CN113013118A - 应用磁性盖封装的封装级芯片、芯片模组及电子产品 - Google Patents

应用磁性盖封装的封装级芯片、芯片模组及电子产品 Download PDF

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CN113013118A
CN113013118A CN202110193674.8A CN202110193674A CN113013118A CN 113013118 A CN113013118 A CN 113013118A CN 202110193674 A CN202110193674 A CN 202110193674A CN 113013118 A CN113013118 A CN 113013118A
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白彦文
刘宪明
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Yingren Technology Shanghai Co ltd
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Abstract

本申请提供了一种应用磁性盖封装的封装级芯片、芯片模组及电子产品。其中，应用磁性盖封装的封装级芯片(1)包括晶粒(2)、封装材料(3)、基板(4)、磁性盖(8)。所述封装材料(3)封装于所述晶粒(2)的外部，所述晶粒(2)设置于所述基板(4)之上，所述磁性盖(8)封装于所述封装材料(3)的顶部，所述磁性盖(8)具有磁性。

Description

应用磁性盖封装的封装级芯片、芯片模组及电子产品
技术领域
本申请涉及半导体制造领域，尤其涉及一种应用磁性盖封装的封装级芯片、芯片模组及电子产品。
背景技术
随着PCIe Gen3/Gen4/Gen5(第三代/第四代/第五代高速串行计算机扩展总线接口标准)的产品更迭，还有UFS(通用闪存存储)或者其他高速紧凑型产品的出现，数据的传输速度越来越快，数据的存储容量越来越大，芯片的散热设计的挑战也随之加大。现有产品(例如M.2固态硬盘模组)的主要散热方式包括：设置金属盖、设置四周溅射散热涂层、裸片封装、露芯片封装、外加金属散热器和导热硅胶片、外贴铜箔、外贴石墨烯片等。
业界较为常用的是外加金属散热器和导热硅胶片的散热方式。如图1、2所示，现有技术中，封装级芯片1包括晶粒2、封装材料3、基板4。封装级芯片1设置在印制电路板5(PCB)上，与散热片6(例如导热硅胶片)、散热器7(例如金属散热器)配合，形成芯片模组。芯片模组中热量的传导路径包括由封装级芯片1、散热片6、散热器7传导到外界。可以理解，晶粒2上面和封装材料3外部的箭头表示向上的热传导、热对流方向。
上述芯片模组的散热设计的优点是散热效果明显，安装简易。缺点是导热硅胶片和金属散热器的存在使得芯片模组整体的高度明显增大，应用范围受限。导热硅胶片易老化失效，会使得散热效果下降。封装级芯片1的顶部(封装材料3的顶部)与散热器7之间容易存在穴居的空气泡，空气导热系数较低，会影响封装级芯片1中的热源(例如晶粒2)到散热器7之间的热阻，影响散热效率。
发明内容
本申请提供了一种应用磁性盖封装的封装级芯片、芯片模组及电子产品。
本申请提出的应用磁性盖封装的封装级芯片包括：
晶粒；
封装材料，所述封装材料封装于所述晶粒的外部；
基板，所述晶粒设置于所述基板之上；以及
磁性盖，所述磁性盖封装于所述封装材料的顶部，所述磁性盖具有磁性。
在至少一个实施方式中，所述磁性盖中包含磁体，所述磁体使得所述应用磁性盖封装的封装级芯片的顶部具有磁性。
在至少一个实施方式中，所述磁体设置于所述磁性盖的内部，且所述磁体与所述磁性盖的表面有间隔。
在至少一个实施方式中，所述磁体为钕磁铁。
在至少一个实施方式中，所述磁性盖为金属盖。
本申请提出的应用磁性盖封装的芯片模组包括：
应用磁性盖封装的封装级芯片，所述应用磁性盖封装的封装级芯片为前述的应用磁性盖封装的封装级芯片；
印制电路板，所述应用磁性盖封装的封装级芯片设置于所述印制电路板之上；以及
散热器，所述散热器被所述磁性盖吸附于所述磁性盖之上。
在至少一个实施方式中，所述散热器和所述磁性盖之间设置有硅脂。
在至少一个实施方式中，所述散热器包括金属散热器、热管、金属外壳、金属连接器中的至少一种。
在至少一个实施方式中，所述散热器和所述磁性盖的接触面紧贴在一起。
本申请提出的一种电子产品包括前述的应用磁性盖封装的芯片模组。
本申请提出的封装级芯片顶部可以配合安装散热器，通过应用磁性盖封装芯片，使封装级芯片和散热器之间的间隙较小，残留的空气较少，从而减少发热源到散热器之间的热阻，利于散热。同时利用磁性定位散热器，使散热器的定位安装方便，不使用导热硅胶片，可以降低芯片模组的整体高度。
附图说明
图1示出了现有技术中芯片模组的结构示意图。
图2示出了现有技术中封装级芯片的结构示意图。
图3示出了根据本申请实施方式的封装级芯片的结构示意图。
图4示出了根据本申请实施方式的芯片模组的结构示意图。
图5示出了根据本申请实施方式的另一芯片模组的结构示意图。
附图标记说明
1封装级芯片；2晶粒；3封装材料；4基板；5印制电路板；6散热片；7散热器；8磁性盖；9磁体。
具体实施方式
下面参照附图描述本申请的示例性实施方式。应当理解，这些具体的说明仅用于示教本领域技术人员如何实施本申请，而不用于穷举本申请的所有可行的方式，也不用于限制本申请的范围。
本申请提供了应用磁性盖封装的封装级芯片、芯片模组及电子产品。如图3、4所示，封装级芯片1包括晶粒2、封装材料3、基板4和磁性盖8。
封装材料3封装于晶粒2外部，晶粒2设置于基板4之上，磁性盖8封装于封装材料3的顶部。可以理解，相比于其他固定方法，将磁性盖8直接封装于封装材料3的顶部，工艺更加简单，磁性盖8与封装材料3的结合更加可靠。封装级芯片1的具体使用位姿不限制。
磁性盖8中包含磁体9，磁体9在磁性盖8的内部且磁体9距磁性盖8的表面具有一定距离。由例如金属的磁性盖8包裹于磁体9外部，可以抑制磁体9的磁场与封装级芯片1的磁场之间的耦合。具体加工过程可以在磁性盖8上开槽，在槽中设置块状的磁体9，然后封住开槽部位，使磁体9置于磁性盖8内部。如果在金属盖内部添加磁性粉，也可以使金属盖具有磁性，成为磁性盖8。但是磁性粉的分布不易控制，使得磁体9的磁场不容易抑制。磁性粉可能会吸收信号传输过程中的电磁波而引发信号完整性的问题。磁体9可以为钕磁铁，当然本申请对磁体9的具体类别不限制。
磁性盖8可以为金属盖，利用金属较好的导热性可以更好地将热量传导到散热器7(后面介绍)。
如图4、5所示，芯片模组包括封装级芯片1、印制电路板5、散热器7。
封装级芯片1为上述的封装级芯片1，封装级芯片1设置于印制电路板5之上，散热器7吸附于磁性盖8之上。例如可以由4块封装级芯片1设置在印制电路板5上，形成一个芯片模组，实现特定功能。可以理解，芯片模组的具体使用位姿不限制，每个芯片模组需要的封装级芯片1的数量不限制。
散热器7的材料可以具有铁磁性，使得散热器7和磁性盖8能通过磁力和重力贴紧在一起。散热器7和磁性盖8的接触面可能凹凸不平而穴居空气，磁力施加的吸引力，可以在一定程度上减少封装级芯片1和散热器7之间的空气，降低热阻，提高散热效率。也可以在散热器7和磁性盖8之间涂上硅脂，磁力使得硅脂更好地分布于散热器7和磁性盖8的表面的凹凸不平处，得以更好地挤压空气。可以理解，硅脂较薄，对芯片模组的高度影响较小。
另外，封装级芯片1对散热器7施加的磁力可以引导散热器7到安装位置，更利于散热器7定位安装。
散热器7可以为金属散热器、热管、金属外壳、金属连接器中的一种。可以理解，图4中散热器7内部的的箭头表示散热方向，但不限于向右。
本申请提出的电子产品包括上述的芯片模组，芯片模组中的封装级芯片1应用磁性盖8封装。实现不同功能的芯片模组组装在一起，形成终端电子产品。电子产品可以为硬盘、手机、电子计算机等。
本申请可以不使用导热硅胶片等散热涂层，使得芯片模组的高度得到一定程度的降低，同时避免了导热硅胶片等高分子材料失效的问题。
以上所述是本申请的优选实施方式，应当指出，对于本领域技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (10)

1.一种应用磁性盖封装的封装级芯片，其特征在于，
所述应用磁性盖封装的封装级芯片(1)包括：
晶粒(2)；
封装材料(3)，所述封装材料(3)封装于所述晶粒(2)的外部；
基板(4)，所述晶粒(2)设置于所述基板(4)之上；以及
磁性盖(8)，所述磁性盖(8)封装于所述封装材料(3)的顶部，所述磁性盖(8)具有磁性。
2.根据权利要求1所述的封装级芯片，其特征在于，
所述磁性盖(8)中包含磁体(9)，所述磁体(9)使得所述应用磁性盖封装的封装级芯片(1)的顶部具有磁性。
3.根据权利要求2所述的封装级芯片，其特征在于，
所述磁体(9)设置于所述磁性盖(8)的内部，且所述磁体(9)与所述磁性盖(8)的表面有间隔。
4.根据权利要求2所述的封装级芯片，其特征在于，
所述磁体(9)为钕磁铁。
5.根据权利要求1所述的封装级芯片，其特征在于，
所述磁性盖(8)为金属盖。
6.一种应用磁性盖封装的芯片模组，其特征在于，
所述应用磁性盖封装的芯片模组包括：
应用磁性盖封装的封装级芯片(1)，所述应用磁性盖封装的封装级芯片(1)为权利要求1至5中任一项所述的应用磁性盖封装的封装级芯片(1)；
印制电路板(5)，所述应用磁性盖封装的封装级芯片(1)设置于所述印制电路板(5)之上；以及
散热器(7)，所述散热器(7)被所述磁性盖(8)吸附于所述磁性盖(8)之上。
7.根据权利要求6所述的芯片模组，其特征在于，
所述散热器(7)和所述磁性盖(8)之间设置有硅脂。
8.根据权利要求6所述的芯片模组，其特征在于，
所述散热器(7)包括金属散热器、热管、金属外壳、金属连接器中的至少一种。
9.根据权利要求6所述的芯片模组，其特征在于，
所述散热器(7)和所述磁性盖(8)的接触面紧贴在一起。
10.一种电子产品，其特征在于，
所述电子产品包括权利要求6至9中任一项所述的应用磁性盖封装的芯片模组。
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