CN113000416A - Test screening method of oscillator circuit module - Google Patents
Test screening method of oscillator circuit module Download PDFInfo
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- CN113000416A CN113000416A CN202110164284.8A CN202110164284A CN113000416A CN 113000416 A CN113000416 A CN 113000416A CN 202110164284 A CN202110164284 A CN 202110164284A CN 113000416 A CN113000416 A CN 113000416A
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- 238000012360 testing method Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000012216 screening Methods 0.000 title claims abstract description 18
- 238000013461 design Methods 0.000 claims abstract description 24
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 238000005259 measurement Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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Abstract
The invention provides a test screening method of an oscillator circuit module, which comprises the following steps: step S10: providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules; step S20: and carrying out N times of frequency output detection on each oscillator circuit module, wherein N is more than or equal to 2 and is a positive integer. According to the invention, whether the circuit design of the oscillator circuit module has a problem is obtained by additionally carrying out N times of frequency output detection on each oscillator circuit module, so that the accuracy of the test can be effectively improved, the stability of the output frequency of the oscillator circuit module can be effectively detected, the problem of circuit design error of the oscillator circuit module is detected, and the reliability index of a chip is improved.
Description
Technical Field
The invention relates to the field of semiconductor memory devices, in particular to a test screening method of an oscillator circuit module.
Background
Semiconductor memory devices (e.g., flash memory or embedded memory, etc.) are continuously being developed toward high integration and high capacity memory cells. In flash memory design, various error checking and correction repair methods are commonly used to improve the yield of flash memory.
An OSC (Oscillator) IP (circuit module) is a common circuit module in a chip analog circuit module, and in a test at the beginning of design, only a temperature drift coefficient and a dispersion coefficient of the OSC IP are usually determined according to a preset specification standard of an OSC output frequency, and the reliability of the OSC IP chip measured by the test method is low.
Disclosure of Invention
The invention aims to provide a test screening method of an oscillator circuit module so as to improve the reliability of the oscillator circuit module.
In order to solve the above technical problem, the present invention provides a test screening method for an oscillator circuit module, comprising the following steps:
providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules; and
and carrying out N times of frequency output detection on each oscillator circuit module, wherein N is more than or equal to 2 and is a positive integer.
Optionally, each oscillator circuit module is subjected to N times of frequency output detection to obtain a difference value between a maximum value and a minimum value of output frequency obtained by the N times of detection,
when the difference value between the maximum value and the minimum value of the output frequency is 0, the design of the oscillator circuit module is free from problems; and
and when the difference value between the maximum value and the minimum value of the output frequency is greater than 0, the problem of the design of the oscillator circuit module is indicated.
Further, N is more than or equal to 2 and less than or equal to 100, and N is a positive integer.
Further, the chip to be tested comprises a chip of the oscillator circuit module.
Further, the chip to be tested comprises a chip with an embedded oscillator circuit module.
Optionally, after performing N frequency output detections on each oscillator circuit module, the method further includes:
and carrying out temperature drift coefficient detection and discrete coefficient test on each oscillator circuit module.
Compared with the prior art, the method has the following beneficial effects:
the invention provides a test screening method of an oscillator circuit module, which comprises the following steps: step S10: providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules; step S20: and carrying out N times of frequency output detection on each oscillator circuit module, wherein N is more than or equal to 2 and is a positive integer. According to the invention, whether the circuit design of the oscillator circuit module has a problem is obtained by additionally carrying out N times of frequency output detection on each oscillator circuit module, so that the accuracy of the test can be effectively improved, the stability of the output frequency of the oscillator circuit module can be effectively detected, the problem of circuit design error of the oscillator circuit module is detected, and the reliability index of a chip is improved.
Drawings
Fig. 1 is a flowchart illustrating a test screening method for an oscillator circuit module according to an embodiment of the present invention.
Detailed Description
The test screening method of an oscillator circuit module according to the present invention will be described in further detail below. The present invention will now be described in more detail with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it being understood that one skilled in the art may modify the invention herein described while still achieving the advantageous effects of the invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. It will of course be appreciated that in the development of any such actual embodiment, numerous implementation-specific details must be set forth in order to achieve the developer's specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art.
In order to make the objects and features of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise ratio for the purpose of facilitating and distinctly aiding in the description of the embodiments of the invention.
Fig. 1 is a schematic flowchart of a test screening method for an oscillator circuit module according to this embodiment. As shown in fig. 1, the present embodiment provides a test screening method for an oscillator circuit module.
The test screening method of the oscillator circuit module comprises the following steps:
step S10: providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules;
step S20: performing frequency output detection on each oscillator circuit module for N times; and
step S30: and carrying out temperature drift coefficient detection and discrete coefficient test on each oscillator circuit module.
The test screening method of the oscillator circuit module is described in detail below with reference to fig. 1.
