CN112967957A - Eutectic device and transistor packaging eutectic system - Google Patents
Eutectic device and transistor packaging eutectic system Download PDFInfo
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- CN112967957A CN112967957A CN202110176456.3A CN202110176456A CN112967957A CN 112967957 A CN112967957 A CN 112967957A CN 202110176456 A CN202110176456 A CN 202110176456A CN 112967957 A CN112967957 A CN 112967957A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention provides an eutectic device and a transistor packaging eutectic system, wherein the eutectic device comprises a wafer suction structure, a product suction structure to be eutectic, a preheating structure, an eutectic heating platform and eutectic identification structures, the wafer suction structure is used for sucking a wafer, the product suction structure to be eutectic is used for sucking a product to be eutectic, the preheating structure is used for preheating the product to be eutectic, the eutectic heating platform is used for heating the wafer and the product to be eutectic, the eutectic identification structures are used for taking pictures in the eutectic process, the preheating structure, the eutectic heating platform and the eutectic identification structures are respectively two in number, the two preheating structures are respectively arranged corresponding to the two eutectic heating platforms, and the two eutectic identification structures are correspondingly arranged above the two eutectic heating platforms. This eutectic device can promote eutectic efficiency, and two structures of preheating the structure are the same, have greatly reduced the influence of preheating structure processing and assembly tolerance for two eutectic heating platform eutectic precision are unanimous basically with the eutectic effect.
Description
Technical Field
The invention belongs to the technical field of transistor packaging, and particularly relates to a eutectic device and a transistor packaging eutectic system.
Background
At present, a transistor-packaged TO-CAN eutectic system used in the optical communication industry adopts a heating platform, and two or four preheating rotary tubes are arranged in the same preheating system. Because the machining and assembling tolerance of each preheating rotary pipe is large, the difference between the eutectic precision and the eutectic welding effect between the preheating pipes is large, the difficulty of the subsequent working procedure operation is increased, and the product performance is influenced.
Four preheating tubes of the existing TO-CAN eutectic system are distributed on the same rotating system at intervals of 90 degrees and are assembled on the rotating system in a mode of sinking the preheating tubes and fixing side jackscrews. Suction material suction nozzle puts product into 1#The preheating rotating system rotates 90 degrees after the number tube, so that 2#The horn can be loaded with product by rotating in sequence until four pre-heat tubes are loaded with product, at this time 1#Feeding the product into a heating table for eutectic crystallization by a preheating pipe, retreating the eutectic to a product loading position, and carrying out eutectic crystallization on the product 1#Rotating the number tube to an upward position, sucking the eutectic finished product back to the carrying disc by the sucking material suction nozzle, and putting the non-eutectic product into the carrying disc 1#Number tube, this time 2#The preheating tube starts eutectic operation, and the same action is followed by rotation operation. But due to 1#、2#、3#、4#The four preheating tubes are arranged on the same rotating system, the mechanical positions of the motors are consistent, the machining and assembling tolerance is large, the lengths and verticality of the four preheating tubes after machining and assembling cannot be consistent, the differences of eutectic precision and welding effect are large due to the inconsistency of verticality, the difficulty in machine adjustment is large, and the differences of precision in the eutectic Y direction are large due to the inconsistency of lengths.
Disclosure of Invention
The embodiment of the invention aims to provide a eutectic device to solve the technical problem that in the prior art, the transistor eutectic precision and the welding effect are poor.
Another objective of the embodiments of the present invention is to provide a transistor eutectic package system, so as to solve the technical problem in the prior art that the transistor eutectic precision and the soldering effect are poor.
In order to achieve the purpose, the invention adopts the technical scheme that: the invention provides an eutectic device, which comprises a wafer suction structure, a to-be-eutectic product suction structure, a preheating structure, an eutectic heating platform and an eutectic identification structure, wherein the wafer suction structure is used for sucking a wafer, the eutectic product suction structure is used for sucking a to-be-eutectic product, the preheating structure is used for preheating the to-be-eutectic product, the eutectic heating platform is used for heating the wafer and the to-be-eutectic product, and the eutectic identification structure is used for taking a picture in an eutectic process;
the preheating structure the quantity of eutectic heating platform with the eutectic identification structure is two, two preheat the structure and correspond with two the setting of eutectic heating platform respectively, two the eutectic identification structure corresponds the setting in two the top of eutectic heating platform.
In one embodiment, the wafer suction structure and the to-be-eutectic product suction structure are vacuum suction nozzles.
In one embodiment, the wafer suction structure and the eutectic product suction structure are both vacuum suction nozzles.
In one embodiment, the wafer identification structure is a camera.
In one embodiment, the wafer suction structure comprises a first wafer suction nozzle, a second wafer suction nozzle, a first driving motor and a first transmission structure;
the first transmission structure comprises a first gear, a first rack and a second rack, the first gear is fixed on an output shaft of the first driving motor, the first rack and the second rack are arranged in parallel, the first gear is located between the first rack and the second rack, the first rack and the second rack are both meshed with the first gear, the first wafer suction nozzle is fixed on the first rack, and the second wafer suction nozzle is fixed on the second rack.
In one embodiment, the to-be-eutectic product suction structure comprises a first to-be-eutectic product suction nozzle, a second driving motor and a second transmission structure;
the second transmission structure comprises a second gear, a third rack and a fourth rack, the second gear is fixed on an output shaft of the second driving motor, the third rack and the fourth rack are arranged in parallel, the second gear is located between the third rack and the fourth rack, the third rack and the fourth rack are meshed with the second gear, a first suction nozzle of an eutectic product to be prepared is fixed on the third rack, and a second suction nozzle of the eutectic product to be prepared is fixed on the fourth rack.
In one embodiment, the eutectic device further comprises a first drive structure, a second drive structure, and a third drive structure;
the first driving structure is used for driving the to-be-eutectic product suction structure, so that the to-be-eutectic product is moved to the position above the preheating structure by the eutectic product suction structure;
the second driving structure is used for driving the preheating structure, so that the preheating structure transfers the product to be eutectic to the eutectic heating platform;
the third driving structure is used for driving the preheating structure, so that the preheating structure moves the product to be eutectic to the eutectic heating platform.
In one embodiment, the third driving structure comprises a rotary driving structure and a horizontal pushing structure, the rotary driving structure is used for driving the preheating structure to be close to the eutectic heating platform, and the horizontal pushing structure is used for driving the preheating structure to convey the product to be eutectic to the eutectic heating platform.
In one embodiment, the rotary driving structure is a rotary motor, and the horizontal pushing structure is an electric screw rod.
In one embodiment, a positioning column matched with a product to be eutectic is arranged on the eutectic heating platform, a clamp is further arranged on the eutectic heating platform, the clamp is an automatic clamp, and the clamp clamps the product to be eutectic after the product to be eutectic is matched with the positioning column.
In a second aspect, the invention provides a transistor package eutectic system, which includes the eutectic device.
The eutectic device comprises a wafer suction structure, a product to be eutectic, a preheating structure, an eutectic heating platform and an eutectic identification structure, wherein the wafer suction structure is used for sucking a wafer, the eutectic product suction structure is used for sucking the product to be eutectic, the preheating structure is used for preheating the product to be eutectic, the eutectic heating platform is used for heating the wafer and the product to be eutectic, and the eutectic identification structure is used for taking a picture in the eutectic process; preheating structure the eutectic heating platform with the quantity of eutectic identification structure is two, two preheat the structure respectively with two the setting is corresponded to the eutectic heating platform, two the eutectic identification structure corresponds and sets up in two the top of eutectic heating platform, this eutectic device adopts two sets of heating structures, when one of them eutectic heating platform eutectic, preheat the product of treating the eutectic with its preheating structure that corresponds, when another eutectic heating platform eutectic, preheat the product of treating the eutectic with its another preheating structure that corresponds, can promote eutectic efficiency like this, two structure of preheating the structure are the same, greatly reduced the influence of preheating structure processing and assembly tolerance for two eutectic heating platform eutectic precision are unanimous basically with the eutectic effect.
According to the transistor packaging eutectic system, two sets of heating structures are adopted, when one eutectic heating platform is eutectic, the preheating structure corresponding to the eutectic heating platform preheats a product to be eutectic, and when the other eutectic heating platform is eutectic, the preheating structure corresponding to the eutectic heating platform preheats the product to be eutectic, so that the eutectic efficiency can be improved, the structures of the two preheating structures are the same, the influence of machining and assembling tolerance of the preheating structures is greatly reduced, and the eutectic precision and the eutectic effect of the two eutectic heating platforms are basically consistent.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a preheating rotary pipe of a conventional TO-CAN eutectic system;
fig. 2 is a schematic structural diagram of an eutectic device according to an embodiment of the present invention;
fig. 3 is a schematic partial structure view of an eutectic heating platform of the eutectic device according to the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a finished eutectic device according to an embodiment of the present invention after eutectic is completed.
Wherein, in the figures, the respective reference numerals:
1-a wafer suction structure;
2-a to-be-eutectic product suction structure;
3-preheating structure;
4-eutectic heating platform;
5-eutectic identification structure;
6-a first wafer recognition camera;
7-a wafer front face recognition platform;
8-a second wafer recognition camera;
9-a third wafer recognition camera;
10-a first drive configuration;
11-a second drive configuration;
12-location columns.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The eutectic device and the eutectic system for transistor packaging provided by the present invention will be described in detail with reference to the following embodiments.
Fig. 2 is a schematic structural diagram of a transistor-type packaged eutectic system according to an embodiment of the present invention, and please refer to fig. 2, where the transistor-type packaged eutectic system according to the present invention includes a wafer suction structure 1, a structure 2 for sucking a product to be eutectic, a preheating structure 3, an eutectic heating platform 4, and an eutectic identification structure 5, where the wafer suction structure 1 is used for sucking a wafer, the structure 2 for sucking the product to be eutectic, the preheating structure 3 is used for preheating the product to be eutectic, the eutectic heating platform 4 is used for heating the wafer and the product to be eutectic, and the eutectic identification structure 5 is used for taking a picture during a eutectic process;
The wafer suction structure 1 of the present embodiment is used for sucking a wafer, and the specific form of the wafer suction structure 1 is not particularly limited in the present embodiment. In this embodiment, the first wafer recognition camera 6 is further configured to recognize an image and a position of a wafer, the first wafer recognition camera 6 is in signal connection with the wafer suction structure 1, and the wafer suction structure 1 realizes a suction action of the wafer according to the recognition signal of the first wafer recognition camera 6.
In this embodiment the quantity of preheating structure 3, eutectic heating platform 4 and eutectic identification structure 5 is two, and the eutectic device of this embodiment is because adopt two preheating structure 3, when 4 eutectics of first eutectic heating platform, first preheating structure 3 preheats the product of treating the eutectic, and when 4 eutectics of second eutectic heating platform, the second preheats structure 3 and preheats the product of treating the eutectic, and alternate work has promoted eutectic efficiency like this. The structure homoenergetic of two preheating structure 3 and two eutectic heating platform 4 is the same, reaches two eutectic heating platform 4 eutectic precisions and the eutectic effect unanimous basically, very big reduction preheating structure 3 processing and assembly tolerance's influence, can effectual reduction transfer time and the subsequent handling's the operation degree of difficulty to promote the eutectic product and can produce the property.
The transistor packaging eutectic system of this embodiment adopts two sets of heating structures, when one of them eutectic heating platform eutectic, preheat the product of treating the eutectic with its preheating structure that corresponds, when another eutectic heating platform eutectic, preheat the product of treating the eutectic with its another preheating structure that corresponds, can promote eutectic efficiency like this, two structures of preheating the structure are the same, greatly reduced the influence of preheating structure processing and assembly tolerance, make two eutectic heating platform eutectic precision unanimous basically with the eutectic effect.
Preferably, the wafer suction structure 1 and the to-be-eutectic product suction structure 2 are both vacuum suction nozzle structures, the vacuum suction nozzle structures mainly use vacuum suction to suck components, and the components sucked on the suction nozzles are placed on the coordinate positions of the patch components by blowing. Compared with other mechanical carrying modes, the vacuum suction nozzle can complete the whole conveying process on the premise of not damaging products or raw materials. The vacuum suction nozzle structure of the embodiment does not damage the wafer in the conveying process of the wafer and does not damage the product to be eutectic in the conveying process of the product to be eutectic.
The eutectic device of this embodiment still includes the wafer and rectifies the structure, and the wafer is rectified the structure and is included positive discernment platform 7 of wafer and the reverse side discernment platform of wafer, and positive discernment platform 7 of wafer top is provided with second wafer discernment camera 8, and the below of reverse side discernment platform of wafer is provided with third wafer discernment camera 9, positive discernment platform 7 of wafer is automatic rotary platform, and this positive discernment platform 7 of wafer can adjust the angle of wafer through automatic the commentaries on classics when the angle that second wafer discernment camera 8 discerned the wafer is unusual. The third wafer recognition camera 9 is used for recognizing the reverse side of the wafer, and the vacuum suction nozzle structure of the wafer suction structure 1 is a rotatable suction nozzle structure. In the embodiment, the third wafer recognition camera 9 is arranged to recognize the reverse side of the wafer, so that the angle of the wafer can be adjusted by rotating the vacuum suction nozzle when the angle of the wafer is recognized to be inclined, and the eutectic precision is improved.
Specifically, the wafer suction structure 1 comprises a first wafer suction nozzle, a second wafer suction nozzle, a first driving motor and a first transmission structure, wherein the first transmission structure comprises a first gear, a first rack and a second rack, the first gear is fixed on an output shaft of the first driving motor, the first rack and the second rack are arranged in parallel, the first gear is located between the first rack and the second rack, the first rack and the second rack are both meshed with the gear, the first wafer suction nozzle is fixed on the first rack, and the second wafer suction nozzle is fixed on the second rack. The first transmission structure of the embodiment enables the first wafer suction nozzle and the second wafer suction nozzle to move up and down through one driving motor.
Further, the to-be-eutectic product suction structure 2 comprises a first to-be-eutectic product suction nozzle, a second driving motor and a second transmission structure;
the second transmission structure comprises a second gear, a third rack and a fourth rack, the second gear is fixed on an output shaft of the second driving motor, the third rack and the fourth rack are arranged in parallel, the second gear is located between the third rack and the fourth rack, the third rack and the fourth rack are meshed with the second gear, a first suction nozzle of an eutectic product to be prepared is fixed on the third rack, and a second suction nozzle of the eutectic product to be prepared is fixed on the fourth rack. The second transmission structure of this embodiment makes the first product suction nozzle of waiting to eutectic and the second up-and-down motion of waiting to eutectic product suction nozzle realize through a driving motor.
Further, the eutectic device of the present embodiment further includes a first driving structure 10, a second driving structure 11 and a third driving structure; the first driving structure 10 is configured to drive the wafer suction structure 1 to move along a preset route, so that the wafer suction structure 1 moves the wafer to the eutectic heating platform 4; the second driving structure 11 is used for driving the to-be-eutectic product suction structure 2, so that the to-be-eutectic product suction structure 2 moves the to-be-eutectic product to the preheating structure 3 for preheating;
in this embodiment, the first driving structure 10 and the second driving structure 11 are both electric screw rod structures.
The third driving structure is used for driving the preheating structure 3, so that the preheating structure 3 moves the product to be eutectic to the eutectic heating platform 4.
Specifically, the third drive structure includes rotary drive structure and horizontal pushing structure, rotary drive structure is used for the drive preheat structure 3 and is close to eutectic heating platform 4, horizontal pushing structure is used for the drive preheat structure 3 will treat that the eutectic product sends to eutectic heating platform 4. In this embodiment, the rotation driving structure is a rotating motor, and the horizontal pushing structure is an electric screw rod.
Fig. 3 is a schematic partial structure view of an eutectic heating platform of the eutectic device according to an embodiment of the present invention, please refer to fig. 3, preferably, a positioning column 12 matched with a product to be eutectic is disposed on the eutectic heating platform 4, a clamp is further disposed on the eutectic heating platform 4, the clamp is an automatic clamp, and the clamp clamps the product to be eutectic after the product to be eutectic is matched with the positioning column 12. This embodiment is convenient for treat the location of eutectic product through setting up reference column 12, treats the anchor clamps of eutectic product through setting up the centre gripping, has guaranteed the position accuracy of eutectic in-process. Fig. 4 is a schematic view of a eutectic device according to an embodiment of the present invention, where a and B are both wafers.
A second aspect of the present embodiments provides a transistor package eutectic system including the eutectic device of the above embodiments.
For example, the eutectic device comprises a wafer suction structure, a product to be eutectic, a preheating structure, an eutectic heating platform and an eutectic identification structure, wherein the wafer suction structure is used for sucking a wafer, the eutectic product suction structure is used for sucking the product to be eutectic, the preheating structure is used for preheating the product to be eutectic, the eutectic heating platform is used for heating the wafer and the product to be eutectic, and the eutectic identification structure is used for taking a picture in the eutectic process;
the preheating structure the quantity of eutectic heating platform with the eutectic identification structure is two, two preheat the structure and correspond with two the setting of eutectic heating platform respectively, two the eutectic identification structure corresponds the setting in two the top of eutectic heating platform.
The transistor packaging eutectic system of this embodiment includes above-mentioned eutectic device, transistor packaging eutectic system adopts two sets of heating system, when one of them eutectic heating platform eutectic, preheat the product of treating the eutectic with its preheating structure that corresponds, when another eutectic heating platform eutectic, preheat the product of treating the eutectic with its another preheating structure that corresponds, can promote eutectic efficiency like this, two eutectic heating platforms and two structures of preheating are the same, the influence of preheating structure processing and assembly tolerance has greatly been reduced, make two eutectic heating platform eutectic precision and eutectic effect basic unanimous, the operation degree of difficulty of the time of shunting and subsequent handling can effectual reduction to a certain extent, the performance of transistor has been promoted.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An eutectic device, characterized in that:
the device comprises a wafer suction structure, a product to be eutectic, a preheating structure, an eutectic heating platform and an eutectic identification structure, wherein the wafer suction structure is used for sucking a wafer, the product to be eutectic is sucked by the suction structure, the preheating structure is used for preheating the product to be eutectic, the eutectic heating platform is used for heating the wafer and the product to be eutectic, and the eutectic identification structure is used for taking a picture in the eutectic process;
the preheating structure the quantity of eutectic heating platform with the eutectic identification structure is two, two preheat the structure and correspond with two the setting of eutectic heating platform respectively, two the eutectic identification structure corresponds the setting in two the top of eutectic heating platform.
2. The eutectic device of claim 1, wherein: the wafer suction structure and the suction structure of the product to be eutectic are vacuum suction nozzles.
3. The eutectic device of claim 1, wherein: the eutectic identification structure is a camera.
4. The eutectic device of claim 2, wherein: the wafer suction structure comprises a first wafer suction nozzle, a second wafer suction nozzle, a first driving motor and a first transmission structure;
the first transmission structure comprises a first gear, a first rack and a second rack, the first gear is fixed on an output shaft of the first driving motor, the first rack and the second rack are arranged in parallel, the first gear is located between the first rack and the second rack, the first rack and the second rack are both meshed with the first gear, the first wafer suction nozzle is fixed on the first rack, and the second wafer suction nozzle is fixed on the second rack.
5. The eutectic device of claim 4, wherein: the to-be-eutectic product suction structure comprises a first to-be-eutectic product suction nozzle, a second driving motor and a second transmission structure;
the second transmission structure comprises a second gear, a third rack and a fourth rack, the second gear is fixed on an output shaft of the second driving motor, the third rack and the fourth rack are arranged in parallel, the second gear is located between the third rack and the fourth rack, the third rack and the fourth rack are meshed with the second gear, a first suction nozzle of an eutectic product to be prepared is fixed on the third rack, and a second suction nozzle of the eutectic product to be prepared is fixed on the fourth rack.
6. The eutectic device of claim 5, wherein: the eutectic device further comprises a first driving structure, a second driving structure and a third driving structure;
the first driving structure is used for driving the to-be-eutectic product suction structure, so that the to-be-eutectic product is moved to the position above the preheating structure by the eutectic product suction structure;
the second driving structure is used for driving the preheating structure, so that the preheating structure moves the product to be eutectic to the eutectic heating platform;
the third driving structure is used for driving the preheating structure, so that the preheating structure moves the product to be eutectic to the eutectic heating platform.
7. The eutectic device of claim 6, wherein: the third drive structure comprises a rotary drive structure and a horizontal pushing structure, the rotary drive structure is used for driving the preheating structure to be close to the eutectic heating platform, and the horizontal pushing structure is used for driving the preheating structure to transfer the to-be-eutectic product to the eutectic heating platform.
8. The eutectic device of claim 7, wherein: the rotary driving structure is a rotary motor, and the horizontal pushing structure is an electric screw rod.
9. The eutectic device of any one of claims 1-8, wherein: the eutectic heating platform is provided with a positioning column matched with the eutectic product to be treated, the eutectic heating platform is further provided with a clamp, the clamp is an automatic clamp, and the clamp is used for clamping the eutectic product after the eutectic product is matched with the positioning column.
10. A transistor package eutectic system, characterized in that: the transistor package eutectic system includes the eutectic device of any one of claims 1-9.
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