CN205634875U - A remove device for removing MEMS chip cap - Google Patents
A remove device for removing MEMS chip cap Download PDFInfo
- Publication number
- CN205634875U CN205634875U CN201620518693.8U CN201620518693U CN205634875U CN 205634875 U CN205634875 U CN 205634875U CN 201620518693 U CN201620518693 U CN 201620518693U CN 205634875 U CN205634875 U CN 205634875U
- Authority
- CN
- China
- Prior art keywords
- mems
- mems chip
- cap
- heater
- dryer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
The utility model provides a remove device for removing MEMS chip cap, the MEMS chip includes be located its bottom the base plate, set up on the base plate MEMS component and ASIC and through the binder MEMS cap on the base plate that adheres, wherein, MEMS component and ASIC are located between base plate and the MEMS cap, remove the device and include heater and air blower, air blower's mouthful position of blowing is arranged in to the heater, will through blowing of air blower the heating temperature of heater transmits to the binder position of MEMS chip. The utility model discloses a heating and the mode that wind -force combined together come the hot melt to be used for the binder of MEMS cap and base plate of adhereing, and then make the in -process contactless corrosivity chemical reagent that the MEMS chip was removing cap just not produce mechanical collision, have effectively prevented the damage of MEMS component, have improved the yield of MEMS chip sample and the accuracy of later stage analysis.
Description
Technical field
This utility model relates to MEMS chip construction applications, in particular, relate to a kind of for
Remove the apparatus for removing of MEMS chip Cap (protection cap).
Background technology
To MEMS (Micro-Electro-Mechanical System, MEMS) core
When sheet carries out failure analysis, owing to this kind of MEMS chip surface covers MEMS Cap, the most generally
Chip is carried out MEMS Cap remove, in order to internal MEMS element and ASIC (Application
Specific Integrated Circuit, the integrated circuit of special-purpose) it is observed and analyzes.Tradition
Method is MEMS chip to be placed directly within corrosive chemical, to corrode MEMS chip
Adhesive between Substrate (substrate) and MEMS Cap and make MEMS Cap separate with substrate.
But in operating process, corrosive chemical not only can react with adhesive but also can contact
Corrosion MEMS element within MEMS chip, causes its structure or property abnormality, thus affects
The accuracy analyzed.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of is not damaging MEMS element
In the case of for removing the apparatus for removing of MEMS chip Cap.
The purpose of this utility model is achieved through the following technical solutions:
This utility model discloses a kind of apparatus for removing for removing MEMS chip Cap, described
MEMS chip include being positioned at the substrate bottom it, arrange MEMS element on the substrate and
ASIC and the MEMS Cap being adhered on described substrate by adhesive, wherein, described MEMS
Element and ASIC are between described substrate and MEMS Cap, and described apparatus for removing includes heater
And hair-dryer, described heater is placed in the blowing mouth position of described hair-dryer, by the blowing of hair-dryer
The heating-up temperature of described heater is transmitted the adhesive position to MEMS chip, described heater
Heating-up temperature is in the range of 500 degree to 600 degree.
Preferably, the heating-up temperature of described heater is 550 degree.The heating-up temperature of heater is 550
Degree is more excellent mode of the present utility model, hot melt faster during the heating-up temperature of heater to 550 degree
Adhesive, and miscellaneous part will not be caused damage.
Preferably, described heater and hair-dryer are arranged in heat gun, and described heat gun is outside to be arranged
There is nozzle, the adhesive position of MEMS chip described in described nozzle alignment.Heat gun realizes adding simultaneously
Heat and the effect of blowing, convenient heat MEMS chip and dry.
Preferably, described apparatus for removing also includes the controller for controlling described MEMS chip.
Control MEMS chip by controller, thus be moved easily MEMS chip, so the most convenient
Adhesive by the blowing position alignment chip of hair-dryer.
Preferably, described controller includes the tweezers for clamping described substrate two ends.Tweezers are to control
The one of device, tweezers clamping MEMS chip is convenient.
