WO2015001766A1

WO2015001766A1 - Electronic device

Info

Publication number: WO2015001766A1
Application number: PCT/JP2014/003379
Authority: WO
Inventors: 篤志柏崎
Original assignee: 株式会社デンソー
Priority date: 2013-07-05
Filing date: 2014-06-24
Publication date: 2015-01-08
Also published as: JP2015015385A

Abstract

　A ring-shaped sealing member (50) is formed by integrating a ring-shaped part (51), a substrate-pressing part (52a), and a linking part (53a) for linking the ring-shaped part and the substrate-pressing part. Such a configuration makes it possible for the ring-shaped part to provide a seal between a case (30) and a base plate (40) and the substrate-pressing part to press a circuit board (10) towards a support part (37a) side and suppress vibrations. It becomes possible to form a ring-shaped sealing member and the substrate-pressing part using a single member, obviating the need to provide the substrate-pressing part (52a) as a separate standalone component.

Description

Electronic equipment

Cross-reference of related applications

This disclosure is based on Japanese Patent Application No. 2013-141657 filed on July 5, 2013, the contents of which are incorporated herein.

The present disclosure relates to an electronic device in which a circuit board is housed in a housing portion formed by opening one surface of a case, and the housing portion of the case is covered with a base plate serving as a lid.

2. Description of the Related Art Conventionally, there is an electronic device in which a circuit board is accommodated in an accommodating portion formed by opening one surface of a case, and the case accommodating portion is covered with a base plate serving as a lid (see, for example, Patent Document 1). . In this type of electronic device, the circuit board is fixed to the case by heat caulking a part of the case or screwing. Further, in this electronic device, the seal member is disposed at a place other than the place where the circuit board is fixed to the case, and the vibration of the circuit board is suppressed by pressing the circuit board.

JP 2008-060465 A

However, since the sealing member is provided as a separate part as a board pressing member for pressing the circuit board against the case, this may lead to an increase in the number of parts, which may lead to an increase in product cost. .

This disclosure is intended to provide an electronic device capable of suppressing vibration by pressing a circuit board against a case while reducing the number of components.

In order to achieve the above object, according to a first example of the present disclosure, an electronic device is provided as follows. A circuit board having a front surface and a back surface, on which electronic components are mounted on at least one of the front surface and the back surface; a case in which a housing portion for housing the circuit board is formed by opening one side; The cover has a closed surface facing one surface, covers the housing portion, and is disposed between the surface of the circuit board and the closed surface of the cover material, and further covers the surface of the circuit board and one surface of the case and the cover. An elastic member in which at least two pressure contact parts sandwiched between at least one of the closed surfaces of the material and a connection part that connects the two pressure contact parts are integrally formed of an elastic body; It is characterized by having.

Thus, by providing the pressure contact portion between the surface of the circuit board and the lid member, the circuit board can be pressed toward the support portion by the pressure contact portion to suppress vibration. And, by constructing such a pressure contact part integrally with another pressure contact part, it is not necessary to provide the pressure contact part as a separate component. Therefore, it is possible to reduce the number of parts, thereby reducing the product cost.

For example, as an arbitrarily selectable configuration, the configuration of the above first example is also provided as follows. That is, with respect to the ring-shaped sealing member having the ring member (51) that seals between the case and the lid and constitutes one of the press contact portions, the circuit board is disposed between the surface of the circuit board and the closed surface. The pressure contact portion can be integrated. For example, a single elastic body is integrally formed as a single piece without a seam. In that case, as an optional configuration, the ring-shaped portion of the ring-shaped seal member has a higher compression ratio than the pressure contact portion disposed between the surface of the circuit board and the closed surface of the lid member. If it is made to compress by (3), it will become possible to exhibit the press function by a press-contact part suitably, without disturbing the sealing function by a ring-shaped part.

Also, the configuration of the first example is provided as follows as an arbitrarily selectable configuration. That is, the press contact portion can be integrated with the pressing member that presses the circuit board against the pedestal portion, or the press contact portion can be integrated with the flow restricting member that restricts the flow of the heat radiating gel.

Furthermore, according to the method of the second example of the present disclosure, as the ring-shaped sealing member, a ring-shaped portion that is sandwiched between the lid member and the side wall portion of the case, and the ring-shaped portion extends inwardly. And a connecting portion connected to the connecting portion, and a pressure contact portion that presses the circuit board by being sandwiched between the lid member and the circuit board. The base plate is fixed to the case with the ring-shaped seal member disposed between them, and the connecting portion is cut, and the circuit board is formed at the pressure contact portion while sealing the space between the case and the lid material by the ring-shaped portion. Press.

In this way, when the lid is fixed to the case, the pressure contact part is separated from the ring-shaped part, so that the circuit board is pressed even if the case or the lid is thermally expanded or contracted. It is possible to prevent the part that is present from shifting. Even in this case, since the pressure contact part is integrated with the ring-shaped seal member, it is possible to reduce the number of parts in the state before separation, thereby reducing the product cost. .

