CN113020798A - Femtosecond laser material increase and decrease processing system and processing method - Google Patents
Femtosecond laser material increase and decrease processing system and processing method Download PDFInfo
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- CN113020798A CN113020798A CN202110297092.4A CN202110297092A CN113020798A CN 113020798 A CN113020798 A CN 113020798A CN 202110297092 A CN202110297092 A CN 202110297092A CN 113020798 A CN113020798 A CN 113020798A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
Abstract
The invention provides a femtosecond laser material increasing and decreasing processing system and a processing method, belonging to the technical field of laser processing, wherein the femtosecond laser material increasing and decreasing processing system comprises a laser emitting module and a laser working module, the laser working module comprises a light path adjusting component, a light path integrating component and a workpiece processing component, and laser emitted by the laser emitting module sequentially passes through a light path shaping component and the light path adjusting component and then reaches the workpiece processing component to carry out laser processing on a workpiece to be processed in the workpiece processing component; the workpiece processing assembly comprises a tank body and a partition arranged inside the tank body, the partition divides the tank body into a liquid storage tank and a processing tank, a communicating hole is formed in the bottom of the partition and the bottom of the tank body, a discharge hole suitable for discharging liquid is formed in the side wall of the processing tank, and the distance between the discharge hole and the bottom of the tank body is larger than the distance between a workpiece to be processed and the bottom of the tank body. The invention can obtain the microstructure with the functional coating on the surface, and the surface quality of the workpiece processing area is good and the processing effect is stable.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a femtosecond laser material increase and decrease processing system and a femtosecond laser material increase and decrease processing method.
Background
The electrochemical energy storage technology has the advantages of environmental friendliness, safety, high efficiency, long service life and the like, and is widely applied to high-end equipment in the national key development fields of aerospace, national defense and military, instruments and meters and the like.
Indexes such as energy conversion efficiency, specific capacity and rate capability of the electrochemical energy storage device are closely related to material properties and macro microstructure of the electrode. The existing mature electrode construction technology, such as chemical synthesis assembly, wet spinning, ink-jet printing and the like, has the problems of large material limitation, complex process, poor repeatability and the like. In recent years, the femtosecond laser processing technology has little influence on the periphery of materials, can safely cut, perforate and carve and is widely applied to the field of micromachining, but the interaction of the femtosecond laser and a solid material in an air environment can generate ablation debris on the surface of the materials, thereby influencing the surface quality of a workpiece processing area.
Disclosure of Invention
The invention solves the problem that when the existing femtosecond laser processing technology is applied in an air environment, ablation debris can be generated on the surface of a material due to the interaction of femtosecond laser and a solid material, and the surface quality of a workpiece processing area is further influenced.
In order to solve the problems, the invention provides a femtosecond laser material increasing and decreasing processing system which comprises a laser emitting module and a laser working module, wherein the laser working module comprises a light path adjusting component, a light path integrating component and a workpiece processing component, and laser emitted by the laser emitting module sequentially passes through a light path shaping component and the light path adjusting component and then reaches the workpiece processing component to carry out laser processing on a workpiece to be processed in the workpiece processing component;
the work piece processing subassembly includes the work piece processing pond, the work piece processing pond include the cell body with set up in the inside separator of cell body, the separator will the cell body falls into the reservoir and is used for placing the processing groove of treating the processing work piece, just the separator with the bottom of cell body is provided with the intercommunicating pore, the reservoir is used for saving chemical solution and passes through the intercommunicating pore to carry in the processing groove chemical solution, just the lateral wall of processing groove is provided with the earial drainage hole that is suitable for the flowing back, the earial drainage hole with the distance of the bottom of cell body is greater than treat the processing work piece with the distance of cell body bottom.
Preferably, the optical path shaping system comprises a beam expander, a 1/4 slide mirror group and a half slide mirror group, the 1/4 slide mirror group and the half slide mirror group are arranged downstream of the beam expander in the optical path, the 1/4 slide mirror group is arranged close to the beam expander relative to the half slide mirror group, and the 1/4 slide mirror group is suitable for switching between a working position and a non-working position.
Preferably, the 1/4 glass slide mirror group comprises a first reflecting mirror, a second reflecting mirror and 1/4 glass slides arranged between the first reflecting mirror and the second reflecting mirror, and the first reflecting mirror and/or the second reflecting mirror are/is suitable for switching between a reflecting station and a non-reflecting station.
Preferably, the half glass mirror group comprises a third reflecting mirror, a fourth reflecting mirror and a half glass mirror arranged between the third reflecting mirror and the fourth reflecting mirror.
Preferably, the optical path adjusting component includes a fifth reflector, a visible light transmission laser reflector, a non-polarized white light beam splitter and an objective lens, and the laser emitted by the laser emitting module passes through the optical path shaping component and then sequentially passes through the fifth reflector, the non-polarized white light beam splitter, the visible light transmission laser reflector and the objective lens to process the workpiece to be processed.
Preferably, the laser working module further comprises a focusing observation assembly, the focusing observation assembly comprises a white light source and an observation mirror group for receiving white light, and the white light emitted by the white light source and the laser emitted by the laser emission module are coaxially incident to the surface of the workpiece to be processed.
Preferably, the observation mirror group comprises an attenuation sheet, an optical filter, a CCD and an optical lens, which are sequentially arranged according to the incident order of the white light, wherein the attenuation sheet and the optical filter are used for converting the white light reflected by the workpiece to be processed into a signal that can be processed by the CCD, and the optical lens is used for converting the signal processed by the CCD into a digital image signal to observe the relative position of the laser and the workpiece to be processed.
Preferably, the femtosecond laser material increase and decrease processing system further comprises a power supply module, wherein the power supply module is connected with the laser emission module and the laser working module, and is used for supplying power to the laser emission module and the laser working module.
Preferably, the workpiece processing assembly further comprises a workbench for placing the workpiece processing pool, the workbench is electrically connected with the power module, and the workbench is suitable for driving the workpiece processing pool to move.
Preferably, the workpiece processing assembly further comprises a base pad and a sample carrying plate, the base pad is arranged at the bottom of the tank body, the sample carrying plate is arranged above the base pad, the sample carrying plate is used for accommodating the workpiece to be processed, and the sample carrying plate is provided with a through hole suitable for the chemical solution to penetrate through.
Preferably, the laser emission module includes a femtosecond laser and an optical shutter, the femtosecond laser, the optical shutter and the beam expander are coaxially and sequentially installed, the femtosecond laser is used for generating femtosecond laser, and the optical shutter is used for passing or blocking laser pulses.
Compared with the prior art, the femtosecond laser material increase and decrease processing system comprises:
firstly, the femtosecond laser can reduce cations in a chemical solution while processing the microstructure and deposit on the microstructure and the periphery of the microstructure to finally obtain the microstructure with a functional coating on the surface;
secondly, no obvious thermal effect is generated in the femtosecond laser processing process, and scraps and slag generated in the processing are taken away by chemical solution and cannot be accumulated around the microstructure, so that the surface quality of a workpiece processing area can be ensured;
and thirdly, chemical solution is supplemented by virtue of the communicating hole between the liquid storage tank and the processing tank, so that the solution loss caused by thermal evaporation in the laser processing process is compensated, and the dynamic balance of the liquid level in the processing tank is maintained together with the drainage hole on the side wall of the processing tank, thereby ensuring the stability of the processing effect.
In order to solve the technical problem, the invention also provides a processing method of the femtosecond laser material increasing and decreasing processing system, which is based on the femtosecond laser material increasing and decreasing processing system and comprises the following steps:
s1, placing the workpiece to be processed in a processing tank of a workpiece processing tank, and adding chemical solution into a liquid storage tank and the processing tank to enable the liquid level in the processing tank to be equal to the drainage hole in the processing tank;
step S2, turning on a laser emission module, outputting low-power femtosecond laser, adjusting the positions of a beam expander and each lens group in a laser working module to enable femtosecond laser spots to be positioned at the centers of the beam expander and each lens group, and enabling the femtosecond laser to vertically enter an objective lens and focus on the surface of the workpiece to be processed;
and S3, closing the laser emission module, re-opening the laser emission module after setting the output parameters of the laser emission module according to the processing requirements, and selecting a 1/4 glass mirror group or a half glass mirror group in the light path shaping component according to the processing requirements to adjust the polarization state of the femtosecond laser to process the workpiece to be processed.
Preferably, the step S3 of selecting the 1/4 glass-glass mirror group or the half glass-glass mirror group in the optical path shaping assembly according to the processing requirement to adjust the polarization state of the femtosecond laser includes:
if elliptical polarized light is needed to be used, moving a first reflecting mirror and a second reflecting mirror in the 1/4 glass slide mirror group into a reflecting station, and rotating a 1/4 glass slide in the 1/4 glass slide mirror group to adjust the polarization state of the femtosecond laser;
if linearly polarized light is needed, the first reflecting mirror and the second reflecting mirror in the 1/4 glass slide mirror group are moved to enter a non-reflecting station, and the half glass slide in the half glass slide mirror group is rotated to adjust the polarization state of the femtosecond laser.
