CN112951818B - Power conversion device - Google Patents
Power conversion device Download PDFInfo
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- CN112951818B CN112951818B CN202011389383.8A CN202011389383A CN112951818B CN 112951818 B CN112951818 B CN 112951818B CN 202011389383 A CN202011389383 A CN 202011389383A CN 112951818 B CN112951818 B CN 112951818B
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- control circuit
- power semiconductor
- circuit board
- semiconductor element
- power conversion
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 73
- 239000004065 semiconductor Substances 0.000 claims abstract description 82
- 239000003990 capacitor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- 239000004570 mortar (masonry) Substances 0.000 description 3
- 239000000446 fuel Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
The invention provides a power conversion device capable of improving vibration resistance. The power conversion device includes a holding plate (613) and a guide member (53), the holding plate (613) is fixed to the support case (6), elastic holding pieces (616, 617) are provided between the holding plate and the surface (501) of the control circuit board (5), the guide member (53) is disposed in the space, the relay terminals (320) extending from the power semiconductor elements (31, 32) are guided to through holes (51) provided in the control circuit board (5), and the guide member (53) is mounted on the surface (501) of the control circuit board (5) by the holding pieces (616, 617) and pressed.
Description
Technical Field
The present application relates to power conversion devices.
Background
In recent years, in order to improve environmental performance such as fuel efficiency, automobiles have been rapidly put into use in addition to conventional internal combustion engines, such as electric automobiles, hybrid automobiles, and fuel cell automobiles, and development of automobiles using electric power and market input have been rapidly advanced. Such an automobile is equipped with an ac motor, and a power conversion device for converting dc power into ac power is mounted in order to supply dc power from a battery to the ac motor.
The power conversion device is housed in a housing: a power semiconductor element that constitutes a power conversion circuit that performs power conversion between direct current and alternating current; a heat generating component that constitutes a step-up converter, a step-down converter, or the like that converts a voltage value; a water-cooled heat sink that cools the power semiconductor element and the heat-generating component; a control circuit board provided with a control circuit for driving the power semiconductor element; and a filter capacitor for suppressing ripple current.
In the power conversion device described above, the relay terminal extending from the power semiconductor element is inserted into a through hole provided in the control circuit board and then soldered to an electrical conductor provided in the control circuit board, but patent document 1 proposes a power conversion device as follows: a guide member having a guide portion for inserting a relay terminal into a through hole is provided to a control circuit board so that the assemblability is improved.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2004-87605
Disclosure of Invention
Technical problem to be solved by the invention
In particular, in the case of a drive device of a vehicle such as a transmission device mounted on a hybrid vehicle, vibrations of an engine are also transmitted to the power conversion device, and thus the following problems may occur: the control circuit board deforms due to vibration, which causes cracking in the soldered joint between the control circuit board and the electronic component, or breakage of the relay terminal from the electronic component such as the power semiconductor element due to vibration.
The present application discloses a technique for solving the above-described problems, and an object thereof is to provide a power conversion device that realizes improvement of vibration resistance.
Technical proposal adopted for solving the technical problems
The power conversion device disclosed in the present application has:
a plurality of power semiconductor elements constituting a power conversion circuit; and a control circuit board for controlling the driving of the power semiconductor element, the control circuit board comprising:
a frame body having a cooling surface of a radiator inside;
a support case provided inside the housing, holding the power semiconductor element so as to cool the power semiconductor element by the cooling surface of the heat sink, and incorporating a dc input terminal and an ac output terminal connected to the power semiconductor element via bus bars, and fixing the control circuit board so as to be opposed to and parallel to the surface of the power semiconductor element; and
a holding plate fixed to the support case and having a holding piece having elasticity facing the control circuit board through a space; and
a guide member disposed in the space and guiding the relay terminal extending from the power semiconductor element to a through hole provided in the control circuit board,
the guide member is mounted on a surface of the control circuit substrate opposite to the power semiconductor element and pressed by the holding piece.
Further, the power conversion device disclosed in the present application has:
a plurality of power semiconductor elements constituting a power conversion circuit; and a control circuit board for controlling the driving of the power semiconductor element, the control circuit board comprising:
a frame body having a cooling surface of a radiator inside;
a support case provided inside the housing, holding the power semiconductor element so as to cool the power semiconductor element by the cooling surface of the heat sink, and incorporating a dc input terminal and an ac output terminal connected to the power semiconductor element via bus bars, and fixing the control circuit board so as to be opposed to and parallel to the surface of the power semiconductor element;
a shielding plate disposed between the control circuit board and the power semiconductor element;
a holding piece provided to the shield plate and having elasticity; and
a guide member disposed between the holding piece and the control circuit board, for guiding the relay terminal extending from the power semiconductor element to a through hole provided in the control circuit board,
the guide member is mounted on a surface of the control circuit substrate opposite to the power semiconductor element and pressed by the holding piece.
Effects of the invention
According to the power conversion device disclosed in the present application, a power conversion device that realizes improvement of vibration resistance can be obtained.
Drawings
Fig. 1 is a longitudinal sectional view of a power conversion device according to embodiment 1.
Fig. 2 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 1.
Fig. 3 is a schematic plan view of the position of the X-X line, as seen from the direction of arrow a shown in fig. 2.
Fig. 4 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 2.
Fig. 5 is a schematic plan view of the position of the X-X line, as seen from the direction of arrow B shown in fig. 4.
Fig. 6 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 3.
Fig. 7 is a schematic plan view seen from the direction of arrow C shown in fig. 6.
Fig. 8 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 4.
Fig. 9 is a schematic plan view of the position of the X-X line, as seen from the direction of arrow D shown in fig. 8.
Fig. 10 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 5.
Fig. 11 is a schematic plan view of the position of the X-X line, as seen from the direction of arrow E shown in fig. 10.
Detailed Description
Hereinafter, a power conversion device according to an embodiment of the present application will be described with reference to the drawings. In the drawings, like reference numerals designate like or corresponding parts throughout the several views.
Embodiment 1.
Fig. 1 is a longitudinal sectional view of a power conversion device according to embodiment 1. In fig. 1, a power conversion device 100 includes a metal housing 2 fixed to a surface 11 of a water-cooled radiator 1. The radiator 1 has a flow path 12 formed therein, and is configured such that cooling water flows through the flow path 12.
The inside of the housing 2 houses: power semiconductor elements 31, 32 embedded in the resin support case 6; filter capacitor 4 supported by boss portions 91, 92; a control circuit board 5 supported by the support case 6; a shield plate 8 supported by the support housing 6; and a bus bar 120, a part of which is inserted into the support housing 6, and the like.
The power semiconductor elements 31 and 32 are part of 6 power semiconductor elements constituting an inverter circuit as a power conversion circuit, for example, U-phase, V-phase, and W-phase upper arm switching elements and U-phase, V-phase, and W-phase lower arm switching elements that are three-phase bridge circuits. Here, the power semiconductor element 31 constitutes an upper arm switching element of the U-phase, and the power semiconductor element 32 constitutes a lower arm switching element of the U-phase. Other power semiconductor elements, not shown, constitute V-phase and W-phase upper arm switching elements and lower arm switching elements. In the following description, only the power semiconductor elements 31 and 32 are described, but other power semiconductor elements have the same configuration.
The filter capacitor 4 is connected between dc terminals of the inverter circuit, and filters a dc current input to the inverter circuit. The control circuit board 5 has a mounting surface 50 as a surface thereof: power semiconductor elements 31, 32; a drive circuit for driving and controlling other power semiconductor elements not shown; a CPU (Central Processing Unit: central processing Unit) 71 that supplies instruction signals to the drive circuits; an electronic component 72 such as a semiconductor integrated circuit.
The power semiconductor elements 31 and 32 are embedded in the resin support case 6. The back surfaces of the power semiconductor elements 31 and 32 are exposed on the back surface of the support case 6, and contact the front surface 11 of the heat sink 1. The back surfaces of the power semiconductor elements 31, 32 protrude from the back surface of the support case 6 to the front surface side of the heat sink 1 in a minute size. Therefore, the back surface of the support case 6 faces the front surface 11 of the radiator 1 with a small-sized gap (not shown). The back surfaces of the power semiconductor elements 31 and 32 may be formed to be flush with the back surface of the support case 6, and in this case, the back surface of the support case 6 is in contact with the front surface 11 of the heat sink 1.
The side edge portions 611, 612 of the support housing 6 are formed to protrude from the surface of the support housing 6. Further, the supporting bodies 621, 622 are fixed to the surface of the supporting case 6. The support bodies 621, 622 may be integrally formed with the support housing 6, and may be formed separately.
The control circuit board 5 is fixed to the side edges 611 and 612 of the support case 6 by screws 510 and 520. The metal shield plate 8 is disposed between the power semiconductor elements 31 and 32 and the control circuit board 5, and is fixed to the support bodies 621 and 622 by screws 81 and 82. The shielding plate 8 shields electromagnetic noise emitted from the power semiconductor elements 31 and 32 from the control circuit board 5. The filter capacitor 4 is fixed to boss portions 91, 92 by screws 41, 42, and the boss portions 91, 92 are fixed to the surface of the radiator 1.
The side edge 611 of the support case 6 is inserted with the positive-side dc terminal 110 and the negative-side dc terminal (not shown) of the inverter. One end of the positive-side dc terminal 110 is exposed to the outside from the outer side wall surface of the side edge 611, and the other end penetrates the side edge 611 and is connected to the terminal 311 of the power semiconductor element 31. Further, a part of the bus bar 120, one end of which is electrically connected to the direct current terminal 110 on the positive electrode side, is inserted into the side edge portion 611 of the support case 6. The other end of the bus bar 120 penetrates the side edge portion 611 and is connected to the terminal 321 of the power semiconductor element 32.
The ac terminals 111 of the inverter are inserted into the side edge portions 612 of the support case 6. One end of the ac terminal 111 is exposed to the outside from the outer side wall surface of the side edge portion 612, and the other end penetrates the side edge portion 612 and is connected to the terminal 322 of the power semiconductor element 32. A bus bar (not shown) having one end electrically connected to the ac terminal 111 is insert molded to the side edge portion 612 of the support case 6, and the other end of the bus bar penetrates the side edge portion 611 and is connected to a terminal (not shown) of the power semiconductor element 31.
The dc-side bus bar 120 is electrically connected from the dc terminal 110 of the inverter to the ac terminal 111 of the inverter via the power semiconductor element 32. Further, a bus bar (not shown) inserted into the ac side of the side edge portion 612 of the support case 6 is electrically connected from the ac terminal 111 of the inverter to the dc terminal 110 of the inverter via the power semiconductor element 31.
The positive-side bus bar 121 extending from the filter capacitor 4 is electrically connected to the positive-side dc terminal 110 provided at the side edge 611 of the support case 6, and is fixed to the side edge 611 by the screw 43. The negative-side bus bar 122 extending from the filter capacitor 4 is electrically connected to a negative-side dc terminal (not shown) provided on the side edge 611 of the support case 6, and is fixed to the side edge 611 by a screw (not shown). The relay terminals 310 and 320 extending from the power semiconductor elements 31 and 32 are electrically connected to an electrical conductor provided on the control circuit board 5 through a through hole provided on the control circuit board 5, as will be described later.
As described above, the power conversion device according to embodiment 1 has the power semiconductor elements 31 and 32 arranged on the front surface 11 of the heat sink 1, and is configured such that the control circuit board 5 for controlling the driving of the power semiconductor elements 31 and 32 faces the power semiconductor elements 31 and 32. The relay terminals 310 and 320 extending from the power semiconductor elements 31 and 32 are electrically connected to the control circuit board 5, and the support case 6 is provided between the heat sink 1 and the control circuit board 5, with the dc-side bus bar 120 interposed therebetween, the dc-side bus bar 120 being electrically connected from the dc terminal 110 to the ac terminal 111 via the power semiconductor element 32, the filter capacitor 4 being disposed so as to face the mounting surface 50 of the control circuit board 5, and the filter capacitor 4 being fixed to the boss portions 91 and 92 provided to the heat sink 1. The bus bar 121 on the positive electrode side extending from the filter capacitor 4 is electrically connected to the dc terminal 110 of the side edge 611 of the support case by the screw 43. By configuring as described above, each structural member can be efficiently housed inside the metal housing 2.
