first and second drive vibration arms 40, 42.

More specifically, the driving signal electrode 130 is formed on the first surface 101 and the second surface 102 of the first and second driving vibration arms 40, 42. The drive signal electrode 130 is formed on the side surfaces 103 of the third and fourth drive vibration arms 44 and 46, and on the first and second surfaces 101 and 102 of the tip ends 44a and 46a of the third and fourth drive vibration arms 44 and 46.

The drive signal electrodes 130 formed on the surfaces 101, 102 and the side surfaces 103 of the third drive vibrating arms 44 are electrically connected to each other. In addition, the drive signal electrodes 130 formed on the surfaces 101, 102 and the side surfaces 103 of the fourth drive vibration arms 46 are electrically connected to each other. In the illustrated example, the driving signal electrode 130 is configured to be plane-symmetrical with respect to the XZ plane. The drive signal electrode 130 is an electrode for exciting the drive vibration of the first to fourth drive vibration arms 40, 42, 44, 46.

As shown in fig. 1, the driving signal wiring 132 is formed on the third and fourth beams 54, 56. More specifically, the driving signal wiring 132 is formed on the first surface 101 of the third and fourth beams 54, 56. The drive signal wiring 132 is formed on the first surface 101 of the base 10, the first surface 101 of the first connecting arm 20, the side surface 103c of the first connecting arm 20 parallel to the YZ plane, and the side surface 103d of the second connecting arm 22 parallel to the XZ plane. In the illustrated example, the drive signal wiring 132 is configured to be plane-symmetrical with respect to the XZ plane.

As shown in fig. 1 and 2, the drive signal terminal 134 is formed on the second support portion 62. More specifically, the drive signal terminals 134 are formed on the first and second surfaces 101, 102 of the second support portion 62, and on the side surface 103. The drive signal terminals 134 formed on the surfaces 101, 102 and the side surfaces 103 of the second support portion 62 are electrically connected to each other. In the illustrated example, the drive signal terminal 134 formed on the second support portion 62 is disposed on the negative direction side of the Y axis with respect to the tip end portion 46a of the fourth drive vibration arm 46 on which the drive signal electrode 130 is formed. That is, it can be said that the drive signal terminal 134 formed on the second support portion 62 is opposed to the drive signal electrode 130 formed on the tip portion 46a in the Y-axis direction.

As shown in fig. 1, the drive signal terminal 134 formed on the second support portion 62 is electrically connected to the drive signal electrode 130 formed on the first to fourth drive vibration arms 40, 42, 44, 46 via the drive signal wiring 132 formed on the fourth beam 56.

More specifically, the drive signal terminal 134 is connected to the drive signal wiring 132 formed on the first surface 101 of the fourth beam 56, and the drive signal wiring 132 is connected to the drive signal electrode 130 formed on the first surface 101 of the first and second drive vibration arms 40, 42 from the first surface 101 of the fourth beam 56, through the first surface 101 of the base 10, and through the first surface 101 of the first connecting arm 20.

As shown in fig. 1 and 2, the drive signal wiring 132 extends from the first surface 101 of the first connecting arm 20, passes through the side surface 103c of the first connecting arm 20, and is connected to the drive signal electrode 130 formed on the second surface 102 of the first and second drive vibration arms 40 and 42.

The drive signal wiring 132 is connected to the drive signal electrode 130 formed on the side surface 103 of the third and fourth drive vibration arms 44 and 46 from the first surface 101 of the base 10 through the side surface 103d of the second connecting arm 22. Thus, the drive signal for driving the first to fourth drive vibration arms 40, 42, 44, 46 can be transmitted from the drive signal terminal 134 to the drive signal electrode 130.

Here, the driving signal pattern D1 is provided including the driving signal electrode 130, the driving signal terminal 134, and the driving signal wiring 132 as driving electrodes.

(4) Driving ground electrode, driving ground wiring, and driving ground terminal

As shown in fig. 1 and 2, the driving ground electrode 140 is formed on the distal end portions 40a and 42a on the distal end side of the driving signal electrodes 130 of the first and second driving vibration arms 40 and 42.

More specifically, the driving ground electrode 140 is formed on the first and second surfaces 101, 102 of the tip portions 40a, 42a of the first and second driving vibration arms 40, 42. Further, the driving ground electrode 140 is formed on the side surface 103 of the first and second driving vibration arms 40, 42. The driving ground electrodes 140 formed on the surfaces 101, 102 and the side surfaces 103 of the first driving vibration arms 40 are electrically connected to each other. In addition, the driving ground electrodes 140 formed on the surfaces 101, 102 and the side surfaces 103 of the second driving vibration arms 42 are electrically connected to each other.

Further, the driving ground electrode 140 is formed on the first and second surfaces 101, 102 of the third and fourth driving vibration arms 44, 46. However, in the illustrated example, the driving ground electrode 140 is not formed on the tip portions 44a, 46 a. In the illustrated example, the driving ground electrode 140 is configured to be plane-symmetrical with respect to the XZ plane. The driving ground electrode 140 has a potential that is grounded with respect to the driving signal electrode 130.

The driving ground wiring 142 is formed on the third and fourth beams 54, 56. More specifically, the driving ground wiring 142 is formed on the second surface 102 and the side surface 103 of the third and fourth beams 54, 56. The driving ground wiring 142 is formed on the second surface 102 of the base 10, the side surface 103e of the first connecting arm 20 parallel to the XZ plane, the second surface 102 of the second connecting arm 22, and the side surface 103f of the second connecting arm 22 parallel to the YZ plane. In the illustrated example, the driving ground wiring 142 is configured to be plane-symmetrical with respect to the XZ plane.

The driving ground terminal 144 is formed on the first supporting portion 60. More specifically, the driving ground terminal 144 is formed on the first and second surfaces 101, 102 of the first supporting portion 60, and is formed on the side surface 103. The driving ground terminals 144 formed on the surfaces 101, 102 and the side surfaces 103 of the first supporting portion 60 are electrically connected to each other.

In the illustrated example, the drive ground terminal 144 formed on the first support portion 60 is disposed on the positive direction side of the Y axis with respect to the tip end portion 44a of the third drive vibration arm 44 on which the drive signal electrode 130 is formed. That is, it can be said that the driving ground terminal 144 formed on the first support portion 60 is opposed to the driving signal electrode 130 formed on the tip portion 44a in the Y-axis direction.

The driving ground terminal 144 formed on the first supporting portion 60 is electrically connected to the driving ground electrode 140 formed on the first to fourth driving vibration arms 40, 42, 44, 46 via the driving ground wiring 142 formed on the third beam 54.

More specifically, the driving ground terminal 144 is connected to the driving ground wiring 142 formed on the second surface 102 and the side surface 103 of the third beam 54, and the driving ground wiring 142 is connected to the driving ground electrode 140 formed on the side surface 103 of the first and second driving vibration arms 40, 42 from the second surface 102 and the side surface 103 of the third beam 54, through the second surface 102 of the base 10, and through the side surface 103e of the first connecting arm 20.

The driving ground wire 142 is connected to the driving ground electrode 140 formed on the second surface 102 of the third and fourth driving vibration arms 44 and 46 from the second surface 102 of the base 10 through the second surface 102 of the second connecting arm 22. The driving ground wire 142 is connected to the driving ground electrode 140 formed on the first surface 101 of the third and fourth driving vibration arms 44 and 46 from the second surface 102 of the second connecting arm 22 through the side surface 103f of the second connecting arm 22.

As described above, the drive signal electrode 130, the drive signal wiring 132, the drive signal terminal 134, the drive ground electrode 140, the drive ground wiring 142, and the drive ground terminal 144 are arranged. In this way, in the gyro vibration element 1, by applying a drive signal between the drive signal terminal 134 formed on the second support portion 62 and the drive ground terminal 144 formed on the first support portion 60, an electric field is generated between the drive signal electrode 130 and the drive ground electrode 140 formed on each of the drive vibration arms 40, 42, 44, 46, whereby each of the drive vibration arms 40, 42, 44, 46 can be driven and vibrated.

As described above, the gyro vibration element 1 includes the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2, the drive signal pattern D1 includes the drive signal electrode 130 to which the drive signal is applied, the drive signal wiring 132 connected to the drive signal electrode 130, and the drive signal terminal 134, the first detection signal pattern S1 includes the first detection electrode S1a outputting the first detection signal and the first detection signal wiring S1b connected to the first detection electrode S1a, and is capacitively coupled to the drive signal pattern D1 by the electrostatic capacitance C1 as shown in fig. 3A, and the second detection signal pattern S2 includes the second detection electrode S2a outputting the second detection signal opposite to the first detection signal and the second detection signal wiring S2b connected to the second detection electrode S2a, and is capacitively coupled to the drive signal pattern D1 by the electrostatic capacitance C2 as shown in fig. 3A.

The gyro vibration device 1 includes an adjustment pattern P for adjusting the area of any one of the first detection signal pattern S1, the second detection signal pattern S2, and the drive signal pattern D1 (here, the second detection signal pattern S2).

As shown in fig. 3A, the adjustment pattern P is arranged in a region where the first detection signal pattern S1 and the drive signal pattern D1 are aligned or where the second detection signal pattern S2 and the drive signal pattern D1 are aligned, and in this embodiment, is arranged in an adjustment region Q where the first detection signal pattern S1, the second detection signal pattern S2, and the drive signal pattern D1 are aligned so as to be able to perform capacitance adjustment. The adjustment pattern P of the present embodiment is configured to have a shape in which the area of the adjustment region Q is enlarged by increasing the size of a part of the second detection signal pattern S2 in the width direction. Specifically, the adjustment pattern P has a width W1, which is a dimension in a direction (Y-axis direction in the drawing) intersecting the extending direction (X-axis direction in the drawing) of the second detection signal pattern S2.

Then, a portion of the adjustment pattern P on the drive signal pattern D1 side of the width W1 (first width) is removed (removed portion R indicated by a two-dot chain line in the figure), thereby forming a width narrowed portion (second pattern portion) P2 of the width W2 having a narrower width dimension (second width). At this time, the adjustment pattern P having the width (first width) W1 of the portion not removed becomes a wide portion (first pattern portion) P1. In other words, the pattern P for adjustment includes a first pattern portion (wide width portion P1) having a first width in a direction intersecting with the extending direction of the pattern P for adjustment and a second pattern portion (narrow width portion P2) having a second width narrower than the first width in the direction. Further, the capacitance adjustment can be performed by changing the distance L1 between the adjustment pattern P (first pattern portion) and the driving signal pattern D1 in the width W1 (first width) to the distance L2 between the adjustment pattern P (second pattern portion) and the driving signal pattern D1 in the width W2 (second width) of the width-narrowed portion P2.

The adjustment pattern P can be disposed in either one of the drive signal pattern D1 and the first detection signal pattern S1. Hereinafter, another arrangement example of the adjustment pattern P will be described with reference to fig. 3B, 3C, and 3D. Fig. 3B is an enlarged view of the center portion of fig. 1 for explaining another arrangement example 1 of the adjustment pattern. Fig. 3C is an enlarged view of the center portion of fig. 2 for explaining another arrangement example 2 of the adjustment pattern. Fig. 3D is an enlarged view of the center portion of fig. 1 for explaining another arrangement example 3 of the adjustment pattern.

As shown in fig. 3B, the adjustment pattern P according to the other configuration example 1 expands the width dimension of a part of the drive signal pattern D1 in the adjustment region Q as the adjustment pattern P. Specifically, the width dimension, which is the dimension in the direction (Y-axis direction in the drawing) intersecting the extending direction (X-axis direction in the drawing) of the drive signal pattern D1, is set as the width W1 by the adjustment pattern P. In addition, as described above, the width narrowing portion P2 of the width W2 having a narrower width dimension is formed by removing a portion (the removed portion R shown by the two-dot chain line in the figure) of the second detection signal pattern S2 side of the adjustment pattern P of the width W1 provided in the drive signal pattern D1.

In this way, even in the other arrangement example 1 in which the adjustment pattern P is provided in the drive signal pattern D1, the capacitance adjustment can be performed by changing the distance L1 between the adjustment pattern P (the first pattern portion as the wide portion) and the second detection signal pattern S2 in the width W1 (the first width) to the distance L2 between the adjustment pattern P (the second pattern portion as the narrow portion) and the second detection signal pattern S2 in the width W2 (the second width).

As shown in fig. 3B, the adjustment pattern P can be arranged in the first detection signal pattern S1. The adjustment pattern Pa disposed in the first detection signal pattern S1 can be provided as a projection (indicated by a two-dot chain line in the figure) that enlarges the size of a part of the first detection signal pattern S1 in the width direction in the adjustment region Q.

As shown in fig. 3C, the adjustment pattern P according to another arrangement example 2 can be arranged on the second surface 102 (the other main surface, see fig. 2) of the gyro vibration element 1. Even on the second surface 102 side, as shown in fig. 3C, the adjustment pattern P can be disposed in a region where the first detection signal pattern S1 and the drive signal pattern D1 are aligned or where the second detection signal pattern S2 and the drive signal pattern D1 are aligned, and in this embodiment, in the adjustment region Q where the first detection signal pattern S1, the second detection signal pattern S2, and the drive signal pattern D1 are aligned so that capacitance adjustment can be performed. In this arrangement example 2, the width-directional dimension of a part of the second detection signal pattern S2 is enlarged as the adjustment pattern P in the adjustment region Q.

The adjustment patterns P can be arranged in the same pattern on both sides of the first surface 101 (one main surface, see fig. 1) and the second surface 102 (the other main surface, see fig. 2), for example, in the second detection signal pattern S2 on the first surface 101 side and the second detection signal pattern S2 on the second surface 102 (the other main surface, see fig. 2) side, respectively. In this case, the adjustment region in which the capacitance adjustment can be performed becomes wide, so that the capacitance adjustment amount can be increased.

As shown in fig. 3D, the adjustment pattern P according to another configuration example 3 is configured such that a part of the second detection signal pattern S2 is curved in an arc shape in the adjustment region Q. Such an adjustment pattern P can be adjusted in capacitance by changing the distance between the adjustment pattern P and the drive signal pattern D1 by removing the top portion on the side of the arcuate drive signal pattern D1.

The gyro vibration device 1 is a vibration device having a base 10, first and second detection vibration arms 30, 32 and first to fourth drive vibration arms 40, 42, 44, 46 as vibration parts connected to the base 10, the drive signal electrode 130, the first detection electrode S1a, and the second detection electrode S2a are disposed on the first and second detection vibration arms 30, 32 and the first to fourth drive vibration arms 40, 42, 44, 46, the drive signal wiring 132, the first detection signal wiring S1b, and the second detection signal wiring S2b are disposed on the base 10, and the adjustment pattern P is disposed on the base 10.

The operation of the gyro vibration device 1 will be described.

Fig. 4 and 5 are schematic plan views for explaining the operation of the gyro vibration device. In fig. 4 and 5, illustrations of the base 10, the first and second connecting arms 20 and 22, the first and second detection vibration arms 30 and 32, and the first to fourth driving vibration arms 40, 42, 44, and 46 are omitted for convenience.

As shown in fig. 4, in the gyro vibration element 1, when an electric field is generated between the drive signal electrode and the drive ground electrode in a state where the angular velocity is not applied, the first to fourth drive vibration arms 40, 42, 44, 46 perform bending vibration in the direction indicated by the arrow mark a. At this time, since the first and second driving vibration arms 40 and 42 and the third and fourth driving vibration arms 44 and 46 vibrate in plane symmetry with respect to the YZ plane passing through the center point G (center of gravity G) of the gyro vibration element 1, the base 10, the first and second connecting arms 20 and 22, and the first and second detection vibration arms 30 and 32 hardly vibrate.

When the angular velocity ω about the Z axis is applied to the gyro vibration element 1 in a state where the driving vibration is being performed, vibration as shown in fig. 5 is performed. That is, coriolis force in the arrow B direction acts on the first to fourth driving vibration arms 40, 42, 44, 46 and the first and second connecting arms 20, 22 constituting the driving vibration system, thereby exciting new vibrations. The vibration in the arrow mark B direction is a vibration in the circumferential direction with respect to the center point G. At the same time, the first and second detection vibration arms 30 and 32 excite the detection vibration in the arrow C direction in response to the vibration in the arrow B direction. The deformation of the piezoelectric material due to the vibration is detected by the detection signal electrode and the detection ground electrode formed on the first and second detection vibration arms 30 and 32, and the angular velocity is obtained.

Here, a circuit configuration related to driving and detection of the gyro vibration element 1 will be described.

Fig. 6 is a schematic diagram showing a circuit configuration related to driving and detection of the gyro vibration element. The following description of the circuit configuration is common to the following embodiments.

As shown in fig. 6, the circuit configuration related to driving and detecting the gyro vibration element 1 includes a driving circuit 410 and a detecting circuit 420. The driving circuit 410 and the detecting circuit 420 are assembled in the IC chip 320.

The driving circuit 410 has an I/V conversion circuit (current-voltage conversion circuit) 411, an AC amplification circuit 412, and an amplitude adjustment circuit 413. The driving circuit 410 is a circuit for supplying a driving signal to the driving signal electrode 130 formed in the gyro vibration element 1. The driving circuit 410 is described in detail below.

When the gyro vibration element 1 vibrates, an alternating current based on the piezoelectric effect will be output from the drive signal electrode 130 formed in the gyro vibration element 1 and input into the I/V conversion circuit 411 via the drive signal terminal 134. The I/V conversion circuit 411 converts the input ac current into an ac voltage signal of the same frequency as the vibration frequency of the gyro vibration element 1 and outputs the ac voltage signal.

The AC voltage signal output from the I/V conversion circuit 411 is input into the AC amplification circuit 412. The AC amplifying circuit 412 amplifies and outputs the input AC voltage signal.

The AC voltage signal output from the AC amplifying circuit 412 is input to the amplitude adjusting circuit 413. The amplitude adjustment circuit 413 controls the gain so as to maintain the amplitude of the input ac voltage signal at a fixed value, and outputs the ac voltage signal after the gain control to the drive signal electrode 130 via the drive signal terminal 134 formed in the gyro vibration element 1. The gyro vibration element 1 is vibrated by an ac voltage signal (drive signal) inputted to the drive signal electrode 130.

The detection circuit 420 includes charge amplifier circuits 421 and 422, a differential amplifier circuit 423, an AC amplifier circuit 424, a synchronous detector circuit 425, a smoothing circuit 426, a variable amplifier circuit 427, and a filter circuit 428. The detection circuit 420 is a circuit that differentially amplifies a first detection signal generated in the detection signal electrode 110 (first detection electrode S1 a) formed on the first detection vibrating arm 30 of the gyro vibration element 1 and a second detection signal generated in the detection signal electrode 110 (second detection electrode S2 a) formed on the second detection vibrating arm 32 to generate a differential amplification signal, and detects a predetermined physical quantity (angular velocity) based on the differential amplification signal. The detection circuit 420 will be described in detail below.

The detection signals (alternating currents) detected by the detection signal electrodes 110 (the first detection electrode S1a and the second detection electrode S2 a) formed on the first and second detection vibrating arms 30 and 32 of the gyro vibration element 1 and in opposite phases (opposite phases) are input to the charge amplifier circuits 421 and 422 via the detection signal terminals 114 (in other words, the first and second detection signal patterns S1 and S2).

For example, the first detection signal detected by the detection signal electrode 110 (the first detection electrode S1 a) formed on the first detection vibrating arm 30 is input to the charge amplifier circuit 421, and the second detection signal detected by the detection signal electrode 110 (the second detection electrode S2 a) formed on the second detection vibrating arm 32 is input to the charge amplifier circuit 422. The charge amplifier circuits 421 and 422 convert the input detection signal (ac current) into an ac voltage signal centered on the reference voltage Vref.

The differential amplifier circuit 423 differentially amplifies the output signal of the charge amplifier circuit 421 and the output signal of the charge amplifier circuit 422 to generate a differential amplified signal. The output signal (differential amplification signal) of the differential amplification circuit 423 is further amplified by the AC amplification circuit 424.

The synchronous detection circuit 425 extracts an angular velocity component by synchronously detecting an output signal of the AC amplification circuit 424 with respect to an AC voltage signal output from the AC amplification circuit 412 of the drive circuit 410.

The signal of the angular velocity component extracted by the synchronous detector circuit 425 is smoothed into a dc voltage signal by the smoothing circuit 426, and is input to the variable amplifier circuit 427.

The variable amplification circuit 427 amplifies (or attenuates) the output signal (direct-current voltage signal) of the smoothing circuit 426 at the set amplification factor (or attenuation factor) to change the angular velocity sensitivity. The signal amplified (or attenuated) by the variable amplifying circuit 427 is input to the filter circuit 428.

The filter circuit 428 removes a high-frequency noise component (to be precise, attenuates to a predetermined level or less) from the output signal of the variable amplification circuit 427, and generates a detection signal of polarity and voltage level according to the direction and magnitude of the angular velocity. The detection signal is output from an external output terminal (not shown).

As described above, in the gyro vibration device 1 of the first embodiment, any one of the first detection signal pattern S1 capacitively coupled to the drive signal pattern D1, the second detection signal pattern S2 capacitively coupled to the drive signal pattern D1, and the drive signal pattern D1 (here, the second detection signal pattern S2) includes the adjustment pattern P for adjusting the area of the signal pattern (the second detection signal pattern S2).

Accordingly, since the gyro vibration device 1 includes the adjustment pattern P (corresponding to the adjustment electrode) in the specified one signal pattern (here, the second detection signal pattern S2), it is not necessary to provide the adjustment electrode in a plurality of comb teeth shape according to the number of the detection signal wirings as in the conventional technique (for example, patent document 1).

For example, the gyro vibration device 1 can include the adjustment pattern P in either the first detection signal pattern S1 or the second detection signal pattern S2 (here, the second detection signal pattern S2) by estimating the manufacturing variation in advance and providing a sufficient difference in capacitance (here, C1 < C2) between the first detection signal pattern S1 and the second detection signal pattern S2.

As a result, the gyro vibration device 1 can reduce the imbalance of the unnecessary signal components by reducing the difference (C1-C2) between the electrostatic capacitances of the first detection signal pattern S1 and the second detection signal pattern S2 by the adjustment pattern P for adjusting the area of the signal pattern, thereby improving the detection accuracy of the angular velocity ω and realizing further miniaturization and improvement of productivity.

The gyro vibration device 1 is a vibration device having a base 10, first and second detection vibration arms 30 and 32 as vibration parts connected to the base 10, and first to fourth driving vibration arms 40, 42, 44, and 46, and the adjustment pattern P is disposed on the base 10.

Thus, for example, the gyro vibration element 1 can reduce the influence on the first and second detection vibration arms 30, 32 and the first to fourth driving vibration arms 40, 42, 44, 46 caused by the adjustment of the area of the adjustment pattern P, as compared with the case where the adjustment pattern P is located at the root of the vibration arm.

The adjustment pattern P may be provided in the first detection signal pattern S1 or the driving signal pattern D1 (see fig. 3B) instead of being provided in the second detection signal pattern S2.

The gyro vibration device 1 is stored in a container during actual use. The same applies to each gyro vibration element described below.

Here, the adjustment of the area of the adjustment pattern P will be described in terms of a method for manufacturing the gyro vibration device 1.

The method for manufacturing the gyro vibration device 1 includes a step of reducing the difference between the electrostatic capacitance C1 generated by the capacitive coupling between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 generated by the capacitive coupling between the second detection signal pattern S2 and the drive signal pattern D1 by changing the area of the adjustment pattern P.

Specifically, in the step of changing the area of the adjustment pattern P, the gyro vibration element 1 including the adjustment pattern P (here, the second detection signal pattern S2) and having one electrostatic capacitance (here, C2) larger than the other electrostatic capacitance (here, C1) of the adjustment pattern P (C2 > C1) is first prepared.

Next, as shown in an enlarged view of a main portion of the method for manufacturing the gyro vibration device shown in fig. 7A, the method includes a step of removing at least a part of the adjustment pattern P (the removed portion R, which is a portion surrounded by a two-dot chain line in the drawing) by using energy lines such as an ion beam, a laser beam, and an electron beam, thereby reducing the area of the adjustment pattern P (in other words, separating the interval between the adjustment pattern P and the drive signal pattern D1).

Hereinafter, a method of adjusting the area of the adjustment pattern P will be described in detail with reference to fig. 7B and 7C. Fig. 7B is an enlarged view of a main part of specific example 1 showing a method of adjusting the pattern for adjustment. Fig. 7C is an enlarged view of a main part of specific example 2 showing a method of adjusting the pattern for adjustment. Fig. 7B and 7C illustrate a method of using a laser beam as an energy line.

First, in a state where the angular velocity is not applied to the gyro vibration element 1, the gyro vibration element 1 is driven by the above-described driving circuit 410.

Next, in a state where the gyro vibration element 1 is driven, the output signal of the differential amplifier circuit 423 is measured by a measuring device such as an oscilloscope, and the adjustment pattern P is trimmed by an energy line, for example, a laser beam, so that the output signal becomes small.

In detail, as in specific example 1 shown in fig. 7B, the laser beam is moved from the position LP1 in the direction of arrow mark m in the figure to the position LP2 where a predetermined output signal is formed. By this movement of the laser beam, the removal portion R is formed in which the adjustment pattern P is removed by being irradiated with the laser beam. Thus, the adjustment pattern P is formed with a wide portion P1 (first pattern portion) having a width W1 (first width) which is the original width of the adjustment pattern P, in other words, a width W2 (second pattern portion) having a width W2 (second width) which is narrower as a result of removal of a part of the drive signal wiring 132 (the drive signal pattern D1) side (the part indicated by the two-dot chain line in the figure).

As described above, in specific example 1, the capacitance can be changed by changing the distance L1 between the adjustment pattern P and the drive signal wiring 132 (drive signal pattern D1) in the width W1 to the distance L2 between the adjustment pattern P and the drive signal wiring 132 (drive signal pattern D1) in the width W2 of the width-narrowed portion P2, thereby performing capacitance adjustment.

In addition, in specific example 2 shown in fig. 7C, an example in which movement of the laser beam is repeatedly performed is illustrated. As shown in fig. 7C, first, when the laser beam is moved from the position LP1 in the direction of the arrow mark m in the figure and reaches the position LP2 at the end of the adjustment pattern P, but a predetermined output signal is not formed, the laser beam is moved from the position LP3 in the direction of the arrow mark m in the figure to the position LP4 at which a predetermined output signal is formed as a second column. By such movement of the laser beam from the position LP1 to the position LP4, the removal portion (the removal portion R1 of the first stage and the removal portion R2 of the second stage) is formed in which the adjustment pattern P is removed by being irradiated with the laser beam.

In this way, in specific example 2, the capacitance can be changed by changing the distance L1 between the adjustment pattern P and the drive signal wiring 132 (drive signal pattern D1) in the width W1 to the distance L3 between the adjustment pattern P and the drive signal wiring 132 (drive signal pattern D1) in the width W3 of the width-narrowed portion P2, thereby performing capacitance adjustment.

In addition, in the removal of the adjustment pattern P by the irradiation of the laser beam, the edge portion of the removal portion R is not necessarily a straight line, and may have irregularities or meandering. In addition, the edge portion of the removed portion R may generate a bulge in the thickness direction due to the molten residue of the adjustment pattern P.

In addition, in the trimming, the output signals of the charge amplifier circuit 421 and the charge amplifier circuit 422 may be measured by a measuring device such as an oscilloscope in a state where the gyro vibration element 1 is driven, and the adjustment pattern P may be trimmed by an energy line so that the amplitude of the output signal of the charge amplifier circuit 421 matches the amplitude of the output signal of the charge amplifier circuit 422.

This can reduce the difference between the capacitance C2 and the capacitance C1.

In the step of changing the area of the adjustment pattern P, the gyro vibration element 1 including the adjustment pattern P and having one (for example, the second detection signal pattern S2) of the adjustment patterns P with a capacitance smaller than the capacitance (C2 < C1) of the other is first prepared.

Next, a step of increasing the area of the adjustment pattern P (in other words, narrowing the interval between the adjustment pattern P and the drive signal pattern D1) by at least one of vapor deposition, sputtering, and ion beam may be included.

As described above, in the method of manufacturing the gyro vibration device 1, the area of the adjustment pattern P is changed, so that the difference between the capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 is reduced, whereby imbalance in unwanted signal components can be reduced, and the detection accuracy of the gyro vibration device 1 can be improved.

In the method of manufacturing the gyro vibration device 1, the adjustment pattern P is provided in any one of the first detection signal pattern S1, the second detection signal pattern S2, and the drive signal pattern D1 (here, the second detection signal pattern S2), and therefore, further miniaturization and improvement in productivity of the gyro vibration device 1 can be achieved as compared with the case of being provided in each signal pattern.

In addition, in the method for manufacturing the gyro vibration device 1, since the step of preparing the gyro vibration device 1 including the adjustment pattern P in which the capacitance of one of the two electrostatic capacitances is larger than the capacitance of the other electrostatic capacitance and removing at least a part of the adjustment pattern P by using the energy line to reduce the area of the adjustment pattern P is included, the difference (C1-C2) between the two electrostatic capacitances can be reliably reduced.

Thus, the method for manufacturing the gyro vibration device 1 can reduce imbalance of the unnecessary signal components, thereby improving the detection accuracy of the gyro vibration device 1.

In addition, in the method for manufacturing the gyro vibration device 1, since the step of preparing the gyro vibration device 1 including the adjustment pattern P in which the capacitance of one of the adjustment patterns P is smaller than the capacitance of the other adjustment pattern P and increasing the area of the adjustment pattern P by at least one of vapor deposition and sputtering is included, the difference (C1-C2) between the two capacitances can be reliably reduced.

The gyro vibration device 1 may be configured such that each support portion and each beam are removed and each terminal is disposed on the second surface 102 of the base 10. Thus, the gyro vibration element 1 can be further miniaturized.

Modification example

Next, a modification of the first embodiment will be described.

Fig. 8 is a plan view showing a structure of one principal surface side of the gyro vibration element according to the modification of the first embodiment. The same reference numerals are given to the portions common to the first embodiment, and detailed description thereof will be omitted, focusing on the portions different from the first embodiment.

As shown in fig. 8, the gyro vibration device 2 of the modified example includes the first support portion 60 and the second support portion 62 as fixing portions connected to the base portion 10, and the drive signal wiring 132, the first detection signal wiring S1b, and the second detection signal wiring S2b are disposed on both the base portion 10 and the first support portion 60 and the second support portion 62, and the adjustment pattern P is disposed on the first support portion 60 or the second support portion 62 (here, is disposed on the detection signal terminal 114 of the second support portion 62).

Here, as an example, the manufacturing variation is estimated in advance, and a sufficient difference (C1 < C2) is given to the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1.

Thus, the gyro vibration device 2 can reduce the difference between the capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the above-described method, thereby improving the detection accuracy.

As described above, the gyro vibration device 2 of the modification includes the first support portion 60 and the second support portion 62 connected to the base portion 10, and the adjustment pattern P is disposed on the first support portion 60 or the second support portion 62.

As a result, the gyro vibration device 2 can further reduce the influence on the first and second detection vibration arms 30 and 32 and the first to fourth driving vibration arms 40, 42, 44 and 46 as vibration parts caused by the adjustment of the area of the adjustment pattern P, compared with the case where the adjustment pattern P is arranged on the base 10.

In addition, the gyro vibration device 2 can reduce the size of the base portion 10 as compared with the case where the adjustment pattern P is arranged on the base portion 10.

The adjustment pattern P may be provided on the other main surface (second surface 102) side.

Second embodiment

Next, a physical quantity sensor assembly as an example of the physical quantity detection device will be described.

Fig. 9 is a plan view showing the structure of the physical quantity sensor unit according to the second embodiment. Fig. 10 is a cross-sectional view taken along line E-E of fig. 9. The same reference numerals are given to the portions common to the first embodiment, and detailed description thereof will be omitted, focusing on the portions different from the first embodiment.

As shown in fig. 9 and 10, the physical quantity sensor unit 3 includes a gyro vibration element 1A as a vibration element and an IC chip 320 as an electronic element electrically connected to the gyro vibration element 1A via a relay substrate 310. In addition, hatching is marked in top view of gyro vibration device 1A for easy understanding.

The physical quantity sensor unit 3 is disposed so as to span the driving signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2, the gyro vibration device 1A, and the relay substrate 310.

In the physical quantity sensor unit 3, the adjustment pattern P is disposed on the relay substrate 310.

In detail, in the physical quantity sensor unit 3, for example, the gyro vibration element 1A having the structure in which the adjustment pattern P is removed from the gyro vibration element 1 described above is mounted on the substantially rectangular flat plate-shaped relay board 310, and each terminal (not shown) of the gyro vibration element 1A is electrically and mechanically connected to the relay terminals 311A to 311f of the relay board 310 through the joining member 312 such as a metal bump.

The relay substrate 310 includes a substrate main body 313 made of a resin such as polyimide and a wiring pattern 314 made of a metal foil such as copper laminated on the gyro vibration element 1A side of the substrate main body 313.

The portions of the wiring pattern 314 facing the terminals of the gyro vibration element 1A are the relay terminals 311A to 311f, and the portions of the wiring pattern 314 facing the connection pads 321 provided at the substantially central portion of the IC chip 320 are the connection terminals 315a, 315b, 315d, 315e. The substrate main body 313 at the connection terminals 315a, 315b, 315d, 315e is provided with through holes.

The relay terminal 311a is connected to the connection terminal 315a, the relay terminal 311b is connected to the connection terminal 315b, the relay terminal 311d is connected to the connection terminal 315d, and the relay terminal 311e is connected to the connection terminal 315e.

The relay substrate 310 is mounted on the passivation film 323 of the IC chip 320, and the connection terminals 315a, 315b, 315d, 315e are electrically connected to the connection pads 321 of the IC chip 320 via the bonding members 322 such as metal bumps.

Thereby, the gyro vibration element 1A and the IC chip 320 are electrically connected.

The connection pad 321 of the IC chip 320 is connected to the driving circuit 410 and the detection circuit 420, the wiring pattern 314 connecting the relay terminal 311a and the connection terminal 315a of the relay substrate 310 becomes the driving signal pattern D1, the wiring pattern 314 connecting the relay terminal 311D and the connection terminal 315D becomes the first detection signal pattern S1, and the wiring pattern 314 connecting the relay terminal 311e and the connection terminal 315e becomes the second detection signal pattern S2.

The first detection signal pattern S1 is wound clockwise along the outer periphery of the relay substrate 310 and reaches the vicinity of the relay terminal 311 a. Then, the tip end portion of the first detection signal pattern S1 reaching the vicinity of the relay terminal 311a becomes the adjustment pattern P.

The physical quantity sensor unit 3 estimates manufacturing variations in advance, and gives a sufficient difference (C1 > C2) between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1.

As a result, the physical quantity sensor unit 3 can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy.

As described above, the physical quantity sensor unit 3 of the second embodiment includes the gyro vibration element 1A and the IC chip 320 electrically connected to the gyro vibration element 1A via the relay substrate 310, and the adjustment pattern P is disposed on the relay substrate 310, so that both can be miniaturized as compared with the case where the adjustment pattern P is disposed on the gyro vibration element 1A or the IC chip 320.

In addition, the physical quantity sensor unit 3 improves the degree of freedom in designing the gyro vibration device 1A.

The adjustment pattern P may be provided in the second detection signal pattern S2 or the driving signal pattern D1 instead of being provided in the first detection signal pattern S1.

Third embodiment

Next, an H-shaped gyro vibration element as an example of the physical quantity detection device will be described.

Fig. 11 is a plan view showing a structure of the gyro vibration device according to the third embodiment on one principal surface side. Fig. 12 is a plan view showing a structure of the gyro vibration element seen from one principal surface side to the other principal surface side.

The basic configuration of the present embodiment is the same as that of the first embodiment, and therefore, the description will be mainly made.

As shown in fig. 11 and 12, the H-shaped gyro vibration device 5 includes: a base 510; first and second detection vibrating arms 530, 532 and first and second driving vibrating arms 540, 542 as vibrating portions connected to the base 510; a fixing portion 560 connected to the base portion 510.

The gyro vibration element 5 has a first surface 501 (one main surface) and a second surface 502 (the other main surface) facing in opposite directions to each other, and a side surface 503 connecting the first surface 501 and the second surface 502. The first surface 501 and the second surface 502 are surfaces parallel to the XY plane, and the second surface 502 is a surface facing the inner bottom surface of the container (not shown) in which the storage is performed.

The side surface 503 is a surface orthogonal to the first surface 501 and the second surface 502 and parallel to the Z axis.

The first and second detection vibration arms 530, 532 extend in the Y-axis positive direction from the substantially rectangular base 510.

The first and second driving vibration arms 540, 542 extend in the Y-axis negative direction from the base 510.

The first and second detection vibration arms 530 and 532 and the first and second drive vibration arms 540 and 542 have groove portions, but the drawings are complicated and omitted.

The fixing portion 560 extends from the base portion 510 in the positive and negative directions along the X-axis, is bent, and is provided so as to surround the first and second driving vibration arms 540 and 542. Beams 570 and 572 connecting the base 510 and the fixing portion 560 extend along the Y axis on both sides of the first and second driving vibration arms 540 and 542.

The gyro vibration element 5 includes drive signal patterns D1 and D2 and a first detection signal pattern S1, the drive signal patterns D1 and D2 include drive electrodes D1a and D2a to which a drive signal is applied and drive signal wirings D1b and D2b connected to the drive electrodes D1a and D2a, and the first detection signal pattern S1 includes a first detection electrode S1a outputting a first detection signal and a first detection signal wiring S1b connected to the first detection electrode S1a, and is capacitively coupled to the drive signal pattern D1 by a capacitance C1. The driving electrode D2a also performs the same function as the driving ground electrode (140) in the first embodiment.

The gyro vibration device 5 further includes a second detection signal pattern S2, and the second detection signal pattern S2 includes a second detection electrode S2a outputting a second detection signal inverted from the first detection signal and a second detection signal wiring S2b connected to the second detection electrode S2a, and is capacitively coupled to the drive signal pattern D1 by a capacitance C2.

In addition, in the gyro vibration device 5, any one of the first detection signal pattern S1, the second detection signal pattern S2, and the drive signal pattern D1 (here, the first detection signal pattern S1) includes an adjustment pattern P for adjusting the area of the signal pattern (here, the first detection signal pattern S1).

Specifically, the driving electrodes D1a and D2a are disposed on the first and second driving vibration arms 540 and 542, and the first detection electrode S1a and the second detection electrode S2a are disposed on the first and second detection vibration arms 530 and 532.

The drive signal wirings D1b and D2b, the first detection signal wiring S1b, and the second detection signal wiring S2b are disposed on the base 510, and the adjustment pattern P is disposed on the first detection signal wiring S1b of the first surface 501 of the base 510. The adjustment pattern P is arranged so as to protrude in a substantially rectangular shape along the Y-axis negative direction.

The drive signal terminals D1c and D2c are disposed on the second surface 502 at positions opposed to the first and second drive vibration arms 540 and 542 of the portion of the fixing portion 560 extending along the X axis, and the first detection signal terminal S1c and the second detection signal terminal S2c are disposed on the second surface 502 at the substantially center of the portion of the fixing portion 560 extending along the Y axis, respectively.

The drive signal terminals D1c, D2c, the first detection signal terminal S1c, and the second detection signal terminal S2c are connected to the electrodes (D1 a, etc.) via the respective wirings (D1 b, etc.).

The electrodes and the wirings are also disposed on the side surface 503, and extend to the first surface 501 and the second surface 502 through the side surface 503.

In the gyro vibration device 5, the adjustment pattern P and the signal pattern (here, the drive signal pattern D1) to be capacitively coupled among the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2 are disposed so as to face each other, and the constant potential pattern F is disposed between the adjustment pattern P and the drive signal pattern D1 (D1 b).

The constant potential pattern F is set to the ground potential (GND potential) and is disposed in almost all portions of the space other than the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2, thereby realizing a function of reducing intrusion of noise or the like.

Here, an outline of the operation of the gyro vibration device 5 will be described.

Fig. 13 is a schematic perspective view showing a driving vibration state of the gyro vibration element, and fig. 14 is a schematic perspective view showing a detection vibration state of the gyro vibration element. In fig. 13 and 14, the shape of the gyro vibration device is simplified for convenience of explanation, and the fixing portion is omitted.

As shown in fig. 13, the gyro vibration element 5 performs driving vibration in which driving signals are applied to driving electrodes (D1 a, D2a, not shown) provided to the first and second driving vibration arms 540, 542, so that the first and second driving vibration arms 540, 542 alternately perform bending vibration in a direction (white arrow mark) approaching each other and in a direction (black arrow mark) separating from each other along the X-axis.

In this driving vibration state, as shown in fig. 14, when an angular velocity is applied around the Y axis (in other words, when the gyro vibration element 5 rotates around the Y axis), the gyro vibration element 5 performs detection vibrations in which the first and second driving vibration arms 540 and 542 and the first and second detection vibration arms 530 and 532 alternately bend and vibrate in the positive and negative directions along the Z axis due to the coriolis force.

In the detailed description, when the first driving vibration arm 540 and the second detection vibration arm 532 are bent in the positive direction, the second driving vibration arm 542 and the first detection vibration arm 530 are bent in the negative direction (black arrow mark), and when the first driving vibration arm 540 and the second detection vibration arm 532 are bent in the negative direction, the second driving vibration arm 542 and the first detection vibration arm 530 are bent in the positive direction (white arrow mark).

The gyro vibration device 5 can derive the angular velocity ω1 by extracting, as a first detection signal and a second detection signal, electric charges generated in the first and second detection electrodes (S1 a, S2a, not shown) provided to the first and second detection vibration arms 530, 532 in response to the detection vibrations.

Returning to fig. 11 and 12, the gyro vibration device 5 sets the adjustment pattern P in the first detection signal pattern S1, estimates the manufacturing variation in advance, and gives a sufficient difference (C1 > C2) in electrostatic capacitance between the first detection signal pattern S1 and the second detection signal pattern S2.

Thus, the gyro vibration device 5 can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy of the angular velocity ω1.

As described above, since the gyro vibration device 5 of the third embodiment includes the adjustment pattern P in one signal pattern (here, the first detection signal pattern S1) as determined in the first embodiment, it is not necessary to provide the adjustment electrode in a plurality of comb teeth shape according to the number of detection signal wires as in the related art (for example, patent document 1).

As a result, the gyro vibration device 5 can reduce the difference (C1-C2) between the electrostatic capacitances of the first detection signal pattern S1 and the second detection signal pattern S2 by adjusting the pattern P, thereby improving the detection accuracy of the angular velocity ω1 and realizing further miniaturization and improvement of productivity.

In addition, since the gyro vibration device 5 is a vibration device having the base 510, the first and second detection vibration arms 530 and 532 connected to the base 510, and the first and second driving vibration arms 540 and 542, and the adjustment pattern P is disposed on the base 510, the influence on the first and second detection vibration arms 530 and 532 and the first and second driving vibration arms 540 and 542 due to the adjustment of the area of the adjustment pattern P can be reduced as compared with, for example, the case where the adjustment pattern P is located at the root of the vibration arm, as in the first embodiment.

In addition, in the gyro vibration element 5, since the constant potential pattern F is arranged between the adjustment pattern P and the signal pattern (here, the drive signal pattern D1) to be capacitively coupled, the electrostatic capacitance C1 between the adjustment pattern P and the drive signal pattern D1 due to capacitive coupling can be reduced as compared with the case where the constant potential pattern F is not arranged.

The gyro vibration device 5 may include the adjustment pattern P in the second detection signal pattern S2 or the drive signal pattern D1 instead of the first detection signal pattern S1. Even in this case, the gyro vibration element 5 can obtain the same effects as described above. This structure can be applied to the following modifications.

The gyro vibration device 5 may have a structure in which the fixing portion 560 is removed and the terminals are provided on the second surface 502 of the base 510. Thereby, the gyro vibration element 5 can be further miniaturized. This structure can be applied to the following modification examples 1 to 3.

Next, a modification of the third embodiment will be described.

Modification 1

Fig. 15 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 1 of the third embodiment. The same reference numerals are given to the portions common to the third embodiment, and detailed description thereof will be omitted, focusing on the portions different from the third embodiment.

As shown in fig. 15, in the gyro vibration device 6 of modification 1, the adjustment pattern P and the signal pattern (here, the drive signal pattern D1) to be capacitively coupled out of the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2 are disposed so as to face each other, and there is a region (in other words, a region where the constant potential pattern F is not disposed) that is not electrostatically shielded between the adjustment pattern P and the drive signal pattern D1.

As a result, in the gyro vibration element 6, since there is a region (region where the constant potential pattern F is not arranged) which is not electrostatically shielded between the adjustment pattern P and the signal pattern (here, the driving signal pattern D1) which is the object of capacitive coupling, the electrostatic capacitance C1 between the adjustment pattern P (the first detection signal pattern S1) and the driving signal pattern D1 becomes larger than in the case where the constant potential pattern F is arranged.

Thus, by adjusting the area of the adjustment pattern P, the gyro vibration element 6 can increase the change in the capacitance C1 as compared with the case where the constant potential pattern F is arranged, even with the same adjustment amount.

As a result, the gyro vibration device 6 removes a portion (a portion indicated by a two-dot chain line in the figure) of the driving signal wiring D1b side of the adjustment pattern P having the width W1, for example, by the method described in the first embodiment, thereby forming a width narrowed portion of the width W2 having a narrower width dimension. In this way, by changing the distance between the adjustment pattern P and the drive signal wiring D1b in the width W1 to the distance between the adjustment pattern P and the drive signal wiring D1b in the width W2 of the narrow portion, the capacitance adjustment can be performed. Specifically, the capacitance C1 between the adjustment pattern P and the drive signal wiring D1b changes to the capacitance C1a. In this way, by adjusting the area of the adjustment pattern P, that is, by changing the distance between the adjustment pattern P and the drive signal wiring D1b, the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 (see fig. 12) between the second detection signal pattern S2 and the drive signal pattern D1 is reduced, thereby improving the detection accuracy of the angular velocity ω1.

Modification 2

Fig. 16 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 2 of the third embodiment. The same reference numerals are given to the portions common to the third embodiment, and detailed description thereof will be omitted, focusing on the portions different from the third embodiment.

As shown in fig. 16, in the gyro vibration device 7 according to modification 2, the adjustment pattern P and the signal pattern (here, the drive signal pattern D1) to be capacitively coupled among the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2 are disposed so as to face each other, and there are a region where the constant potential pattern F is disposed and a region where the constant potential pattern F is not electrostatically shielded (a region where the constant potential pattern F is not disposed) between the adjustment pattern P and the drive signal pattern D1.

As a result, in the gyro vibration element 7, there is a region where the constant potential pattern F is arranged and a region where the constant potential pattern F is not electrostatically shielded (region where the constant potential pattern F is not arranged) between the adjustment pattern P and the signal pattern (here, the driving signal pattern D1) to be capacitively coupled, and therefore, the change in the electrostatic capacitance C1 can be increased or decreased depending on the position where the area of the adjustment pattern P is adjusted.

Specifically, in the gyro vibration device 7, coarse adjustment of the capacitance C1 can be performed by adjusting the area of the portion corresponding to the region (capacitance C1: large) where the constant potential pattern F is not arranged, and fine adjustment of the capacitance C1 can be performed by adjusting the area of the portion corresponding to the region (capacitance C1: small) where the constant potential pattern F is arranged.

As a result, the gyro vibration device 7 can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 (see fig. 12) between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy of the angular velocity ω1.

Modification 3

Fig. 17 is an enlarged plan view of a main part of a structure of a gyro vibration element according to modification 3 of the third embodiment. The same reference numerals are given to the portions common to the third embodiment, and detailed description thereof will be omitted, focusing on the portions different from the third embodiment.

As shown in fig. 17, in the gyro vibration device 8 of modification 3, the adjustment pattern P and the signal pattern (here, the drive signal pattern D1) to be capacitively coupled out of the drive signal pattern D1, the first detection signal pattern S1, and the second detection signal pattern S2 are arranged so as to oppose each other, and the end portion of the adjustment pattern P on the drive signal pattern D1 side is formed in a stepped shape.

Thus, in the gyro vibration device 8, since the end portion of the adjustment pattern P on the drive signal pattern D1 side is formed in a stepped shape, the change in the electrostatic capacitance C1 can be increased or decreased depending on the position (the distance from the adjustment stepped portion to the drive signal pattern D1) at which the area of the adjustment pattern P is adjusted.

As a result, the gyro vibration device 8 can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 (see fig. 12) between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy of the angular velocity ω1.

Modification 4

Fig. 18 is a plan view showing a structure of a gyro vibration device according to modification 4 of the third embodiment, seen from one principal surface side of the gyro vibration device. The same reference numerals are given to the portions common to the third embodiment, and detailed description thereof will be omitted, focusing on the portions different from the third embodiment.

As shown in fig. 18, the gyro vibration device 9A of modification 4 includes a fixing portion 560 connected to the base portion 510, the driving signal wires D1b and D2b, the first detection signal wire S1b, and the second detection signal wire S2b are disposed on both the base portion 510 and the fixing portion 560, and the adjustment pattern P is disposed on the fixing portion 560.

Specifically, the adjustment pattern P is included in the first detection signal wiring S1b in a portion extending from the first detection signal terminal S1c in the negative Y-axis direction along the shape of the fixing portion 560 and disposed in the vicinity of the drive signal terminal D1 c.

Further, from the second detection signal terminal S2c, the second detection signal wiring S2b (second detection signal pattern S2) extends along the shape of the fixing portion 560 in the negative Y-axis direction and is disposed in the vicinity of the drive signal terminal D2 c.

The gyro vibration device 9A sets the adjustment pattern P in the first detection signal wiring S1b (first detection signal pattern S1) of the fixing portion 560, estimates the manufacturing variation in advance, and gives a sufficient difference (c1 > C2) in electrostatic capacitance between the first detection signal pattern S1 and the second detection signal pattern S2.

Thus, the gyro vibration device 9A can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy of the angular velocity ω1.

As described above, the gyro vibration device 9A of modification 4 includes the fixing portion 560 connected to the base portion 510, and the adjustment pattern P is disposed on the fixing portion 560, so that the influence on the first and second detection vibration arms 530, 532 and the first and second driving vibration arms 540, 542 due to the adjustment of the area of the adjustment pattern P can be further reduced as compared with the case where the adjustment pattern P is disposed on the base portion 510.

In addition, the gyro vibration device 9A can reduce the size of the base portion 510 as compared with the case where the adjustment pattern P is disposed on the base portion 510.

In the gyro vibration device 9A, the first detection signal wiring S1b extending from the first detection signal terminal S1c and including the adjustment pattern P, and the second detection signal wiring S2b extending from the second detection signal terminal S2c and extending parallel to the first detection signal wiring S1b may also serve as both the inspection and adjustment wiring in the wafer state before singulation, as indicated by the two-dot chain line.

Thus, the gyro vibration device 9A does not need to prepare the adjustment pattern P exclusively, and thus can be miniaturized.

Fourth embodiment

Next, a physical quantity sensor as an example of the physical quantity detecting device will be described.

Fig. 19 is a plan view showing the structure of a physical quantity sensor according to the fourth embodiment, and fig. 20 is a cross-sectional view taken along line H-H in fig. 19. In the fourth embodiment, since the H-type gyro vibration element is used, the same reference numerals are given to the portions common to the third embodiment, and a detailed description thereof will be omitted, centering on the portions different from the third embodiment.

As shown in fig. 19 and 20, the physical quantity sensor 9B includes: a gyro vibration element 5A as a vibration element; an IC chip 320 incorporating a drive circuit 410 for driving the gyro vibration device 5A, a detection circuit 420 for detecting a physical quantity (angular velocity) detection operation of the gyro vibration device 5A, and the like; package 900 serving as a container for accommodating gyro vibration element 5A and IC chip 320.

The gyro vibration device 5A is a device in which the adjustment pattern P is removed from the gyro vibration device 5 of the third embodiment. In fig. 19, gyro vibration element 5A has a structure on the side of second surface 502 seen from first surface 501.

The package 900 has a package base 901 having a substantially rectangular shape in plan view and having a concave portion 902, and a cover (lid) 903 having a substantially rectangular shape in plan view and a flat plate shape covering the concave portion 902 of the package base 901, and the package 900 is formed in a substantially rectangular parallelepiped shape.

For the package base 901, for example, an alumina sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, or other ceramic insulating materials obtained by molding and laminating ceramic green sheets and firing the ceramic green sheets are used.

The cover 903 covering the recess 902 of the package base 901 is made of the same material as the package base 901, or a metal such as kovar or 42.

In the step portion 904 provided along the inner wall of the recess 902 of the package base 901, connection terminals are provided at positions opposed to the signal terminals of the gyro vibration element 5A, and the signal terminals and the connection terminals are electrically connected to each other by a joint member 905 as a connection portion.

In detail, the connection terminal D1D is provided at a position facing the drive signal terminal D1c, the connection terminal D2D is provided at a position facing the drive signal terminal D2c, the connection terminal S1D is provided at a position facing the first detection signal terminal S1c, and the connection terminal S2D is provided at a position facing the second detection signal terminal S2c, and the connection terminals are electrically and mechanically connected to each other by the joint member 905.

The connection terminal D1D is included in the driving signal pattern D1, and the connection terminal D2D is included in the driving signal pattern D2.

From the connection terminal S1D included in the first detection signal pattern S1, the first detection signal wiring S1b extends along the inner periphery of the concave portion 902 to the vicinity of the connection terminal D1D, and includes an adjustment pattern P at the tip end portion.

From the connection terminal S2D included in the second detection signal pattern S2, the second detection signal wiring S2b extends along the inner periphery of the concave portion 902 to the vicinity of the connection terminal D1D.

Thus, the driving signal patterns D1 and D2, the first detection signal pattern S1, and the second detection signal pattern S2 are arranged so as to span the gyro vibration element 5A and the package 900 via the joint member 905, and the adjustment pattern P is arranged on the package 900.

A receiving recess 907 for receiving the IC chip 320 is provided in the bottom surface 906 of the recess 902 of the package base 901. The IC chip 320 is fixed to the bottom surface of the storage recess 907 by an adhesive (not shown) or the like, and a connection pad (not shown) is connected to an internal terminal 908 provided around the storage recess 907 by a bonding wire 909 or the like.

The internal terminals 908 are connected to respective connection terminals, external terminals 911 provided on an outer bottom surface 910 of the package base 901, and the like via internal wiring (not shown).

The signal patterns, the internal terminals 908, the external terminals 911, the internal wirings, and the like of the package base 901 are formed of, for example, metal films obtained by laminating films of nickel, gold, and the like by plating or the like on a metallization layer formed by adding a metal paste obtained by mixing an organic binder and a solvent to a metal powder of tungsten, molybdenum, and the like, and then performing a heat treatment by printing (coating) by, for example, a screen printing method.

The bonding member 905 includes an epoxy-based conductive adhesive, a silicone-based conductive adhesive, a polyimide-based conductive adhesive, a metal bump, or the like mixed with a conductive material such as metal particles.

In the physical quantity sensor 9B, in a state where the gyro vibration element 5A is connected to each connection terminal of the package base 901, the concave portion 902 of the package base 901 is covered with the lid 903, and the package base 901 and the lid 903 are hermetically joined by a joining member 912 such as a seal ring, low-melting glass, or an adhesive.

The inside of the hermetically bonded package 900 is in a reduced pressure state (a state in which the vacuum degree is high).

The physical quantity sensor 9B detects the angular velocity by the operation of the gyro vibration device 5A similar to the third embodiment, and the detection signal is output from the external terminal 911 via the IC chip 320.

The physical quantity sensor 9B sets the adjustment pattern P in the first detection signal pattern S1 (S1B) of the package 900, estimates the manufacturing variation in advance, and gives a sufficient difference (c1 > C2) between the electrostatic capacitances to the first detection signal pattern S1 and the second detection signal pattern S2 (S2B).

Specifically, the adjustment pattern P is brought close to the drive signal pattern D1 (the connection terminal D1D), and the adjustment pattern P is made thicker than the second detection signal pattern S2.

Thus, the physical quantity sensor 9B can reduce the difference between the electrostatic capacitance C1 between the first detection signal pattern S1 and the drive signal pattern D1 and the electrostatic capacitance C2 between the second detection signal pattern S2 and the drive signal pattern D1 by adjusting the area of the adjustment pattern P by the method described in the first embodiment, thereby improving the detection accuracy of the angular velocity.

As described above, the physical quantity sensor 9B according to the fourth embodiment includes the gyro vibration element 5A and the package 900, and the gyro vibration element 5A and the package 900 are electrically connected to each other by the joint member 905, and the adjustment pattern P is disposed on the package 900, so that the gyro vibration element 5A can be miniaturized as compared with the case where the adjustment pattern P is disposed on the gyro vibration element 5A.

The physical quantity sensor 9B may be provided with a double-T-shaped vibrating element instead of the gyro vibrating element 5A. Even in this case, the same effect can be achieved.

In the above embodiment and modification, the material (base material) of the gyro vibration element is a piezoelectric material such as crystal, but it may not be a semiconductor such as silicon.

In addition, the gyro vibration element may be of various types, such as a two-pin tuning fork, a three-pin tuning fork, a comb-tooth type, an orthogonal type, and a prism type, other than the double-T type or the H type. In addition, the physical quantity sensor may be provided with a plurality of gyro vibration elements. Thus, the physical quantity sensor can detect angular velocities about three axes, for example, an X axis, a Y axis, and a Z axis. In this case, the adjustment pattern may be provided on only one gyro vibration element.

Electronic equipment

Next, an electronic device including the physical quantity detection device will be described.

As shown in fig. 21, the personal computer 1100 includes a main body 1104 including a keyboard 1102 and a display unit 1106 including a display 1101, and the display unit 1106 is rotatably supported with respect to the main body 1104 by a hinge structure.

Any one of the physical quantity detection devices described above (here, the gyro vibration device 1 is an example) is incorporated in the personal computer 1100.

Fig. 22 is a schematic perspective view showing a structure of a mobile phone (including PHS) as an electronic device provided with a physical quantity detecting device.

As shown in fig. 22, the mobile phone 1200 includes a plurality of operation buttons 1202, a handset 1204, and a microphone 1206, and a display unit 1201 is arranged between the operation buttons 1202 and the handset 1204.

In this type of mobile phone 1200, any one of the above-described physical quantity detection devices (here, the gyro vibration device 1 is an example) is incorporated.

Fig. 23 is a schematic perspective view showing a configuration of a digital camera as an electronic device provided with a physical quantity detecting device. Fig. 23 also schematically illustrates the connection with an external device.

Here, in contrast to a typical camera in which a silver salt photographic film is sensitized with an optical image of a subject, the digital camera 1300 generates an imaging signal (image signal) by photoelectrically converting the optical image of the subject with an imaging element such as a CCD (Charge Coupled Device: charge coupled device).

A display portion 1310 is provided on the back surface (near front side in the drawing) of a case (main body) 1302 in the digital camera 1300, and the display portion 1310 functions as a viewfinder for displaying an object as an electronic image in accordance with an image pickup signal generated by a CCD.

A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the deep side in the drawing) of the housing 1302.

When the photographer confirms the subject image displayed on the display section 1310 and presses the shutter button 1306, the image pickup signal of the CCD at this point of time is transferred and stored in the memory 1308.

In the digital camera 1300, a video signal output terminal 1312 and an input/output terminal 1314 for data communication are provided on the side surface of the case 1302. The video monitor 1430 is connected to the video signal output terminal 1312, and the personal computer 1440 is connected to the data communication input/output terminal 1314, as necessary. Further, the imaging signal stored in the memory 1308 is outputted to the video monitor 1430 or the personal computer 1440 by a predetermined operation.

In this type of digital camera 1300, any one of the above-described physical quantity detection devices (here, the gyro vibration device 1 is an example) is incorporated.

Since such an electronic device includes the physical quantity detection device, the effects described in the above embodiments and modified examples can be achieved, and excellent performance can be exhibited.

Examples of the electronic device including the physical quantity detecting device include an inkjet type ejection device (e.g., an inkjet printer), a laptop personal computer, a television, a video camera, a video recorder, various navigation devices, a pager, an electronic organizer (including a product with a communication function), an electronic dictionary, a desk type electronic calculator, an electronic game device, a word processor, a workstation, a video phone, a security video monitor, an electronic binoculars, a POS (point of sale) terminal, a medical device (e.g., an electronic thermometer, a blood pressure meter, a blood glucose meter, an electrocardiograph measuring device, an ultrasonic diagnostic device, an electronic endoscope), a fish group detector, various measuring devices, a measuring device, a flight simulator, a GPS module, a network device, a broadcasting device, and the like.

In any case, since these electronic devices are provided with the physical quantity detection device described above, the effects described in the above embodiments and modified examples can be achieved, and excellent performance can be exhibited.

Moving body

Next, a moving body provided with the physical quantity detecting device will be described.

The automobile 1500 shown in fig. 24 uses any one of the physical quantity detection devices (here, the gyro vibration device 1 is an example) as a constituent element of an attitude detection sensor of a mounted automobile navigation device, an attitude control device, or the like.

Thus, since the automobile 1500 includes the physical quantity detection device, the effects described in the above embodiments and modified examples can be achieved, and excellent performance can be exhibited.

The physical quantity detection device described above is not limited to the application to the automobile 1500, and can be preferably applied to a posture detection sensor or the like of a moving body including a self-propelled robot, a self-propelled conveyor, a train, a ship, an airplane, a satellite, or the like, and in any case, the effects described in the above embodiments and modified examples can be achieved, and thus an excellent moving body can be provided.

Symbol description

1. 2 … a gyro vibration element as a physical quantity detecting means; 3 … as a physical quantity sensor unit of the physical quantity detecting device; 5. 6, 7, 8, 9a … as gyro vibration elements of the physical quantity detecting apparatus; 1A, 5A … gyro vibration elements; 9B … as a physical quantity sensor of the physical quantity detecting device; 10 … base; 20 … first connecting arm; 22 … second link arms; 30 … first detecting vibrating arm; 32 … second detecting vibrating arms; 40 … first drive vibrating arms; 42 … second drive vibrating arms; 50 … first beam; 52 … second beam; 54 … third beam; 56 … fourth beam; 60 … as a first support portion of the fixing portion; 62 … as a second support portion of the fixing portion; 101 … first surface; 102 … second surface; 103 … side; 110 … detection signal electrode; 112 … detection signal wiring; 114 … detect signal terminal; 120 … detect ground electrode; 122 … to detect a ground wire; 124 … detect a ground terminal; 130 … drive signal electrodes; 132 … drive signal wiring; 134 … drive signal terminals; 140 … drive ground electrode; 142 … drive ground wiring; 144 … drive ground terminals; 410 … drive circuit; 411 … I/V conversion circuits; 412 … AC amplifying circuit; 413 … amplitude modulation circuits; 420 … detection circuit; 421. 422 … charge amplifier circuit; 423 and … differential amplifying circuits; 424 … AC amplifying circuit; 425 … synchronous detection circuit; 426 … smoothing circuit; 427 … variable amplifying circuit; 428 … filter circuit; 310 … relay substrate; 311a, 311b, 311c, 311d, 311e, 311f … relay terminals; 312 … engagement members; 313 … substrate body; 314 … wiring patterns; 315a, 315b, 315d, 315e … connection terminals; 320 … IC chip; 321 … connection pad; 322 … engagement members; 323 … passivation film; 501 … first surface; 502 … second surface; 503 … side; 510 … base; 530 … first detection vibrating arm; 532 … second detection vibrating arms; 540 … first drive vibrating arms; 542 … second drive vibrating arms; 560 … fixing portions; 570. 572 … beams; 900 … as a package for a container; 901 … package base; 902 … recess; 903 … cover (lid); 904, … height difference portion; 905 … engagement members; 906 … bottom surface of the recess; 907, …, receiving recesses; 908 … internal terminals; 909 … bond wires; 910 … outer bottom surface; 911 … external terminals; 1100 … a personal computer as an electronic device; 1101 … display section; 1102 … keyboard; 1104 … main body; 1106 … display unit; 1200 … as a mobile phone for an electronic device; 1201 … display section; 1202 … operating buttons; 1204 … earpiece; 1206 … microphone; 1300 … as a digital camera of an electronic device; 1302 … casing; 1304 … light receiving unit; 1306 … shutter button; 1308 … memory; 1310 … display portion; 1312 and … video signal output terminals; 1314 … input-output terminals; 1430 … video monitor; 1440, … personal computer; 1500 … an automobile as a moving body; d1, D2 … drive signal patterns; d1a, D2a … drive electrodes; d1b, D2b … drive signal wiring; d1c, D2c … drive signal terminals; D1D, D2D … connection terminals; s1 … first detection signal pattern; s1a … first detection electrode; s1b … first detection signal wiring; s1c … first detection signal terminals; s1d … connection terminals; s2 … a second detection signal pattern; s2a … second detection electrode; s2b … second detection signal wiring; s2c … second detection signal terminals; s2d … connection terminals; g … center point.

Claims

1. A method for manufacturing a physical quantity detecting device, characterized in that,

the physical quantity detection device is provided with:

a drive signal pattern including a drive electrode to which a drive signal is applied and a drive signal wiring connected to the drive electrode;

a first detection signal pattern including a first detection electrode outputting a first detection signal and a first detection signal wiring connected to the first detection electrode, and capacitively coupled to the driving signal pattern;

a second detection signal pattern including a second detection electrode outputting a second detection signal inverted from the first detection signal and a second detection signal wiring connected to the second detection electrode and capacitively coupled to the driving signal pattern,

any one of the first detection signal pattern, the second detection signal pattern, and the driving signal pattern is provided with an adjustment pattern,

the method for manufacturing the physical quantity detection device comprises the following steps:

a step of reducing a difference between a capacitance generated by the capacitive coupling between the first detection signal pattern and the drive signal pattern and a capacitance generated by the capacitive coupling between the second detection signal pattern and the drive signal pattern by changing an area of the adjustment pattern,

The step of reducing the difference by changing the area of the adjustment pattern includes:

a step of removing at least a part of the adjustment pattern by using an energy line, thereby reducing the area of the adjustment pattern,

the pattern for adjustment includes:

a first pattern portion having a first width along a crossing direction crossing the extending direction of the pattern for adjustment;

a second pattern portion having a second width along the crossing direction smaller than the first width,

the first pattern portion and the second pattern portion are contiguous in the extending direction,

when a distance between any one of the first detection signal pattern and the second detection signal pattern and the driving signal pattern is set to L1 in the first pattern portion, and a distance between any one of the first detection signal pattern and the second detection signal pattern and the driving signal pattern is set to L2 in the second pattern portion, L1 < L2.

2. A method for manufacturing a physical quantity detecting device, characterized in that,

the physical quantity detection device is provided with:

a step of increasing the area of the adjustment pattern by at least one of vapor deposition and sputtering,

The pattern for adjustment includes: