CN112954899A - LED flexible lamp strip circuit board and preparation method thereof - Google Patents

LED flexible lamp strip circuit board and preparation method thereof Download PDF

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Publication number
CN112954899A
CN112954899A CN202110125688.6A CN202110125688A CN112954899A CN 112954899 A CN112954899 A CN 112954899A CN 202110125688 A CN202110125688 A CN 202110125688A CN 112954899 A CN112954899 A CN 112954899A
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CN
China
Prior art keywords
copper
circuit board
clad plate
lamp strip
flexible lamp
Prior art date
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Pending
Application number
CN202110125688.6A
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Chinese (zh)
Inventor
黄健
张强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinyu Mulinsen Circuit Board Co ltd
Original Assignee
Xinyu Mulinsen Circuit Board Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xinyu Mulinsen Circuit Board Co ltd filed Critical Xinyu Mulinsen Circuit Board Co ltd
Priority to CN202110125688.6A priority Critical patent/CN112954899A/en
Publication of CN112954899A publication Critical patent/CN112954899A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention discloses an LED flexible lamp strip circuit board and a preparation method thereof, belonging to the technical field of circuit board processing, wherein the circuit board is processed to be 1m in length, and the method further comprises the following steps: providing a sheet-shaped base material and a covering film, and respectively drilling holes on the base material and the covering film; carrying out copper deposition and copper plating on the drilled base material to obtain a copper-clad plate; and sequentially carrying out circuit manufacturing, developing etching, testing, surface mounting, pressing, solder mask and surface treatment on the copper-clad plate. The length of the circuit board prepared by the method is more than or equal to 1m, so that the welding times of subsequent finished product manufacturing are saved, the labor and material costs are saved, and the problem that the traditional circuit board with the thickness of 0.5m can be spliced for multiple times to form a required strip-shaped product is solved.

Description

LED flexible lamp strip circuit board and preparation method thereof
Technical Field
The invention relates to the technical field of circuit board processing, in particular to an LED flexible lamp strip circuit board and a manufacturing method thereof.
Background
The LED flexible lamp strip circuit board is used as a bearing substrate of an LED lamp strip product. The low-voltage lamp belt product is used as one variety of lamp belt products, is usually designed for a double-sided electroplating plate at present, and the length of a circuit board is 0.5 m; the length of a finished roll of low-voltage lamp strip is 5 meters (determined according to customer requirements), namely 10 circuit boards with the length of 0.50 meter are needed to be spliced for 9 times to meet the requirements. The existing design and manufacture length is improved to 1 meter, so that the requirement of a finished product of 5 meters can be met only by splicing 5 circuit boards for 4 times, the production efficiency is doubled, and the labor and material costs are reduced. Namely, the prior art has the following problems:
(1) the length of the product is 0.5 meter, the total length of a finished product roll is 5 meters, the splicing times are more, and the working efficiency is low;
(2) the splicing uses more materials, wastes materials and increases the cost;
(3) the splicing times are many, the used materials are many, the operation personnel are many, and the manpower waste is caused.
And traditional equipment drilling machine, the biggest can only bore 650mm length, and 1M long product drilling and cover membrane drilling need divide twice and bore, and this method firstly influences production efficiency, and secondly secondary drilling location concatenation has the deviation and covers the membrane bonding and have the step, and is incomplete, influences pleasing to the eye etc..
If large-size equipment is customized, the problems can be perfectly solved, and the investment is huge because a whole set of large-size equipment needs to be customized, so that technicians are forbidden to produce the equipment by adopting a traditional secondary drilling and splicing mode at present.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides an LED flexible lamp strip circuit board and a preparation method thereof.
The technical solution of the invention is as follows:
a method for preparing a circuit board of an LED flexible lamp strip,
the method comprises the following steps: providing a sheet-shaped base material and a covering film, and respectively drilling holes on the base material and the covering film; carrying out copper deposition and copper plating on the drilled base material to obtain a copper-clad plate; and sequentially carrying out circuit manufacturing, developing etching, testing, surface mounting, pressing, solder mask and surface treatment on the copper-clad plate.
Preferably, the specific process for manufacturing the circuit is as follows: and irradiating the copper-clad plate by using ultraviolet rays of an exposure machine to enable an optical film on the copper-clad plate to form a cross-linking polymerization reaction, so that the pattern on the film is copied onto the copper-clad plate.
Preferably, the specific process of developing and etching is as follows: through Na2CO3The chemical liquid images the unexposed and solidified copper surface of the copper-clad plate, the exposed copper layer is etched by the acid etching chemical liquid, and the exposed dry film layer on the circuit is removed to form a circuit pattern.
Preferably, the specific process of the test is as follows: and detecting the electrical conduction performance of the copper-clad plate with the circuit pattern through the test jig, and removing open/short circuit products.
Preferably, the specific process for attaching the covering film is as follows: attaching the drilled covering film to the copper-clad plate printed with the circuit pattern, and pre-positioning;
the specific process of the pressing is as follows: pressing the copper-clad plate with the attached covering film by utilizing the high-temperature pressurizing function of a quick press, so that the covering film is completely combined with the plate surface, and a solder mask is formed in a non-welding area of the copper-clad plate to protect the copper surface; the pressing temperature of the high-temperature pressurization is 180 ℃, and the pressurization pressure is 100-150kg/cm2(ii) a Pressurizing time: 100-.
Preferably, the specific process of solder mask is as follows: and providing pressure for an ink scraper, and enabling the ink to penetrate through micro gaps between the warps and wefts of the gauze which are not covered with the photosensitive adhesive to form a required oil covering area on the copper-clad plate so as to protect the copper surface below the ink.
Preferably, the specific process of the surface treatment is as follows: an organic anti-oxidation protective film is chemically grown on the clean bare copper surface of the copper-clad plate, so that the subsequent welding of electronic elements is facilitated;
and/or;
and forming, finished product detection and packaging are further included after the surface treatment.
The invention also discloses an LED flexible lamp strip circuit board which is manufactured by the manufacturing method and has the length more than or equal to 1 m.
The invention also discloses a circuit board product which is prepared by splicing n circuit boards according to claim 1 for n-1 times.
Preferably, the splicing adopts an electronic component welding process.
The invention has at least one of the following beneficial effects: the length of the circuit board prepared by the method is 1m, the welding times of subsequent finished product manufacturing are saved, the labor and material cost are saved, the problem that the traditional circuit board with the thickness of 0.5m can be spliced for multiple times to form a required strip-shaped product is solved, and meanwhile, the circuit board prepared by the method has excellent electrical performance and high yield.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
100-substrate, 200-back side pads, 300-back side traces, 400-front side traces, 500-front side pads, 600-front side text.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a preferred embodiment of the present invention:
a method for preparing a circuit board of an LED flexible lamp strip,
the method comprises the following steps: the roll-type base material or the covering film is cut into required sheet materials, so that the post-process operation is facilitated; the method comprises the steps of providing a sheet-shaped base material 100 and a covering film, drilling holes on the base material 100 and the covering film respectively, specifically drilling holes on a PCB or the covering film through a drill bit rotating at a high speed, and providing a connecting channel for circuits requiring interconnection between different layers; providing a positioning hole for a post-process flow; providing positioning and mounting holes for finished product mounting; and carrying out copper deposition and copper plating on the drilled base material 100 to obtain the copper-clad plate. Even if a layer of copper is plated on the hole wall and the plate surface, the corresponding quality requirements are met; the circuit manufacturing, developing and etching, testing, mounting, pressing, solder mask and surface treatment are sequentially performed on the copper-clad plate, that is, the front surface bonding pad 500 and the back surface bonding pad 200, the back surface circuit 300 and the front surface circuit 400 and the front surface characters 600 are respectively obtained, but the method is not limited thereto and can be reasonably set according to specific process requirements.
More specifically, the specific process for manufacturing the circuit is as follows: and irradiating the copper-clad plate by using ultraviolet rays of an exposure machine at the irradiation temperature of 18 ℃ for 15s to enable an optical film on the copper-clad plate to form a cross-linking polymerization reaction and enable the pattern on the film to be copied onto the copper-clad plate.
More specifically, the specific process of the development etching is as follows: through Na2CO3Developing the unexposed and solidified copper surface of the copper-clad plate by using a chemical solution, etching the exposed copper layer by using an acidic etching chemical solution, and removing the exposed dry film layer on the circuit to form a circuit pattern, wherein the acidic etching chemical solution is used for forming a circuit patternThe etching liquid medicine is mainly a mixed liquid medicine of hydrochloric acid, copper chloride and sodium hypochlorite.
More specifically, the specific process of the test is as follows: and detecting the electrical conduction performance of the copper-clad plate with the circuit pattern through the test jig, and removing open/short circuit products.
More specifically, the specific process for attaching the covering film comprises the following steps: attaching the drilled covering film to the copper-clad plate printed with the circuit pattern, and pre-positioning;
the specific process of the pressing is as follows: pressing the copper-clad plate with the attached covering film by utilizing the high-temperature pressurizing function of a quick press, so that the covering film is completely combined with the plate surface, and a solder mask is formed in a non-welding area of the copper-clad plate to protect the copper surface; specifically, the pressing temperature: 180 ℃; pressure of 100-2Preferably 140kg/cm2(ii) a Time: 100-.
More specifically, the specific process of solder mask is as follows: the ink scraper is pressurized, ink penetrates through tiny gaps between warps and wefts of the gauze which are not covered with the photosensitive glue, namely the ink needs to penetrate through gaps printed on a board by the gauze, the gaps are gaps on the gauze and commonly called meshes, the mesh number of the conventional screen printing plate is 120T, 100T and 90T, the larger the mesh is, the larger the oil amount is, and a needed oil covering area is formed on the copper-clad plate so as to protect the copper surface below the ink.
More specifically, the specific process of the surface treatment is as follows: an organic anti-oxidation protective film is chemically grown on the clean bare copper surface of the copper-clad plate, so that the subsequent welding of electronic elements is facilitated; specifically, the chemical method adopts imidazole and copper ions to form an organic metal complex to synthesize an oxidation resistant film, namely OSP for short.
And/or;
after the surface treatment, forming, finished product detection and packaging are also included; wherein the molding is specifically molding: the flexible plate is cut into strips, so that a client can conveniently divide the plate after punching; and (3) finished product detection and packaging: carrying out final appearance inspection before warehousing the product; packaging and delivering: and packaging and warehousing the boards subjected to the OK inspection according to MI requirements.
The invention also discloses an LED flexible lamp strip circuit board which is prepared by the preparation method, the length of the LED flexible lamp strip circuit board is more than or equal to 1m, the sizes of common LED circuit boards in the market are 0.5m and 1m, the longest length of the LED circuit board is not more than 1.5m, a client side of a conventional half-meter board needs to be welded for 10 times, the length of the client side is totally connected into 5 meters, one meter of the board can meet the length of 5 meters only by being welded for 4 times, the cost of the client side can be reduced, and the production efficiency of the client side can. .
The invention also discloses a circuit board product which is prepared by splicing n circuit boards according to claim 1 for n-1 times.
Preferably, the splicing adopts an electronic component welding process.
For example, when a customer needs to produce a lamp strip with the length of 5m, the product can be obtained by welding the circuit board with the length of 1m for 4 times.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
In the description of the embodiments of the present invention, it should be understood that "-" and "-" indicate the same range of two numerical values, and the range includes the endpoints. For example: "A-B" means a range of greater than or equal to A and less than or equal to B. "A to B" means a range of not less than A and not more than B.
In the description of the embodiments of the present invention, the term "and/or" herein is only one kind of association relationship describing an associated object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The above description is only a preferred embodiment of the present invention, and the technical solutions that achieve the objects of the present invention by basically the same means are all within the protection scope of the present invention.

Claims (10)

1. A method for preparing a circuit board of an LED flexible lamp strip is characterized in that,
the method comprises the following steps: providing a sheet-shaped base material and a covering film, and respectively drilling holes on the base material and the covering film; carrying out copper deposition and copper plating on the drilled base material to obtain a copper-clad plate; and sequentially carrying out circuit manufacturing, developing etching, testing, surface mounting, pressing, solder mask and surface treatment on the copper-clad plate.
2. The method for manufacturing the LED flexible lamp strip circuit board according to claim 1, wherein the specific process for manufacturing the circuit is as follows: and irradiating the copper-clad plate by using ultraviolet rays of an exposure machine to enable an optical film on the copper-clad plate to form a cross-linking polymerization reaction, so that the pattern on the film is copied onto the copper-clad plate.
3. The method for manufacturing the LED flexible lamp strip circuit board according to claim 2, wherein the specific developing and etching process comprises the following steps: through Na2CO3The chemical liquid images the unexposed and solidified copper surface of the copper-clad plate, the exposed copper layer is etched by the acid etching chemical liquid, and the exposed dry film layer on the circuit is removed to form a circuit pattern.
4. The method for manufacturing the LED flexible lamp strip circuit board according to claim 1, wherein the specific process of the test is as follows: and detecting the electrical conduction performance of the copper-clad plate with the circuit pattern through the test jig, and removing open/short circuit products.
5. The method for manufacturing the LED flexible lamp strip circuit board according to claim 1, wherein the specific process for pasting the covering film is as follows: attaching the drilled covering film to the copper-clad plate printed with the circuit pattern, and pre-positioning;
the specific process of the pressing is as follows: pressing the copper-clad plate with the covering film attached by utilizing the high-temperature pressurizing function of the quick press to completely combine the covering film and the copper-clad plate, so that a solder mask is formed in a non-welding area of the copper-clad plate to protect the copper surface; the pressing temperature of the high-temperature pressurization is 180 ℃, and the pressurization pressure is 100-150kg/cm2(ii) a Pressurizing time: 100-.
6. The method for manufacturing the LED flexible lamp strip circuit board according to claim 1, wherein the specific process of solder mask is as follows: and providing pressure for an ink scraper, and enabling the ink to penetrate through micro gaps between the warps and wefts of the gauze which are not covered with the photosensitive adhesive to form a required oil covering area on the copper-clad plate so as to protect the copper surface below the ink.
7. The method for preparing the LED flexible lamp strip circuit board according to claim 1, wherein the specific process of surface treatment is as follows: an organic anti-oxidation protective film is chemically grown on the clean bare copper surface of the copper-clad plate, so that the subsequent welding of electronic elements is facilitated;
and/or;
and forming, finished product detection and packaging are further included after the surface treatment.
8. An LED flexible lamp strip circuit board is characterized by being prepared by the preparation method of any one of claims 1-8, and the length of the LED flexible lamp strip circuit board is more than or equal to 1 m.
9. A circuit board product produced by splicing n pieces of the circuit board of claim 1 n-1 times.
10. A circuit board product according to claim 9, wherein said joining is performed by an electronic component soldering process.
CN202110125688.6A 2021-01-29 2021-01-29 LED flexible lamp strip circuit board and preparation method thereof Pending CN112954899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110125688.6A CN112954899A (en) 2021-01-29 2021-01-29 LED flexible lamp strip circuit board and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110125688.6A CN112954899A (en) 2021-01-29 2021-01-29 LED flexible lamp strip circuit board and preparation method thereof

Publications (1)

Publication Number Publication Date
CN112954899A true CN112954899A (en) 2021-06-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115087237A (en) * 2022-06-28 2022-09-20 欣强电子（清远）有限公司 method for manufacturing mini LED board and mini LED device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101572992A (en) * 2008-04-28 2009-11-04 王定锋 Continuous double-sided flexible printed circuit board and LED strip
CN106195695A (en) * 2016-07-01 2016-12-07 广东三泰迈高光电科技有限公司 A kind of production technology of flexible LED lamp bar

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101572992A (en) * 2008-04-28 2009-11-04 王定锋 Continuous double-sided flexible printed circuit board and LED strip
CN106195695A (en) * 2016-07-01 2016-12-07 广东三泰迈高光电科技有限公司 A kind of production technology of flexible LED lamp bar

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115087237A (en) * 2022-06-28 2022-09-20 欣强电子（清远）有限公司 method for manufacturing mini LED board and mini LED device

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Application publication date: 20210611