CN112992752A - Wafer map display method, system, equipment and storage medium - Google Patents
Wafer map display method, system, equipment and storage medium Download PDFInfo
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- CN112992752A CN112992752A CN202110242363.6A CN202110242363A CN112992752A CN 112992752 A CN112992752 A CN 112992752A CN 202110242363 A CN202110242363 A CN 202110242363A CN 112992752 A CN112992752 A CN 112992752A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Abstract
The invention discloses a wafer map display method, a system, equipment and a storage medium, wherein the method comprises the following steps: displaying a wafer map; when a wafer extraction event is received, setting a reference wafer, a wafer extraction mode and an extraction area on a wafer map according to the wafer extraction event; acquiring position information of a reference wafer from a wafer map; and taking the position information as an initial position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and updating the displayed wafer map according to the extracted wafers. In the wafer extraction link, the invention not only realizes the real-time display of the wafer state information, but also realizes the accurate positioning of the wafer, thereby greatly improving the production efficiency of the wafer extraction link.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technologies, and in particular, to a method, a system, a device, and a storage medium for displaying a wafer map.
Background
In semiconductor chip production, a wafer (circular silicon wafer) having a diameter of a certain size is cut into a plurality of small chips. The chiplets refer to silicon wafers, also known as wafers, used in the fabrication of silicon semiconductor integrated circuits.
At present, during the production of a semiconductor chip, before a probe station is controlled to extract a wafer from the wafer, a position parameter of a reference wafer is often determined from the wafer by naked eyes, then the position parameter of the reference wafer is input into a control system of the probe station, and then the probe station is controlled to extract the wafer from the wafer. However, in the method of determining the position parameter of the reference wafer from the wafer by naked eyes and controlling the probe station to extract the wafer from the wafer according to the position parameter of the reference wafer, the problem of inaccurate wafer extraction is easily caused, so that a wafer extraction link fails, and the production efficiency is affected.
Disclosure of Invention
The embodiment of the application provides a wafer map display method, a wafer map display system, wafer map display equipment and a storage medium, and aims to solve the problem that inaccurate wafer extraction is easy to occur in a mode that a probe station is controlled to extract a wafer from a wafer by determining a position parameter of a reference wafer from the wafer through naked eyes.
The embodiment of the application provides a wafer map display method, which comprises the following steps:
displaying a wafer map;
when a wafer extraction event is received, setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event;
acquiring the position information of the reference wafer from the wafer map;
and taking the position information as an initial position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and updating the displayed wafer map according to the extracted wafers.
In one embodiment, the step of displaying the wafer map includes:
receiving and reading a wafer map file to obtain the position information and the state information of each wafer on a wafer;
and drawing and displaying a wafer map matched with the wafer according to the position information and the state information of each wafer.
In one embodiment, the extraction manner includes a line extraction manner; the extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position comprises the following steps:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
In an embodiment, the step of extracting the currently selected wafer and selecting the next wafer when the currently selected wafer is a qualified wafer includes:
when the currently selected wafer is a qualified wafer, acquiring a first distance between the currently selected wafer and a first initial wafer, and acquiring a second distance between a last extracted wafer and the first initial wafer, wherein the first initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the first distance is greater than the second distance, extracting the currently selected wafer and selecting the next wafer.
In one embodiment, the extraction manner further includes a column extraction manner; the extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position comprises the following steps:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
In an embodiment, the step of extracting the currently selected wafer and selecting the next wafer when the currently selected wafer is a qualified wafer includes:
when the currently selected wafer is a qualified wafer, acquiring a third distance between the currently selected wafer and a second initial wafer, and acquiring a fourth distance between a last extracted wafer and the second initial wafer, wherein the second initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the third distance is greater than the fourth distance, extracting the currently selected wafer and selecting the next wafer.
In an embodiment, after the step of extracting the currently selected wafer when the currently selected wafer is a qualified wafer, the method further includes:
and changing the extracted state identifier of the wafer into an extracted identifier on the wafer map.
In addition, to achieve the above object, the present invention also provides a wafer map display system, including:
the wafer map display module is used for displaying a wafer map;
the information setting module is used for setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event when the wafer extraction event is received;
the information acquisition module is used for acquiring the position information of the reference wafer from the wafer map;
and the wafer extracting module is used for extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position, and updating the displayed wafer map according to the extracted wafers.
In addition, to achieve the above object, the present invention also provides a wafer map display apparatus comprising: the system comprises a memory, a processor and a wafer map display program stored on the memory and capable of running on the processor, wherein the wafer map display program realizes the steps of the wafer map display method when being executed by the processor.
In addition, to achieve the above object, the present invention further provides a storage medium having a wafer map display program stored thereon, wherein the wafer map display program, when executed by a processor, implements the steps of the wafer map display method described above.
The technical scheme of the wafer map display method, system, device and storage medium provided in the embodiments of the present application has at least the following technical effects or advantages:
because the wafer drawing is displayed, when a wafer drawing event is received, a reference wafer, a wafer drawing mode and a drawing area are arranged on the wafer drawing according to the wafer drawing event, the position information of the reference wafer is obtained from the wafer drawing, taking the position information as a starting position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and the technical proposal of updating the displayed wafer map according to the extracted wafer solves the problem that the position parameter of the reference wafer is determined from the wafer by naked eyes, the invention realizes the real-time display of the wafer state information and the accurate positioning of the wafer in the wafer extraction link, thereby greatly improving the production efficiency of the wafer extraction link.
Drawings
FIG. 1 is a schematic diagram of a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart diagram illustrating a first embodiment of a wafer map display method according to the present invention;
FIG. 3 is a schematic flow chart diagram illustrating a second embodiment of a wafer map display method according to the present invention;
FIG. 4 is a schematic flow chart diagram illustrating a third embodiment of a wafer map display method according to the present invention;
FIG. 5 is a schematic flow chart diagram illustrating a fourth embodiment of a wafer map displaying method according to the present invention;
FIG. 6 is a functional block diagram of a wafer map display system according to the present invention.
Detailed Description
For a better understanding of the above technical solutions, exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a hardware operating environment according to an embodiment of the present invention.
It should be noted that fig. 1 is a schematic structural diagram of a hardware operating environment of the wafer map display apparatus.
As shown in fig. 1, the wafer map display apparatus may include: a processor 1001, such as a CPU, a memory 1005, a user interface 1003, a network interface 1004, a communication bus 1002. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface). The memory 1005 may be a high-speed RAM memory or a non-volatile memory (e.g., a magnetic disk memory). The memory 1005 may alternatively be a storage device separate from the processor 1001.
Optionally, the wafer map display apparatus may further include a camera, a Radio Frequency (RF) circuit, a sensor, an audio circuit, a WiFi module, and the like. Such as light sensors, motion sensors, and other sensors. Specifically, the light sensor may include an ambient light sensor that may adjust the brightness of the display screen according to the brightness of ambient light, and a proximity sensor that may turn off the display screen and/or the backlight when the mobile terminal is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), detect the magnitude and direction of gravity when the mobile terminal is stationary, and can be used for applications (such as horizontal and vertical screen switching, related games, magnetometer attitude calibration), vibration recognition related functions (such as pedometer and tapping) and the like for recognizing the attitude of the mobile terminal; of course, the mobile terminal may also be configured with other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which are not described herein again.
Those skilled in the art will appreciate that the wafer map display device configuration shown in fig. 1 is not intended to be limiting of the wafer map display device and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a storage medium, may include an operating system, a network communication module, a user interface module, and a wafer map display program. The operating system is a program that manages and controls the hardware and software resources of the wafer map display device, the wafer map display program, and the execution of other software or programs.
In the wafer map display apparatus shown in fig. 1, the user interface 1003 is mainly used for connecting a terminal and performing data communication with the terminal; the network interface 1004 is mainly used for the background server and performs data communication with the background server; the processor 1001 may be configured to invoke a wafer map display program stored in the memory 1005.
In this embodiment, the wafer map display apparatus includes: a memory 1005, a processor 1001 and a wafer map display program stored on the memory and executable on the processor, wherein:
when the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are performed:
displaying a wafer map;
when a wafer extraction event is received, setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event;
acquiring the position information of the reference wafer from the wafer map;
and taking the position information as an initial position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and updating the displayed wafer map according to the extracted wafers.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
receiving and reading a wafer map file to obtain the position information and the state information of each wafer on a wafer;
and drawing and displaying a wafer map matched with the wafer according to the position information and the state information of each wafer.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
when the currently selected wafer is a qualified wafer, acquiring a first distance between the currently selected wafer and a first initial wafer, and acquiring a second distance between a last extracted wafer and the first initial wafer, wherein the first initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the first distance is greater than the second distance, extracting the currently selected wafer and selecting the next wafer.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
when the currently selected wafer is a qualified wafer, acquiring a third distance between the currently selected wafer and a second initial wafer, and acquiring a fourth distance between a last extracted wafer and the second initial wafer, wherein the second initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the third distance is greater than the fourth distance, extracting the currently selected wafer and selecting the next wafer.
When the processor 1001 calls the wafer map display program stored in the memory 1005, the following operations are also performed:
and changing the extracted state identifier of the wafer into an extracted identifier on the wafer map.
It should be noted that, although a logical sequence is shown in the flowchart, in some cases, the steps shown or described may be performed in a sequence different from that shown or described, and the wafer map display method is applied to the production of semiconductor chips, and specifically, the method controls a probe station for extracting a wafer to extract the wafer from the wafer, and displays a wafer map corresponding to the wafer in real time, so that a worker can check the condition that the probe station extracts the wafer from the wafer and the condition of the remaining wafers on the wafer through the wafer map.
As shown in fig. 2, in a first embodiment of the present application, a wafer map display method of the present application includes the following steps:
step S210: the wafer map is displayed.
In this embodiment, before the probe station for controlling the wafer extraction performs the wafer extraction from the wafer, the wafer map corresponding to the wafer is displayed by the control device of the probe station. Each wafer on the wafer is an entity wafer, and each entity wafer is orderly arranged on the wafer according to a row-column arrangement mode. The wafer map comprises a plurality of wafers, and the position information and the state information of each wafer on the wafer map have a one-to-one correspondence relationship with the position information and the state information of each wafer on the wafer. For example, the mth row of wafers is sequentially arranged as wafer a, wafer B, wafer a. The wafer corresponding to the mth row of wafers is also displayed on the wafer map, and the wafers are sequentially arranged as a wafer a, a wafer B, a wafer a and a wafer f, wherein the position information and the state information of the wafer a correspond to the position information and the state information of the wafer a one by one, the position information and the state information of the wafer B correspond to the position information and the state information of the wafer B one by one, and the like.
Step S220: and when a wafer extraction event is received, setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event.
In this embodiment, the wafer extraction event refers to an event in which an operator selects a reference wafer, an extraction method of the wafer, and an extraction area on a wafer map by mouse clicking, touching, and the like on an interface of the control device for displaying the wafer map. And when the control equipment receives the wafer extraction event, setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event. The reference wafer is a starting point selected by the wafer, and the reference wafer corresponds to the first wafer selected by the probe station from the wafer. The wafer extraction mode comprises a row extraction mode and a column extraction mode, wherein the row extraction mode refers to that a probe station extracts the wafer from the row where the reference wafer is located; similarly, the row extraction method refers to the wafer extraction performed by the probe station from the row of the reference wafer. The extraction area refers to a certain area selected by a worker on a wafer map, and after the extraction area is set, the probe station only extracts the wafer from the area corresponding to the extraction area on the wafer, and the wafer is not extracted beyond the area.
Step S230: and acquiring the position information of the reference wafer from the wafer map.
In this embodiment, after the control device completes the setting of the reference wafer, the position information of the reference wafer is acquired. The position information is generally expressed by means of coordinate points, line numbers, column numbers and the like. For example, the position information of the reference wafer is (10, 20), which may indicate that the reference wafer is at the line 10 and the line 20 on the wafer map, or the position information of the reference wafer may also be indicated as the line 20 on the wafer map, where the reference wafer corresponds to the wafer and indicates that the reference wafer is at the line 10 and the line 20 on the wafer, or the line 20 on the wafer, and it should be noted that the present embodiment does not limit the indication manner of the position information of the reference wafer.
Step S240: and taking the position information as an initial position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and updating the displayed wafer map according to the extracted wafers.
In this embodiment, the control device controls the probe station to move to a wafer corresponding to the reference wafer on the wafer according to the position information of the reference wafer, uses the position information of the reference wafer as a start position (that is, uses the position information of the wafer corresponding to the reference wafer on the wafer as a start position), and then performs qualified wafer extraction in an area corresponding to the extraction area on the wafer according to the extraction manner. If the extraction mode is a line extraction mode, controlling the probe station to extract qualified wafers according to the line extraction mode; and if the extraction mode is a column extraction mode, controlling the probe station to extract qualified wafers according to the column extraction mode. Before the qualified wafer is extracted, the qualification judgment of the wafer selected each time is needed, namely, whether the wafer selected each time is the qualified wafer or the unqualified wafer is judged, if the selected wafer is the qualified wafer, the wafer is extracted, and the next wafer is continuously selected for the qualification judgment; and if the selected wafer is the unqualified wafer, the wafer is not extracted, then the current unqualified wafer is skipped over, and the next wafer is continuously selected for qualification judgment. After the qualified wafer on each row or each column is extracted, the probe station is controlled to move to the next row or the next column, and qualified wafer extraction is continued until the qualified wafer in the area corresponding to the extraction area on the wafer is extracted.
Furthermore, when the probe station extracts a qualified wafer from the wafer, the control device synchronously updates the wafer map, namely, the wafer corresponding to the wafer extracted each time on the wafer map is changed into the extracted wafer, so that the worker can visually check which wafers on the wafer are extracted through the wafer map updated in real time.
According to the above technical solution, since the wafer map is displayed, when the wafer picking event is received, setting a reference wafer, a wafer extraction mode and an extraction area on a wafer map according to a wafer extraction event, acquiring position information of the reference wafer from the wafer map, taking the position information as a starting position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and the technical proposal of updating the displayed wafer map according to the extracted wafer solves the problem that the position parameter of the reference wafer is determined from the wafer by naked eyes, the method of controlling the probe station to extract the wafer from the wafer according to the position parameter of the reference wafer is easy to have the technical means of inaccurate wafer extraction, in the step of extracting the wafer, the real-time display of the state information of the wafer is realized, the accurate positioning of the wafer is also realized, and the production efficiency of the step of extracting the wafer is greatly improved.
As shown in fig. 3, in the second embodiment of the present application, based on the first embodiment, the step S210 includes the following steps:
step S211: and receiving and reading the wafer map file to obtain the position information and the state information of each wafer on the wafer.
After production of each wafer is completed, each wafer carries a matched wafer map file, position information and state information of each wafer on the wafer are recorded in the wafer map file, the position information can determine the specific position of each wafer on the wafer, and the state information comprises the following information: (ii) a The qualification information of each wafer is represented, namely, each wafer is qualified or unqualified; information indicating whether each wafer has been extracted from the wafer sheet, and so on. The information indicating the acceptability of each wafer and the information indicating whether each wafer has been extracted from the wafer sheet are generally information given with characters of different colors.
In this embodiment, before extracting a wafer from a wafer, a wafer map file matched with the wafer needs to be imported into the control device, and after the control device reads the wafer map file, the position information and the state information of each wafer on the wafer are obtained, and then the following step S212 is executed.
Step S212: and drawing and displaying a wafer map matched with the wafer according to the position information and the state information of each wafer.
In this embodiment, the control device loads the position information and the state information of each wafer in the wafer map file, further draws the wafer map corresponding to the wafer map file, and then displays the wafer map. When the wafer map is drawn, the color of each wafer is uniform, the position of the wafer is determined according to the position information, and the state of the wafer is determined according to the state information. Wherein characters assigned with different colors are used to indicate whether each wafer is acceptable or unacceptable, and whether each wafer has been extracted from the wafer sheet. For example, the color of the wafers is uniformly gold, a black color T indicates an unextracted good wafer, a black color F indicates an unextracted bad wafer, and so on.
According to the technical scheme, the technical means that the wafer map file is received and read to obtain the position information and the state information of each wafer on the wafer, and the wafer map matched with the wafer is drawn and displayed according to the position information and the state information of each wafer is adopted, so that the visual display of the wafer state information on the wafer is realized through the wafer map.
As shown in fig. 4, in a third embodiment of the present application, based on the first embodiment, when the extraction method includes a row extraction method, the step S240 of extracting qualified wafers from the wafers according to the extraction method and the extraction area by using the position information as a starting position includes the following steps:
step S2411: and sequentially selecting the wafers in each row by taking the position information as an initial position.
In this embodiment, the control device uses the position information of the reference wafer as the starting position, that is, uses the position information of the wafer corresponding to the reference wafer on the wafer as the starting position, and then controls the probe station to sequentially select the wafers in each row in the area corresponding to the extraction area on the wafer according to the row extraction method.
Step S2412: after each wafer is selected, whether the currently selected wafer is a qualified wafer is determined.
In this embodiment, the control device controls the probe station to be on the wafer, and after selecting one wafer, the control device determines whether the wafer is a qualified wafer according to the state information of the wafer. Wherein, if the selected wafer is qualified, the selected wafer is taken out from the wafer by the probe station, and the following step S2413 is executed; if the selected wafer is not acceptable, it is not picked up from the wafer by the probe station, and the following step S2414 is executed.
Step S2413: and when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected.
In this embodiment, when extracting a wafer, first, a first wafer in a row where the currently extracted wafer is located is determined as a first initial wafer, and then when determining that the currently selected wafer is a qualified wafer, a first distance between the currently selected wafer and the first initial wafer is obtained, and a second distance between a last extracted wafer and the first initial wafer is obtained; and when the first distance is larger than the second distance, extracting the currently selected wafer, and selecting the next wafer until the wafers in the area corresponding to the extraction area on the wafer are selected.
Step S2414: and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
In this embodiment, when it is determined that the currently selected wafer is an unqualified wafer, the currently selected wafer is skipped without extraction, and then a next wafer is selected until the selection of the wafer in the area corresponding to the extraction area on the wafer is completed.
According to the technical scheme, the wafers in each row are sequentially selected by taking the position information as the starting position, after each wafer is selected, whether the currently selected wafer is a qualified wafer is determined, when the currently selected wafer is the qualified wafer, the currently selected wafer is extracted, the next wafer is selected until the wafer is selected completely, and when the currently selected wafer is the unqualified wafer, the next wafer is selected until the wafer is selected completely, so that the accuracy of extracting the wafers from the wafers according to a row extraction mode is achieved.
As shown in fig. 5, in a fourth embodiment of the present application, based on the first embodiment, when the extraction method includes a row extraction method, the step S240 is to extract qualified wafers from the wafers according to the extraction method and the extraction area by using the position information as a starting position, and further includes the following steps:
step S2421: and sequentially selecting the wafers in each row by taking the position information as a starting position.
In this embodiment, the same as the third embodiment, the control device uses the position information of the reference wafer as the starting position, that is, uses the position information of the wafer corresponding to the reference wafer on the wafer as the starting position, and then controls the probe station to sequentially select the wafers in each row in the area corresponding to the extraction area on the wafer according to the row extraction manner.
Step S2422: after each wafer is selected, whether the currently selected wafer is a qualified wafer is determined.
In this embodiment, the same as the third embodiment, the control device controls the probe station to determine whether the wafer is a qualified wafer according to the state information of the wafer after selecting one wafer. If the selected wafer is qualified, the selected wafer is taken out of the wafer by the probe station, and the following step S2423 is executed; if the selected wafer is not qualified, the selected wafer is not lifted from the wafer by the probe station, and the following step S2424 is performed.
Step S2423: and when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected.
In this embodiment, similar to the third embodiment, when wafer extraction is performed, first, a first wafer in a row where a currently extracted wafer is located is determined as a second initial wafer, and then, when it is determined that the currently selected wafer is a qualified wafer, a third distance between the currently selected wafer and the second initial wafer is obtained, and a fourth distance between a last extracted wafer and the second initial wafer is obtained; and when the third distance is larger than the fourth distance, extracting the currently selected wafer, and selecting the next wafer until the wafers in the area corresponding to the extraction area on the wafer are selected.
Step S2424: and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
In this embodiment, similar to the third embodiment, when it is determined that the currently selected wafer is an unqualified wafer, the currently selected wafer is skipped without extraction, and then a next wafer is selected until the selection of the wafer in the area corresponding to the extraction area on the wafer is completed.
According to the technical scheme, the wafers in each row are sequentially selected by taking the position information as the starting position, after each wafer is selected, whether the currently selected wafer is a qualified wafer is determined, when the currently selected wafer is the qualified wafer, the currently selected wafer is extracted, the next wafer is selected until the wafer is selected completely, and when the currently selected wafer is the unqualified wafer, the next wafer is selected until the wafer is selected completely, so that the accuracy of extracting the wafers from the wafers in a row extraction mode is achieved.
Further, based on the third embodiment or the fourth embodiment, after the step of extracting the currently selected wafer when the currently selected wafer is a qualified wafer, the method further includes: and changing the extracted state identifier of the wafer into an extracted identifier on the wafer map.
Specifically, when the currently selected wafer is a qualified wafer, after the currently selected wafer is extracted, the state identifier of the extracted wafer is changed into the extracted identifier on the wafer map. The state mark is a character endowed with different colors, and comprises an extracted mark and an unextracted mark. The state identifier displayed on the wafer graph before the currently selected wafer is not extracted is an unextracted identifier, and if the state identifier is a black T, the currently selected wafer is a qualified wafer which is not extracted; after the currently selected wafer is extracted, the un-extracted mark displayed on the wafer map is changed to the extracted mark, for example, the T of the black color is changed to the T of the white color, and the T of the white color indicates that the wafer at the position is extracted.
As shown in fig. 6, the present application provides a wafer map display system, which includes:
a wafer map display module 310 for displaying a wafer map;
the information setting module 320 is configured to set a reference wafer, a wafer extraction method and an extraction area on the wafer map according to a wafer extraction event when the wafer extraction event is received;
an information obtaining module 330, configured to obtain position information of the reference wafer from the wafer map;
and the wafer extracting module 340 is configured to extract qualified wafers from the wafers according to the extracting manner and the extracting area by using the position information as an initial position, and update the displayed wafer map according to the extracted wafers.
Further, the wafer map display module 310 includes:
the file reading unit is used for receiving and reading the wafer image file to obtain the position information and the state information of each wafer on the wafer;
and the image drawing unit is used for drawing and displaying the wafer image matched with the wafer according to the position information and the state information of each wafer.
Further, the wafer extracting module 340 specifically includes, in terms of extracting qualified wafers from the wafers according to the extracting manner and the extracting area by using the position information as a start position:
the row selecting unit is used for sequentially selecting the wafers in each row by taking the position information as an initial position;
the row judgment unit is used for determining whether the currently selected wafer is a qualified wafer or not after each wafer is selected;
the first row of extraction units are used for extracting the currently selected wafer when the currently selected wafer is a qualified wafer, and selecting the next wafer until the wafer is selected;
and the second row of extraction units is used for selecting the next wafer until the wafer is selected completely when the currently selected wafer is an unqualified wafer.
Further, the first line extracting unit includes:
the row distance determining subunit is configured to, when the currently selected wafer is a qualified wafer, obtain a first distance between the currently selected wafer and a first initial wafer, and obtain a second distance between a last extracted wafer and the first initial wafer, where the first initial wafer is a first wafer in a row where the currently extracted wafer is located;
and the row extracting subunit is used for extracting the currently selected wafer and selecting the next wafer when the first distance is greater than the second distance.
Further, the wafer extracting module 340 specifically includes, in terms of extracting qualified wafers from the wafers according to the extracting manner and the extracting area by using the position information as a start position:
the row selecting unit is used for sequentially selecting the wafers in each row by taking the position information as an initial position;
the row judgment unit is used for determining whether the currently selected wafer is a qualified wafer or not after each wafer is selected;
the first row of extraction units are used for extracting the currently selected wafer when the currently selected wafer is a qualified wafer, and selecting the next wafer until the wafer is selected;
and the second row of extraction units is used for selecting the next wafer until the wafer is selected completely when the currently selected wafer is an unqualified wafer.
Further, the first column extracting unit includes:
a row distance determining subunit, configured to, when the currently selected wafer is a qualified wafer, obtain a third distance between the currently selected wafer and a second initial wafer, and obtain a fourth distance between a last extracted wafer and the second initial wafer, where the second initial wafer is a first wafer in a row where the currently extracted wafer is located;
and the row extracting subunit is used for extracting the currently selected wafer and selecting the next wafer when the third distance is greater than the fourth distance.
Further, the wafer map display system further includes:
and the mark changing unit is used for changing the extracted state mark of the wafer into an extracted mark on the wafer map.
The specific embodiment of the wafer map display system of the present invention is substantially the same as the embodiments of the wafer map display method described above, and will not be described herein again.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A wafer map display method is characterized by comprising the following steps:
displaying a wafer map;
when a wafer extraction event is received, setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event;
acquiring the position information of the reference wafer from the wafer map;
and taking the position information as an initial position, extracting qualified wafers from the wafers according to the extraction mode and the extraction area, and updating the displayed wafer map according to the extracted wafers.
2. The method of claim 1, wherein the step of displaying the wafer map comprises:
receiving and reading a wafer map file to obtain the position information and the state information of each wafer on a wafer;
and drawing and displaying a wafer map matched with the wafer according to the position information and the state information of each wafer.
3. The method of claim 1, wherein the extraction mode comprises a line extraction mode; the extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position comprises the following steps:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
4. The method as claimed in claim 3, wherein the step of extracting the currently selected wafer and selecting the next wafer when the currently selected wafer is a qualified wafer comprises:
when the currently selected wafer is a qualified wafer, acquiring a first distance between the currently selected wafer and a first initial wafer, and acquiring a second distance between a last extracted wafer and the first initial wafer, wherein the first initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the first distance is greater than the second distance, extracting the currently selected wafer and selecting the next wafer.
5. The method of claim 1, wherein the extraction mode further comprises a column extraction mode; the extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position comprises the following steps:
sequentially selecting the wafers in each row by taking the position information as an initial position;
after each wafer is selected, determining whether the currently selected wafer is a qualified wafer;
when the currently selected wafer is a qualified wafer, extracting the currently selected wafer, and selecting the next wafer until the wafer is selected;
and when the currently selected wafer is an unqualified wafer, selecting the next wafer until the wafer is selected.
6. The method as claimed in claim 5, wherein the step of extracting the currently selected wafer and selecting the next wafer when the currently selected wafer is a qualified wafer comprises:
when the currently selected wafer is a qualified wafer, acquiring a third distance between the currently selected wafer and a second initial wafer, and acquiring a fourth distance between a last extracted wafer and the second initial wafer, wherein the second initial wafer is a first wafer in a row where the currently extracted wafer is located;
and when the third distance is greater than the fourth distance, extracting the currently selected wafer and selecting the next wafer.
7. The method as claimed in claim 3 or 5, wherein after the step of extracting the currently selected wafer when the currently selected wafer is a qualified wafer, the method further comprises:
and changing the extracted state identifier of the wafer into an extracted identifier on the wafer map.
8. A wafer map display system, comprising:
the wafer map display module is used for displaying a wafer map;
the information setting module is used for setting a reference wafer, a wafer extraction mode and an extraction area on the wafer map according to the wafer extraction event when the wafer extraction event is received;
the information acquisition module is used for acquiring the position information of the reference wafer from the wafer map;
and the wafer extracting module is used for extracting qualified wafers from the wafers according to the extracting mode and the extracting area by taking the position information as an initial position, and updating the displayed wafer map according to the extracted wafers.
9. A wafer map display apparatus, comprising: a memory, a processor and a wafer map display program stored on the memory and executable on the processor, the wafer map display program when executed by the processor implementing the steps of the wafer map display method as claimed in any one of claims 1-7.
10. A storage medium having stored thereon a wafer map display program which, when executed by a processor, implements the steps of the wafer map display method according to any one of claims 1 to 7.
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