CN113038796B - Heat storage type radiator based on multiple phase change working media - Google Patents
Heat storage type radiator based on multiple phase change working media Download PDFInfo
- Publication number
- CN113038796B CN113038796B CN202110255766.4A CN202110255766A CN113038796B CN 113038796 B CN113038796 B CN 113038796B CN 202110255766 A CN202110255766 A CN 202110255766A CN 113038796 B CN113038796 B CN 113038796B
- Authority
- CN
- China
- Prior art keywords
- phase change
- cavity
- alloy
- multiple phase
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention discloses a heat storage type radiator based on multiple phase change working media, which relates to the technical field of heat dissipation of missile-borne electronic equipment and comprises a cavity and multiple phase change working media arranged in the cavity; the multiple phase change working medium comprises an organic phase change material and a plurality of alloy cylinders; the organic phase-change material is deposited between the adjacent alloy columns and between the alloy columns and the cavity wall of the cavity to form an organic phase-change material body; the first cavity wall of the cavity is a cold plate; one side of the cold plate is in contact with one side of the multiple phase change working medium, and the other side of the cold plate is connected with the electronic equipment through the heat expansion graphite layer. The invention can realize the cooperative reinforcement of heat conduction performance and natural convection in the melting process of multiple phase-change working media, thereby improving the heat dissipation performance of the missile-borne electronic equipment radiator and ensuring the working precision and working performance of a missile system.
Description
Technical Field
The invention relates to the technical field of heat dissipation of missile-borne electronic equipment, in particular to a heat storage type heat radiator based on multiple phase change working media.
Background
With the wide application of very large scale integrated circuits and high power electronic devices in missile-borne electronic equipment, the local heat flux density of the missile-borne electronic equipment in the working process is increased along with the improvement of the integration level, and a high-efficiency heat dissipation technology is urgently needed. Due to the fact that missile-borne electronic equipment is different from conventional electronic equipment, the improvement of performance is strictly limited by the internal space and the self weight of the missile-borne electronic equipment, the external working environment can be changed violently during working, and particularly, the electronic equipment working in the middle flight section and the tail flight section of a missile can generate higher heat flux density. The above problems cause the thermal design of missile-borne electronic devices to be more and more challenging, and if the heat dissipation mode cannot be optimized, the temperature of the electronic devices can be rapidly increased, so that certain damage is caused, and the striking precision of a missile system is obviously influenced. And when the temperature exceeds a critical value, some electronic devices can be completely failed, and the success or failure of the whole missile system combat mission is seriously influenced.
Aiming at the thermal design of missile-borne electronic equipment, most of the existing equipment passively absorbs electronic devices by means of the heat capacity of a metal component of the equipment and a heat sink transient heat storage technology taking a phase change material as a coreHeat generated during operation. As the requirements for the weight and volume of the whole system become more severe, not only the weight of the metal member itself is limited, but also the heat capacity thereof gradually fails to meet the heat consumption of the electronic device. The traditional metal heat storage materials are mostly brass and aluminum alloy, the weight of the brass and the aluminum alloy is respectively 10 times and 3 times of that of paraffin, but the specific heat capacity is 395 J.kg -1 ·K -1 And 921J kg -1 ·K -1 Only one fifth and one half of the paraffin wax. Therefore, the phase change material is used for replacing a metal device to design a phase change thermal storage type heat radiator with an energy buffering effect, and an effective solution is provided in the aspect of preventing the overload failure of the missile-borne electronic device.
The core of phase change energy storage is Phase Change Material (PCM), and the selection of proper PCM plays an important role in the effective utilization of an energy storage system. Commonly used working media are divided into organic phase change materials, inorganic phase change materials, composite phase change materials and low-melting-point alloys. Among them, the organic phase change material represented by paraffin has the advantages of large latent heat of fusion, low cost, stable physicochemical properties, and the like, thereby being widely applied. The paraffin has low heat conductivity coefficient, so that the storage and release of energy in the working process of the radiator are seriously hindered. In order to improve the efficiency of phase change energy storage, the method is realized by adding a porous medium, nano particles with high thermal conductivity, a heat pipe, fins and the like into the PCM. While these methods help to improve the thermal conductivity of the paraffin, they also inhibit natural convection during the melting of the paraffin.
Disclosure of Invention
The invention aims to provide a heat storage type radiator based on multiple phase change working media, which realizes the cooperative reinforcement of heat conduction performance and natural convection in the melting process of the multiple phase change working media, and further improves the working precision and working performance of a missile system.
In order to achieve the purpose, the invention provides the following scheme:
a heat storage type radiator based on multiple phase change working media comprises a cavity and the multiple phase change working media arranged in the cavity; the multiple phase change working medium comprises an organic phase change material and a plurality of alloy cylinders; injecting the organic phase-change material between the adjacent alloy columns and between the alloy columns and the cavity wall of the cavity to form an organic phase-change material body;
the first cavity wall of the cavity is a cold plate; one side of the cold plate is in contact with one side of the multiple phase change working medium, and the other side of the cold plate is connected with the electronic equipment through the heat expansion graphite layer.
Optionally, the second cavity wall of the cavity is a top cover parallel to the cold plate, and a first air cavity is arranged between the top cover and the other side of the multiple phase change working medium.
Optionally, the organic phase change material body is provided with a plurality of second air cavities; the first open end and the second open end are arranged in the second air cavity, the first open end of the second air cavity is in contact with one surface of the cold plate, and the second open end of the second air cavity is communicated with the first air cavity.
Optionally, the second air cavity is arranged between the two alloy columns.
Optionally, the phase transition temperatures of the organic phase change material and the alloy pillar are both higher than an initial ambient temperature and lower than a maximum safe temperature of the electronic device.
Optionally, the temperature range of the phase change temperature difference is 20-30 ℃; the phase change temperature difference is the difference between the phase change temperature of the organic phase change material and the phase change temperature of the alloy column.
Optionally, the temperature ranges of the phase transition temperatures of the organic phase change material and the alloy column are both 35 to 110 ℃, and the phase transition temperature of the alloy column is lower than the phase transition temperature of the organic phase change material.
Optionally, a third cavity wall of the cavity is a base perpendicular to the cold plate; the base body, the top cover and the cold plate are all made of metal.
Optionally, the base body and the top cover are made of aluminum alloy; the cold plate is made of red copper.
Optionally, the alloy cylinder is made of an InSnBi alloy; the organic phase change material is paraffin.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
according to the missile-borne electronic equipment radiator, the multiple phase change working media composed of the organic phase change material and the low-melting-point alloy are arranged, so that the heat conduction performance and natural convection are cooperatively enhanced in the melting process of the multiple phase change working media, the heat dissipation performance of the missile-borne electronic equipment radiator is further improved, and the working precision and the working performance of a missile system are ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a front sectional view of a heat storage type heat radiator based on multiple phase change working media according to the present invention;
fig. 2 is a top sectional view of the heat storage type heat sink based on multiple phase change working media according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a heat storage type radiator based on multiple phase change working media, which realizes the cooperative enhancement of heat conduction performance and natural convection in the melting process of the multiple phase change working media by replacing a phase change heat storage type radiator for radiating heat of a missile-borne electronic device. The volume and the weight of the heat storage type radiator can be obviously reduced under the same heat dissipation effect, or the working temperature of electronic equipment is obviously reduced under the condition of the same volume/weight of the heat storage type radiator, so that the working precision and the working performance of the missile system are improved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Interpretation of professional terms
Pcm (phase Change material): refers to a substance that absorbs or releases latent heat by changing the state of the substance while maintaining a certain temperature. Such substances are generally classified into organic phase change materials, inorganic phase change materials, composite phase change materials, and metals.
Phase Change Thermal Storage Based Heat Sink (Phase Change Thermal Storage Based Heat Sink): the heat radiator utilizes the latent heat absorbed by the phase-change material in the phase-change process to realize the storage and utilization of energy so as to complete the heat radiation function.
The Multiple Phase Change Materials are Materials which are cooperatively arranged by two or more different types of single Phase Change Materials so as to improve the overall heat exchange performance.
The invention aims at the problem that the prior composite phase-change working medium can not realize the cooperative enhancement of natural convection and heat conductivity in the melting process, so that a novel multiple phase-change working medium combined by two single working media of paraffin and low-melting-point alloy becomes the key for improving the phase-change heat exchange performance, the working medium can cooperatively enhance the heat conductivity and the natural convection in the melting process, the realization of the combination of the two is realized, and the heat radiation performance of the radiator of the missile-borne electronic equipment is further improved.
The invention mainly changes the working medium of the energy storage radiator in the missile-borne electronic equipment, and adds a graphite layer expansion surface with high thermal conductivity between a cold plate and an electronic device so as to uniformly distribute the temperature of the electronic device on the cold plate.