Preferably, described apparatus for removing also includes that baffle plate, described baffle plate are positioned at the blowing of described hair-dryer
One end, described MEMS chip is between described baffle plate and hair-dryer.When hair-dryer and heater work
When making, continue forward when hair-dryer blows over MEMS chip with the heat that heater blows out to be blown to baffle plate
Position, the hot blast that baffle plate just prevents hair-dryer and heater from cooperatively forming continues blow forward, so
Just prevent from damaging other device when hair-dryer and heater cooperation.
Preferably, described baffle plate two ends are respectively arranged with accessory plate, and two described accessory plates lay respectively at
The upper and lower of described MEMS chip.Arranging accessory plate prevents hair-dryer and heater coefficient
Hot blast is blown away to the upper and lower both direction of MEMS chip, thus prevents hair-dryer and heater cooperation
Time to damage the effect of other device more preferable.
Preferably, described apparatus for removing also includes the detector being electrically connected with described hair-dryer, described
Detector is for detecting the heating-up temperature of described heater, when described detector detects described heater
Heating-up temperature between 500 degree to 600 degree time control described hair-dryer blowing；When described detector
Detect that the heating-up temperature of described heater less than 500 degree or is higher than 600 degree of described hair-dryers of control not
Work.By detector, the detection of heater heating-up temperature is controlled the duty of hair-dryer, from
And just improve work efficiency, adhesive cannot be made to be not turned on hair-dryer when melting in temperature, not only save
Electricity, and reduce the abrasion of hair-dryer.
Prior art is all by being placed directly within corruption in MEMS chip when removing MEMS Cap
Erosion property chemical reagent, corrodes the adhesive in MEMS chip so that MEMS Cap and substrate
Separate.But, the MEMS element of MEMS chip is corroded by corrosive chemical equally,
Cause its structure or property abnormality.Compared with prior art, of the present utility model this is had the technical effect that
Utility model, by the way of heating combines with wind-force, carrys out hot melt for bonding MEMS Cap and base
The adhesive of plate, and then make MEMS chip not contact corrosionization during removing Cap
Learn reagent and do not produce mechanical collision, effectively prevent the damage of MEMS element, improve MEMS
The yield of chip sample and the accuracy of post analysis.
It addition, the temperature of heater is controlled between 500 degree to 600 degree by this utility model, when adding
It is difficult to when the heating-up temperature of hot device is less than 500 degree make adhesive melt, when the heating-up temperature of heater is high
The components and parts of MEMS chip it are easily damaged in 600 degree time.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of this utility model embodiment MEMS chip；
Fig. 2 is the structural representation that this utility model embodiment apparatus for removing coordinates with MEMS chip.
Wherein: 1, substrate；2, Cap (protection cap)；3, MEMS element；4、ASIC；5、
Adhesive；6, heat gun；7, nozzle；8, tweezers；9, MEMS chip；10, baffle plate；11、
First accessory plate；12, the second accessory plate.
Detailed description of the invention
The utility model is described in further detail with preferred embodiment below in conjunction with the accompanying drawings.
In description of the present utility model, it is to be understood that term " " center ", " laterally ",
On " ", D score, "left", "right", " vertically ", " level ", " top ", " end ",
The orientation of the instruction such as " interior ", " outward " or position relationship are to close based on orientation shown in the drawings or position
System, is for only for ease of description this utility model and simplifies description rather than instruction or imply indication
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore can not manage
Solve as to restriction of the present utility model.Additionally, term " first ", " second " are only used for describing mesh
, and it is not intended that instruction or hint relative importance or implicit indicate indicated technical characteristic
Quantity.Thus, define " first ", the feature of " second " can be expressed or impliedly wrap
Include one or more this feature.In description of the present utility model, except as otherwise noted, " many
Individual " it is meant that two or more.It addition, term " includes " and any deformation, it is intended that
It is to cover non-exclusive comprising.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited,
Term " is installed ", " being connected ", " connection " should be interpreted broadly, for example, it may be fixing even
Connect, it is also possible to be to removably connect, or be integrally connected；Can be to be mechanically connected, it is also possible to be electricity
Connect；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two elements
Internal connection.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
Language concrete meaning in this utility model.
This utility model embodiment is described for removing MEMS chip Cap below with reference to Fig. 1 and Fig. 2
Apparatus for removing.
As depicted in figs. 1 and 2, the open one of this utility model is used for removing MEMS chip Cap
Apparatus for removing, described MEMS chip 9 includes being positioned at the substrate 1 bottom it, is arranged on described base
MEMS element 3 and ASIC 4 on plate 1 and being adhered on described substrate 1 by binding 5 doses
MEMS Cap 2, wherein, described MEMS element 3 and ASIC is positioned at described substrate and MEMS
Between Cap, described apparatus for removing includes that heater and hair-dryer, described heater are placed in described blowing
The blowing mouth position of device, is transmitted the heating-up temperature of described heater extremely by the blowing of hair-dryer
The adhesive position of MEMS chip, the heating-up temperature of described heater is in the range of 500 degree to 600
Degree.
Prior art is all by being placed directly within corruption in MEMS chip when removing MEMS Cap
Erosion property chemical reagent, corrodes the adhesive in MEMS chip so that MEMS Cap and substrate
Separate.But, the MEMS element of MEMS chip is corroded by corrosive chemical equally,
Cause its structure or property abnormality.And the present embodiment is by the way of heating combines with wind-force, come hot
Melt the adhesive for bonding MEMS Cap and substrate, and then make MEMS chip remove Cap
During not contact corrosion chemical reagent and do not produce mechanical collision, effectively prevent MEMS
The damage of element, improves the yield of MEMS chip sample and the accuracy of post analysis.
Wherein, the temperature of heater is controlled between 500 degree to 600 degree by the present embodiment, works as heating
It is difficult to when the heating-up temperature of device is less than 500 degree make adhesive melt, when the heating-up temperature of heater is higher than
The components and parts of MEMS chip it are easily damaged when 600 degree.And each heat fusion joint of adhesive is the most different,
Concrete heating-up temperature can also be adjusted according to the difference of adhesive.
Further, the heating-up temperature of described heater is 550 degree.The heating-up temperature of heater is 550
Degree is more excellent mode of the present utility model, hot melt faster during the heating-up temperature of heater to 550 degree
Adhesive, and miscellaneous part will not be caused damage.
Further, described apparatus for removing also includes the detector (figure being electrically connected with described hair-dryer
In do not demonstrate), described detector is for detecting the heating-up temperature of described heater, when described detector
Detect that controlling described hair-dryer when the heating-up temperature of described heater is between 500 degree to 600 degree blows
Wind；When described detector detects that the heating-up temperature of described heater is less than 500 degree or higher than 600 degree
Control described hair-dryer not work.Control to dry to the detection of heater heating-up temperature by detector
The duty of device, thus just improve work efficiency, adhesive cannot be made to be not turned on when melting in temperature
Hair-dryer, not only saves electricity, and reduces the abrasion of hair-dryer.Meanwhile, heater is also prevented
Heating-up temperature is more than 600 degree, and then prevents heater from damaging the inside of chip because heating-up temperature is too high
Device.
In the present embodiment, described heater and hair-dryer are arranged in heat gun 6, described heat gun
Outside is provided with nozzle 7, adhesive 5 position of MEMS chip described in described nozzle alignment.Hot blast
Rifle realizes heating and the effect of blowing simultaneously, convenient heat MEMS chip and dries.
This is a kind of preferably mode that the present embodiment arranges heater and hair-dryer, and the present embodiment passes through one
Heat gun achieves heating and the effect of blowing, and the nozzle alignment of heat gun is binded by convenient user
The position of agent, thus convenient melted adhesive.And a heat gun realizes two functions, this
Sample during operated by personnel, convenient control.
Certainly, the present embodiment can also be separately provided a heater and be separately provided a hair-dryer phase
Coordinate mutually and realize heating and airflow effects, thus complete adhesive is melted.
It addition, the detector of the present embodiment is also disposed at inside heat gun.
In the present embodiment, described apparatus for removing also includes the control for controlling described MEMS chip
Device processed.Control MEMS chip by controller, thus be moved easily MEMS chip, and then
The most convenient adhesive by the blowing position alignment chip of hair-dryer.
Further, described controller includes the tweezers 8 for clamping described substrate two ends.Tweezers are
The one of controller, tweezers clamping MEMS chip is convenient.Certainly, the present embodiment can also use it
His controller comes clamping or control chip, the most directly arranges a mounting table, arranges use on mounting table
Draw-in groove in screens chip.
In the present embodiment, described apparatus for removing also includes that baffle plate 10, described baffle plate are positioned at described blowing
One end of device blowing, described MEMS chip is between described baffle plate and hair-dryer.When hair-dryer and
During heater work, hair-dryer continues forward when blowing over MEMS chip with the heat that heater blows out
Being blown to baffle position, the hot blast that baffle plate just prevents hair-dryer and heater from cooperatively forming continues forward
Blow, thus prevent from damaging other device when hair-dryer and heater cooperation.
Further, described baffle plate two ends are respectively arranged with accessory plate, the respectively first accessory plate 11
With the second accessory plate 12, two described accessory plates lay respectively at the upper and lower of described MEMS chip；
Particularly, described first accessory plate 11 is positioned at the top of chip, and described second accessory plate is positioned at chip
Lower section.The present embodiment arrange accessory plate prevent hair-dryer and the coefficient hot blast of heater to
The upper and lower both direction of MEMS chip is blown away, thus damages when preventing hair-dryer and heater cooperation
The effect of other device is more preferable.
Wherein, the present embodiment is for general adhesive, by the heating and temperature control of heater 550
Degree, controls heater simultaneously and controls heater when heating-up temperature reaches 550 degree and work on 5 to 10
Second, thus adhesive can be made fully to be heated, and then it is more preferable to make adhesive melt effect.
Above content be combine that this utility model made by concrete preferred implementation the most in detail
Describe in detail bright, it is impossible to assert that of the present utility model being embodied as is confined to these explanations.For this practicality
For novel person of an ordinary skill in the technical field, in the premise conceived without departing from this utility model
Under, it is also possible to make some simple deduction or replace, all should be considered as belonging to protection of the present utility model
Scope.
Claims (8)
1., for removing an apparatus for removing for MEMS chip Cap, described MEMS chip includes
It is positioned at the substrate bottom it, MEMS element on the substrate and ASIC are set and by glutinous
Mixture is adhered to the MEMS Cap on described substrate, wherein, described MEMS element and ASIC position
Between described substrate and MEMS Cap, it is characterised in that described apparatus for removing include heater and
Hair-dryer, described heater is placed in the blowing mouth position of described hair-dryer, will by the blowing of hair-dryer
The heating-up temperature of described heater transmits the adhesive position to MEMS chip, adding of described heater
Hot temperature is in the range of 500 degree to 600 degree.
A kind of apparatus for removing for removing MEMS chip Cap,
It is characterized in that, the heating-up temperature of described heater is 550 degree.
A kind of apparatus for removing for removing MEMS chip Cap,
It is characterized in that, described heater and hair-dryer are arranged in heat gun, and described heat gun is outside to be arranged
There is nozzle, the adhesive position of MEMS chip described in described nozzle alignment.
4. a kind of for removing MEMS chip Cap as described in any one of claims 1 to 3
Apparatus for removing, it is characterised in that described apparatus for removing also includes for controlling described MEMS chip
Controller.
A kind of apparatus for removing for removing MEMS chip Cap,
It is characterized in that, described controller includes the tweezers for clamping described substrate two ends.
6. a kind of for removing MEMS chip Cap as described in any one of claims 1 to 3
Apparatus for removing, it is characterised in that described apparatus for removing also includes that baffle plate, described baffle plate blow described in being positioned at
One end of wind device blowing, described MEMS chip is between described baffle plate and hair-dryer.
A kind of apparatus for removing for removing MEMS chip Cap,
It is characterized in that, described baffle plate two ends are respectively arranged with accessory plate, and two described accessory plates lay respectively at
The upper and lower of described MEMS chip.
8. a kind of for removing MEMS chip Cap as described in any one of claims 1 to 3
Apparatus for removing, it is characterised in that described apparatus for removing also includes the inspection being electrically connected with described hair-dryer
Surveying device, described detector is for detecting the heating-up temperature of described heater, when described detector detects
The blowing of described hair-dryer is controlled when the heating-up temperature of described heater is between 500 degree to 600 degree；When
Described detector detects that the heating-up temperature of described heater is less than 500 degree or higher than 600 degree of control institutes
State hair-dryer not work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620518693.8U CN205634875U (en) | 2016-05-31 | 2016-05-31 | A remove device for removing MEMS chip cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620518693.8U CN205634875U (en) | 2016-05-31 | 2016-05-31 | A remove device for removing MEMS chip cap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205634875U true CN205634875U (en) | 2016-10-12 |
Family
ID=57051807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620518693.8U Active CN205634875U (en) | 2016-05-31 | 2016-05-31 | A remove device for removing MEMS chip cap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205634875U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113044804A (en) * | 2021-03-10 | 2021-06-29 | 苏试宜特(深圳)检测技术有限公司 | Method for removing protective cover of MEMS (micro-electromechanical system) chip |
| CN114720842A (en) * | 2022-06-08 | 2022-07-08 | 合肥新晶集成电路有限公司 | Preparation method of failure analysis structure and failure analysis method |
-
2016
- 2016-05-31 CN CN201620518693.8U patent/CN205634875U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113044804A (en) * | 2021-03-10 | 2021-06-29 | 苏试宜特(深圳)检测技术有限公司 | Method for removing protective cover of MEMS (micro-electromechanical system) chip |
| CN114720842A (en) * | 2022-06-08 | 2022-07-08 | 合肥新晶集成电路有限公司 | Preparation method of failure analysis structure and failure analysis method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205634875U (en) | A remove device for removing MEMS chip cap | |
| CN104833698B (en) | A kind of coal-fired power station boiler flue gas acid dew point detecting system and detection method | |
| CN101975683A (en) | Back blowing warming device in high-temperature smoke sampling system | |
| CN206312963U (en) | A kind of waterproof temperature controlled safe battery box system | |
| CN203164044U (en) | Portable sample concentrator | |
| CN206583196U (en) | Refrigerator | |
| CN209632250U (en) | The LED lamp bead maintenance unit of LED display module | |
| CN204612159U (en) | A kind of air heater | |
| CN212459476U (en) | Engineering structure solid-heat flow coupling experimental device | |
| CN217466626U (en) | Detection apparatus for be used for corrosion resistance of metal welding department | |
| CN207472451U (en) | A kind of automatic temperature-controlled maintenance platform | |
| CN211626082U (en) | Novel bell jar sintering furnace for sintering magnetic materials | |
| CN107160664A (en) | Save the heating arrangement and energy-conservation hot-bending machine of hot-bending machine | |
| CN209612613U (en) | A kind of wet desulfurization flue gas takes off white device | |
| CN207494834U (en) | Blowing device and blower system | |
| CN105722706A (en) | A vehicle-mounted automatic air conditioning system | |
| CN204758515U (en) | Sour dew point hygrometer of coal -fired power plant boiler flue gas | |
| CN206648952U (en) | A kind of atomizer and its igniter | |
| CN221467842U (en) | Anti-fog structure of handheld observation instrument | |
| CN205353299U (en) | Novel diode failure analysis device | |
| CN206121210U (en) | Intelligent control material addition and material temperature's concentrator | |
| CN108459424A (en) | Load transfer station, adhering device and its attaching method | |
| CN208742183U (en) | A kind of stack effect nature demister | |
| CN205897775U (en) | Multifunctional door board drying chamber | |
| CN1173733A (en) | Radiant polishing block heater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong city of Shenzhen province Nanshan District South Road seven Digital Technology Park A1 Building 1 floor B District Patentee after: Suzhou Yite (Shenzhen) Testing Technology Co., Ltd Address before: 518000 Guangdong city of Shenzhen province Nanshan District South Road seven Digital Technology Park A1 Building 1 floor B District Patentee before: SHENZHEN YITE DETECTION TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |