CN112917715A - Quartz product cutting device of infiltration formula - Google Patents
Quartz product cutting device of infiltration formula Download PDFInfo
- Publication number
- CN112917715A CN112917715A CN202110089661.6A CN202110089661A CN112917715A CN 112917715 A CN112917715 A CN 112917715A CN 202110089661 A CN202110089661 A CN 202110089661A CN 112917715 A CN112917715 A CN 112917715A
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- Prior art keywords
- cutting
- moving platform
- wire saw
- quartz product
- diamond wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
Abstract
The invention discloses an immersion type quartz product cutting device which comprises a base, a cutting fluid disc, a cutting mechanism, a cooling and filtering device and a diamond wire saw, wherein a moving platform is slidably arranged on the base, a groove is formed in the cutting fluid disc, the cooling and filtering device and the cutting fluid disc are connected through a liquid inlet pipe and a liquid outlet pipe, the cooling and filtering device comprises a box body, a centrifugal machine, a filtering machine and a cooling device, the cutting fluid disc is arranged on the moving platform, a rotary table driving device connected with a rotary table is arranged on the moving platform, a supporting frame is arranged on the base, rotatable rotating wheels are arranged on two sides of the supporting frame, the diamond wire saw is in a closed ring shape, two ends of the ring shape are wound on the two rotating wheels, the cutting of a quartz product can be controlled by controlling the rotation of the rotating wheels and the moving condition. The invention has the advantages of smooth cutting surface, no edge breakage and broken layer, high cutting efficiency and yield, good chip removal and cooling effect and the like.
Description
[ technical field ] A method for producing a semiconductor device
The invention belongs to the technical field of cutting devices, and particularly relates to an immersion type quartz product cutting device.
[ background of the invention ]
Most of existing quartz product cutting equipment adopts a saw blade cutting structure, and saw blade cutting belongs to a rigid cutting technology. The saw teeth used for cutting the saw blade are relatively large, the cutting line speed of the saw blade is generally 25-35 m/s in the cutting process, the knife gap is about 3mm, edge breakage is serious, the cutting surface roughness of a quartz product is large, a broken layer is more, the grinding workload of the follow-up quartz product is increased easily, and the processing efficiency and the surface quality of the quartz product are affected. The cutting saw blade produces heat easily during the cutting, and it is little to adopt the cutting fluid to spray the mode and can make area of contact between cutting fluid and the cutting saw blade, and the cooling effect is relatively poor.
[ summary of the invention ]
The invention aims to solve the problems in the prior art, and provides an immersion type quartz product cutting device which can enable the surface of a cut quartz product to be flat without edge breakage and broken layers, and is high in cutting efficiency and yield, and good in chip removal and cooling effects.
In order to achieve the purpose, the invention provides an immersion type quartz product cutting device which comprises a base, a moving platform, a cutting fluid disc, a rotary table, a cutting mechanism, a cooling and filtering device and a diamond wire saw, wherein the base is provided with a moving platform driving device for driving and controlling the moving platform to linearly move, the moving platform is slidably arranged on the base, the cutting fluid disc is provided with a groove, a liquid inlet and a liquid outlet, cutting fluid is arranged in the groove, the cooling and filtering device is respectively connected with the liquid inlet and the liquid outlet through a liquid inlet pipe and a liquid outlet pipe, the cooling and filtering device comprises a box body, a centrifugal machine, a filter and a cooling device, the centrifugal machine and the cooling device are respectively connected with the liquid outlet pipe and the liquid inlet pipe, the centrifugal machine, the filter and the cooling device are sequentially connected, the liquid disc is arranged on the moving platform, be equipped with revolving stage drive arrangement on the moving platform, placed the quartz product on the revolving stage, the revolving stage is located the recess and the revolving stage bottom links to each other with revolving stage drive arrangement, install the support frame on the base, the support arm is installed to the support frame both sides, and connecting portion are installed to the front end of support arm, and the connecting portion lower extreme all rotates and installs the runner, one of them the connecting portion on install runner drive arrangement, the diamond wire saw is the annular both ends of sealing annular and diamond wire saw and winds on the runner, through the rotation of control runner, the cutting of the steerable quartz product of moving condition of moving platform, the liquid level of cutting fluid is not less than the position of diamond wire saw cutting quartz product, moving platform drive arrangement, runner drive arrangement, revolving stage drive arrangement, centrifuge, cooling device's behavior all adopts PLC to.
Preferably, the base is provided with a screw rod and two guide rails, the bottom of the moving platform is slidably mounted on the two guide rails through a sliding block, the moving platform driving device comprises a servo motor, the bottom of the moving platform is provided with a nut seat, the nut seat is connected with the screw rod in a matched mode, the output end of the servo motor is connected with the screw rod through a coupler, and the working condition of the servo motor is controlled through a PLC.
Preferably, the diamond wire saw comprises a cutting wire, diamond particles protruding outwards are embedded in the outer edge surface of the cutting wire, a nickel film is plated on the outer side of the cutting wire in an electroplating mode, the exposed diamond particles and the outer edge surface of the cutting wire can be wrapped by the nickel film, the contact area between the diamond wire saw and a quartz product is small, the cutting mode of the diamond wire saw is flexible cutting in a friction mode, and the protruding diamond particles can be effectively discharged with chips while cutting.
Preferably, the size of the diamond particles is 140-170 meshes, and 40-60 diamond particles are embedded on the outer edge surface of the cutting line in unit length of each millimeter, so that chips can be better removed during cutting, and the influence on the surface cutting quality of a quartz product due to insufficient chip removal is prevented.
Preferably, the diamond wire saw cuts the quartz product, the generated cutting seam does not exceed 0.7mm, and the cutting seam is small.
Preferably, the box body is provided with an opening, and the opening is hinged with a sealing door, so that internal parts can be maintained, replaced and cleaned conveniently.
Preferably, the cutting fluid disc extends upwards to form a supporting part, a through hole is formed in the supporting part and communicated with the bottom end of the cutting fluid disc, and the bottom of the rotary table is rotatably mounted on the supporting part to prevent the cutting fluid in the groove from entering the rotary table driving device.
Preferably, the turntable driving device comprises a driving motor, the output end of the driving motor penetrates through the through hole in the supporting part and then is connected with the bottom of the turntable, and a sealing element is arranged between the output end of the driving motor and the inner wall of the through hole, so that the sealing property between the output end of the driving motor and the supporting part is good, and the turntable can rotate smoothly.
Preferably, the rotating direction of the diamond wire saw is opposite to that of the rotary table, and the rotating speed of the diamond wire saw is controlled to be 40-60 m/s, so that the cutting efficiency and the service life of the diamond wire saw are high, and the cutting uniformity and the cutting surface flatness are guaranteed.
The invention has the beneficial effects that: according to the invention, the cutting fluid disc is arranged on the moving platform, the groove for containing the cutting fluid is arranged in the cutting fluid disc, the cutting fluid submerges the cutting position of the diamond wire saw, the contact area between the cutting fluid and the cutting position of the diamond wire saw can be effectively increased by the cutting fluid soaking mode, the cooling effect is improved, and the cutting chips in the cutting seam can be effectively discharged along with the flowing of the cutting fluid, so that the chip removal rate is improved; the quartz product is cut by the double-rotor-driven annular diamond wire saw, the rotating directions of the rotary table and the diamond wire saw are opposite, so that the cutting can be efficiently carried out, the diameter of the diamond wire saw is small, the flexible cutting can be carried out, the cutting gap is small, and the edge breakage and the crushing layer are not easy to generate; the cooling and filtering device can be used for efficiently cooling and filtering the cutting fluid, so that the cutting fluid in the groove is kept within a certain temperature range, the cutting fluid can be guaranteed to effectively cool the cutting position of the diamond wire saw, the content of chips in the cutting fluid is reduced, and the chips are guaranteed not to damage the cutting surface in the cutting process; the device overall control precision is high, adopts PLC control to make things convenient for operating personnel to carry out parameter adjustment according to the demand and makes the better demand that satisfies of quartzy product cutting, and cutting efficiency and yields are high.
The features and advantages of the present invention will be described in detail by embodiments in conjunction with the accompanying drawings.
[ description of the drawings ]
FIG. 1 is a schematic structural diagram of one embodiment of the present invention;
FIG. 2 is a top view of one embodiment of the present invention;
FIG. 3 is a partial schematic view of one embodiment of the present invention;
FIG. 4 is a schematic longitudinal cross-sectional view of a diamond wire saw according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of the operation of a cooling filter assembly and cutting fluid pan according to one embodiment of the present invention;
FIG. 6 is a schematic partial structure diagram of an embodiment of the present invention;
fig. 7 is an enlarged view of portion a of fig. 6 according to an embodiment of the present invention.
In the figure: 1-base, 2-moving platform, 3-cutting fluid disc, 4-rotary table, 5-cooling filtering device, 6-support frame, 7-diamond wire saw, 8-quartz product, 11-guide rail, 21-driving motor, 31-groove, 51-liquid inlet pipe, 52-liquid outlet pipe, 53-centrifugal machine, 54-filter, 55-cooling device, 61-support arm, 62-connecting part, 63-rotary wheel, 71-cutting line, 72-diamond particle and 73-nickel film.
[ detailed description ] embodiments
Referring to fig. 1, 2, 3 and 5, this embodiment provides an immersion type quartz product cutting device, which includes a base 1, a moving platform 2, a cutting fluid disc 3, a turntable 4, a cutting mechanism, a cooling and filtering device 5 and a diamond wire saw 7, wherein the base 1 is provided with a moving platform driving device for driving and controlling the moving platform 2 to move linearly, the moving platform 2 is slidably mounted on the base 1, the cutting fluid disc 3 is provided with a groove 31, a liquid inlet and a liquid outlet, cutting fluid is arranged in the groove 31, the cooling and filtering device 5 is connected with the liquid inlet and the liquid outlet through a liquid inlet pipe 51 and a liquid outlet pipe 52, the cooling and filtering device 5 includes a box body, a centrifuge 53, a filter 54 and a cooling device 55 mounted inside the box body, the centrifuge 53 and the cooling device 55 are respectively connected with the liquid outlet pipe 52 and the liquid inlet pipe 51, the centrifuge 53, the filter 54 and the cooling device 55 are sequentially connected to centrifuge the cutting fluid flowing into the box, Filtration and cooling treatment, the cutting fluid plate 3 is installed on the moving platform 2, a turntable driving device is arranged on the moving platform 2, a quartz product 8 is placed on the turntable 4, the turntable 4 is located in the groove 31, the bottom of the turntable 4 is connected with the turntable driving device, a support frame 6 is installed on the base 1, support arms 61 are installed on the left side and the right side of the support frame 6, a connecting part 62 is installed at the front end of each support arm 61, a rotating wheel 63 is installed at the lower end of each connecting part 62 in a rotating mode, a rotating wheel driving device is installed on the connecting part 62 on the right side, the diamond wire saw 7 is in a closed annular shape, two annular ends of the diamond wire saw 7 are wound on the rotating wheel 63, the cutting condition of the diamond wire saw 7 on the quartz product 8 can be controlled by controlling the rotating of the rotating wheel 63 and the moving condition of, Runner drive arrangement, revolving stage drive arrangement, centrifuge 53, cooling device 55's behavior all adopts PLC to control, runner drive arrangement includes runner driving motor, runner driving motor's output and runner 63 of below link to each other, wherein, quartzy product 8 is the cube shape, the thickness of quartzy product 8 is 20 ~ 25mm, the thickness control of cutting one deck quartzy product 8 at every turn is at 5mm, the cutting fluid is water, install electric putter on the base 1, electric putter's push rod and support frame 6 link to each other and control reciprocating of support frame 6, the feed speed of moving platform 2 is 5mm/h during the cutting.
Further, be equipped with lead screw, two guide rails 11 on the base 1, the lead screw is located between two guide rails 11, and 2 bottoms of moving platform are with slider slidable mounting on two guide rails 11, and moving platform drive arrangement includes servo motor, and 2 bottoms of moving platform are equipped with the nut seat, and the cooperation is connected between nut seat and the lead screw, link to each other with the shaft coupling between servo motor's the output and the lead screw, servo motor's operating condition adopts PLC to control.
Further, referring to fig. 4, the diamond wire saw 7 includes a cutting wire 71, wherein diamond particles 72 protruding outward are embedded on an outer peripheral surface of the cutting wire 71 and a nickel film 73 is plated on an outer side of the cutting wire 71 by means of electroplating, the nickel film 73 can cover the exposed diamond particles 72 and the outer peripheral surface of the cutting wire 71, the diamond particles 72 have a regular shape or an irregular shape with a tip, and the regular shape includes a triangle and a trapezoid.
Furthermore, the diameter of the diamond particles 72 is 140-170 meshes, and 40-60 diamond particles 72 are embedded on the outer edge surface of the cutting line 71 in unit length of each millimeter.
Further, the diamond wire saw 7 cuts the quartz product 8 with a kerf not exceeding 0.7 mm.
Furthermore, an opening is formed in the box body, and a sealing door is hinged to the opening.
Further, referring to fig. 6 and 7, the cutting fluid disk 3 extends upward to form a support portion 32, a through hole is formed in the support portion 32, the through hole is communicated with the bottom end of the cutting fluid disk 3, a plurality of balls 33 are mounted at the upper end of the support portion 32 in a matched manner, an annular rolling groove is formed in the bottom of the turntable 4, the bottom of the turntable 4 is rotatably mounted on the support portion 32, the balls 33 at the upper end of the support portion 32 can rotate along the annular rolling groove, and the height of the support portion 32 is lower than the depth of the.
Further, the turntable driving device comprises a driving motor 21, an output end of the driving motor 21 penetrates through a through hole in the supporting portion 32 and then is connected with the bottom of the turntable 4, and a sealing member is arranged between the output end of the driving motor 21 and the inner wall of the through hole.
Further, the rotating direction of the diamond wire saw 7 is opposite to that of the rotary table 4, and the rotating speed of the diamond wire saw 7 is controlled to be 40-60 m/s.
The working process of the embodiment is as follows:
in the working process of the embodiment, a quartz product 8 is placed on a rotary table 4, cooling liquid is added into a groove 31 until the cooling liquid submerges the quartz product 8, a servo motor on a moving platform driving device is started, the servo motor is started to drive a screw rod to rotate, the screw rod is interacted with threads on a nut seat after rotating to drive a moving platform 2 and a cutting liquid disc 3 to synchronously and horizontally move along a guide rail 11, so that one corner of the quartz product 8 gradually approaches to a diamond wire saw 7, a rotating wheel driving motor on the rotating wheel driving device is started, the rotating wheel driving motor is started to drive a rotating wheel 63 on the right side to rotate, the rotating wheel 63 drives a rotating wheel 63 on the left side to rotate through an annular diamond wire saw 7, so that the diamond wire saw 7 rotates at a high speed, the driving motor 21 on the rotating driving device is started, the rotary table is driven to rotate 4 after the driving, cutting scraps generated by cutting can be taken out by the diamond particles 72, because the cutting fluid submerges the quartz product 8, on one hand, the diamond wire saw 7 at the cutting joint can be effectively cooled, on the other hand, the cutting scraps can be conveniently discharged, the smooth cutting is ensured, no edge breakage and broken layer are generated on the cutting surface of the quartz product, the cutting of a layer of quartz product 8 can be stably finished through the horizontal feeding motion of the moving platform 2, after the cutting of the layer is finished, the support frame 6 can be driven to descend by 5mm through the electric push rod, after the support frame 6 descends, the rotating wheel 63 and the diamond wire saw 7 are driven to descend synchronously, and then, the quartz product 8 can be cut again by repeating the operations;
wherein, the cutting fluid containing the cutting chips flows to the cooling and filtering device 5 through the liquid outlet pipe 52, the centrifuge 53 and the filter 54 in the cooling and filtering device 5, the cooling device 55 can carry out centrifugal scattering, filtering and cooling treatment on the cutting fluid flowing into the cooling and filtering device 5 in sequence, the cutting fluid treated by the cooling and filtering device 5 flows into the groove 31 again after passing through the fluid inlet pipe 51, the recycling rate of the cutting fluid is improved, the cutting fluid is guaranteed to be kept in a certain temperature range so as to effectively cool the cutting position of the diamond wire saw 7, the content of chips in the cutting fluid in the groove 31 is reduced, the influence on the cutting surface quality of the quartz product 8 due to insufficient chip removal is avoided, high-precision control and programmable operation can be guaranteed by integrally adopting PLC control, the rotating speed of the diamond wire saw 7 is controlled at 45m/s when the cutting fluid just enters the quartz product, and the rotating speed of the diamond wire saw 7 is gradually increased along with the deep cutting and finally stabilized at 60 m/s.
The above embodiments are illustrative of the present invention, and are not intended to limit the present invention, and any simple modifications of the present invention are within the scope of the present invention.
Claims (9)
1. The utility model provides a quartz product cutting device of infiltration formula, includes base, moving platform, installs the moving platform drive arrangement that drive control moving platform linear motion used on the base, but moving platform slidable mounting is on the base its characterized in that: the cutting fluid disc is provided with a groove, a liquid inlet and a liquid outlet, cutting fluid is arranged in the groove, the cutting fluid disc is connected with the liquid inlet and the liquid outlet through a liquid inlet pipe and a liquid outlet pipe respectively, the cooling filter device comprises a box body, a centrifugal machine, a filter and a cooling device, the centrifugal machine, the filter and the cooling device are arranged in the box body and are connected with the liquid outlet pipe and the liquid inlet pipe respectively, the centrifugal machine, the filter and the cooling device are sequentially connected, the cutting fluid disc is arranged on a movable platform, a rotary table driving device is arranged on the movable platform, quartz products are placed on the rotary table, the rotary table is positioned in the groove, the bottom of the rotary table is connected with the rotary table driving device, a support frame is arranged on the base, support arms are arranged on two sides of the support frame, and a connecting part is, the connecting portion lower extreme all rotates and installs the runner, one of them the connecting portion on install runner drive arrangement, the diamond wire saw is the annular both ends of sealing annular and diamond wire saw and winds on the runner, through the rotation of control runner, the cutting of the steerable quartz products of moving condition of moving platform, the liquid level height of cutting fluid is not less than the position of diamond wire saw cutting quartz products, moving platform drive arrangement, runner drive arrangement, revolving stage drive arrangement, centrifuge, cooling device's behavior all adopts PLC to control.
2. The immersion type quartz product cutting apparatus as claimed in claim 1, wherein: the base is provided with a lead screw and two guide rails, the bottom of the moving platform is slidably mounted on the two guide rails through a sliding block, the moving platform driving device comprises a servo motor, the bottom of the moving platform is provided with a nut seat, the nut seat and the lead screw are connected in a matched mode, the output end of the servo motor is connected with the lead screw through a coupler, and the working condition of the servo motor is controlled through a PLC.
3. The immersion type quartz product cutting apparatus as claimed in claim 1, wherein: the diamond wire saw comprises a cutting line, diamond particles protruding outwards are embedded in the outer edge surface of the cutting line, a nickel film is plated on the outer side of the cutting line in an electroplating mode, and the exposed diamond particles and the outer edge surface of the cutting line can be wrapped by the nickel film.
4. The immersion type quartz product cutting apparatus as claimed in claim 3, wherein: the size of the diamond particles is 140-170 meshes, and 40-60 diamond particles are embedded on the outer edge surface of each millimeter of unit length of the cutting line.
5. The immersion type quartz product cutting apparatus as claimed in claim 3, wherein: the cutting seam generated when the diamond wire saw cuts the quartz product is not more than 0.7 mm.
6. The immersion type quartz product cutting apparatus as claimed in claim 1, wherein: the box body is provided with an opening, and the opening is hinged with a sealing door.
7. The immersion type quartz product cutting apparatus as claimed in claim 1, wherein: the cutting fluid disc extends upwards to form a supporting part, a through hole is formed in the supporting part and communicated with the bottom end of the cutting fluid disc, and the bottom of the rotary table is rotatably installed on the supporting part.
8. The immersion type quartz product cutting apparatus as claimed in claim 7, wherein: the turntable driving device comprises a driving motor, the output end of the driving motor penetrates through the through hole in the supporting part and then is connected with the bottom of the turntable, and a sealing element is arranged between the output end of the driving motor and the inner wall of the through hole.
9. The immersion type quartz product cutting apparatus as claimed in claim 1, wherein: the rotating direction of the diamond wire saw is opposite to that of the rotary table, and the rotating speed of the diamond wire saw is controlled to be 40-60 m/s.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110089661.6A CN112917715A (en) | 2021-01-22 | 2021-01-22 | Quartz product cutting device of infiltration formula |
| PCT/CN2021/076902 WO2022156018A1 (en) | 2021-01-22 | 2021-02-19 | Immersion quartz-product cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110089661.6A CN112917715A (en) | 2021-01-22 | 2021-01-22 | Quartz product cutting device of infiltration formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112917715A true CN112917715A (en) | 2021-06-08 |
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ID=76164952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110089661.6A Pending CN112917715A (en) | 2021-01-22 | 2021-01-22 | Quartz product cutting device of infiltration formula |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112917715A (en) |
| WO (1) | WO2022156018A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114147288A (en) * | 2021-12-13 | 2022-03-08 | 上海德瀛睿创半导体科技有限公司 | Wire saw machine and wire saw system |
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| CN109227976A (en) * | 2018-10-29 | 2019-01-18 | 江苏科技大学 | A kind of adaptive diamond fretsaw cutting equipment |
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| JP5151851B2 (en) * | 2008-09-19 | 2013-02-27 | 信越半導体株式会社 | Band saw cutting device and ingot cutting method |
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| CN104890036A (en) * | 2015-06-29 | 2015-09-09 | 泰州市晨虹数控设备制造有限公司 | Horizontal diamond wire cutting machine tool |
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| Publication number | Publication date |
|---|---|
| WO2022156018A1 (en) | 2022-07-28 |
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