CN115993565A - Error compensation method for radio frequency chip test system - Google Patents
Error compensation method for radio frequency chip test system Download PDFInfo
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- CN115993565A CN115993565A CN202310037891.7A CN202310037891A CN115993565A CN 115993565 A CN115993565 A CN 115993565A CN 202310037891 A CN202310037891 A CN 202310037891A CN 115993565 A CN115993565 A CN 115993565A
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Abstract
The invention discloses a radio frequency chip test system error compensation method, which comprises the following steps: s100: obtaining each parameter standard value of a standard radio frequency chip; s200: obtaining test values of parameters of a standard radio frequency chip; s300: manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of a standard radio frequency chip; s400: performing small batch test on the radio frequency chip to be tested in a mass production test environment to obtain small batch sample data, and generating a final compensation file based on the small batch sample data and the dynamic compensation configuration file; s500: and carrying out mass test on the radio frequency chip to be tested in a mass production test environment to obtain a mass production measurement value, and compensating the mass production measurement value according to the final compensation file to obtain a mass production measurement value after the compensation of the radio frequency chip to be tested.
Description
Technical Field
The disclosure belongs to the field of semiconductor testing, and in particular relates to an error compensation method of a radio frequency chip testing system.
Background
The test of the radio frequency chip has higher requirements on performance indexes of instruments, and particularly has higher requirements on system errors of the whole test system. Because the test system often further comprises peripheral components such as a radio frequency device, a radio frequency cable, a test fixture and the like, the overall test accuracy of the test system is often affected by radio frequency parameter deviation caused by insertion loss, return loss and the like of each component. Usually we can only calibrate the test instrument itself, but test systems incorporating peripheral radio frequency components cannot be calibrated at the system level by existing tools. And some test components such as test spring pins, the contact impedance and the radio frequency index of the test components can change along with the increase of the test times, namely the radio frequency index of the test components shows a dynamic change state along with the accumulation of the test quantity.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide an error compensation method of a radio frequency chip test system, which solves the problem that a radio frequency test system comprising an external radio frequency test component cannot perform system level calibration in a system linear compensation calibration mode, and solves the problem of dynamic offset of a radio frequency index of a vulnerable test component by periodically comparing and adjusting compensation values.
In order to achieve the above object, the present disclosure provides the following technical solutions:
the error compensation method of the radio frequency chip test system comprises the following steps:
s100: obtaining each parameter standard value of a standard radio frequency chip;
s200: obtaining test values of parameters of a standard radio frequency chip;
s300: manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of a standard radio frequency chip;
s400: performing small batch test on the radio frequency chip to be tested in a mass production test environment to obtain small batch sample data, and generating a final compensation file based on the small batch sample data and the dynamic compensation configuration file;
s500: and carrying out mass test on the radio frequency chip to be tested in a mass production test environment to obtain a mass production measurement value, and compensating the mass production measurement value according to the final compensation file to obtain a mass production measurement value after the compensation of the radio frequency chip to be tested.
Preferably, the parameters of the standard radio frequency chip include: gain at 3.3GHz, 1dB compression point, third order intermodulation intercept point, input return loss, output return loss and noise figure.
Preferably, step S400 includes the steps of:
s401: comparing the small-batch sample data with the clamping control range of the parameter test value in the dynamic compensation configuration file to judge the rationality of the small-batch sample data, and if the rationality is high, continuing to execute the step S402; if not, adjusting the mass production test environment to carry out small batch test on the radio frequency chip to be tested again;
s402: and obtaining a compensation value based on the small-batch sample data and the parameter standard value in the dynamic compensation configuration file, and filling the compensation value into a final compensation file.
Preferably, in step S500, the compensating the mass production measurement value according to the final compensation file includes: and adding the mass production measured value and the compensation value to obtain the mass production measured value of the radio frequency chip to be measured after compensation.
The disclosure also provides an error compensation device of a radio frequency chip test system, comprising:
the first acquisition module is used for acquiring each parameter standard value of the standard radio frequency chip;
the second acquisition module is used for acquiring the test values of all parameters of the standard radio frequency chip;
the first generation module is used for manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of the standard radio frequency chip;
the second generation module is used for generating a final compensation file based on the small batch sample data of the radio frequency chip to be tested and the dynamic compensation configuration file;
and the compensation module is used for compensating the mass production measured value of the radio frequency chip to be detected according to the final compensation file so as to obtain the mass production measured value of the radio frequency chip to be detected after compensation.
