CN113031401B

CN113031401B - Leveling device of photoetching machine and photoetching machine with leveling device

Info

Publication number: CN113031401B
Application number: CN202110236610.1A
Authority: CN
Inventors: 曲鲁杰; 何少锋; 关远远
Original assignee: Hefei Xinqi Microelectronics Equipment Co ltd
Current assignee: Hefei Xinqi Microelectronics Equipment Co ltd
Priority date: 2021-03-03
Filing date: 2021-03-03
Publication date: 2022-10-18
Anticipated expiration: 2041-03-03
Also published as: CN113031401A

Abstract

The invention discloses a leveling device of a photoetching machine and a photoetching machine with the same, wherein the leveling device of the photoetching machine comprises: the chip sucking device comprises a platform, wherein a sucking disc assembly is arranged on the platform and comprises a sucking disc and at least one air extractor, the air extractor is connected with the sucking disc, a chip is suitable for being placed on the sucking disc, and the chip is suitable for being adsorbed on the sucking disc when the air extractor works; the frame, the rack is established in the top of platform, is equipped with the subassembly of blowing in the frame, and the subassembly of blowing includes at least one piece of blowing that can move in the horizontal plane, and the piece of blowing is including blowing the mouth, and it is relative with the sucking disc to blow the mouth. According to the leveling device of the photoetching machine, the deformation and warpage of the chip can be effectively avoided, the flatness of the chip is ensured, the subsequent exposure of the chip is facilitated, the exposure precision of the chip is improved, and therefore the reject ratio of the chip exposure can be effectively reduced.

Description

Leveling device of photoetching machine and photoetching machine with leveling device

Technical Field

The invention relates to the technical field of photoetching machines, in particular to a leveling device of a photoetching machine and a photoetching machine with the leveling device.

Background

Currently, fan-out wafer level packaging technologies are widely used, and include System In a Package (SIP Package) technology, panel level packaging technology, module packaging of power devices, and the like. The fan-out type wafer level packaging technology can be expanded and applied to the production and manufacturing of a new generation of Mini-LED and Micro-LED displays in the field of the production and manufacturing of a new generation of flat panel displays.

In the related art, in the fan-out wafer level packaging process, the chip after being mounted may have a certain angle and displacement, so that the chip may be misaligned during the transferring process and cannot be connected to the designed circuit. In addition, due to the accuracy and stress of the chip mounting, the chip is prone to deformation, warping and other problems, so that the chip exceeds an error range, the exposure of the chip is poor, and the qualification rate of the chip is affected.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a leveling device for a lithography machine, which can effectively prevent a chip from deformation and warpage, ensure the flatness of the chip, and improve the exposure precision of the chip.

Another object of the present invention is to provide a lithographic apparatus having the above leveling device.

A leveling device of a lithography machine according to an embodiment of a first aspect of the invention comprises: the chip sucking device comprises a platform, wherein a sucking disc assembly is arranged on the platform and comprises a sucking disc and at least one air extractor, the air extractor is connected with the sucking disc, a chip is suitable for being placed on the sucking disc, and the chip is suitable for being adsorbed on the sucking disc when the air extractor works; the automatic air blowing device comprises a machine frame, wherein the machine frame is arranged above a platform, an air blowing assembly is arranged on the machine frame, the air blowing assembly comprises at least one air blowing piece which can move in a horizontal plane, the air blowing piece comprises an air blowing opening, and the air blowing opening is opposite to a sucker.

According to the leveling device of the photoetching machine, the sucker assembly is arranged on the platform, the sucker is connected with the air exhaust device, the air blowing assembly is arranged on the lower surface of the rack, the air blowing piece of the air blowing assembly can move in the horizontal plane, and the air blowing opening of the air blowing piece is opposite to the sucker. From this, can effectively avoid the chip to take place deformation and warpage, guarantee the roughness of chip, and make things convenient for follow-up exposing the chip, improve the exposure precision of chip to can reduce the defective rate that the chip exposes effectively.

According to some embodiments of the invention, the insufflation assembly further comprises: a turntable having a rotation axis extending in an up-down direction, the turntable being rotatable about the rotation axis; the guide rail is connected to the rotary table and extends horizontally, and the air blowing piece is movably arranged on the guide rail.

According to some embodiments of the invention, the guide rail is connected to a side of the turntable adjacent to the suction cup, and two ends of the guide rail are respectively located at two sides of the turntable in the radial direction.

According to some embodiments of the invention, two blowing members are provided on the guide rail, each blowing member being movable between a position of the guide rail adjacent to the center of the turntable and a corresponding end of the guide rail.

According to some embodiments of the invention, the number of the guide rails is two, and the two guide rails are perpendicular to each other.

According to some embodiments of the invention, the blowing member extends vertically in an up-down direction.

According to some embodiments of the invention, the frame is provided with a connecting rod extending downwards, and the lower end of the connecting rod is rotatably connected with the turntable.

According to some embodiments of the invention, the suction device is a plurality of suction devices, and the plurality of suction devices are connected to the bottom of the suction cup at intervals.

According to some embodiments of the invention, the platform is a mobile platform.

A lithographic apparatus according to an embodiment of the second aspect of the invention includes a lithographic apparatus according to an embodiment of the first aspect of the invention described above.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of a leveling device of a lithography machine according to an embodiment of the invention;

FIG. 2 is a top view of a blow down assembly of a leveling device of a lithography machine according to an embodiment of the invention, wherein the turntable is not shown.

Reference numerals:

100: a lithography machine leveling device;

1: a platform; 2: a suction cup assembly; 21: a suction cup; 22: an air extraction device;

221: a communication port; 3: a frame; 31: a connecting rod; 4: a blowing assembly;

41: an air blowing member; 411: an air blowing port; 42: a turntable; 43: a guide rail;

200: and (3) a chip.

Detailed Description

A lithographic apparatus 100 according to an embodiment of the first aspect of the present invention is described below with reference to FIGS. 1-2. In the following description of the present application, the leveling device 100 of the lithography machine is applied to a laser direct write lithography machine as an example. Of course, those skilled in the art will appreciate that the lithographic machine leveling device 100 can also be applied to other types of lithographic machines, and is not limited to laser direct write lithography machines.

As shown in fig. 1 and 2, a leveling device 100 of a lithography machine according to an embodiment of the first aspect of the present invention includes a stage 1 and a frame 3.

Specifically, the platform 1 is provided with a suction cup assembly 2, the suction cup assembly 2 comprises a suction cup 21 and at least one air extractor 22, the air extractor 22 is connected with the suction cup 21, the suction cup 21 is suitable for placing the chip 200, and the chip 200 is suitable for being adsorbed on the suction cup 21 when the air extractor 22 works. The frame 3 is arranged above the platform 1, the blowing assembly 4 is arranged on the frame 3, the blowing assembly 4 comprises at least one blowing member 41 capable of moving in a horizontal plane, the blowing member 41 comprises a blowing opening 411, and the blowing opening 411 is opposite to the suction cup 21.

For example, in the example of fig. 1 and 2, the suction cup 21 may be mounted on the upper surface of the platform 1, and the air-blowing assembly 4 may be mounted on the lower surface of the frame 3. When a chip 200, such as a wafer level chip, is placed on the upper surface of the suction cup 21, the suction device 22 may vacuum the suction cup 21 to suck the chip 200, such as a wafer level chip, on the suction cup 21, and when the blowing assembly 2 is in operation, the air flow in the blowing member 41 may be blown toward the upper surface of the chip 200 through the blowing port 411, and at the same time, the blowing member 41 may move in a horizontal plane to blow the surface of the chip 200 flat. Thereafter, the exposure apparatus may expose the blown-flat chip 200.

Therefore, the deformation and warpage of the chip 200, such as a wafer-level chip, can be effectively avoided, the flatness of the chip 200 is ensured, the subsequent exposure of the chip 200 is facilitated, the exposure precision of the chip 200 is improved, and the exposure reject ratio of the chip 200 can be effectively reduced. In addition, by moving the air blowing member 41 in the horizontal plane, it can be effectively ensured that the air flow in the air blowing member 41 can blow to various positions on the surface of the chip 200, so that the chip 200 can be more smoothly adsorbed on the suction cup 21, and the flatness of the chip 200 can be further improved.

According to the leveling device 100 of the lithography machine provided by the embodiment of the invention, the sucker assembly 2 is arranged on the platform 1, the sucker 21 is connected with the air suction device 22, the air blowing assembly 4 is arranged on the lower surface of the machine frame 3, the air blowing part 41 of the air blowing assembly 4 can move in a horizontal plane, and the air blowing opening 411 of the air blowing part 41 is opposite to the sucker 21. From this, can effectively avoid chip 200 to take place deformation and warpage, guarantee chip 200's roughness, and make things convenient for follow-up exposing chip 200, improve chip 200's exposure accuracy to can reduce the defective rate that chip 200 exposes effectively.

According to some embodiments of the present invention, the air-blowing assembly 4 further includes a turntable 42 and at least one guide rail 43, the turntable 42 having a rotation axis extending in an up-down direction, the turntable 42 being rotatable about the rotation axis, the guide rail 43 being connected to the turntable 42, the guide rail 43 extending horizontally, and the air-blowing members 41 being movably provided on the guide rail 43. Referring to fig. 1, the turntable 42 may be a disk, the rotation axis is a central axis of the turntable 42, the turntable 42 may rotate 360 ° around the rotation axis in a horizontal plane, and the turntable 42 may drive the guide rail 43 to rotate in the horizontal plane, so that the blowing member 41 may also rotate around the rotation axis of the turntable 42 when moving along the length direction of the guide rail 43, so that the air flow at the blowing opening 411 may be blown to various positions on the surface of the chip 200.

From this, when photoetching machine leveling device 100 during operation, carousel 42 can drive guide rail 43 360 rotations in the horizontal plane when revolving the axis rotation, blow piece 41 simultaneously and can remove along the length direction of guide rail 43, make and blow piece 41 and have circular motion and linear motion simultaneously concurrently, thereby the air current of blowing mouth 411 department can blow to each position department of chip 200, make chip 200 and sucking disc 21 can laminate more, further reduce the deformation volume of chip 200, guarantee chip 200's roughness.

Further, the guide rail 43 is connected to a side of the turntable 42 adjacent to the suction cup 21, so that the distance between the guide rail 43 and the suction cup 21 can be reduced, and the blowing member 41 can blow the air flow toward the chip 200 conveniently. Both ends of the guide rail 43 are located on both sides of the turntable 42 in the radial direction, respectively. Referring to fig. 1 in combination with fig. 2, the turntable 42 may be disposed at a middle portion of the guide rail 43, and both ends of the guide rail 43 may be symmetrical with respect to a rotation axis of the turntable 42, which may enlarge a moving range of the blowing member 41. When the leveling device 100 of the lithography machine works, the blowing member 41 can move back and forth along the length direction of the guide rail 43, so that the air flow blown out from the blowing port 411 can be blown to each position of the chip 200, and meanwhile, the whole structure of the blowing component 4 is more regular, the assembly is convenient, and the assembly efficiency of the leveling device 100 of the lithography machine can be improved.

Alternatively, as shown in fig. 1 and 2, two blowing members 41 are provided on the guide rail 43, and each blowing member 41 is movable between a position of the guide rail 43 adjacent to the center of the turntable 42 and a corresponding end of the guide rail 43. When the leveling device 100 of the lithography machine is in operation, the two blowing members 41 on the guide rail 43 can simultaneously reciprocate between the corresponding ends of the guide rail 43 at a position adjacent to the center of the turntable 42 on the guide rail 43. With such an arrangement, the two air blowing members 41 can blow air to the upper surface of the chip 200 synchronously, so that the speed of blowing air to the chip 200 by the leveling device 100 of the lithography machine can be effectively increased, and the working efficiency of the leveling device 100 of the lithography machine can be improved.

