CN112934741A - Diode screening method and system - Google Patents
Diode screening method and system Download PDFInfo
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- CN112934741A CN112934741A CN202110108205.1A CN202110108205A CN112934741A CN 112934741 A CN112934741 A CN 112934741A CN 202110108205 A CN202110108205 A CN 202110108205A CN 112934741 A CN112934741 A CN 112934741A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
Abstract
The invention discloses a diode screening method and a diode screening system, which comprise the following steps: step S1: detecting a piece to be detected to form a characteristic curve diagram; step S2: capturing the characteristic curve graph in the step S1, and transmitting the characteristic curve graph to the detection system; step S3: and inputting a preset value into the detection system, and comparing the parameter information in the characteristic curve graph with the preset value by the detection system to complete screening. The invention also discloses a system for realizing the method, and solves the technical problem of inaccurate detection of the diode in the prior art.
Description
Technical Field
The invention relates to the technical field of diode screening, in particular to a diode screening method and system.
Background
The existing diode characteristic curve is tested and screened by manually using a transistor graphic instrument, the manual speed is low, the manual work is consumed, the operation cost of a company is increased, and the manual test is easy to misjudge, so that the defective products flow out, and the product quality is influenced. The customer specifically requests tube or package testing. The manual screening cost is doubled.
Disclosure of Invention
The invention aims to provide a diode screening method and a diode screening system, which solve the technical problem that manual screening of diodes in the prior art is prone to errors.
The embodiment of the application discloses a diode screening method, which comprises the following steps:
step S1: detecting a piece to be detected to form a characteristic curve diagram;
step S2: capturing the characteristic curve graph in the step S1, and transmitting the characteristic curve graph to the detection system;
step S3: and inputting a preset value in the detection system, and comparing the parameter information in the characteristic curve graph with the preset value to complete screening.
The detection machine detects the to-be-detected piece to form a characteristic curve graph, and specific software is used for detection and comparison to complete screening, so that the manual judgment time is greatly reduced, and the judgment accuracy is improved.
On the basis of the technical scheme, the embodiment of the application can be further improved as follows:
further, the detecting in step S1 is to detect the to-be-detected object by using a transistor graphic instrument, and the capturing in step S2 includes: adopt the camera to shoot the screen of transistor graphic display appearance, the camera is the camera that can zoom, adopts this step's beneficial effect to be through making a video recording in picture information transfer to industrial computer, the follow-up comparison of being convenient for.
Furthermore, the detection system is an industrial computer comprising CCD detection software or an industrial computer comprising VIS software, and the beneficial effect of the step is that the screening and comparison are completed through specific software.
Further, the preset value is one or more of length L, included angle alpha, diameter R and voltage VB.
Further, the specific steps of the comparison in step S3 to complete the screening are: and (3) comparing the reverse curve bifurcation value L ' in the characteristic curve chart read by the detection system with L after the reading is finished, if the L ' is less than or equal to L, judging that the product to be detected is a good product, and if the L ' is more than L, judging that the product to be detected is a waste product.
Further, the specific steps of the comparison in step S3 to complete the screening are: and comparing the alpha ' with the alpha ' after the characteristic angle alpha ' of the reverse curve in the characteristic curve chart read by the detection system is read, if the alpha ' is less than or equal to the alpha, judging that the product to be detected is a good product, and if the alpha ' is more than the alpha, judging that the product to be detected is a waste product.
Further, the specific steps of the comparison in step S3 to complete the screening are: and (3) comparing R 'with R after the diameter R' of the inscribed circle of the reverse curve in the characteristic curve graph read by the detection system is read, if R 'is less than or equal to R, judging that the product to be detected is a good product, and if R' is more than R, judging that the product to be detected is a waste product.
Further, the specific steps of the comparison in step S3 to complete the screening are: and (3) detecting the reverse breakdown voltage VB 'in the characteristic curve chart read by the system, comparing VB' with VB after the reading is finished, if VB 'is less than or equal to VB, judging that the product to be detected is a waste product, and if VB' is greater than VB, judging that the product to be detected is a good product.
