CN113044804A - Method for removing protective cover of MEMS (micro-electromechanical system) chip - Google Patents
Method for removing protective cover of MEMS (micro-electromechanical system) chip Download PDFInfo
- Publication number
- CN113044804A CN113044804A CN202110259977.5A CN202110259977A CN113044804A CN 113044804 A CN113044804 A CN 113044804A CN 202110259977 A CN202110259977 A CN 202110259977A CN 113044804 A CN113044804 A CN 113044804A
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- China
- Prior art keywords
- chip
- protective cover
- connecting plate
- glue
- fixing plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Abstract
The invention relates to a method for removing a protective cover of an MEMS (micro-electromechanical system) chip, wherein the chip comprises a chip main body and the protective cover covering the top of the chip main body, and the method for removing the protective cover comprises the following steps: providing a fixing plate, and adhering the bottom of the chip main body to the top surface of the fixing plate; providing a connecting plate, adhering the connecting plate to the top of the protective cover, wherein the connecting plate is vertical to the fixing plate; and pressing the fixing plate and lifting the connecting plate upwards to enable the connecting plate to drive the protective cover to move upwards, so that the protective cover is removed. The invention effectively solves the problem that the corrosive liquid is easy to cause element corrosion or damage, can remove the protective cover and protect the chip main body so as to facilitate later analysis of the chip, reduce the risk of failure of the chip due to reasons other than tests and improve the reliability of an analysis result.
Description
Technical Field
The invention relates to the field of chip packaging, in particular to a method for removing a protective cover of an MEMS (micro-electromechanical system) chip.
Background
MEMS (Micro-Electro-Mechanical System), i.e. Micro-electromechanical System, often fails during the production and use of such chips, and as the requirements of people on product quality and reliability are continuously improved, failure analysis work is more and more important.
Different from the traditional chip, the MEMS chip has fragile internal elements, the surface of the MEMS chip is covered by a protective cover, the protective cover needs to be removed firstly when failure analysis is carried out, the traditional method is to use a chemical reagent to corrode an adhesive between a chip main body and the protective cover of the MEMS chip so as to achieve the purpose of removing the protective cover, however, in the operation process of the method, corrosive liquid is easy to contact with the chip main body, so that the elements are corroded or damaged, secondary failure is easy to cause, and the method has influence on later analysis.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a method for removing a protective cover of an MEMS chip, solves the problem that elements are easy to corrode or damage due to corrosive liquid, can remove the protective cover and protect a chip main body, facilitates later analysis of the chip, reduces the risk of failure of the chip due to reasons other than tests, and improves the reliability of an analysis result.
The technical scheme for realizing the purpose is as follows:
the invention provides a method for removing a protective cover of an MEMS (micro-electromechanical system) chip, wherein the chip comprises a chip main body and the protective cover covering the top of the chip main body, and the method comprises the following steps:
providing a fixing plate, and adhering the bottom of the chip main body to the top surface of the fixing plate;
providing a connecting plate, adhering the connecting plate to the top of the protective cover, wherein the connecting plate is vertical to the fixing plate;
and pressing the fixing plate and lifting the connecting plate upwards to enable the connecting plate to drive the protective cover to move upwards, so that the protective cover is removed.
According to the method for removing the protective cover of the MEMS chip, the fixed plate is adhered to the bottom of the chip main body, the connecting plate is adhered to the top of the protective cover, the connecting plate and the fixed plate are perpendicular to each other, so that a force application basis is provided for an operator, the operator presses the fixed plate and lifts the connecting plate upwards to enable the connecting plate to drive the protective cover to move upwards, the protective cover is removed, the problem that elements are easily corroded or damaged by corrosive liquid is effectively solved, the protective cover can be removed, the chip main body can be protected, later analysis on the chip is facilitated, the risk that the chip fails due to reasons except for a test is reduced, and the reliability of an analysis result is improved.
