CN113035742B - Wafer cleaning and recycling device for semiconductor manufacturing - Google Patents
Wafer cleaning and recycling device for semiconductor manufacturing Download PDFInfo
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- CN113035742B CN113035742B CN202110181207.3A CN202110181207A CN113035742B CN 113035742 B CN113035742 B CN 113035742B CN 202110181207 A CN202110181207 A CN 202110181207A CN 113035742 B CN113035742 B CN 113035742B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000004064 recycling Methods 0.000 title abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 93
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 238000001035 drying Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 20
- 238000007599 discharging Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims 2
- 238000011084 recovery Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 27
- 238000010586 diagram Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Abstract
The invention discloses a wafer cleaning and recycling device for semiconductor manufacturing, which comprises a supporting mechanism, a rotating mechanism and a lifting mechanism, wherein the supporting mechanism is used for supporting equipment, the rotating mechanism is arranged above the supporting mechanism, the lifting mechanism is arranged at the rear part of the rotating mechanism, the wafer cleaning and recycling device also comprises a cleaning mechanism, a drying mechanism and a collecting mechanism, the cleaning mechanism is arranged above the rotating mechanism, the drying mechanism is arranged at two sides of the cleaning mechanism, and the collecting mechanism is fixed on the supporting mechanism. According to the invention, the cleaning mechanism is arranged, and the four branch pipes enable the device to simultaneously clean the round crystal from four directions, so that the cleaning liquid is more fully contacted with the surface of the round crystal, and the cleaning efficiency is improved.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning and recycling device for semiconductor manufacturing.
Background
A wafer is a silicon chip used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Wafers are carriers used in the production of integrated circuits, and in general, wafers are referred to as single crystal silicon wafers. The monocrystalline silicon wafer is drawn and refined by common silica sand, a monocrystalline silicon rod is prepared by a series of measures of dissolution, purification and distillation, and the monocrystalline silicon rod becomes a wafer after being polished and sliced.
Many impurities can be attached to the surface of a wafer in the manufacturing process, the wafer needs to be cleaned in order to ensure that the wafer is not affected during use, and the existing cleaning device has the following problems to be solved:
1. the cleaning efficiency is low;
2. the drying function is not realized, and the water drops on the surface of the round crystal are easy to adsorb impurities again;
3. the used water is directly discharged, and a large amount of water resources are consumed.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a wafer cleaning and recovering apparatus for semiconductor manufacturing.
The invention realizes the purpose through the following technical scheme:
a wafer cleaning and recycling device for semiconductor manufacturing comprises a supporting mechanism, a rotating mechanism and a lifting mechanism, wherein the supporting mechanism is used for supporting equipment, the rotating mechanism is mounted above the supporting mechanism, the lifting mechanism is arranged at the rear part of the rotating mechanism, the wafer cleaning and recycling device further comprises a cleaning mechanism, a drying mechanism and a collecting mechanism, the cleaning mechanism is arranged above the rotating mechanism, the drying mechanism is mounted on two sides of the cleaning mechanism, and the collecting mechanism is fixed on the supporting mechanism;
the cleaning mechanism comprises a lifting box, a clamping groove, a water inlet pipe, a first electromagnetic valve, an exhaust pipe, a first mounting shell, a first gas filter screen, a fixed disc, a branch pipe and a spray head, wherein the clamping groove is formed in the lifting box;
the drying mechanism comprises a heating box, a resistance wire, a blower, a gas pipe, a second mounting shell, a second gas filter screen and a first one-way valve, the resistance wire is mounted in the heating box, the blower is fixed on one side of the heating box, the gas pipe is fixed on the other side of the heating box, the second mounting shell is fixed on one side of the blower away from the heating box, the second gas filter screen is fixed on the inner side of the second mounting shell, and the first one-way valve is fixed on the gas pipe;
the collecting mechanism comprises a fixing frame, a liquid filter screen, an arc-shaped plate, a liquid conveying pipe, a second one-way valve, a collecting box, a liquid discharging pipe and a second electromagnetic valve, wherein the liquid filter screen is arranged inside the fixing frame, the arc-shaped plate is arranged below the liquid filter screen, the liquid conveying pipe is fixed below the arc-shaped plate, the second one-way valve is fixed on the liquid conveying pipe, the collecting box is arranged below the fixing frame, the liquid discharging pipe is arranged on the side surface of the collecting box, and the second electromagnetic valve is fixed on the liquid discharging pipe.