In some alternative embodiments, there are two guide rails 43, and the two guide rails 43 are perpendicular to each other. For example, in the example of fig. 1 and 2, two guide rails 43 may be arranged in a crisscross, and two blowing members 41 may be provided on each guide rail 43, and the turntable 42 may be installed at the intersection of the two guide rails 43. From this, when guaranteeing the mobility sphere of the piece 41 of blowing, set up two guide rails 43 and can further improve the work efficiency of photoetching machine leveling device 100, and two guide rails 43 of mutually perpendicular for the structure of the subassembly 4 of blowing is more regular, convenient assembly.

According to some embodiments of the present invention, the guide rail 43 may be a plurality of guide rails 43, the plurality of guide rails 43 may be arranged at intervals along the circumferential direction of the turntable 42, one end of each guide rail 43 is connected to the outer circumferential surface of the turntable 42, the other end of each guide rail 43 extends radially in a direction away from the center of the turntable 42, and each guide rail 43 is provided with an air blowing member 41 (not shown) that is movable along the length direction of the corresponding guide rail 43. In the description of the present invention, "a plurality" means two or more. Therefore, when the leveling device 100 of the lithography machine works, the turntable 42 can drive the plurality of guide rails 43 to rotate 360 degrees in the horizontal plane along the rotation axis, meanwhile, the plurality of air blowing pieces 41 can move along the length direction of the corresponding guide rails 43, and the air flow of the plurality of air blowing openings 411 can be blown to the chip 200 at the same time, so that the speed of blowing the chip 200 by the leveling device 100 of the lithography machine can be effectively improved.

Wherein the plurality of blowing members 41 may be moved along the corresponding guide rails 43 at equal rates. Of course, the rates of movement of the plurality of blowing members 41 along the corresponding guide rails 43 may not be equal. Still alternatively, the moving speeds of some of the blowing members 41 along the corresponding guide rails 43 may be all equal, and the moving speeds of the remaining blowing members 41 of the blowing members 41 along the corresponding guide rails 43 may be all equal or may not be equal.

In some alternative embodiments, the air blowing members 41 extend vertically in the up-down direction. Referring to fig. 1, the blowing members 41 may extend vertically downward in the up-down direction, and thus, a distance between the blowing openings 411 and the chip 200 may be further reduced, so that the air flow at the blowing openings 411 may be effectively blown toward the upper surface of the chip 200.

In some alternative embodiments, the frame 3 is provided with a connecting rod 31 extending downward, and the lower end of the connecting rod 31 is rotatably connected with the turntable 42. For example, in the example of fig. 1, the connecting rod 31 is provided on a side of the frame 3 adjacent to the suction cup 21, and an upper end of the connecting rod 31 is fixedly connected to the frame 3. Thus, by arranging the connecting rod 31 to extend toward the suction cup 21 and rotatably connecting the lower end of the connecting rod 31 to the turntable 42, the distance between the blowing port 411 and the chip 200 can be further reduced while ensuring that the turntable 42 can rotate in the horizontal plane around the rotation axis.

According to some embodiments of the present invention, the suction device 22 is provided in a plurality, and the plurality of suction devices 22 are attached to the bottom of the suction cup 21 in a spaced apart relationship. For example, in the example of fig. 1, the suction cup 21 may be provided with two communication ports 221 at a side away from the air blowing assembly 4, and the two communication ports 221 may be provided at intervals on the lower surface of the suction cup 21. The number of the air-extracting devices 22 is two, and the two air-extracting devices 22 may be connected to the corresponding communication ports 221, respectively. When the leveling device 100 of the lithography machine is in operation, the two air-extracting devices 22 can simultaneously evacuate the suction cup 21, so that the rate at which the inside of the suction cup 21 becomes vacuum-like can be increased, and the chip 200 can be quickly adsorbed on the suction cup 21.

Two gas evacuation devices 22 are shown in FIG. 1 for illustrative purposes, but it will be apparent to one of ordinary skill after reading the teachings herein that it is within the scope of the present invention to apply this to three or more gas evacuation devices 22.

