CN112910251A

CN112910251A - Electronic equipment and control method thereof

Info

Publication number: CN112910251A
Application number: CN202110111774.1A
Authority: CN
Inventors: 郑乐平
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2021-06-04
Also published as: WO2022161345A1

Abstract

The application discloses electronic equipment and a control method thereof, relates to the technical field of electronics, and solves the problem that power consumption is not considered in the process of switching the working mode of a BOB power supply, and the electric quantity is seriously consumed. The electronic device includes: the circuit comprises a CPU, a buck-boost converter BOB, an inductor and a switch element, wherein the CPU is respectively connected with the BOB and the switch element, the BOB is provided with at least two pairs of pins, a first pair of pins in the at least two pairs of pins are respectively connected with two ends of the inductor, and a second pair of pins or the first pair of pins in the at least two pairs of pins are respectively connected with two ends of the switch element; switching the BOB to a bypass mode if the input voltage of the BOB is less than or equal to a voltage threshold; wherein the voltage threshold is equal to the actual output voltage/η of the BOB, where η is the conversion efficiency of the BOB. The power saving method and the power saving device are used for saving power of the BOB power supply.

Description

Electronic equipment and control method thereof

Technical Field

The application belongs to the technical field of electronics, and particularly relates to electronic equipment and a control method thereof.

Background

Buck-Boost (BOB) power supplies (including BOB and inductors) are often used in electronic devices to supply power to modules such as low dropout linear regulators (LDOs). Switching the operating mode of the BOB power supply is often involved in the process of supplying power to the BOB power supply.

The prior art switches the operating mode of the BOB power supply according to the magnitude relationship between the actual input voltage and the configured output voltage of the BOB power supply.

In the process of implementing the present application, the applicant finds that at least the following problems exist in the prior art: the power consumption is not considered in the process of switching the operating mode of the BOB power supply, and the problem of serious power consumption exists.

Disclosure of Invention

The present application aims to provide an electronic device and a control method thereof, which at least solve the problem in the prior art that power consumption is not considered in the process of switching the operating mode of the BOB power supply, and the power consumption is serious.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an electronic device, including: the circuit comprises a CPU, a buck-boost converter BOB, an inductor and a switch element, wherein the CPU is respectively connected with the BOB and the switch element, the BOB is provided with at least two pairs of pins, a first pair of pins in the at least two pairs of pins are respectively connected with two ends of the inductor, and a second pair of pins or the first pair of pins in the at least two pairs of pins are respectively connected with two ends of the switch element; switching the BOB to a bypass mode if an input voltage of the BOB is less than or equal to a voltage threshold; wherein the voltage threshold is equal to an actual output voltage/η of the BOB, where η is a conversion efficiency of the BOB.

In a second aspect, an embodiment of the present application provides a method for controlling an electronic device described above, including: acquiring an input voltage of the BOB; determining whether the input voltage is less than or equal to a voltage threshold; wherein the voltage threshold is equal to an actual output voltage/η of the BOB, wherein η is a conversion efficiency of the BOB; switching the BOB to a bypass mode and turning on the switching element if the input voltage is less than or equal to a voltage threshold.

In the embodiment of the application, by additionally arranging the switch element in the electronic device, the switch element is connected with the CPU, and the second pair of pins or the first pair of pins of at least two pairs of pins of the BOB are respectively connected with two ends of the switch element, and the BOB is switched to the bypass mode when the input voltage of the BOB is less than or equal to the voltage threshold, so that a part of power consumption of the BOB can be reduced, and the power saving effect can be achieved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a block diagram of an electronic device according to an embodiment of the present disclosure;

fig. 2(a) is a block diagram of an electronic device according to another embodiment of the present application;

fig. 2(b) is a block diagram of an electronic device according to another embodiment of the present application;

FIG. 3(a) is a schematic diagram of an electronic device according to another embodiment of the present application;

FIG. 3(b) is a schematic diagram of an electronic device according to another embodiment of the present application;

FIG. 4(a) is a schematic diagram of an electronic device according to another embodiment of the present application;

FIG. 4(b) is a schematic diagram of an electronic device according to another embodiment of the present application;

FIG. 5 is a schematic diagram of a BOB power supply in an electronic device according to an embodiment of the present application;

fig. 6 is a schematic diagram of a control method of an electronic device according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of a control method of an electronic device according to an embodiment of the present application;

fig. 8 is a schematic diagram of a control method of an electronic device according to an embodiment of the present disclosure;

fig. 9 is a schematic diagram of a control method of an electronic device according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. Further, "and/or" in the specification and claims means at least one of the connected objects.

