CN113036048A - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- CN113036048A CN113036048A CN201911360328.3A CN201911360328A CN113036048A CN 113036048 A CN113036048 A CN 113036048A CN 201911360328 A CN201911360328 A CN 201911360328A CN 113036048 A CN113036048 A CN 113036048A
- Authority
- CN
- China
- Prior art keywords
- layer
- display device
- water
- barrier layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 113
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000000903 blocking effect Effects 0.000 claims abstract description 38
- 238000010521 absorption reaction Methods 0.000 claims description 33
- -1 polyethylene terephthalate Polymers 0.000 claims description 23
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 12
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000292 calcium oxide Substances 0.000 claims description 10
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 10
- 239000002274 desiccant Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 6
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 229920002396 Polyurea Polymers 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 230000002745 absorbent Effects 0.000 claims description 3
- 239000002250 absorbent Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 23
- 239000001301 oxygen Substances 0.000 abstract description 23
- 229910052760 oxygen Inorganic materials 0.000 abstract description 23
- 230000002035 prolonged effect Effects 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 269
- 238000000034 method Methods 0.000 description 26
- 239000011368 organic material Substances 0.000 description 19
- 230000008569 process Effects 0.000 description 19
- 239000010408 film Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 16
- 230000035882 stress Effects 0.000 description 16
- 238000004806 packaging method and process Methods 0.000 description 12
- 229910010272 inorganic material Inorganic materials 0.000 description 10
- 239000011147 inorganic material Substances 0.000 description 10
- 239000011358 absorbing material Substances 0.000 description 8
- 238000007641 inkjet printing Methods 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 6
- 238000000231 atomic layer deposition Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000003811 curling process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display device which comprises a substrate base plate, an organic light-emitting diode device, a first blocking layer, a water absorbing layer, a flat layer and a second blocking layer, wherein the organic light-emitting diode device is positioned on the substrate base plate, the first blocking layer covers the organic light-emitting diode device, the water absorbing layer is positioned on the periphery of the first blocking layer, the flat layer covers the first blocking layer and the water absorbing layer, and the second blocking layer covers the surface and the periphery of the flat layer. The mode that adopts barrier layer and flat layer to set up in turn can promote the performance of display device separation water oxygen, can flat the device simultaneously, alleviates the display device and takes place the internal stress that produces when buckling and curling, and the protection display device does not receive the damage. The water absorbing layer is arranged around the first blocking layer, so that the water absorbing performance of the device can be enhanced, the moisture in the device can be absorbed, and the service life of the display device can be prolonged. The layer that absorbs water only sets up around the OLED device, and avoids the top of OLED device, can prevent to absorb water the layer and shelter from the light outgoing of OLED device, guarantees the emergence efficiency of OLED device.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display device.
Background
Organic Light Emitting Diode (OLED) display panels have the characteristics of fast response speed and being Light and thin, and are currently applied to the fields of mobile display devices, television devices and the like.
The service life of the OLED device is an important factor that restricts the development of the OLED industry. The factors influencing the service life of the OLED device are many, and the OLED device has physical factors such as a device structure, a circuit driving mode and the like; there are also chemical factors such as oxidation of the metal cathode, crystallization and aging of the organic material, etc. There have been many studies that have shown that the presence of moisture inside an OLED device is a major factor affecting the lifetime of the OLED.
Although the current OLED packaging technology can play a role in blocking external water vapor, the water absorption capacity is still limited, the edge peeling is caused due to poor flexibility of an OLED device, the water vapor is caused to permeate in an accelerated manner, the service life of the device is influenced by the internal water vapor, and therefore the improvement of the water absorption performance of the OLED device is the primary task of improving the OLED device.
Disclosure of Invention
The invention provides a display device which is used for reducing water vapor in an OLED device and prolonging the service life of the OLED device.
The present invention provides a display device including:
the substrate base plate has supporting and bearing functions;
an organic light emitting diode device located on the substrate base plate;
the first blocking layer covers the surface and the periphery of one side, away from the substrate, of the organic light-emitting diode device;
the water absorption layer is positioned on the periphery of the first blocking layer, and the orthographic projection of the water absorption layer on the substrate base plate and the orthographic projection of the organic light-emitting diode device on the substrate base plate are not overlapped with each other;
the flat layer covers the surfaces of the first barrier layer and the water absorption layer on the side away from the substrate;
and the second barrier layer covers the surface and the periphery of one side of the flat layer, which deviates from the substrate base plate.
In a possible implementation manner, the display device provided by the present invention further includes:
and the buffer layer covers the surface and the periphery of one side of the second barrier layer, which deviates from the substrate base plate.
In a possible implementation manner, in the display device provided by the invention, the nano water-absorbing particles are dispersed in the flat layer.
In a possible implementation manner, in the display device provided by the invention, the buffer layer is dispersed with nano water-absorbing particles.
In a possible implementation manner, in the display device provided by the present invention, at least one of calcium oxide, barium oxide, and aluminum oxide is used as the nano water-absorbing particles.
In one possible implementation manner, in the display device provided by the present invention, the water-absorbing layer includes:
an organic medium as a matrix;
a desiccant dispersed in the organic medium;
the drying agent is at least one of calcium oxide, barium oxide and aluminum oxide.
In a possible implementation manner, in the display device provided by the invention, the material used for the first barrier layer and the second barrier layer includes at least one of aluminum oxide, titanium dioxide, zirconium dioxide, magnesium oxide, hafnium dioxide, tantalum pentoxide, silicon nitride, aluminum nitride, silicon oxynitride, silicon monoxide, silicon dioxide, and silicon carbide.
In a possible implementation manner, in the display device provided by the invention, the thickness of the first barrier layer is 0.01 μm to 5 μm, and the thickness of the second barrier layer is 0.01 μm to 5 μm.
In a possible implementation manner, in the above display device provided by the present invention, the material used for the planarization layer includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, polystyrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polydiethylsulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene, and epoxy resin;
the buffer layer is made of at least one of epoxy resin, acrylic resin and silicon resin.
In a possible implementation manner, in the display device provided by the invention, the thickness of the flat layer is 1 μm to 50 μm, and the thickness of the buffer layer is 1 μm to 50 μm.
The invention has the following beneficial effects:
the present invention provides a display device including: the substrate base plate has supporting and bearing functions; an organic light emitting diode device located on the substrate base plate; the first blocking layer covers the surface and the periphery of one side, away from the substrate, of the organic light-emitting diode device; the water absorption layer is positioned on the periphery of the first blocking layer, and the orthographic projection of the water absorption layer on the substrate and the orthographic projection of the organic light-emitting diode device on the substrate are not overlapped; the flat layer covers the surfaces of the first blocking layer and the water absorbing layer on the side departing from the substrate; and the second barrier layer covers the surface and the periphery of one side of the flat layer, which is far away from the substrate. The mode that adopts barrier layer and flat layer to set up in turn can promote the performance of display device separation water oxygen, can flat the device simultaneously, alleviates the display device and takes place the internal stress that produces when buckling and curling, and the protection display device does not receive the damage. The water absorbing layer is arranged around the first blocking layer, so that the water absorbing performance of the device can be enhanced, the moisture in the device can be absorbed, and the service life of the display device can be prolonged. The layer that absorbs water only sets up around the OLED device, and avoids the top of OLED device, can prevent to absorb water the layer and shelter from the light outgoing of OLED device, guarantees the emergence efficiency of OLED device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a display device according to an embodiment of the invention;
fig. 2 is a schematic top view of a display device according to an embodiment of the present invention;
fig. 3 is a second schematic cross-sectional view of a display device according to an embodiment of the invention;
fig. 4 is a third schematic cross-sectional view illustrating a display device according to an embodiment of the invention;
FIG. 5 is a fourth schematic cross-sectional view of a display device according to an embodiment of the present invention;
fig. 6 is a flowchart of a packaging method of a display device according to an embodiment of the present invention;
fig. 7a to 7d are schematic cross-sectional structures of a display device corresponding to steps of an encapsulation method according to an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are for illustrative purposes only and do not represent true scale.
The embodiment of the invention provides a display device, which can be an OLED display, an OLED panel or an OLED television and other display equipment, and also can be a mobile terminal such as a mobile phone, a tablet personal computer or an intelligent photo album. An OLED is a device that generates electroluminescence using a multi-layer organic thin film structure, is easier to fabricate than other display devices, and requires a lower driving voltage. The OLED display is thinner and lighter than the LCD, has high brightness, low power consumption, fast response, high definition, good flexibility, and high light emitting efficiency, and is currently applied to various fields such as mobile display devices and television devices.
Organic light emitting materials and metal materials with high activity are generally used in OLED display devices, and these materials are liable to react with water and oxygen when meeting with water and oxygen in the environment, thereby destroying the performance of the materials themselves. In view of this, embodiments of the present invention provide a display device, and provide an improved encapsulation structure, which can not only block external water and oxygen, but also absorb moisture inside an OLED light emitting device, so as to prolong the service life of the OLED device.
Fig. 1 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention, and fig. 2 is a schematic top-view structure diagram of the display device according to the embodiment of the present invention, as shown in fig. 1 and fig. 2, the display device according to the embodiment of the present invention includes:
the substrate base plate 11 has supporting and bearing functions.
In specific implementation, the substrate can be a glass substrate, the glass substrate has the advantages of good stability and low cost, and a circuit can be formed on the glass substrate by adopting an etching process and used for driving the OLED device. The OLED display device has the advantages that the flexible substrate can be adopted, the flexible OLED does not use a glass substrate, and the screen can be bent to realize flexible display. The flexible substrate can be made of polyimide PI and the like, a driving circuit for controlling the OLED is formed by patterning the surface of the flexible substrate, and flexible display of the OLED display device can be achieved by matching with a thin film packaging process.
And an organic light emitting diode device 12 located on the substrate base plate 11.
The structure of the organic light emitting diode device 12 may include an anode, a light emitting layer, and a cathode. In general, after the driving lines are formed, a flat layer may be formed, and the flat layer has a connection electrode thereon for connecting the driving lines, and the connection circuit is used for connecting the electrodes of the OLED device, so as to achieve electrical connection between the driving lines and the OLED device. And forming a pattern of mutually separated anodes on the flat layer, wherein each anode is connected with the connecting electrode, forming an organic light-emitting layer on the pattern of the anode after forming the pattern of the anode, and forming a cathode of the whole layer above the organic light-emitting layer to finish the preparation of the organic light-emitting diode device. The light emitting layer in the organic light emitting diode device 12 may be a light emitting material emitting light of the same color, or may be a light emitting material emitting light of different colors, and may be set according to actual needs, which is not limited herein.
The first blocking layer 13 covers a surface and a periphery of the organic light emitting diode device 12 on a side away from the substrate 11.
The first barrier layer 13 in the embodiment of the present invention is used to protect the OLED device 12 and prevent external water and oxygen from eroding the OLED device 12. The first blocking layer 13 completely covers the surface and the peripheral side surfaces of the OLED device 12, so that the OLED device 12 inside can be protected in all directions, and external water and oxygen can be blocked from entering the OLED device. The first barrier layer 13 in the embodiment of the invention can be made of an inorganic material, and the inorganic material has good compactness and can effectively prevent external water and oxygen from entering the device.
And the water absorption layer 14 is positioned at the periphery of the first barrier layer 13, and the orthographic projection of the water absorption layer 14 on the substrate 11 and the orthographic projection of the organic light-emitting diode device 12 on the substrate 11 are not overlapped.
The water absorbent layer 14 is disposed adjacent to the first barrier layer 13 and surrounds the first barrier layer 13. The water absorption layer 14 can absorb moisture in the OLED device and protect the OLED device from being corroded. As shown in fig. 2, in the embodiment of the present invention, the water-absorbing layer 13 is disposed around the first blocking layer 13, and as shown in fig. 3, an orthographic projection of the water-absorbing layer 14 on the substrate 11 and an orthographic projection of the OLED device 12 on the substrate 11 do not overlap with each other, that is, the water-absorbing layer 14 is disposed only on a side surface and is not disposed above the OLED device 12, so that the water-absorbing layer 14 can be prevented from blocking the light emitted from the OLED device 12, and the light-emitting efficiency of the display device is protected from being affected.
And a flat layer 15 covering the surfaces of the first barrier layer 13 and the water absorbing layer 14 on the side away from the substrate 11.
The first barrier layer 13 and the water absorbing layer 14 are used for blocking external water, oxygen and absorbing water, and only the thickness with the functions of blocking and absorbing water is needed during manufacturing, so that the surface of the OLED device is not flat after the first barrier layer 13 and the water absorbing layer 14 are manufactured, which affects the manufacturing of other film layers formed above the OLED device, and therefore, in the embodiment of the invention, the flat layer 15 is formed on the surface of the first barrier layer 13 and the surface of the water absorbing layer 14, which are away from the substrate 11, and is used for a flat device structure, and internal stress generated in the process of bending and curling of the device can be buffered. The flat layer 14 can be made of an organic material, and the organic material has good elasticity, so that the stress inside the device can be effectively relieved, and the device is prevented from being damaged when being bent or curled.
And the second barrier layer 16 covers the surface and the periphery of one side of the flat layer 15, which faces away from the substrate base plate 11.
The second barrier layer 16 is formed on the surface of the lower film and the side surfaces around the devices below, and the second barrier layer 16 further enhances the barrier performance of the package structure. The second barrier layer 16 has the same function as the first barrier layer 13, and both have the function of blocking water and oxygen. The material used for the second barrier layer 16 may be the same as that used for the first barrier layer 13.
The mode that adopts barrier layer and flat layer to set up in turn can promote the performance of display device separation water oxygen, can flat the device simultaneously, alleviates the display device and takes place the internal stress that produces when buckling and curling, and the protection display device does not receive the damage. The water absorbing layer is arranged around the first blocking layer, so that the water absorbing performance of the device can be enhanced, the moisture in the device can be absorbed, and the service life of the display device can be prolonged. The layer that absorbs water only sets up around the OLED device, and avoids the top of OLED device, can prevent to absorb water the layer and shelter from the light outgoing of OLED device, guarantees the emergence efficiency of OLED device.
Fig. 3 is a second schematic cross-sectional structure diagram of a display device according to an embodiment of the present invention, and as shown in fig. 3, the display device according to the embodiment of the present invention further includes:
and the buffer layer 17 covers the surface and the periphery of one side of the second barrier layer 16, which is far away from the substrate base plate 11.
The buffer layer 17 is located on the outer side of the second barrier layer 16, covers all the films below and the side faces of the films, and the edge of the buffer layer 17 completely covers and exceeds the second barrier layer 16, so that the internal stress generated in the bending process of the second barrier layer 16 can be relieved, the second barrier layer is prevented from being broken, and the second barrier layer 16 is protected from warping and breaking away from the substrate in the curling process. The buffer layer 17 can be made of an organic material, and the organic material has good elasticity, so that the stress inside the device can be effectively relieved, and the device is prevented from being damaged when being bent or curled.
Fig. 4 is a third schematic cross-sectional view of a display device according to an embodiment of the present invention, and in an implementation manner, as shown in fig. 4, in the embodiment of the present invention, nano water-absorbing particles 18 may be dispersed in the planarization layer 15.
Fig. 5 is a fourth schematic cross-sectional view of a display device according to an embodiment of the invention, and in another practical implementation manner, as shown in fig. 5, the embodiment of the invention may further disperse the nano water-absorbing particles 18 in the buffer layer 17.
In order to improve the longitudinal water absorption capacity of the encapsulation structure, the embodiment of the invention may disperse the nano water absorbing particles 18 in the planarization layer 15 or the buffer layer 17. Thus, the water absorption layer 14 can absorb water penetrating into the device and generated inside the device at the periphery, and the nano water absorption particles in the flat layer 15 or the buffer layer 17 absorb water longitudinally penetrating into the device, so that the water absorption performance of the packaging structure can be comprehensively improved.
In the embodiment of the present invention, the nano water-absorbing particles may use at least one of calcium oxide, barium oxide and aluminum oxide. The water-absorbing materials such as calcium oxide, barium oxide and aluminum oxide are usually inorganic substances and are in a powder state, so that the water-absorbing materials are more suitable for being doped into organic materials, but both the flat layer 15 and the buffer layer 17 in the embodiment of the present invention can be made of organic materials, so that in practical application, the nano water-absorbing particles 18 can be dispersed into the organic materials of the flat layer 15 or the buffer layer 17, and the nano water-absorbing particles can be directly dispersed into the film layer when the flat layer 15 or the buffer layer 17 is made, so as to improve the longitudinal water-absorbing performance of the package structure.
The water-absorbing material is usually an opaque inorganic material, and in order not to affect the light emission of the OLED device 12, the embodiment of the present invention manufactures the water-absorbing particles to a nanometer level, and the doping ratio of the nano water-absorbing particles 18 is also strictly controlled. In specific implementation, when the nano water-absorbing particles made of any one of the above materials are used, the doping ratio of the nano water-absorbing particles 18 is 10%, so that a good water-absorbing effect can be achieved, and the doping ratio does not affect the light-emitting efficiency of the OLED device 12.
In particular implementations, the water absorbent layer 14 may include an organic medium and a desiccant. Wherein, the organic medium is used as a substrate; a desiccant dispersed in an organic medium; and the drying agent can adopt at least one of calcium oxide, barium oxide and aluminum oxide. In the embodiment of the present invention, one or more of the water absorbing materials are dispersed in a matrix of a resin organic substance such as polyacrylate, so that the raw material of the water absorbing layer can be in a liquid state, and thus, the water absorbing layer can be manufactured by adopting processes such as ink jet printing, spin coating, blade coating, and the like. For example, one or more water-absorbing materials of barium oxide, calcium oxide, and aluminum oxide may be dispersed in the organic matrix and then formed around the first barrier layer 13 by spraying or the like, thereby enhancing the water absorption performance of the package structure.
The first barrier layer 13 and the second barrier layer 16 in the embodiment of the present invention are for blocking water and oxygen, and require high denseness, so Al may be used2O3、TiO2、ZrO2、MgO、HfO2、Ta2O5、Si3N4、AlN、SiN、SiNO、SiO、SiO2At least one material selected from SiOx and SiC. The first barrier layer 13 and the second barrier layer 16 can be made of the inorganic substances to improve the water and oxygen barrier performance, and the inorganic substances generally do not need to have larger thickness to have better barrier effect, so the inorganic materials are usedThe fabrication of the first barrier layer 13 and the second barrier layer 16 facilitates control of the overall thickness of the device.
The first barrier layer 13 and the second barrier layer 16 can be fabricated by using Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Physical Vapor Deposition (PVD), and other processes.
The above process can control the thickness of the first barrier layer 13 and the second barrier layer 16 to be thinner, and the thickness of the first barrier layer 13 and the second barrier layer 16 can be controlled to be 0.01 μm to 5 μm, so that the barrier properties can be better. Therefore, the device can have a good water and oxygen blocking effect without adopting a heavy blocking structure, and the device is beneficial to thinning the whole thickness of the device. When the ALD process is adopted to manufacture the first barrier layer, the thickness of the first barrier layer can reach the nanometer level; the first barrier layer is manufactured by adopting a PECVD process, the thickness of the first barrier layer can reach the micron order, and a proper process can be selected to manufacture the first barrier layer according to the requirement in practical application.
The function of the planarization layer 15 in the embodiment of the present invention is to planarize the device structure, which is more advantageous for further manufacturing other film layer structures on the surface thereof. And the flattening layer also has the effect of relieving the stress of the underlying first barrier layer 13. In the actual manufacturing process, in consideration of the above-described function of the planarization layer 15, it may be manufactured using an organic material having elasticity. The planarization layer 15 may be made of at least one material selected from the group consisting of polyethylene terephthalate PET, polyethylene naphthalate PEN, polycarbonate PC, polyimide PI, polyvinyl chloride PVC, polystyrene PS, polymethyl methacrylate PMMA, polybutylene terephthalate PBT, polysulfone PSO, polydiethylsulfone PES, polyethylene PE, polypropylene PP, polysiloxane, polyamide PA, polyvinylidene fluoride PVDF, ethylene vinyl acetate EVA, ethylene vinyl alcohol copolymer EVAL, polyacrylonitrile PAN, polyvinyl acetate PVAc, Parylene ne, Polyurea poly urea, polytetrafluoroethylene PTFE, and epoxy resin.
In specific implementation, the flat layer 15 may be manufactured by using ink jet printing, spin coating, knife coating, chemical vapor deposition, or other processes, so that the flat layer may completely cover the lower film layer while the surface of the side away from the substrate 11 is a flat surface, which is beneficial to continuously manufacturing the second barrier layer 16 above the flat layer.
The planarization layer 15 is used to planarize the surface structure of the lower film layer, and the thickness of the planarization layer can be larger than that of the first barrier layer 13 in the manufacturing process, and the planarization layer manufactured by any one of the above organic materials in the embodiment of the present invention can have a thickness of 1 μm to 50 μm, so that the planarization layer can play a role in planarizing the surface of the film layer, and can also fully cover the lower first barrier layer 13, so that when the device is bent or curled, the internal stress generated by the first barrier layer 13 can be fully relieved, and the first barrier layer 13 is prevented from being broken.
The buffer layer 17 in the embodiment of the present invention is used to buffer the internal stress generated by the second barrier layer 16 during the bending process, so as to avoid the internal stress from breaking, and in the actual manufacturing process, the buffer layer 17 may be made of an elastic organic material in consideration of the above-mentioned function. The buffer layer 17 may be made of at least one of epoxy resin, acrylic resin, and silicone resin.
In specific implementation, the buffer layer 17 may be manufactured by using processes such as inkjet printing, spin coating, blade coating, and the like, so that the buffer layer 17 completely covers the lower film layer and extends to a region outside the edge of the lower film layer, thereby sufficiently relieving internal stress generated in the bending process of the lower film layer, and avoiding the phenomena of warping and separation from the substrate in the curling process of the barrier layer made of an inorganic material.
In the manufacturing process, the thickness of the buffer layer 17 may be greater than that of the second barrier layer 16, and the thickness of the buffer layer made of any one of the above organic materials in the embodiment of the present invention may be 1 μm to 50 μm, so that the underlying film layer may be fully protected, and when the device is bent or curled, the internal stress generated by the second barrier layer 16 may be fully relieved, thereby preventing the second barrier layer 16 from being broken.
Therefore, the embodiment of the invention adopts the packaging structure with the organic layers and the inorganic layers alternately arranged, so that the packaging structure not only can block water and oxygen, but also has excellent flexibility. The water absorption layers arranged around the device improve the water absorption capacity of the packaging structure, and greatly prolong the service life of the OLED display device.
Based on the same inventive concept, an embodiment of the present invention further provides a packaging method for a display device, and fig. 6 is a flowchart of the packaging method for a display device provided in the embodiment of the present invention, as shown in fig. 6, the packaging method may include:
s10, forming a first barrier layer on the surface and the periphery of the organic light-emitting diode device on the substrate base plate;
s20, forming a water absorbing layer around the first barrier layer;
s30, forming a flat layer on the surface of the first barrier layer and the surface of the water absorption layer which is far away from the substrate;
and S40, forming a second barrier layer on the surface and the periphery of one side of the flat layer, which is far away from the substrate.
According to the embodiment of the invention, the barrier layer and the flat layer are alternately arranged, so that the water and oxygen barrier performance of the display device can be improved, meanwhile, the device can be flat, the internal stress generated when the display device is bent and curled is relieved, and the display device is protected from being damaged. The water absorbing layer is arranged around the first blocking layer, so that the water absorbing performance of the device can be enhanced, the moisture in the device can be absorbed, and the service life of the display device can be prolonged. The layer that absorbs water only sets up around the OLED device, and avoids the top of OLED device, can prevent to absorb water the layer and shelter from the light outgoing of OLED device, guarantees the emergence efficiency of OLED device.
The following describes the packaging method provided by the embodiment of the present invention in detail, and fig. 7a to 7d schematically illustrate cross-sectional structures of the display device corresponding to each step of the packaging process. The process method for manufacturing the OLED device in the embodiments of the present invention may refer to the prior art, and is not described herein in detail.
After the OLED device 12 is formed on the substrate 11, the OLED device 12 needs to be packaged to prevent damage to the OLED device 12 from the environment and external force. First, as shown in fig. 7a, a first blocking layer 13 is formed on the surface and around the OLED device 12, the first blocking layer 13 needs to completely cover the OLED device 12 and around the OLED device 12, and the first blocking layer 13 has good compactness and can block external water and oxygen from entering the OLED device 12, so as to protect the organic material and the electrode structure in the OLED device 12 from being damaged by the external water and oxygen. The first barrier layer 13 may be made of an inorganic material, and may be made by a process such as PECVD, ALD, PVD, or the like in actual manufacturing, which is not limited herein.
Next, as shown in fig. 7b, a circle of water absorption layer 14 is formed around the first barrier layer 13, and the water absorption layer 14 is disposed adjacent to the first barrier layer 13 and around the first barrier layer 13 and the OLED device 12. The water absorption layer can improve the water absorption capacity of the packaging structure, so that water vapor permeating into the display device can be absorbed, and water generated by the display device can be absorbed, so that the service life of the OLED device 12 is prolonged.
In practical applications, the water-absorbing layer 14 may be made of water-absorbing materials such as calcium oxide, barium oxide, or aluminum oxide, which are usually powdered, and for convenience of manufacturing, one or more of the water-absorbing materials may be dispersed in a matrix of organic resin such as polyacrylate, so that the original material of the water-absorbing layer may be in a liquid state, and thus, the water-absorbing layer may be manufactured by using processes such as inkjet printing, spin coating, and doctor blade. For example, one or more water-absorbing materials of barium oxide, calcium oxide, and aluminum oxide may be dispersed in the organic matrix and then formed around the first barrier layer 13 by spraying or the like, thereby enhancing the water absorption performance of the package structure.
Then, as shown in fig. 7c, a planarization layer 15 is formed on the surface of the first barrier layer 13 and the water-absorbing layer 14 on the side away from the base substrate 11. The first barrier layer 13 may be made of an inorganic material, the water-absorbing layer 14 may be made of an organic material, and the thickness of the organic material is generally greater than that of the inorganic material, so that the surface structure of the device after the first barrier layer 13 and the water-absorbing layer 14 are formed is not flat, and a flat layer 15 may be formed on the surfaces of the first barrier layer 13 and the water-absorbing layer 14 to flatten the surface of the device, which is beneficial for further forming other film layers on the surface.
Besides, the flat layer 15 is usually made of an elastic organic material, and after the flat layer 15 with elasticity is formed on the surface of the first barrier layer 13, the internal stress generated by the first barrier layer 13 in the curling process can be relieved, and the first barrier layer 13 is prevented from being broken, so that the performance of blocking water and oxygen of the first barrier layer 13 is ensured.
In order to improve the longitudinal water absorption performance of the packaging structure, nano water absorption particles can be dispersed in the material of the flat layer 15 and formed on the surfaces of the first barrier layer 13 and the water absorption layer 14 along with the flat layer 15. The planarization layer 15 may be made of an organic material, and may be made by a process such as inkjet printing, spin coating, knife coating, chemical vapor deposition, or the like, in practice, which is not limited herein.
Then, as shown in fig. 7d, a second barrier layer 16 is formed on the surface and around the planarization layer 15, and the second barrier layer 16 completely covers the lower layer and the side surface of the lower layer. The second barrier layer 16 and the first barrier layer 13 have the same function, and both function to block external water and oxygen from penetrating into the OLED device, and the formation of a layer of the second barrier layer 16 on the outer side of the planarization layer 14 can improve the performance of the package structure in blocking water and oxygen.
Similarly, the second barrier layer 16 may be made of the same material as the first barrier layer 13, and the second barrier layer 16 may be made of an inorganic material in general, and may be made by a process such as PECVD, ALD, PVD or the like in actual manufacturing, which is not limited herein.
The display device provided by the embodiment of the invention is particularly suitable for flexible OLED display, and the first barrier layer 13 and the second barrier layer 16 made of inorganic materials with poor flexibility are adopted in the packaging structure, so that in order to buffer internal stress generated by the barrier layers in the bending or curling process, a buffer layer can be further formed on the surface of the second barrier layer 16, and the structure is shown in fig. 3. The buffer layer 17 completely covers the second barrier layer 16 and its periphery, and its boundary may extend behind the second barrier layer 16, so that the second barrier layer 16 and its underlying film layer are completely covered by the buffer layer 17. Therefore, the lower film layer can be protected, the second barrier layer 16 is prevented from being broken when being curled, and the water and oxygen blocking performance of the second barrier layer 16 is guaranteed.
The buffer layer 17 is usually made of an organic material with elasticity, and in order to improve the longitudinal water absorption performance of the package structure, nano water absorption particles can be dispersed in the material of the buffer layer 17 and formed on the surface of the second barrier layer 16 along with the buffer layer 17. The buffer layer 17 may be made of an organic material, and may be made by a process such as inkjet printing, spin coating, or blade coating in actual manufacturing, which is not limited herein.
The display device provided by the embodiment of the invention comprises: the substrate base plate has supporting and bearing functions; an organic light emitting diode device located on the substrate base plate; the first blocking layer covers the surface and the periphery of one side, away from the substrate, of the organic light-emitting diode device; the water absorption layer is positioned on the periphery of the first blocking layer, and the orthographic projection of the water absorption layer on the substrate and the orthographic projection of the organic light-emitting diode device on the substrate are not overlapped; the flat layer covers the surfaces of the first blocking layer and the water absorbing layer on the side departing from the substrate; and the second barrier layer covers the surface and the periphery of one side of the flat layer, which is far away from the substrate. The mode that adopts barrier layer and flat layer to set up in turn can promote the performance of display device separation water oxygen, can flat the device simultaneously, alleviates the display device and takes place the internal stress that produces when buckling and curling, and the protection display device does not receive the damage. The water absorbing layer is arranged around the first blocking layer, so that the water absorbing performance of the device can be enhanced, the moisture in the device can be absorbed, and the service life of the display device can be prolonged. The layer that absorbs water only sets up around the OLED device, and avoids the top of OLED device, can prevent to absorb water the layer and shelter from the light outgoing of OLED device, guarantees the emergence efficiency of OLED device.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A display device, comprising:
the substrate base plate has supporting and bearing functions;
an organic light emitting diode device located on the substrate base plate;
the first blocking layer covers the surface and the periphery of one side, away from the substrate, of the organic light-emitting diode device;
the water absorption layer is positioned on the periphery of the first blocking layer, and the orthographic projection of the water absorption layer on the substrate base plate and the orthographic projection of the organic light-emitting diode device on the substrate base plate are not overlapped with each other;
the flat layer covers the surfaces of the first barrier layer and the water absorption layer on the side away from the substrate;
and the second barrier layer covers the surface and the periphery of one side of the flat layer, which deviates from the substrate base plate.
2. The display device of claim 1, further comprising:
and the buffer layer covers the surface and the periphery of one side of the second barrier layer, which deviates from the substrate base plate.
3. The display device of claim 2, wherein the planarization layer has nano-sized water absorbing particles dispersed therein.
4. The display device according to claim 2, wherein nano water absorbent particles are dispersed in the buffer layer.
5. The display device according to claim 3 or 4, wherein the nano water-absorbing particles use at least one of calcium oxide, barium oxide, and aluminum oxide.
6. The display device of claim 1, wherein the water-absorbing layer comprises:
an organic medium as a matrix;
a desiccant dispersed in the organic medium;
the drying agent is at least one of calcium oxide, barium oxide and aluminum oxide.
7. The display device according to claim 1, wherein a material used for the first barrier layer and the second barrier layer includes at least one of aluminum oxide, titanium dioxide, zirconium dioxide, magnesium oxide, hafnium dioxide, tantalum pentoxide, silicon nitride, aluminum nitride, silicon oxynitride, silicon monoxide, silicon dioxide, and silicon carbide.
8. The display device according to claim 7, wherein the first barrier layer has a thickness of 0.01 μm to 5 μm, and the second barrier layer has a thickness of 0.01 μm to 5 μm.
9. The display device according to claim 2, wherein the material used for the planarization layer includes at least one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, polystyrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polydiethylsulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene, and epoxy resin;
the buffer layer is made of at least one of epoxy resin, acrylic resin and silicon resin.
10. The display device according to claim 9, wherein the planarization layer has a thickness of 1 μm to 50 μm, and the buffer layer has a thickness of 1 μm to 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911360328.3A CN113036048A (en) | 2019-12-25 | 2019-12-25 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911360328.3A CN113036048A (en) | 2019-12-25 | 2019-12-25 | Display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113036048A true CN113036048A (en) | 2021-06-25 |
Family
ID=76458938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911360328.3A Pending CN113036048A (en) | 2019-12-25 | 2019-12-25 | Display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113036048A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114583081A (en) * | 2022-02-24 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150194618A1 (en) * | 2013-08-02 | 2015-07-09 | Boe Technology Group Co., Ltd. | Flexible organic light emitting diode display device and manufacturing method thereof |
| CN107425136A (en) * | 2017-05-11 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof |
| CN107799666A (en) * | 2017-11-10 | 2018-03-13 | 武汉华星光电半导体显示技术有限公司 | Encapsulating structure, method for packing and electronic device |
-
2019
- 2019-12-25 CN CN201911360328.3A patent/CN113036048A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150194618A1 (en) * | 2013-08-02 | 2015-07-09 | Boe Technology Group Co., Ltd. | Flexible organic light emitting diode display device and manufacturing method thereof |
| CN107425136A (en) * | 2017-05-11 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof |
| CN107799666A (en) * | 2017-11-10 | 2018-03-13 | 武汉华星光电半导体显示技术有限公司 | Encapsulating structure, method for packing and electronic device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114583081A (en) * | 2022-02-24 | 2022-06-03 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11393995B2 (en) | Light-emitting device having light blocking overlapping connection portion or spacer | |
| US11088350B2 (en) | Display device and method for manufacturing the same | |
| JP6466012B2 (en) | Light emitting device and manufacturing method thereof | |
| US10050228B2 (en) | OLED display device and encapsulation method thereof | |
| US9013099B2 (en) | Organic electroluminescent apparatus | |
| US11871606B2 (en) | Display substrate and display device | |
| US10050230B1 (en) | OLED display and manufacturing method thereof | |
| TWI699020B (en) | Organic light emitting diode device | |
| US10714708B2 (en) | Display and method of manufacturing the same | |
| US10371869B2 (en) | Anti-scratch film for flexible display | |
| US9825108B2 (en) | Curved display device | |
| CN109546002B (en) | Organic electroluminescent display panel and display device | |
| KR102432641B1 (en) | Display device, light-emitting device, and electronic appliance | |
| US20130126915A1 (en) | Flexible active device array substrate and organic electroluminescent device having the same | |
| CN109671751B (en) | Display device, display panel and manufacturing method thereof | |
| CN106784380A (en) | A kind of encapsulating structure and its preparation method and application | |
| CN212085044U (en) | Display device | |
| CN112447929A (en) | Display device | |
| CN113036048A (en) | Display device | |
| KR102693569B1 (en) | Display apparatus | |
| JP2008016205A (en) | Optical device and electronic apparatus | |
| WO2014084051A1 (en) | Oxide semiconductor element, method for manufacturing oxide semiconductor element, display device and image sensor | |
| WO2019104859A1 (en) | Packaging structure for packaging oled device, and display device | |
| US20190386249A1 (en) | Encapsulation method, encapsulating structure of organic electroluminescent device, and display apparatus | |
| CN111276616B (en) | Groove packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |