CN112984412A - LED landing lamp heat radiation structure - Google Patents
LED landing lamp heat radiation structure Download PDFInfo
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- CN112984412A CN112984412A CN201911295477.6A CN201911295477A CN112984412A CN 112984412 A CN112984412 A CN 112984412A CN 201911295477 A CN201911295477 A CN 201911295477A CN 112984412 A CN112984412 A CN 112984412A
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- Prior art keywords
- lamp
- printed board
- led
- top surface
- light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/30—Use or application of lighting devices on or in particular types of vehicles for aircraft
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a heat dissipation structure of an LED landing lamp, which comprises a lamp shell, a heat dissipation plate and a heat dissipation plate, wherein the lamp shell is of a bowl-shaped structure; a lamp housing; fixing a pressing ring; the driving circuit printed board is provided with a power module, the bottom surface of the power module is abutted against the top surface of the bottom wall of the lamp shell, and a heat conduction gasket is arranged between the bottom surface of the power module and the top surface of the bottom wall of the lamp shell; and the light source module is provided with a module base and an LED light source printed board, the bottom surface of the module base is abutted against the top surface of the bottom wall of the lamp shell, a heat-conducting silicone grease layer is arranged between the bottom surface of the module base and the top surface of the lamp shell, the bottom surface of the LED light source printed board is abutted against the top surface of the module base, and a heat-conducting silicone grease layer is arranged between the bottom surface of the LED light source printed board and the top surface of the module base, wherein the LED light source printed board is a thermoelectric separation type printed. The invention has the beneficial effects that: the heat dissipation problem of the LED landing lamp is improved, the light attenuation of the LED is effectively reduced, and the service life of the LED landing lamp is greatly prolonged.
Description
Technical Field
The invention relates to a heat dissipation structure of an LED landing lamp.
Background
The landing lamp is an important component of an aircraft external lighting system and provides landing lighting for pilots. With the continuous development of science and technology, the high-luminous-efficiency high-power LED gradually replaces the traditional light source due to high luminous efficiency, long service life and high reliability, and becomes the preferred light source of the landing lamp. And according to the light emitting principle of the LED light source, the following principle is known: the excessively high junction temperature causes the luminous capacity to be reduced and the service life to be shortened, and in order to ensure that the LED can work stably for a long time, the working temperature of the LED must be ensured to be lower than the allowed maximum junction temperature. Meanwhile, with the design requirement of lighter and lighter weight of modern airplanes, the overall size and weight of the landing lamp are also smaller and smaller, which puts higher requirements on the heat dissipation design of the landing lamp.
Disclosure of Invention
The invention provides a novel LED landing lamp heat dissipation structure, aiming at solving the defect of poor heat dissipation of an LED landing lamp in the prior art.
In order to achieve the purpose, the technical scheme of the invention is as follows: a heat dissipation structure of LED landing lamp comprises,
the lamp shell is of a bowl-shaped structure and is provided with an upward opening, and radiating fins are formed on the lamp shell and extend downwards from the bottom wall of the lamp shell;
a lamp cover disposed over the lamp housing, the lamp cover configured to seal the upward opening, the lamp cover and the lamp housing together defining a housing chamber;
the fixed pressing ring is arranged above the lamp shade body, and the fixed pressing ring and the lamp shell jointly fix the lamp shade body;
the driving circuit printed board is arranged inside the cavity of the shell and is provided with a power module, the bottom surface of the power module is abutted against the top surface of the bottom wall of the lamp shell, and a heat conduction gasket is arranged between the bottom surface of the power module and the top surface of the bottom wall of the lamp shell; and the number of the first and second groups,
the light source module comprises a module base, an LED light source printed board, an insulating board and a reflecting bowl, wherein the bottom surface of the module base is abutted to the top surface of the bottom wall of the lamp shell, a heat conduction silicone grease layer is arranged between the bottom surface of the module base and the top surface of the bottom wall of the lamp shell, the bottom surface of the LED light source printed board is abutted to the top surface of the module base, and the heat conduction silicone grease layer is arranged between the bottom surface of the LED light source printed board and the top surface of the module base, wherein the LED light source printed board is.
As a preferred scheme of the heat dissipation structure of the LED landing lamp, a first connection hole is formed on the top surface of the lamp housing, a first connected hole corresponding to the first connection hole is formed on the fixed pressing ring, the first connected hole and the first connection hole have a common vertical axis, and a first connecting member is provided between the first connected hole and the first connection hole, so that the fixed pressing ring is fixedly connected to the lamp housing.
As a preferable scheme of the heat dissipation structure of the LED landing lamp, a cover body through hole for the first connecting member to pass through is formed on the lamp cover body.
As a preferred scheme of the heat dissipation structure of the LED landing lamp, a sealing ring is disposed between the fixed pressing ring and the lamp cover body, and/or a sealing ring is disposed between the fixed lamp cover body and the lamp housing.
As a preferred scheme of the heat dissipation structure of the LED landing lamp, a positioning shoulder is formed on the inner surface of the lamp housing, a second connection hole is formed on the positioning shoulder, the driving circuit printed board is placed on the positioning shoulder, a second connection hole corresponding to the second connection hole is formed on the driving circuit printed board, the second connection hole and the second connection hole have a common vertical axis, and a second connection member is provided between the second connection hole and the second connection hole, so that the driving circuit printed board is fixedly connected to the lamp housing.
Compared with the prior art, the invention has the beneficial effects that: the heat dissipation problem of the LED landing lamp is improved, the light attenuation of the LED is effectively reduced, and the service life of the LED landing lamp is greatly prolonged.
In addition to the technical problems solved by the present invention, the technical features constituting the technical solutions, and the advantageous effects brought by the technical features of the technical solutions described above, other technical problems solved by the present invention, other technical features included in the technical solutions, and advantageous effects brought by the technical features will be described in further detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a light source module according to an embodiment of the invention.
FIG. 3 is a diagram of heat conduction paths according to an embodiment of the present invention.
Detailed Description
The invention will be described in further detail below with reference to specific embodiments and drawings. Here, the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, a heat dissipation structure of an LED landing lamp is shown, which is particularly suitable for a small LED landing lamp.
The heat dissipation structure comprises a lamp shell 1, a lamp cover body 2, a light source module 3, a driving circuit printed board 4, a fixed pressing ring 5 and the like.
The lamp housing 1 is made of a material with good heat conductivity, such as aluminum alloy. The lamp shell 1 is of a bowl-shaped structure. The lamp housing 1 has an upward opening. A first connection hole is formed on the top surface of the lamp housing 1. The lamp housing 1 is formed with a heat sink 11, and the heat sink 11 extends downward from the bottom surface of the lamp housing 1, so as to significantly increase the heat convection area of the lamp housing 1. In this embodiment, the thickness of the heat dissipation sheet is 1.5mm, and the distance between two adjacent heat dissipation sheets is 8 mm. A positioning shoulder 10 is formed on the inner surface of the lamp housing 1. The positioning shoulder 10 is formed with a second connection hole.
The lamp shade 2 is arranged above the lamp housing 1. The lampshade body 2 is used for sealing the upward opening. The lamp housing 2 and the lamp housing 1 together define a housing chamber.
The fixed pressing ring 5 is arranged above the lamp shade body 2. A first connected hole corresponding to the first connecting hole is formed on the fixed pressing ring 5. The first connected hole and the first connecting hole have a common vertical axis. A first connecting piece is arranged between the first connected hole and the first connecting hole so as to realize that the fixed pressing ring 5 is fixedly connected with the lamp shell 1. The fixed pressing ring 5 and the lamp shell 1 jointly fix the lamp shade 2. In order to avoid the first connecting piece, a cover body passing hole for the first connecting piece to pass through is formed on the lamp cover body 2.
Preferably, a sealing ring 6 is disposed between the fixed pressing ring 5 and the lamp cover 2, and/or a sealing ring 6 is disposed between the fixed lamp cover 2 and the lamp housing 1. The seal 6 is designed to prevent moisture etc. from entering the housing chamber.
The drive circuit printed board 4 is placed inside the housing cavity and rests on the positioning shoulders 10. A second connected hole corresponding to the second connection hole is formed on the driving circuit printed board 4. The second connected hole and the second connecting hole have a common vertical axis. And a second connecting piece is arranged between the second connected hole and the second connecting hole so as to realize that the driving circuit printed board 4 is fixedly connected with the lamp shell 1. The drive circuit printed board 4 has a power module disposed thereon. The bottom surface of the power module is abutted against the top surface of the bottom wall of the lamp shell 1. The power of the power module is as high as possible in order to maximize the heat transfer from the housing chamber to the outside air. For better sufficient contact heat conduction, a heat conducting gasket is arranged between the bottom surface of the power module and the top surface of the bottom wall of the lamp housing 1.
Referring to fig. 2, the light source module 3 includes a module base 31, an LED light source printed board 32, an insulating board 33, and a light reflecting bowl 34. The module base 31 is made of red copper having excellent heat conductivity. The module base 31 is fixed on the bottom wall of the lamp housing 1. The contact surface of the module base 31 and the drive circuit printed board 4 is coated with heat conductive silicone grease having excellent heat conductivity, thereby reducing the thermal resistance on the contact surface. The LED light source printed board is provided with LEDs with high power density. The LED light source printed board 32 is placed on the module base 31 and coated with a layer of heat conductive silicone grease having excellent heat conductive properties on the contact surface thereof. The LED light source printed board 32 employs a thermoelectric separation type printed board. The thermal conductivity of the LED light source printed board 32 at the bonding pad under the LED is as high as 170W/m.k, which can guide the heat generated by the LED to the module base to the maximum extent. The insulating board 33 is disposed on the LED light source printed board 32. The reflector 34 surrounds the periphery of the LED.
Referring to fig. 3, the working principle of the present embodiment is as follows: the heat generated by the LED operation is conducted to the module base 31 through the LED light source printed board 32, then conducted to the lamp housing 1 through the module base 31, and finally dissipated to the external environment through the heat convection between the heat dissipation sheet and the air.
The foregoing merely represents embodiments of the present invention, which are described in some detail and detail, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A heat dissipation structure of LED landing lamp is characterized in that it comprises,
the lamp shell is of a bowl-shaped structure and is provided with an upward opening, and radiating fins are formed on the lamp shell and extend downwards from the bottom wall of the lamp shell;
a lamp cover disposed over the lamp housing, the lamp cover configured to seal the upward opening, the lamp cover and the lamp housing together defining a housing chamber;
the fixed pressing ring is arranged above the lamp shade body, and the fixed pressing ring and the lamp shell jointly fix the lamp shade body;
the driving circuit printed board is arranged inside the cavity of the shell and is provided with a power module, the bottom surface of the power module is abutted against the top surface of the bottom wall of the lamp shell, and a heat conduction gasket is arranged between the bottom surface of the power module and the top surface of the bottom wall of the lamp shell; and the number of the first and second groups,
the light source module comprises a module base, an LED light source printed board, an insulating board and a reflecting bowl, wherein the bottom surface of the module base is abutted to the top surface of the bottom wall of the lamp shell, a heat conduction silicone grease layer is arranged between the bottom surface of the module base and the top surface of the bottom wall of the lamp shell, the bottom surface of the LED light source printed board is abutted to the top surface of the module base, and the heat conduction silicone grease layer is arranged between the bottom surface of the LED light source printed board and the top surface of the module base, wherein the LED light source printed board is.
2. The LED landing lamp heat dissipation structure of claim 1, wherein a first connection hole is formed on a top surface of the lamp housing, a first connected hole corresponding to the first connection hole is formed on the fixed pressing ring, the first connected hole and the first connection hole have a common vertical axis, and a first connection member is disposed between the first connected hole and the first connection hole to fixedly connect the fixed pressing ring and the lamp housing.
3. The LED landing lamp heat dissipation structure as claimed in claim 2, wherein the lamp housing has a housing through hole formed therein for the first connector to pass through.
4. The LED landing lamp heat dissipation structure as claimed in claim 2 or 3, wherein a sealing ring is disposed between the fixed pressing ring and the lamp housing, and/or a sealing ring is disposed between the fixed lamp housing and the lamp housing.
5. The LED landing lamp heat dissipation structure as claimed in claim 1, wherein a positioning shoulder is formed on an inner surface of the lamp housing, a second connection hole is formed on the positioning shoulder, the driving circuit printed board is placed on the positioning shoulder, a second connected hole corresponding to the second connection hole is formed on the driving circuit printed board, the second connected hole and the second connection hole have a common vertical axis, and a second connection member is provided between the second connected hole and the second connection hole to fixedly connect the driving circuit printed board and the lamp housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911295477.6A CN112984412A (en) | 2019-12-16 | 2019-12-16 | LED landing lamp heat radiation structure |
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CN201911295477.6A CN112984412A (en) | 2019-12-16 | 2019-12-16 | LED landing lamp heat radiation structure |
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CN112984412A true CN112984412A (en) | 2021-06-18 |
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CN201911295477.6A Pending CN112984412A (en) | 2019-12-16 | 2019-12-16 | LED landing lamp heat radiation structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113820101A (en) * | 2021-11-23 | 2021-12-21 | 成都盛及航空科技发展有限公司 | Method for detecting and evaluating reliability of landing lamp |
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2019
- 2019-12-16 CN CN201911295477.6A patent/CN112984412A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113820101A (en) * | 2021-11-23 | 2021-12-21 | 成都盛及航空科技发展有限公司 | Method for detecting and evaluating reliability of landing lamp |
CN113820101B (en) * | 2021-11-23 | 2022-04-01 | 成都盛及航空科技发展有限公司 | Method for detecting and evaluating reliability of landing lamp |
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