The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings.
FIG. 3 is a top surface layout diagram of the electronic device according to the first embodiment of the present disclosure; FIG. 2 is a cross-sectional view taken along the line II-II in FIG. It is an expanded sectional view of the vicinity of the ring-shaped seal member in FIG. FIG. 6 is a top surface layout diagram of an electronic device according to a second embodiment of the present disclosure; FIG. 5 is a cross-sectional view taken along line VV in FIG. FIG. 6 is a top surface layout diagram of an electronic device according to a third embodiment of the present disclosure; FIG. 7 is a sectional view taken along arrow VII-VII in FIG. FIG. 6 is a top surface layout diagram of an electronic device according to a fourth embodiment of the present disclosure; FIG. 9 is a sectional view taken along arrow IX-IX in FIG. FIG. 10 is a top surface layout diagram of an electronic device according to a fifth embodiment of the present disclosure; FIG. 11 is a cross-sectional view taken along the line XI-XI in FIG. FIG. 10 is a top surface layout diagram of an electronic device according to a sixth embodiment of the present disclosure; FIG. 13 is a cross-sectional view taken along arrow XIII-XIII in FIG. FIG. 10 is a top surface layout diagram of an electronic device according to a seventh embodiment of the present disclosure; FIG. 15 is a cross-sectional view taken along arrow XV-XV in FIG. FIG. 10 is a top surface layout diagram of an electronic device according to an eighth embodiment of the present disclosure; It is XVII-XVII arrow sectional drawing of FIG. 16, FIG. 20 is a top surface layout diagram of an electronic device according to a ninth embodiment of the present disclosure; FIG. 19 is a cross-sectional view taken along arrow XIX-XIX in FIG. It is a top surface layout diagram of an electronic device according to a tenth embodiment of the present disclosure, FIG. 21 is a cross-sectional view taken along arrow XXI-XXI in FIG. 20, and is a top surface layout diagram of the electronic device according to the ninth embodiment of the present disclosure; FIG. 20 is a top surface layout diagram of an electronic device according to an eleventh embodiment of the present disclosure; FIG. 22 is a cross-sectional view taken along the line XXIII-XXIII of FIG. It is the figure which showed an example of the cross-sectional shape of the board | substrate press part demonstrated by other embodiment, It is the figure which showed an example of the cross-sectional shape of the board | substrate press part demonstrated by other embodiment, It is the figure which showed an example of the cross-sectional shape of the board | substrate press part demonstrated by other embodiment, It is sectional drawing of the board | substrate press part vicinity which showed the modification of circuit boards etc. which are demonstrated by other embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
A first embodiment of the present disclosure will be described. With reference to FIG. 1 and FIG. 2, the overall configuration of the electronic device S1 according to the first embodiment of the present disclosure will be described. The electronic device S1 is mounted on a vehicle such as an automobile, and is applied as a device for driving each device for the vehicle.

As shown in FIGS. 1 and 2, the electronic device S1 includes a circuit board 10, an electronic component 20, a case 30, a base plate 40, a ring-shaped seal member 50, a fixing member 60, and the like.

As shown in FIG. 2, the circuit board 10 forms a plate-like member having one surface 11 as a front surface and the other surface 12 as a back surface opposite to the surface 11. In the present embodiment, the circuit board 10 is a plate-like member having a rectangular top surface as shown in FIG. For example, the circuit board 10 is configured by a multilayer wiring board based on a material obtained by adding glass fibers to an epoxy resin.

The circuit board 10 is formed with a wiring pattern (not shown) constituted by inner layer wiring or surface layer wiring, and each electronic component 20 is electrically connected to the wiring pattern. In the case of the present embodiment, the electronic component 20 is mounted on both the one surface 11 and the other surface 12 of the circuit board 10, but may be mounted on only one of them.

Further, a through hole 13 provided with metal plating or the like connected to the wiring pattern is provided so as to face two opposite sides of the circuit board 10. The connection terminal 35 provided in the case 30 is inserted into the through hole 13 and joined by soldering or the like, so that the through hole 13 and the connection terminal 35 are electrically connected. In the case of this embodiment, a plurality of through holes 13 are arranged in two rows along each of two opposite sides of the circuit board 10.

The circuit board 10 thus configured is supported by the case 30 at the four corners. In the case of the present embodiment, fixing holes 14 serving as through holes are formed at the four corners of the circuit board 10, and after inserting the mechanical connection portion 34 protruding from the bottom surface 31 of the case 30, the machine The circuit board 10 is supported on the case 30 by heat caulking the tip of the target connection portion 34.

The electronic component 20 is electrically connected to the wiring pattern by being mounted on the circuit board 10, and may be any surface mounting component or through-hole mounting component. In the present embodiment, as the electronic component 20, a semiconductor element, a passive element, or the like is used. Examples of semiconductor elements include microcomputers, control elements, power elements such as IGBTs (Insulated Gate Bipolar Transistors) and MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), etc. These semiconductor elements include bonding wires and solders. The die bond material is connected to a land connected to the wiring pattern of the circuit board 10 or a land formed by a part of the wiring pattern, and examples of the passive element include a chip resistor, a chip capacitor, and a crystal resonator. This passive element is connected to a land provided on the circuit board 10 by a die bonding material such as solder.

With these configurations, the electronic component 20 is electrically connected to the wiring pattern formed on the circuit board 10 and can be electrically connected to the outside through the through hole 13 connected to the wiring pattern.

The case 30 is a rectangular parallelepiped housing that accommodates the electronic component 20 mounted on the one surface 11 and the other surface 12 of the circuit board 10. The case 30 is basically composed of an insulator based on a resin such as PPS (polyphenylene sulfide) or PBT (polybutylene terephthalate). In the case of the present embodiment, the case 30 is a member that forms a concave housing portion 33 that is open on one side and is surrounded by a side wall portion 32 around the bottom surface 31, and the circuit board 10 on which the electronic component 20 is mounted It is accommodated in the accommodating portion 33 so that the other surface 12 side faces the bottom surface 31 side.

As described above, the mechanical connection portion 34 that supports the circuit board 10 is formed on the bottom surface 31 of the case 30. The mechanical connection portion 34 has a structure that is vertically raised from the bottom surface 31, and includes a pedestal portion 34 a disposed on the bottom surface 31 side and a tip end portion 34 b that protrudes from the surface of the pedestal portion 34 a on the base plate 40 side. It is set as having. The pedestal portion 34a has a cross-sectional dimension larger than that of the fixing hole 14 formed in the circuit board 10 and constitutes a seat surface on which the circuit board 10 is brought into contact. The distal end portion 34b is a portion that fixes the circuit board 10 to the pedestal portion 34a. In the case of this embodiment, the circuit board 10 is fixed to the pedestal portion 34a by caulking the tip of the tip portion 34b.

Specifically, in the state before the circuit board 10 is fixed, the front end portion 34b has a cross-sectional dimension on the front end side that is substantially the same as or slightly smaller than the fixing hole 14. Because of such dimensions, the mechanical connection portion 34 holds the circuit board 10 with the surface of the pedestal portion 34a as the seat surface while the tip side is inserted into the fixing hole 14. Then, the tip end portion 34b of the mechanical connection portion 34 is fitted into the fixing hole 14 and then heat caulked, so that the cross-sectional dimension of the tip portion 34b protruding from the circuit board 10 is larger than that of the fixing hole 14. The circuit board 10 is sandwiched and supported between the portion and the pedestal portion 34a. The mechanical connection portion 34 configured in this manner has a protruding amount from the bottom surface 31 lower than the height of the side wall portion 32, and the circuit board 10 enters the inside of the housing portion 33 rather than the tip of the side wall portion 32. It is like that.

