CN112981504A - Polyimide film electrolytic copper plating equipment and use method thereof - Google Patents
Polyimide film electrolytic copper plating equipment and use method thereof Download PDFInfo
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- CN112981504A CN112981504A CN202110164185.XA CN202110164185A CN112981504A CN 112981504 A CN112981504 A CN 112981504A CN 202110164185 A CN202110164185 A CN 202110164185A CN 112981504 A CN112981504 A CN 112981504A
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- 238000007747 plating Methods 0.000 title claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 69
- 239000010949 copper Substances 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229920001721 polyimide Polymers 0.000 title claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 156
- 238000004140 cleaning Methods 0.000 claims abstract description 102
- 239000003792 electrolyte Substances 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 description 17
- 230000000694 effects Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 244000137852 Petrea volubilis Species 0.000 description 4
- 229920001821 foam rubber Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000002198 insoluble material Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses polyimide film electrolytic copper plating equipment and a use method thereof, relating to the technical field of electrolytic copper plating equipment; the problems that the operation is complicated and the labor intensity of workers is high in the electrolytic copper plating process of the workpiece are solved; the polyimide film electrolytic copper plating equipment comprises an electroplating bracket; the outer wall of the bottom end of the electroplating bracket is fixedly connected with an electric guide rail through a screw; the outer wall of the top end of the electric guide rail is connected with an electroplating box body and a cleaning box body in a sliding mode, and the using method of the polyimide film electrolytic copper plating equipment comprises the following steps: and respectively installing the electroplating workpiece and the insoluble anode rod on a cathode electric push rod and an anode electric push rod. According to the invention, by arranging the panoramic camera, the cleaning box body and the electroplating box body, the panoramic camera can monitor the electroplating and cleaning processes in the whole process, so that the adjustment of workers is facilitated, the flexibility of the device is improved, and the electroplated workpiece and the insoluble anode rod are cleaned.
Description
Technical Field
The invention relates to the technical field of electrolytic copper plating equipment, in particular to polyimide film electrolytic copper plating equipment and a using method thereof.
Background
The electrolytic copper plating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, when in electroplating, plating layer metal is taken as an anode and is oxidized into cations to enter electroplating solution, a metal product to be plated is taken as a cathode, and the cations of the plating layer metal are reduced on the surface of the metal to form a plating layer.
Through retrieval, chinese patent application No. cn201710590844.x discloses a copper plating device that adopts external groove to dissolve electrolytic copper, including the coating bath, is equipped with plating solution nozzle, copper bar and insoluble anode in the coating bath, and the coating bath is connected the stock solution tank and is formed plating solution circulating structure, its characterized in that: the copper melting device is characterized by also comprising a copper melting tank, wherein a plurality of titanium baskets for placing electrolytic copper are arranged in the copper melting tank, the liquid inlet end of the copper melting tank is communicated with a return pipe for connecting the plating tank and the liquid storage tank, and the liquid outlet end of the copper melting tank is directly connected with the liquid storage tank to form a copper ion supplementing mechanism for the liquid storage tank; the liquid storage tank is provided with a copper ion concentration monitor. In the copper plating device for dissolving electrolytic copper by adopting the external tank, the concentration of the electrolytic solution needs to be adjusted by workers in the electrolytic copper plating process, and the electroplated workpiece needs to be cleaned, so that the labor intensity of the workers is increased.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides polyimide film electrolytic copper plating equipment and a using method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a polyimide film electrolytic copper plating device comprises an electroplating bracket; the outer wall of the bottom end of the electroplating bracket is fixedly connected with an electric guide rail through a screw; the outer wall of the top end of the electric guide rail is connected with an electroplating box body and a cleaning box body in a sliding way; the inner wall of the top end of the electroplating bracket is fixedly connected with a panoramic camera through a screw; the inner wall of the top end of the electroplating bracket is respectively connected with an anode electric push rod and a cathode electric push rod through bolts; the outer wall of the bottom end of the output shaft of the anode electric push rod is fixedly connected with an insoluble anode rod through a screw; the outer wall of one side of the output shaft of the cathode electric push rod is fixedly connected with an electroplating workpiece through a screw; a control unit is arranged inside the electroplating bracket; the anode electric push rod, the panoramic camera and the cathode electric push rod are electrically connected with the internal control unit.
Preferably: the electroplating box body comprises an electroplating bath and an exchange tank; the inner wall of the top end of the electroplating bath is fixedly connected with a baume densimeter through a screw.
Preferably: the inner wall of one side of the electroplating bath is fixedly connected with a temperature sensor through a screw; the temperature sensor is electrically connected with the internal control unit.
Preferably: the outer wall of one side of the exchange tank is connected with a closed baffle through a hinge; the inner wall of one side of the exchange tank is fixedly connected with a dissolving tank and a liquid storage tank through screws respectively.
Preferably: an electroplating metal rod is placed on the inner wall of the bottom end of the dissolving tank; the outer wall of one side of the dissolving tank is connected with the outer wall of one side of the liquid storage tank through a pipeline; the outer wall of the other side of the dissolving box is connected with an electric valve through a pipeline; the outer wall of the top end of the electric valve is connected with the outer wall of the bottom end of the electroplating bath through a pipeline; the outer wall of the other side of the electric valve is connected with the outer wall of the other side of the liquid storage tank through a pipeline; the outer wall of the other side of the liquid storage tank is connected with a liquid pump through a pipeline; the outer wall of one side of the liquid pump is connected to the outer wall of the bottom end of the electroplating bath through a pipeline; the electric valve and the liquid pump are electrically connected with the internal control unit.
Preferably: the outer walls of two sides of the cleaning box body are fixedly connected with a water storage tank through screws; water outlets are processed on the inner walls of two sides of the cleaning box body; an arc-shaped bottom plate is processed on the inner wall of the bottom end of the cleaning box body.
Preferably: the cleaning box body comprises a cathode cleaning tank and an anode cleaning tank; the inner walls of one sides of the cathode cleaning tank and the anode cleaning tank are fixedly connected with annular sprinklers through screws.
Preferably: the inner walls of the two sides of the anode cleaning tank are provided with anode guide rails; an anode electric slide block is connected to the inner wall of one side of the anode guide rail in a sliding manner; the outer wall of one side of the anode electric sliding block is connected with a cleaning electric push rod through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod is fixedly connected with a cleaning bearing plate through a screw; a sponge cushion is fixedly connected to the outer wall of one side of the cleaning bearing plate; the anode electric sliding block and the cleaning electric push rod are electrically connected with the internal control unit.
Preferably: cathode guide rails are processed on the inner walls of the two sides of the cathode cleaning tank; the inner wall of one side of the cathode guide rail is connected with a cathode slide block in a sliding way; the outer wall of one side of the cathode electric slide block is connected with a cleaning electric push rod through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod is fixedly connected with a cleaning bearing plate through a screw; the outer wall of one side of the cleaning bearing plate is fixedly connected with uniformly distributed telescopic springs; the outer wall of one end of the extension spring is fixedly connected with waterproof abrasive paper; the outer wall of one side of the cleaning bearing plate is fixedly connected with transverse connecting rods which are uniformly distributed through screws; the transverse connecting rod is positioned at the central axis of the telescopic spring; the cathode electric slide block and the cleaning electric push rod are electrically connected with the internal control unit.
A use method of polyimide film electrolytic copper plating equipment specifically comprises the following steps:
s1: respectively installing an electroplating workpiece and an insoluble anode rod on a cathode electric push rod and an anode electric push rod;
s2: opening the closed baffle plate to fill electrolyte and the electroplated metal rod into the dissolving tank, and enabling the electrolyte to be filled into the electroplating tank;
s3: adjusting the temperature of the electrolyte in the electroplating bath to 40 ℃, and adjusting the ion concentration of the electrolyte by a baume densitometer;
s4: moving the electroplating box body to the lower part of the insoluble anode bar and the electroplating workpiece, and operating the anode electric push rod and the cathode electric push rod to carry out electrolytic copper plating;
s5: and lifting the insoluble anode bar and the electroplating workpiece after the electrolytic copper plating, moving the cleaning box to the lower part of the insoluble anode bar and the electroplating workpiece, and cleaning the insoluble anode bar and the electroplating workpiece.
The invention has the beneficial effects that:
1. through setting up the panoramic camera, the clearance box and electroplate the box, the panoramic camera can whole control electroplate and the clearance process, the staff in time adjustment of being convenient for, improve the device flexibility, electroplate the box, the clearance box moves on the electronic guide rail of electroplating the support, can make electroplating work piece and insoluble anode rod clean through electroplating the box after electroplating the completion, the clearance box and cathode push rod, the operation of positive pole electric push rod.
2. Through setting up positive pole electric putter, negative pole electric putter and insoluble anode rod, this device is through installing the work piece of electroplating on negative pole electric putter, insoluble anode rod is installed on insoluble anode rod, can be at any time with the plated item deep-going electroplating box and the inside clearance box for the device reaches the random open and use when electroplating and rinsing the work piece, close the effect of stopping promptly, adopt insoluble anode rod to make the electroplating process that can not influence the electroplating work piece at electroplating in-process positive pole mud simultaneously, improve the quality of electroplating.
3. Through arranging the temperature sensor, the baume densimeter, the electroplating bath, the dissolving tank and the liquid storage tank, a worker can open the closed baffle to add the electroplating metal rod and the electrolyte into the dissolving tank in the exchange tank, so that the electrolyte can be filled in the electroplating bath, at the moment, the worker can observe the temperature of the electrolyte through the temperature sensor, keep the temperature at about 40 ℃, and observe the concentration of the electrolyte through the baume densimeter, so that the ion concentration of the electrolyte in the electrolytic copper plating process is unchanged, the normal operation of electrolytic copper plating is ensured, during the work, because the insoluble anode rod is made of insoluble materials, the electroplating metal rod in the dissolving tank starts to dissolve, ions in the electrolyte obtain an electron generation coating to be adsorbed on an electroplating workpiece, anode mud cannot be generated in the electroplating bath, the anode mud is in the electroplating metal rod, and the uniform stability of copper plating in the electrolytic copper plating process is ensured, improve the quality of electrolytic copper plating, in time observe the ion concentration of electrolyte through the baume hydrometer, adjust the ion concentration of the inside electrolyte of plating bath through electric valve, drawing liquid pump, guarantee going on smoothly of electrolytic copper plating process, the baume hydrometer is more convenient than the operation of ion concentration monitor, and the reading is more swift and the precision is high.
4. Through setting up the foam-rubber cushion, wash the electric push rod, wash loading board and positive pole guide rail, the insoluble anode stick is inside the positive pole washing tank, wash the electric push rod operation, will wash foam-rubber cushion and insoluble anode stick contact on the loading board, because the foam-rubber cushion's of flexibility makes the foam-rubber cushion of both sides can surround the insoluble anode stick, positive pole electricity slider reciprocates this moment, washs the insoluble anode stick, prevent that adnexed electrolyte from influencing electroplating next time on the insoluble anode stick.
5. Through setting up water sand paper, clean electric push rod, clean loading board, expanding spring, transverse connecting rod and cathode guide rail, electroplating work piece after electroplating is located the clean inslot of negative pole, clean electric push rod operation makes clean loading board area expanding spring and electroplating work piece remove, make water sand paper and electroplating work piece contact mutually, because expanding spring's elasticity, make electroplating work piece can surround electroplating work piece, cathode slide block reciprocates realizes the cleanness of water sand paper to electroplating work piece, guarantee the quality of electroplating work piece after electroplating, transverse connecting rod is located expanding spring's axis department, can keep expanding spring's horizontal balance, prevent that expanding spring from sloping down under the effect of gravity, influence the clean effect to electroplating work piece.
Drawings
FIG. 1 is a schematic view of the subjective structure of an apparatus for electrolytic copper plating of polyimide film according to the present invention;
FIG. 2 is a schematic structural diagram of an electroplating box of the polyimide film electrolytic copper plating equipment provided by the invention;
FIG. 3 is a schematic cross-sectional view of an exchange tank of an apparatus for electrolytic copper plating of polyimide film according to the present invention;
FIG. 4 is a schematic view of the form of a cleaning box of the apparatus for electrolytic copper plating of polyimide film according to the present invention;
FIG. 5 is a schematic diagram of the top structure of an electroplating rack of the apparatus for electrolytic copper plating of polyimide film according to the present invention;
FIG. 6 is a schematic circuit flow diagram of an apparatus for electrolytic copper plating of polyimide film according to the present invention;
FIG. 7 is a flow chart of a method for using the apparatus for electrolytic copper plating of polyimide film according to the present invention.
In the figure: 1 electroplating bracket, 2 electroplating box, 3 cleaning box, 4 water outlet, 5 water storage tank, 6 electric guide rail, 7 closed baffle, 8 baume gravimeter, 9 temperature sensor, 10 electroplating bath, 11 exchange tank, 12 dissolving tank, 13 electroplating metal bar, 14 electric valve, 15 liquid pump, 16 liquid storage tank, 17 anode guide rail, 18 annular sprinkler, 19 anode electric slide block, 20 cleaning electric push rod, 21 sponge pad, 22 cleaning bearing plate, 23 arc bottom plate, 24 cleaning bearing plate, 25 expansion spring, 26 water sand paper, 27 transverse connecting rod, 28 cathode guide rail, 29 cathode electric slide block, 30 cleaning electric push rod, 31 cathode cleaning tank, 32 anode cleaning tank, 33 anode push rod, 34 panoramic camera, 35 insoluble anode bar, 36 electroplating workpiece, 37 cathode electric push rod.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
The first embodiment is as follows:
an electrolytic copper plating device for polyimide film, as shown in figure 1, figure 5 and figure 6, comprises an electroplating bracket 1; the outer wall of the bottom end of the electroplating bracket 1 is fixedly connected with an electric guide rail 6 through a screw; the outer wall of the top end of the electric guide rail 6 is connected with an electroplating box body 2 and a cleaning box body 3 in a sliding way; the inner wall of the top end of the electroplating bracket 1 is fixedly connected with a panoramic camera 34 through a screw; the inner wall of the top end of the electroplating bracket 1 is respectively connected with an anode electric push rod 33 and a cathode electric push rod 37 through bolts; the outer wall of the bottom end of the output shaft of the anode electric push rod 33 is fixedly connected with an insoluble anode bar 35 through a screw; the outer wall of one side of the output shaft of the cathode electric push rod 37 is fixedly connected with an electroplating workpiece 36 through a screw; a control unit is arranged inside the electroplating bracket 1; the anode electric push rod 33, the panoramic camera 34 and the cathode electric push rod 37 are electrically connected with the internal control unit; the device is characterized in that an electroplating workpiece 36 is arranged on a cathode electric push rod 37, an insoluble anode rod 35 is arranged on the insoluble anode rod 35, the electroplated part can be inserted into the electroplating box body 2 and the cleaning box body 3 at any time, so that the device can be used at any time when the workpiece is electroplated and cleaned, the effect of stopping immediately after closing, meanwhile, the anode mud does not influence the electroplating process of the electroplating workpiece 36 in the electroplating process by adopting the insoluble anode bar 35, the electroplating quality is improved, the panoramic camera 34 can monitor the electroplating and cleaning processes in the whole process, the adjustment by workers is convenient, the flexibility of the device is improved, the electroplating box body 2 and the cleaning box body 3 move on the electric guide rail 6 of the electroplating bracket 1, after the electroplating is finished, the electroplating workpiece 36 and the insoluble anode bar 35 can be cleaned through the operation of the electroplating box body 2, the cleaning box body 3, the cathode electric push rod 37 and the anode electric push rod 33.
In order to ensure the normal operation of the electrolytic copper plating process, as shown in fig. 1, fig. 2, fig. 3 and fig. 6, the plating tank body 2 comprises a plating tank 10 and an exchange tank 11; the inner wall of the top end of the electroplating bath 10 is fixedly connected with a baume densimeter 8 through a screw; the inner wall of one side of the electroplating bath 10 is fixedly connected with a temperature sensor 9 through a screw; the outer wall of one side of the exchange tank 11 is connected with a closed baffle 7 through a hinge; the inner wall of one side of the exchange tank 11 is fixedly connected with a dissolving tank 12 and a liquid storage tank 16 through screws respectively; the inner wall of the bottom end of the dissolving box 12 is provided with an electroplating metal bar 13; the outer wall of one side of the dissolving tank 12 is connected with the outer wall of one side of the liquid storage tank 16 through a pipeline; the outer wall of the other side of the dissolving tank 12 is connected with an electric valve 14 through a pipeline; the outer wall of the top end of the electric valve 14 is connected with the outer wall of the bottom end of the electroplating bath 10 through a pipeline; the outer wall of the other side of the electric valve 14 is connected with the outer wall of the other side of the liquid storage tank 16 through a pipeline; the outer wall of the other side of the liquid storage tank 16 is connected with a liquid pump 15 through a pipeline; the outer wall of one side of the liquid pump 15 is connected with the outer wall of the bottom end of the electroplating bath 10 through a pipeline; the temperature sensor 9, the electric valve 14 and the liquid pump 15 are electrically connected with the internal control unit; the staff can open the closed baffle 7 and add the metal rod 13 and the electrolyte into the dissolving tank 12 in the exchange tank 11, so that the electrolyte can be filled in the electroplating bath 10, at the moment, the staff observes the temperature of the electrolyte through the temperature sensor 9, keeps the temperature at about 40 ℃, observes the concentration of the electrolyte through the baume densimeter 8, ensures that the ion concentration of the electrolyte is unchanged in the electrolytic copper plating process, and ensures the normal operation of electrolytic copper plating, during the work, because the insoluble anode rod 35 is made of insoluble materials, the metal rod 13 in the dissolving tank 12 starts to dissolve, the ions in the electrolyte are adsorbed on the electroplating workpiece 36 by an electron generation coating, so that the anode mud cannot be generated in the electroplating bath 10, the anode mud is in the metal rod 13, thereby ensuring the uniform stability of copper plating in the electrolytic copper plating process, the quality of electrolytic copper plating is improved, the ion concentration of the electrolyte is timely observed through the baume densimeter 8, the ion concentration of the electrolyte in the electroplating bath 10 is adjusted through the electric valve 14 and the liquid pump 15, the smooth proceeding of the electrolytic copper plating process is guaranteed, the baume densimeter 8 is more convenient to operate compared with an ion concentration monitor, and the reading is more rapid and high in precision.
In order to ensure the cleaning effect on the insoluble anode bar 35 and the electroplating workpiece 36, as shown in fig. 1, 4 and 6, the outer walls of two sides of the cleaning box body 3 are fixedly connected with a water storage tank 5 through screws; water outlets 4 are processed on the inner walls of two sides of the cleaning box body 3; an arc bottom plate 23 is processed on the inner wall of the bottom end of the cleaning box body 3; the cleaning box body 3 comprises a cathode cleaning tank 31 and an anode cleaning tank 32; the inner walls of one sides of the cathode cleaning tank 31 and the anode cleaning tank 32 are fixedly connected with an annular sprinkler 18 through screws; the inner walls of the two sides of the anode cleaning tank 32 are provided with anode guide rails 17; an anode electric slide block 19 is connected on the inner wall of one side of the anode guide rail 17 in a sliding way; the outer wall of one side of the anode electric slide block 19 is connected with a cleaning electric push rod 20 through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod 20 is fixedly connected with a cleaning bearing plate 22 through a screw; the outer wall of one side of the cleaning bearing plate 22 is fixedly connected with a sponge cushion 21; cathode guide rails 28 are processed on the inner walls of the two sides of the cathode cleaning tank 31; the inner wall of one side of the cathode guide rail 28 is connected with a cathode electric slide block 29 in a sliding way; the outer wall of one side of the cathode electric slide block 29 is connected with a cleaning electric push rod 30 through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod 30 is fixedly connected with a cleaning bearing plate 24 through a screw; the outer wall of one side of the cleaning bearing plate 24 is fixedly connected with uniformly distributed telescopic springs 25; the outer wall of one end of the extension spring 25 is fixedly connected with waterproof abrasive paper 26; the outer wall of one side of the cleaning bearing plate 24 is fixedly connected with transverse connecting rods 27 which are uniformly distributed through screws; the transverse connecting rod 27 is positioned at the central axis of the telescopic spring 25; the anode electric slide block 19, the cleaning electric push rod 20, the cathode electric slide block 29 and the cleaning electric push rod 30 are electrically connected with the internal control unit; after the electroplating is finished, the insoluble anode bar 35 and the electroplating workpiece 36 need to be cleaned, the insoluble anode bar 35 is arranged inside the anode cleaning tank 32, the cleaning electric push rod 20 operates, the spongy cushion 21 on the cleaning bearing plate 22 is contacted with the insoluble anode bar 35, the spongy cushions 21 on two sides can surround the insoluble anode bar 35 due to the flexibility of the spongy cushion 21, the anode electric slide block 19 moves up and down at the moment, the insoluble anode bar 35 is cleaned, the next electroplating is prevented from being influenced by electrolyte attached on the insoluble anode bar 35, the electroplated workpiece 36 is arranged inside the cathode cleaning tank 31, the cleaning electric push rod 30 operates to enable the cleaning bearing plate 24 to drive the telescopic spring 25 and the electroplating workpiece 36 to move, so that the waterproof abrasive paper 26 and the electroplating workpiece 36 are contacted with each other, and the electroplating workpiece 36 can surround the electroplating workpiece 36 due to the elasticity of the telescopic spring 25, the cathode electrode slide block 29 moves up and down to clean the electroplating workpiece 36 by the waterproof abrasive paper 26, the quality of the electroplated electroplating workpiece 36 is guaranteed, the transverse connecting rod 27 is located at the central axis of the telescopic spring 25, the horizontal balance of the telescopic spring 25 can be kept, and the telescopic spring 25 is prevented from inclining downwards under the action of gravity to influence the cleaning effect on the electroplating workpiece 36.
The working principle is as follows: when the device is used, various power supplies of electric equipment are turned on, the electroplating workpiece 36 is arranged on the cathode push rod 37, the insoluble anode rod 35 is arranged on the insoluble anode rod 35, an electroplated part can be inserted into the electroplating box body 2 and the inside of the cleaning box body 3 at any time, so that the device can be used at any time when the workpiece is electroplated and cleaned, and the device can be stopped at any time when the workpiece is closed, meanwhile, the anode mud cannot influence the electroplating process of the electroplating workpiece 36 in the electroplating process by adopting the insoluble anode rod 35, the electroplating quality is improved, the panoramic camera 34 can monitor the electroplating and cleaning processes in the whole process, the device can be conveniently adjusted by workers in time, the flexibility of the device is improved, the electroplating box body 2 and the cleaning box body 3 can move on the electric guide rail 6 of the electroplating bracket 1, and after the electroplating is finished, the power supplies of the electric equipment can be electrically connected through the, The operation of the anode electric push rod 33 enables the electroplated workpiece 36 and the insoluble anode rod 35 to be cleaned, a worker can open the closed baffle 7 to add the electroplated metal rod 13 and the electrolyte into the dissolving tank 12 in the exchange tank 11, so that the electrolyte can be filled in the electroplating tank 10, at the moment, the worker can observe the temperature of the electrolyte through the temperature sensor 9, keep the temperature at about 40 ℃, and observe the concentration of the electrolyte through the baume densimeter 8, so as to ensure that the ion concentration of the electrolyte is unchanged in the electrolytic copper plating process and ensure the normal operation of electrolytic copper plating, during operation, because the insoluble anode rod 35 is made of insoluble materials, the electroplated metal rod 13 in the dissolving tank 12 starts to be dissolved, ions in the electrolyte are adsorbed on the electroplated workpiece 36 to form an electron-generated plating layer, so that no anode mud is generated in the electroplating tank 10, the anode mud is in the electroplated metal rod 13, thereby ensuring the uniform stability of copper plating in the electrolytic copper plating process, improving the quality of the electrolytic copper plating, observing the ion concentration of the electrolyte in time through the baume densimeter 8, adjusting the ion concentration of the electrolyte in the electroplating bath 10 through the electric valve 14 and the liquid drawing pump 15, ensuring the smooth proceeding of the electrolytic copper plating process, ensuring the more convenient operation of the baume densimeter 8 compared with an ion concentration monitor, faster reading and higher precision, cleaning the insoluble anode bar 35 and the electroplating workpiece 36 after the electroplating is finished, cleaning the insoluble anode bar 35 in the anode cleaning tank 32, operating the cleaning electric push rod 20, contacting the sponge pad 21 on the cleaning bearing plate 22 with the insoluble anode bar 35, and leading the sponge pad 21 at both sides to be capable of surrounding the insoluble anode bar 35 due to the flexibility of the sponge pad 21, moving the anode electric slide block 19 up and down and cleaning the insoluble anode bar 35, prevent that adnexed electrolyte from influencing electroplating next time on the insoluble anode rod 35, electroplating work piece 36 after the electroplating is located inside the clean groove 31 of negative pole, clean electric push rod 30 operation makes clean loading board 24 take expanding spring 25 and electroplating work piece 36 to remove, make waterproof abrasive paper 26 and electroplating work piece 36 contact each other, because expanding spring 25's elasticity, make electroplating work piece 36 can surround electroplating work piece 36, cathode electrode slider 29 reciprocates and realizes waterproof abrasive paper 26 to electroplating work piece 36's cleanness, guarantee the quality of electroplating work piece 36 after the electroplating, horizontal connecting rod 27 is located expanding spring 25's axis department, can keep expanding spring 25's horizontal balance, prevent that expanding spring 25 from the downward sloping under the effect of gravity, the influence is to electroplating work piece 36's clean effect.
Example two:
a method for using a polyimide film electrolytic copper plating device is shown in figure 7 and comprises the following steps:
s1: respectively installing an electroplating workpiece 36 and an insoluble anode rod 35 on a cathode electric push rod 37 and an anode electric push rod 33;
s2: opening the closed baffle 7, filling electrolyte and the electroplated metal rod 13 into the dissolving tank 12, and enabling the electrolyte to be filled into the electroplating tank 10;
s3: adjusting the temperature of the electrolyte in the electroplating bath 10 to 40 ℃, and adjusting the ion concentration of the electrolyte by a baume densitometer 8;
s4: moving the electroplating box body 2 to the lower part of the insoluble anode bar 35 and the electroplating workpiece 36, and operating the anode electric push rod 33 and the cathode electric push rod 37 to carry out electrolytic copper plating;
s5: the insoluble anode bar 35 and the electroplated workpiece 36 after the electrolytic copper plating are lifted, and then the cleaning box body 3 is moved to the lower part of the insoluble anode bar 35 and the electroplated workpiece 36, and the insoluble anode bar 35 and the electroplated workpiece 36 are cleaned.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A polyimide film electrolytic copper plating device comprises an electroplating bracket (1); the electroplating rack is characterized in that the outer wall of the bottom end of the electroplating rack (1) is fixedly connected with an electric guide rail (6) through a screw; the outer wall of the top end of the electric guide rail (6) is connected with an electroplating box body (2) and a cleaning box body (3) in a sliding way; the inner wall of the top end of the electroplating bracket (1) is fixedly connected with a panoramic camera (34) through a screw; the inner wall of the top end of the electroplating bracket (1) is respectively connected with an anode electric push rod (33) and a cathode electric push rod (37) through bolts; the outer wall of the bottom end of the output shaft of the anode electric push rod (33) is fixedly connected with an insoluble anode bar (35) through a screw; the outer wall of one side of the output shaft of the cathode electric push rod (37) is fixedly connected with an electroplating workpiece (36) through a screw; a control unit is arranged inside the electroplating bracket (1); the anode electric push rod (33), the panoramic camera (34) and the cathode electric push rod (37) are electrically connected with the internal control unit.
2. The polyimide film electrolytic copper plating apparatus according to claim 1, wherein the plating tank body (2) comprises a plating tank (10), an exchange tank (11); the inner wall of the top end of the electroplating bath (10) is fixedly connected with a baume densimeter (8) through a screw.
3. The polyimide film electrolytic copper plating equipment according to claim 2, wherein a temperature sensor (9) is fixedly connected to the inner wall of one side of the electroplating bath (10) through a screw; the temperature sensor (9) is electrically connected with the internal control unit.
4. The polyimide film electrolytic copper plating equipment according to the claim 3, characterized in that the outer wall of one side of the exchange tank (11) is connected with a closed baffle plate (7) through a hinge; the inner wall of one side of the exchange tank (11) is fixedly connected with a dissolving tank (12) and a liquid storage tank (16) through screws respectively.
5. The polyimide film electrolytic copper plating equipment according to claim 4, characterized in that the inner wall of the bottom end of the dissolving tank (12) is provided with a plated metal bar (13); the outer wall of one side of the dissolving tank (12) is connected with the outer wall of one side of the liquid storage tank (16) through a pipeline; the outer wall of the other side of the dissolving tank (12) is connected with an electric valve (14) through a pipeline; the outer wall of the top end of the electric valve (14) is connected with the outer wall of the bottom end of the electroplating bath (10) through a pipeline; the outer wall of the other side of the electric valve (14) is connected with the outer wall of the other side of the liquid storage tank (16) through a pipeline; the outer wall of the other side of the liquid storage tank (16) is connected with a liquid pump (15) through a pipeline; the outer wall of one side of the liquid pump (15) is connected with the outer wall of the bottom end of the electroplating bath (10) through a pipeline; the electric valve (14) and the liquid pump (15) are electrically connected with the internal control unit.
6. The polyimide film electrolytic copper plating equipment according to claim 5, wherein the outer walls of two sides of the cleaning box body (3) are fixedly connected with a water storage tank (5) through screws; water outlets (4) are processed on the inner walls of the two sides of the cleaning box body (3); an arc-shaped bottom plate (23) is processed on the inner wall of the bottom end of the cleaning box body (3).
7. The apparatus for electrolytic copper plating of polyimide film according to claim 6, wherein said cleaning tank (3) comprises a cathode cleaning tank (31), an anode cleaning tank (32); the inner walls of one sides of the cathode cleaning tank (31) and the anode cleaning tank (32) are fixedly connected with an annular sprinkler (18) through screws.
8. The apparatus for electrolytic copper plating of polyimide film according to claim 7, wherein the inner walls of both sides of the anode cleaning tank (32) are provided with anode guide rails (17); an anode electric sliding block (19) is connected to the inner wall of one side of the anode guide rail (17) in a sliding manner; the outer wall of one side of the anode electric sliding block (19) is connected with a cleaning electric push rod (20) through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod (20) is fixedly connected with a cleaning bearing plate (22) through a screw; a sponge cushion (21) is fixedly connected with the outer wall of one side of the cleaning bearing plate (22); the anode electric sliding block (19) and the cleaning electric push rod (20) are electrically connected with the internal control unit.
9. The apparatus for electrolytic copper plating of polyimide film according to claim 8, wherein the cathode cleaning tank (31) is provided with cathode guide rails (28) on the inner walls of both sides thereof; the inner wall of one side of the cathode guide rail (28) is connected with a cathode electric slide block (29) in a sliding way; the outer wall of one side of the cathode electric slide block (29) is connected with a cleaning electric push rod (30) through a bolt; the outer wall of one side of the output shaft of the cleaning electric push rod (30) is fixedly connected with a cleaning bearing plate (24) through a screw; the outer wall of one side of the cleaning bearing plate (24) is fixedly connected with uniformly distributed telescopic springs (25); the outer wall of one end of the extension spring (25) is fixedly connected with waterproof abrasive paper (26); the outer wall of one side of the cleaning bearing plate (24) is fixedly connected with transverse connecting rods (27) which are uniformly distributed through screws; the transverse connecting rod (27) is positioned at the central axis of the telescopic spring (25); the cathode electric slide block (29) and the cleaning electric push rod (30) are electrically connected with the internal control unit.
10. A method for using the polyimide film electrolytic copper plating equipment according to any one of claims 1 to 9, characterized by comprising the steps of:
s1: respectively installing an electroplating workpiece (36) and an insoluble anode rod (35) on a cathode electric push rod (37) and an anode electric push rod (33);
s2: opening the closed baffle (7) to fill electrolyte and the electroplated metal rod (13) into the dissolving tank (12), and enabling the electrolyte to be filled into the electroplating tank (10);
s3: adjusting the temperature of the electrolyte in the electroplating bath (10) to 40 ℃, and adjusting the ion concentration of the electrolyte by a baume densitometer (8);
s4: moving the electroplating box body (2) to the lower parts of an insoluble anode rod (35) and an electroplating workpiece (36), and operating an anode electric push rod (33) and a cathode electric push rod (37) to carry out electrolytic copper plating;
s5: the insoluble anode bar (35) and the electroplating workpiece (36) after the electrolytic copper plating are lifted, the cleaning box body (3) is moved to the lower part of the insoluble anode bar (35) and the electroplating workpiece (36), and the insoluble anode bar (35) and the electroplating workpiece (36) are cleaned.
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