Preferably, the supporting mechanism comprises a transverse plate and a supporting assembly, and the supporting assembly is mounted below the transverse plate; the transverse plate is rectangular and made of stainless steel.
Preferably, the support assembly comprises a support rod and a bottom plate, and the bottom plate is fixed below the support rod; the number of the supporting rods is four, and the supporting rods are welded with the bottom plate.
Preferably, the supporting component comprises a supporting frame and a connecting plate, and the supporting frame is fixed on two sides of the connecting plate; the support frame is welded with the connecting plate.
Preferably, the rotating mechanism comprises a fixed shell, a clamping ring, a protection box, a first motor, a rotating shaft, a rotating disc, a placing groove and fixing rods, wherein the clamping ring is installed above the fixed shell, the protection box is arranged inside the fixed shell, the first motor is fixed inside the protection box, the rotating shaft is installed above the first motor, the rotating disc is fixed above the rotating shaft, the placing groove is formed in the rotating disc, and the fixing rods are installed on two sides of the protection box; the snap ring with the set casing welding, first motor with the guard box passes through bolted connection, the carousel with the pivot welding, the dead lever with the guard box welding, the dead lever with the set casing welding.
Preferably, the lifting mechanism comprises a fixed box, a lifting groove, a second motor, a threaded rod, a movable sleeve and a movable rod, the lifting groove is formed in the fixed box, the second motor is installed above the fixed box, the threaded rod is installed on the second motor, the movable sleeve is arranged on the outer side of the threaded rod, and the movable rod is fixed to the front portion of the movable sleeve; the second motor with the fixed case passes through bolted connection, the movable sleeve with the threaded rod passes through threaded connection, the movable rod with the movable sleeve welding.
Preferably, the inlet tube with the lift case welding, first solenoid valve with the inlet tube passes through threaded connection, the blast pipe with the lift case welding, first installation shell with the blast pipe welding, first gas filter net with first installation shell passes through bolted connection.
Preferably, the fixed disk with the inlet tube welding, the branch pipe with the fixed disk welding, the quantity of branch pipe is four, the shower nozzle with the branch pipe welding.
Preferably, the resistance wire is welded with the heating box, the air blower is connected with the heating box through bolts, the second gas filter screen is connected with the second mounting shell through bolts, and the gas transmission pipe is welded with the heating box.
Preferably, the liquid filter screen is connected with the fixed frame through a bolt, the arc-shaped plate is welded with the fixed frame, the liquid conveying pipe is welded with the arc-shaped plate, the liquid discharge pipe is welded with the collection box, and the second electromagnetic valve is connected with the liquid discharge pipe through a thread.
Compared with the prior art, the invention has the following beneficial effects:
1. by arranging the cleaning mechanism, the four branch pipes enable the device to clean the round crystal from four directions simultaneously, so that the cleaning liquid is more fully contacted with the surface of the round crystal, and the cleaning efficiency is improved;
2. through the arrangement of the drying mechanism, after the round crystal is cleaned, external air is filtered by the second air filter screen under the action of the blower and then enters the heating box, the resistance wire heats the air, high-temperature air enters the branch pipe through the air conveying pipe and the fixed disc, and the air in the branch pipe is sprayed out through the spray head, so that the round crystal is dried, and water drops can be effectively prevented from sticking and sinking impurities;
3. through setting up the collection mechanism, the water after the use enters into the collection box through the transfer line after liquid filter screen filters in, and the collecting box is collected the water after using, makes it can recycle once more, so effectively avoided the waste of water resource.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first structure of a wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 2 is a schematic diagram of a second structure of the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 3 is a schematic diagram of a first front view of the internal structure of the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 4 is a schematic diagram of a second front view of the internal structure of the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 5 is an enlarged schematic view of a turntable in the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 6 is a schematic left-side view of the internal structure of the elevating mechanism of the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention;
FIG. 7 is an enlarged view of a fixing plate of the wafer cleaning and recycling device for semiconductor manufacturing according to the present invention;
FIG. 8 is an enlarged schematic view of a drain pipe in the wafer cleaning and recycling apparatus for semiconductor manufacturing according to the present invention.
