CN112996230A - Windowing transfer film, flexible circuit board and manufacturing method of windowing transfer film - Google Patents
Windowing transfer film, flexible circuit board and manufacturing method of windowing transfer film Download PDFInfo
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- CN112996230A CN112996230A CN202110149380.5A CN202110149380A CN112996230A CN 112996230 A CN112996230 A CN 112996230A CN 202110149380 A CN202110149380 A CN 202110149380A CN 112996230 A CN112996230 A CN 112996230A
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- 238000012546 transfer Methods 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 225
- 239000012790 adhesive layer Substances 0.000 claims abstract description 67
- 238000005452 bending Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 45
- 229910052802 copper Inorganic materials 0.000 abstract description 44
- 239000010949 copper Substances 0.000 abstract description 44
- 238000010586 diagram Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 239000011889 copper foil Substances 0.000 description 1
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- 238000005859 coupling reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a windowing transfer film, a flexible circuit board and a manufacturing method thereof, wherein the windowing transfer film comprises the following components: a conductive adhesive layer; the first conductive layer is positioned on the surface of the conductive adhesive layer; the first insulating layer is positioned on the surface of the first conducting layer and provided with a first window, and the first window is exposed out of the first conducting layer. After the windowing transfer film is fixed on the flexible circuit board, the first conducting layer is electrically connected with the copper exposing area of the flexible circuit board through the conducting adhesive layer, the copper exposing area can be transferred to the windowing transfer film, the first conducting layer exposed by the first windowing is electrically connected with the grounding end of the whole machine, and the flexible circuit board can be electrically connected with the grounding end of the whole machine, so that the first windowing with different areas can be manufactured at different positions of the first insulating layer, the flexible circuit board does not need to be redesigned, and different requirements of different electronic products on the copper exposing area can be met.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a windowing transfer film, a flexible circuit board and a manufacturing method of the windowing transfer film.
Background
Flexible Printed Circuit (FPC) is widely used in various electronic products because of its advantages of high wiring density, light weight, good bending property, etc. The flexible circuit board is provided with a copper exposure area for realizing the electrical connection with the grounding end of the whole electronic product. However, since different electronic products have different requirements on the position and area of the copper exposed area of the flexible printed circuit board, the position and area of the copper exposed area of the flexible printed circuit board need to be designed differently, which results in higher cost of the flexible printed circuit board.
Disclosure of Invention
In view of the above, the invention provides a windowing transfer film, a flexible circuit board and a manufacturing method thereof, so that the flexible circuit board can meet different requirements of different electronic products on a copper exposure area at lower cost.
In order to achieve the purpose, the invention provides the following technical scheme:
a fenestration transfer film comprising:
a conductive adhesive layer;
the first conducting layer is positioned on the surface of the conducting adhesive layer;
the first insulating layer is positioned on the surface of the first conducting layer and provided with a first window, and the first window is exposed out of the first conducting layer.
Optionally, the material of the first conductive layer comprises a metal.
A flexible wiring board comprising:
the flexible circuit board body comprises a flexible substrate, at least one second conducting layer positioned on the surface of the flexible substrate and a second insulating layer positioned on the surface of the at least one second conducting layer, wherein the second insulating layer is provided with a second window, and the second window exposes the second conducting layer;
the window opening transfer film is positioned on the flexible circuit board body and comprises a conductive adhesive layer, a first conductive layer positioned on the surface of the conductive adhesive layer and a first insulating layer positioned on the surface of the first conductive layer, the conductive adhesive layer is pasted on the first insulating layer and the surface of the second conductive layer exposed by the second window opening, the first conductive layer is electrically connected with the second conductive layer exposed by the second window opening through the conductive adhesive layer, the first insulating layer is provided with a first window opening, and the first window opening is exposed out of the first conductive layer.
An electronic device comprising the flexible wiring board as described in any one of the above.
A manufacturing method of a flexible circuit board comprises the following steps:
providing a flexible circuit board body and a windowing transfer film, wherein the windowing transfer film comprises a conductive adhesive layer, a first conductive layer positioned on the surface of the conductive adhesive layer and a first insulating layer positioned on the surface of the first conductive layer, the first insulating layer is provided with a first windowing, the first windowing exposes the first conductive layer, the flexible circuit board body comprises a flexible substrate, at least one second conductive layer positioned on the surface of the flexible substrate and a second insulating layer positioned on the surface of the at least one second conductive layer, the second insulating layer is provided with a second windowing, and the second windowing exposes the second conductive layer;
fixing the windowing transfer film on the flexible circuit board body, and enabling the conductive adhesive layer to be pasted on the first insulating layer and the surface of the second conductive layer exposed by the second windowing, wherein the first conductive layer is electrically connected with the second conductive layer exposed by the second windowing through the conductive adhesive layer.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
after the windowing transfer film is fixed on the flexible circuit board, the first conducting layer is electrically connected with the copper exposing area of the flexible circuit board through the conducting adhesive layer, namely, the first conducting layer is electrically connected with the second conducting layer exposed by the second windowing of the flexible circuit board, the copper exposing area can be transferred onto the windowing transfer film, the first conducting layer exposed by the first windowing is electrically connected with the functional interface, for example, the grounding end of the whole machine, the flexible circuit board can be electrically connected with the functional interface, for example, the grounding end of the whole machine, so that the first windowing with different areas can be manufactured at different positions of the first insulating layer, the flexible circuit board does not need to be redesigned, and different requirements of different electronic products on the copper exposing area can be met. Moreover, the cost of the windowing transfer film is lower than the cost of redesigning the flexible circuit board, so that the flexible circuit board can meet different requirements of different electronic products on a copper exposure area at lower cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic top view of a windowed transfer film provided in accordance with an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the windowed transfer film shown in FIG. 1 along cutting line AA';
fig. 3 is a schematic top view of a flexible printed circuit according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the flexible printed circuit shown in FIG. 3 along a cutting line BB';
fig. 5 is a schematic cross-sectional structure diagram of a flexible printed circuit according to another embodiment of the present invention;
fig. 6 is a schematic cross-sectional structure diagram of a flexible printed circuit according to another embodiment of the present invention;
fig. 7 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention;
fig. 8 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention;
fig. 9 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention;
fig. 10 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention;
fig. 11 is a schematic cross-sectional structure diagram of a flexible printed circuit according to another embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view of a flexible printed circuit board according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional structure view of a flexible printed circuit according to another embodiment of the present invention;
fig. 14 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention;
fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 16 is a flowchart of a method for manufacturing a flexible printed circuit according to an embodiment of the present invention.
Detailed Description
As described in the background art, when different electronic products have different requirements on the copper exposed area of the flexible printed circuit board, the copper exposed area of the flexible printed circuit board needs to be designed differently, which results in higher cost of the flexible printed circuit board.
The inventor researches and discovers that the reason for causing the problem is mainly that the specifications of different electronic products are different, and as the electronic products gradually develop from standardization to customization, the positions of functional interfaces of the electronic products, such as grounding ends of the whole machine, also need to be customized, so that the functional interfaces of the flexible circuit board, such as a copper-exposed area, cannot be commonly used, and the flexible circuit board needs to be redesigned for each customized electronic product.
The redesigned flexible circuit board not only needs to adjust the functional interface such as the copper exposure area, but also needs to adjust the wiring and the like related to the functional interface such as the copper exposure area, thereby not only increasing the labor cost and causing the waste of human resources, but also increasing the development time of the electronic product and slowing down the development progress of the electronic product. In addition, adjusting the position of the functional interface such as the copper exposure area affects the performance of the electronic product, for example, if the position of the wiring and the like related to the functional interface such as the copper exposure area cannot be adjusted, the wiring and the like need to be redesigned, which leads to the fact that the crosstalk and the coupling between the signal lines cannot reach the optimal design, thereby leading to the fact that the performance of the flexible circuit board cannot reach the optimal, and further leading to the fact that the display effect of the electronic product cannot reach the optimal. Thirdly, the flexible circuit board is required to be opened again every time the flexible circuit board is redesigned, so that the design cost of the flexible circuit board and the electronic product is greatly increased.
Based on this, the invention provides a windowing transfer film, a flexible circuit board and a manufacturing method thereof, so as to overcome the problems in the prior art, wherein the windowing transfer film comprises:
a conductive adhesive layer;
the first conductive layer is positioned on the surface of the conductive adhesive layer;
the first insulating layer is positioned on the surface of the first conducting layer and provided with a first window, and the first window is exposed out of the first conducting layer.
After the windowing transfer film is fixed on the flexible circuit board, the first conducting layer is electrically connected with the copper exposing area of the flexible circuit board through the conducting adhesive layer, namely, the first conducting layer is electrically connected with the second conducting layer exposed by the second windowing of the flexible circuit board, the copper exposing area can be transferred onto the windowing transfer film, the first conducting layer exposed by the first windowing is electrically connected with the functional interface, for example, the first conducting layer is electrically connected with the grounding end of the whole machine, the flexible circuit board can be electrically connected with the functional interface, for example, the grounding end of the whole machine, so that the first windowing with different areas can be manufactured at different positions of the first insulating layer, the flexible circuit board does not need to be redesigned, and different requirements of different electronic products on the copper exposing area can be met. Moreover, the cost of the windowing transfer film is lower than the cost of redesigning the flexible circuit board, so that the flexible circuit board can meet different requirements of different electronic products on a copper exposure area at lower cost.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the above is the core idea of the present invention, and the above objects, features and advantages of the present invention can be more clearly understood. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a windowing transfer film, as shown in fig. 1 and fig. 2, fig. 1 is a schematic top view structure of the windowing transfer film provided in an embodiment of the present invention, and fig. 2 is a schematic cross-sectional structure of the windowing transfer film shown in fig. 1 along a cutting line AA', where the windowing transfer film includes a conductive adhesive layer 201, a first conductive layer 202, and a first insulating layer 203.
The first conductive layer 202 is located on the surface of the conductive adhesive layer 201. Optionally, the first conductive layer 202 is attached to the surface of the conductive adhesive layer 201, that is, after the whole first conductive layer 202 is manufactured, the first conductive layer 202 is attached to the surface of the conductive adhesive layer 201.
The first insulating layer 203 is located on the surface of the first conductive layer 202, and optionally, the first insulating layer 203 is pasted on the surface of the first conductive layer 202, that is, after the whole first insulating layer 203 is manufactured, the first insulating layer 203 is pasted on the surface of the first conductive layer 202. Of course, the invention is not limited thereto, and in other embodiments, the first insulating layer 203 may be formed directly on the surface of the first conductive layer 202, for example, by spraying a material directly on the surface of the first conductive layer 202 to form the first insulating layer 203.
The first insulating layer 203 has a first window 2030, and the first window 2030 exposes the first conductive layer 202. Alternatively, the first insulating layer 203 may be cut to form the first window 2030 after the entire first insulating layer 203 is manufactured, or the first window 2030 may be formed by covering the first conductive layer 202 with a mask and spraying no insulating material in the window area when the first insulating layer 203 is manufactured on the surface of the first conductive layer 202.
In the embodiment of the present invention, the conductive adhesive layer 201 may be made of a conductive adhesive, and the conductive adhesive is an adhesive with a certain conductivity after being cured or dried, that is, the conductive adhesive layer 201 is an adhesive layer with conductivity. The Conductive Adhesive constituting the Conductive Adhesive layer 201 may be Isotropic Conductive Adhesive (ICAs) or Anisotropic Conductive Adhesive (ACAs), which is not described herein again. The material of the first conductive layer 202 includes a metal, such as copper or aluminum, which has good conductivity. The material of the first insulating layer 203 includes a thermoplastic polyester material such as PET (Polyethylene terephthalate), but the present invention is not limited thereto, and any insulating material that can be easily formed and easily opened may be used in the present invention.
It should be noted that, when the windowing transfer film in the embodiment of the present invention is applied to a device requiring a window to be transferred, such as a flexible printed circuit board, after the windowing transfer film is fixed on the flexible printed circuit board, the first conductive layer 202 is electrically connected with the exposed copper area of the flexible circuit board through the conductive adhesive layer 201, if the first conductive layer 202 is electrically connected to the second conductive layer exposed by the second window of the flexible circuit board, the copper-exposed areas can be transferred to the windowed transfer film by electrically connecting the exposed first conductive layer 202 of the first window 2030 to a functional interface, such as a ground terminal of the overall device, the electric connection between the flexible circuit board and the functional interface, such as the grounding end of the whole machine, therefore, different requirements of different electronic products on the copper exposure area can be met only by manufacturing the first windows 2030 with different areas at different positions of the first insulating layer 203 without redesigning the flexible circuit board. Moreover, the cost of the windowing transfer film is lower than the cost of redesigning the flexible circuit board, so that the flexible circuit board can meet different requirements of different electronic products on a copper exposure area with lower cost and convenience and rapidness.
In the embodiments of the present invention, only the shape of the windowing transfer film is a square, but the present invention is not limited thereto, and in other embodiments, the shape of the windowing transfer film may also be a circle, a polygon, or the like. Similarly, in the embodiment of the present invention, only the first opening 2030 is illustrated as a square, but the present invention is not limited thereto, and in other embodiments, the shape of the first opening 2030 may also be a circle or a polygon, and the opening transfer film and the first opening 2030 in the embodiment of the present invention may be cut or manufactured into any shape as needed to meet the needs of different flexible circuit boards or devices requiring opening transfer.
It should be noted that, in the embodiment of the present invention, the windowing transfer film may only include one first conductive layer 202, or may include multiple first conductive layers 202, and an insulating layer may or may not be provided between adjacent first conductive layers 202, but if an insulating layer is provided between adjacent first conductive layers 202, the adjacent first conductive layers 202 need to be electrically connected through a via, etc. to achieve the purpose of windowing transfer.
An embodiment of the present invention further provides a flexible printed circuit, as shown in fig. 3 and 4, fig. 3 is a schematic view of a top-view structure of the flexible printed circuit provided in an embodiment of the present invention, and fig. 4 is a schematic view of a cross-sectional structure of the flexible printed circuit shown in fig. 3 along a cutting line BB', where the flexible printed circuit includes a flexible printed circuit body 10 and a windowing transfer film 20 located on the flexible printed circuit body 10.
The flexible printed circuit board body 10 includes a flexible substrate 101, at least one second conductive layer 102 on a surface of the flexible substrate 101, and a second insulating layer 103 on a surface of the at least one second conductive layer 102, where the second insulating layer 103 has a second window 1030, and the second window 1030 exposes the second conductive layer 102.
The windowing transfer film 20 comprises a conductive adhesive layer 201, a first conductive layer 202 located on the surface of the conductive adhesive layer 201 and a first insulating layer 203 located on the surface of the first conductive layer 202, wherein the conductive adhesive layer 201 is adhered to the first insulating layer 203 and the surface of the second conductive layer 102 exposed by the second windowing 1030, the first conductive layer 202 is electrically connected with the second conductive layer 102 exposed by the second windowing 1030 through the conductive adhesive layer 201, the first insulating layer 203 is provided with a first windowing 2030, and the first conductive layer 202 is exposed by the first windowing 2030.
It should be noted that in some embodiments of the present invention, the second conductive layer 102 is a copper foil layer, and the second window 1030 is a copper exposed area of the flexible circuit board body 10. In the embodiment of the present invention, the first conductive layer 202 is electrically connected to the second conductive layer 102 exposed by the second window 1030, i.e. the copper exposed area, through the conductive adhesive layer 201, that is, the copper exposed area of the flexible circuit board body 10 can be transferred to the windowing transfer film 20, and the first conductive layer 202 exposed by the first window 2030 is electrically connected to the ground end of the whole device, so that the flexible circuit board can be electrically connected to the ground end of the whole device, and thus, the first windows 2030 with different areas can be manufactured at different positions of the first insulating layer 203, and different requirements of different electronic products on the copper exposed area can be met without redesigning the flexible circuit board. And because the cost of the windowing transfer film is lower than the cost of redesigning the flexible circuit board, the flexible circuit board can meet different requirements of different electronic products on a copper exposure area conveniently and quickly at lower cost.
It should be noted that fig. 4 only illustrates the flexible printed circuit board 10 having one second conductive layer 102, but the present invention is not limited thereto, and in other embodiments, the flexible printed circuit board 10 may have two, three, four, or even more second conductive layers 102, however, as shown in fig. 5, fig. 5 is a schematic cross-sectional view of a flexible printed circuit board according to another embodiment of the present invention, and an insulating layer 104 is required between adjacent second conductive layers 102.
In some embodiments of the present invention, in a direction Y perpendicular to the flexible printed circuit board, a projection of the first window 2030 and a projection of the second window 1030 are at least partially not overlapped, so that when a position of the second window 1030, i.e. a copper exposure area, on the flexible printed circuit board body 10 cannot be changed, a position of the first window 2030 is adjusted to transfer the copper exposure area to the first window 2030, so that the position of the copper exposure area meets requirements of different electronic products.
As shown in fig. 4, the projection of the first window 2030 does not overlap the projection of the second window 1030 at all. Because the first window 2030 can expose the first conductive layer 202, the exposed first conductive layer 202 is easily corroded in a warm and humid environment, and water, oxygen and the like are easily corroded into the flexible printed circuit board through the exposed first conductive layer 202, therefore, the projections of the first window 2030 and the second window 1030 are not overlapped at all, on one hand, the distance between the first window 2030 and the second window 1030 can be increased, the corrosion path is extended, and the corrosion process is delayed, on the other hand, when the windowing transfer film 20 is attached to the surface of the flexible printed circuit board, a step difference is formed at the second window 1030, that is, when the conductive adhesive layer 201 is attached to the surface of the flexible printed circuit board, a warped portion is generated, when the first window 2030 is partially located at the warped portion, if the side wall of the first window 2030 is located at the side face of the warped portion, the stress from the warped portion on the side wall of the first window 2030 can be decomposed into two directional component forces, the component force in one direction is a force perpendicular to the plane of the flexible circuit board, and the component force in the other direction is a force parallel to the plane of the flexible circuit board, wherein the force parallel to the plane of the flexible circuit board easily enables the first insulating layer 203 at the edge of the first window 2030 to peel off the surface of the first conductive layer 202, so that a defect or a notch is generated, and water vapor and oxygen invade along the defect or the notch.
Alternatively, as shown in fig. 6, fig. 6 is a schematic cross-sectional structural diagram of a flexible printed circuit according to another embodiment of the present invention, a projection of the first window 2030 does not overlap a projection of the second window 1030, that is, the projection of the first window 2030 overlaps a projection of the second window 1030. Since the first insulating layer 203 and the second insulating layer 103 are generally made of plastic and have low thermal conductivity, the area of heat exchange between the first conductive layer 202 and the second conductive layer 102 can be increased by overlapping the projection of the first window 2030 and the projection of the second window 1030, thereby improving the heat dissipation efficiency.
In some embodiments of the present invention, in the direction Y perpendicular to the flexible circuit board, the projection area of the first open window 2030 is larger than the projection area of the second open window 1030. As shown in fig. 7, fig. 7 is a schematic top view structure diagram of a flexible circuit board according to another embodiment of the present invention, taking the projection shapes of the first window 2030 and the second window 1030 as an example of a circle, a radius R1 of the first window 2030 is greater than a radius R2 of the second window 1030, and a projection area of the first window 2030 is greater than a projection area of the second window 1030, so that the area of the second window 1030, i.e., a copper-exposed area, is smaller and cannot meet the requirement of an electronic product, and when there are too many traces on the flexible circuit board body 10 and the area of the copper-exposed area cannot be further increased, the area of the copper-exposed area can be increased by the window transfer film 20.
Although the area of the first window 2030 cannot be increased to reduce the resistance under the condition that the opening area of the second window 1030 and the contact resistance between the conductive adhesive layer 201 and the second conductive layer 102 are determined, the inventor researches and discovers that the transmission resistance of the functional interface can be reduced by increasing the area of the first window 2030, so that the loss of signals transmitted by the functional interface on the first conductive layer 202 due to the internal resistance and the potential difference of the first conductive layer 202 can be compensated to a certain extent, and the transmission performance between the flexible printed circuit board and the functional interface can be enhanced.
It should be noted that, when the projection shapes of the first window 2030 and the second window 1030 are both circular, compared with the projection shapes of both the first window and the second window which are both square, the curvature of the circular window is equal at all positions, and the curvature does not suddenly change, so that the stress concentration generated by the flexible circuit board during bending can be avoided, and further the situations such as warping and deformation at the window position can be avoided.
It should be noted that, in the embodiment of the present invention, the second conductive layer 102 may be electrically connected to the ground terminal of the complete machine through the first conductive layer 202, and may also be electrically connected to a device bound to the flexible circuit board through the ground connection terminal. As shown in fig. 8, fig. 8 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention, the flexible printed circuit body 10 includes a plurality of connection terminals 104, at least one of the connection terminals 104 is a ground connection terminal, and the second conductive layer 102 is electrically connected to the ground connection terminal. And the grounding connection terminal is electrically connected with a binding device of the flexible circuit board, such as a display panel, namely the binding device, such as the display panel, can be electrically connected with the grounding end of the whole machine through the grounding connection terminal, the second conductive layer 102, the conductive adhesive layer 201 and the first conductive layer 202, so as to realize the grounding of the device, such as the display panel.
It should be noted that, in general, the ground connection terminal is located on the surface of the flexible printed circuit board body 10, i.e. the second insulation layer 103, so as to be electrically connected to the bonding device, e.g. the display panel, and therefore, the second conductive layer 102 and the ground connection terminal need to be electrically connected through the trace inside the flexible printed circuit board and the via hole penetrating through the second insulation layer 103.
In some embodiments of the present invention, the number of the first windows 2030 on the first insulating layer 203 may be one, or two or more, so that the exposed second conductive layer 102 on the flexible printed circuit board, i.e. the exposed copper region, is electrically connected to different functional interfaces according to the requirement of practical application. As shown in fig. 9, fig. 9 is a schematic top view of a flexible printed circuit according to another embodiment of the present invention, when an electronic product has two overall ground terminals, the flexible printed circuit can be electrically connected to the two overall ground terminals through the first conductive layers 202 at the two first windows 2030, respectively.
Therefore, when the electronic product falls to cause the first conductive layer 202 at one first window 2030 to be separated from the ground terminal of the whole machine, the first conductive layer 202 at the other first window 2030 and the ground terminal of the whole machine can be ensured, thereby improving the reliability of the electronic product. The electronic product can be applied to the fields of military industry three prevention, outdoor exploration and the like. In addition, the flexible printed circuit board is electrically connected to a plurality of functional interfaces, such as a grounding terminal of the whole machine, through the first conductive layers 202 at the plurality of first windows 2030, so that the transmission resistance of signals can be reduced, and the transmission strength of signals can be improved.
In addition, in some embodiments of the present invention, the second insulating layer 103 may have one second window 1030, or may have two or more second windows 1030, where different second windows 1030 expose different areas of the second conductive layer 102, or different second windows 1030 expose different film layers of the second conductive layer 102, such as one second window 1030 exposing the first second conductive layer 102 and another second window 1030 exposing the second conductive layer 102. Based on this, the number of the first windows 2030 of the first insulating layer 203 needs to correspond to the number of the second windows 1030 of the second insulating layer 103, so as to electrically connect different functional interfaces with different second windows 1030 through the first windows 2030.
It should be further noted that, in the embodiment of the present invention, the windowing transfer film 20 may cover the entire surface of the flexible circuit board body 10 to ensure the flatness of the surface of the flexible circuit board, but some surfaces are excluded from areas having electronic devices (such as capacitors, resistors, etc.) or connection terminals (ground connection terminals), that is, as shown in fig. 10, fig. 10 is a schematic top view structure diagram of the flexible circuit board according to another embodiment of the present invention, and the windowing transfer film 20 further includes at least two hollow areas B1 and B2, in a direction Y perpendicular to the flexible circuit board, projections of the hollow areas B1 and B2 overlap projections of the electronic devices or the connection terminals on the flexible circuit board.
As shown in fig. 10, the projections of the hollow areas B1 and B2 overlap with the projection of the connection terminals on the flexible printed circuit board, that is, the windowing transfer film 20 exposes the connection terminals on the flexible printed circuit board, and based on this, the windowing transfer film 20 does not affect the binding electrical connection between the connection terminals on the flexible printed circuit board and the connection terminals on the display panel. Of course, the invention is not limited thereto, and in other embodiments, the windowing transfer film 20 may also be attached to the surface of the connection terminal, the first conductive layer 202 is electrically connected to the connection terminal through the conductive adhesive layer 201, but the first window 2030 needs to expose all the connection terminals in the area where the connection terminal is located to ensure the flatness of the surface of each connection terminal so as not to affect the flatness of the bonding area between the connection terminal and the display panel, and the first conductive layer 202 electrically connected to each connection terminal is disconnected or insulated so as not to short-circuit between the connection terminals.
In addition, the projection of the hollow area needs to overlap with the projection of the electronic device on the flexible circuit board, for example, the windowing transfer film 20 needs to expose the electronic device such as a capacitor or a resistor welded on the flexible circuit board, so as to prevent the first insulating layer 203 in the windowing transfer film 20 from affecting the heat dissipation of the electronic device such as the capacitor or the resistor.
Of course, the invention is not limited to this, and in other embodiments, the windowing transfer film 20 may only cover a part of the surface of the flexible circuit board body 10, that is, only the purpose of transferring the exposed copper region is achieved, so as to reduce the cost and the occupied space of the windowing transfer film 20.
In some embodiments of the present invention, as shown in fig. 11, fig. 11 is a schematic cross-sectional structure view of a flexible printed circuit board according to another embodiment of the present invention, and a sidewall of the second insulating layer 103 at the second window 1030 is an inclined sidewall. If the sidewall of the second insulating layer 103 at the second window 1030 is a vertical sidewall, the vertical sidewall cannot be completely attached to the conductive adhesive layer 201 during the process of attaching the conductive adhesive layer 201 to the second insulating layer 103, although the vertical sidewall can be attached to the conductive adhesive layer 201 by pressing the conductive adhesive layer 201 into the second window 1030, as shown in fig. 12, fig. 12 is a schematic cross-sectional structure of the flexible printed circuit board according to an embodiment of the present invention, if the pressing force is insufficient, air in the gap between the vertical corner of the vertical sidewall and the conductive adhesive layer 201 may not be completely discharged during the attaching process, as shown in the dashed-line frame in fig. 12, there may still exist bubbles between the vertical sidewall and the conductive adhesive layer 201, which may cause the vertical sidewall and the conductive adhesive layer 201 that are not completely attached to be easily torn when the flexible printed circuit board is bent, causing the windowed transfer film 20 to fall off, affecting the application of the flexible circuit board.
And the side wall of the second insulating layer 103 at the second windowing portion 1030 is an inclined side wall, so that the inclination angle of the side wall can be increased, air between the inclined side wall and the conductive adhesive layer 201 can be completely discharged, the inclined side wall and the conductive adhesive layer 201 can be completely attached, the inclined side wall and the conductive adhesive layer 201 are not easy to tear, the windowing transfer film 20 cannot easily fall off, and the reliability of the flexible circuit board is enhanced. Moreover, the side wall of the second insulating layer 103 at the second window 1030 is an inclined side wall, so that the adhering area of the conductive adhesive layer 102 and the flexible circuit board body 10 can be increased, and the conductive adhesive layer 102 and the flexible circuit board body 10 are adhered more firmly. Of course, the present invention is not limited thereto, and in other embodiments, as shown in fig. 13, fig. 13 is a schematic cross-sectional structure diagram of a flexible printed circuit board according to another embodiment of the present invention, and the adhesion force between the conductive adhesive layer 102 and the flexible printed circuit board body 10 can be increased by coating the conductive adhesive 30 in the second window 1030.
In some embodiments of the present invention, the flexible circuit board may be a circuit board that does not need to be bent, but in other embodiments, the flexible circuit board disposed in the electronic device is a circuit board that needs to be bent, as shown in fig. 14, fig. 14 is a schematic view of a top view structure of a flexible circuit board provided in another embodiment of the present invention, and the flexible circuit board has a bending region a1 and a first non-bending region a2 and a second non-bending region A3 located at two opposite sides of the bending region a 1. In some embodiments, the windowed transfer film 20 is located in the first non-bending zone a2 or the second non-bending zone A3.
Of course, the invention is not limited thereto, and in other embodiments, for example, the flexible printed circuit board may be bent along the bending region a1 when being mounted, but after being mounted, the windowing transfer film 20 may be located at the bending region a1 when the flexible printed circuit board is not bent along the bending region a 1. Alternatively, the windowing transfer film 20 located in the bending region a1 may be designed to resist bending, for example, the windowing transfer film 20 in the bending region a1 may have a plurality of discontinuous grooves, so that when the flexible circuit board is bent, the tensile stress of the windowing transfer film 20 can be reduced by stretching the plurality of grooves, and the bending resistance of the windowing transfer film 20 can be further improved. Of course, in other embodiments, other ways to improve the bending resistance of the windowing transfer film 20 may be adopted, and are not described herein again.
It should be noted that, in the drawings of the embodiments of the present invention, only one shape of the flexible circuit board is taken as an example for illustration, and not limited thereto, in practical applications, the shapes of the flexible circuit boards may be different for different electronic products, and the shapes of the windowing transfer film 20 may also be different, and are not described in detail herein.
The embodiment of the invention also provides electronic equipment which comprises the flexible circuit board provided by any one of the above embodiments. As shown in fig. 15, fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present invention, where the electronic device P includes, but is not limited to, a full-screen mobile phone, a tablet computer, a digital camera, and the like.
In the embodiment of the invention, a functional interface such as a grounding terminal on the electronic equipment is electrically connected with the first conducting layer exposed by the first window on the flexible circuit board. Of course, according to the requirement of practical application, one or more functional interfaces of the electronic device can be electrically connected with the second conductive layers at one or more second windows of the flexible circuit board correspondingly through the windowing transfer film.
Based on the method, the requirement of the electronic equipment on the copper-exposed area of the flexible circuit board can be met without redesigning the flexible circuit board, the design cost of the flexible circuit board can be reduced, the development cost of the electronic equipment can be reduced, and the development progress of the electronic equipment can be improved.
An embodiment of the present invention further provides a method for manufacturing a flexible printed circuit board, as shown in fig. 16, fig. 16 is a flowchart of a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention, where the method includes:
s101: providing a flexible circuit board body and a windowing transfer film, wherein the windowing transfer film comprises a conductive adhesive layer, a first conductive layer positioned on the surface of the conductive adhesive layer and a first insulating layer positioned on the surface of the first conductive layer, the first insulating layer is provided with a first windowing part, the first windowing part exposes the first conductive layer, the flexible circuit board body comprises a flexible substrate, at least one second conductive layer positioned on the surface of the flexible substrate and a second insulating layer positioned on the surface of the at least one second conductive layer, the second insulating layer is provided with a second windowing part, and the second windowing part exposes the second conductive layer;
s102: and fixing the windowing transfer film on the flexible circuit board body, pasting the conductive adhesive layer on the first insulating layer and the surface of the second conductive layer exposed by the second windowing, and electrically connecting the first conductive layer with the second conductive layer exposed by the second windowing through the conductive adhesive layer.
In some embodiments of the present invention, the first window is formed by a cutting process, that is, after the first insulating layer is formed, the first insulating layer is cut to form the first window, but the present invention is not limited thereto, in other embodiments, the first insulating layer having the first window is formed by a spraying process, that is, a mask is formed on a surface of the first conductive layer, the mask covers a region of the first window, then an insulating material is sprayed by the spraying process, and the first insulating layer is formed in a region outside the first window.
In some embodiments of the invention, the first conductive layer may be attached to the surface of the conductive adhesive layer, the first insulating layer may be attached to or formed on the surface of the first conductive layer, and then the windowing transfer film may be integrally attached to or fixed on the flexible circuit board body. In other embodiments, the conductive adhesive layer may be attached to the flexible circuit board body, the first conductive layer may be attached to the surface of the conductive adhesive layer, and the first insulating layer may be attached to or formed on the surface of the first conductive layer.
In some embodiments of the present invention, when the conductive adhesive layer or the windowing transfer film is attached to the flexible circuit board body, the conductive adhesive layer or the windowing transfer film can be firmly attached to the second windowing portion of the flexible circuit board body by pressing.
According to the manufacturing method of the flexible circuit board provided by the embodiment of the invention, the transfer of the copper-exposed area on the flexible circuit board body, namely the second conducting layer exposed by the second windowing is realized through the windowing transfer film, so that the different requirements of different electronic products on the copper-exposed area can be met only by manufacturing the first windowing with different areas at different positions of the first insulating layer and without redesigning the flexible circuit board. And because the cost of the windowing transfer film is lower than the cost of redesigning the flexible circuit board, the flexible circuit board can meet different requirements of different electronic products on a copper exposure area conveniently and quickly at lower cost.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (13)
1. A fenestration transfer film, comprising:
a conductive adhesive layer;
the first conducting layer is positioned on the surface of the conducting adhesive layer;
the first insulating layer is positioned on the surface of the first conducting layer and provided with a first window, and the first window is exposed out of the first conducting layer.
2. The fenestration transfer film of claim 1 wherein the material of the first conductive layer comprises a metal.
3. A flexible wiring board, comprising:
the flexible circuit board body comprises a flexible substrate, at least one second conducting layer positioned on the surface of the flexible substrate and a second insulating layer positioned on the surface of the at least one second conducting layer, wherein the second insulating layer is provided with a second window, and the second window exposes the second conducting layer;
the window opening transfer film is positioned on the flexible circuit board body and comprises a conductive adhesive layer, a first conductive layer positioned on the surface of the conductive adhesive layer and a first insulating layer positioned on the surface of the first conductive layer, the conductive adhesive layer is pasted on the first insulating layer and the surface of the second conductive layer exposed by the second window opening, the first conductive layer is electrically connected with the second conductive layer exposed by the second window opening through the conductive adhesive layer, the first insulating layer is provided with a first window opening, and the first window opening is exposed out of the first conductive layer.
4. The flexible wiring board of claim 3, wherein a projection of the first window does not at least partially overlap a projection of the second window in a direction perpendicular to the array substrate.
5. The flexible wiring board of claim 3 or 4, wherein a projected area of the first window is larger than a projected area of the second window in a direction perpendicular to the array substrate.
6. The flexible wiring board of claim 3, wherein the flexible wiring board body includes a ground connection terminal, and the second conductive layer is electrically connected to the ground connection terminal.
7. The flexible wiring board of claim 3, wherein the sidewall of the second insulating layer at the second window is a sloped sidewall.
8. The flexible wiring board of claim 3, wherein the windowed transfer film further comprises at least two hollowed-out areas, and a projection of the hollowed-out areas overlaps with a projection of electronic devices and connection terminals on the flexible wiring board in a direction perpendicular to the flexible wiring board.
9. The flexible circuit board of claim 3, wherein the flexible circuit board has a bending region and a first non-bending region and a second non-bending region located on opposite sides of the bending region, and the windowing transfer film is located in the first non-bending region or the second non-bending region.
10. An electronic device comprising the flexible wiring board according to any one of claims 3 to 9.
11. The electronic device of claim 10, wherein a ground terminal on the electronic device is electrically connected to the first conductive layer exposed by the first window.
12. A manufacturing method of a flexible circuit board is characterized by comprising the following steps:
providing a flexible circuit board body and a windowing transfer film, wherein the windowing transfer film comprises a conductive adhesive layer, a first conductive layer positioned on the surface of the conductive adhesive layer and a first insulating layer positioned on the surface of the first conductive layer, the first insulating layer is provided with a first windowing, the first windowing exposes the first conductive layer, the flexible circuit board body comprises a flexible substrate, at least one second conductive layer positioned on the surface of the flexible substrate and a second insulating layer positioned on the surface of the at least one second conductive layer, the second insulating layer is provided with a second windowing, and the second windowing exposes the second conductive layer;
fixing the windowing transfer film on the flexible circuit board body, and enabling the conductive adhesive layer to be pasted on the first insulating layer and the surface of the second conductive layer exposed by the second windowing, wherein the first conductive layer is electrically connected with the second conductive layer exposed by the second windowing through the conductive adhesive layer.
13. The method of manufacturing of claim 12, wherein the first fenestration is formed using a cutting process; or the first insulating layer with the first window is formed by adopting a spraying process.
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| CN202110149380.5A CN112996230A (en) | 2021-02-03 | 2021-02-03 | Windowing transfer film, flexible circuit board and manufacturing method of windowing transfer film |
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| CN202110149380.5A CN112996230A (en) | 2021-02-03 | 2021-02-03 | Windowing transfer film, flexible circuit board and manufacturing method of windowing transfer film |
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| CN112996230A true CN112996230A (en) | 2021-06-18 |
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Application publication date: 20210618 |