Further, a plurality of connection terminals 35 are erected on the bottom surface 31 of the case 30 in a direction perpendicular to the bottom surface 31. The connection terminals 35 are arranged in two rows in accordance with the arrangement of the through holes 13 formed in the circuit board 10, and the same number as the through holes 13. For example, each connection terminal 35 is configured by a copper alloy that is tin-plated or nickel-plated. Each of the plurality of connection terminals 35 is inserted through a through hole 13 formed in the circuit board 10 and is electrically connected to the through hole 13 via a connection member such as solder.

In the case of the present embodiment, each connection terminal 35 is provided so as to protrude from the bottom surface 31 to the outside of the case 30. The connector wall 36a is provided outside the case 30 in a direction perpendicular to the bottom surface 31, so that the connector portion 36 is formed on the surface of the case 30 opposite to the base plate 40, and the connector portion 36 is electrically connected to the outside. The structure is such that a general connection can be made.

Furthermore, a groove portion 32 a that surrounds the periphery of the accommodating portion 33 is formed on the tip surface of the side wall portion 32 of the case 30, that is, on one surface of the side wall portion 32 that faces the base plate 40. A ring-shaped seal member 50 is disposed in the groove 32a. The depth of the groove part 32a is made shallower than the thickness of the part arrange | positioned in the groove part 32a in the ring-shaped sealing member 50. FIG. For this reason, in a state before the base plate 40 is fixed to the case 30, the ring-shaped sealing member 50 protrudes from the front end surface of the side wall portion 32. In the present embodiment, the depth of the groove 32 a is set so that the bottom surface of the groove 32 a is positioned closer to the base plate 40 than the one surface 11 of the circuit board 10.

Further, a connecting groove 32b for connecting the groove portion 32a and the housing portion 33 is formed on the side of the housing portion 33, that is, on the circuit board 10 side from the groove portion 32a in the front end surface of the side wall portion 32. A part of the ring-shaped seal member 50 is fitted in the connecting groove 32b. Further, a support portion 37 a is formed adjacent to the side wall portion 32 so as to be in contact with the lower side of the center positions of the two opposite sides of the circuit board 10. In the present embodiment, the support portion 37 a has a shape protruding from the bottom surface 31 of the case 30 toward the circuit board 10 and is in contact with the side wall portion 32, but is separated from the side wall portion 32. You may do it. In addition, at the four corners of the case 30, female screw holes 32 c are formed on the front end surface of the side wall portion 32, and the fixing member 60 is fastened using the female screw holes 32 c.

The base plate 40 serves as a lid member that seals the inside of the case 30 by being connected to the opening end of the case 30, that is, the front end surface of the side wall portion 32, with the surface on the case 30 side as a closed surface. In this case, it is fixed to the case 30 via the fixing member 60. The base plate 40 is made of a metal material having a high heat transfer coefficient, such as aluminum or copper, and is made of a rectangular plate member. In the present embodiment, fixing holes 40 a through which the fixing members 60 are inserted are formed at the four corners of the base plate 40. In FIG. 1, parts other than the base plate 40 of the electronic device S <b> 1 are illustrated, and the base plate 40 is omitted.

The ring-shaped seal member 50 constitutes an elastic member made of an elastic body such as rubber, and is sandwiched between the side wall portion 32 of the case 30 and the base plate 40 so that the inside of the housing portion 33 and the electronic device It plays the role of sealing between the outside of S1. The ring-shaped seal member 50 is basically configured to have a ring-shaped portion 51 configured by an O-ring or the like. The ring-shaped portion 51 constitutes one of the press contact portions. The ring-shaped portion 51 is disposed in the groove portion 32 a formed on the distal end surface of the side wall portion 32 and is crushed by the base plate 40. The seal function is demonstrated. Further, in the present embodiment, the ring-shaped sealing member 50 includes a substrate pressing portion 52a disposed inward of the ring-shaped portion 51, and an inwardly extending ring-shaped portion 51 and the substrate. A connecting portion 53a that connects the pressing portion 52a is provided.

The board pressing part 52a presses the circuit board 10 toward the support part 37a side of the case 30, and constitutes one of the press contact parts. The circuit board 10 is pressed against the support part 37a by the board pressing part 52a, so that the vibration of the circuit board 10 is suppressed. In the case of this embodiment, the board | substrate press part 52a is comprised with the spherical member. The size of the portion sandwiched between the circuit board 10 and the base plate 40 in the board pressing portion 52 a is set larger than the distance between the circuit board 10 and the base plate 40. For this reason, the board pressing part 52a is crushed by the base plate 40 when the base plate 40 is fixed to the case 30, and presses the circuit board 10 toward the support part 37a based on the elastic reaction force.

The connecting portion 53a integrates the connecting portion 53a with the ring-shaped seal member 50 by connecting the ring-shaped portion 51 and the substrate pressing portion 52a linearly. In other words, the ring-shaped sealing member 50 is provided as a unitary and seamlessly formed ring-shaped part 51, the substrate pressing part 52a, and the connecting part 53a that connects between them. It can be said that it is a thing. Furthermore, the ring-shaped sealing member 50 formed integrally is formed of the same elastic body in this embodiment. The connecting portion 53a is smaller in dimension in the normal direction of the circuit board 10 than the ring-shaped portion 51 and the substrate pressing portion 52a. For this reason, even when the base plate 40 is fixed to the case 30, the connecting portion 53a is not crushed.

The board pressing part 52a and the connecting part 53a are provided at the center positions of the two opposite sides of the circuit board 10, and the circuit board 10 is pressed toward the support part 37a at the center position. Thus, by arranging the board pressing portion 52a and the connecting portion 53a at the center positions of the two opposite sides of the circuit board 10, the circuit board 10 can be pressed at a point-symmetrical position with respect to the center of gravity of the circuit board 10. For this reason, the circuit board 10 can be pressed in a well-balanced manner without biasing the pressing force.

The fixing member 60 is a member for fixing the base plate 40 and the case 30. In the case of this embodiment, the fixing member 60 is constituted by a male screw, and the fixing member 60 is screwed into the female screw hole 32c of the side wall portion 32, whereby the base plate 40 and the case 30 are fixed. Yes. Although the fixing member 60 is used here, the fixing between the base plate 40 and the case 30 may be any fixing method, may be performed using an adhesive, or the circuit board 10 and the case. You may carry out by heat caulking like fixation with 30.

As described above, the electronic device S1 according to the present embodiment is configured. Such an electronic device S1 is manufactured by the following manufacturing method.

First, the circuit board 10 on which the wiring pattern and the through holes 13 are formed is prepared, and the case 30 provided with the connection terminals 35 is prepared. Then, after mounting the electronic component 20 on the one surface 11 of the circuit board 10, the circuit board 10 mounted with the electronic component 20 is placed in the housing portion 33 of the case 30 so that the other surface 12 side faces the bottom surface 31. Deploy. At this time, the plurality of connection terminals 35 are inserted into the through holes 13 so that the tips of the mechanical connection portions 34 are fitted into the fixing holes 14.

Thereafter, the tip of the mechanical connection portion 34 is heat caulked, and the through hole 13 and the plurality of connection terminals 35 are joined by soldering or the like. Subsequently, the ring-shaped seal member 50 is disposed on the distal end surface of the side wall portion 32. Specifically, the ring-shaped portion 51 is fitted into the groove portion 32a, and the connecting portion 53a is fitted into the connecting groove 32b. Then, the base plate 40 is disposed on the case 30 and the fixing member 60 is screwed into the female screw hole 32c, whereby the electronic device S1 according to the present embodiment is completed.

In the electronic device S1 of the present embodiment described above, the ring-shaped portion 51 of the ring-shaped seal member 50 can seal between the case 30 and the base plate 40, and the circuit board 10 is supported by the substrate pressing portion 52a on the support portion 37a side. To suppress vibrations. And since the board | substrate press part 52a is integrated with respect to the ring-shaped seal member 50, it becomes possible to comprise the ring-shaped seal member 50 and the board | substrate press part 52a by one member, and the board | substrate press part 52a is independent. It does not need to be provided as a separate part. Therefore, it is possible to reduce the number of parts, thereby reducing the product cost.

In addition, in order to acquire the said effect, it is necessary for the ring-shaped part 51 and the board | substrate press part 52a to be crushed between the case 30 and the base plate 40, However, The compression rate when these are crushed As for, it is preferable to make the ring-shaped portion 51 larger. This will be described with reference to FIG.

As shown in FIG. 3, with respect to the ring-shaped portion 51 and the substrate pressing portion 52a that are crushed between the case 30 and the base plate 40, the ring-shaped portion 51 has a higher compressibility than the substrate pressing portion 52a. I have to. For example, the distance from the base plate 40 to the bottom surface of the groove 32a is 1.5 ± 0.1 mm, the distance from the base plate 40 to the circuit board 10 is 2.5 ± 0.1 mm, and the ring-shaped portion 51 is φ2.05 ± 0. 1 mm, and the substrate pressing portion 52a is set to φ2.8 ± 0.1 mm. In this case, the compression rate of the ring-shaped portion 51 is 17.9 to 34.9%, and the compression rate of the substrate pressing portion 52a is 3.7 to 17.2%.

Since the ring-shaped portion 51 is crushed between the case 30 and the base plate 40, and serves to seal the inside of the housing portion 33 and the outside of the electronic device S <b> 1, the ring-shaped portion 51 is highly adhered to the case 30 and the base plate 40. It is preferable to contact with force. On the other hand, the board pressing part 52a presses the circuit board 10 toward the support part 37a to suppress vibrations, and a high pressing force is not necessarily required. If the compression ratio of the substrate pressing portion 52a is increased in order to obtain a high pressing force by the substrate pressing portion 52a, the substrate pressing portion 52a presses and spreads between the circuit board 10 and the base plate 40, and the bottom surfaces of the base plate 40 and the groove portion 32a. May increase the distance between the two. For this reason, by making the compression rate of the ring-shaped part 51 and the board | substrate press part 52a become the said relationship, the press function by the board | substrate press part 52a is suitably performed, without hindering the sealing function by the ring-shaped part 51. It will be possible to demonstrate.

(Second Embodiment)
A second embodiment of the present disclosure will be described. In this embodiment, a heat radiating gel is provided with respect to the first embodiment, the shape of the ring-shaped sealing member 50 is changed accordingly, and the rest is the same as the first embodiment. Only the parts different from the form will be described.

As shown in FIGS. 4 and 5, in this embodiment, a heat radiating gel 70 is provided between the circuit board 10 and the base plate 40. The heat dissipation gel 70 is made of, for example, a silicone oil compound having a high thermal conductivity, and is disposed so as to cover the electronic component 20 provided on the circuit board 10 that is provided with a heating element. Through the heat radiating gel 70, the heat generated by the electronic component 20 is easily transmitted to the base plate 40 side and is easily released from the base plate 40.

In the present embodiment, the ring-shaped seal member 50 is provided with a frame-shaped portion 54 that constitutes a flow restricting member that surrounds the heat radiating gel 70. The frame-like portion 54 is connected to the ring-like portion 51 by further extending the connecting portion 53b from the substrate pressing portion 52a. Further, a substrate pressing portion 52b that constitutes one of the press contact portions is partially provided on the frame-shaped portion 54 so that the circuit board 10 can be pressed by the substrate pressing portion 52b even at a portion where the frame-shaped portion 54 is disposed. I have to. The board pressing part 52b has the same dimensions as the board pressing part 52a, and presses the circuit board 10 by being sandwiched between the circuit board 10 and the base plate 40. The board pressing part 52b may be arranged at any location on the frame-like part 54, but in the case of the present embodiment, it is on the extension line of the connecting part 53a, that is, the center positions of the two opposite sides of the circuit board 10 respectively. The connection part 53b and the board | substrate press part 52b are arrange | positioned in the position which cross | intersects the line which ties. Thereby, the circuit board 10 can be pressed with good balance on the center line of the circuit board 10.

Further, as shown in FIG. 5, in the present embodiment, the support portion 37 b is arranged at a position corresponding to the substrate pressing portion 52 b provided in the frame-like portion 54. The support portion 37 b is provided so as to protrude from the bottom surface 31 toward the circuit board 10, and has a height in contact with the other surface 12 of the circuit board 10.