In some alternative embodiments, the platform 1 is a mobile platform. For example, the stage 1 may move only in the step direction of the chip 200 (e.g., left-right direction in fig. 1); alternatively, the stage 1 may move only in the scanning direction of the chip 200 (e.g., the front-back direction in fig. 1); still alternatively, the stage 1 may be moved in both the step direction and the scan direction of the chip 200. Therefore, for the chip 200 with a larger size specification, the platform 1 and the air blowing assembly 4 are matched with each other, so that the air flow at the air blowing opening 411 can be blown to various positions of the chip 200 with a larger size to ensure the flatness of the chip 200. Here, it should be explained that the "front-rear direction" refers to a direction perpendicular to the paper surface, where a direction perpendicular to the paper surface outward is "front" and a direction perpendicular to the paper surface inward is "rear".

Optionally, the air-blowing assembly 4 may further include a control module, which may be electrically connected or communicatively connected to the air-blowing members 41. When the control module is started, the air blowing piece 41 can move from the position of the corresponding guide rail 43 adjacent to the center of the turntable 42 to the end part of the guide rail 43, and during the operation of the leveling device 100 of the photoetching machine, the air blowing piece 41 can always move back and forth between the position of the guide rail 43 adjacent to the center of the turntable 42 and the end part of the guide rail 43; when the control module is closed, the blowing member 41 can be moved from an arbitrary position corresponding to the guide rail 43 to a position of the guide rail 43 adjacent to the center of the turntable 42.

A lithographic apparatus according to an embodiment of the second aspect of the invention includes a lithographic apparatus leveling device 100 according to an embodiment of the first aspect of the invention described above.

According to the lithography machine such as the laser direct writing lithography machine of the embodiment of the invention, by adopting the leveling device 100 of the lithography machine, the warping and deformation of the chip 200 can be effectively avoided, the flatness of the chip 200 is ensured, and the exposure precision of the chip 200 can be improved.

Other configurations and operations of a lithography machine, such as a laser direct write lithography machine, according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A leveling device of a lithography machine, comprising:

the chip sucking device comprises a platform, wherein a sucking disc assembly is arranged on the platform and comprises a sucking disc and at least one air extractor, the air extractor is connected with the sucking disc, a chip is suitable for being placed on the sucking disc, and the chip is suitable for being adsorbed on the sucking disc when the air extractor works;

the frame is arranged above the platform, the frame is provided with a blowing assembly, the blowing assembly comprises at least one blowing piece, a turntable and at least one guide rail, the blowing piece can move in a horizontal plane, the blowing piece comprises a blowing opening, the blowing opening is opposite to the sucker,

the turntable has a rotation axis extending in an up-down direction, the turntable is rotatable about the rotation axis,

the guide rail is connected to the turntable, the guide rail extends horizontally, and the blowing piece is movably arranged on the guide rail.

2. The apparatus of claim 1, wherein the guide rail is connected to a side of the turntable adjacent to the suction cup, and both ends of the guide rail are located on both sides of the turntable in a radial direction.

3. A lithographic apparatus as in claim 2, wherein said guide rail is provided with two blowing members, each of said blowing members being movable between a position of said guide rail adjacent to the center of said turntable and a corresponding end of said guide rail.

4. The lithographic apparatus leveling device of claim 1, wherein the number of guide rails is two, the two guide rails being perpendicular to each other.

5. The lithographic apparatus of claim 1, wherein said blowing member extends vertically in an up-and-down direction.

6. The apparatus of claim 1, wherein the frame is provided with a downwardly extending connecting rod, a lower end of the connecting rod being rotatably connected to the turntable.

7. The lithographic apparatus leveling device of any one of claims 1-6, wherein the gas evacuation device is a plurality of the gas evacuation devices, the plurality of the gas evacuation devices being attached to the bottom of the suction cup in a spaced apart relationship.

8. The lithographic apparatus leveling device of any one of claims 1-6, wherein the stage is a moving stage.

9. A lithography machine comprising a lithography machine leveling device according to any one of claims 1-8.