As shown in fig. 1, the heat storage type heat sink based on multiple phase change working mediums provided in this embodiment includes a cavity and multiple phase change working mediums arranged inside the cavity; the multiple phase change working medium comprises an organic phase change material 4 and a plurality of alloy cylinders 2; the organic phase change material 4 is injected between adjacent alloy cylinders 2 and between the alloy cylinders 2 and the cavity wall of the cavity to form organic phase change material bodies. Wherein, the alloy cylinder 2 is a low melting point alloy cylinder.
The first cavity wall of the cavity is a cold plate 6; one side of the cold plate 6 is in contact with one side of the multiple phase change working medium, and the other side of the cold plate 6 is connected with the electronic equipment through the heat expansion graphite layer 7.
As a preferred embodiment, the multiple phase change working medium provided in this embodiment has an air cavity 3 therein, and an air cavity 3 is also provided between the multiple phase change working medium and the cavity wall. Specifically, the second cavity wall of the cavity is a top cover 1 parallel to the cold plate 6, and a first air cavity is arranged between the top cover 1 and the other side of the multiple phase change working medium. The organic phase change material body is provided with a plurality of second air cavities; the second air cavity is provided with a first opening end and a second opening end, the first opening end of the second air cavity is in contact with one surface of the cold plate 6, and the second opening end of the second air cavity is communicated with the first air cavity. Preferably, the second air chamber is arranged between two of the alloy cylinders 2.
As a preferred embodiment, the third cavity wall of the cavity provided in this embodiment is a base 5 perpendicular to the cold plate 6, that is, the cavity provided in this embodiment is composed of the cold plate 6, the base 5, and the top cover 1; wherein the base body 5, the top cover 6 and the top cover 1 are made of metal.
As a preferred specific implementation manner, the material of the base body 5 and the top cover 1 provided in this embodiment is an aluminum alloy; the cold plate 6 is made of red copper.
As a preferred embodiment, the phase transition temperature of the organic phase change material 4 and the phase transition temperature of the alloy pillar 2 provided in this embodiment are both higher than the initial environment temperature and lower than the maximum safe temperature of the electronic device.
As a preferred embodiment, the temperature range of the phase transition temperature difference provided by this embodiment is 20-30 ℃; the phase change temperature difference is the difference between the phase change temperature of the organic phase change material 4 and the phase change temperature of the alloy cylinder 2.
As a preferred specific implementation manner, the temperature ranges of the phase transition temperatures of the organic phase change material 4 and the alloy pillar 2 provided in this embodiment are both 35 to 110 ℃, and the phase transition temperature of the alloy pillar 2 is lower than the phase transition temperature of the organic phase change material 4.
As a preferred specific implementation manner, the material of the alloy cylinder 2 provided in this embodiment is an InSnBi alloy; the organic phase change material 4 is paraffin.
Fig. 2 is a top view of the thermal storage heat sink, and the shape, position and amount of the low melting point alloy package are not limited to those shown in fig. 2, and may be designed according to the heat flux density of the specific cooling target.
The working process of the heat storage type radiator is as follows:
during the flight of the missile, the internal missile-borne electronic equipment presents different working states in different flight phases. The missile-borne electronic equipment has the characteristics of instantaneity and intermittence when heating, a large amount of generated heat is rapidly and uniformly transferred to the cold plate 6 through the heat expansion graphite layer 7, and the cold plate 6 transfers the heat to the low-melting-point alloy cylinder and the organic phase change material 4 in the heat storage type radiator. The thermal conductivity coefficient of the low-melting-point alloy cylinder is two orders of magnitude higher than that of the organic phase change material 4, so that the heat transfer to the upper organic phase change material 4 is accelerated. And the low-melting-point alloy cylinder has low melting point and high density and is melted before the organic phase-change material 4. After the organic phase-change material 4 is melted, the density difference generates strong disturbance, so that the natural convection effect inside the heat storage type radiator is enhanced, the melting process of the mixed material (namely, the multiple phase-change working medium) is accelerated, the heat absorption rate is greatly improved, and the temperature of the electronic equipment is maintained in a proper temperature range.
Compared with the prior art, the innovation part of the application is as follows:
1. a mixed phase-change material consisting of low-melting-point alloy and an organic phase-change material is used as a heat exchange working medium of the phase-change heat storage type radiator to replace a traditional single phase-change material or a traditional composite phase-change material. Different low-melting-point alloys and organic phase-change material combinations are used according to different working conditions of the missile-borne electronic equipment, for example, an InSnBi alloy-paraffin wax mixed phase-change working medium is used, and the mass fraction and different packaging positions of the alloys can be changed to adapt to different working environments.
2. According to the specific working condition of the missile-borne electronic equipment, a proper low-melting-point alloy and an organic phase-change material are selected to be packaged into a heat storage type radiator together, the phase-change temperature of the low-melting-point alloy and the phase-change material is selected to be 35-110 ℃, the phase-change temperature of the low-melting-point alloy is lower than that of the organic phase-change material, the phase-change temperature of the low-melting-point alloy and the phase-change material is higher than the initial environment temperature and lower than the highest safety temperature of the electronic equipment, and the temperature difference of about 20-30 ℃ is recommended to be kept. The organic phase-change material should be selected from materials with large heat capacity, stable physicochemical properties, safety and no toxicity.
3. In order to quickly transfer the heat of the electronic equipment, the cold plate is made of red copper with excellent mechanical property and thermodynamic property so as to ensure smaller heat transfer resistance, a heat expansion graphite layer with high heat conductivity is added between the cold plate and the electronic equipment, and the top cover and the base body are made of metal with stronger mechanical property and environmental adaptability, such as brass and aluminum alloy with excellent heat conductivity.
4. Considering the thermal expansion after the working medium is melted and the volume change caused by extruding the organic phase-change material after the alloy is melted due to the gravity factor, a certain space needs to be reserved at the top part when the working medium is packaged, and a certain number of cavities need to be reserved inside the working medium, so that the natural convection can be fully developed.
The method of using a traditional metal component to absorb heat by self heat capacity in the cooling of missile-borne electronic equipment is gradually limited by the weight of the system, and compared with the metal component, the method of using a single phase-change material or a composite phase-change material can reduce the weight and increase the heat capacity, but with the application of a very large scale integrated circuit, the materials can not meet the working condition of high heat flow density, and the reinforced heat exchange in a limited space reaches the bottleneck state. In order to further improve the heat dissipation performance, an alloy-organic phase change material multiple phase change working medium is introduced as a heat exchange medium, and the working medium can generate violent disturbance due to the large density difference of the two materials in the melting process, so that the effect of natural convection is obviously enhanced. Meanwhile, the addition of the low-melting-point alloy improves the equivalent heat-conducting property of the working medium, and the heat at the bottom can be quickly transferred to the upper-layer organic phase-change material at the initial working stage. The whole process has the synergistic strengthening effect on the heat conducting performance and the natural convection, and simultaneously, the purposes of reducing the system weight and increasing the overall heat capacity are also considered, so that the heat dissipation performance of the missile-borne electronic equipment is further improved, and the application prospect in the field is very wide.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (8)
1. A heat storage type radiator based on multiple phase change working media is characterized by comprising a cavity and multiple phase change working media arranged in the cavity; the multiple phase change working medium comprises an organic phase change material and a plurality of alloy cylinders; injecting the organic phase-change material between the adjacent alloy columns and between the alloy columns and the cavity wall of the cavity to form an organic phase-change material body;
the first cavity wall of the cavity is a cold plate; one surface of the cold plate is in contact with one surface of the multiple phase change working medium, and the other surface of the cold plate is connected with electronic equipment through a heat expansion graphite layer;
the second cavity wall of the cavity is a top cover parallel to the cold plate, and a first air cavity is arranged between the top cover and the other side of the multiple phase change working medium; the organic phase change material body is provided with a plurality of second air cavities; the second air cavity is provided with a first opening end and a second opening end, the first opening end of the second air cavity is in contact with one surface of the cold plate, and the second opening end of the second air cavity is communicated with the first air cavity;
the phase transition temperature of the alloy cylinder is lower than that of the organic phase transition material.
2. The thermal storage heat sink based on multiple phase-change working mediums of claim 1, wherein the second air cavity is disposed between two of the alloy columns.
3. The thermal storage type heat sink based on multiple phase change working mediums of claim 1, wherein the phase change temperatures of the organic phase change material and the alloy pillar are higher than an initial environment temperature and lower than a maximum safe temperature of the electronic device.
4. The heat storage type heat radiator based on multiple phase change working media according to claim 1, wherein the temperature range of the phase change temperature difference is 20-30 ℃; the phase change temperature difference is the difference between the phase change temperature of the organic phase change material and the phase change temperature of the alloy cylinder.
5. The heat storage type heat radiator based on multiple phase change working media as claimed in claim 1, wherein the phase change temperatures of the organic phase change material and the alloy cylinder are both in the range of 35-110 ℃.