Fig. 2 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 1, and fig. 3 is a schematic plan view of the power conversion device at a position of X-X line viewed from the direction of arrow a shown in fig. 2. In fig. 2 and 3, the control circuit substrate 5 is formed with a through hole 51, and the through hole 51 is inserted with the relay terminal 320 extending from the power semiconductor element 32. The number and positions of the through holes 51 are set according to the number and positions of the relay terminals 320 extending from the power semiconductor element 32. In addition, the number of through holes 51 may be greater than the number of relay terminals 320.
A guide member 53 is disposed on the opposite surface 501, which is the surface of the control circuit board 5 facing the power semiconductor element, and the guide member 53 has a guide portion 531 recessed in a mortar shape for guiding insertion of the relay terminal 320 into the through hole 51. The guide member 53 has a through hole 532 in the center of the guide portion 531. The through hole 532 is disposed to communicate with the through hole 51 of the control circuit board 5. The shape of the guide portion 531 of the guide member 53 is not limited to a mortar shape, and may be a tapered shape such as a square taper or a triangular pyramid, and the same effects can be obtained.
The guide member 53 will be described in further detail. As shown in fig. 3, one guide member 53 includes: 10 guide portions 531 formed in a rectangular parallelepiped and arranged in the longitudinal direction of the guide member 53; and 10 through holes 532 provided in the central portion of the guide portion 531. In embodiment 1, among the 4 sides of the rectangular control circuit board 5, 2 guide members 53 are arranged in the longitudinal direction along one side 502 of 2 opposing sides fixed to the side edges 611 and 612 of the support case 6. Although not shown, 2 guide members 53 are similarly disposed near the other of the 2 opposing sides of the control circuit board 5.
As shown in fig. 2 and 3, the holding plate 613 made of a metal plate having elasticity has its through hole 614 penetrated by the screw 520, and is fixed to the side edge portion 612 of the support case 6 together with the control circuit board 5 by the screw 520. The holding plate 613 includes: a main body portion 615 having a through hole 614; and retention tabs 616, 617 extending from the body portion 615, respectively. As shown in fig. 2, the holding pieces 616 and 617 extending from the main body portion 615 of the holding plate 613 are formed to be bent from the main body portion 615 toward the side of the counter control circuit board.
One of the 2 guide members 53 is held by the counter surface 501 of the control circuit board 5 by being sandwiched between the holding piece 616 of the holding plate 613 and the counter surface 501 of the control circuit board 5 at the center in the longitudinal direction. Similarly, the other of the 2 guide members 53 is held by the counter surface 501 of the control circuit board 5 by being sandwiched between the holding piece 617 of the holding plate 613 and the counter surface 501 of the control circuit board 5 at the center in the longitudinal direction.
The holding pieces 616, 617 bent from the main body portion 615 of the holding plate 613 are opposed to the counter mounting surface 501 of the control circuit board 5 through a space of a dimension equal to or smaller than the thickness dimension of the guide member 53. The guide member 53 is firmly pressed against the counter surface 501 of the control circuit board 5 by the elasticity of the holding pieces 616, 617 of the holding plate 613, and is prevented from falling off from the counter surface 501 of the control circuit board 5. The guide member 53 can be easily mounted between the counter mounting face 501 of the control circuit substrate 5 and the holding pieces 616, 617 by the elasticity of the holding pieces 616, 617 of the holding plate 613.
The relay terminal 320 extending from the side surface portion of the power semiconductor element 32 is bent at right angles in the direction of the control circuit board 5, and the tip end portion thereof is guided to the wall surface of the guide portion 531 formed to be recessed in a mortar shape in the guide member 53, is inserted into the through hole 532 of the guide member 53, penetrates the through hole 51 of the control circuit board 5, and protrudes perpendicularly from the mounting surface 50 of the control circuit board 5.
The tip end portion of the relay terminal 320 protruding from the mounting surface 50 of the control circuit board 5 is electrically and mechanically bonded to an electrical conductor (not shown) formed on the mounting surface 50 of the control circuit board 5 by a solder joint portion 503. Note that, although not shown in fig. 2 and 3, the relay terminal 310 extending from the side surface portion of the power semiconductor element 31 is electrically and mechanically bonded to another conductor formed on the mounting surface 50 of the control circuit board 5 by a solder joint portion, similarly to the relay terminal 320.
According to the power conversion device of embodiment 1, since the guide member is held between the holding piece having the elastic holding plate and the opposite surface of the control circuit board, vibration of the control circuit board can be suppressed. As a result, the control circuit board is not deformed, and problems such as those of the conventional power conversion device are not generated, namely: cracks are generated in the soldered joint portion between the control circuit board and the electronic component, or relay terminals from the electronic component are broken due to vibration. Further, since the guide member is mounted on the opposite surface of the control circuit board, the area of the mounting surface of the control circuit board is not reduced. In addition, the effect of improving the assembling property by the guide member can be obtained.
Embodiment 2.
Fig. 4 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 2, and fig. 5 is a schematic plan view of the power conversion device at a position of X-X line viewed from the direction of arrow B shown in fig. 4. In fig. 4 and 5, the vibration preventing member 618 made of vibration preventing rubber is interposed between the holding pieces 616, 617 of the holding plate 613 and the guide member 53. In more detail, the vibration preventing member 618 is held by the holding pieces 616 and 617 by embedding the holding pieces 616 and 617 of the holding plate 613 inside, and is configured to cover the peripheral edge portion of the guide member 53.
According to the power conversion device of embodiment 2, since the guide member 53 is mounted on the counter-mount surface 501, which is the 2 nd surface of the control circuit board 5, via the vibration-proof member 618, the following effects are obtained: the vibration resistance of the relay terminal and the electronic component mounted on the control circuit board 5 can be further improved.
Other configurations of the power conversion device according to embodiment 2 are the same as those of the power conversion device according to embodiment 1.
Embodiment 3.
Fig. 6 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 3, and fig. 7 is a schematic plan view of the power conversion device as viewed from the direction of arrow C shown in fig. 6. In fig. 6 and 7, an insulating vibration-proof member 619 made of vibration-proof rubber, which is mounted on the mounting surface 50, which is the surface of the control circuit board 5, surrounds the solder joint 503 and the tip end portion of the relay terminal 320, and the solder joint 503 electrically connects the relay terminal 320 from the power semiconductor element 32 to the electric conductor of the control circuit board 5. The pressing plate 700 made of a metal plate having elasticity is fixed to the side edge portion 612 of the support housing 6 together with the control circuit board 5 and the holding plate 613 by the screw 520.
The pressing plate 700 includes pressing pieces 701 and 702 inserted into the insulating vibration isolation member 619 at both ends of the main body 703. The insulating vibration isolation member 619 is pressed against the mounting surface 50 of the control circuit board 5 by the pressing piece 701 of the pressing plate 700.
Other configurations of the power conversion device according to embodiment 3 are the same as those of the power conversion device according to embodiment 2.
According to the power conversion device of embodiment 3, since the vibration isolation member 618 and the insulating vibration isolation member 619 are provided on the surface of the control circuit board on which the guide member 53 is mounted and the surface opposite to the surface, respectively, the vibration resistance of the power conversion device and the electronic components and the relay terminals mounted on the control circuit board 5 can be further improved.
Embodiment 4.
Fig. 8 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 4, and fig. 9 is a schematic plan view of the power conversion device at a position of X-X line viewed from the direction of arrow D shown in fig. 8. In fig. 8 and 9, a metal shield plate 8 for shielding electromagnetic noise emitted from the power semiconductor element 32 is mounted between the power semiconductor element 32 and the control circuit board 5, and the shield plate 8 is provided with a pair of holding pieces 801 and 802 integrally formed with the shield plate 8.
Guide members 53 are provided between the holding pieces 801 and 802 and the counter surface 501 which is the 2 nd surface of the control circuit board 5. The guide members 53 are pressed against and held by the counter surface 501 of the control circuit board 5 by the elasticity of the holding pieces 801 and 802. The other structure is the same as that of the power conversion device of embodiment 1.
According to the power conversion device of embodiment 4, the same vibration-resistant effect as that of the power conversion device of embodiment 1 can be obtained by providing the shield plate with the retaining piece, without providing the retaining plate additionally.
Embodiment 5.
Fig. 10 is a longitudinal enlarged cross-sectional view of a part of the power conversion device according to embodiment 5, and fig. 11 is a schematic plan view of the power conversion device at a position of X-X line viewed from the direction of arrow E shown in fig. 10. In fig. 10 and 11, the tip ends of the holding pieces 801, 802 integrally formed with the shield plate are inserted into the vibration-proof member 618 made of vibration-proof rubber. The vibration preventing member 618 surrounds the guide member 53, and the guide member 53 is interposed between the holding pieces 801, 802 and the counter mounting surface 501, which is the 2 nd surface of the control circuit substrate 5. Other configurations of the power conversion device according to embodiment 5 are the same as those of embodiment 4 described above.
According to the power conversion device of embodiment 5, since the guide member 53 is mounted on the counter-mount surface 501, which is the 2 nd surface of the control circuit board 5, via the vibration-proof member 618, the following effects are obtained: the vibration resistance of the relay terminal and the electronic component mounted on the control circuit board 5 can be further improved.
While various exemplary embodiments and examples are described herein, the various features, aspects, and functions described in one or more embodiments are not limited in application to particular embodiments and may be applied to embodiments alone or in various combinations.
Accordingly, numerous modifications not shown by way of example are contemplated within the scope of the techniques disclosed herein. For example, it is assumed that the case where at least one component is deformed, added, or omitted, and the case where at least one component is extracted and combined with the components of other embodiments are included.
Description of the reference numerals
100. Power conversion device
1. Radiator
11. Surface of radiator
12. Flow path
2. Frame body
31. 32 power semiconductor element
310. 320 relay terminal
311. 321, 322 terminal
310. 320 relay terminal
4. Filtering capacitor
5. Control circuit board
50. Mounting surface
501. Reverse mounting surface
502. Edge portion
503. Welded joint
51. Through hole
53. Guide member
531. Guide part
532. Through hole
41. 42, 43, 510, 520, 81, 82 screw
6. Bearing housing
611. 612 side edge portion
613. Retaining plate
614. Through hole
615. 703 main body
616. 617 holding sheet
618. Vibration-proof member
619. Insulating vibration-proof member
621. 622 support
71 CPU
72. Electronic component
700. Pressing plate
701. Pressing sheet
8. Shielding plate
801. 802 holding sheet
91. 92 shaft sleeve part
110. DC terminal
111. AC terminal
120. 121, 122 bus bars.
Claims (8)
1. A power conversion device includes: a plurality of power semiconductor elements constituting a power conversion circuit; and a control circuit board for controlling the driving of the power semiconductor element, wherein the power conversion device includes:
a frame body having a cooling surface of a radiator inside;
a support case provided inside the housing, holding the power semiconductor element so as to cool the power semiconductor element by the cooling surface of the heat sink, and incorporating a dc input terminal and an ac output terminal connected to the power semiconductor element via bus bars, and fixing the control circuit board so as to be opposed to and parallel to the surface of the power semiconductor element;
a holding plate fixed to the support case and having a holding piece having elasticity and facing the control circuit board with a space therebetween; and
a guide member disposed in the space and guiding the relay terminal extending from the power semiconductor element to a through hole provided in the control circuit board,
the guide member is mounted on a surface of the control circuit substrate opposite to the power semiconductor element and pressed by the holding piece.
2. The power conversion device of claim 1, wherein,
the bus bar is composed of a bus bar on the direct current side and a bus bar on the alternating current side,
a part of the bus bar on the direct current side is inserted into the supporting housing and connected to the direct current terminal of the power conversion circuit and the power semiconductor element,
a part of the bus bar on the alternating current side is inserted into the supporting housing and connected to the alternating current terminal of the power conversion circuit and the power semiconductor element,
comprises a filter capacitor disposed in the housing and connected to the DC terminal of the power conversion circuit,
the surface of the control circuit substrate is disposed opposite and parallel to the surface of the filter capacitor,
the dc-side bus bar and the ac-side bus bar are arranged to extend in parallel with respect to the control circuit board.
3. The power conversion device of claim 2, wherein,
the guide member is mounted on a surface of the control circuit substrate via a vibration preventing member.
4. The power conversion device of claim 1, wherein,
the guide member is mounted on a surface of the control circuit substrate via a vibration preventing member.
5. The power conversion apparatus according to any one of claims 1 to 4,
the relay terminal is electrically connected to the control circuit board through a solder joint on a surface of the control circuit board on a back side with respect to a surface on which the guide member is mounted,
comprising the following steps: an insulating vibration-proof member covering the welded joint;
and a pressing plate having a pressing piece that presses the insulating vibration prevention member to a surface on the back side of the control circuit board and has elasticity.
6. A power conversion device includes: a plurality of power semiconductor elements constituting a power conversion circuit; and a control circuit board for controlling the driving of the power semiconductor element, wherein the power conversion device includes:
a frame body having a cooling surface of a radiator inside;
a support case provided inside the housing, holding the power semiconductor element so as to cool the power semiconductor element by the cooling surface of the heat sink, and incorporating a dc input terminal and an ac output terminal connected to the power semiconductor element via bus bars, and fixing the control circuit board so as to be opposed to and parallel to the surface of the power semiconductor element;
a shielding plate disposed between the control circuit board and the power semiconductor element;
a holding piece provided to the shield plate and having elasticity; and
a guide member disposed between the holding piece and the control circuit board, for guiding the relay terminal extending from the power semiconductor element to a through hole provided in the control circuit board,
the guide member is mounted on a surface of the control circuit substrate opposite to the power semiconductor element and pressed by the holding piece.
7. The power conversion device of claim 6, wherein,
the bus bar is composed of a bus bar on the direct current side and a bus bar on the alternating current side,
a part of the bus bar on the direct current side is inserted into the supporting housing and connected to the direct current terminal of the power conversion circuit and the power semiconductor element,
a part of the bus bar on the alternating current side is inserted into the supporting housing and connected to the alternating current terminal of the power conversion circuit and the power semiconductor element,
comprises a filter capacitor disposed in the housing and connected to the DC terminal of the power conversion circuit,
the control circuit board is disposed opposite and parallel to the surface of the filter capacitor,
the bus bar on the direct current side and the bus bar on the alternating current side are arranged to extend in parallel with respect to the control circuit substrate,
the shield plate is disposed parallel to the control circuit board.
8. A power conversion apparatus according to claim 6 or 7, wherein,
a vibration preventing member is disposed between the holding piece and the guide member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-223447 | 2019-12-11 | ||
| JP2019223447A JP6854874B1 (en) | 2019-12-11 | 2019-12-11 | Power converter |
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| Publication Number | Publication Date |
|---|---|
| CN112951818A CN112951818A (en) | 2021-06-11 |
| CN112951818B true CN112951818B (en) | 2024-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011389383.8A Active CN112951818B (en) | 2019-12-11 | 2020-12-01 | Power conversion device |
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| Country | Link |
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| JP (1) | JP6854874B1 (en) |
| CN (1) | CN112951818B (en) |
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| JP2000307056A (en) * | 1999-04-22 | 2000-11-02 | Mitsubishi Electric Corp | Vehicle-mounted semiconductor device |
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| CN1308441A (en) * | 1996-08-29 | 2001-08-15 | 松下电器产业株式会社 | Vibrator holder |
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| JP2008294272A (en) * | 2007-05-25 | 2008-12-04 | Kyocera Mita Corp | Board assembly and image forming apparatus with the board assembly |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2021093851A (en) | 2021-06-17 |
| CN112951818A (en) | 2021-06-11 |
| JP6854874B1 (en) | 2021-04-07 |
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