CN112911819A

CN112911819A - Circuit board and manufacturing method thereof, and light-emitting device and manufacturing method thereof

Info

Publication number: CN112911819A
Application number: CN201911135629.6A
Authority: CN
Inventors: 黄秋佩; 涂成一; 陈颖星; 洪培豪; 赖正忠; 李远智
Original assignee: Uniflex Technology Jiangsu Ltd
Current assignee: Uniflex Technology Jiangsu Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2021-06-04

Abstract

The invention provides a circuit board which comprises a circuit structure and a white covering film. The circuit structure comprises an insulating substrate and a circuit layer. The circuit layer is located on the insulating substrate. And the white covering film is positioned on the circuit structure and exposes part of the circuit layer. The invention also provides a manufacturing method of the circuit board, a light-emitting device and a manufacturing method thereof.

Description

Circuit board and manufacturing method thereof, and light-emitting device and manufacturing method thereof

Technical Field

The present invention relates to a circuit board and a light emitting device having the same, and more particularly, to a circuit board having a white cover film (CVL) and a method for manufacturing the same, and a light emitting device and a method for manufacturing the same.

Background

The circuit board often has a cover film on the side where the electronic components are disposed. The coverlay film may be used to protect the circuitry within the wiring board.

Disclosure of Invention

The invention aims at a circuit board and a manufacturing method thereof, and the circuit board has better quality.

The manufacturing method of the circuit board comprises the following steps. A circuit structure is provided, which includes an insulating substrate and a circuit layer on the insulating substrate. A white cover film is formed on the circuit structure, and a part of the circuit layer is exposed by the white cover film.

In an embodiment of the present invention, the step of forming the white overcoat film includes: forming white ink on the circuit structure; curing the white ink formed on the circuit structure to form a white cured layer; and removing part of the white solidified layer to form an opening, wherein the opening exposes part of the circuit layer.

In one embodiment of the present invention, the white ink is a thermosetting white ink; and the white ink cured on the circuit structure is formed by heating.

In an embodiment of the invention, the manner of removing the portion of the white solidified layer is laser stripping.

In an embodiment of the invention, the sidewall of the opening is substantially perpendicular to the top surface of the line layer.

In an embodiment of the invention, the method for manufacturing a circuit board further includes the following steps. And forming a conductive protection layer on the circuit layer exposed by the white covering film.

The circuit board comprises a circuit structure and a white covering film. The circuit structure comprises an insulating substrate and a circuit layer positioned on the insulating substrate. The white covering film is positioned on the circuit structure, and part of the circuit layer is exposed out of the white covering film.

In an embodiment of the invention, the white cover film has an opening, the opening exposes a portion of the circuit layer, and a sidewall of the opening is substantially perpendicular to a top surface of the circuit layer.

The circuit board of the invention comprises the circuit board and the light-emitting component of any one of the embodiments. The light-emitting component is arranged on the circuit board and is electrically connected with the circuit layer of the circuit board.

The invention aims at a light-emitting device with a circuit board and a manufacturing method thereof, and the light-emitting device is good in quality.

The method for manufacturing the light-emitting device comprises the following steps. A wiring board of any of the preceding embodiments is provided. The light-emitting component is configured on the circuit board and electrically connected to the circuit layer of the circuit board.

Based on the above, the circuit board and the light-emitting device with the circuit board have better quality.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Fig. 1A to fig. 1D are schematic partial cross-sectional views illustrating a method for manufacturing a circuit board according to a first embodiment of the invention;

fig. 2 is a schematic partial cross-sectional view of a method for manufacturing a circuit board according to a second embodiment of the invention;

FIG. 3 is a schematic partial cross-sectional view of a portion of a method for fabricating a light emitting device in accordance with an embodiment of the present invention;

FIG. 4 is a schematic partial cross-sectional view of a circuit board according to a comparative example of the present invention;

fig. 5 is a schematic partial cross-sectional view of a wiring board according to a test example of the present invention.

Description of the reference numerals

100. 200: a circuit board;

300: a light emitting device;

110: a circuit structure;

120: an insulating base material;

121: a first surface;

122: a second surface;

130: a first circuit layer;

131: a top surface;

140: a second circuit layer;

150: white ink;

160: a white solidified layer;

161: an upper surface;

170: a white cover film;

171: an opening;

172: a side wall;

280: a conductive protective layer;

390: a light emitting assembly;

391: a conductive paste;

t1: a first thickness;

t2: a second thickness;

11: a laser device.

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

The foregoing and other technical and scientific aspects, features and utilities of the present invention will be apparent from the following detailed description of various embodiments, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: "upper", "lower", "front", "rear", "left", "right", etc., are simply directions with reference to the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. Also, in the following embodiments, the same or similar components will be given the same or similar reference numerals.

Referring to fig. 1A, a circuit structure 110 is provided. The circuit structure 110 includes an insulating substrate 120 and a first circuit layer 130. The insulating substrate 120 has a first surface 121 and a second surface 122. The first circuit layer 130 may be on the first surface 121 of the insulating substrate 120.

