CN113045920A - Anti-oxidation bonding copper wire and preparation method thereof - Google Patents
Anti-oxidation bonding copper wire and preparation method thereof Download PDFInfo
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- CN113045920A CN113045920A CN202110522040.2A CN202110522040A CN113045920A CN 113045920 A CN113045920 A CN 113045920A CN 202110522040 A CN202110522040 A CN 202110522040A CN 113045920 A CN113045920 A CN 113045920A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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Abstract
The invention discloses an antioxidant bonding copper wire, which comprises a bonding copper wire and an antioxidant coating coated on the outer wall of the bonding copper wire, wherein the antioxidant coating comprises the following components in parts by mass: 21-33 parts of hydroxyethyl cellulose, 18-23 parts of tin octoate, 19-29 parts of methyl silane, 30-41 parts of trichloro insecticidal ester, 15-35 parts of fumaric diester, 18-33 parts of cerium oxide, 14-29 parts of dimethylaminopropylamine, 25-38 parts of sodium oleate, 17-31 parts of trimethylolpropane trimethacrylate, 15-35 parts of cellulose acetate butyrate, 18-38 parts of vinyl acetate, 15-26 parts of montmorillonite powder, 14-23 parts of sepiolite powder, 10-15 parts of titanium dioxide, 5-9 parts of nano calcium sulfate, 12-18 parts of an antifreezing agent, 15-27 parts of methyl chloride, 13-26 parts of polyethylene wax, 16-21 parts of magnesium stearate and 12-20 parts of sodium stearate. According to the invention, the surface of the bonding copper wire is coated with the antioxidant coating by a laser melting method, so that the antioxidant property of the bonding copper wire is further improved, and the bonding copper wire is ensured to be not easy to oxidize in storage, transportation and use.
Description
Technical Field
The invention belongs to the technical field of oxidation bonding copper wires, and particularly relates to an oxidation-resistant bonding copper wire; in particular to a preparation method of the antioxidant bonding copper wire.
Background
The bonding wire in integrated circuits and semiconductor discrete devices mainly uses a copper wire, namely a bonding copper wire, and the bonding copper wire is a mature product and has the advantages of stable chemical property and the like.
However, due to the high oxidation characteristic of the copper wire, the copper wire must be used within a specified time after being unpacked, and nitrogen-hydrogen mixed gas must be added for protection during use, so that flammable and explosive gas is dispersed around a packaging and bonding production field, and the danger is increased.
Disclosure of Invention
The invention aims to provide an antioxidant bonding copper wire and a preparation method thereof, and aims to solve the problem that the copper wire is inconvenient to use due to the high oxidation characteristic of the copper wire in the background technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
the antioxidant bonding copper wire comprises a bonding copper wire and an antioxidant coating coated on the outer wall of the bonding copper wire, and the antioxidant coating comprises the following components in parts by mass: 21-33 parts of hydroxyethyl cellulose, 18-23 parts of tin octoate, 19-29 parts of methyl silane, 30-41 parts of trichloro insecticidal ester, 15-35 parts of fumaric diester, 18-33 parts of cerium oxide, 14-29 parts of dimethylaminopropylamine, 25-38 parts of sodium oleate, 17-31 parts of trimethylolpropane trimethacrylate, 15-35 parts of cellulose acetate butyrate, 18-38 parts of vinyl acetate, 15-26 parts of montmorillonite powder, 14-23 parts of sepiolite powder, 10-15 parts of titanium dioxide, 5-9 parts of nano calcium sulfate, 12-18 parts of an antifreezing agent, 15-27 parts of methyl chloride, 13-26 parts of polyethylene wax, 16-21 parts of magnesium stearate, 12-20 parts of sodium stearate, 15-23 parts of dimethylolbutyric acid and 17-31 parts of triisopropanolamine, 11-18 parts of graphite powder, 15-20 parts of ethyl acetate and 17-25 parts of an oxidant.
Preferably, the bonding copper wire includes: the purity of the single crystal copper wire is more than or equal to 99.996 percent, and the mixture of zinc, tin and cerium.
Preferably, the formula of the antioxidant coating comprises the following components in parts by weight: 21 parts of hydroxyethyl cellulose, 18 parts of tin octoate, 19 parts of methyl silane, 30 parts of trichloro insecticidal ester, 15 parts of fumaric diester, 18 parts of cerium oxide, 14 parts of dimethylaminopropylamine, 25 parts of sodium oleate, 17 parts of trimethylolpropane trimethacrylate, 15 parts of cellulose acetate butyrate, 18 parts of vinyl acetate, 15 parts of montmorillonite powder, 14 parts of sepiolite powder, 10 parts of titanium dioxide, 5 parts of nano calcium sulfate, 12 parts of an antifreezing agent, 15 parts of methyl chloride, 13 parts of polyethylene wax, 16 parts of magnesium stearate, 12 parts of sodium stearate, 15 parts of dimethylolbutyric acid, 17 parts of triisopropanolamine, 11 parts of graphite powder, 15 parts of ethyl acetate and 17 parts of an oxidizing agent.
Preferably, the formula of the antioxidant coating comprises the following components in parts by weight: 27 parts of hydroxyethyl cellulose, 20 parts of tin octoate, 24 parts of methyl silane, 35 parts of trichloro insecticidal ester, 25 parts of fumaric diester, 26 parts of cerium oxide, 21 parts of dimethylaminopropylamine, 32 parts of sodium oleate, 24 parts of trimethylolpropane trimethacrylate, 25 parts of cellulose acetate butyrate, 26 parts of vinyl acetate, 21 parts of montmorillonite powder, 18 parts of sepiolite powder, 12 parts of titanium dioxide, 7 parts of nano calcium sulfate, 15 parts of an antifreezing agent, 22 parts of methyl chloride, 20 parts of polyethylene wax, 18 parts of magnesium stearate, 16 parts of sodium stearate, 18 parts of dimethylolbutyric acid, 28 parts of triisopropanolamine, 15 parts of graphite powder, 17 parts of ethyl acetate and 22 parts of an oxidizing agent.
Preferably, the formula of the antioxidant coating comprises the following components in parts by weight: 33 parts of hydroxyethyl cellulose, 23 parts of tin octoate, 29 parts of methyl silane, 41 parts of trichloro insecticidal ester, 35 parts of fumaric diester, 33 parts of cerium oxide, 29 parts of dimethylaminopropylamine, 38 parts of sodium oleate, 31 parts of trimethylolpropane trimethacrylate, 35 parts of cellulose acetate butyrate, 38 parts of vinyl acetate, 26 parts of montmorillonite powder, 23 parts of sepiolite powder, 15 parts of titanium dioxide, 9 parts of nano calcium sulfate, 18 parts of an antifreezing agent, 27 parts of methyl chloride, 26 parts of polyethylene wax, 21 parts of magnesium stearate, 20 parts of sodium stearate, 23 parts of dimethylolbutyric acid, 31 parts of triisopropanolamine, 18 parts of graphite powder, 20 parts of ethyl acetate and 25 parts of an oxidant.
A preparation method of an antioxidant bonding copper wire comprises the following steps:
s1, preparing materials, namely weighing the materials for later use according to the formula of the antioxidant bonding copper wire in parts by mass;
s2, preparing a bonding copper wire, namely, carrying out vacuum melting on the single crystal copper with the purity of more than or equal to 99.996% and the mixture of zinc, tin and cerium, and pouring, pickling and drawing after melting to prepare the bonding copper wire;
s3, preparing raw materials of the anti-oxidation coating, and sequentially putting the anti-oxidation coating into a crucible for smelting;
s5, grinding, namely grinding the antioxidant coating raw material prepared in the step S3 into powder through a metal grinder;
s6, coating the anti-oxidation coating, and coating the raw material powder of the oxidation coating on the surface of the bonding copper wire by a laser melting method;
and S7, trimming, namely trimming the surface of the copper wire coated with the anti-oxidation coating, and removing and repairing the accumulated anti-oxidation coating on the surface and the anti-oxidation layer missing coating part.
Preferably, magnesium oxide crucibles are adopted for smelting in both the step S2 and the step S3, the smelting vacuum degree is 0.1 multiplied by 10 < -3 > Pa, and the smelting temperature is 1200-1300 ℃.
Preferably, the raw material for the oxidation-resistant coating of step S5 is milled, and the milled grain size is 80 mesh.
Preferably, in step S6, the coating thickness of the anti-oxidation coating is 250 to 500 μm, the precision is ± 10 μm, and the relative density is greater than or equal to 99.9%.