The further improvement of the method for removing the protective cover of the MEMS chip is that when the bottom of the chip main body is pasted on the fixing plate, the method further comprises the following steps:
glue is smeared on the top surface of the fixing plate, the chip main body is placed on the glue and pressed, and then the chip is baked, so that the glue is solidified, and the bottom of the chip main body is pasted on the fixing plate.
The further improvement of the method for removing the protective cover of the MEMS chip is that when the connecting plate is stuck on the top of the protective cover, the method further comprises the following steps:
glue is smeared on the surface of the connecting plate, the chip is reversely buckled, the protective cover is placed on the glue, the fixing plate is pressed, the chip is baked, the glue is solidified, and the connecting plate is pasted on the top of the protective cover.
The further improvement of the method for removing the protective cover of the MEMS chip is that the glue is AB glue.
The further improvement of the method for removing the MEMS chip protective cover is that the AB glue is double-component epoxy resin AB glue.
The method for removing the protective cover of the MEMS chip is further improved in that the temperature for baking the chip is 110 ℃.
The method for removing the protective cover of the MEMS chip is further improved in that the time for baking the chip is 40 minutes.
The further improvement of the method for removing the protective cover of the MEMS chip is that the fixed plate and the connecting plate are rectangular.
The MEMS chip protective cover removing method is further improved in that the fixing plate and the connecting plate are made of glass.
Drawings
FIG. 1 is a flow chart of a method for removing a protective cover of a MEMS chip according to the present invention.
FIG. 2 is a front view of the overall structure of the method for removing the protective cover of the MEMS chip of the present invention.
FIG. 3 is a top view of the entire structure in the method for removing the protective cover of the MEMS chip of the present invention.
Detailed Description
The invention is further described with reference to the following figures and specific examples.
Referring to fig. 1, the invention provides a method for removing a protective cover of an MEMS chip, in which a fixing plate is adhered to the bottom of a chip main body, and a connecting plate is adhered to the top of the protective cover, and since the connecting plate and the fixing plate are perpendicular to each other, a force application base is provided for an operator, and the operator presses the fixing plate and lifts the connecting plate upward, so that the connecting plate drives the protective cover to move upward, thereby removing the protective cover, effectively solving the problem that corrosion liquid easily causes element corrosion or damage, and not only removing the protective cover, but also protecting the chip main body, facilitating later analysis of the chip, reducing the risk of failure of the chip due to reasons other than a test, and improving reliability of an analysis result. The following describes a method for removing the protection cover of the MEMS chip according to the present invention with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a flow chart of a method for removing a protective cover of a MEMS chip according to the present invention. The following describes a method for removing the protective cover of the MEMS chip according to the present invention with reference to fig. 1.
Referring to fig. 1, 2 and 3, in the method for removing a protective cover of a MEMS chip of the present invention, a chip 11 includes a chip body 111 and a protective cover 112 covering a top of the chip body 111, and the method includes the following steps:
providing a fixing plate 12, and adhering the bottom of the chip main body 111 to the top surface of the fixing plate 12;
providing a connecting plate 13, adhering the connecting plate 13 on the top of the protective cover 112, and enabling the connecting plate 13 to be perpendicular to the fixing plate 12;
pressing the fixing plate 12 and lifting the connecting plate 13 upward so that the connecting plate 13 carries the protective cover 112 upward, thereby removing the protective cover 112.
Specifically, the fixing plate 12 and the connecting plate 13 are rectangular.
Preferably, the fixing plate 12 and the connecting plate 13 are made of glass.
In a preferred embodiment of the present invention, when the bottom of the chip body 111 is attached to the fixing plate 12, the method further includes:
glue is applied to the top surface of the fixing plate 12, the chip body 111 is placed on the glue and the chip body 111 is pressed to discharge air bubbles at the bottom of the chip body 111, and then the chip 11 is baked to cure the glue, so that the bottom of the chip body 111 is adhered to the fixing plate 12.
