CN112992698B - Method for manufacturing optical module - Google Patents
Method for manufacturing optical module Download PDFInfo
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- CN112992698B CN112992698B CN201911215042.6A CN201911215042A CN112992698B CN 112992698 B CN112992698 B CN 112992698B CN 201911215042 A CN201911215042 A CN 201911215042A CN 112992698 B CN112992698 B CN 112992698B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 50
- 239000010410 layer Substances 0.000 claims abstract description 70
- 239000011241 protective layer Substances 0.000 claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims description 75
- 230000000903 blocking effect Effects 0.000 claims description 46
- 230000008569 process Effects 0.000 description 33
- 238000007772 electroless plating Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010329 laser etching Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a manufacturing method of an optical module, which comprises the following steps: arranging a light-emitting device and a sensor on a substrate; forming a first package part on the light emitting device and a second package part on the sensor respectively; forming a protective layer on the structure; the protection layer, the first packaging part and the second packaging part are removed along a direction, so that the position of the first packaging part corresponding to the light emitting device and the position of the second packaging part corresponding to the sensor are exposed out of the protection layer.
Description
Technical Field
The present invention relates to a method for manufacturing an optical module, and more particularly, to an optical module for miniaturizing an electronic device and a method for manufacturing the same.
Background
Currently, miniaturization of the size of an environmental sensor (proximity sensor) and a proximity sensor (proximity sensor) has been a trend in the mobile phone market due to the larger and larger screen of the mobile phone or the larger usage space required for its electronic components. Fig. 1 shows a schematic diagram of a conventional mobile phone, as shown in fig. 1, in the mobile phone 10, when the size of the display 11 of the mobile phone 10 becomes larger and the size of the optical module 12 having the environmental sensor and the proximity sensor becomes smaller, the problem of the crosstalk phenomenon (crosstalk phenomenon) has become an important problem in the development of the mobile phone.
Accordingly, there is a need to devise a novel manufacturing method that can reduce the influence of the crosstalk phenomenon as the size of an optical module including a proximity sensor becomes smaller and smaller.
Disclosure of Invention
The invention aims to solve the technical problem of improving the crosstalk phenomenon of a proximity sensor and provides a manufacturing method of an optical module.
According to the above object, one of the technical solutions adopted by the present invention is to provide a method for manufacturing an optical module, which includes: arranging a light-emitting device and a sensor on a substrate; forming a first packaging part on the light-emitting device and forming a second packaging part on the sensor; forming a protective layer on the first packaging part and the second packaging part; and removing part of the protective layer, the first packaging part and the second packaging part along one direction, so that the first packaging part and the second packaging part are exposed from the protective layer.
Further, the method further includes forming a first protrusion on the first package portion and forming a second protrusion on the second package portion, forming a protection layer on the first package portion and the second package portion according to the shapes of the first package portion having the first protrusion and the second package portion having the second protrusion, and further forming a continuous profile on the first package portion and the second package portion, wherein the areas of the first protrusion and the second protrusion are smaller than or equal to the areas of the first package portion and the second package portion.
Further, the removing step further includes removing the second protrusion on the second package portion, so that the two upper surfaces of the protection layer and the upper surface of the first package portion are flush with the upper surface of the second package portion.
Further, in the step of forming the first package portion and the second package portion, a sealing compound is coated on the light emitting device, the sensor and the substrate, and then the sealing compound and the substrate are cut to form a gap between the first package portion, the second package portion and the substrate.
Further, the manufacturing method of the optical module further includes: a third packaging part is selectively formed on one outer surface of the first packaging part or one outer surface of the first packaging part and one outer surface of the second packaging part.
According to the above object, another aspect of the present invention provides a method for manufacturing an optical module, including: arranging a light-emitting device and a sensor on a substrate; forming a first packaging part on the light-emitting device and forming a second packaging part on the sensor; forming an ultraviolet blocking layer on the first packaging part and the second packaging part; forming a protective layer on the ultraviolet blocking layer; removing a first block of the protection layer corresponding to the position of the light emitting device and a second block of the protection layer corresponding to the position of the sensor.
Furthermore, the first packaging part forms a protruding surface at the same time when being formed, and the ultraviolet blocking layer and the protective layer protrude above the first packaging part in sequence according to the protruding surface.
The removing step further includes curing the ultraviolet blocking layer by ultraviolet rays, so that the ultraviolet blocking layer is effectively adhered to the first packaging part and the second packaging part.
Further, the manufacturing method of the optical module further includes: selectively forming a third packaging part on the first window of the ultraviolet blocking layer, forming the third packaging part on the second window of the ultraviolet blocking layer, or forming the third packaging part on the first window and the second window of the ultraviolet blocking layer.
Still further, a first section of the third encapsulation over the first window of the ultraviolet blocking layer on the light emitting device may include a dome surface, an aspherical surface, an arcuate surface, a parabolic surface, or a hyperbolic surface.
The invention has the advantages that the protective layer is formed on the first packaging part in an electroless plating mode and comprises a submicron thickness, so that the optical module can block most scattered light, thereby having better sensitivity. Also, due to the manufacturing method and structure of the optical module in the present invention, as the size of the optical module becomes smaller and smaller, the crosstalk phenomenon can be improved by applying the optical module of the present invention.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the invention.
Drawings
Fig. 1 shows a schematic diagram of a conventional mobile phone.
Fig. 2 is a flowchart of an optical module manufacturing method in the first embodiment of the present invention.
Fig. 3A to 3E are schematic views illustrating a method for manufacturing a light emitting module according to a first embodiment of the present invention.
Fig. 4 is a flowchart of a method of manufacturing an optical module in a second embodiment of the present invention.
Fig. 5A to 5G are schematic views of a manufacturing method of an optical module in a second embodiment of the present invention.
Detailed Description
The following description is given of specific embodiments of the present invention with respect to a method for manufacturing an optical module, and those skilled in the art will recognize the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or signal from another signal. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
For clarity of explanation, in some cases, the present technology may be presented as including separate functional blocks including functional blocks, including devices, device components, steps or routes in a method implemented in software, or a combination of hardware and software.
Means for implementing methods in accordance with these disclosures may include hardware, firmware, and/or software, and may take any of a variety of forms. Typical examples of such features include notebook computers, smart phones, mini-personal computers, personal digital assistants, and the like. The functions described herein may also be implemented in a peripheral device or a built-in card. By way of further example, such functionality may also be implemented on circuit boards of different programs executing on different chips or on a single device.
The instructions, media for transmitting such instructions, computing resources for executing the same, or other structures for supporting such computing resources are means for providing the functionality described in these disclosures.
First embodiment
Fig. 2 is a flowchart of a method for manufacturing an optical module according to a first embodiment of the present invention, and fig. 3A to 3E are schematic diagrams of a method for manufacturing a light emitting module according to a first embodiment of the present invention. Referring to fig. 2 and 3A, in the manufacturing method of the optical module 30, in step S201, the light emitting device 31 and the sensor 32 are first disposed on the substrate 33, and the light emitting device 31 and the sensor 32 may be disposed on the substrate 33 by die bonding or wire bonding, but the present invention is not limited thereto.
The light emitting device 31 may be an infrared light emitting diode (INFRARED RED, IR LED) or a laser diode, which may emit light of a specific wavelength. The sensor 32 may be a photodiode or any sensor 32 that can detect light emitted from the light emitting device 31. Specifically, in an embodiment of the present invention, the sensor 32 is capable of detecting infrared light emitted from the light emitting device 31. The sensor 32 in embodiments of the present invention may include an ambient light sensor 321 and a proximity sensor 322, but is not limited thereto. The sensor 32 may optically detect a person or object in front of the sensor 32, in particular, the sensor 32 may detect light reflected from the person or object after being emitted by the light emitting device 31, and the sensor 32 will determine whether the person or object is close to the sensor 32 by the reflected light. Thus, the optical module 30 of the present invention may be used in a mobile phone to determine whether a person or object is approaching the mobile phone, or in a robotic vacuum cleaner or vacuum cleaner to detect whether furniture or someone is blocking the cleaning path. The substrate 33 in the present invention is preferably a printed circuit board (Print Circuit Board, PCB), but is not limited thereto. In various embodiments, the light emitting device 31 and the sensor 32 may be electrically connected to other conductive components (not shown) on the substrate 33 using Wire bonding (Wire bonding).
Referring to fig. 3B, in step S202, a first package portion 34A and a second package portion 34B are formed on the light emitting device 31 and the sensor 32, respectively. In addition, the first and second encapsulation portions 34A and 34B may be formed simultaneously or in two different steps, which is not limited herein. Further, a package layer may be formed on the light emitting device 31, the sensor 32 and the substrate 33, and then the package layer and the substrate 33 are separated by a separation process, so as to form a first package portion 34A covering the light emitting device 31 and a second package portion 34B covering the sensor 32, respectively. Or by Molding, the first and second package portions 34A and 34B are directly formed on the light emitting device 31 and the sensor 32 with a specific mold. In addition, the sealing material used to form the first and second sealing parts 34A and 34B is preferably a transparent material such as Epoxy compound (Epoxy compound), silicone resin (Silicone), urea resin (Urea resin), or the like, but is not limited thereto. The first and second encapsulation parts 34A and 34B have appropriate heights and thicknesses to protect the light emitting device 31, the sensor 32, or the wire bonding when manufacturing the optical module 30 in the present invention. In addition, the encapsulation process in step S202 forms a gap 35 between the light emitting device 31 and the sensor 32, so that the sensor 32 can be prevented from directly receiving the light emitted by the light emitting device 31, and the gap 35 can be further coated with metal to form a barrier in the subsequent process, so as to effectively isolate the light emitting device 31 from the sensor 32 and reduce interference and crosstalk between the light emitting device 31 and the sensor 32, as shown in fig. 3B. In addition, if the gap 35 is formed by a dicing process, it preferably penetrates the encapsulation layer to extend to a part of the substrate 33, so as to avoid light emitted from the light emitting device 31 from being directly introduced into the sensor 32 through the encapsulation layer.
In the present embodiment, the first and second convex portions 341A and 341B are further included on the first and second package portions 34A and 34B, respectively. The first and second protrusions 341A and 341B may serve as reference positions for a subsequent dicing process, and thus opening windows corresponding to predetermined light emitting positions of the light emitting device 31 and predetermined of the sensor 32, respectively, may be generated on top of the first and second encapsulation parts 34A and 34B. On the other hand, in various embodiments, an encapsulant such as resin may be formed on the light emitting device 31, the sensor 32 and the substrate 33, and then a portion of the encapsulant around the light emitting device 31 and the sensor 32 is removed to form the gap 35, the first encapsulation portion 34A and the second encapsulation portion 34B, but is not limited thereto. The area of the first convex portion 341A and the area of the second convex portion 341B may be equal to or smaller than the first package portion 34A and the second package portion 34B, respectively, depending on optical design considerations, but is not limited thereto.
Referring to fig. 3C, in step S203, a protective layer 36 is formed on the first and second package portions 34A and 34B, and a continuous profile is formed on the first and second package portions 34A and 34B. For example, a continuous profile of the protective layer 36 may be formed by a profile defined by the surfaces of the substrate, the first encapsulation portion 34A, and the second encapsulation portion 34B. Specifically, the protective layer 36 is preferably formed on the first and second encapsulation parts 34A and 34B using an electroless plating (electro-LESS PLATING) process, but is not limited thereto. The electroless plating process of the present invention may be performed with a dry film as a material, followed by a lamination process, an exposure process, or other mechanical means to provide the protective layer 36 on the first and second encapsulation portions 34A and 34B. In addition, the continuous profile of the protective layer 36 may be formed according to the shape of the first convex portion 341A of the first encapsulation portion 34A and the second convex portion 341B of the second encapsulation portion 34B.
The protective layer 36 may block more than 90% of Infrared (IR) to form a shield, thereby preventing light from penetrating from the light emitting device 31 to the sensor 32 and reducing crosstalk between the light emitting device 31 and the sensor 32. Thereby improving the performance of the optical module 30. The material of the protective layer 36 may be copper (Cu), gold (Au), silver (Ag), or an alloy metal of a combination thereof, but is not limited thereto. Through the electroless plating process, the protective layer 36 may be sub-micron thick for the purpose of minimizing the optical module 30.
In step S204, a portion of the protective layer 36, the first encapsulation portion 34A, and the second encapsulation portion 34B are removed along a direction, such that the first encapsulation portion 34A and the second encapsulation portion 34B are exposed on the protective layer 36. Specifically, referring to fig. 3C, a dicing process is performed to remove the first portion 381 of the first package portion 34A, the second portion 382 of the second package portion 34B, and the third portion 361 of the protection layer 36. The first portion 381 corresponds to a default light exit position at the light emitting device 31, the second portion 382 corresponds to a default light receiving position at the sensor 32, and the third portion 361 of the protective layer 36 corresponds to the light emitting device 31 and the sensor 32.
In the present embodiment, the first portion 381 of the first package portion 34A is a portion of the first convex portion 341A of the first package portion 34A, and the second portion 382 of the second package portion 34B is a portion of the second convex portion 341B of the second package portion 34B. The third portion 361 is a portion of the protection layer 36, and the third portion 361 of the protection layer 36 is on top of the first package portion 34A and the second package portion 34B and corresponds to the light emitting device 31 and the sensor 32, respectively, which blocks at least one light transmission path on top of the light emitting device 31 or the sensor 32, so that in this embodiment, the first protrusion 341A of the first package portion 34A, the second protrusion 341B of the second package portion 34B and the protection layer 36 of the portion are removed by a dicing process, and thus a window in which the light emitting device 31 defaults to light and a window in which the sensor 32 presets to receive light are opened. Since the first encapsulation 34A has the first convex portion 341A and the second encapsulation 34B has the second convex portion 341B, the first portion 381, the second portion 382, and the third portion 361 can be easily removed by a dicing process.
To obtain better sensing capability, the first portion 381, the second portion 382, and the third portion 361 are removed, and the first window 383 and the second window 384 are formed on the first package 34A and the second package 34B, respectively. The first upper surface 342A of the first package portion 34A and the second upper surface 342B of the second package portion 34B are exposed by the formation of the first window 383 and the second window 384, and the first window 383 and the second window 384 correspond to a default light-emitting position of the light-emitting device 31 and a default light-receiving position of the sensor 32, respectively. In other words, the two top surfaces of the protective layer 36 are flush with the first upper surface 342A and the second upper surface 342B.
Therefore, the first window 383 and the second window 384 limit the light transmission path, thereby enabling the sensor 32 to have an optimal functionality, and improving the reliability of the optical module by preventing the light of the light emitting device 31 from being scattered to the sensor 32.
Specifically, light emitted from the light emitting device 31 may be scattered to the sensor 32, thereby affecting the sensing capability of the sensor 32. In an embodiment of the present invention, the protective layer 36 may block some or all of the scattered light emitted from the light emitting device 31, but the protective layer 36 may also block the sensing light reflected from the sensing object at the same time. Accordingly, a cutting process is required to remove the first and second portions 381 and 382 on top of the first and second encapsulation parts 34A and 34B to form the first and second windows 383 and 384, thereby preventing light emitted or transmitted from the light-emitting device 31 to the sensor 32 from being blocked by the protective layer 36 on the first and second windows 381 and 384.
Referring to fig. 3D, a third encapsulation portion 39 is formed on the protection layer 36, the first encapsulation portion 34A and the second encapsulation portion 34B, and the third encapsulation portion 39 can be used to protect the protection layer 36, the first window 383 and the second window 384. Specifically, the third encapsulation 39 includes a first section 391 and a second section 392, the first section 391 of the third encapsulation 39 is formed on the first window 383, and the second section 392 of the third encapsulation 39 is formed on the second window 384. In a preferred embodiment, the thickness of the second section 392 needs to be less than 3-5 μm, so that light emitted directly from the light emitting device 31 will not be transmitted within the third encapsulation 39. In other words, in an embodiment of the present invention, the thickness of the second section 392 is sufficiently thin so as not to affect the light transmitted to the sensor 32. Moreover, the first section 391 may be connected to the second section 392 to form a third encapsulation 39 of a continuous profile, but in various embodiments, the first section 391 may be proximate to only the second section 392 without being directly connected to the second section 392, but is not limited thereto.
The first section 391 of the third package 39 can include a dome surface, and an optical lens having a corresponding first window 383 is formed on the first upper surface 342A of the first package 34A on the light-emitting device 31, so as to increase the intensity of the LED on-axis brightness to provide better light-emitting efficiency. However, in various embodiments of the present invention, the first section 391 may include an aspherical surface, an arc surface, a parabolic surface, a hyperbolic surface, etc. to enhance the light emitting efficiency of the light emitting device 31, but is not limited thereto.
Fig. 3E is a schematic view of a third package 39 of a different shape of an optical module in a different embodiment of the present invention, wherein the third package 39 is formed as an optical lens on top of the light emitting device 31. Specifically, the third encapsulation 39 may be the first section 391 including only the dome surface, that is, the second section 392 of the third encapsulation 39 is not covered by the upper surface of the second window 384 of the second encapsulation 34B, so that the crosstalk effect of the optical module 30 of the present invention is minimized. On the other hand, the first section 391 of the third package 39 having the dome surface is located on top of the first package 34A, which enhances the light emission of the light emitting device 31.
After forming the third encapsulation 39 on the protective layer 36, the first window 383, and the second window 384, the manufacturing method of the optical module 30 is completed. By the above-described manufacturing method including the limited-size package in the optical module, the problem of the crosstalk phenomenon can be minimized.
Second embodiment
Fig. 4 is a flowchart of a method of manufacturing an optical module in a second embodiment of the present invention. Fig. 5A to 5G are schematic views of a manufacturing method of an optical module in a second embodiment of the present invention. As shown in fig. 4 and 5A, in the manufacturing method of the optical module 50, first, the light emitting device 51 and the sensor 52 are provided on the substrate 53 in step S401. The light emitting device 51 and the sensor 52 may be provided on the substrate 53 by die bonding or wire bonding, and the sensor 52 includes an ambient light sensor 521 and a proximity sensor 522, but is not limited thereto.
Referring to fig. 5B, in step S402, a first encapsulation portion 54A and a second encapsulation portion 54B are formed on the light emitting device 51 and the sensor 52, respectively. Specifically, a package layer is formed on the light emitting device 51, the sensor 52 and the substrate 53, and then a separation process is introduced to divide the package layer and a portion of the substrate 53 along a predetermined dicing line, thereby forming a first package portion 54A of the light emitting device 51 and a second package portion 54B of the sensor 52, which are separated from each other. Or by Molding, the first and second package portions 54A and 54B are directly formed on the light emitting device 51 and the sensor 52 with a specific mold. The sealing material used for the first and second sealing portions 54A and 54B is preferably a transparent material such as epoxy, silicone, urea resin, or the like, but is not limited thereto. In addition, in the present invention, the first and second encapsulation parts 54A and 54B include appropriate heights and thicknesses in order to protect the light emitting device 51, the sensor 52, or the wire bonding when manufacturing the optical module 50 of the present invention. In addition, in step S402, the encapsulation process forms a gap 55 between the light emitting device 51 and the sensor 52, the sensor 52 can be prevented from directly receiving the light emitted by the light emitting device 51 by the gap 55, and the gap 55 can be used for further coating metal to form a barrier in the subsequent process steps, so as to effectively isolate the light emitting device 51 from the sensor 52, and further reduce interference and crosstalk between the light emitting device 51 and the sensor 52. In addition, if the gap 55 is formed by a dicing process, it preferably penetrates the encapsulation layer and extends to a part of the substrate 53, so that light emitted from the light emitting device 51 is prevented from being directly introduced into the sensor 52 through the encapsulation layer.
Referring to fig. 5C, in step S403, an ultraviolet blocking layer 56 is formed on the first encapsulation portion 54A, the second encapsulation portion 54B, and the substrate 53. Specifically, the ultraviolet blocking layer 56 is coated on the first encapsulation portion 54A, the second encapsulation portion 54B, and the substrate 53 by spraying, dipping, or painting, but is not limited thereto. An ultraviolet blocking layer 56 is coated on the first and second encapsulation portions 54A and 54B to provide the desired optical shielding. The optical shielding functions to block the laser light used in the subsequent steps, as the laser light may damage the light emitting device 51 or the sensor 52. Ultraviolet blocking layer 56 protects light emitting device 51 or sensor 52 from the laser light, and ultraviolet blocking layer 56 may be any material capable of providing optical shielding or infrared blocking, but is not limited thereto. In addition, after step S403, in the embodiment of the present invention, a curing process may be performed on the ultraviolet blocking layer 56 by ultraviolet rays, the curing process may ensure that the ultraviolet blocking layer 56 is firmly adhered to the first and second encapsulation parts 54A and 54B, and the curing process includes at least one ultraviolet curing process and at least one heating process, but is not limited thereto.
Still referring to fig. 5C, in step S404, a protective layer 57 is formed on the ultraviolet blocking layer 56. Specifically, the protective layer 57 is formed and provided on the ultraviolet blocking layer 56 by an electroless plating process. The electroless plating process of the present invention may be performed using a dry film as the material and then using a lamination process, an exposure process, or other mechanical means to place the protective layer 57 over the uv blocking layer 56. The protective layer 57 may block more than 90% of Infrared (IR) intensity to form a shield, prevent light from penetrating from the light emitting device 51 to the sensor 52, and reduce a crosstalk phenomenon between the light emitting device 51 and the sensor 52, thereby improving the performance of the optical module 50. The material of the protective layer 57 may be, for example, copper (Cu), gold (Au), silver (Ag), or a combination thereof, but is not limited thereto. The protective layer 57 may be sub-micron thick by an electroless plating process for the purpose of minimizing the optical module 50.
Referring to fig. 5D, in step S405, an etching process is performed to remove the first and second areas 571 and 572 of the protection layer 57, respectively, and the first area 571 of the protection layer 57 corresponds to the position of the light emitting device 51 and the second area 572 of the protection layer 57 corresponds to the position of the sensor 52. The first and second blocks 571 and 572 are partial areas of the protective layer 57, which block at least one light transmission path on the light emitting device 51 or the sensor 52, and the first and second blocks 571 and 572 are removed to open a window over the light emitting device 51 and a window over the sensor 52, and an Ultraviolet (UV) laser etching process is preferably used in the present invention in order to accurately remove the first and second blocks 571 and 572, but is not limited thereto. Because of the provision of the uv blocking layer 56, the light emitting device 51 and the sensor 52 will not be damaged during the uv laser etching process.
To obtain better sensing capability, the first and second regions 571 and 572 of the protection layer 57 are removed, and a first window 581 and a second window 582 are formed on top of the ultraviolet blocking layer 56, as shown in fig. 5E and 5F. The first and second windows 581 and 582 are formed to expose the third and fourth portions 561 and 562 of the ultraviolet blocking layer 56, and the first and second windows 581 and 582 correspond to the default light-emitting position of the light-emitting device 51 and the default light-receiving position of the sensor 52, respectively.
Accordingly, the first and second windows 581 and 582 may limit the light transmission path, thereby providing the sensor 52 with optimal functionality, and increasing the reliability of the optical module 50 by preventing light from being emitted from the light emitting device 51 or transmitted to the sensor 52.
The etching process does not etch the ultraviolet blocking layer 56 under the protective layer 57 due to etching the protective layer 57. Accordingly, the light emitting device 51 and the sensor 52 located under the ultraviolet blocking layer 56 and inside the first and second encapsulation parts 54A and 54B can be protected from the ultraviolet laser light. Then, the first and second blocks 571 and 572 of the protection layer 57 are removed using an etching process, thereby forming first and second windows 581 and 582, preventing light emitted or transferred from the light-emitting device 51 to the sensor 52 from being blocked. Due to the ultraviolet blocking layer 56, the first encapsulation portion 54A and the second encapsulation portion 54B, the light emitting device 51 and the sensor 52 will not be affected by the laser etching process.
The difference between the first embodiment and the second embodiment is that the laser etching process in the second embodiment is more accurate than the cutting process in the first embodiment, and the etching process can remove the first and second blocks 571 and 572 of small area.
As shown in fig. 5E, a third encapsulation portion 59 is formed on the protective layer 57 and the ultraviolet blocking layer 56 by an encapsulation process. The third encapsulation 59 may serve to protect the protective layer 57, the first window 581, and the second window 582. Specifically, the third enclosure 59 includes a first section 591 and a second section 592 connected to the first section 591. The first section 591 of the third encapsulation 59 is located on the first window 581 and the second section 592 of the third encapsulation 59 is located on the second window 582, wherein the thickness of the second section 592 is smaller than 5 μm, so that light emitted directly from the light emitting device 51 will not be able to pass directly through the first section 591 and the second section 592 of the third encapsulation 59 to the sensor 52. The first section 591 may include a dome surface forming a dome lens on top of the light emitting device 51 to increase the intensity of the on-axis brightness of the LED and provide better light extraction efficiency. However, in various embodiments of the present invention, the first section 591 may be an aspherical surface, an arc surface, a parabolic surface, a hyperbolic surface, or the like to enhance the light output intensity of the light emitting device 51, but is not limited thereto.
In various embodiments, the third encapsulation 59 may be formed as shown in fig. 5F, wherein the third encapsulation 59 may include only the first section 591 without the second section 592 overlying the second window 582. In other words, the continuous outline formed by the third encapsulation portion 59 covers the first window 581 of the ultraviolet blocking layer 56 and the protective layer 57 of a portion of the first encapsulation portion 54A. In various embodiments of the present invention, first section 591 may also include a dome surface, an aspherical surface, an arcuate surface, a parabolic surface, a hyperbolic surface, etc. to enhance the light output intensity of light emitting device 51, but is not limited thereto.
On the other hand, in a different embodiment, as shown in fig. 5G, the first encapsulation portion 54A is formed with a convex surface, for example, a dome surface, at the same time, and then the ultraviolet blocking layer 56 and the protective layer 57 are sequentially disposed on the first encapsulation portion 54A, the second encapsulation portion 54B and the substrate 53 according to the shapes of the first encapsulation portion 54A and the second encapsulation portion 54B. Specifically, since the first encapsulation portion 54A is formed with a convex surface, the ultraviolet blocking layer 56 and the protective layer 57 also sequentially protrude from the top position of the first encapsulation portion 54A. Since the second encapsulation portion 54B has a horizontal surface, the ultraviolet blocking layer 56 and the protective layer 57 are disposed at a top position of the second encapsulation portion 54B having a horizontal surface.