As described above, the ring-shaped sealing member 50 includes the frame-shaped portion 54, and the heat-radiating gel 70 is disposed in the frame-shaped portion 54. Thereby, the frame-shaped part 54 functions as a dam, and it becomes possible to regulate the flow of the heat radiating gel 70. Therefore, it is possible to suppress a reduction in the heat dissipation effect due to the heat dissipation gel 70 flowing.

Here, the frame-like portion 54 is connected to the ring-like portion 51 together with the substrate pressing portion 52a by further extending the connecting portion 53b from the substrate pressing portion 52a, but a connecting portion different from the substrate pressing portion 52a is used. It may be provided and connected to the ring-shaped part 51.

(Third embodiment)
A third embodiment of the present disclosure will be described. In this embodiment, the shape of the connection terminal 35 and the ring-shaped seal member 50 is changed with respect to the first embodiment, and the other parts are the same as those in the first embodiment, and therefore different from the first embodiment. Only will be described.

As shown in FIGS. 6 and 7, in the present embodiment, the connection terminal 35 is curved between the bottom surface 31 and the circuit board 10. By providing such a bending portion, the bending portion functions as a spring, and the connection terminal 35 is brought into contact with the circuit board 10 side by a snap fit so that electrical connection with the through hole 13 can be achieved. In such a configuration, the circuit board 10 is pressed to the side opposite to the bottom surface 31 by the connection terminal 35, and the circuit board 10 may be warped or a connection failure between the connection terminal 35 and the through hole 13 may occur. Therefore, it is preferable to press the circuit board 10 toward the bottom surface 31 side.

For this reason, in this embodiment, an area connected to the connection terminal 35 in the circuit board 10 is defined as a terminal arrangement area 15, and one of the press contact portions is configured so as to press the circuit board 10 in the terminal arrangement area 15. A substrate pressing portion 52c is provided. The board pressing part 52c is configured similarly to the board pressing part 52a, and presses the circuit board 10 by being sandwiched between the circuit board 10 and the base plate 40. These board | substrate press parts 52c are connected with the ring-shaped part 51 via the connection part 53c provided separately from the connection part 53a. A connecting groove 32b is also formed at a position corresponding to the connecting portion 53c in the tip of the side wall portion 32, and the connecting portion 53c is disposed in the connecting groove 32b.

Further, as shown in FIG. 7, in the present embodiment, the support portion 37c is disposed at a position corresponding to the substrate pressing portion 52c. The support portion 37 c is provided so as to protrude from the bottom surface 31 toward the circuit board 10, and has a height in contact with the other surface 12 of the circuit board 10.

In this way, the board pressing portion 52c is arranged in the terminal arrangement area 15, and the circuit board 10 is pressed toward the support section 37c in the terminal arrangement area 15. As a result, the circuit board 10 can be pressed toward the support portion 37c against the spring force of the curved portion of the connection terminal 35. Therefore, it is possible to prevent the circuit board 10 from being warped or a connection failure between the connection terminal 35 and the through hole 13 from occurring.

(Fourth embodiment)
A fourth embodiment of the present disclosure will be described. In this embodiment, the shape of the ring-shaped sealing member 50 is changed with respect to the third embodiment, and the other parts are the same as those in the third embodiment. Therefore, only the parts different from the third embodiment will be described. .

As shown in FIGS. 8 and 9, in the present embodiment, the connection portion 53 c is laid out in a frame shape so as to surround the terminal arrangement region 15, and the circuit board 10 is pressed at a plurality of locations around the terminal arrangement region 15. A substrate pressing portion 52c is disposed on the substrate. For example, the plurality of substrate pressing portions 52 c are arranged so as to be point-symmetric with respect to the center of the terminal arrangement region 15.

As described above, the circuit board 10 can be pressed so as to surround the terminal arrangement area 15 by arranging the board pressing portions 52 c at a plurality of locations around the terminal arrangement area 15 and pressing the circuit board 10. For this reason, it is possible to press the terminal arrangement region 15 in a well-balanced manner, to suppress the bias of the pressing force, and to further suppress the warp of the circuit board 10 in the terminal arrangement region 15.

(Fifth embodiment)
A fifth embodiment of the present disclosure will be described. This embodiment can be applied to the case where the shape of the ring-shaped sealing member 50 is provided with the electrolytic capacitor 21 as the electronic component 20 with respect to the first embodiment, and the rest is the same as the first embodiment. Therefore, only different parts from the first embodiment will be described.

As shown in FIGS. 10 and 11, in this embodiment, an electrolytic capacitor 21 is provided as an electronic component 20 on the other surface 12 side of the circuit board 10. As the electrolytic capacitor 21, for example, an aluminum electrolytic capacitor or the like is applied. It is preferable that the electrolytic capacitor 21 is easily affected by vibration and can suppress vibration more than the other electronic components 20 mounted on the circuit board 10.

For this reason, as shown in FIG. 10 and FIG. 11, a substrate pressing portion 52d constituting one of the press contact portions is arranged adjacent to the electrolytic capacitor 21 in the circuit substrate 10, and the circuit substrate 10 is mounted by the substrate pressing portion 52d. Pressing. The board pressing part 52d is configured similarly to the board pressing part 52a, and presses the circuit board 10 by being sandwiched between the circuit board 10 and the base plate 40. Each board | substrate press part 52d is connected via the connection part 53d further extended from the connection part 53a and the board | substrate press part 52a. The connecting portion 53d is connected so as to connect the substrate pressing portions 52a and the connecting portions 53a provided on two opposite sides of the circuit board 10.

Further, as shown in FIG. 11, a support portion 37d is disposed at a position corresponding to the connecting portion 53d. The support portion 37 d is provided so as to protrude from the bottom surface 31 toward the circuit board 10, and has a height in contact with the other surface 12 of the circuit board 10.

As described above, the substrate pressing portion 52d is arranged adjacent to the electrolytic capacitor 21, and the circuit board 10 is pressed toward the support portion 37d around the electrolytic capacitor 21. Thereby, the vibration of the circuit board 10 in the vicinity of the electrolytic capacitor 21 can be suppressed, and the influence of the vibration on the electrolytic capacitor 21 can be suppressed.

In addition, although the electrolytic capacitor 21 was mentioned as an example as the electronic component 20 with a big influence of a vibration, it is the same also about the component with a heavy weight compared with the other electronic component 20 among other electronic components 20, or a weak vibration resistance component. The structure of can be applied.

(Sixth embodiment)
A sixth embodiment of the present disclosure will be described. In the present embodiment, interference between the ring-shaped sealing member 50 and the electronic component 20 can be suppressed as compared with the fifth embodiment, and the other aspects are the same as those in the first embodiment. Only the parts different from the form will be described.

In the fifth embodiment, the connecting portion 53d has a single structure in which each substrate pressing portion 52a and each connecting portion 53a are connected. On the other hand, in the present embodiment, as shown in FIGS. 12 and 13, the connecting portions 53d are extended from the substrate pressing portions 52a and the connecting portions 53a, respectively, so that they are separated. Further, the connecting portion 53a is arranged not on the center position of the

substrate pressing portions

52a and 52d but on the base plate 40 side. That is, the gap between the connecting portion 53a and the circuit board 10 is made larger than in the fifth embodiment.

As described above, the connecting portion 53d extends from each of the substrate pressing portions 52a and each of the connecting portions 53a and is configured so as to be separated from each other, so that the region between the separated connecting portions 53d is also electronic. The component 20 can be arranged. Moreover, the clearance gap between the connection part 53d and the circuit board 10 is taken large, and it can suppress that the connection part 53d and the electronic component 20 interfere by making space free.

(Seventh embodiment)
A seventh embodiment of the present disclosure will be described. In the present embodiment, the circuit board 10 is fixed to the case 30 by the ring-shaped seal member 50 as compared to the first embodiment, and the rest is the same as the first embodiment. Only parts different from the first embodiment will be described.

As shown in FIGS. 14 and 15, in this embodiment, the configuration of the mechanical connection portion 34 used in the first embodiment or the like is changed, and the tip end portion 34 b shown in FIGS. 1 and 2 is eliminated. Only the pedestal 34a is provided. Further, the circuit board 10 has a structure that does not include the fixing hole 14.

On the other hand, the ring-shaped sealing member 50 has a substrate pressing portion 52e that constitutes one of the press contact portions disposed at positions corresponding to the four corners of the circuit board 10, and the substrate pressing portion 52e is interposed via the connecting portion 53e. Are connected to the ring-shaped portion 51. The board pressing part 52d is configured similarly to the board pressing part 52a, and presses the circuit board 10 by being sandwiched between the circuit board 10 and the base plate 40. The side wall 32 of the case 30 is formed with a connecting groove 32d that connects the groove 32a and the accommodating portion 33 at the four corners of the case 30, and the connecting portion 53e is disposed in the connecting groove 32d.

Thus, the circuit board 10 can be fixed to the case 30 by the ring-shaped seal member 50. This eliminates the need for a step of fixing the circuit board 10 to the case 30 by, for example, caulking a part of the case 30, thereby simplifying the manufacturing process.

(Eighth embodiment)
The eighth embodiment of the present disclosure will be described. In the present embodiment, the portion that presses the circuit board 10 is provided on a member different from the ring-shaped seal member 50 as compared to the first embodiment, and the rest is the same as the first embodiment. Only the parts different from the first embodiment will be described.

As shown in FIGS. 16 and 17, in this embodiment, a substrate pressing portion 41 is provided on one surface of the base plate 40 on the circuit substrate 10 side. The substrate pressing portion 41 is integrated with the base plate 40 by being brought into close contact with the base plate 40 via an adhesive or the like. The substrate pressing portion 41 is configured similarly to the substrate pressing portion 52a, and presses the circuit substrate 10 by being sandwiched between the circuit substrate 10 and the base plate 40. Specifically, a protrusion 40b is formed at a position corresponding to the central position of each side of the rectangular circuit board 10 on one surface of the base plate 40 on the side of the circuit board 10, and the protrusion 40b. A substrate pressing portion 41 is disposed at the tip of the substrate.

In such a configuration, when the base plate 40 is fixed to the case 30, the circuit board 10 can be pressed toward the bottom surface 31 by the board pressing portion 41. And since such a structure is realizable by integrating the board | substrate press part 41 with the baseplate 40, it becomes possible to reduce a number of parts, and it becomes possible to aim at reduction of product cost. In this embodiment, an example is shown in which the substrate pressing portion 41 and the base plate 40 are an integrated unit made of an adhesive or the like. This integral is different from the seamless integral described in the first embodiment or the like in that there is a joint. Another difference is whether or not there are parts having different materials. However, it is integrated at least in a pre-assembly prior to product manufacture or assembly with other parts. Therefore, after that, it can be handled as a single component in the manufacturing process, and thus the manufacturing cost and the product cost can be reduced.

(Ninth embodiment)
A ninth embodiment of the present disclosure will be described. In the present embodiment, the portion that presses the circuit board 10 is provided on a member different from the ring-shaped seal member 50 as compared to the first embodiment, and the other portions are the same as in the first embodiment. Only the parts different from the first embodiment will be described.

As shown in FIG. 18 and FIG. 19, in this embodiment, a pressing member 80 constituting an elastic member is provided inside the ring-shaped seal member 50. The pressing member 80 includes a plurality of substrate pressing portions 81 constituting pressure contact portions disposed at the center positions of two sides opposite to the four corners of the circuit board 10, and a frame-shaped connecting portion 82 that connects the substrate pressing portions 81. The ring-shaped sealing member 50 is a separate body.

By providing the pressing member 80 having such a configuration, the circuit board 10 can be fixed to the case 30 at the four corners of the circuit board 10, and the circuit board 10 is attached to the case 30 at the center positions of the two opposite sides of the circuit board 10. Can be pressed. For this reason, the process of fixing the circuit board 10 to the case 30 by, for example, caulking a part of the case 30 is not necessary, and the manufacturing process can be simplified. In the case of such a configuration, the pressing member 80 is a separate component from the ring-shaped sealing member 50, but a member for pressing the circuit board 10 against the case 30 and a member for fixing the circuit board 10 to the case 30 Can also serve. For this reason, it is possible to reduce the number of parts, thereby reducing the product cost.