Further, when the connection plate 13 is adhered to the top of the protection cover 112, the method further includes:
glue is coated on the surface of the connecting plate 13, the chip 11 is turned upside down, that is, the chip 11 is turned over, the protective cover 112 faces downwards, so that the protective cover 112 can be placed on the glue, the fixing plate 12 is pressed to discharge air bubbles between the protective cover 112 and the connecting plate 13, the chip 11 is baked, so that the glue is cured, and the connecting plate 13 is adhered to the top of the protective cover 112.
Specifically, the glue is AB glue.
Preferably, the AB glue is double-component epoxy resin AB glue, the A glue and the B glue are mixed according to the weight ratio of 1:8, and the glue is obtained after uniform stirring and standing.
Specifically, the temperature for baking the chip was 110 ℃.
Preferably, the time for baking the chip is 40 minutes.
The specific embodiment of the invention is as follows:
coating glue on the surface of the fixing plate 12, placing the chip main body 111 on the glue, pressing to discharge air bubbles at the bottom of the chip main body 111, baking the chip for 40 minutes to cure the glue, so that the fixing plate 12 is fixed at the bottom of the chip main body 111;
coating glue on the surface of the connecting plate 13, reversely buckling the chip 11 to enable the protective cover 112 to be placed on the glue, pressing to discharge air bubbles between the protective cover 112 and the connecting plate 13, baking the chip for 40 minutes to enable the glue to be solidified, and enabling the connecting plate 13 to be fixed on the top of the protective cover 112, wherein the connecting plate 13 is perpendicular to the fixing plate 12;
the fixing plate 12 is pressed and the connecting plate 13 is pulled upwards, at the moment, the connecting plate 13 drives the protective cover 112 to be pulled upwards, so that the protective cover 112 is separated from the chip main body 111, the purpose of removing the protective cover 112 is achieved, corrosive liquid does not need to be dripped in the mode, elements of the chip main body 111 can be prevented from being damaged, and an analysis result has higher reference value.
While the present invention has been described in detail and with reference to the embodiments thereof as illustrated in the accompanying drawings, it will be apparent to one skilled in the art that various changes and modifications can be made therein. Therefore, certain details of the embodiments are not to be interpreted as limiting, and the scope of the invention is to be determined by the appended claims.
Claims (9)
1. A method for removing a protective cover of a MEMS chip, wherein the chip comprises a chip body and a protective cover covering the top of the chip body, the method comprising the steps of:
providing a fixing plate, and adhering the bottom of the chip main body to the top surface of the fixing plate;
providing a connecting plate, adhering the connecting plate to the top of the protective cover, wherein the connecting plate is perpendicular to the fixing plate;
and pressing the fixing plate and lifting the connecting plate upwards to enable the connecting plate to drive the protective cover to move upwards, so that the protective cover is removed.
2. The method of removing the MEMS chip protection cover of claim 1, wherein the step of attaching the bottom of the chip body to the mounting plate further comprises:
and coating glue on the top surface of the fixing plate, placing the chip main body on the glue and pressing the chip main body, and further baking the chip to cure the glue, so that the bottom of the chip main body is adhered to the fixing plate.
3. The method of removing the MEMS chip protective cover of claim 1, wherein attaching the connecting plate to the top of the protective cover further comprises:
and coating glue on the surface of the connecting plate, reversely buckling the chip to enable the protective cover to be placed on the glue, pressing the fixing plate, baking the chip to enable the glue to be solidified, and enabling the connecting plate to be adhered to the top of the protective cover.
4. The method for removing the protective cover of the MEMS chip as claimed in claim 2 or 3, wherein the glue is AB glue.
5. The method of removing the protective cover of the MEMS chip of claim 4, wherein the AB glue is a two-component epoxy AB glue.
6. The method of removing the protective cover of the MEMS chip of claim 4, wherein the temperature of baking the chip is 110 ℃.