Step S10 is executed first, and a plurality of chips to be tested are provided, where the chips to be tested include an oscillator circuit module.
The oscillator circuit module of the chip to be tested is, for example, a newly designed circuit module. The chip to be tested can be a chip of the oscillator circuit module, and particularly, the chip to be tested can be a chip with the embedded oscillator circuit module.
Then, step S20 is executed to perform N frequency output detections on each oscillator circuit module, where N is greater than or equal to 2 and N is a positive integer. Compared with the conventional method that the same test item is only detected once to obtain the detection result, whether the circuit design of the oscillator circuit module has a problem or not is obtained through N times of frequency output detection, and the accuracy of the test can be effectively improved.
In a normal circuit design of the oscillator circuit module, the output frequency of the oscillator circuit module is the same no matter how many times the frequency output of the same oscillator circuit module is measured, that is, Freq _ Delta is F _ Max-F _ Min is 0, where F _ Max is the maximum output frequency and F _ Min is the minimum output frequency. However, when a problem occurs in the circuit design of the oscillator circuit block (i.e., a defect occurs in the circuit design of the oscillator circuit block), Freq _ Delta is not zero, and is, for example, greater than 0.
In order to detect whether a problem occurs in the circuit design of the oscillator circuit module, the output frequency of the oscillator circuit module is detected for N times, and the difference value (i.e., Freq _ Delta) between the maximum value and the minimum value of the output frequency obtained by the N times of detection is obtained. In the embodiment, N is more than or equal to 2 and less than or equal to 100, and N is a positive integer.
Specifically, F _ Max and F _ Min are obtained by the following test procedures:
1)Measure Freq with N times:
1st OSC Measurement:Freq[0]＝F0,Then,
If F0≥F_Max,F_Max＝F0； If F0≤F_Min,F_Min＝F0
2nd OSC Measurement:Freq[1]＝F1,Then,
If F1≥F_Max,F_Max＝F1； If F1≤F_Min,F_Min＝F1
3rd OSC Measurement:Freq[2]＝F2,Then,
If F2≥F_Max,F_Max＝F2； If F2≤F_Min,F_Min＝F2
……
N-1th OSC Measurement:Freq[N-1]＝FN-1,Then,
If FN-1≥F_Max,F_Max＝FN-1； If FN-1≤F_Min,F_Min＝FN-1
Nth OSC Measurement:Freq[N]＝FN,Then,
If FN≥F_Max,F_Max＝FN； If FN≤F_Min,F_Min＝FN
next, Freq _ Delta is obtained by the following test procedure:
2)Calculate Freq_Delta:
Freq_Delta＝F_Max-F_Min
if at least most of the obtained Freq _ Delta values are 0, the circuit design of the oscillator circuit module is normal, namely, the circuit design of the oscillator circuit module has no problem, and if the obtained Freq _ Delta values are more than 0, the circuit design of the oscillator circuit module has a problem, and the test result needs to be fed back to a designer to modify the circuit design of the oscillator circuit module, so that the problem that the reliability of a product is reduced due to design errors is avoided, and the quality of the product is influenced.
In this embodiment, when the oscillator circuit module with 81410 chips is subjected to frequency output detection for 100 times, test results shown in the following table appear, where the number of failed chips with Freq _ Delta values between 0.00 and 0.20 is 41894, and the failure rate is 51.46%; the number of the failed chips with the value of Freq _ Delta between 0.21 and 0.40 is 13166, and the failure rate is 16.17%; the number of the failure chips with the value of Freq _ Delta between 0.41 and 0.60 is 3516, and the failure rate is 4.32 percent; the number of the failure chips with the value of Freq _ Delta between 0.61 and 0.80 is 1223, and the failure rate is 1.50 percent; the number of the failed chips with the value of Freq _ Delta between 0.81 and 1.00 is 564, and the failure rate is 0.69%; the number of the failed chips with the value of Freq _ Delta of 1.01-2.00 is 588, and the failure rate is 0.72%; the number of the failure chips with the value of Freq _ Delta between 2.01 and 4.00 is 65, and the failure rate is 0.08 percent; the number of the failed chips with the value of Freq _ Delta between 4.01 and 8.00 is 2, and the failure rate is 0.00 percent; the number of the failed chips with the value of Freq _ Delta between 8.01 and 100.00 is 2, and the failure rate of the failed chips is 0.00 percent. The total number of the failed chips is 61020, and the failure rate is 74.94%. Therefore, at least most values of Freq _ Delta are larger than 0, and a large number of values are concentrated between 0.00 and 4.00, so that the circuit design of the oscillator circuit module has problems.
As can be seen from the above table, the stability of the output frequency of the oscillator circuit module can be effectively detected through the step, so that the problem of circuit design error of the oscillator circuit module is detected, and the reliability index of the chip is improved.
In the step, when the measured value of Freq _ Delta is kept to be 0 in a period of time, namely after the product enters mass production, the test of the test item can be selected not to be carried out.
Next, step S30 is executed to perform a temperature drift coefficient test and a discrete coefficient test on each of the oscillator circuit modules.
In this embodiment, the temperature drift coefficient test and the dispersion coefficient test can be performed by a conventional test method, and therefore, the details are not repeated herein.
In summary, the test screening method for the oscillator circuit module provided by the invention includes the following steps: step S10: providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules; step S20: and carrying out N times of frequency output detection on each oscillator circuit module, wherein N is more than or equal to 2 and is a positive integer. According to the invention, whether the circuit design of the oscillator circuit module has a problem is obtained by additionally carrying out N times of frequency output detection on each oscillator circuit module, so that the accuracy of the test can be effectively improved, the stability of the output frequency of the oscillator circuit module can be effectively detected, the problem of circuit design error of the oscillator circuit module is detected, and the reliability index of a chip is improved.
In addition, unless otherwise specified or indicated, the description of the terms "first" and "second" in the specification is only used for distinguishing various components, elements, steps and the like in the specification, and is not used for representing logical relationships or sequential relationships among the various components, elements, steps and the like.
It is to be understood that while the present invention has been described in conjunction with the preferred embodiments thereof, it is not intended to limit the invention to those embodiments. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention, unless the contents of the technical solution of the present invention are departed.
Claims (6)
1. A test screening method for oscillator circuit modules is characterized by comprising the following steps:
providing a plurality of chips to be tested, wherein the chips to be tested comprise oscillator circuit modules; and
and carrying out N times of frequency output detection on each oscillator circuit module, wherein N is more than or equal to 2 and is a positive integer.
2. The test screening method for the oscillator circuit module according to claim 1,
performing N times of frequency output detection on each oscillator circuit module to obtain the difference value between the maximum value and the minimum value of the output frequency obtained by the N times of detection,
when the difference value between the maximum value and the minimum value of the output frequency is 0, the design of the oscillator circuit module is free from problems; and
and when the difference value between the maximum value and the minimum value of the output frequency is greater than 0, the problem of the design of the oscillator circuit module is indicated.
3. The method of claim 2, wherein 2 ≦ N ≦ 100, and N is a positive integer.
4. The test screening method for the oscillator circuit module according to claim 3, wherein the chip under test includes a chip of the oscillator circuit module.
5. The method of claim 4, wherein the chip under test comprises a chip with an embedded oscillator circuit module.
6. The method of test screening of oscillator circuit modules of claim 1, further comprising, after performing N frequency output tests on each of said oscillator circuit modules:
and carrying out temperature drift coefficient detection and discrete coefficient test on each oscillator circuit module.
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Citations (6)
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| US20010044702A1 (en) * | 2000-04-13 | 2001-11-22 | Alessandro Rocchi | Device for testing and calibrating the oscillation frequency of an integrated oscillator |
| TW201027101A (en) * | 2008-12-30 | 2010-07-16 | Dongbu Hitek Co Ltd | Measurement apparatus for improving performance of standard cell library |
| CN102193496A (en) * | 2010-03-08 | 2011-09-21 | 技嘉科技股份有限公司 | Method for detecting real time clock (RTC) oscillator and calculator system |
| CN103973266A (en) * | 2013-01-31 | 2014-08-06 | 新唐科技股份有限公司 | Oscillator correction circuit and method and integrated circuit |
| CN108318809A (en) * | 2017-01-16 | 2018-07-24 | 奇景光电股份有限公司 | The built-in self-test circuit of frequency jitter |
| CN109541443A (en) * | 2019-01-10 | 2019-03-29 | 北京智芯微电子科技有限公司 | Real-time clock detection device and method |
-
2021
- 2021-02-05 CN CN202110164284.8A patent/CN113000416A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010044702A1 (en) * | 2000-04-13 | 2001-11-22 | Alessandro Rocchi | Device for testing and calibrating the oscillation frequency of an integrated oscillator |
| TW201027101A (en) * | 2008-12-30 | 2010-07-16 | Dongbu Hitek Co Ltd | Measurement apparatus for improving performance of standard cell library |
| CN102193496A (en) * | 2010-03-08 | 2011-09-21 | 技嘉科技股份有限公司 | Method for detecting real time clock (RTC) oscillator and calculator system |
| CN103973266A (en) * | 2013-01-31 | 2014-08-06 | 新唐科技股份有限公司 | Oscillator correction circuit and method and integrated circuit |
| CN108318809A (en) * | 2017-01-16 | 2018-07-24 | 奇景光电股份有限公司 | The built-in self-test circuit of frequency jitter |
| CN109541443A (en) * | 2019-01-10 | 2019-03-29 | 北京智芯微电子科技有限公司 | Real-time clock detection device and method |
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