In a subsequent step, an etching process is further performed to remove the first and second regions 571 and 572 of the protection layer 57, thereby forming the first and second windows 581 'and 582' on which the protruding portion of the ultraviolet blocking layer 56 above the first encapsulation portion 54A and a portion of the ultraviolet blocking layer 56 above the second encapsulation portion 54B are exposed. Finally, a third encapsulation portion 59 is formed on the continuous outline defined by the protective layer 57 and the ultraviolet blocking layer 56, so as to protect the light emitting device 51 of the first encapsulation portion 54A and the sensor 52 of the second encapsulation portion 54B. Further, as shown in fig. 5G, the second section 592 of the third encapsulant 59 covers the second window 582 'exposing the first window 581', i.e., the protruding portion of the ultraviolet blocking layer 56 over the first encapsulant 54A. In various embodiments of the present invention, the convex portion may also include a dome surface, an aspherical surface, an arc surface, a parabolic surface, a hyperbolic surface, etc. to enhance the light output intensity of the light emitting device 51, but is not limited thereto.
The invention has the advantages that the protective layer is formed on the first packaging part in an electroless plating mode and comprises a submicron thickness, so that the optical module can block most scattered light, thereby having better sensitivity. Also, due to the manufacturing method and structure of the optical module in the present invention, as the size of the optical module becomes smaller and smaller, the crosstalk phenomenon can be improved by applying the optical module of the present invention.
The foregoing disclosure is only a preferred embodiment of the present invention and is not intended to limit the scope of the claims, so that all equivalent technical changes made by the application of the present specification and the accompanying drawings are included in the scope of the claims.
Claims (5)
1. A method of manufacturing an optical module, comprising:
arranging a light-emitting device and a sensor on a substrate;
Forming a first packaging part on the light-emitting device and forming a second packaging part on the sensor;
Forming an ultraviolet blocking layer on the first packaging part and the second packaging part;
Forming a protective layer on the ultraviolet blocking layer, wherein the protective layer is used for reducing crosstalk between the light emitting device and the sensor; and
Removing a first block of the protective layer corresponding to the position of the light emitting device and a second block of the protective layer corresponding to the position of the sensor to form a first window and a second window on the ultraviolet blocking layer respectively.
2. The method according to claim 1, wherein the first package portion is formed with a convex surface, and the ultraviolet blocking layer and the protective layer are sequentially protruded above the first package portion according to the convex surface.
3. The method of claim 1, further comprising curing the uv blocking layer by uv light to effectively adhere the uv blocking layer to the first and second package portions.
4. A method of manufacturing an optical module according to any one of claims 1 to 3, further comprising: selectively forming a third packaging part on the first window of the ultraviolet blocking layer, forming the third packaging part on the second window of the ultraviolet blocking layer, or forming the third packaging part on the first window and the second window of the ultraviolet blocking layer.
5. The method of claim 4, wherein a first section of the third encapsulation portion above the first window of the ultraviolet blocking layer on the light emitting device comprises an aspheric surface or an arcuate surface.
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| TW200629489A (en) * | 2004-09-16 | 2006-08-16 | Sharp Kk | Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
| KR20120087779A (en) * | 2011-11-16 | 2012-08-07 | 주식회사 오디텍 | Method for manufacturing proximity sensor |
| TW201526212A (en) * | 2013-12-27 | 2015-07-01 | Lingsen Precision Ind Ltd | Micro-optical package structure having light filtration layer and fabrication method thereof |
| KR101898055B1 (en) * | 2017-08-11 | 2018-09-12 | (주)파트론 | Optical sensor package and manufacturing method thereof |
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| CN201440413U (en) * | 2009-01-23 | 2010-04-21 | 原相科技股份有限公司 | Encapsulation structure |
| TWI606571B (en) * | 2015-05-07 | 2017-11-21 | 億光電子工業股份有限公司 | Optical sensing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200629489A (en) * | 2004-09-16 | 2006-08-16 | Sharp Kk | Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment |
| KR20120087779A (en) * | 2011-11-16 | 2012-08-07 | 주식회사 오디텍 | Method for manufacturing proximity sensor |
| TW201526212A (en) * | 2013-12-27 | 2015-07-01 | Lingsen Precision Ind Ltd | Micro-optical package structure having light filtration layer and fabrication method thereof |
| KR101898055B1 (en) * | 2017-08-11 | 2018-09-12 | (주)파트론 | Optical sensor package and manufacturing method thereof |
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