7. The method of claim 6, wherein the time to bake the chip is 40 minutes.
8. The method of removing a protective cover of a MEMS chip of claim 1 wherein the fixed plate and the connecting plate are rectangular.
9. The method of removing a protective cover of a MEMS chip of claim 1 wherein the fixed plate and the connecting plate are made of glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110259977.5A CN113044804A (en) | 2021-03-10 | 2021-03-10 | Method for removing protective cover of MEMS (micro-electromechanical system) chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110259977.5A CN113044804A (en) | 2021-03-10 | 2021-03-10 | Method for removing protective cover of MEMS (micro-electromechanical system) chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113044804A true CN113044804A (en) | 2021-06-29 |
Family
ID=76510959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110259977.5A Pending CN113044804A (en) | 2021-03-10 | 2021-03-10 | Method for removing protective cover of MEMS (micro-electromechanical system) chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113044804A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101509867A (en) * | 2009-02-18 | 2009-08-19 | 西北农林科技大学 | Method for testing peeling strength of adhesive sealant and adhered substrate bonding sample |
| CN102480098A (en) * | 2010-11-24 | 2012-05-30 | 英业达股份有限公司 | Removing fixture of protection cover |
| CN102901922A (en) * | 2012-09-21 | 2013-01-30 | 中国空间技术研究院 | Single-particle test chip protection device and operating method thereof |
| CN203324094U (en) * | 2013-06-03 | 2013-12-04 | 华侨大学 | Clamp for testing bonding strength of mortar in laboratory |
| CN203758895U (en) * | 2014-01-26 | 2014-08-06 | 珠海格力电器股份有限公司 | Sponge adhesive adhesion force testing tool |
| CN105842163A (en) * | 2016-05-03 | 2016-08-10 | 山东科技大学 | Measuring method for bonding force between polymeric substrate and metal coating |
| CN205634875U (en) * | 2016-05-31 | 2016-10-12 | 深圳宜特检测技术有限公司 | A remove device for removing MEMS chip cap |
| CN212275545U (en) * | 2020-04-24 | 2021-01-01 | 惠州亿纬锂能股份有限公司 | Battery pole piece bonding force test fixture and test equipment |
| CN212434585U (en) * | 2020-07-02 | 2021-01-29 | 合肥晶合集成电路股份有限公司 | Unsealing device for packaged chip |
-
2021
- 2021-03-10 CN CN202110259977.5A patent/CN113044804A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101509867A (en) * | 2009-02-18 | 2009-08-19 | 西北农林科技大学 | Method for testing peeling strength of adhesive sealant and adhered substrate bonding sample |
| CN102480098A (en) * | 2010-11-24 | 2012-05-30 | 英业达股份有限公司 | Removing fixture of protection cover |
| CN102901922A (en) * | 2012-09-21 | 2013-01-30 | 中国空间技术研究院 | Single-particle test chip protection device and operating method thereof |
| CN203324094U (en) * | 2013-06-03 | 2013-12-04 | 华侨大学 | Clamp for testing bonding strength of mortar in laboratory |
| CN203758895U (en) * | 2014-01-26 | 2014-08-06 | 珠海格力电器股份有限公司 | Sponge adhesive adhesion force testing tool |
| CN105842163A (en) * | 2016-05-03 | 2016-08-10 | 山东科技大学 | Measuring method for bonding force between polymeric substrate and metal coating |
| CN205634875U (en) * | 2016-05-31 | 2016-10-12 | 深圳宜特检测技术有限公司 | A remove device for removing MEMS chip cap |
| CN212275545U (en) * | 2020-04-24 | 2021-01-01 | 惠州亿纬锂能股份有限公司 | Battery pole piece bonding force test fixture and test equipment |
| CN212434585U (en) * | 2020-07-02 | 2021-01-29 | 合肥晶合集成电路股份有限公司 | Unsealing device for packaged chip |
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