6. The heat storage radiator based on multiple phase change working media according to claim 1, wherein the third cavity wall of the cavity is a base body perpendicular to the cold plate; the base body, the top cover and the cold plate are all made of metal.
7. The heat storage type radiator based on multiple phase change working media according to claim 6, wherein the base body and the top cover are made of aluminum alloy; the cold plate is made of red copper.
8. The heat storage type heat radiator based on the multiple phase change working media as claimed in claim 1, wherein the alloy cylinder is made of an InSnBi alloy; the organic phase change material is paraffin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110255766.4A CN113038796B (en) | 2021-03-09 | 2021-03-09 | Heat storage type radiator based on multiple phase change working media |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110255766.4A CN113038796B (en) | 2021-03-09 | 2021-03-09 | Heat storage type radiator based on multiple phase change working media |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113038796A CN113038796A (en) | 2021-06-25 |
| CN113038796B true CN113038796B (en) | 2022-08-30 |
Family
ID=76467313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110255766.4A Active CN113038796B (en) | 2021-03-09 | 2021-03-09 | Heat storage type radiator based on multiple phase change working media |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113038796B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611807A (en) * | 2016-01-30 | 2016-05-25 | 清华大学 | Integrated heat sink based on metal phase-change material and heat pipes |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10157671A1 (en) * | 2001-11-24 | 2003-06-05 | Merck Patent Gmbh | Optimized use of PCM in cooling devices |
| CN106052452A (en) * | 2016-06-03 | 2016-10-26 | 清华大学 | Composite phase-change heat sink based on low-melting-point metal phase-change material |
| CN106918259B (en) * | 2017-01-20 | 2019-06-28 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Rapid thermal response composite phase-change heat-storage device and preparation method thereof |
| US10043732B1 (en) * | 2017-06-05 | 2018-08-07 | United Arab Emirates University | Heat sink |
| CN211352892U (en) * | 2019-11-25 | 2020-08-25 | 东南大学 | Power amplifier heat dissipation device based on novel heat pipe and energy storage material |
| CN112351650A (en) * | 2020-10-30 | 2021-02-09 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Design method of missile-borne transient thermal control electronic module composite phase change cold plate |
-
2021
- 2021-03-09 CN CN202110255766.4A patent/CN113038796B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611807A (en) * | 2016-01-30 | 2016-05-25 | 清华大学 | Integrated heat sink based on metal phase-change material and heat pipes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113038796A (en) | 2021-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9909816B2 (en) | Thermal management system | |
| US11035621B2 (en) | Electronics cooling with multi-phase heat exchange and heat spreader | |
| CA2964864C (en) | Thermal capacitance system | |
| EP1264343B1 (en) | Apparatus and method for passive phase change thermal management | |
| CN106918259B (en) | Rapid thermal response composite phase-change heat-storage device and preparation method thereof | |
| US20120061065A1 (en) | Heat-absorbing structural material | |
| CN108601288B (en) | High-power matrix fin enhanced heat exchange phase change heat sink | |
| CN101578029A (en) | Phase-change temperature control device integrating heat pipe and foam metal core body | |
| CN106052452A (en) | Composite phase-change heat sink based on low-melting-point metal phase-change material | |
| CN104244677B (en) | The phase-change temperature control device of electronic heating component and manufacture method thereof | |
| CN105611807A (en) | Integrated heat sink based on metal phase-change material and heat pipes | |
| CN107116279A (en) | Integration system for foam metal phase change temperature control component method | |
| CN208523116U (en) | A kind of finned phase transition heat sink | |
| CN107623154A (en) | The cylindrical battery pack heat dissipation device and method of a kind of radiated rib using composite phase-change material | |
| US11243032B2 (en) | Heat sink devices and methods of using such devices for thermal management | |
| CN111397418A (en) | Three-dimensional steam cavity type phase-change heat storage device | |
| CN113038796B (en) | Heat storage type radiator based on multiple phase change working media | |
| CN113207271B (en) | Phase-change energy-storage type radiator | |
| KR20190029710A (en) | Regenerative heat exchanger structure using phase change material | |
| KR102293590B1 (en) | Thermal management module for battery of electric aircraft | |
| CN113163672B (en) | Phase change heat storage type radiator utilizing thermal expansion of phase change material | |
| CN114525431A (en) | Aluminum-based phase-change heat storage alloy composite material and preparation method thereof | |
| CN109163591B (en) | High-power phase change energy storage heat exchanger | |
| CN115529807A (en) | Thermal buffer | |
| CN216354171U (en) | Heat control heat dissipation device and equipment thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |