CN215511763U - Cutting equipment is used in quartz wafer processing production - Google Patents
Cutting equipment is used in quartz wafer processing production Download PDFInfo
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- CN215511763U CN215511763U CN202121538988.9U CN202121538988U CN215511763U CN 215511763 U CN215511763 U CN 215511763U CN 202121538988 U CN202121538988 U CN 202121538988U CN 215511763 U CN215511763 U CN 215511763U
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- guide groove
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Abstract
The utility model belongs to the technical field of quartz wafer processing, and particularly relates to cutting equipment for quartz wafer processing production, which aims at the problem of poor treatment effect of chips and cooling liquid during cutting treatment of quartz crystal mounds, and the following scheme is proposed, wherein the cutting equipment comprises a cutting table and a mounting frame, the mounting frame is fixed on one side of the top surface of the cutting table, a cutting line is arranged between the mounting frame and the cutting table, a cooling water tank is mounted at the top of the mounting frame, and a guide pipe communicated with the cooling water tank is arranged on one side of the top of the cutting line; according to the utility model, the feeding motor drives the feeding plate to move and cut so as to drive the screening blades to rotate, waste chips and cooling liquid are screened and separated, and the feeding plate can also drive the screening blades to screen and separate after being reset by reverse movement, so that the screening and separating effects of the screening blades on the cooling liquid and the waste chips are further improved.
Description
Technical Field
The utility model relates to the technical field of quartz wafer processing, in particular to cutting equipment for quartz wafer processing production.
Background
The chemical composition of the quartz crystal is SiO2, the crystal belongs to oxide mineral of trigonal system, namely low-temperature quartz (a-quartz), is a mineral species with the widest distribution in quartz group minerals, and when the quartz resonator is manufactured, the quartz crystal block needs to be cut into quartz wafers.
At present, the quartz crystal mound is cut by a cutting line, and the quartz crystal mound has certain hardness and needs to be cooled when being cut, so that the stability of the quartz crystal mound during cutting is ensured, and scraps generated during cutting are discharged along with cooling liquid, so that the timely treatment of the scraps and waste liquid is particularly important.
Therefore, a cutting device for processing and producing quartz wafers is needed to solve the problem of poor treatment effect of chips and cooling liquid when cutting quartz crystal mounds.
SUMMERY OF THE UTILITY MODEL
The cutting equipment for quartz wafer processing and production provided by the utility model solves the problem of poor treatment effect of chips and cooling liquid when the quartz wafer is subjected to cutting treatment.
In order to achieve the purpose, the utility model adopts the following technical scheme: a cutting device for quartz wafer processing production comprises a cutting table, and the cutting table also comprises
The mounting frame is fixed on one side of the top surface of the cutting table, a cutting line is arranged between the mounting frame and the cutting table, a cooling water tank is mounted at the top of the mounting frame, and a guide pipe communicated with the cooling water tank is arranged on one side of the top of the cutting line;
the cutting table comprises a feeding plate, the feeding plate is connected with the top surface of the cutting table in a sliding mode, a sliding groove is formed in the top surface of the cutting table, a mounting plate fixed with the cutting table is installed on one side of the sliding groove, an adjusting gear is connected to the side wall of one side of the mounting plate in a rotating mode, a feeding motor coaxially installed with the adjusting gear is arranged on the side wall of the other side of the mounting plate, a toothed plate is fixed to the bottom surface of the feeding plate and meshed with the adjusting gear, and a collecting assembly is arranged at one end of the cutting table.
Preferably, the collection assembly comprises
The guide groove is arranged on the top surface of the cutting table and is positioned at one end of the cutting line, and a collecting box is fixed on the side wall of one side of the cutting table;
the separator box, the separator box with communicate between the guiding gutter, a plurality of screening holes that are evenly distributed have been seted up to the bottom of separator box, the screening passageway has all been seted up to the both sides lateral wall of separator box, the screening baffle that one side of screening passageway install with the separator box with the collecting box is fixed, the inner wall of separator box rotates and is connected with the screening blade, the outside of collecting box is provided with the bevel gear an with screening blade coaxial arrangement, one side of mounting bracket is provided with the bevel gear b with adjusting gear coaxial arrangement, bevel gear a with bevel gear b meshes mutually.
Preferably, the cross section of the diversion trench is splayed, and the bottom surface of the diversion trench is arranged in a downward inclined plane.
Preferably, the vertical section of the collecting box is in an inverted convex shape, and the screening baffle is obliquely arranged at the middle connecting part of the collecting box.
Preferably, the bottom surface of separator box is the cambered surface setting, the tip of screening blade with the inner wall of separator box contacts.
Preferably, the top surface of the cutting table is provided with a guide groove, the guide groove and the sliding groove are symmetrically arranged along the guide groove, the bottom end of the toothed plate is fixed with a sliding block a matched with the sliding groove, and the bottom surface of the feeding plate is fixed with a sliding block b matched with the guide groove.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the feeding motor drives the feeding plate to move and cut so as to drive the screening blades to rotate, waste chips and cooling liquid are screened and separated, and the feeding plate can also drive the screening blades to screen and separate after being reset by reverse movement, so that the screening and separating effects of the screening blades on the cooling liquid and the waste chips are further improved.
2. According to the utility model, the slide block a is arranged, so that the motion stability of the toothed plate in the chute is improved, and the guide groove and the slide block b are arranged, so that the feeding plate is more stable when moving on the cutting table for feeding, and the precision of cutting the quartz crystal weight is improved to a certain extent.
Drawings
FIG. 1 is a schematic view of the overall structure of a cutting apparatus for processing and producing a quartz wafer according to the present invention;
FIG. 2 is a schematic structural diagram of a collection box of the cutting device for quartz wafer processing production according to the present invention;
FIG. 3 is an enlarged view of a portion of the collecting assembly of the cutting apparatus for processing and producing quartz wafers according to the present invention;
FIG. 4 is a schematic view of a partial structure of a chute of a cutting apparatus for processing and producing a quartz wafer according to the present invention.
In the figure: 1. cutting table; 2. a mounting frame; 3. cutting a line; 4. a cooling water tank; 5. a conduit; 6. a feeding plate; 7. a chute; 8. mounting a plate; 9. an adjusting gear; 10. a feeding motor; 11. a toothed plate; 12. a collection assembly; 121. a diversion trench; 122. a collection box; 123. a separation tank; 124. screening holes; 125. a screening channel; 126. screening the baffle plate; 127. screening the blades; 128. a bevel gear a; 129. a bevel gear b; 13. a guide groove; 14. a slide block a; 15. and a slide block b.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, the cutting equipment for processing and producing the quartz wafer comprises a cutting table 1, wherein the cutting table 1 further comprises a mounting frame 2, the mounting frame 2 is fixed on one side of the top surface of the cutting table 1, a cutting line 3 is arranged between the mounting frame 2 and the cutting table 1, a cooling water tank 4 is mounted on the top of the mounting frame 2, and a guide pipe 5 communicated with the cooling water tank 4 is arranged on one side of the top of the cutting line 3; the cutting machine comprises a feeding plate 6, the feeding plate 6 is in sliding connection with the top surface of a cutting table 1, a sliding groove 7 is formed in the top surface of the cutting table 1, a mounting plate 8 fixed with the cutting table 1 is installed on one side of the sliding groove 7, an adjusting gear 9 is rotatably connected to the side wall of one side of the mounting plate 8, a feeding motor 10 coaxially installed with the adjusting gear 9 is arranged on the side wall of the other side of the mounting plate 8, a toothed plate 11 is fixed on the bottom surface of the feeding plate 6, the toothed plate 11 is meshed with the adjusting gear 9, a collecting component 12 is arranged at one end of the cutting table 1, specifically, a positioning device can be installed on the feeding plate 6 and used for ensuring that quartz stone crystals are positioned and treated, the adjusting gear 9 is driven by the feeding motor 10 to rotate, so that the toothed plate 11 drives the feeding plate 6 to move and treat the quartz stone stones on the feeding plate 6, the quartz stone stones on the feeding plate 6 are cut and treated, the collecting component 12 is used for screening and separating cooling liquid and scraps, thereby improving the treatment effect on the cooling liquid and the scraps.
The collecting assembly 12 comprises a diversion trench 121, the diversion trench 121 is arranged on the top surface of the cutting table 1, the diversion trench 121 is positioned at one end of the cutting line 3, and a collecting box 122 is fixed on the side wall of one side of the cutting table 1; the separating box 123, communicate between separating box 123 and guiding gutter 121, a plurality of screening holes 124 that are evenly distributed have been seted up to the bottom of separating box 123, screening passageway 125 has all been seted up to the both sides lateral wall of separating box 123, screening baffle 126 fixed with separating box 123 and collecting box 122 is installed to one side of screening passageway 125, the inner wall of separating box 123 rotates and is connected with screening blade 127, the outside of collecting box 122 is provided with bevel gear a128 with screening blade 127 coaxial arrangement, one side of mounting bracket 2 is provided with bevel gear b129 with adjusting gear 9 coaxial arrangement, bevel gear a128 meshes with bevel gear b129 mutually, through bevel gear a128 and bevel gear b 129's transmission effect, make screening blade 127 rotate in separating box 123, thereby rotate screening processing to coolant liquid and piece.
The cross section of guiding gutter 121 is the splayed, and the bottom surface of guiding gutter 121 is the inclined plane setting of downward sloping, and is specific, the setting of guiding gutter 121 shape further improves the water conservancy diversion effect that the coolant liquid drove the piece and gets into in separator 123.
The vertical section of the collecting box 122 is in an inverted convex shape, the screening baffle 126 is obliquely arranged at the middle connecting part of the collecting box 122, specifically, the screening baffle 126 is a porous plate and is used for filtering and screening the cooling liquid entering along with the screening blades 127, the shape of the collecting box 122 is set, so that the cooling liquid is concentrated at the bottom of the collecting box 122, and the chips are concentrated above the screening baffle 126 in the collecting box 122 to form separation treatment, so that the subsequent concentration treatment is conveniently carried out on the chips.
The bottom surface of separator box 123 is the cambered surface setting, and the tip of screening blade 127 contacts with the inner wall of separator box 123, and is concrete, the setting of separator box 123 bottom cambered surface for screening blade 127 can drive screening blade 127 to rotate and carry out screening separation processing to sweeps and coolant liquid when cutting along with the motion of delivery sheet 6, and the setting back of accessible delivery sheet 6 continues to drive sweeps and coolant liquid and carry out screening separation processing.
The working principle is as follows: when the quartz crystal mound is cut, the quartz crystal mound is placed on the feeding plate 6 and is positioned and installed through an external positioning device, the feeding motor 10 is driven to drive the adjusting gear 9 to rotate, so that the feeding plate 6 is driven to slide on the cutting table 1 through the meshing transmission action of the toothed plate 11, the quartz crystal mound is cut through the cutting line 3, the cooling liquid of the cooling water tank 4 is used for cooling the cutting position of the quartz crystal mound through the guide pipe 5, the cooling liquid drives the waste chips to flow from the guide groove 121 to the separating box 123, the screening blades 127 rotate in the separating box 123 through the transmission action of the bevel gears a128 and b129 along with the driving of the driving motor, and the chips enter the screening baffle 126 through the screening passage 125 through the rotation of the screening blades 127 and are accumulated in the middle of the collecting box 122, and the cooling liquid flows into the bottom of the collecting box 122 through the screening through holes, so that screening and separating treatment on the cooling liquid and the chips is formed, and the screening and separating effect on the chips and the cooling liquid is improved; drive the cutting of pay-off board 6 motion through pay-off motor 10 and can drive screening blade 127 and rotate, carry out screening separation processing to sweeps and coolant liquid, pay-off board 6 also can drive screening blade 127 after reverse motion resets simultaneously and carry out screening processing to further improve the screening separation effect of screening blade 127 to coolant liquid and sweeps.
The feeding motor 10 is commercially available, and the feeding motor 10 is provided with a power supply, which belongs to the mature technology in the field and is fully disclosed, so repeated description in the specification is omitted.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. A cutting device for processing and producing quartz wafers comprises a cutting table (1), and is characterized in that the cutting table (1) further comprises
The cutting table comprises a mounting frame (2), wherein the mounting frame (2) is fixed on one side of the top surface of the cutting table (1), a cutting line (3) is arranged between the mounting frame (2) and the cutting table (1), a cooling water tank (4) is installed at the top of the mounting frame (2), and a guide pipe (5) communicated with the cooling water tank (4) is arranged on one side of the top of the cutting line (3);
the cutting table comprises a feeding plate (6), the feeding plate (6) is in sliding connection with the top surface of the cutting table (1), a sliding groove (7) is formed in the top surface of the cutting table (1), a mounting plate (8) fixed with the cutting table (1) is installed on one side of the sliding groove (7), an adjusting gear (9) is rotatably connected to one side wall of the mounting plate (8), a feeding motor (10) coaxially installed with the adjusting gear (9) is arranged on the other side wall of the mounting plate (8), a toothed plate (11) is fixed to the bottom surface of the feeding plate (6), the toothed plate (11) is meshed with the adjusting gear (9), and a collecting assembly (12) is arranged at one end of the cutting table (1).
2. Cutting device for quartz wafer processing production according to claim 1, characterized in that said collection assembly (12) comprises
The guide groove (121) is arranged on the top surface of the cutting table (1), the guide groove (121) is positioned at one end of the cutting line (3), and a collecting box (122) is fixed on the side wall of one side of the cutting table (1);
the separation box (123), communicate between separation box (123) and guiding gutter (121), a plurality of screening holes (124) that are evenly distributed have been seted up to the bottom of separation box (123), screening passageway (125) have all been seted up to the both sides lateral wall of separation box (123), screening baffle (126) fixed with separation box (123) and collecting box (122) are installed to one side of screening passageway (125), the inner wall of separation box (123) rotates and is connected with screening blade (127), the outside of collecting box (122) is provided with bevel gear a (128) with screening blade (127) coaxial arrangement, one side of mounting bracket (2) is provided with bevel gear b (129) with adjusting gear (9) coaxial arrangement, bevel gear a (128) with bevel gear b (129) mesh.
3. The cutting equipment for processing and producing the quartz wafer as claimed in claim 2, wherein the cross section of the guide groove (121) is splayed, and the bottom surface of the guide groove (121) is arranged in a downward inclined plane.
4. The cutting equipment for quartz wafer processing production according to claim 2, characterized in that the vertical section of the collection box (122) is in an inverted convex shape, and the screening baffle (126) is obliquely installed at the middle connection part of the collection box (122).
5. The cutting equipment for quartz wafer processing production according to claim 2, characterized in that the bottom surface of the separation box (123) is provided with a cambered surface, and the end of the sieving blade (127) is in contact with the inner wall of the separation box (123).
6. The cutting equipment for processing and producing the quartz wafer as claimed in claim 2, wherein a guide groove (13) is formed in the top surface of the cutting table (1), the guide groove (13) and the sliding groove (7) are symmetrically arranged along the guide groove (121), a sliding block a (14) matched with the sliding groove (7) is fixed at the bottom end of the toothed plate (11), and a sliding block b (15) matched with the guide groove (13) is fixed at the bottom surface of the feeding plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121538988.9U CN215511763U (en) | 2021-07-07 | 2021-07-07 | Cutting equipment is used in quartz wafer processing production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121538988.9U CN215511763U (en) | 2021-07-07 | 2021-07-07 | Cutting equipment is used in quartz wafer processing production |
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| Publication Number | Publication Date |
|---|---|
| CN215511763U true CN215511763U (en) | 2022-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121538988.9U Active CN215511763U (en) | 2021-07-07 | 2021-07-07 | Cutting equipment is used in quartz wafer processing production |
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| Country | Link |
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| CN (1) | CN215511763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114770781A (en) * | 2022-06-22 | 2022-07-22 | 成都泰美克晶体技术有限公司 | SC wafer chord-changing positioning device and using method thereof |
-
2021
- 2021-07-07 CN CN202121538988.9U patent/CN215511763U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114770781A (en) * | 2022-06-22 | 2022-07-22 | 成都泰美克晶体技术有限公司 | SC wafer chord-changing positioning device and using method thereof |
| CN114770781B (en) * | 2022-06-22 | 2022-10-14 | 成都泰美克晶体技术有限公司 | SC wafer chord-changing positioning device and using method thereof |
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