CN112916503A - Processing method for ceramic surface glazing - Google Patents
Processing method for ceramic surface glazing Download PDFInfo
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- CN112916503A CN112916503A CN202110300324.7A CN202110300324A CN112916503A CN 112916503 A CN112916503 A CN 112916503A CN 202110300324 A CN202110300324 A CN 202110300324A CN 112916503 A CN112916503 A CN 112916503A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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Abstract
A ceramic surface glazing processing method comprises the steps of firstly, building a laser processing system, then cleaning a ceramic wafer, and placing the ceramic wafer on a processing platform of the laser processing system; setting the adjusting parameters of the laser processing system; then setting laser processing track parameters; finally, processing the ceramic wafer by laser, standing and cooling to finish processing; the method can obtain various glazing tissues with different shapes through parameter regulation and control, and realize accurate selective glazing.
Description
Technical Field
The invention belongs to the technical field of ceramic surface laser processing, and particularly relates to a processing method for ceramic surface glazing.
Background
Ceramics are widely used in many fields as a representative of inorganic nonmetallic materials. Based on the higher resistivity, the mechanical strength, the lower thermal conductivity and the stronger high temperature resistance of the ceramic, the ceramic can be applied to some complex and special working environments, such as circuits which need to be in extremely high temperature, strong current and strong impact working environments, and the like. The ceramic is formed by mixing a metal compound with a resin material, and then pressing under high pressure and sintering at high temperature, so that the bonding force of the ceramic material is not strong enough, and the ceramic has low ductility and certain brittleness, so that the ceramic surface is easy to break and crack under the condition of concentrated external force.
In order to solve the problems of poor impact resistance of ceramic materials and the like, an effective method is to improve the mechanical strength of the ceramic by preparing a glazed layer on the surface of the ceramic. The general glazing method is a surface treatment method of spraying some metal compounds on the surface of a ceramic blank and then forming a glazing layer different from a base material on the surface of the blank in a high-temperature sintering mode. The method has the advantages that a sintering furnace is generally adopted for high-temperature sintering, the mode can ensure the uniformity of a glazed layer only when the ceramic of a thick piece with a large area and a single structure is glazed, and the defects of long sintering process, complex steps, incapability of selective sintering and glazing and the like exist; meanwhile, the crystal phase of the ceramic material can trigger the phase change of the crystal phase when reaching the corresponding phase change temperature, when the temperature reaches the glass transition temperature of the ceramic crystal grains, the glass transition of the ceramic crystal grains can occur, and a layer of glass structure, namely a glazing layer, can be formed after cooling.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a processing method for ceramic surface glazing, which can obtain glazing tissues with various shapes through parameter control and realize accurate selective glazing.
In order to achieve the purpose, the invention adopts the technical scheme that:
a processing method for ceramic surface glazing comprises the following steps:
s1: building a laser processing system;
s2: cleaning the ceramic wafer, and placing the ceramic wafer on a processing platform of a laser processing system;
s3: setting adjustment parameters of a laser processing system;
s4: setting laser processing track parameters;
s5: and (5) processing the ceramic wafer by laser, standing and cooling to finish processing.
The laser processing system in the S1 comprises a fiber laser, a transmission fiber, a laser output head, a galvanometer system, a processing platform, a processor and a controller, wherein laser emitted by the fiber laser is transmitted through the transmission fiber, is output from the laser output head, enters the galvanometer system to be focused and then acts on the surface of a ceramic wafer on the processing platform; the fiber laser and the galvanometer system are respectively connected with the processor.
The ceramic sheet material in S2 includes ceramic materials such as zirconia, alumina, and aluminum nitride.
The specific steps of S2 are: and (3) placing the ceramic wafer in acetone, cleaning the ceramic wafer by using an ultrasonic cleaning machine, washing the ceramic wafer by using distilled water, drying the ceramic wafer, and placing the ceramic wafer on a processing platform of a laser processing system.
The adjusting parameters in the step S3 include laser mode, laser output power, laser scanning speed and defocus amount; the laser mode is a continuous mode or a pulse mode, the laser output power is E, the laser scanning speed is V, and the defocusing amount is D.
The processing track parameters in the step S4 include the laser scanning times and the laser scanning path; the laser scanning times are n times, the laser scanning path is a line segment with any length or track, and finally the line segments with any length and track form processing areas with various shapes.
Compared with the prior art, the invention has the following advantages:
(1) the method is simple to operate, can be completed by using a conventional laser processing system, does not need additional equipment and investment, and is easy to realize large scale.
(2) The laser processing parameters are convenient to regulate and control, and the temperature and the heat duration of a laser irradiation area can be regulated and controlled only by changing the processing parameters, so that the glazed layer with different crystalline phase tissues can be obtained in the processing area.
(3) Based on the characteristic that laser is easy to combine with automatic control software, the glazing area is not influenced by the shape and specification of the material, and accurate selective processing of planes and even random shapes of irregular curved surfaces can be realized on the surface of the material.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Fig. 2 is a schematic structural diagram of a laser processing system according to the present invention.
Fig. 3 is a schematic diagram of the laser processing system of the present invention processing a ceramic wafer.
FIG. 4 is a microscopic comparison of the morphology of the glazed structure and the substrate structure of example 1 of the present invention.
FIG. 5 is a microscopic comparison of the morphology of the glazed structure and the substrate structure of example 2 of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Example 1: referring to fig. 1, a processing method for ceramic surface glazing comprises the following steps:
s1: building a laser processing system, as shown in fig. 2, wherein the laser processing system comprises an optical fiber laser 1, a transmission optical fiber 2, a laser output head 3, a galvanometer system 4, a processing platform 6, a processor 8 and a controller 7, wherein laser emitted by the optical fiber laser 1 is transmitted through the transmission optical fiber 2, is output from the laser output head 3, enters the galvanometer system 4, is focused and then acts on the surface of a ceramic wafer 5 on the processing platform 6; the fiber laser 1 and the galvanometer system 4 are respectively connected with a processor 8; the ceramic plate 5 is made of zirconia;
s2: cleaning the ceramic wafer 5, and placing the ceramic wafer 5 on a processing platform 6 of a laser processing system;
the thickness of the ceramic plate 5 is 3mm, and the ceramic plate 5 is a square with the side length of 20 mm;
s3: setting adjustment parameters of a laser processing system, wherein the adjustment parameters comprise a laser mode, laser output power, laser scanning speed and defocusing amount, the laser mode is a continuous mode and a pulse mode, the laser output power is more than 20W, the laser scanning speed is more than 0.2mm/s, and the defocusing amount is more than-15 mm and less than +15 mm;
s4: setting laser processing track parameters, wherein the processing track parameters comprise laser scanning times and laser scanning paths;
the laser scanning times are 1 time, and the laser scanning path is a line segment with the length of 20 mm;
s5: the ceramic sheet 5 is processed by laser, and as shown in fig. 3, left to stand and cooled to complete the processing.
After processing, detecting and observing, changing laser processing system parameters, wherein the width of the glazing structure is about 1 mm-3 mm, and the length is about 20 mm; the result of fig. 4 can be obtained by observing the processed ceramic sheet under a metallographic microscope, and it can be found from fig. 4 that a macroscopic glazing layer is formed in the processed area, and the glazing structure is obviously different from the base material structure and is in the shape of fish scales.
Example 2: the scanning speed of the processing parameters in step S3 of example 1 is set to 1.5mm/S, the other steps are the same as those of example 1, the processing morphology micrograph is shown in fig. 5, and the ceramic wafer has three types of structure morphologies under the metallographic microscope, which are: the base material tissue, the scaly glazed tissue and the feather glazed tissue are observed by naked eyes, the glazed area presents bright silver color, and the surface appearance of the glazed area is good; under a microscope, the feather-shaped glazing structure has fine and bent crystal grains, and the bending direction of the crystal grains is consistent with the advancing direction of the laser.
The above embodiments are merely examples and do not limit the scope of the present invention. These embodiments may be implemented in other various manners, and various omissions, substitutions, and changes may be made without departing from the technical spirit of the present invention.
Claims (8)
1. The processing method for ceramic surface glazing is characterized by comprising the following steps:
s1: building a laser processing system;
s2: cleaning the ceramic wafer, and placing the ceramic wafer on a processing platform of a laser processing system;
s3: setting adjustment parameters of a laser processing system;
s4: setting laser processing track parameters;
s5: and (5) processing the ceramic wafer by laser, standing and cooling to finish processing.
2. The method for glazing a ceramic surface according to claim 1, wherein: the laser processing system in the S1 comprises a fiber laser, a transmission fiber, a laser output head, a galvanometer system, a processing platform, a processor and a controller, wherein laser emitted by the fiber laser is transmitted through the transmission fiber, is output from the laser output head, enters the galvanometer system to be focused and then acts on the surface of a ceramic wafer on the processing platform; the fiber laser and the galvanometer system are respectively connected with the processor.
3. The method for glazing a ceramic surface according to claim 1, wherein: the ceramic sheet material in S2 includes zirconia, alumina and aluminum nitride ceramic materials.
4. The method for glazing a ceramic surface according to claim 1, wherein: the specific steps of S2 are: and (3) placing the ceramic wafer in acetone, cleaning the ceramic wafer by using an ultrasonic cleaning machine, washing the ceramic wafer by using distilled water, drying the ceramic wafer, and placing the ceramic wafer on a processing platform of a laser processing system.
5. The method for glazing a ceramic surface according to claim 1, wherein: the adjusting parameters in the step S3 include laser mode, laser output power, laser scanning speed and defocus amount; the laser mode is a continuous mode or a pulse mode, the laser output power is E, the laser scanning speed is V, and the defocusing amount is D.
6. The method for glazing a ceramic surface according to claim 1, wherein: the processing track parameters in the step S4 include the laser scanning times and the laser scanning path; the laser scanning times are n times, the laser scanning path is a line segment with any length or track, and finally the line segments with any length and track form processing areas with various shapes.
7. The processing method for ceramic surface glazing is characterized by comprising the following steps:
s1: the method comprises the steps that a laser processing system is set up and comprises an optical fiber laser (1), a transmission optical fiber (2), a laser output head (3), a vibrating mirror system (4), a processing platform (6), a processor (8) and a controller (7), laser emitted by the optical fiber laser (1) is transmitted through the transmission optical fiber (2), is output from the laser output head (3), and enters the vibrating mirror system (4) to be focused and then acts on the surface of a ceramic wafer (5) on the processing platform (6); the fiber laser (1) and the galvanometer system (4) are respectively connected with the processor (8); the ceramic plate (5) is made of zirconium oxide;
s2: cleaning the ceramic wafer (5), and placing the ceramic wafer (5) on a processing platform (6) of a laser processing system;
the thickness of the ceramic plate (5) is 3mm, and the ceramic plate (5) is a square with the side length of 20 mm;
s3: setting adjustment parameters of a laser processing system, wherein the adjustment parameters comprise a laser mode, laser output power, laser scanning speed and defocusing amount, the laser mode is a continuous mode and a pulse mode, the laser output power is more than 20W, the laser scanning speed is more than 0.2mm/s, and the defocusing amount is more than-15 mm and less than +15 mm;
s4: setting laser processing track parameters, wherein the processing track parameters comprise laser scanning times and laser scanning paths;
the laser scanning times are 1 time, and the laser scanning path is a line segment with the length of 20 mm;
s5: and (5) processing the ceramic wafer (5) by laser, standing and cooling to finish processing.
8. The method of claim 7, wherein the ceramic surface glazing process comprises: after processing, detecting and observing, changing laser processing system parameters, wherein the width of the glazing structure is between 1mm and 3mm, and the length is 20 mm; the processed ceramic chip is placed under a metallographic microscope for observation, and the processed area has a macroscopic glazing layer, the glazing structure is obviously different from the base material structure, and the processed ceramic chip is fish-scale-shaped.
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| CN202110300324.7A CN112916503A (en) | 2021-03-22 | 2021-03-22 | Processing method for ceramic surface glazing |
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| CN202110300324.7A CN112916503A (en) | 2021-03-22 | 2021-03-22 | Processing method for ceramic surface glazing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500297A (en) * | 2021-06-21 | 2021-10-15 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1090834A (en) * | 1993-02-09 | 1994-08-17 | 勒脱吉尔州立大学 | The localized surface glazing of ceramic |
| CN103396162A (en) * | 2013-07-22 | 2013-11-20 | 中原工学院 | Method for founding scaled glaze on ceramic substrate by adopting laser |
| CN108890138A (en) * | 2018-07-17 | 2018-11-27 | 西安交通大学 | A kind of ultrafast laser polishing processing method for ceramic matric composite |
| CN110919193A (en) * | 2019-12-31 | 2020-03-27 | 上海工程技术大学 | Nanosecond laser processing method for ceramic surface hole based on processing track optimization |
| CN111716005A (en) * | 2020-06-19 | 2020-09-29 | 西安交通大学 | Method for polishing ceramic matrix composite material by ultrasonic-assisted laser |
-
2021
- 2021-03-22 CN CN202110300324.7A patent/CN112916503A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1090834A (en) * | 1993-02-09 | 1994-08-17 | 勒脱吉尔州立大学 | The localized surface glazing of ceramic |
| US5427825A (en) * | 1993-02-09 | 1995-06-27 | Rutgers, The State University | Localized surface glazing of ceramic articles |
| CN103396162A (en) * | 2013-07-22 | 2013-11-20 | 中原工学院 | Method for founding scaled glaze on ceramic substrate by adopting laser |
| CN108890138A (en) * | 2018-07-17 | 2018-11-27 | 西安交通大学 | A kind of ultrafast laser polishing processing method for ceramic matric composite |
| CN110919193A (en) * | 2019-12-31 | 2020-03-27 | 上海工程技术大学 | Nanosecond laser processing method for ceramic surface hole based on processing track optimization |
| CN111716005A (en) * | 2020-06-19 | 2020-09-29 | 西安交通大学 | Method for polishing ceramic matrix composite material by ultrasonic-assisted laser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500297A (en) * | 2021-06-21 | 2021-10-15 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
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Application publication date: 20210608 |