Preferably, in step S2, the femtosecond laser is perpendicularly incident to the objective lens and focused on the surface of the workpiece to be processed by using the focusing observation component in the laser working module.
The advantages of the processing method of the femtosecond laser material increase and decrease processing system and the femtosecond laser material increase and decrease processing system in the invention are the same as the advantages of the femtosecond laser material increase and decrease processing system in comparison with the prior art, and are not repeated herein.
Drawings
FIG. 1 is a block diagram of a femtosecond laser material-increasing/decreasing machining system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a femtosecond laser material-increasing and material-decreasing machining system in the embodiment of the invention;
FIG. 3 is a schematic diagram of a workpiece processing cell according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a workpiece processing cell in an embodiment of the invention.
Description of reference numerals:
1-power supply module, 2-femtosecond laser, 3-optical shutter, 4-beam expander, 5-1/4 glass slide mirror group, 501-first reflector, 502-1/4 glass slide, 503-second reflector, 6-half glass slide mirror group, 601-third reflector, 602-half glass slide, 603-fourth reflector, 7-fifth reflector, 801-visible light transmission laser reflector, 802-non-polarized white light beam splitter, 9-objective lens, 10-workpiece processing tank, 1001-tank body, 1002-base pad, 1003-sample loading plate, 1004-workpiece to be processed, 1005-communication hole, 1006-drainage hole, 1007-chemical solution, 1008-liquid storage tank, 1009-processing tank, 11-workbench and 12-white light source, 13-observation mirror group, 1301-attenuation sheet, 1302-optical filter, 1303-CCD, 1304-optical lens.
Detailed Description
The technical solutions in the embodiments of the present application will be described in detail and clearly with reference to the accompanying drawings. In the description of the present invention, it is to be understood that the forward direction of "X" in the drawings represents the right direction, "the reverse direction of" X "represents the left direction," the forward direction of "Y" represents the upper direction, "the reverse direction of" Y "represents the lower direction," the forward direction of "Z" represents the front direction, "the reverse direction of" Z "represents the rear direction, and the directions or positional relationships indicated by the terms" X "," Y "and" Z "are based on the directions or positional relationships shown in the drawings of the specification, only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The terms "first", "second", … …, "fifth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," … …, "fifth" may explicitly or implicitly include at least one of the feature.
The description of the term "some embodiments" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Throughout this specification, the schematic representations of the terms used above do not necessarily refer to the same implementation or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
As shown in fig. 2, an embodiment of the present invention provides a femtosecond laser material increase and decrease processing system, which includes a laser emission module and a laser working module, where the laser working module includes a light path adjusting component, a light path integrating component and a workpiece processing component, and laser emitted by the laser emission module sequentially passes through a light path shaping component and a light path adjusting component and then reaches the workpiece processing component to perform laser processing on a workpiece 1004 to be processed in the workpiece processing component;
the workpiece processing assembly comprises a workpiece processing tank 10, the workpiece processing tank 10 comprises a tank body 1001 and a partition arranged inside the tank body 1001, the partition divides the tank body 1001 into a liquid storage tank 1008 and a processing tank 1009 for placing a workpiece 1004 to be processed, and the bottom of the separator and the tank body 1001 is provided with a communication hole 1005, the liquid storage tank 1008 is used for storing the chemical solution 1007 and conveying the chemical solution 1007 into the processing tank 1009 through the communication hole 1005, the side wall of the processing groove 1009 is provided with a drain hole 1006 suitable for draining liquid, and the distance between the drain hole 1006 and the bottom of the groove body 1001 is greater than the distance between the workpiece to be processed 1004 and the bottom of the groove body 1001, it should be noted that the distance between the drain hole 1006 and the bottom of the groove body 1001 in this embodiment refers to the distance between the lowest position of the drain hole 1006 and the bottom of the groove body 1001, and the distance between the workpiece to be processed 1004 and the bottom of the groove body 1001 in this embodiment refers to the distance between the highest position of the workpiece to be processed 1004 and the bottom of the groove body 1001.
Therefore, the femtosecond laser material increase and decrease processing system of the embodiment processes the electrode material in the chemical solution 1007 by using the femtosecond laser, can reduce cations in the chemical solution while constructing the electrode microstructure, integrally constructs a functional conductive coating on the surface of the microstructure, does not generate obvious thermal effect in the femtosecond laser processing process, takes away scraps and slag generated by processing by the chemical solution 1007 and does not accumulate around the microstructure, so that the surface quality of a workpiece processing area can be ensured, supplements the chemical solution 1007 by virtue of the communication hole 1005 between the liquid storage tank 1008 and the processing tank 1009, compensates the solution loss caused by thermal evaporation in the laser processing process, and maintains the dynamic balance of the liquid level in the processing tank 1009 with the drain hole 1006 on the side wall of the processing tank 1009, thereby ensuring the stability of the processing effect.
As shown in fig. 3 and 4, it should be noted that, in this embodiment, the shape of the partition is not limited, and may be any geometric figure, as long as the liquid storage tank 1008 is separated from the processing tank 1009, in some specific embodiments, the partition is rectangular, the longer bottom edge of the rectangle is connected to the tank bottom, the two shorter sides of the rectangle are connected to the side walls of the tank body 1001, and the longer bottom edge is provided with the communication hole 1005, the structure is simple, and except for the communication hole 1005, each side of the rectangle connected to the tank body 1001 is connected to the tank body 1001 in a sealing manner, so that it is effectively ensured that the chemical solution 1007 in the liquid storage tank 1008 can only enter the processing tank 1009 through the communication hole 1005.
It should be noted that in this embodiment, the chemical solution 1007 in the storage tank 1008 is much more than the chemical solution 1007 in the processing tank 1009, and after the solution is lost due to thermal evaporation in the laser processing process, the chemical solution 1007 in the storage tank 1008 is replenished into the processing tank 1009 through the communication hole 1005, so that the chemical solution 1007 in the processing tank 1009 can be slightly higher than the workpiece 1004 to be processed, and when the liquid level of the chemical solution 1007 in the processing tank 1009 reaches the height of the drain hole 1006, the chemical solution flows out of the drain hole 1006, and therefore, the chemical solution 1007 is replenished through the communication hole 1005 between the storage tank 1008 and the processing tank 1009, the solution loss due to thermal evaporation in the laser processing process is compensated, and the dynamic balance of the liquid level in the processing tank 1009 is maintained together with the drain hole 1006 on the side wall of the processing tank 1009, thereby ensuring the stability of the processing effect.
It should be noted that, in this embodiment, the shape of the communication hole 1005 is not limited, and may be any geometric figure, and in some specific embodiments, the shape of the communication hole 1005 is circular, so that the structure is simple, and the appearance is beautiful.
In some preferred embodiments, the workpiece processing assembly further comprises a base pad 1002 and a sample loading plate 1003 disposed in the processing tank 1009, the base pad 1002 is disposed at the bottom of the tank body 1001, the sample loading plate 1003 is disposed above the base pad 1002, the sample loading plate 1003 is used for accommodating the workpiece 1004 to be processed, and the sample loading plate 1003 is provided with a through hole suitable for the chemical solution 1007 to penetrate.
In a preferred embodiment, the sample loading plate 1003 is provided with a plurality of through holes, and the through holes are uniformly arranged on the sample loading plate 1003, so that the chemical solution 1007 can uniformly penetrate through the through holes to contact the workpiece 1004 to be processed.
In the present embodiment, the material of the sample loading plate 1003 and the base pad 1002 is not limited as long as the sample loading plate 1003 and the base pad 1002 can be ensured not to be corroded by the chemical solution 1007. In addition, in this embodiment, the shapes of the sample loading plate 1003 and the base pad 1002 are not limited, and may be any geometric figure, and in some specific embodiments, the shapes of the sample loading plate 1003 and the base pad 1002 are rectangular, so that the structure is simple, and the appearance is beautiful.
In this embodiment, the sizes of the sample loading plate 1003 and the base pad 1002 are not limited, in some preferred embodiments, the number of the sample loading plate 1003 and the base pad 1002 is one, each sample loading plate 1003 can only accommodate one workpiece 1004 to be machined, the area of the base pad 1002 is larger than that of the sample loading plate 1003, the areas of the base pad 1002 and the sample loading plate 1003 are larger than that of the workpiece 1004 to be machined, in other preferred embodiments, the number of the base pads 1002 is two, the number of the sample loading plates 1003 is one, and the two base pads 1002 are respectively arranged at two ends of the bottom of the sample loading plate 1003, so that the workpiece 1004 to be machined is placed on the sample loading plate 1003 more stably, and the machining of the workpiece 1004 to be machined is facilitated.
As shown in fig. 1 and 2, in some preferred embodiments, the laser emission module includes a femtosecond laser 2 and an optical shutter 3, the femtosecond laser 2 is used to generate femtosecond pulse laser, the optical shutter 3 is disposed behind the femtosecond laser 2, and the optical shutter 3 is used to pass or block laser pulses to control the number of output pulses.
In some preferred embodiments, the optical path shaping system includes a beam expander 4, a 1/4 slide mirror group 5 and a half slide mirror group 6, and the femtosecond laser 2, the optical shutter 3 and the beam expander 4 are coaxially and sequentially installed, the beam expander 4 is used for expanding the laser beam to obtain a smaller light spot after subsequent optical path adjustment or focusing, the 1/4 slide mirror group 5 is used for adjusting the polarization state of the laser from linear polarization to circular polarization or elliptical polarization, and the half slide mirror group 6 is used for adjusting the linear polarization angle of the laser.
In this embodiment, the 1/4 slide mirror group 5 and the half slide mirror group 6 are disposed behind the beam expander 4, the 1/4 slide mirror group 5 is disposed close to the beam expander 4 relative to the half slide mirror group 6, and the 1/4 slide mirror group 5 is suitable for switching between a working position and a non-working position. From this, when 1/4 slide mirror group 5 is in the work position, because 1/4 slide mirror group 5 is close to beam expander 4 setting for half slide mirror group 6, consequently, laser is through the beam expander 4 back of expanding, directly gets into 1/4 slide mirror group 5, adjust the polarization state of laser from linear polarization to circular polarization or elliptical polarization, and can not get into half slide mirror group 6, when 1/4 slide mirror group 5 is in the non-work position, laser is after the beam expander 4 expands, will directly get into half slide mirror group 6, adjust the linear polarization angle of laser, and can not get into 1/4 slide mirror group 5. By switching different glass mirror groups, the output power of the femtosecond laser 2 can be controlled to be slightly higher than the ablation threshold of a workpiece material, and meanwhile, a periodic structure can be induced around the constructed micropores or microgrooves, so that the electrochemical performance of the electrode material is further improved.
It should be noted that the working position in this embodiment refers to the position of 1/4 slide mirror set 5 when in working, and correspondingly, the non-working position refers to the position of 1/4 slide mirror set 5 when in non-working, and the non-working position in this embodiment may be a determined position, or may be any position, as long as 1/4 slide mirror set 5 is not in the working position.
In some preferred embodiments, 1/4 slide mirror set 5 comprises a first mirror 501, a second mirror 503, and a 1/4 slide 502 disposed between the first mirror 501 and the second mirror 503, and the first mirror 501 and/or the second mirror 503 are adapted to switch between a reflective station and a non-reflective station.
It should be noted that, in this embodiment, the reflection station refers to a position where the first reflecting mirror 501 and/or the second reflecting mirror 503 are located when operating, and correspondingly, the non-reflection station is a position where the first reflecting mirror 501 and/or the second reflecting mirror 503 are located when not operating, and the non-operating position in this embodiment may be a determined position, or may be any position, as long as it is ensured that the first reflecting mirror 501 and/or the second reflecting mirror 503 are not located at the operating position, in some preferred embodiments, the first reflecting mirror 501 and/or the second reflecting mirror 503 may be directly taken out from the operating position and placed at a suitable position, as long as it is ensured that the first reflecting mirror 501 and/or the second reflecting mirror 503 do not participate in operation.
In some preferred embodiments, the half slide mirror group 6 includes a third mirror 601, a fourth mirror 603, and a half slide 602 disposed between the third mirror 601 and the fourth mirror 603. After the laser beam enters the half glass mirror group 6 after being expanded by the beam expander 4, the laser beam is reflected by the third reflector 601, passes through the half glass 602, and is emitted by the fourth reflector 603.
In some preferred embodiments, the optical path adjusting component includes a fifth mirror 7, a visible light transmitting laser mirror 801, a non-polarized white light beam splitter 802 and an objective lens 9, the mirror reflects the femtosecond laser to adjust the optical path direction, the visible light transmitting laser mirror 801 is used for reflecting the femtosecond laser and transmitting the white light of the focusing observation component, the non-polarized white light beam splitter 802 is used for separating the energy of the incident light to obtain the reflected light and the refracted light with lower intensity; the objective lens 9 is used for focusing a laser beam, and laser emitted by the laser emission module passes through the light path shaping component and then sequentially passes through the fifth reflector 7, the unpolarized white light beam splitter 802, the visible light transmission laser reflector 801 and the objective lens 9 to process the workpiece 1004 to be processed.
In some preferred embodiments, the laser working module further comprises a focusing observation assembly, the focusing observation assembly comprises a white light source 12 and an observation mirror group 13 for receiving white light, and the white light emitted by the white light source 12 and the laser emitted by the laser emission module are coaxially incident to the surface to be processed, specifically, the white light emitted by the white light source 12 is coaxially incident to the femtosecond laser and illuminates the surface of the workpiece 1004 to be processed via a non-polarized white light beam splitter 802 and a visible light transmission laser reflector 801, and part of the white light is reflected by the surface of the workpiece 1004 to be processed and enters the observation mirror group 13 via the objective lens 9, the visible light transmission laser reflector 801 and the non-polarized white light beam splitter 802.
In some preferred embodiments, the observation mirror group 13 includes an attenuation plate 1301, a light filter 1302, a CCD1303 and an optical lens 1304, which are sequentially arranged according to the incident order of the white light, the attenuation plate 1301 and the light filter 1302 are used for converting the white light reflected by the workpiece 1004 to be processed into a signal that can be processed by the CCD1303, and the optical lens 1304 is used for converting the signal processed by the CCD1303 into a digital image signal to observe the relative position of the laser light and the workpiece 1004 to be processed.
In some preferred embodiments, the femtosecond laser material adding and removing processing system further includes a power module 1, the power module 1 is connected to the laser emitting module and the laser working module, and the power module 1 is used for supplying power to the laser emitting module and the laser working module.
In some preferred embodiments, the workpiece processing assembly further comprises a worktable 11 for placing the workpiece processing pool 10, the worktable 11 is electrically connected with the power module 1, and the worktable 11 is adapted to move the workpiece processing pool 10 to perform laser processing on the workpiece 1004 to be processed. It should be noted that, in this embodiment, the shape of the table 11 is not limited, and in some specific embodiments, the table 11 is rectangular, so that the structure is simple and the processing is convenient.
Therefore, the femtosecond laser material increase and decrease processing system of the embodiment can reduce cations in the chemical solution 1007 and deposit on and around the microstructure while the femtosecond laser processes the microstructure, so as to finally obtain the microstructure with the functional coating on the surface; on the other hand, obvious thermal effect cannot be generated in the femtosecond laser processing process, and scraps and slag generated in the processing are taken away by the chemical solution 1007 and cannot be accumulated around the microstructure, so that the surface quality of the workpiece processing area can be ensured.
In addition, the chemical solution 1007 is supplemented through the communication hole 1005 between the liquid storage tank 1008 and the processing tank 1009, so that the solution loss caused by thermal evaporation in the laser processing process is compensated, and the dynamic balance of the liquid level in the processing tank 1009 is maintained together with the drain hole 1006 on the side wall of the processing tank 1009, thereby ensuring the stability of the processing effect.
Another embodiment of the present invention provides a processing method of a femtosecond laser material increase and decrease processing system, including the following steps:
step S1, placing the workpiece 1004 to be processed in the processing tank 1009 of the workpiece processing pool 10, and adding the chemical solution 1007 into both the storage tank 1008 and the processing tank 1009, so that the liquid level in the processing tank 1009 is level with the drain hole 1006 on the processing tank 1009;
step S2, turning on a laser emission module, outputting low-power femtosecond laser, adjusting the positions of a beam expander 4 and each lens group in the laser working module to enable the femtosecond laser spot to be positioned at the centers of the beam expander 4 and each lens group, and enabling the femtosecond laser to vertically enter an objective lens 9 and focus on the surface of a workpiece 1004 to be processed;
and step S3, closing the laser emission module, re-opening the laser emission module after setting the output parameters of the laser emission module according to the processing requirements, and selecting the 1/4 glass mirror group 5 or the half glass mirror group 6 in the light path shaping component according to the processing requirements to adjust the polarization state of the femtosecond laser, so as to process the workpiece 1004 to be processed.
In some preferred embodiments, processing the workpiece 1004 to be processed includes:
step S4, controlling the table 11 to move according to a given instruction to process the workpiece 1004 to be processed;
step S5, after the machining is finished, the workpiece 1004 to be machined is placed in the air to be dried, and a workpiece with a surface coating microstructure is obtained.
Therefore, the workpiece 1004 to be processed is processed by controlling the movement of the workbench 11, so that the control is convenient, the intelligent processing is realized, the structure is simple, and the processing is easy.
In some preferred embodiments, the step S3 of selecting the 1/4 glass mirror group 5 or the half glass mirror group 6 in the optical path shaping assembly according to the processing requirement to adjust the polarization state of the femtosecond laser includes:
if elliptical polarized light is needed, moving 1/4 the first mirror 501 and the second mirror 503 in the glass slide mirror group 5 to enter a reflection station, and rotating 1/4 the 1/4 glass slide 502 in the glass slide mirror group 5 to adjust the polarization state of the femtosecond laser;
if linearly polarized light is needed, the first reflecting mirror 501 and the second reflecting mirror 503 in the glass slide mirror group 5 are moved 1/4 to enter a non-reflecting station, and the half glass slide 602 in the half glass slide mirror group 6 is rotated to adjust the polarization state of the femtosecond laser.
In some preferred embodiments, the femtosecond laser is perpendicularly incident to the objective lens 9 and focused on the surface of the workpiece 1004 to be processed by using the focusing observation component in the laser working module in step S2.
The advantages of the processing method of the femtosecond laser material increasing and decreasing processing system of the invention and the advantages of the femtosecond laser material increasing and decreasing processing system relative to the prior art are the same, and are not described herein again.
Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the spirit and scope of the present disclosure, and these changes and modifications are intended to be within the scope of the present disclosure.
Claims (14)
1. The femtosecond laser material increase and decrease processing system is characterized by comprising a laser emitting module and a laser working module, wherein the laser working module comprises a light path adjusting component, a light path integrating component and a workpiece processing component, and laser emitted by the laser emitting module sequentially passes through the light path shaping component and the light path adjusting component and then reaches the workpiece processing component to carry out laser processing on a workpiece (1004) to be processed in the workpiece processing component;
the workpiece processing assembly comprises a workpiece processing tank (10), wherein the workpiece processing tank (10) comprises a tank body (1001) and a partition arranged inside the tank body (1001), the partition divides the tank body (1001) into a liquid storage tank (1008) and a processing tank (1009) for placing the workpiece (1004) to be processed, a communication hole (1005) is formed in the bottom of the partition and the bottom of the tank body (1001), the liquid storage tank (1008) is used for storing a chemical solution (1007) and conveying the chemical solution (1007) into the processing tank (1009) through the communication hole (1005), a drainage hole (1006) suitable for drainage is formed in the side wall of the processing tank (1009), and the distance between the drainage hole (1006) and the bottom of the tank body (1001) is larger than the distance between the workpiece (1004) to be processed and the bottom of the tank body (1001).
2. The femtosecond laser additive-subtractive processing system according to claim 1, wherein the optical path shaping system comprises a beam expander (4), a 1/4 slide mirror group (5) and a half slide mirror group (6), the 1/4 slide mirror group (5) and the half slide mirror group (6) are disposed downstream of the beam expander (4), the 1/4 slide mirror group (5) is disposed close to the beam expander (4) relative to the half slide mirror group (6), and the 1/4 slide mirror group (5) is adapted to be switched between a working position and a non-working position.
3. The femtosecond laser additive-subtractive processing system according to claim 2, wherein the 1/4 slide mirror group (5) comprises a first mirror (501), a second mirror (503), and a 1/4 slide (502) disposed between the first mirror (501) and the second mirror (503), and the first mirror (501) and/or the second mirror (503) are adapted to switch between a reflective station and a non-reflective station.
4. The femtosecond laser additive-subtractive processing system according to claim 2, wherein the half-glass mirror group (6) comprises a third mirror (601), a fourth mirror (603) and a half-glass (602) disposed between the third mirror (601) and the fourth mirror (603).
5. The femtosecond laser material increase and decrease processing system according to claim 2, wherein the optical path adjusting component comprises a fifth reflector (7), a visible light transmission laser reflector (801), a non-polarized white light beam splitter (802) and an objective lens (9), and the laser emitted by the laser emitting module passes through the optical path shaping component and then sequentially passes through the fifth reflector (7), the non-polarized white light beam splitter (802), the visible light transmission laser reflector (801) and the objective lens (9) to process the workpiece (1004) to be processed.
6. The femtosecond laser additive-subtractive machining system according to claim 1, wherein the laser working module further comprises a focusing observation assembly, the focusing observation assembly comprises a white light source (12) and an observation mirror group (13) for receiving white light, and the white light emitted by the white light source (12) and the laser emitted by the laser emitting module are coaxially incident on the surface of the workpiece to be machined (1004).
7. The femtosecond laser material increase and decrease processing system according to claim 6, wherein the observation mirror group (13) comprises an attenuation sheet (1301), a light filter (1302), a CCD (1303) and an optical lens (1304) which are sequentially arranged according to the incidence order of the white light, the attenuation sheet (1301) and the light filter (1302) are used for converting the white light reflected by the workpiece to be processed (1004) into a signal which can be processed by the CCD (1303), and the optical lens (1304) is used for converting the signal processed by the CCD (1303) into a digital image signal to observe the relative position of the laser and the workpiece to be processed (1004).
8. The femtosecond laser incremental and subtractive machining system according to claim 1, further comprising a power supply module (1), wherein the power supply module (1) is connected with the laser emitting module and the laser working module, and the power supply module (1) is used for supplying power to the laser emitting module and the laser working module.
9. The femtosecond laser additive-subtractive processing system according to claim 8, wherein the workpiece processing assembly further comprises a workbench (11) for placing the workpiece processing pool (10), the workbench (11) is electrically connected with the power supply module (1), and the workbench (11) is adapted to drive the workpiece processing pool (10) to move.
10. The femtosecond laser incremental and decremental machining system according to claim 1, wherein the workpiece machining assembly further comprises a base pad (1002) and a sample loading plate (1003) disposed in the machining tank (1009), the base pad (1002) is disposed at the bottom of the tank body (1001), the sample loading plate (1003) is disposed above the base pad (1002), the sample loading plate (1003) is used for accommodating the workpiece (1004) to be machined, and a through hole suitable for the chemical solution (1007) to penetrate is disposed on the sample loading plate (1003).
11. The femtosecond laser incremental and subtractive processing system according to claim 2, wherein the laser emitting module comprises a femtosecond laser (2) and an optical shutter (3), the femtosecond laser (2), the optical shutter (3) and the beam expander (4) are coaxially and sequentially installed, and the femtosecond laser (2) is used for generating femtosecond laser and the optical shutter (3) is used for passing or blocking laser pulses.
12. A processing method of a femtosecond laser material increase and decrease processing system, which is based on the femtosecond laser material increase and decrease processing system as set forth in any one of claims 1 to 11, and is characterized by comprising the following steps:
step S1, placing a workpiece (1004) to be processed into a processing tank (1009) of a workpiece processing pool (10), and adding a chemical solution (1007) into a liquid storage tank (1008) and the processing tank (1009) so that the liquid level in the processing tank (1009) is equal to a drain hole (1006) on the processing tank (1009);
step S2, turning on a laser emission module, outputting low-power femtosecond laser, adjusting the positions of a beam expander (4) and each lens group in a laser working module to enable femtosecond laser spots to be positioned at the centers of the beam expander (4) and each lens group, and enabling the femtosecond laser to vertically enter an objective lens (9) and focus on the surface of the workpiece (1004) to be processed;
and S3, closing the laser emission module, re-opening the laser emission module after setting the output parameters of the laser emission module according to the processing requirements, and selecting a 1/4 glass mirror group (5) or a half glass mirror group (6) in the light path shaping component according to the processing requirements to adjust the polarization state of the femtosecond laser to process the workpiece to be processed (1004).
13. The processing method of femtosecond laser additive-subtractive processing system according to claim 12, wherein the step S3 of selecting the 1/4 glass mirror group (5) or the half glass mirror group (6) in the optical path shaping assembly according to the processing requirement to adjust the polarization state of the femtosecond laser comprises:
if elliptical polarized light is needed to be used, a first reflecting mirror (501) and a second reflecting mirror (503) in the 1/4 glass slide mirror group (5) are moved into a reflecting station, and 1/4 glass slides (502) in the 1/4 glass slide mirror group (5) are rotated to adjust the polarization state of the femtosecond laser;
if linearly polarized light is needed, a first reflecting mirror (501) and a second reflecting mirror (503) in the 1/4 glass slide mirror group (5) are moved into a non-reflecting station, and a half glass slide (602) in the half glass slide mirror group (6) is rotated to adjust the polarization state of the femtosecond laser.
14. The machining method of a femtosecond laser incremental and decremental material machining system according to claim 12, wherein in step S2, the femtosecond laser is perpendicularly incident to the objective lens (9) and focused on the surface of the workpiece to be machined (1004) by using the focusing observation component in the laser working module.
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| WO2022193678A1 (en) * | 2021-03-19 | 2022-09-22 | 哈尔滨工业大学 | Femtosecond laser additive/subtractive machining system and machining method |
| CN114054969B (en) * | 2021-11-30 | 2024-05-03 | 哈尔滨工业大学 | Ultrafast laser processing method for flexible asymmetric electrode |
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| CN114054969A (en) * | 2021-11-30 | 2022-02-18 | 哈尔滨工业大学 | Ultrafast laser processing method of flexible asymmetric electrode |
| CN114054969B (en) * | 2021-11-30 | 2024-05-03 | 哈尔滨工业大学 | Ultrafast laser processing method for flexible asymmetric electrode |
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