A system of the diode screening method is provided.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. according to the embodiment of the application, the characteristic curve graph is shot and then sent to a specific industrial computer for data comparison and judgment, so that good products or waste products are distinguished, the process of manual judgment is reduced, and the judgment accuracy and the screening efficiency are improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a diode screening method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a characteristic graph according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention pertains, and the characteristic profile is specifically a diode reverse characteristic profile.
The embodiment of the application is particularly applied to the field of diode testing and is matched with an integrating machine to judge whether a diode product is qualified or not, when the diode product runs on the integrating machine (containing a PLC), the diode product reaches the embodiment of the application, the judgment of good products and waste products is completed through the embodiment of the application, then the integrating machine receives a signal of the embodiment of the application, the waste products are removed, the bad products of characteristic curves of the diodes can be effectively removed, the product quality can be improved, and the requirements of customers are met.
Example 1:
the embodiment of the application discloses a diode screening method, which comprises the following steps:
step S1: detecting a piece to be detected to form a characteristic curve diagram;
step S2: capturing the characteristic curve graph in the step S1, and transmitting the characteristic curve graph to the detection system;
step S3: and inputting a preset value in the detection system, and comparing the parameter information in the characteristic curve graph with the preset value to complete screening.
Specifically, in the embodiment of the present application, step S1 is to detect the to-be-detected object by using a transistor graphic instrument, and the capturing in step S2 includes: adopt the camera to shoot the screen of transistor graphic display appearance, the camera is the camera that can zoom, adopts this step's beneficial effect to be through making a video recording in picture information transfer to industrial computer, the follow-up comparison of being convenient for.
The detection system is an industrial computer comprising CCD detection software or an industrial computer comprising VIS software, and the CCD detection software or the VIS software is the existing software and can digitize pictures so as to facilitate subsequent comparison.
Specifically, the preset value is a length L. The specific steps of the comparison in step S3 to complete the screening are: and (3) comparing the reverse curve bifurcation value L ' in the characteristic curve chart read by the detection system with L after the reading is finished, if the L ' is less than or equal to L, judging that the product to be detected is a good product, and if the L ' is more than L, judging that the product to be detected is a waste product. Wherein, the reverse curve bifurcation value is the length of the overlapped part of the two characteristic curve graphs.
The embodiment of the application also discloses a system for implementing the diode screening method.
Example 2:
step S3 is different from embodiment 1.
Specifically, the preset value is an included angle α. The specific steps of the comparison in step S3 to complete the screening are: and comparing the alpha ' with the alpha ' after the characteristic angle alpha ' of the reverse curve in the characteristic curve chart read by the detection system is read, if the alpha ' is less than or equal to the alpha, judging that the product to be detected is a good product, and if the alpha ' is more than the alpha, judging that the product to be detected is a waste product. And the reverse curve characteristic angle is the maximum included angle intersected by the tangent lines of the characteristic curve graph.
The embodiment of the application also discloses a system for implementing the diode screening method.
Example 3:
step S3 is different from embodiment 1.
In particular, the preset value is the diameter R. The specific steps of the comparison in step S3 to complete the screening are: and (3) comparing R 'with R after the diameter R' of the inscribed circle of the reverse curve in the characteristic curve graph read by the detection system is read, if R 'is less than or equal to R, judging that the product to be detected is a good product, and if R' is more than R, judging that the product to be detected is a waste product. Wherein the reverse curve inscribed circle is an inscribed circle with the largest diameter of the bending parts of the two characteristic curves.
The embodiment of the application also discloses a system for implementing the diode screening method.
Example 4:
step S3 is different from embodiment 1.
Specifically, the preset value is a voltage VB, and the specific steps of comparing in step S3 to complete the screening are as follows: and (3) detecting the reverse breakdown voltage VB 'in the characteristic curve chart read by the system, comparing VB' with VB after the reading is finished, if VB 'is less than or equal to VB, judging that the product to be detected is a waste product, and if VB' is greater than VB, judging that the product to be detected is a good product.
A system of the diode screening method is provided.
The embodiment of the application also discloses a system for implementing the diode screening method.
Example 5:
step S3 is different from embodiment 1.
Specifically, the preset value comprises two of length L, included angle alpha, diameter R and voltage VB; referring to the embodiment 1-4, only when the two detection results are good, the product to be detected is finally judged to be good, otherwise, the product is a waste product.
Example 6:
step S3 is different from embodiment 1.
Specifically, the preset values include three of length L, included angle α, diameter R and voltage VB; referring to the embodiment 1-4, only when the three detection results are all good, the product to be detected is finally judged to be good, otherwise, the product is a waste product.
Example 7:
step S3 is different from embodiment 1.
Specifically, the preset values comprise a length L, an included angle alpha, a diameter R and a voltage VB; referring to the embodiment 1-4, only when the four detection results are good, the product to be detected is finally judged to be good, otherwise, the product is a waste product.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (9)
1. A diode screening method is characterized by comprising the following steps:
step S1: detecting a piece to be detected to form a characteristic curve diagram;
step S2: capturing the characteristic curve graph in the step S1, and transmitting the characteristic curve graph to the detection system;
step S3: and inputting a preset value into the detection system, and comparing the parameter information in the characteristic curve graph with the preset value by the detection system to complete screening.
2. The diode screening method of claim 1, wherein the step S1 of detecting is to detect the to-be-detected element by using a transistor graphic instrument, and the step S2 of capturing comprises: and shooting a screen of the transistor graphic instrument by adopting a camera, wherein the camera is a zoom camera.
3. The diode screening method of claim 1, wherein the inspection system is an industrial computer including CCD inspection software or an industrial computer including VIS software.
4. The diode screening method of claim 3, wherein the preset values are one or more of length L, included angle α, diameter R and voltage VB.
5. The diode screening method of claim 4, wherein the step of comparing to complete the screening in step S3 comprises the following steps: and (3) comparing the reverse curve bifurcation value L ' in the characteristic curve chart read by the detection system with L after the reading is finished, if the L ' is less than or equal to L, judging that the product to be detected is a good product, and if the L ' is more than L, judging that the product to be detected is a waste product.
6. The diode screening method of claim 4, wherein the step of comparing to complete the screening in step S3 comprises the following steps: and comparing the alpha ' with the alpha ' after the characteristic angle alpha ' of the reverse curve in the characteristic curve chart read by the detection system is read, if the alpha ' is less than or equal to the alpha, judging that the product to be detected is a good product, and if the alpha ' is more than the alpha, judging that the product to be detected is a waste product.
7. The diode screening method of claim 4, wherein the step of comparing to complete the screening in step S3 comprises the following steps: and (3) comparing R 'with R after the diameter R' of the inscribed circle of the reverse curve in the characteristic curve graph read by the detection system is read, if R 'is less than or equal to R, judging that the product to be detected is a good product, and if R' is more than R, judging that the product to be detected is a waste product.
8. The diode screening method of claim 4, wherein the step of comparing to complete the screening in step S3 comprises the following steps: and (3) detecting the reverse breakdown voltage VB 'in the characteristic curve chart read by the system, comparing VB' with VB after the reading is finished, if VB 'is less than or equal to VB, judging that the product to be detected is a waste product, and if VB' is greater than VB, judging that the product to be detected is a good product.
9. A system for performing the diode screening method of any one of claims 1-8.
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CN110223269A (en) * | 2019-04-24 | 2019-09-10 | 深圳市派科斯科技有限公司 | A kind of FPC defect inspection method and device |
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DE1488162A1 (en) * | 1963-07-03 | 1968-12-12 | Gen Electric | Control circuit for alternating current |
US3545611A (en) * | 1969-01-15 | 1970-12-08 | Robert G Husome | Rebound type checkweigher |
CN104267063A (en) * | 2014-10-10 | 2015-01-07 | 国家电网公司 | Low-value insulator detection method based on infrared thermography |
CN104408916A (en) * | 2014-10-31 | 2015-03-11 | 重庆大学 | Road segment speed and flow data-based road traffic operating state evaluation method |
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