(10th Embodiment)
A tenth embodiment of the present disclosure will be described. In the present embodiment, the circuit board 10 is pressed and the heat dissipation gel 70 is prevented from flowing with respect to the second embodiment by using a member different from the ring-shaped seal member 50, and the rest is the same as the second embodiment. Therefore, only different parts from the first embodiment will be described.

As shown in FIGS. 20 and 21, in this embodiment, a flow regulating member 90 that constitutes an elastic member is provided inside the ring-shaped seal member 50. The flow restricting member 90 is configured to include a frame-shaped portion 91, a connecting portion 92, and a plurality of substrate pressing portions 93 that constitute a press-contact portion. The frame portion 91 has a frame shape that surrounds the periphery of the heat radiating gel 70, and regulates the flow of the heat radiating gel 70 by surrounding the heat radiating gel 70. The connecting portion 92 extends from the frame-shaped portion 91 to the outside of the frame-shaped portion 91, specifically, toward the center positions of the two opposite sides of the circuit board 10. The substrate pressing portion 93 is provided at the tip of the connecting portion 92 and at an arbitrary position of the frame-shaped portion 91. The board pressing part 93 presses the circuit board 10 by being sandwiched between the circuit board 10 and the base plate 40 in the same manner as the board pressing part 52a.

By providing the flow regulating member 90 having such a configuration, the flow of the heat radiating gel 70 can be regulated and the circuit board 10 can be pressed against the case 30 at the center positions of the two opposite sides of the circuit board 10. Even in such a configuration, the flow restricting member 90 is a separate component from the ring-shaped seal member 50, but restricts the flow of the heat release gel 70 and the member for pressing the circuit board 10 against the case 30. It can also serve as a member for. For this reason, it is possible to reduce the number of parts, thereby reducing the product cost.

(Eleventh embodiment)
An eleventh embodiment of the present disclosure will be described. In the present embodiment, the

substrate pressing portions

52a and 52e are separated from the ring-shaped portion 51 in a state where the base plate 40 is fixed to the case 30 while using the ring-shaped sealing member 50 having the same structure as that of the seventh embodiment. It is a thing. Since other parts of the present embodiment are the same as those of the seventh embodiment, only parts different from the first embodiment will be described.

As shown in FIG. 22 and FIG. 23, in this embodiment, the connecting

portions

53a and 53e are cut so that the

substrate pressing portions

52a and 52e are separated from the ring-shaped portion 51. The

board pressing parts

52a and 52e may be integrated with the ring-shaped sealing member 50, but the

parts

53a and 53e are pulled by the thermal expansion / contraction of the case 30 and the base plate 40 to press the circuit board 10. May shift. On the other hand, by separating the

substrate pressing portions

52a and 52e from the ring-shaped portion 51 as in this embodiment, the circuit board 10 can be used even if the case 30 or the base plate 40 is thermally expanded or contracted. The part which is pressing can be prevented from shifting. Even in this case, since the

substrate pressing portions

52a and 52e are integrated with the ring-shaped seal member 50 in the state before separation, it is possible to reduce the number of parts, thereby reducing the product cost. It becomes possible to plan.

In addition, although cutting | disconnection of the

connection parts

53a and 53e may be performed with a blade etc. like a cutter, you may make it perform simultaneously when fixing the baseplate 40 to the case 30. FIG. For example, the

connection grooves

32b and 32d of the side wall portion 32 are eliminated, and when the base plate 40 is fixed to the case 30, a portion of the front end portion of the side wall portion 32 that is located inside the groove portion 32a is in contact with the case 30. For example, the connecting

portions

53a and 53e can be cut by the portion.

(Other embodiments)
The present disclosure is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims.

For example, the substrate pressing portions 52a to 52e, 81, and 93 serving as the pressure contact portions are spherical, but this is not restrictive. For example, any shape such as a rectangular cross section as shown in FIG. 24A, a rhombus cross section as shown in FIG. 24B, and an elliptical cross section as shown in FIG. good. Here, the substrate pressing portions 52a to 52e, 81, and 93 are taken as an example, but the substrate pressing portion 41 may be similarly configured in any shape.

Further, as shown in FIG. 25, a relief portion 10a constituted by a through hole or the like can be formed in a portion of the circuit board 10 that is pressed by the

board pressing portions

41, 52a to 52e, 81, 93. With such a configuration, part of the

substrate pressing portions

41, 52a to 52e, 81, 93 enters the escape portion 10a, and the compression rate of the

substrate pressing portions

41, 52a to 52e, 81, 93 is reduced. Can do. In FIG. 25, the substrate pressing portion 52a is representatively illustrated, but the same applies to the other

substrate pressing portions

41, 52b to 52e, 81, 93.

Further, when the escape portion 10a is a through hole as described above, a protrusion 37aa that fits with the escape portion 10 can be formed on the support portion 37a of the case 30. With such a configuration, the circuit board 10 and the case 30 can be positioned, and the positional deviation between the circuit board 10 and the case 30 can be prevented.

In each of the above embodiments, the substrate pressing portions 52a to 52e, 81, 93 provided between the circuit board 10 and the base plate 40 and the ring-shaped portion 51 disposed between the case 30 and the base plate 40 are pressed. It is said. The elastic member is configured by connecting at least two pressure contact portions with the connecting portions 53a to 53e, 82, and 92. In this way, by using an elastic member in which at least two pressure contact portions are integrated, the substrate pressing portion need not be provided as a separate component, and the number of components is reduced. However, the structures shown in the above embodiments are merely examples. That is, in addition to between the circuit board 10 and the base plate 40, at least one of the circuit board 10 and the case 30 and the base plate 40 is provided with a pressure contact part, so that at least two pressure contact parts are provided. Any structure may be used as long as they are connected by a connecting portion. Moreover, although the base plate 40, the ring-shaped seal member 50, the pressing member 80, and the flow regulating member 90 are given as examples of integration with other components provided in the electronic device, other components may be used. .

In addition, about each said embodiment, it can be combined suitably between embodiment. For example, a structure in which the ring-shaped seal member 50 includes the substrate pressing portion 52a and a structure in which the base plate 40 includes the substrate pressing portion 41 may be combined. Further, in the configuration in which the circuit board 10 and the case 30 are fixed using the board pressing part 52e instead of the tip part 34b of the mechanical connection part 34, the board pressing part 52c that presses the circuit board 10 in the terminal arrangement region 15 is provided. You may make it prepare.

Although the present disclosure has been described based on the embodiments, it is understood that the present disclosure is not limited to the embodiments and structures. The present disclosure includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, as well as other combinations and forms including only one element, more or less, are within the scope and spirit of the present disclosure.

Claims

A circuit board (10) having a front surface (11) and a back surface (12), and an electronic component (20) mounted on at least one of the front surface and the back surface;
A case (30) in which a housing part (33) for housing the circuit board is formed by opening one surface side;
A lid member (40) having a closed surface facing the surface of the circuit board and one surface of the case, and covering the accommodating portion;
The circuit board is disposed between the surface of the circuit board and the closed surface of the lid member, and further between at least one of the surface of the circuit board and one surface of the case and the closed surface of the lid member. The at least two pressure contact parts (51, 52a to 52e, 81, 93) sandwiched between the two and the connection parts (53a to 53e, 82, 92) for connecting the two pressure contact parts are integrally formed of an elastic body. And an elastic member (50, 80, 90).
As the elastic member, a ring-shaped sealing member (50) having a ring-shaped portion (51) that seals between the case and the lid and constitutes one of the pressure contact portions,
The pressure contact portions (52a to 52e) disposed between the surface of the circuit board and the closed surface of the lid member are connected portions (53a to 53e) extending inward from the ring-shaped portion. 2. The electronic device according to claim 1, wherein the electronic device is integrated with the ring-shaped seal member by being connected to the ring-shaped portion via a pin.
The ring-shaped portion of the ring-shaped seal member is compressed at a higher compression rate than a press-contact portion disposed between the surface of the circuit board and the closing surface of the lid member. The electronic device described.
A connection terminal (35) extending from the bottom surface of the case toward the circuit board is provided,
The through hole (13) provided in the circuit board and the connection terminal are electrically connected,
The pressure contact portion is a region where the connection terminals are disposed in the circuit board. In the terminal arrangement region (15), the pressure contact portion (52c) presses the circuit board, and the inside of the ring-shaped portion 4. The electronic device according to claim 2, wherein the electronic device is integrated with the ring-shaped seal member by being connected to the ring-shaped portion via the connection portion (53 c) extending toward the side.
The electronic device according to claim 4, wherein the pressure contact portion is coupled to the ring-shaped portion via the coupling portion (53c) disposed so as to surround the terminal arrangement region.
The case includes a pedestal (34a) that supports the circuit board,
The pressure contact part (52e) is also provided at a position corresponding to the pedestal part, and the circuit board is fixed to the case by pressing the circuit board against the pedestal part, and corresponds to the pedestal part. The said press-contact part provided in the position to be integrated with the said ring-shaped sealing member through the said connection part (53e) extended inward from the said ring-shaped part. 5. The electronic device according to any one of 5 above.
The case includes a pedestal (34a) that supports the circuit board,
The elastic member includes a pressing member (80) that presses the circuit board against the pedestal portion. The pressing member includes the pressing portion (81), and the pressing portion corresponds to the pedestal portion. 2. The electronic device according to claim 1, wherein the electronic device is disposed at a position, and the pressure contact portion is coupled via a frame-shaped coupling portion (82) disposed in the housing recess.
8. The case according to claim 1, further comprising a support portion (37a to 37d) for supporting a position of the circuit board facing the pressure contact portion. Electronic equipment.
Between the circuit board and the lid member, a heat dissipation gel (70) applied to the electronic component,
A frame-shaped flow regulating member (54, 90) that regulates the flow of the heat radiating gel by surrounding the heat radiating gel,
The pressure contact portions (52a, 93) are connected to the flow restricting member via the connecting portions (53b, 92) extending outward from the flow restricting member. The electronic device according to claim 1, which is integrated.
The electronic device according to any one of claims 1 to 9, wherein the pressure contact portion (52d) is disposed adjacent to the electronic component.
A circuit board (10) having a front surface (11) and a back surface (12), and an electronic component (20) mounted on at least one of the front surface and the back surface;
A case (30) in which a housing part (33) for housing the circuit board is formed by opening one surface side;
A lid member (40) having a closed surface facing the surface of the circuit board and one surface of the case, and covering the accommodating portion;
On one side of the case, a ring-shaped sealing member disposed around the outer periphery of the circuit board and sealed between the case and the lid member by being sandwiched between the case and the lid member ( 50),
Between the circuit board and the lid member, a heat dissipation gel (70) applied to the electronic component,
The ring-shaped seal member includes a flow regulating member that extends on the surface of the circuit board toward the inside of the ring-shaped seal member, and regulates the flow of the heat-radiating gel by surrounding the heat-radiating gel. (54) The electronic device provided with.
A circuit board (10) having a front surface (11) and a back surface (12), and an electronic component (20) mounted on at least one of the front surface and the back surface;
A case (30) in which a housing part (33) for housing the circuit board is formed by opening one surface side;
A lid member (40) having a closed surface facing the surface of the circuit board and one surface of the case, and covering the accommodating portion;
An electronic device that is integrated with the lid material by being disposed on the closing surface side of the lid material, and includes a pressure contact portion (41) sandwiched between the lid material and the circuit board. apparatus.
A circuit board (10) having a front surface (11) and a back surface (12), and an electronic component (20) mounted on at least one of the front surface and the back surface;
A case (30) in which a housing part (33) for housing the circuit board is formed by opening one surface side;
A lid member (40) having a closed surface facing the surface of the circuit board and one surface of the case, and covering the accommodating portion;
On one side of the case, a ring-shaped sealing member disposed around the outer periphery of the circuit board and sealed between the case and the lid member by being sandwiched between the case and the lid member ( 50), and a method for manufacturing an electronic device,
As the ring-shaped seal member, a ring-shaped portion (51) sandwiched between the lid member and a side wall portion of the case, and a connecting portion (53a) extending inward from the ring-shaped portion. And a pressure contact part (52a) for pressing the circuit board by being connected to the connection part and being sandwiched between the lid member and the circuit board,
In the state where the ring-shaped seal member is disposed between the side wall portion and the lid member in the case, the lid member is fixed to the case and the connecting portion is cut, and the ring-shaped portion cuts the case. A method of manufacturing an electronic device in which the circuit board is pressed by the pressure contact portion while sealing between the cover and the lid.