In the embodiment, the insulating substrate 120 may be a hard substrate or a flexible substrate, and the invention is not limited thereto. For example, the material of the hard substrate includes polymer glass fiber composite, glass, ceramic or other hard materials, and the material of the flexible substrate is Polyimide (PI) or other flexible materials. The insulating substrate 120 may be a single-layer board or a composite board, but the invention is not limited thereto.

In the embodiment, the circuit structure 110 may further include a second circuit layer 140, but the invention is not limited thereto. The second circuit layer 140 may be on the second surface 122 of the insulating substrate 120.

In an embodiment not shown, the line structure 110 may include a conductive via (not shown) penetrating the insulating substrate 120. The first circuit layer 130 on the first surface 121 and the second circuit layer 140 on the second surface 122 may be electrically connected through a via.

Referring to fig. 1B, a white ink 150 is formed on the circuit structure 110.

In this embodiment, the white ink 150 may be formed on the first surface 121 of the insulating substrate 120.

In this embodiment, the white ink 150 may be formed by coating. That is, the white ink 150 may cover the first circuit layer 130 and the insulating substrate 120.

In the embodiment, the white ink 150 may directly contact the first circuit layer 130 and the insulating substrate 120, but the invention is not limited thereto. That is, the thickness of the white ink 150 contacting the first circuit layer 130 may be different from the thickness of the white ink 150 contacting the insulating substrate 120, but the present invention is not limited thereto.

In the present embodiment, the white ink 150 is a thermosetting white ink. In other words, the white ink 150 needs to be cured by heating, and the white ink 150 cannot be cured by irradiation.

Referring to fig. 1C, the white ink 150 (shown in fig. 1B) is cured on the circuit structure 110 to form a white cured layer 160.

In the present embodiment, since the white ink 150 is obtained by curing the thermosetting white ink by heating, the method of curing the white ink 150 includes at least a heating step.

In the present embodiment, the upper surface 161 of the white cured layer 160 may be a substantially flat surface, and the thickness of the white cured layer 160 is not substantially uniform. For example, the contact portion of the white ink 150 and the first circuit layer 130 may have a first thickness T1, the contact portion of the white ink 150 and the insulating substrate 120 may have a second thickness T2, and the first thickness T1 is smaller than the second thickness T2.

Since the white cured layer 160 is formed by thermally curing the thermosetting white ink, the curing quality of the white cured layer 160 is good. For example, photo-curing of ink (i.e., photo-curing ink) may affect the curing quality of the photo-curing ink due to non-uniform thickness or due to reflection, diffraction or absorption of light by the components covered by the ink (including direct or indirect coverage).

Referring to fig. 1D, a portion of the white solidified layer 160 (shown in fig. 1C) is removed to form a white covering film 170 having an opening 171. The opening 171 of the white coverlay film 170 exposes a portion of the first circuit layer 130.

In fig. 1D, only one opening 171 is exemplarily shown, but the size, position, or number of the openings 171 is not limited by the present invention.

In this embodiment, a portion of the white solidified layer 160 may be removed by laser stripping via the laser device 11 to form the corresponding opening 171. Compared with the etching method, the quality of laser stripping is better. For example, by removing the cured ink by etching, undercutting or lateral erosion (undercutting) may occur. That is, in the opening 171 formed by the laser stripping, the sidewall 172 of the opening 171 may be a flat surface, and the sidewall 172 of the opening 171 may be substantially perpendicular to the top surface 131 of the first circuit layer 130.

The manufacturing of the circuit board 100 of the present embodiment can be substantially completed through the above processes.

Referring to fig. 1D, the circuit board 100 includes a circuit structure 110 and a white cover film 170. The circuit structure 110 includes an insulating substrate 120 and a first circuit layer 130 disposed on the insulating substrate 120. The white cover film 170 is disposed on the circuit structure 110, and the white cover film 170 exposes a portion of the first circuit layer 130.

In the present embodiment, the white cover film 170 has an opening 171. The opening 171 exposes a portion of the first circuit layer 130, and the sidewall 172 of the opening 171 is substantially perpendicular to the top surface 131 of the first circuit layer 130.

Fig. 2 is a schematic partial cross-sectional view of a part of a method for manufacturing a circuit board according to a second embodiment of the invention. The manufacturing method of the wiring board 200 of the present embodiment is similar to that of the wiring board 100 of the first embodiment, and like components thereof are denoted by like reference numerals and have like functions, materials, or formation manners, and description thereof is omitted.

Referring to fig. 2, following the step shown in fig. 1D, after the opening 171 is formed, a conductive passivation layer 280 may be formed on the first circuit layer 130 exposed by the white cover film 170. The conductive protection layer 280 may be an Electroless Nickel-Palladium Immersion Gold (ENEPIG, electroles Nickel electroles Palladium Immersion Gold) layer formed by Electroless plating, but the invention is not limited thereto.

The manufacturing of the circuit board 200 of the present embodiment can be substantially completed through the above processes.

The wiring board 200 of the present embodiment is similar to the wiring board 100 of the first embodiment, with the difference that: the wiring board 100 may further include a conductive protection layer 280. The conductive protection layer 280 is located on the first circuit layer 130 exposed by the white cover film 170.

In the present embodiment, the conductive protection layer 280 may be located in the opening 171 of the white cover film 170, but the present invention is not limited thereto.

Fig. 3 is a schematic partial cross-sectional view of a part of a method for manufacturing a light-emitting device according to an embodiment of the invention. The method of manufacturing the light emitting device of the present embodiment is exemplarily manufactured using one of the wiring boards 100 of the first embodiment. Therefore, like components thereof are denoted by the same reference numerals and have like functions, materials, or formation manners, and description thereof is omitted. In other embodiments, not shown, the light-emitting device can be fabricated by using other circuit boards similar to the circuit board 100 of the first embodiment (e.g., the same or similar circuit board 200 of the second embodiment).

Referring to fig. 1D and fig. 3, the light emitting device 390 may be disposed on the circuit board 100, and the light emitting device 390 is electrically connected to the first circuit layer 130 of the circuit board 100 to form the light emitting device 300.

In the present embodiment, the light emitting device 390 may be electrically connected to the corresponding portion of the first circuit layer 130 by flip chip bonding (flip chip bonding). For example, the light emitting element 390 and the corresponding portion of the first circuit layer 130 can be electrically connected by a conductive paste 391 (e.g., solder paste).

In addition, the

wiring board

100 or 200 used in the light-emitting device 300 has the white cover film 170. The light-emitting device 300 has better light-emitting efficiency than cover films of other colors (i.e., not white). Here, white may be in the range of visible light, with a light reflectance of greater than or equal to 90% for the range of visible light; preferably, the light reflectance for the range of visible light is greater than or equal to 95%; more preferably, the light reflectance for the visible light range is greater than or equal to 98%.

Comparative example and test example

In order to prove that the quality of the circuit board and the manufacturing method thereof using the invention is better, the comparative example and the test example are particularly taken as the description. However, these test examples are not to be construed in any way as limiting the scope of the present invention.

Fig. 4 is a schematic partial cross-sectional view of a wiring board according to a comparative example of the present invention. Fig. 5 is a schematic partial cross-sectional view of a wiring board according to a test example of the present invention.

The circuit board of the comparative example was similar to the circuit board of the test example in the manufacturing method, and the difference was: the cover film of the circuit board of the comparative example did not use the thermosetting white ink, and the cured ink was removed by etching in the comparative example, while the circuit board of the test example used the thermosetting white ink, and the cured ink was removed by laser lift-off in the test example.

As shown in fig. 4, the circuit board of the comparative example may have undercut or lateral erosion (undercut). Therefore, the circuit board of the test example (shown in fig. 5) was better in quality than the circuit board of the comparative example (shown in fig. 4).

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing method of a circuit board comprises the following steps:

providing a wiring structure comprising:

an insulating base material; and

a circuit layer on the insulating substrate; and

and forming a white covering film on the circuit structure, wherein part of the circuit layer is exposed.

2. The method for manufacturing a wiring board according to claim 1, wherein the step of forming the white cover film comprises:

forming white ink on the circuit structure;

curing the white forming ink on the circuit structure to form a white cured layer; and

and removing part of the white solidified layer to form an opening, wherein the opening exposes part of the circuit layer.

3. A method of manufacturing a wiring board according to claim 2, wherein:

the white ink is thermosetting white ink; and is

The white ink cured on the circuit structure is formed by heating.

4. A method of manufacturing a wiring board according to claim 3, wherein:

the way to remove part of the white solidified layer is laser stripping.

5. The method of claim 4, wherein the sidewalls of the opening are substantially perpendicular to the top surface of the wiring layer.

6. A method of fabricating a wiring board according to claim 1, further comprising:

and forming a conductive protection layer on the circuit layer exposed by the white covering film.

7. A circuit board, comprising:

a circuit structure, comprising:

an insulating base material; and

a circuit layer on the insulating substrate; and

and the white covering film is positioned on the circuit structure and exposes part of the circuit layer.

8. The wiring board of claim 7, wherein the white coverlay film has an opening that exposes a portion of the wiring layer, and sidewalls of the opening are substantially perpendicular to a top surface of the wiring layer.

9. A light emitting device comprising:

the wiring board of any one of claims 7 to 8; and

and the light-emitting component is configured on the circuit board and is electrically connected to the circuit layer of the circuit board.

10. A method of making a light emitting device, comprising:

providing a wiring board according to any one of claims 7 to 8;

and configuring a light-emitting component on the circuit board, and electrically connecting the light-emitting component to the circuit layer of the circuit board.