CN112952334A - Core board with multiple symmetrical coupling lines and coupler with core board - Google Patents

Core board with multiple symmetrical coupling lines and coupler with core board Download PDF

Info

Publication number
CN112952334A
CN112952334A CN202110105485.0A CN202110105485A CN112952334A CN 112952334 A CN112952334 A CN 112952334A CN 202110105485 A CN202110105485 A CN 202110105485A CN 112952334 A CN112952334 A CN 112952334A
Authority
CN
China
Prior art keywords
coupling
lines
coupler
line
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110105485.0A
Other languages
Chinese (zh)
Inventor
马长春
张广珊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Yongxie Technology Co ltd Shanghai Branch
Original Assignee
Hangzhou Yongxie Technology Co ltd Shanghai Branch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Yongxie Technology Co ltd Shanghai Branch filed Critical Hangzhou Yongxie Technology Co ltd Shanghai Branch
Priority to CN202110105485.0A priority Critical patent/CN112952334A/en
Publication of CN112952334A publication Critical patent/CN112952334A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • H01P5/16Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185Edge coupled lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • H01P5/16Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips

Abstract

The invention provides a core board with a plurality of sections of symmetrical coupling lines and a coupler comprising the core board, wherein the coupler comprises a top layer medium, the core board and a bottom layer medium, the core board comprises a medium layer and a copper-clad layer, the copper-clad layer is respectively arranged on the top surface and the bottom surface of the medium layer, a strip line is etched on the copper-clad layer and comprises a feeder line and a coupling line, the coupling line comprises a coupling center line and coupling side lines, and the coupling side lines are symmetrically connected to the two sides of the coupling center line in a staggered mode and are respectively connected with the adjacent feeder lines. The invention has the advantages and positive effects that: the design of multiple sections of the strip line is adopted, compared with the traditional microstrip line coupler, the microstrip line coupler has lower radiation loss and higher power capacity, and is more suitable for occasions with higher relative bandwidth.

Description

Core board with multiple symmetrical coupling lines and coupler with core board
Technical Field
The invention relates to the technical field of microwave communication, in particular to a core board with a plurality of sections of symmetrical coupling lines and a coupler with the core board.
Background
In a microwave system, one path of microwave power is often divided into several paths in proportion, which is a problem of power distribution. The components that perform this function are referred to as power distribution components. The coupler is commonly used for unequal power distribution and is a four-port device, and the common coupler is designed in a microstrip line mode, so that the power capacity is low and the overall loss is large; the single-section design enables the relative bandwidth of the coupler to be narrow; the coplanar coupling design makes the implementation difficult under the condition of strong coupling; or under the condition of weak coupling, the whole size is larger, and the aim of miniaturization cannot be achieved.
With the rapid development of 5G technology, higher requirements are also placed on the design and use conditions of the coupler, including miniaturization, high frequency, ultra-wideband, low loss and the like, however, the conventional coupler is often difficult to meet the use requirements in terms of writing, and has great limitations.
Disclosure of Invention
The invention aims to solve the problem of providing a core plate with a plurality of sections of symmetrical coupling lines and a coupler comprising the core plate.
The technical scheme of the invention for achieving the purpose is that the core board with the multiple sections of symmetrical coupling lines comprises a dielectric layer and a copper-clad layer, wherein the copper-clad layer is respectively arranged on the top surface and the bottom surface of the dielectric layer, strip lines are etched on the copper-clad layer and comprise feeder lines and coupling lines, the feeder lines are 2 sections, each coupling line comprises a coupling center line and a coupling sideline, the coupling center line is 1 section, the number of the coupling sidelines is even and is at least 2 sections, and the coupling sidelines are symmetrically connected to two sides of the coupling center line in a staggered mode and are respectively connected with adjacent feeder lines.
The 2 sections of feeder lines are all L-shaped, the coupling lines are arranged between the 2 sections of feeder lines, and the coupling side lines and the feeder lines are symmetrically connected in a staggered mode.
The sizes of the coupling sidelines are all equal, and the length and the width of the coupling sidelines are a respectively1=3.29mm、b10.45mm, the length and width of the coupling midline are respectively a2=2.85mm、b2=0.39mm。
And the coupling side lines on the top surface and the bottom surface copper-clad layer of the dielectric layer are arranged in an offset manner.
And the offset WO between the coupling edge lines on the copper-clad layers on the top surface and the bottom surface of the dielectric layer is 0.8 mm.
And the coupling center lines on the top surface and the bottom surface copper-clad layer of the dielectric layer are arranged in a non-offset manner.
The feeder is made of copper foil.
A coupler with a multi-section symmetrical coupling line core board comprises a top layer medium, a core board and a bottom layer medium, wherein copper-clad layers are covered on the top surface of the top layer medium and the bottom surface of the bottom layer medium.
The core board comprises a core board and is characterized in that 2 sections of feeder lines on a copper-clad layer on the top of the core board are respectively used as an input end and a through end of a coupler, and the feeder line close to the input end in the 2 sections of feeder lines on the copper-clad layer on the bottom of the core board is used as a coupling end of the coupler and the feeder line close to the through end is used as an isolation end of the coupler.
The top medium, the bottom medium and the medium layer in the core plate are made of the same material.
The invention has the advantages and positive effects that: adopt the stripline design, for traditional microstrip line coupler, have lower radiation loss and higher power capacity to adopt the multisection design, for traditional single section design, more be applicable to the higher occasion of relative bandwidth, simultaneously, adopt the design of offset coupling line, for with the design of plane coupling line, obtain the coupler of strong coupling degree more easily, realize miniaturized structural design more easily.
Drawings
FIG. 1 is a schematic top view of a stripline structure on a core dielectric layer;
FIG. 2 is a schematic cross-sectional view of a core plate with multiple symmetrical segments of coupled wires;
FIG. 3 is a schematic cross-sectional view of a coupler;
FIG. 4 is a graph of insertion loss simulation effect;
FIG. 5 is a graph of the effect of coupling simulation;
FIG. 6 is a graph of isolation simulation effects;
fig. 7 is a graph showing the effect of return loss simulation.
In the figure: 1. a dielectric layer; 2. coating a copper layer; 3. a strip line; 4. a feeder line; 5. a coupling line; 6. a coupling neutral line; 7. a coupling edge line; 8. a top layer medium; 9. a core board; 10. an underlying medium.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. As shown in fig. 1 and 2, a core board with multiple symmetrical coupling lines includes a dielectric layer 1 and a copper-clad layer 2, the copper-clad layer 2 is respectively disposed on the top surface and the bottom surface of the dielectric layer 1, a strip line 3 is etched on the copper-clad layer 2, the strip line 3 includes a feeder line 4 and a coupling line 5, the feeder line 4 has 2 sections, the coupling line 5 includes a coupling center line 6 and a coupling side line 7, the coupling center line 6 is 1 section, the number of the coupling side line 7 is an even number and is at least 2 sections, the coupling side line 7 is symmetrically connected to two sides of the coupling center line 6 in a staggered manner and respectively connected to adjacent feeder lines 4, the 2 sections of feeder lines 4 are all L-shaped, the coupling line 5 is disposed between the 2 sections of feeder lines 4, and the coupling side line 7 is symmetrically connected to the feeder lines 4 in a staggered manner.
The core board comprises a dielectric layer 1 and a copper-clad layer 2, the copper-clad layer 2 covers the top surface and the bottom surface of the dielectric layer 1, the copper-clad layer 2 is a layer of copper foil, a strip line 3 is etched on the copper-clad layer 2, the copper foil except the strip line 3 is completely etched, as shown in figure 2, the etching mode is that the copper foil of the inclined section line part in the figure is etched, the copper foil of the dotted section line part is reserved as the strip line 3, in the technical scheme recorded in the application, the strip line 3 comprises a feeder line 4 and a coupling line 5, the coupling line 5 comprises a 1-section coupling center line 6 and a plurality of sections of coupling center lines 7, the number of the sections of the coupling center lines 7 is even and at least 2 sections, meanwhile, the coupling center lines 7 are respectively arranged at two sides of the coupling center line 6 and are symmetrically staggered and connected with the coupling center line 6, and the design of the strip line 3 is relative to a micro-, the coupling line 5 is divided into a coupling neutral line 6 and a coupling side line 7 which is symmetrically arranged in a staggered mode, and the single-section design is more suitable for occasions with relatively high bandwidth.
The sizes of the coupling sidelines 7 are all equal, and the length and the width of the coupling sidelines 7 are a respectively1=3.29mm、b10.45mm, the length and width of the coupling neutral line 6 are a2=2.85mm、b2The thickness of the coupling side line 7 on the top surface and the bottom surface of the dielectric layer 1 coated with the copper layer 2 is 0.39mm, the coupling side line is arranged in an offset mode, and the top surface and the bottom surface of the dielectric layer 1 coated with the copper layer are arranged in a copper modeThe offset WO between the upper coupling edge lines 7 of the dielectric layer 1 is 0.8mm, the upper coupling center lines 6 of the copper-clad layer 2 on the top surface and the bottom surface of the dielectric layer are arranged in a non-offset mode, and the feeder line 4 is made of copper foil.
In the technical solution described in the present application, the coupling sidelines 7 are all equal in size, and the length and width of the coupling sidelines 7 are a1=3.29mm、b10.45mm, the length and width of the coupling neutral line 6 are a2=2.85mm、b20.39mm, simultaneously, be the offset setting and its offset WO is 0.8mm between coupling sideline 7 on dielectric layer 1 top surface and the bottom surface copper-clad layer 2, and be the non-offset setting between coupling central line 6 on dielectric layer 1 top surface and the bottom surface copper-clad layer 2, feeder 4 also adopts the same copper foil material with coupling line 5 simultaneously, and structural design can reduce the volume of coupler under the prerequisite of guaranteeing the degree of coupling like this, more can realize the miniaturization of coupler, has improved the adaptability of coupler.
As shown in fig. 3, a coupler with a multi-section symmetrical coupling line core board comprises a top layer medium 8, a core board 9 and a bottom layer medium 10, wherein copper-clad layers 2 are covered on the top surface of the top layer medium 8 and the bottom surface of the bottom layer medium 10, 2 sections of feeder lines 4 on the copper-clad layer 2 at the top of the core board 9 are respectively used as an input end and a through end of the coupler, the feeder line 4 close to the input end in the 2 sections of feeder lines 4 on the copper-clad layer 2 at the bottom of the core board 9 is used as a coupling end of the coupler and the feeder line 4 close to the through end is used as an isolation end of the coupler, and the top layer medium 8 and the bottom layer medium 10 are the.
The coupler comprises the core board 9 with the multiple symmetrical coupling lines, a top medium 8 and a bottom medium 10 are respectively arranged on the top surface and the bottom surface of the core board 9, the top medium 8 and the bottom medium 10 are made of the same material as the medium layer 1 in the core board, copper-clad layers 2, namely copper foils, are covered on the top surface of the corresponding top medium 8 and the bottom surface of the bottom medium 10, the top medium 8, the core board 9 and the bottom medium 10 are combined together through pressing or pp glue adopting the corresponding medium, after the pressing or the combination, 2 sections of feeder lines 4 on the copper-clad layers 2 at the top of the core board 9 are respectively used as an input end and a straight-through end of the coupler, and the feeder line 4 close to the input end in 2 sections of feeder lines 4 on the copper-clad layers 2 at the bottom of the core board 9 is used as a coupling end of the coupler and.
Below with frequency f1=10GHz,f2Taking a coupler with 30GHz and coupling degree of C-10 dB as an example, a simulation optimization experiment is performed on a simulation model of the coupler formed by adopting the technical scheme of the invention to obtain a corresponding simulation result, and compared with the performance of the existing coupler, the following steps are the process and the result of the experiment:
first of all according to the frequency f of the desired coupler1、f2And coupling degree, referring to a normalized even-mode impedance numerical table of the directional coupler of the snow-ratio-Lev coupled transmission line, determining the section number of the coupled line 4 and the normalized impedance value Z of the even mode, wherein the frequency f is used for determining the normalized impedance value Z of the even mode1、f2The corresponding bandwidth B ═ f can be calculated2/f1And the relative bandwidth W ═ f2-f1)/f0Wherein f is0=(f1+f2) And 2, finally comparing values in the table of values of the bandwidth B, the relative bandwidth W and the normalized even-mode impedance of the directional coupler of the stub coupling transmission line, and selecting the data in the closest group of tables.
In this step, the parameter of the coupler is the frequency f1=10GHz,f2At 30GHz, in frequency band [ f1,f2]If the degree of internal coupling C is-10 dB, the band B may be calculated to be 3, and the relative bandwidth W may be calculated to be 1, and then the normalized impedance value Z of the even mode may be obtained by referring to the normalized even mode impedance value table of the sbev coupling transmission line directional coupler, as shown in table 1:
Figure BDA0002917543310000061
TABLE 1 normalized impedance value table for even mode
Wherein n is the number of the coupled lines 5, the invention adopts symmetrical arrangement, the number of the coupled lines 5 is set to be odd and at least 3, and the type of the coupler is larger as the number of the coupled lines increases, therefore, in the experiment, n is selected to be 3,
Figure BDA0002917543310000062
is decibel ripple and represents the flatness of loss, and the normalized impedance value of the even mode in the 3-section coupling line 5 is Z1、Z2And Z3Z is a symmetrical design, so1=Z3
Followed by a normalized impedance Z of the even mode1、Z2And Z3The normalized impedance of the odd mode can be calculated, and in this experiment, the feed line is set to 50 Ω, so the normalized impedance of the odd mode is 1/the normalized impedance of the even mode, and meanwhile, the normalized impedance of the even mode is × 50 Ω, and the normalized impedance of the odd mode is × 50 Ω.
According to the even mode impedance and the odd mode impedance, high-frequency electromagnetic simulation software is used, an HFSS simulation modeling mode is adopted in the experiment, and corresponding simulation results are obtained, namely the insertion loss, the coupling degree, the isolation degree and the return loss, and the corresponding results are shown in the attached figures 4, 5, 6 and 7:
fig. 4 is a graph showing an insertion loss simulation result of a coupler simulation model formed by using the technical scheme of the present invention, from which it can be seen that the insertion loss is 0.77dB at 30GHz, and the insertion loss of the conventional coupler of this type is over 2.2dB, the insertion loss is the loss caused by heat generation and absorption inside the coupler, and the smaller the insertion loss is, the better the insertion loss is, so experimental data show that the coupler formed by using the technical scheme of the present invention has smaller internal loss and better coupling effect;
FIG. 5 is a diagram of a simulation result of coupling degree of a simulation model of a coupler formed by using the technical solution of the present invention, from which it can be seen that at 30GHz, the coupling degree is-10 dB and the flatness is + -0.4 dB, whereas the flatness of the conventional coupler of this type is basically + -0.5 dB, and the smaller the flatness is, the more stable the coupling effect of the coupler is, so that the coupler formed by using the technical solution of the present invention reduces the flatness and obtains a coupler with a more stable coupling effect;
fig. 6 and 7 are graphs of simulation results of isolation and return loss of a coupler simulation model formed by using the technical solution of the present invention, respectively, and it can be seen from the graphs that the isolation is-19 dB, the return loss of four ports is at most-22.6 dB, the isolation of the existing-10 dB coupler is at-15 dB, the return loss is-15 dB, and the co-frequency interference between a signal sent out by a coupler system with higher isolation and a signal fed back is smaller, because the coupler coupling line 5 formed by using the technical solution of the present invention is offset-set with WO 0.8mm plus dislocation-set, the coupler coupling line has higher isolation, and the co-frequency interference is smaller; the return loss is affected by the quality of the surface treatment of the coupling line 5 in the coupler, and the coupler formed by adopting the technical scheme of the invention has higher return loss and better effect in practical use because the coupling line 5 is symmetrically arranged and the coupling sidelines 7 at two sides and the coupling center line 6 can form a complementary balanced state.
Therefore, various performances of the coupler formed by the technical scheme of the invention are improved compared with the existing coupler, so that the coupler formed by the technical scheme of the invention has better performance in the couplers with the same specification, and correspondingly, on the premise of meeting the same coupling effect, the coupler formed by the technical scheme of the invention does not need to increase the number of sections of the coupling edge line, so that the coupler is smaller in size and can meet the requirement of miniaturization.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims (10)

1. The utility model provides a core board with multisection symmetry type coupling line, includes dielectric layer (1) and covers copper layer (2), cover the copper layer and set up respectively on the top surface and the bottom surface of dielectric layer (1), it has stripline (3) to cover to etch on copper layer (2), stripline (3) include feeder (4) and coupling line (5), its characterized in that: the feeder line (4) has 2 sections, the coupling line (5) comprises a coupling center line (6) and coupling side lines (7), the coupling center line (6) is 1 section, the number of the coupling side lines (7) is even and is at least 2 sections, and the coupling side lines (7) are symmetrically connected to two sides of the coupling center line (6) in a staggered mode and are respectively connected with the adjacent feeder line (4).
2. The core board with multiple symmetrical coupling lines of claim 1, wherein: the feeder lines (4) in the 2 sections are all L-shaped, the coupling lines (5) are arranged between the feeder lines (4) in the 2 sections, and the coupling side lines (7) are symmetrically connected with the feeder lines (4) in a staggered mode.
3. The core board with multiple symmetrical coupling lines of claim 1, wherein: the sizes of the coupling side lines (7) are all equal, and the length and the width of the coupling side lines (7) are a1=3.29mm、b10.45mm, the length and width of the coupling midline (6) are respectively a2=2.85mm、b2=0.39mm。
4. The core board with multiple symmetrical coupling lines of claim 1, wherein: the upper coupling edge lines (7) of the copper-coated layers (2) on the top surface and the bottom surface of the dielectric layer (1) are arranged in an offset mode.
5. The core board with multiple symmetrical coupling lines of claim 4, wherein: and the offset WO between the coupling edge lines (7) on the top surface and the bottom surface copper-coated layer (2) of the dielectric layer (1) is 0.8 mm.
6. The core board with multiple symmetrical coupling lines of claim 1, wherein: the coupling center lines (6) on the copper-clad layers (2) on the top surface and the bottom surface of the dielectric layer (1) are arranged in a non-offset mode.
7. The core board with multiple symmetrical coupling lines of claim 1, wherein: the feeder (4) is made of copper foil.
8. The utility model provides a coupler with multisection symmetry type coupling core board which characterized in that: the copper-clad plate comprises a top layer medium (8), a core plate (9) and a bottom layer medium (10), wherein the top surface of the top layer medium (8) and the bottom surface of the bottom layer medium (10) are covered with copper-clad layers (2).
9. The coupler of claim 8, wherein said coupler has a plurality of symmetrically coupled core plates, and wherein: the feed line (4) close to the input end in the 2 sections of feed lines (4) on the copper-clad layer (2) at the bottom of the core plate (9) is used as the coupling end of the coupler, and the feed line (4) close to the through end in the 2 sections of feed lines (4) on the copper-clad layer (2) at the bottom of the core plate (9) is used as the isolation end of the coupler.
10. The coupler of claim 8, wherein said coupler has a plurality of symmetrically coupled core plates, and wherein: the top layer medium (8) and the bottom layer medium (10) are made of the same material as the medium layer (1) in the core plate (9).
CN202110105485.0A 2021-01-26 2021-01-26 Core board with multiple symmetrical coupling lines and coupler with core board Pending CN112952334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110105485.0A CN112952334A (en) 2021-01-26 2021-01-26 Core board with multiple symmetrical coupling lines and coupler with core board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110105485.0A CN112952334A (en) 2021-01-26 2021-01-26 Core board with multiple symmetrical coupling lines and coupler with core board

Publications (1)

Publication Number Publication Date
CN112952334A true CN112952334A (en) 2021-06-11

Family

ID=76237206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110105485.0A Pending CN112952334A (en) 2021-01-26 2021-01-26 Core board with multiple symmetrical coupling lines and coupler with core board

Country Status (1)

Country Link
CN (1) CN112952334A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114050390A (en) * 2021-10-08 2022-02-15 杭州永谐科技有限公司 Design method of power divider and harmonic elimination type power divider

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208220B1 (en) * 1999-06-11 2001-03-27 Merrimac Industries, Inc. Multilayer microwave couplers using vertically-connected transmission line structures
CN101394017A (en) * 2008-09-08 2009-03-25 合肥仪威贸易有限公司 Strip line directional coupler
CN201829601U (en) * 2010-10-22 2011-05-11 合肥威科电子技术有限公司 Novel 90-degree wideband electrical bridge
CN108010544A (en) * 2016-11-01 2018-05-08 三星电子株式会社 Signalling channel and the memory module for including it

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208220B1 (en) * 1999-06-11 2001-03-27 Merrimac Industries, Inc. Multilayer microwave couplers using vertically-connected transmission line structures
CN101394017A (en) * 2008-09-08 2009-03-25 合肥仪威贸易有限公司 Strip line directional coupler
CN201829601U (en) * 2010-10-22 2011-05-11 合肥威科电子技术有限公司 Novel 90-degree wideband electrical bridge
CN108010544A (en) * 2016-11-01 2018-05-08 三星电子株式会社 Signalling channel and the memory module for including it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114050390A (en) * 2021-10-08 2022-02-15 杭州永谐科技有限公司 Design method of power divider and harmonic elimination type power divider

Similar Documents

Publication Publication Date Title
CN110474137B (en) Multilayer three-way power division filter based on SIW
US20030011442A1 (en) Microstrip directional coupler loaded by a pair of inductive stubs
WO2004062026A1 (en) Reduced size microwave directional coupler
CN109301416B (en) Suspended substrate integrated waveguide transmission line
WO2005112186A1 (en) Directional coupler
JP7468937B2 (en) Fourth-order Ka-band bandpass filter based on printed ridge gap waveguides
CN107230817A (en) The wide wall micropore couplers of the dB of half module substrate integrated wave guide 3
US9564868B2 (en) Balun
CN107257002A (en) The wide wall micropore couplers of the dB of substrate integration wave-guide 3
CN108123196B (en) Broadband filtering integrated stereo balun based on vertical double-sided parallel strip lines
CN112952334A (en) Core board with multiple symmetrical coupling lines and coupler with core board
CN109672012B (en) Broadband RWG and SIW differential transition structure applied to millimeter wave frequency band
JP2002252508A (en) Multilayered chip directional coupler
CN110611144B (en) Miniaturized broadband forward wave directional coupler unit circuit
WO2024007717A1 (en) Strong coupling striplines and microwave element comprising same
CN112838840A (en) Broadband equal-power distribution/synthesis circuit topology with broadband deep isolation
CN217522203U (en) Microwave equipment and multilayer stacking coupler thereof
CN109818124B (en) Rectangular waveguide-microstrip power divider and rectangular waveguide matched load
CN109755711A (en) The double-deck half module substrate integrated wave guide wideband filtered coupler
CN2796130Y (en) Low resistance-high resistance short microstrip line substrte integrated cavity filter
CN110416674B (en) Single-cavity double-frequency-band microwave filter based on coplanar waveguide
CN209747695U (en) multilayer broadside coupling structure broadband filter with notch characteristic
CN210296585U (en) Single-cavity dual-band microwave filter based on coplanar waveguide
CN111613856B (en) Double-passband balance filter adopting double-layer circular patch
CN110492213B (en) Millimeter wave microstrip power distribution or synthesis device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210611

RJ01 Rejection of invention patent application after publication