In the description of the present application, it is to be noted that the terms "connected" and "connected," unless otherwise specifically stated or limited, are to be construed broadly, e.g., as meaning directly connected to one another, indirectly connected through an intermediary, and communicating between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The electronic device in the embodiment of the application may be a mobile terminal such as a mobile phone, an ipad, a smart watch, and smart glasses, and is not limited specifically here. Currently, the BOB in the electronic device can be based on the actual input voltage V of the BOB_INAnd output voltage V of BOB configuration_SETTo seamlessly switch 3 operating modes of the BOB: buck mode, boost mode, bypass mode, so that the BOB can regulate the output voltage over the entire input voltage range.

In particular, by comparing the actual input voltage V of the BOB_INAnd output voltage V of BOB configuration_SETTo seamlessly switch the following 3 operating modes of the BOB:

when V is_IN>V_SET,V_BOB＝V_SETWhen the BOB is switched to a voltage reduction mode;

when V is_IN<V_SET,V_BOB＝V_SETWhen the BOB is switched to the boosting mode, the BOB is switched to the boosting mode;

when V is_IN＝V_SET,V_BOB＝V_SETWhen so, the BOB switches to bypass mode.

Wherein, V_INThe actual input voltage of the BOB; v_SETAn output voltage configured for the BOB; v_BOBThe actual output voltage of BOB. The output voltage of the BOB configuration is generally equal to the actual output voltage of the BOB.

Meanwhile, the conversion efficiency eta of the BOB can be considered in the switching process of the working mode of the BOB. The conversion efficiency η of the BOB is the output power of the BOB/the input power of the BOB, the conversion efficiency η of the BOB is not a fixed constant value under different input voltages and different output currents, and if the conversion efficiency η of the BOB is small, the electric quantity of the ineffective loss of the BOB is large.

The BOB power supply in the electronic device may be used to power other modules, such as LDO modules, flash modules, and the like. In fig. 1, the right end of the BOB power supply may be connected in series with the LDO module (not shown in fig. 1). That is, when the BOB power supply in the electronic device is used to supply power to the LDO module, the output voltage of the BOB power supply is the input voltage of the LDO module.

The working mode of the LDO module is generally a buck mode, that is, the output voltage of the LDO module can be generally smaller than the input voltage. For example, when the output voltage of the BOB power supply is used as the input voltage of the LDO module, the output voltage of the BOB power supply may be generally 3.45V or 3.65V at the minimum, that is, the input voltage of the LDO module may be generally 3.45V or 3.65V at the minimum. When the LDO module operates in the buck mode, the output voltage of the LDO module may be generally 1.8V, 2.8V, 3.0V, 3.3V, and the like.

The electronic equipment and the control method thereof can improve the conversion efficiency of the BOB channel. Specifically, for example, by comparing the conversion efficiency of the BOB path with the conversion efficiency of the LDO path, the embodiment of the present application switches the BOB path to the equivalent LDO path when the condition that the conversion efficiency of the BOB path is less than or equal to the conversion efficiency of the LDO path is satisfied, which can improve the conversion efficiency of the BOB path, reduce a part of power consumption of the BOB, and achieve the purpose of saving power.

The conversion efficiency of the LDO channel is the output power of the LDO module/the input power of the LDO module, and since the input current and the output current of the separate LDO channel can be approximately equal, the conversion efficiency of the LDO channel is the output voltage of the LDO module/the input voltage of the LDO module. That is, the LDO channel conversion efficiency is V_OUT/V_IN. Wherein, V_OUTIs the output voltage of LDO module, V_INIs the input voltage of the LDO module.

It should be noted that the BOB path mentioned in the embodiments of the present application may be a path including the BOB and a module (e.g., LDO module) powered by the BOB, V_INOr an input voltage representing BOB. It is to be understood that the following description is given by way of example only, and not by way of limitation, of a BOB path including a BOB and an LDO module.

Because the right end of the BOB can be connected with the LDO module in series, the conversion efficiency of the BOB channel can be the output power of the BOB channel/the input power of the BOB channel. Specifically, since the BOB powers the LDO module, current flows from the BOB into and out of the LDO module. In a BOB path including the BOB and the LDO module, an input power of the BOB may be used as an input power of the BOB path, and an output power of the LDO module may be used as an output power of the BOB path. Accordingly, the conversion efficiency of the BOB path can be the output power of the LDO module/the input power of the BOB.

Since the BOB is connected in series with the LDO module, the output voltage of the BOB is equal to the input voltage of the LDO module, and the output current of the BOB is equal to the input current of the LDO module, i.e., the output power of the BOB is equal to the input power of the LDO module. The conversion efficiency of the BOB path can be further extended to (output power of LDO module/input power of LDO module) × (output power of BOB/input power of BOB).

Further, the conversion efficiency of the BOB (i.e., output power of the BOB/input power of the BOB) may be generally set to η. The input current of the LDO module is equal to the output current of the BOB, the input current of the LDO module and the output current of the LDO module can be approximately equal, and the conversion efficiency of the BOB channel is further simplified into (the output voltage of the LDO module/the input voltage of the LDO module)) Conversion efficiency of BOB. That is, the BOB path conversion efficiency is (V)_OUT/V_BOB) Eta. Wherein, V_OUTIs the output voltage of LDO module, V_BOBThe output voltage of the BOB.

Based on the condition that the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, the equivalent result is that: (V)_OUT/V_BOB)*η≤V_OUT/V_INThe simplification is as follows: v_IN≤V_BOB/η。

From the above, it can be seen that V is satisfied_IN≤V_BOBAnd when the/eta condition is met, the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency. At this time, since the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, the BOB channel is switched to an equivalent LDO channel (the equivalent LDO channel refers to a channel including only the LDO module), the BOB channel conversion efficiency can be improved, and a part of the BOB power consumption can be reduced.

The embodiment of the application provides electronic equipment and a control method thereof, which can obtain the input voltage of the BOB of the electronic equipment, wherein the input voltage meets V_IN≤V_BOBUnder the condition of eta, the BOB is bypassed, so that the BOB path is switched to an equivalent LDO path, the conversion efficiency of the BOB path can be improved, and part of power consumption of the BOB is reduced.

On the other hand, the embodiment of the application provides another way for reducing the power consumption of the BOB power supply. Specifically, the embodiment of the application can further reduce the on-resistance of the BOB power supply and further reduce a part of power consumption of the BOB by turning on the switching element.

The electronic device and the control method thereof according to the embodiments of the present application are described in detail below with reference to the accompanying drawings.

An embodiment of the present application provides an electronic device, as shown in fig. 1, the electronic device includes: the BOB power supply comprises a BOB and an inductor, the CPU is respectively connected with the BOB and the switch element, and the BOB is connected with the switch element.

The BOB is provided with at least two pairs of pins, and a first pair of pins in the at least two pairs of pins are respectively connected with two ends of the inductor. The second pair of pins or the first pair of pins in the at least two pairs of pins are respectively connected with two ends of the switch element;

switching the BOB to a bypass mode if an input voltage of the BOB is less than or equal to a voltage threshold; wherein the voltage threshold is equal to an actual output voltage/η of the BOB, where η is a conversion efficiency of the BOB.

In the embodiment of the application, a switching element is additionally arranged in an electronic device, the switching element is connected with a CPU, a second pair of pins or a first pair of pins of at least two pairs of pins of a BOB are respectively connected with two ends of the switching element, and the BOB is switched to a bypass mode when the input voltage of the BOB is less than or equal to a voltage threshold; the voltage threshold is equal to the actual output voltage/η of the BOB, wherein η is the conversion efficiency of the BOB, so that when the input voltage of the BOB is less than or equal to the actual output voltage/η of the BOB, the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel, the BOB channel is switched to an equivalent LDO channel, and the BOB is specifically switched to the bypass mode, so that the conversion efficiency of the BOB channel can be improved, part of power consumption of the BOB can be reduced, and the effect of saving power is achieved.

In the embodiment of the present application, a schematic diagram of a BOB power supply in an electronic device as shown in fig. 1 may refer to fig. 5. The BOB power supply includes a BOB and an inductor, the BOB may be a packaged BOB chip, a block diagram of a dotted line portion shown in fig. 5 is a schematic diagram of the BOB chip, and in addition, a specific structure of the BOB chip is not limited in the embodiment of the present application. The BOB chip shown in fig. 5 may include: pin L1, pin L2, pin VIN, pin VOUT; the pin L1 and the pin L2 are generally used for connecting an inductor L1; the BOB chip may have 4 switches inside: the 4 switches cooperate to control the flow direction of the input current in the chip, so as to realize the functions of boosting and reducing voltage.

In addition, at V_IN＝V_SET,V_BOB＝V_SETIn time, the BOB chip can also realize the bypass function. In the BOB chip, the working principle of switching the BOB into the bypass mode is that: the switch K1 and the switch K4 inside the BOB chip are conducted, the switch K2 and the switch K3 are not conducted, and the current can be changed from V_INThe pin enters and flows through the switch K1, the inductor L1 and the switch K4 from V_OUTAnd the pin flows out.

Optionally, as shown in fig. 2(a), in the electronic device provided in the embodiment of the present application, the second pair of pins may include a first voltage pin and a second voltage pin; the first voltage pin may be a VIN pin shown in fig. 2(a), the second voltage pin may be a VOUT pin shown in fig. 2(a), and the VIN pin and the VOUT pin may be respectively connected to two ends of the switching element;

turning on the switching element when the input voltage of the BOB is less than or equal to a voltage threshold or the input voltage of the BOB is equal to an actual output voltage of the BOB;

wherein the voltage threshold is equal to an actual output voltage/η of the BOB, where η is a conversion efficiency of the BOB.

It should be noted that the on-resistance of the switching element can be made very low (e.g., 2m Ω), and the on-resistance of the switching element is lower than that of the BOB power supply in the bypass mode of the BOB in the related art.

In the embodiment of the application, by additionally arranging a switch element in an electronic device, the switch element is connected with a CPU, and a first voltage pin and a second voltage pin of a BOB are respectively connected to two ends of the switch element, and the switch element is turned on when an input voltage of the BOB is less than or equal to a voltage threshold, or the input voltage of the BOB is equal to an actual output voltage of the BOB. Therefore, when the input voltage of the BOB is less than or equal to the voltage threshold value, the switching element is conducted, the conversion efficiency of the BOB path can be improved, and part of power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, the on-resistance of the BOB power supply is reduced by turning on the switching element, compared with the case that the BOB is in the bypass mode in the related art, so that a part of power consumption of the BOB can be reduced, and the effect of saving power is achieved.

Optionally, as shown in fig. 2(b), in the electronic device provided in the embodiment of the present application, the first pair of pins may include a first inductance pin and a second inductance pin; the first inductor pin may be an L1 pin shown in fig. 2(b), the second inductor pin may be an L2 pin shown in fig. 2(b), and the L1 pin and the L2 pin may be respectively connected to two ends of the switching element;

switching the BOB to a bypass mode and turning on the switching element when the input voltage of the BOB is less than or equal to a voltage threshold or the input voltage of the BOB is equal to an actual output voltage of the BOB;

In the embodiment of the application, a switching element is additionally arranged in an electronic device, the switching element is connected with a CPU, a first inductance pin and a second inductance pin of a BOB are respectively connected with two ends of the switching element, and the BOB is switched to a bypass mode and the switching element is conducted under the condition that the input voltage of the BOB is smaller than or equal to a voltage threshold value or the input voltage of the BOB is equal to the actual output voltage of the BOB. Therefore, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB is switched to the bypass mode, and the switch element is conducted to bypass the BOB, so that the conversion efficiency of a BOB channel can be improved, and part of power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to the bypass mode, and the switching element is turned on, so that compared with the case that the BOB is in the bypass mode in the related art, the on-resistance of the BOB power supply is reduced, thereby reducing a part of power consumption of the BOB and achieving the effect of power saving.

Optionally, in the electronic device provided in the embodiment of the present application, the switching element may be a component having a switching function and low on-resistance. For example, the switching element may include a Metal-Oxide-Semiconductor Field Effect Transistor (mOSFET). In which the on-resistance of the MOSFET can be made very low, for example 2m omega. The switching element may also include other common switches having a switching function and a low on-resistance, and the type of the switching element is not particularly limited herein.

In the embodiment of the present application, the number of MOSFETs may be one or more. The type of MOSFET may also be varied. For example, the MOSFET may be an N-channel MOSFET (N-channel MOSFET) or a P-channel MOSFET (P-channel MOSFET), and the specific number and the specific type of the MOSFETs are not limited in the embodiments of the present application.

For example, when the switching element includes a MOSFET, the switching element may include an N-channel MOSFET; alternatively, the switching element may include a P-channel MOSFET.