The reference numerals are explained below:
1. a support mechanism; 101. a transverse plate; 102. a support assembly; 1021. a support bar; 1022. a base plate; 1023. a support frame; 1024. a connecting plate; 2. a rotation mechanism; 201. a stationary case; 202. a snap ring; 203. a protection box; 204. a first motor; 205. a rotating shaft; 206. a turntable; 207. a placement groove; 208. fixing the rod; 3. a lifting mechanism; 301. a fixed box; 302. a lifting groove; 303. a second motor; 304. a threaded rod; 305. moving the sleeve; 306. a travel bar; 4. a cleaning mechanism; 401. a lifting box; 402. a card slot; 403. a water inlet pipe; 404. a first solenoid valve; 405. an exhaust pipe; 406. a first mounting case; 407. a first gas screen; 408. fixing the disc; 409. a branch pipe; 410. a spray head; 5. a drying mechanism; 501. a heating box; 502. a resistance wire; 503. a blower; 504. a gas delivery pipe; 505. a second mounting case; 506. a second gas filter; 507. a first check valve; 6. a collection mechanism; 601. a fixing frame; 602. a liquid filter screen; 603. an arc-shaped plate; 604. a transfusion tube; 605. a second one-way valve; 606. a collection box; 607. a liquid discharge pipe; 608. a second solenoid valve.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1, 3, 5, 6, 7 and 8, a wafer cleaning and recycling device for semiconductor manufacturing comprises a supporting mechanism 1 for supporting equipment, a rotating mechanism 2 and a lifting mechanism 3, wherein the rotating mechanism 2 is installed above the supporting mechanism 1, the lifting mechanism 3 is arranged at the rear part of the rotating mechanism 2, the wafer cleaning and recycling device further comprises a cleaning mechanism 4, a drying mechanism 5 and a collecting mechanism 6, the cleaning mechanism 4 is arranged above the rotating mechanism 2, the drying mechanism 5 is installed at two sides of the cleaning mechanism 4, and the collecting mechanism 6 is fixed on the supporting mechanism 1;
the cleaning mechanism 4 comprises a lifting box 401, a clamping groove 402, a water inlet pipe 403, a first electromagnetic valve 404, two exhaust pipes 405, a first mounting shell 406, a first gas filter screen 407, a fixed disc 408, branch pipes 409 and a spray head 410, wherein the lifting box 401 is provided with the clamping groove 402, the exhaust pipes 405 are mounted above the lifting box 401, the number of the exhaust pipes 405 is two, the first mounting shell 406 is fixed above the exhaust pipes 405, the first gas filter screen 407 is fixed on the inner side of the first mounting shell 406, the water inlet pipe 403 is arranged between the two exhaust pipes 405, the first electromagnetic valve 404 is fixed on the water inlet pipe 403, the fixed disc 408 is mounted below the water inlet pipe 403, the branch pipes 409 are mounted below the fixed disc 408, and the spray head 410 is fixed on the branch pipes 409;
the drying mechanism 5 comprises a heating box 501, a resistance wire 502, a blower 503, an air conveying pipe 504, a second mounting shell 505, a second air filter screen 506 and a first one-way valve 507, wherein the resistance wire 502 is mounted in the heating box 501, the blower 503 is fixed on one side of the heating box 501, the air conveying pipe 504 is fixed on the other side of the heating box 501, the second mounting shell 505 is fixed on one side of the blower 503, which is far away from the heating box 501, the second air filter screen 506 is fixed on the inner side of the second mounting shell 505, and the first one-way valve 507 is fixed on the air conveying pipe 504;
the collecting mechanism 6 comprises a fixing frame 601, a liquid filter screen 602, an arc-shaped plate 603, a liquid conveying pipe 604, a second one-way valve 605, a collecting box 606, a liquid discharging pipe 607 and a second electromagnetic valve 608, wherein the liquid filter screen 602 is installed inside the fixing frame 601, the arc-shaped plate 603 is arranged below the liquid filter screen 602, the liquid conveying pipe 604 is fixed below the arc-shaped plate 603, the second one-way valve 605 is fixed on the liquid conveying pipe 604, the collecting box 606 is installed below the fixing frame 601, the liquid discharging pipe 607 is installed on the side surface of the collecting box 606, and the second electromagnetic valve 608 is fixed on the liquid discharging pipe 607.
The supporting mechanism 1 comprises a transverse plate 101 and a supporting assembly 102, wherein the supporting assembly 102 is arranged below the transverse plate 101; the transverse plate 101 is rectangular and made of stainless steel; the supporting assembly 102 comprises a supporting rod 1021 and a bottom plate 1022, wherein the bottom plate 1022 is fixed below the supporting rod 1021; the number of the support rods 1021 is four, and the support rods 1021 are welded with the bottom plate 1022; the rotating mechanism 2 comprises a fixed shell 201, a clamping ring 202, a protection box 203, a first motor 204, a rotating shaft 205, a rotating disc 206, a placing groove 207 and a fixing rod 208, wherein the clamping ring 202 is installed above the fixed shell 201, the protection box 203 is arranged inside the fixed shell 201, the first motor 204 is fixed inside the protection box 203, the rotating shaft 205 is installed above the first motor 204, the rotating disc 206 is fixed above the rotating shaft 205, the placing groove 207 is arranged on the rotating disc 206, and the fixing rods 208 are installed on two sides of the protection box 203; the clamping ring 202 is welded with the fixed shell 201, the first motor 204 is connected with the protection box 203 through bolts, the turntable 206 is welded with the rotating shaft 205, the fixed rod 208 is welded with the protection box 203, and the fixed rod 208 is welded with the fixed shell 201; the lifting mechanism 3 comprises a fixed box 301, a lifting groove 302, a second motor 303, a threaded rod 304, a movable sleeve 305 and a movable rod 306, the lifting groove 302 is arranged on the fixed box 301, the second motor 303 is arranged above the fixed box 301, the threaded rod 304 is arranged on the second motor 303, the movable sleeve 305 is arranged outside the threaded rod 304, and the movable rod 306 is fixed at the front part of the movable sleeve 305; the second motor 303 is connected with the fixed box 301 through a bolt, the movable sleeve 305 is connected with the threaded rod 304 through a thread, and the movable rod 306 is welded with the movable sleeve 305; the water inlet pipe 403 is welded with the lifting box 401, the first electromagnetic valve 404 is connected with the water inlet pipe 403 through threads, the exhaust pipe 405 is welded with the lifting box 401, the first mounting shell 406 is welded with the exhaust pipe 405, and the first gas filter screen 407 is connected with the first mounting shell 406 through bolts; the fixed disc 408 is welded with the water inlet pipe 403, the branch pipes 409 are welded with the fixed disc 408, the number of the branch pipes 409 is four, and the spray head 410 is welded with the branch pipes 409; the resistance wire 502 is welded with the heating box 501, the blower 503 is connected with the heating box 501 through bolts, the second gas filter screen 506 is connected with the second mounting shell 505 through bolts, and the gas transmission pipe 504 is welded with the heating box 501; the liquid filter screen 602 is connected with the fixed frame 601 through bolts, the arc-shaped plate 603 is welded with the fixed frame 601, the liquid conveying pipe 604 is welded with the arc-shaped plate 603, the liquid discharge pipe 607 is welded with the collection box 606, and the second electromagnetic valve 608 is connected with the liquid discharge pipe 607 through threads.
In the above structure: when the device is used, a round crystal is placed in the placing groove 207, the second motor 303 drives the threaded rod 304 to rotate, the threaded rod 304 drives the moving sleeve 305 to descend, the moving sleeve 305 drives the lifting box 401 to descend through the moving rod 306, the lifting box 401 descends to contact with the fixed box 301, the clamping ring 202 is inserted into the clamping groove 402, the first motor 204 drives the round crystal to rotate through the rotating shaft 205, the first electromagnetic valve 404 is opened, cleaning water enters the branch pipe 409 through the water inlet pipe 403 and the fixed disk 408, water in the branch pipe 409 acts on the round crystal through the spray head 410, the round crystal is cleaned in this way, the used water is filtered through the liquid filter screen 602 and then enters the collecting box 606 through the liquid conveying pipe 604, after the round crystal is cleaned, outside air is filtered through the second gas filter screen 506 under the action of the blower 503 and then enters the heating box 501, the resistance wire 502 heats the air, high-temperature air enters the branch pipe 409 through the air conveying pipe 504 and the fixed disk 408, the gas in the branch pipe 409 is sprayed out through the nozzle 410, so as to dry the wafer, and the supporting rod 1021 and the bottom plate 1022 cooperate together to support and fix the horizontal plate 101 during the operation of the device.
Example 2
As shown in fig. 2, 4, 5, 6, 7, and 8, the difference between the embodiment 2 and the embodiment 1 is that the support rods 1021 and the bottom plate 1022 are replaced by the support frames 1023 and the connecting plates 1024, and the support frames 1023 and the connecting plates 1024 cooperate to support and fix the horizontal plate 101 during the operation of the device.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (6)
1. The utility model provides a wafer washs recovery unit for semiconductor manufacturing, includes supporting mechanism (1), rotary mechanism (2), elevating system (3) that are used for the support equipment, install supporting mechanism (1) top rotary mechanism (2), rotary mechanism (2) rear portion is provided with elevating system (3), its characterized in that: the drying machine is characterized by further comprising a cleaning mechanism (4), a drying mechanism (5) and a collecting mechanism (6), wherein the cleaning mechanism (4) is arranged above the rotating mechanism (2), the drying mechanism (5) is arranged on two sides of the cleaning mechanism (4), and the collecting mechanism (6) is fixed on the supporting mechanism (1);
the cleaning mechanism (4) comprises a lifting box (401), clamping grooves (402), a water inlet pipe (403), a first electromagnetic valve (404), an exhaust pipe (405), first installation shells (406), first gas filter screens (407), a fixed disc (408), branch pipes (409) and a spray head (410), wherein the clamping grooves (402) are arranged on the lifting box (401), the exhaust pipes (405) are installed above the lifting box (401), the number of the exhaust pipes (405) is two, the first installation shells (406) are fixed above the exhaust pipes (405), the first gas filter screens (407) are fixed on the inner side of each first installation shell (406), the water inlet pipe (403) is arranged between the two exhaust pipes (405), the first electromagnetic valve (404) is fixed on the water inlet pipe (403), the fixed disc (408) is installed below the water inlet pipe (403), the branch pipe (409) is arranged below the fixed disc (408), and the spray head (410) is fixed on the branch pipe (409);
the drying mechanism (5) comprises a heating box (501), a resistance wire (502), a blower (503), an air conveying pipe (504), a second mounting shell (505), a second air filtering net (506) and a first one-way valve (507), wherein the resistance wire (502) is mounted in the heating box (501), the blower (503) is fixed on one side of the heating box (501), the air conveying pipe (504) is fixed on the other side of the heating box (501), the second mounting shell (505) is fixed on one side, away from the heating box (501), of the blower (503), the second air filtering net (506) is fixed on the inner side of the second mounting shell (505), and the first one-way valve (507) is fixed on the air conveying pipe (504);
the collecting mechanism (6) comprises a fixing frame (601), a liquid filter screen (602), an arc-shaped plate (603), a liquid conveying pipe (604), a second one-way valve (605), a collecting box (606), a liquid discharging pipe (607) and a second electromagnetic valve (608), wherein the liquid filter screen (602) is installed inside the fixing frame (601), the arc-shaped plate (603) is arranged below the liquid filter screen (602), the liquid conveying pipe (604) is fixed below the arc-shaped plate (603), the second one-way valve (605) is fixed on the liquid conveying pipe (604), the collecting box (606) is installed below the fixing frame (601), the liquid discharging pipe (607) is installed on the side surface of the collecting box (606), and the second electromagnetic valve (608) is fixed on the liquid discharging pipe (607);
the resistance wire (502) is welded with the heating box (501), the blower (503) is connected with the heating box (501) through bolts, the second gas filter screen (506) is connected with the second mounting shell (505) through bolts, and the gas pipe (504) is welded with the heating box (501);
the rotating mechanism (2) comprises a fixed shell (201), a clamping ring (202), a protection box (203), a first motor (204), a rotating shaft (205), a rotating disc (206), a placing groove (207) and fixing rods (208), wherein the clamping ring (202) is installed above the fixed shell (201), the protection box (203) is arranged inside the fixed shell (201), the first motor (204) is fixed inside the protection box (203), the rotating shaft (205) is installed above the first motor (204), the rotating disc (206) is fixed above the rotating shaft (205), the placing groove (207) is arranged on the rotating disc (206), and the fixing rods (208) are installed on two sides of the protection box (203); the clamping ring (202) is welded with the fixed shell (201) and can be inserted into a clamping groove (402), the first motor (204) is connected with the protection box (203) through a bolt, the rotary disc (206) is welded with the rotary shaft (205), the fixing rod (208) is welded with the protection box (203), and the fixing rod (208) is welded with the fixed shell (201);
the lifting mechanism (3) comprises a fixed box (301), a lifting groove (302), a second motor (303), a threaded rod (304), a movable sleeve (305) and a movable rod (306), the lifting groove (302) is arranged on the fixed box (301), the second motor (303) is arranged above the fixed box (301), the threaded rod (304) is arranged on the second motor (303), the movable sleeve (305) is arranged on the outer side of the threaded rod (304), and the movable rod (306) is fixed on the front portion of the movable sleeve (305); the second motor (303) is connected with the fixed box (301) through a bolt, the movable sleeve (305) is connected with the threaded rod (304) through a thread, and the movable rod (306) is welded with the movable sleeve (305);
the fixed disk (408) with inlet tube (403) welding, branch pipe (409) with fixed disk (408) welding, the quantity of branch pipe (409) is four, branch pipe (409) extend along vertical direction and surround carousel (206) are arranged, shower nozzle (410) with branch pipe (409) welding.
2. The apparatus as claimed in claim 1, wherein the wafer cleaning and recovering apparatus comprises: the supporting mechanism (1) comprises a transverse plate (101) and a supporting assembly (102), and the supporting assembly (102) is installed below the transverse plate (101); the transverse plate (101) is rectangular and made of stainless steel.
3. The wafer cleaning and recovering apparatus for semiconductor manufacturing according to claim 2, wherein: the supporting component (102) comprises a supporting rod (1021) and a bottom plate (1022), wherein the bottom plate (1022) is fixed below the supporting rod (1021); the number of the supporting rods (1021) is four, and the supporting rods (1021) are welded with the bottom plate (1022).
4. The wafer cleaning and recovering apparatus for semiconductor manufacturing according to claim 2, wherein: the supporting component (102) comprises a supporting frame (1023) and a connecting plate (1024), and the supporting frame (1023) is fixed on two sides of the connecting plate (1024); the support frame (1023) is welded with the connecting plate (1024).
5. The apparatus as claimed in claim 1, wherein the wafer cleaning and recovering apparatus comprises: the inlet tube (403) with lift case (401) welding, first solenoid valve (404) with inlet tube (403) pass through threaded connection, blast pipe (405) with lift case (401) welding, first installation shell (406) with blast pipe (405) welding, first gas filter screen (407) with first installation shell (406) passes through bolted connection.
6. The apparatus as claimed in claim 1, wherein the wafer cleaning and recovering apparatus comprises: liquid filter screen (602) with fixed frame (601) pass through bolted connection, arc (603) with fixed frame (601) welding, transfer line (604) with arc (603) welding, fluid-discharge tube (607) with collecting box (606) welding, second solenoid valve (608) with fluid-discharge tube (607) pass through threaded connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110181207.3A CN113035742B (en) | 2021-02-10 | 2021-02-10 | Wafer cleaning and recycling device for semiconductor manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| JPH0969509A (en) * | 1995-09-01 | 1997-03-11 | Matsushita Electron Corp | Cleaning/etching/drying system for semiconductor wafer and using method thereof |
| JP3888608B2 (en) * | 2001-04-25 | 2007-03-07 | 東京エレクトロン株式会社 | Substrate double-sided processing equipment |
| KR100897431B1 (en) * | 2001-11-27 | 2009-05-14 | 도쿄엘렉트론가부시키가이샤 | Liquid processing apparatus and method |
| JP6223839B2 (en) * | 2013-03-15 | 2017-11-01 | 東京エレクトロン株式会社 | Substrate liquid processing method, substrate liquid processing apparatus, and storage medium |
| CN107437516B (en) * | 2016-05-25 | 2021-07-13 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |
| CN106824884A (en) * | 2017-03-31 | 2017-06-13 | 贵州大学 | A kind of silicon wafer turnover flusher |
| CN106964588A (en) * | 2017-05-15 | 2017-07-21 | 冯晓栋 | A kind of epitaxial wafer cleaning device produced for LED lamp |
| CN208240627U (en) * | 2018-05-24 | 2018-12-14 | 安徽钜芯半导体科技有限公司 | A kind of semiconductor round brilliant cleaning device |
| CN211125603U (en) * | 2020-02-26 | 2020-07-28 | 青岛天仁微纳科技有限责任公司 | Rotary silicon wafer cleaning and drying equipment |
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