The invention has the technical effects and advantages that:
according to the invention, the bonding copper wire is prepared by adopting the mixture of the single crystal copper wire and the zinc, tin and cerium, the purity of the single crystal copper wire is set to be more than or equal to 99.996%, the oxidation resistance of the bonding copper wire is improved to a certain extent, and the oxidation resistance of the bonding copper wire is further improved by coating the surface of the bonding copper wire with the oxidation-resistant coating by a laser melting method, so that the bonding copper wire is ensured to be not easy to oxidize in storage, transportation and use.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The antioxidant bonding copper wire comprises a bonding copper wire and an antioxidant coating coated on the outer wall of the bonding copper wire, and the antioxidant coating comprises the following components in parts by mass: 21 parts of hydroxyethyl cellulose, 18 parts of tin octoate, 19 parts of methyl silane, 30 parts of trichloro insecticidal ester, 15 parts of fumaric diester, 18 parts of cerium oxide, 14 parts of dimethylaminopropylamine, 25 parts of sodium oleate, 17 parts of trimethylolpropane trimethacrylate, 15 parts of cellulose acetate butyrate, 18 parts of vinyl acetate, 15 parts of montmorillonite powder, 14 parts of sepiolite powder, 10 parts of titanium dioxide, 5 parts of nano calcium sulfate, 12 parts of an antifreezing agent, 15 parts of methyl chloride, 13 parts of polyethylene wax, 16 parts of magnesium stearate, 12 parts of sodium stearate, 15 parts of dimethylolbutyric acid, 17 parts of triisopropanolamine, 11 parts of graphite powder, 15 parts of ethyl acetate and 17 parts of an oxidizing agent.
Wherein the bonding copper wire includes: the purity of the single crystal copper wire is more than or equal to 99.996 percent, and the mixture of zinc, tin and cerium.
A preparation method of an antioxidant bonding copper wire comprises the following steps:
s1, preparing materials, namely weighing the materials for later use according to the formula of the antioxidant bonding copper wire in parts by mass;
s2, preparing a bonding copper wire, namely, carrying out vacuum melting on the single crystal copper with the purity of more than or equal to 99.996% and the mixture of zinc, tin and cerium, and pouring, pickling and drawing after melting to prepare the bonding copper wire;
s3, preparing raw materials of the anti-oxidation coating, and sequentially putting the anti-oxidation coating into a crucible for smelting;
s5, grinding, namely grinding the antioxidant coating raw material prepared in the step S3 into powder through a metal grinder;
s6, coating the anti-oxidation coating, and coating the raw material powder of the oxidation coating on the surface of the bonding copper wire by a laser melting method;
and S7, trimming, namely trimming the surface of the copper wire coated with the anti-oxidation coating, and removing and repairing the accumulated anti-oxidation coating on the surface and the anti-oxidation layer missing coating part.
Wherein, in the steps S2 and S3, magnesium oxide crucibles are adopted for smelting, the smelting vacuum degree is 0.1 multiplied by 10 < -3 > Pa, and the smelting temperature is 1200-1300 ℃.
Wherein, the oxidation resistant coating raw material is ground in the step S5, and the grain size of the ground powder is 80 meshes.
Wherein in the step S6, the coating thickness of the anti-oxidation coating is 250-500 μm, the precision is +/-10 μm, and the relative density is more than or equal to 99.9%
Example 2
The difference from example 1 is that the formulation of the oxidation resistant coating comprises: 27 parts of hydroxyethyl cellulose, 20 parts of tin octoate, 24 parts of methyl silane, 35 parts of trichloro insecticidal ester, 25 parts of fumaric diester, 26 parts of cerium oxide, 21 parts of dimethylaminopropylamine, 32 parts of sodium oleate, 24 parts of trimethylolpropane trimethacrylate, 25 parts of cellulose acetate butyrate, 26 parts of vinyl acetate, 21 parts of montmorillonite powder, 18 parts of sepiolite powder, 12 parts of titanium dioxide, 7 parts of nano calcium sulfate, 15 parts of an antifreezing agent, 22 parts of methyl chloride, 20 parts of polyethylene wax, 18 parts of magnesium stearate, 16 parts of sodium stearate, 18 parts of dimethylolbutyric acid, 28 parts of triisopropanolamine, 15 parts of graphite powder, 17 parts of ethyl acetate and 22 parts of an oxidizing agent.
Example 3
The difference from example 1 is that the formulation of the oxidation resistant coating comprises: 33 parts of hydroxyethyl cellulose, 23 parts of tin octoate, 29 parts of methyl silane, 41 parts of trichloro insecticidal ester, 35 parts of fumaric diester, 33 parts of cerium oxide, 29 parts of dimethylaminopropylamine, 38 parts of sodium oleate, 31 parts of trimethylolpropane trimethacrylate, 35 parts of cellulose acetate butyrate, 38 parts of vinyl acetate, 26 parts of montmorillonite powder, 23 parts of sepiolite powder, 15 parts of titanium dioxide, 9 parts of nano calcium sulfate, 18 parts of an antifreezing agent, 27 parts of methyl chloride, 26 parts of polyethylene wax, 21 parts of magnesium stearate, 20 parts of sodium stearate, 23 parts of dimethylolbutyric acid, 31 parts of triisopropanolamine, 18 parts of graphite powder, 20 parts of ethyl acetate and 25 parts of an oxidant. The specific formulation data for three sets of examples of the invention are given in the following table:
according to the invention, the bonding copper wire is prepared by adopting the mixture of the single crystal copper wire and the zinc, tin and cerium, the purity of the single crystal copper wire is set to be more than or equal to 99.996%, the oxidation resistance of the bonding copper wire is improved to a certain extent, and moreover, the oxidation resistance of the bonding copper wire is further improved by coating the surface of the bonding copper wire with the oxidation-resistant coating by a laser melting method, so that the bonding copper wire is ensured to be not easy to oxidize in storage, transportation and use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. The utility model provides an anti-oxidant bonding copper wire, includes bonding copper wire and the anti-oxidant coating of coating on the bonding copper wire outer wall, its characterized in that: the formula of the antioxidant coating comprises the following components in parts by mass: 21-33 parts of hydroxyethyl cellulose, 18-23 parts of tin octoate, 19-29 parts of methyl silane, 30-41 parts of trichloro insecticidal ester, 15-35 parts of fumaric diester, 18-33 parts of cerium oxide, 14-29 parts of dimethylaminopropylamine, 25-38 parts of sodium oleate, 17-31 parts of trimethylolpropane trimethacrylate, 15-35 parts of cellulose acetate butyrate, 18-38 parts of vinyl acetate, 15-26 parts of montmorillonite powder, 14-23 parts of sepiolite powder, 10-15 parts of titanium dioxide, 5-9 parts of nano calcium sulfate, 12-18 parts of an antifreezing agent, 15-27 parts of methyl chloride, 13-26 parts of polyethylene wax, 16-21 parts of magnesium stearate, 12-20 parts of sodium stearate, 15-23 parts of dimethylolbutyric acid and 17-31 parts of triisopropanolamine, 11-18 parts of graphite powder, 15-20 parts of ethyl acetate and 17-25 parts of an oxidant.
2. The antioxidant bonding copper wire of claim 1, wherein: the bonding copper wire includes: the purity of the single crystal copper wire is more than or equal to 99.996 percent, and the mixture of zinc, tin and cerium.
3. The antioxidant bonding copper wire of claim 1, wherein: the formula of the antioxidant coating comprises the following components in parts by mass: 21 parts of hydroxyethyl cellulose, 18 parts of tin octoate, 19 parts of methyl silane, 30 parts of trichloro insecticidal ester, 15 parts of fumaric diester, 18 parts of cerium oxide, 14 parts of dimethylaminopropylamine, 25 parts of sodium oleate, 17 parts of trimethylolpropane trimethacrylate, 15 parts of cellulose acetate butyrate, 18 parts of vinyl acetate, 15 parts of montmorillonite powder, 14 parts of sepiolite powder, 10 parts of titanium dioxide, 5 parts of nano calcium sulfate, 12 parts of an antifreezing agent, 15 parts of methyl chloride, 13 parts of polyethylene wax, 16 parts of magnesium stearate, 12 parts of sodium stearate, 15 parts of dimethylolbutyric acid, 17 parts of triisopropanolamine, 11 parts of graphite powder, 15 parts of ethyl acetate and 17 parts of an oxidizing agent.
4. The antioxidant bonding copper wire of claim 1, wherein: the formula of the antioxidant coating comprises the following components in parts by mass: 27 parts of hydroxyethyl cellulose, 20 parts of tin octoate, 24 parts of methyl silane, 35 parts of trichloro insecticidal ester, 25 parts of fumaric diester, 26 parts of cerium oxide, 21 parts of dimethylaminopropylamine, 32 parts of sodium oleate, 24 parts of trimethylolpropane trimethacrylate, 25 parts of cellulose acetate butyrate, 26 parts of vinyl acetate, 21 parts of montmorillonite powder, 18 parts of sepiolite powder, 12 parts of titanium dioxide, 7 parts of nano calcium sulfate, 15 parts of an antifreezing agent, 22 parts of methyl chloride, 20 parts of polyethylene wax, 18 parts of magnesium stearate, 16 parts of sodium stearate, 18 parts of dimethylolbutyric acid, 28 parts of triisopropanolamine, 15 parts of graphite powder, 17 parts of ethyl acetate and 22 parts of an oxidizing agent.
5. The antioxidant bonding copper wire of claim 1, wherein: the formula of the antioxidant coating comprises the following components in parts by mass: 33 parts of hydroxyethyl cellulose, 23 parts of tin octoate, 29 parts of methyl silane, 41 parts of trichloro insecticidal ester, 35 parts of fumaric diester, 33 parts of cerium oxide, 29 parts of dimethylaminopropylamine, 38 parts of sodium oleate, 31 parts of trimethylolpropane trimethacrylate, 35 parts of cellulose acetate butyrate, 38 parts of vinyl acetate, 26 parts of montmorillonite powder, 23 parts of sepiolite powder, 15 parts of titanium dioxide, 9 parts of nano calcium sulfate, 18 parts of an antifreezing agent, 27 parts of methyl chloride, 26 parts of polyethylene wax, 21 parts of magnesium stearate, 20 parts of sodium stearate, 23 parts of dimethylolbutyric acid, 31 parts of triisopropanolamine, 18 parts of graphite powder, 20 parts of ethyl acetate and 25 parts of an oxidant.
6. The method for preparing the antioxidant bonding copper wire according to claim 1, comprising the following steps:
s1, preparing materials, namely weighing the materials for later use according to the formula of the antioxidant bonding copper wire in parts by mass;
s2, preparing a bonding copper wire, namely, carrying out vacuum melting on the single crystal copper with the purity of more than or equal to 99.996% and the mixture of zinc, tin and cerium, and pouring, pickling and drawing after melting to prepare the bonding copper wire;
s3, preparing raw materials of the anti-oxidation coating, and sequentially putting the anti-oxidation coating into a crucible for smelting;
s5, grinding, namely grinding the antioxidant coating raw material prepared in the step S3 into powder through a metal grinder;
s6, coating the anti-oxidation coating, and coating the raw material powder of the oxidation coating on the surface of the bonding copper wire by a laser melting method;
and S7, trimming, namely trimming the surface of the copper wire coated with the anti-oxidation coating, and removing and repairing the accumulated anti-oxidation coating on the surface and the anti-oxidation layer missing coating part.
7. The antioxidant bonding copper wire and the preparation method thereof according to claim 6, wherein the preparation method comprises the following steps: in the steps S2 and S3, magnesium oxide crucibles are adopted for smelting, the smelting vacuum degree is 0.1 multiplied by 10 < -3 > Pa, and the smelting temperature is 1200-1300 ℃.
8. The antioxidant bonding copper wire and the preparation method thereof according to claim 6, wherein the preparation method comprises the following steps: and step S5, grinding the anti-oxidation coating raw material into powder, wherein the grain size of the ground powder is 80 meshes.
9. The antioxidant bonding copper wire and the preparation method thereof according to claim 6, wherein the preparation method comprises the following steps: in step S6, the coating thickness of the anti-oxidation coating is 250-500 μm, the precision is +/-10 μm, and the relative density is more than or equal to 99.9%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110522040.2A CN113045920A (en) | 2021-05-13 | 2021-05-13 | Anti-oxidation bonding copper wire and preparation method thereof |
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| CN202110522040.2A CN113045920A (en) | 2021-05-13 | 2021-05-13 | Anti-oxidation bonding copper wire and preparation method thereof |
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| CN113737167A (en) * | 2021-09-22 | 2021-12-03 | 东莞市四辉表面处理科技有限公司 | Copper material antioxidant and preparation method thereof |
| CN114459633A (en) * | 2022-04-11 | 2022-05-10 | 深圳中宝新材科技有限公司 | Data encryption and decryption method for anti-oxidation gold bonding wire equipment based on Internet of things |
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