Preferably, the first acquisition module comprises a test evaluation board.
Preferably, the second acquisition module includes a load plate and a clamp.
The present disclosure also provides a storage medium storing a program that is callable by a processor and that performs a method as described in any one of the preceding.
The present disclosure also provides an electronic device, including:
a storage medium storing a computer program;
a processor for executing a computer program to implement a method as claimed in any one of the preceding claims.
Compared with the prior art, the beneficial effects that this disclosure brought are:
the method and the device can correct the compensation value through sample running timing, keep the consistency of the product test result and the standard radio frequency chip, and improve the accuracy and reliability of test indexes such as the S parameter, the noise coefficient, the 1dB compression point, the third-order intermodulation intercept point and the like of the radio frequency chip. And the change of the test environment and the problem of low yield caused by the error change of the test system can be found in time through a strict card control value, so that the test quality of the product is improved. When the measurement result of the compensated test system becomes accurate, the test system can obtain more stable and excellent product test yield, and the test data among a plurality of stations can be nearly unified.
Drawings
Fig. 1 is a flowchart of a method for compensating an error of a radio frequency chip test system according to an embodiment of the present disclosure.
Detailed Description
Specific embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. While specific embodiments of the disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It should be noted that certain terms are used throughout the description and claims to refer to particular components. Those of skill in the art will understand that a person may refer to the same component by different names. The specification and claims do not identify differences in terms of components, but rather differences in terms of the functionality of the components. As used throughout the specification and claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The description hereinafter sets forth the preferred embodiments for carrying out the present disclosure, but is not intended to limit the scope of the disclosure in general, as the description proceeds. The scope of the present disclosure is defined by the appended claims.
For the purposes of promoting an understanding of the embodiments of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific examples, without the intention of being limiting the embodiments of the disclosure.
In one embodiment, as shown in fig. 1, the disclosure proposes a method for compensating error of a radio frequency chip test system, including the following steps:
s100: testing each radio frequency parameter of the standard radio frequency chip by using a test evaluation board (the test evaluation board is a device commonly used in the field, the structure of the test evaluation board is not innovated, and therefore the test evaluation board is not excessively described) to obtain a parameter standard value;
in the step, a standard radio frequency chip is welded on a well matched test evaluation board, and radio frequency parameters of the chip are tested through a network analyzer N5242B, wherein the radio frequency parameters comprise gain at 3.3GHz, noise coefficient, 1dB compression point and third-order intermodulation intercept point, input return loss, output return loss and noise coefficient, and a set of parameter standard values are obtained after testing, and are specifically shown in table 1:
TABLE 1
In table 1, the first row represents test items, and the names of the test items are standard values of gain, 1dB compression point, third-order intermodulation intercept point, input return loss, output return loss and noise coefficient at 3.3GHz in order from left to right.
S200: the load board and the clamp (the load board and the clamp are common devices in the field, and the structure of the load board and the clamp is not innovated in the embodiment) are used for testing each radio frequency parameter of the standard radio frequency chip, so as to obtain a parameter test value, and the parameter test value is specifically shown in table 2:
TABLE 2
In table 1, table 2, the first row represents test items, and the names of the test items are test values of gain at 3.3GHz, 1dB compression point, third-order intermodulation intercept point, input return loss, output return loss and noise coefficient in order from left to right.
S300: rounding the average value of the parameter standard values to be used as the basis of column 3 in the dynamic compensation configuration file, taking the average value of the parameter test values as the setting basis of the upper limit and the lower limit of column 5 and column 6 in the dynamic compensation configuration file, and manually filling the setting basis to generate the dynamic compensation configuration file, wherein the generated dynamic compensation configuration file is shown in table 3:
TABLE 3 Table 3
In table 3, column 1 represents test items corresponding to the test items in the first row of tables 1 and 2; column 2 is whether compensation is required, T is required, and F is not required; column 3 is the standard value of the parameter; column 4 is whether to perform data reliability card control, T is card control, F is not card control, and specific card control ranges refer to values set in columns 5 and 6, wherein column 5 is the upper card control limit of the parameter test value obtained in step S200; column 6 is the lower limit of the under-card of the parameter test values obtained by step S200. If the parameter test value in step S200 exceeds the control range of columns 5 and 6, it can determine that the production environment is abnormal and notify the technician of optimization.
It should be noted that, the upper limit and the lower limit of the control in the columns 5 and 6 are manually set by the skilled person through the measurement value obtained by the standard rf chip in the mass production environment.
S400: and (3) carrying out small-batch (for example, one thousand) testing on the radio frequency chips to be tested in a mass production testing environment to obtain small-batch sample data (the data format is the same as that of table 2), obtaining the average value corresponding to each test item serial number, and subtracting the average value from the parameter standard value shown in column 3 in the dynamic compensation configuration file shown in table 3, so as to generate the final compensation file shown in table 4. It should be noted that, when the average value of the serial number of a certain test item in the small-lot sample data is just equal to the standard value of the parameter shown in column 3 in table 3, the compensation value corresponding to the test serial number is 0.
TABLE 4 Table 4
| 1 | 2 | 3 |
| <TestNumber> | <Site_1_Offset> | <Site_2_Offset> |
| S21_3.3V_3.3GHz | 2.476007 | 2.472473 |
| OP1_LNA_3.3GHz | -0.05816 | -0.10331 |
| OIP3_LNA_3.3GHz | 0.625977 | 1.087967 |
| S11_LNA_3.3GHz | -1.68507 | -1.80891 |
| S22_LNA_3.3GHz | -8.32528 | -8.31349 |
| NF_LNA_3.3GHz | -0.65139 | -0.58226 |
In table 4, the test item names in column 1 correspond to the test items in the dynamic compensation configuration file shown in table 3, and represent corresponding test item serial numbers; columns 2 and 3 correspond to compensation values for different sites, respectively.
S500: and carrying out mass test on the radio frequency chip to be tested in a mass production test environment to obtain a mass production measurement value, and compensating the mass production measurement value according to a final compensation file shown in table 4 to obtain a mass production measurement value after the compensation of the radio frequency chip to be tested.
In another embodiment, step S400 includes the steps of:
s401: comparing the small-batch sample data with the clamping control range of the parameter test values shown in columns 5 and 6 in the dynamic compensation configuration file shown in the table 3, if the small-batch sample data is in the clamping control range, namely judging that the small-batch sample data is reasonable, continuing to execute the step S402; if the small-batch sample data exceeds the card control range, judging that the small-batch sample data is unreasonable, at the moment, adjusting a mass production test environment, and carrying out small-batch test on the radio frequency chip to be tested again;
s402: and (3) taking the difference between the small batch of sample data and the parameter standard value in the dynamic compensation configuration file, namely subtracting the average value of the small batch of sample data from the parameter standard value to obtain a compensation value (the compensation value can be negative), and filling the compensation value into a final compensation file.
In another embodiment, in step S500, the compensating the mass production measurement value according to the final compensation file includes: the mass production measurement values of different stations are added to the compensation values shown in columns 2 and 3 in table 4, for example, table 5 is the mass production measurement value of station 1, and the mass production measurement value of table 5 is added to the compensation value shown in column 2 in table 4 according to the serial number of the test item (i.e. the value of column 1 in table 5 is added to the value of column 2 in table 4 respectively to obtain the value of column 1 in table 6), so that the mass production measurement value after the station 1 compensation shown in table 6 can be obtained.
In this example, the mass production measurements at station 1 are shown in Table 5:
TABLE 5
The post-station 1 compensation mass production measurements are shown in Table 6:
TABLE 6
In another embodiment, the present disclosure further provides an error compensation apparatus of a radio frequency chip test system, including:
the first acquisition module is used for acquiring each parameter standard value of the standard radio frequency chip;
the second acquisition module is used for acquiring the test values of all parameters of the standard radio frequency chip;
the first generation module is used for manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of the standard radio frequency chip;
the second generation module is used for generating a final compensation file based on the small batch sample data of the radio frequency chip to be tested and the dynamic compensation configuration file;
and the compensation module is used for compensating the mass production measured value of the radio frequency chip to be detected according to the final compensation file so as to obtain the mass production measured value of the radio frequency chip to be detected after compensation.
In another embodiment, the present disclosure provides a storage medium storing a program that is callable by a processor and that performs a method as set forth in any one of the preceding claims.
In another embodiment, the present disclosure provides an electronic device comprising:
a storage medium storing a computer program;
a processor for executing a computer program to implement a method as claimed in any one of the preceding claims.
The foregoing description of specific embodiments has been presented only to aid in the understanding of the present disclosure and is not intended to limit the present disclosure. Any local modification or substitution by one of ordinary skill in the art within the scope of the present disclosure is intended to be encompassed within the scope of the present disclosure.
Claims (9)
1. The error compensation method of the radio frequency chip test system comprises the following steps:
s100: obtaining each parameter standard value of a standard radio frequency chip;
s200: obtaining test values of parameters of a standard radio frequency chip;
s300: manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of a standard radio frequency chip;
s400: performing small batch test on the radio frequency chip to be tested in a mass production test environment to obtain small batch sample data, and generating a final compensation file based on the small batch sample data and the dynamic compensation configuration file;
s500: and carrying out mass test on the radio frequency chip to be tested in a mass production test environment to obtain a mass production measurement value, and compensating the mass production measurement value according to the final compensation file to obtain a mass production measurement value after the compensation of the radio frequency chip to be tested.
2. The method of claim 1, wherein the parameters of the standard radio frequency chip preferably comprise: gain at 3.3GHz, 1dB compression point, third order intermodulation intercept point, input return loss, output return loss and noise figure.
3. The method according to claim 1, wherein step S400 comprises the steps of:
s401: comparing the small-batch sample data with the clamping control range of the parameter test value in the dynamic compensation configuration file to judge the rationality of the small-batch sample data, and if the rationality is high, continuing to execute the step S402; if not, adjusting the mass production test environment, and carrying out small batch test on the radio frequency chip to be tested again;
s402: and obtaining a compensation value based on the small-batch sample data and the parameter standard value in the dynamic compensation configuration file, and filling the compensation value into a final compensation file.
4. A method according to claim 3, wherein in step S500, the compensating the mass production measurement value according to the final compensation file comprises: and adding the mass production measured value and the compensation value to obtain the mass production measured value of the radio frequency chip to be measured after compensation.
5. An error compensation device for a radio frequency chip test system, comprising:
the first acquisition module is used for acquiring each parameter standard value of the standard radio frequency chip;
the second acquisition module is used for acquiring the test values of all parameters of the standard radio frequency chip;
the first generation module is used for manually generating a dynamic compensation configuration file based on each parameter standard value and parameter test value of the standard radio frequency chip;
the second generation module is used for generating a final compensation file based on the small batch sample data of the radio frequency chip to be tested and the dynamic compensation configuration file;
and the compensation module is used for compensating the mass production measured value of the radio frequency chip to be detected according to the final compensation file so as to obtain the mass production measured value of the radio frequency chip to be detected after compensation.
6. The apparatus of claim 5, wherein the first acquisition module comprises a test evaluation board.
7. The apparatus of claim 5, wherein the second acquisition module comprises a load plate and a clamp.
8. A storage medium storing a program that is callable by a processor and that performs the method of any one of claims 1-4.
9. An electronic device, comprising:
a storage medium storing a computer program;
a processor for executing a computer program to implement the method of any of claims 1-4.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116609642A (en) * | 2023-07-18 | 2023-08-18 | 上海孤波科技有限公司 | Chip test error compensation method and device, electronic equipment and storage medium |
| CN117554661A (en) * | 2024-01-12 | 2024-02-13 | 江苏优众微纳半导体科技有限公司 | Radio frequency chip test error compensation method |
| CN118249810A (en) * | 2024-05-28 | 2024-06-25 | 南京航天工业科技有限公司 | Method and system for testing multichannel AD/DA (analog to digital) chip |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116609642A (en) * | 2023-07-18 | 2023-08-18 | 上海孤波科技有限公司 | Chip test error compensation method and device, electronic equipment and storage medium |
| CN116609642B (en) * | 2023-07-18 | 2023-09-19 | 上海孤波科技有限公司 | Chip test error compensation method and device, electronic equipment and storage medium |
| CN117554661A (en) * | 2024-01-12 | 2024-02-13 | 江苏优众微纳半导体科技有限公司 | Radio frequency chip test error compensation method |
| CN117554661B (en) * | 2024-01-12 | 2024-03-26 | 江苏优众微纳半导体科技有限公司 | Radio frequency chip test error compensation method |
| CN118249810A (en) * | 2024-05-28 | 2024-06-25 | 南京航天工业科技有限公司 | Method and system for testing multichannel AD/DA (analog to digital) chip |
| CN118249810B (en) * | 2024-05-28 | 2024-09-10 | 南京航天工业科技有限公司 | Method and system for testing multichannel AD/DA (analog to digital) chip |
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