CN112912926A - Intelligent image tracking system in semiconductor process - Google Patents
Intelligent image tracking system in semiconductor process Download PDFInfo
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- CN112912926A CN112912926A CN201980069006.5A CN201980069006A CN112912926A CN 112912926 A CN112912926 A CN 112912926A CN 201980069006 A CN201980069006 A CN 201980069006A CN 112912926 A CN112912926 A CN 112912926A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/20—Analysis of motion
- G06T7/246—Analysis of motion using feature-based methods, e.g. the tracking of corners or segments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10016—Video; Image sequence
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
The invention relates to an intelligent image tracking system in a semiconductor process. The invention comprises the following steps: an image capturing unit including cameras arranged at a plurality of points of the semiconductor device to capture a process performed on an object by the semiconductor device; an apparatus controller configured to control an operation of the semiconductor apparatus and transmit object identification information as information for identifying an object, position information of the object mapped to time information, and operation state information indicating a current operation state of the semiconductor apparatus; and a network image recording device configured to perform control to add camera identification information to the image information received from the image capturing unit and store the image information added with the camera identification information in the image database, and configured to perform control to store tracking information including object identification information for identifying a camera capturing the image information, position information of the object mapped to the time information, and operation state information received from the device controller into the tracking database. The present invention can provide support for a user so that the user can follow the entire process from the time when wafers, lots, and the like, which are processing objects of a semiconductor process, are put into a sub-apparatus until the semiconductor process is completed.
Description
Technical Field
The present invention relates to an intelligent image tracking system in a semiconductor process, and more particularly, to an intelligent image tracking system in a semiconductor process supporting a user to be able to track an entire process from a wafer, a lot, or the like, which is a processing object of the semiconductor process, being thrown into a sub-device constituting a semiconductor device until the semiconductor process is completed.
Background
In general, a semiconductor process is performed in such a manner that sub-processes are continuously performed, and a semiconductor device can be said to be a collection of devices for constituting the sub-processes of the entire semiconductor process.
Since a semiconductor process is a collection of a plurality of sub-processes, it is necessary to track in which step in the entire semiconductor process a specific wafer or lot accommodating the wafer is processed in association with process management.
According to the existing image recording method associated with semiconductor process management, a plurality of cameras are provided at positions where processing operations of sub-devices constituting the entire semiconductor device can be captured, and images captured by the cameras can be stored while being matched only with the IDs of the cameras.
However, according to the related art, when a user wants to inquire about the current state of a specific wafer, which is an object of a semiconductor process, if an ID of a specific camera is input among a plurality of cameras, since an image recording apparatus displays only individual images captured by the respective cameras to the user, there is a problem that the user cannot check the entire semiconductor process. That is, according to the related art, the image recording apparatus records an image captured by a camera provided at a specific position as an individual image, and therefore, it is difficult for a user to track the entire process from the time when a wafer, a lot, or the like, which is a semiconductor process object, is thrown into a sub-apparatus constituting a semiconductor apparatus until the semiconductor process is completed.
[ Prior art documents ]
[ patent document ]
(patent document 0001) korean patent No. 10-1619097 (granted date: 2016, 5, month, 2, entitled "process monitoring system in semiconductor manufacturing process")
(patent document 0002) Korean patent laid-open No. 10-2005-0048121 (published: 5/24/2005; title of the invention, "monitoring System for etching apparatus and monitoring method thereof")
Disclosure of Invention
Technical problem
The present invention is directed to providing an intelligent image tracking system in a semiconductor process, which allows a user to track the entire process from the time when a wafer, a lot, or the like, which is a processing object of the semiconductor process, is thrown into a sub-device constituting a semiconductor device until the semiconductor process is completed.
Solution scheme
In order to solve the above technical problem, an intelligent image tracking system in a semiconductor process according to the present invention comprises: an image capturing unit including cameras arranged at a plurality of points of the semiconductor device to capture a process performed on an object by the semiconductor device; a device controller configured to control an operation of the semiconductor device and transmit object identification information, which is information for identifying the object, location information of the object mapped to the time information, and operation state information indicating a current operation state of the semiconductor device; and a network image recording device configured to perform control to add camera identification information to the image information received from the image capturing unit and store the image information added with the camera identification information in the image database, and configured to perform control to store tracking information including object identification information for identifying a camera capturing the image information, position information of the object mapped to the time information, and operation state information, received from the device controller, in the tracking database.
In the intelligent image tracking system in semiconductor process according to the present invention, the network image recording apparatus is characterized by performing control to display a process performed on an object by the semiconductor device as a continuous image by matching the tracking information stored in the tracking database with the image information added with the camera identification information stored in the image database according to the search condition input by the user.
In the intelligent image tracking system in semiconductor processes according to the present invention, the network image recording device is characterized in that the object identification information is configured as a root node, the start point and the end point on the path along which the object moves are configured as child nodes, and the tracking information is stored in the tracking database in a tree structure.
In the intelligent image tracking system in a semiconductor process according to the present invention, the network image recording device is characterized in that when a plurality of cameras are in charge of capturing a start point or an end point configured as a child node, one of the plurality of cameras is selected according to the operation state information.
In the intelligent image tracking system in a semiconductor process according to the present invention, when the semiconductor devices are plural and the device controller and the network image recording apparatus in charge of the semiconductor devices have a number corresponding to the number of the semiconductor devices, the intelligent image tracking system further comprises: a central management device configured to manage the network image recording devices, and the central management device is characterized by performing control to display an image provided by a network image recording device specified by the user terminal among the plurality of network image recording devices to the user terminal in response to a request from the user terminal at a remote location.
Advantageous effects
According to the present invention, it is possible to provide an intelligent image tracking system in a semiconductor process, which allows a user to track the entire process from the time when a wafer, a lot, or the like, which is a processing object of the semiconductor process, is thrown into a sub-device constituting a semiconductor device until the semiconductor process is completed.
Drawings
Fig. 1 is a diagram illustrating an intelligent image tracking system in a semiconductor process according to one embodiment of the present invention.
Fig. 2 is a diagram illustrating an intelligent image tracking system in a semiconductor process according to a modified embodiment of one embodiment of the present invention.
Fig. 3 is a diagram exemplarily illustrating an operation of an intelligent image tracking system in a semiconductor process according to one embodiment of the present invention.
Fig. 4 is a diagram illustrating an exemplary tree structure applicable to one embodiment of the present invention.
Fig. 5 is a diagram exemplarily illustrating a method of searching for a camera image using a tree structure according to one embodiment of the present invention.
Detailed Description
The specific structural or functional description of the embodiments according to the inventive concept disclosed herein is shown only for the purpose of describing the embodiments according to the inventive concept, and the embodiments according to the inventive concept may be implemented in various forms and are not limited to the embodiments described herein.
Since embodiments according to the inventive concept may be changed in various ways and may have various forms, the embodiments are illustrated in the drawings and described herein in detail. However, it is not intended to limit embodiments according to the inventive concept to the particular forms disclosed, but to cover all modifications, equivalents, and alternatives falling within the inventive concept and technical scope of the present invention.
Terms such as "first" or "second" may be used to describe various elements, but the elements are not limited by these terms. These terms are only used to distinguish one element from another, e.g., a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the inventive concept.
When an element is referred to as being "coupled" or "connected" to another element, it is understood that the particular element may be directly coupled or connected to the other element or other elements may be present therebetween. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no other elements present between them. Moreover, other expressions describing the relationship between elements should be interpreted in the same manner (e.g., "between," directly between, "" adjacent to …, "directly adjacent to …," etc.).
The terms used herein are set forth only to explain embodiments of the present invention, and the scope of the present invention is not limited thereto. As used herein, the singular is also intended to include the plural unless the context clearly dictates otherwise. It will be further understood that the terms "comprises," "comprising," or "having," as used herein, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in general dictionaries should be interpreted as having a meaning that is consistent with their contextual meaning in the art and will not be interpreted in this specification as having an ideal or excessively formal meaning unless explicitly defined.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a diagram illustrating an intelligent image tracking system in a semiconductor process according to one embodiment of the present invention.
Referring to fig. 1, the intelligent image tracking system in a semiconductor process according to an embodiment of the present invention includes an image capturing unit 10, a device controller 20, and a network image recording apparatus 30.
The image capturing unit 10 includes cameras arranged at a plurality of points of the semiconductor device 1 to capture a process performed on an object by the semiconductor device 1. For example, the number of cameras constituting the image capturing unit 10 may be equal to the number of sub-devices constituting the semiconductor device 1, that is, the number of constituent devices, however, the present invention is not limited thereto, and the number of cameras may be greater than or less than the number of constituent devices. For example, the semiconductor device 1 may include a plurality of chambers for performing respective process reactions, and a transfer device for transferring an object to be processed, which may be a wafer or a lot (lot) containing wafers, to the respective chambers.
The device controller 20 serves to control the overall operation of the semiconductor device 1 and transmit object identification information for identifying an object (i.e., a wafer or a lot) to be processed, object location information mapped to time information, and operation state information indicating the current operation state of the semiconductor device 1 to the network image recording apparatus 30 in real time. For example, the device controller 20 may be a Cluster Tool Controller (CTC) defined in the international semiconductor industry association (SEMI) international standard program, and the CTC may record a path along which a specific wafer or lot moves in the semiconductor device 1 composed of a plurality of constituent sub-devices, a location and time of each operation, and locations and times of all steps constituting a process according to the contents of the SEMI international standard program. In one embodiment of the present invention, the wafer ID, start point, end point, operational status, etc. required for tracking are transmitted to network image recording device 30 in real time by associating the information recorded in the CTC with network image recording device 30. The information transmitted to the network image recording device 30 is converted into a database simultaneously separately from the image information.
The network image recording apparatus 30 performs control to add camera identification information, which is information for identifying a camera capturing image information, to the received image information and to store the image information added with the camera identification information in the image database 310 in real time and to store tracking information including object identification information received from the device controller 20, object position information mapped to time information, and operation state information in the tracking database 320. For example, the operation state information, which is information indicating a current state of an object such as a wafer or a lot, may be information indicating which sub-process of the semiconductor apparatus 1 including a plurality of chambers and a plurality of transfer devices the object is in.
For example, the network image recording device 30 may perform control to display the object handling process performed by the semiconductor apparatus 1 as a continuous image by matching the tracking information stored in the tracking database 320 with the image information added with the camera identification information stored in the image database 310 according to the search condition input by the user.
For example, the network image recording device 30 may store the tracking information in the tracking database 320 in a tree structure by configuring the object identification information as a root node and configuring a start point and an end point on a route in which the object moves as child nodes, and when a plurality of cameras are responsible for capturing the start point or the end point configured as the child nodes, the network image recording device 30 may select one of the plurality of cameras according to the operation state information.
This will be described with additional reference to fig. 4, which fig. 4 shows an exemplary tree structure suitable for use in embodiments of the invention.
With further reference to FIG. 4, the stored information constitutes an inherent tree structure factoring in each wafer ID. The wafer ID is configured as a root node, and the "start point" and "end point" passed along with the wafer ID are configured as child nodes. The "operating state" is used as a weight value for each link. The camera ID composed of child nodes of the "start point" and the "end point" is selected according to the weight value. The camera ID may be used to search for image information to be output at each search time.
The wafer information tree constructed in this way provides the following functions: when a plurality of (i.e., several) cameras are assigned to the "start point" and the "end point", the best image at each time point can be tracked by applying a "weight value" in the camera selection. Equation 1 below may be applied to the extraction of the camera ID using the "weight value".
[ equation 1]
Camera ID ═ Σ (wafer ID × f (x), position × weight value)
In equation 1, f (x) is an index value for the same wafer ID, and the position is an intrinsic value of the start point and the end point. An index value may be given to "operation state", and this index value may be used as a "weight value" to select a camera that can query a real image according to the respective position and operation.
For example, the network image recording device 30 can derive a tracking image search algorithm based on search conditions by using the stored data in this manner. Search conditions that may be effectively used in a process may include: a search conditioned only on "lot ID"; searching on the condition of 'batch ID' and 'wafer ID' at the same time; a search conditioned on "lot ID", "wafer ID", "start point", and "end point"; and a search conditioned on "lot ID", "wafer ID", and "time".
For example, the network image recording device 30 may constitute a trace image by applying a wafer ID, a start/end node value, and operation state information (weight value) according to the search condition and derive information thereof. The method comprises the following steps: the same wafer ID value is searched, the ID value is assigned as each node value of a root (root), and the values stored as child nodes are assigned together at this time when information is stored. At this time, when a tree (tree) is constructed based on the wafer ID value, child nodes can be generated based on the tree generation time.
Fig. 5 is a diagram exemplarily illustrating a method of searching for a camera image using a tree structure according to an embodiment of the present invention.
Further referring to fig. 5, the network image recording apparatus 30 can provide a search path that can satisfy the above-described four search conditions by constructing a tree shape. According to the time information in the search condition, it is possible to start the search from the left node B, calculate a weight value based on the stored information, and search for a camera image assigned to a node of level 3 for output. For example, in order to refer to information to be captured from various angles, all information included in the weight value area in the camera information assigned to the level 3 node may be output a plurality of times according to the "weight value". Therefore, even if a method of outputting information with reference to only one camera at each point in time is used, an image function can be provided from various angles. When a plurality of images are simultaneously output, a function of highlighting a camera image having a high weight value can be provided for output.
Fig. 2 is a diagram illustrating an intelligent image tracking system in a semiconductor process according to a modified embodiment of one embodiment of the present invention.
Further referring to fig. 2, the intelligent image tracking system in the semiconductor process according to the modified embodiment of one embodiment of the present invention has a plurality of semiconductor devices 1, and in the system, when the device controller 20 and the network image recording apparatus 30 in charge of the semiconductor devices 1 have the number corresponding to the number of the semiconductor devices 1, a support user can image-monitor the process status from a remote location.
To this end, the intelligent image tracking system in semiconductor process according to the modified embodiment of one embodiment of the present invention further includes a central management apparatus 40, the central management apparatus 40 being configured to manage the network image recording apparatus 30.
In response to a request from the user terminal 2 at a remote location, the central management apparatus 40 performs control to display an image provided by the network image recording apparatus 30 specified by the user terminal 2 among the plurality of network image recording apparatuses 30 to the user terminal 2. The configuration other than the central management apparatus 40 is the same as that of the intelligent image tracking system in the semiconductor process according to the embodiment of the present invention shown in fig. 1, and thus, a repetitive description will be omitted.
Fig. 3 is a diagram exemplarily illustrating an operation of an intelligent image tracking system in a semiconductor process according to one embodiment of the present invention.
Further referring to fig. 3, in step S10, the operation of the semiconductor apparatus 1 is started.
In step S20, the execution apparatus controller 20 executes the following process: the operations of the sub-devices constituting the semiconductor apparatus 1 are controlled according to a control sequence set and input in advance.
In step S30, the device controller 20 executes the following process: object identification information, which is information for identifying an object to be processed, object position information mapped to time information, and operation state information indicating the current operation state of the semiconductor device 1 are transmitted to the network image recording apparatus 30 in real time.
In step S40, the network image recording device 30 executes the following process: information received from the device controller 20 (i.e., tracking information including object identification information, location information mapped to time information, and operation state information) is stored in the tracking database 320 in real time.
In step S50, which starts together with step S20, the following process is performed: the camera constituting the image capturing unit 10 starts capturing an area in charge thereof.
In step S60, the following process is performed: the camera constituting the image capturing unit 10 transmits captured image information to the network image recording apparatus 30 in real time. For example, the image information passed by the camera to the network image recording device 30 may be in the form of a data packet, and such data packet may include therein the image information and identification information of the camera that captured the image information.
In step S70, the network image recording device 30 executes the following process: the camera identification information is added to the image information received from the camera constituting the image capturing unit 10, and the image information added with the camera identification information is stored in the image database 310 in real time.
Steps S80 and S90 are processing procedures in the case where a request event occurs from a user who wants to monitor the process state, and in step S80, the network video recording apparatus 30 performs the following procedures: the request for the image search is received from an input/output interface device (e.g., a monitor configured by itself) or a user terminal 2 of a remote location connected via the central management device 40.
In step S90, the network image recording device 30 executes the following process: control is performed to display the object handling process performed by the semiconductor apparatus 1 as a continuous image by matching the tracking information stored into the tracking database 320 with the image information added with the camera identification information stored in the image database 310 according to the search condition input by the user.
As described above, according to the present invention, it is possible to provide an intelligent image tracking system in a semiconductor process that allows a user to track the entire process from the input of a wafer, a lot, or the like, which is a processing object of the semiconductor process, to a sub-device constituting a semiconductor device until the semiconductor process is completed.
In addition, according to the present invention, the stored images are stored in association with the chip and lot information, and based on this, the entire process from the equipment drop-in to the FOUP (front opening unified pod) recovery in units of chips and lots can be displayed to the user as if the same camera is tracking and recording.
[ description of reference numerals ]
1: semiconductor device with a plurality of semiconductor chips
2: user terminal
10: image capturing unit
20: device controller (Cluster tool controller)
30: network image recording equipment (network video recorder)
40: central management device
310: image database
320: a tracking database.
Claims (5)
1. An intelligent image tracking system in a semiconductor process, the intelligent image tracking system comprising:
an image capturing unit including cameras arranged at a plurality of points of a semiconductor device to capture a process performed on an object by the semiconductor device;
a device controller configured to control an operation of the semiconductor device and transmit object identification information, which is information for identifying the object, location information of the object mapped to time information, and operation state information indicating a current operation state of the semiconductor device; and
a network image recording device configured to perform control to add camera identification information to image information received from the image capturing unit and store the image information added with the camera identification information in an image database, and configured to perform control to store tracking information including the object identification information for identifying a camera capturing the image information, position information of the object mapped to the time information, and the operation state information, received from the device controller, in a tracking database.
2. An intelligent image tracking system in a semiconductor process according to claim 1, wherein the network image recording apparatus is configured to perform control to display a process performed on the object by the semiconductor device as a continuous image by matching the tracking information stored in the tracking database with the image information added with the camera identification information stored in the image database according to a search condition input by a user.
3. An intelligent image tracking system in a semiconductor process according to claim 1, wherein the network image recording device configures the object identification information as a root node, configures a start point and an end point on a path along which the object moves as child nodes, and stores the tracking information in the tracking database in a tree structure.
4. An intelligent image tracking system in a semiconductor process as claimed in claim 3, wherein the network image recording device selects one of the plurality of cameras according to the operation state information when the plurality of cameras are responsible for capturing the start point or the end point configured as the child node.
5. An intelligent image tracking system in a semiconductor process according to claim 1, wherein when the semiconductor device is plural and a device controller and a network image recording apparatus in charge of the semiconductor device have a number corresponding to the number of the semiconductor devices, the intelligent image tracking system further comprises: a central management device configured to manage the network image recording devices, and
the central management apparatus performs control to display an image provided by a network image recording apparatus designated by the user terminal among the plurality of network image recording apparatuses to the user terminal in response to a request from the user terminal at a remote location.
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| KR10-2018-0125323 | 2018-10-19 | ||
| KR1020180125323A KR102110498B1 (en) | 2018-10-19 | 2018-10-19 | Intelligent image tracking system of semiconductor process |
| PCT/KR2019/010767 WO2020080666A1 (en) | 2018-10-19 | 2019-08-23 | Intelligent image tracking system in semiconductor process |
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| KR20050048121A (en) | 2003-11-19 | 2005-05-24 | 삼성전자주식회사 | System for monitoring with etching apparatus and methode for the same |
| JP2007121768A (en) * | 2005-10-28 | 2007-05-17 | Mitsubishi Electric Corp | Screen display method and equipment monitoring device using method |
| JP2010055334A (en) * | 2008-08-28 | 2010-03-11 | Olympus Corp | Method of controlling production system, and production system |
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| JP5502424B2 (en) * | 2009-10-26 | 2014-05-28 | 株式会社東芝 | Manufacturing history recording system and manufacturing history recording method |
| KR101619097B1 (en) | 2015-08-17 | 2016-05-18 | 주식회사 엠에스비전 | Process monitoring system in semiconductor producing process |
| KR101909836B1 (en) * | 2017-12-04 | 2018-10-18 | 김정석 | HMI system for industrial process automation control, Process automation monitoring method based on the same |
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