In the embodiment of the present application, an N-channel MOSFET or a P-channel MOSFET may be selected as the switching element. The on-resistance of the N-channel MOSFET can be generally 2m Ω, and the on-resistance of the N-channel MOSFET is generally lower than that of the P-channel MOSFET, that is, the N-channel MOSFET can save more energy consumption than the P-channel MOSFET. Meanwhile, compared with an N-channel MOSFET, in an electronic device, a higher voltage is generally required to turn on a P-channel MOSFET, for example, an additional high-voltage power supply may be required to turn on the P-channel MOSFET, and the P-channel MOSFET is also less convenient than the N-channel MOSFET in terms of convenience in use.

For another example, when the switching element includes a pair of reverse-connected MOSFETs, the switching element may include a pair of reverse N-channel MOSFETs; alternatively, the switching element may include a pair of inverted P-channel MOSFETs.

In the present embodiment, a pair of reverse-connected MOSFETs (e.g., a pair of inverted N-channel MOSFETs, or a pair of inverted P-channel MOSFETs) has better utility than one MOSFET. If the switch element is an N-channel MOSFET, the external switch element (an N-channel MOSFET) may leak current due to a body diode existing inside the N-channel MOSFET when the BOB is in the buck mode. If the switch element is a pair of reverse N-channel MOSFETs, when the BOB is in the step-down mode, because the pair of N-channel MOSFETs are reversely connected, the directions of body diodes in the two MOSFETs are also opposite, the risk of electric leakage does not exist, and the safety of the electronic equipment is improved.

Optionally, in the electronic device provided in this embodiment of the application, the switching element includes a MOSFET, the MOSFET has a gate, a source, and a drain, the gate is connected to the CPU, the second pair of pins includes a first voltage pin and a second voltage pin, and the first voltage pin and the second voltage pin are respectively connected to the source and the drain of the MOSFET. Wherein, the CPU can control the conduction of the MOSFET by sending an enabling signal to the grid of the MOSFET.

In the embodiment of the application, the MOSFET is additionally arranged in the electronic equipment, the grid of the MOSFET is connected with the CPU, and the first voltage pin and the second voltage pin of the BOB are respectively connected with the source electrode and the drain electrode of the MOSFET, so that the conduction impedance of the BOB power supply can be reduced by controlling the conduction of the MOSFET, part of power consumption of the BOB can be reduced, and the power saving effect is achieved.

In the embodiment of the present application, depending on the type of the MOSFET, the first voltage pin and the second voltage pin respectively connected to the source and the drain of the MOSFET may include the following two cases: the first voltage pin is connected with the source electrode of the MOSFET, and the second voltage pin is connected with the drain electrode of the MOSFET; and secondly, the first voltage pin is connected with the drain electrode of the MOSFET, and the second voltage pin is connected with the source electrode of the MOSFET.

In the electronic device provided in the embodiment of the present application, as shown in fig. 3(a), the MOSFET may be an N-channel MOSFET. Accordingly, in this case, the VIN pin may be connected to the source of the N-channel MOSFET and the VOUT pin may be connected to the drain of the N-channel MOSFET. Wherein the gate of the N-channel MOSFET may be connected to the central processing unit CPU (not shown).

In the embodiment of the application, an N-channel MOSFET is additionally arranged in the electronic equipment, the grid electrode of the N-channel MOSFET is connected with a CPU, the VIN pin is used for connecting the source electrode of the N-channel MOSFET, and the VOUT pin is connected with the drain electrode of the N-channel MOSFET, so that the conduction impedance of a BOB power supply can be reduced by controlling the conduction of the N-channel MOSFET, and therefore, part of power consumption of the BOB can be reduced, and the power saving effect is achieved. Also, in the embodiments of the present application, the on-resistance of one N-channel MOSFET is lower than that of one P-channel MOSFET, and a part of power consumption of the electronic device can be further reduced.

In an electronic device provided by another embodiment of the present application, the MOSFET may be a P-channel MOSFET. Correspondingly, in this case, the VIN pin is connected to the drain of the P-channel MOSFET, and the VOUT pin is connected to the source of the P-channel MOSFET; the gate of the P-channel MOSFET is connected to the central processing unit CPU (not shown).

In the embodiment of the application, the P-channel MOSFET is additionally arranged in the electronic equipment, the grid electrode of the P-channel MOSFET is connected with the CPU, the VIN pin is connected with the drain electrode of the P-channel MOSFET, and the VOUT pin is connected with the source electrode of the P-channel MOSFET.

Optionally, in the electronic device provided in this embodiment of the present application, the switching element may include a pair of reverse-connected MOSFETs, the second pair of pins includes a first voltage pin and a second voltage pin, and the first voltage pin, the pair of reverse-connected MOSFETs, and the second voltage pin are sequentially connected in series.

In the embodiment of the application, a pair of reversely connected MOSFETs is additionally arranged in the electronic equipment, and a second pair of pins of the BOB is utilized, wherein the second pair of pins comprises a first voltage pin and a second voltage pin, and the first voltage pin, the pair of reversely connected MOSFETs and the second voltage pin are sequentially connected in series, so that the conduction impedance of the BOB power supply is reduced by controlling the conduction of the pair of reversely connected MOSFETs, and therefore, part of power consumption of the BOB can be reduced, and the power saving effect is achieved.

In the embodiment of the present application, depending on the type of the MOSFET, the sequential series connection of the first voltage pin, the pair of reverse-connected MOSFETs, and the second voltage pin may include the following two cases: first, the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the first voltage pin, and the source electrode of the second MOSFET is connected with the second voltage pin; the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source electrode of the first MOSFET is connected with the source electrode of the second MOSFET, the drain electrode of the first MOSFET is connected with the first voltage pin, and the drain electrode of the second MOSFET is connected with the second voltage pin.

In an electronic device provided by an embodiment of the present application, the pair of reverse-connected MOSFETs includes a first MOSFET and a second MOSFET. As shown in fig. 3(b), the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the VIN pin, and the source electrode of the second MOSFET is connected with the VOUT pin. Wherein the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU (not shown).

In the embodiment of the application, a pair of N-channel MOSFETs which are reversely connected is additionally arranged in the electronic device, the grid electrode of each N-channel MOSFET is connected with the CPU, the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the VIN pin, and the source electrode of the second MOSFET is connected with the VOUT pin. Also, in the embodiments of the present application, the on-resistance of the pair of reverse-connected N-channel MOSFETs is lower than that of the pair of reverse-connected P-channel MOSFETs, and a part of power consumption of the electronic device can be further reduced. Compared with an N-channel MOSFET, the directions of two body diodes inside the N-channel MOSFET which is reversely connected are also opposite, the electric leakage risk does not exist in the electronic equipment, and the safety of the electronic equipment is improved.

In another embodiment of the present application, there is provided an electronic device wherein the pair of reverse connected MOSFETs includes a first MOSFET and a second MOSFET. The first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected with the source of the second MOSFET, the drain of the first MOSFET is connected with the first voltage pin, the drain of the second MOSFET is connected with the second voltage pin, and the gate of the first MOSFET and the gate of the second MOSFET are both connected with the CPU (not shown).

In the embodiment of the application, a pair of reversely connected P-channel MOSFETs is additionally arranged in the electronic device, the gates of the pair of reversely connected P-channel MOSFETs are connected with the CPU, the source of the first MOSFET is connected with the source of the second MOSFET, the drain of the first MOSFET is connected with the VIN pin, and the drain of the second MOSFET is connected with the VOUT pin. In addition, in the embodiment of the application, compared with one P-channel MOSFET, the directions of the two body diodes inside the pair of P-channel MOSFETs which are reversely connected are also opposite, so that the electronic device has no leakage risk, and the safety of the electronic device is improved.

In the electronic device provided in the embodiment of the present application, in addition to the second pair of pins including the first voltage pin and the second voltage pin being respectively connected to the switching element as described above, the first pair of pins including the first inductance pin and the second inductance pin being respectively connected to the switching element may be also used.

In an embodiment of the electronic device provided by the present application, the switching element includes a MOSFET having a gate, a source, and a drain, the gate is connected to the CPU, the first pair of pins includes a first inductance pin and a second inductance pin, and the first inductance pin and the second inductance pin are respectively connected to the source and the drain of the MOSFET.

In the embodiment of the application, the MOSFET is additionally arranged in the electronic equipment, the grid of the MOSFET is connected with the CPU, and the first inductance pin and the second inductance pin of the BOB are respectively connected with the source electrode and the drain electrode of the MOSFET, so that the conduction impedance of the BOB power supply can be reduced by controlling the conduction of the MOSFET, part of power consumption of the BOB can be reduced, and the power saving effect is achieved.

In the embodiment of the present application, depending on the type of the MOSFET, the connection of the first inductor pin and the second inductor pin to the source and the drain of the MOSFET, respectively, may include the following two cases: the first inductance pin is connected with the source electrode of the MOSFET, and the second inductance pin is connected with the drain electrode of the MOSFET; and secondly, the first inductance pin is connected with the drain electrode of the MOSFET, and the second inductance pin is connected with the source electrode of the MOSFET.

In the electronic device provided in the embodiment of the present application, as shown in fig. 4(a), the MOSFET may be an N-channel MOSFET, and correspondingly, in this case, the connection between the first inductor pin and the second inductor pin and the source and the drain of the MOSFET may specifically be: the L1 pin is connected to the source of the N-channel MOSFET, and the L2 pin is connected to the drain of the N-channel MOSFET. Wherein the gate of the N-channel MOSFET is connected to the central processing unit CPU (not shown).

In the embodiment of the application, by additionally arranging the N-channel MOSFET in the electronic device, the grid of the N-channel MOSFET is connected with the CPU, the L1 pin is used for connecting the source of the N-channel MOSFET, and the L2 pin is connected with the drain of the N-channel MOSFET, so that the conduction impedance of the BOB power supply can be reduced by controlling the conduction of the N-channel MOSFET, thereby reducing part of power consumption of the BOB and achieving the effect of power saving. Also, in the embodiments of the present application, the on-resistance of one N-channel MOSFET is lower than that of one P-channel MOSFET, and a part of power consumption of the electronic device can be further reduced.

In an electronic device provided by another embodiment of the present application, the MOSFET may be a P-channel MOSFET, and accordingly, in this case, the connection between the first inductor pin and the second inductor pin and the source and the drain of the MOSFET may specifically be: the L1 pin is connected with the drain of the P-channel MOSFET, and the L2 pin is connected with the source of the P-channel MOSFET; the gate of the P-channel MOSFET is connected to the central processing unit CPU (not shown).

In the embodiment of the application, by additionally arranging the P-channel MOSFET in the electronic device, the grid of the P-channel MOSFET is connected with the CPU, the L1 pin is connected with the drain of the P-channel MOSFET, and the L2 pin is connected with the source of the P-channel MOSFET, so that the conduction impedance of the BOB power supply can be reduced by controlling the conduction of the P-channel MOSFET, thereby reducing part of power consumption of the BOB and achieving the effect of saving power.

Optionally, in the electronic device provided in this embodiment of the present application, the switching element may include a pair of reverse-connected MOSFETs, the first pair of pins includes a first inductance pin and a second inductance pin, and the first inductance pin, the pair of reverse-connected MOSFETs, and the second inductance pin are sequentially connected in series.

In the embodiment of the application, a pair of reverse-connection MOSFETs are additionally arranged in the electronic equipment, a first pair of pins of the BOB are utilized, the first pair of pins comprise a first inductance pin and a second inductance pin, and the first inductance pin, the pair of reverse-connection MOSFETs and the second inductance pin are sequentially connected in series, so that the conduction impedance of the BOB power supply is reduced by controlling the conduction of the pair of reverse-connection MOSFETs, and therefore, part of power consumption of the BOB can be reduced, and the power saving effect is achieved.

In the embodiment of the present application, depending on the type of the MOSFET, the connection of the first inductor pin, the pair of reverse-connected MOSFETs, and the second inductor pin in series in this order may include the following two cases: first, the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the first inductance pin, and the source electrode of the second MOSFET is connected with the second inductance pin; the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source electrode of the first MOSFET is connected with the source electrode of the second MOSFET, the drain electrode of the first MOSFET is connected with the first inductance pin, and the drain electrode of the second MOSFET is connected with the second inductance pin.

In the electronic device provided by the embodiment of the present application, the pair of reverse-connected MOSFETs includes a first MOSFET and a second MOSFET, and as shown in fig. 4(b), the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain of the first MOSFET is connected with the drain of the second MOSFET, the source of the first MOSFET is connected with the pin L1, and the source of the second MOSFET is connected with the pin L2. Wherein the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU (not shown).

In the embodiment of the application, a pair of reversely connected N-channel MOSFETs is additionally arranged in an electronic device, the grid of each N-channel MOSFET is connected with a CPU, the drain of a first MOSFET is connected with the drain of a second MOSFET, the source of the first MOSFET is connected with the pin L1, and the source of the second MOSFET is connected with the pin L2, so that the on-resistance of a BOB power supply can be reduced by controlling the conduction of the pair of reversely connected N-channel MOSFETs, and a part of power consumption of the BOB can be reduced, and the effect of saving power is achieved. Also, in the embodiments of the present application, the on-resistance of the pair of reverse-connected N-channel MOSFETs is lower than that of the pair of reverse-connected P-channel MOSFETs, and a part of power consumption of the electronic device can be further reduced. Compared with an N-channel MOSFET, the directions of two body diodes inside the N-channel MOSFET which is reversely connected are also opposite, the electric leakage risk does not exist in the electronic equipment, and the safety of the electronic equipment is improved.

In another embodiment of the present application, an electronic device is provided, in which the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source electrode of the first MOSFET is connected with the source electrode of the second MOSFET, the drain electrode of the first MOSFET is connected with the first inductance pin, the drain electrode of the second MOSFET is connected with the second inductance pin, and the grid electrode of the first MOSFET and the grid electrode of the second MOSFET are both connected with the CPU (not shown).

In the embodiment of the application, a pair of reversely connected P-channel MOSFETs is additionally arranged in an electronic device, gates of the pair of reversely connected P-channel MOSFETs are connected with a CPU, the source of a first MOSFET is connected with the source of a second MOSFET, the drain of the first MOSFET is connected with the pin L1, and the drain of the second MOSFET is connected with the pin L2, so that the on-resistance of a BOB power supply can be reduced by controlling the conduction of the pair of reversely connected P-channel MOSFETs, thereby reducing a part of power consumption of a BOB and achieving the effect of saving power. In addition, in the embodiment of the application, compared with one P-channel MOSFET, the directions of the two body diodes inside the pair of P-channel MOSFETs which are reversely connected are also opposite, so that the electronic device has no leakage risk, and the safety of the electronic device is improved.

According to the electronic equipment provided by the embodiment of the application, the conversion efficiency of the BOB channel can be improved by bypassing the BOB, and part of power consumption of the BOB is reduced; meanwhile, the conduction impedance of the BOB power supply is reduced by conducting the switch element, and a part of power consumption of the BOB is reduced.

Fig. 6 is a schematic diagram of a method for controlling an electronic device according to an embodiment of the present application. Referring to fig. 6, an embodiment of the present application may provide a method of controlling an electronic device shown in fig. 1, an execution subject of the method of controlling an electronic device provided in the embodiment of the present application may be the above-mentioned electronic device, and the method of controlling an electronic device provided in the embodiment of the present application may include:

step 610, acquiring an input voltage of the BOB;

step 620, determining whether the input voltage meets a preset condition;

step 630, when the input voltage meets the preset condition, switching the BOB to a power saving working state.

In the control method of the electronic device provided by the embodiment of the application, the input voltage of the BOB is obtained, and the BOB can be switched to the power-saving working state when the input voltage meets the preset condition. The quick switching of the power-saving working state can be realized.

Before determining whether the input voltage meets a preset condition, the method for controlling the electronic device provided by the embodiment of the application further includes: obtaining the configured output voltage V of the BOB_SETThe values of output current and η;

determining whether the input voltage meets a preset condition may include: determining whether the input voltage is less than or equal to a voltage threshold equal to an actual output voltage/η of the BOB, where η is a conversion efficiency of the BOB.

It can be appreciated that the input voltage at the BOB is less than or equal to the voltage threshold (i.e., V)_IN≤V_BOBEta), the conversion efficiency of the LDO is more than or equal to that of the BOB channel, at the moment, the BOB is bypassed, the BOB channel can be switched to an equivalent LDO channel, the conversion efficiency of the BOB channel can be improved, and part of power consumption of the BOB is reduced.

Wherein, the switching the BOB to a power saving working state includes: switching the BOB to a bypass mode and turning off the switching element; or, the BOB is switched to a bypass mode, and the switching element is turned on.

It can be understood that both of the above two switching manners can bypass the BOB (i.e. switch the BOB path to the equivalent LDO path), improve the conversion efficiency of the BOB path, and reduce a part of the power consumption of the BOB; and, turning on the switching element while switching the BOB to the bypass mode can further reduce the on-resistance of the BOB power supply, thereby reducing a part of the power consumption of the BOB.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: and step 640, turning off the switch element and enabling the BOB to work normally when the input voltage is greater than the voltage threshold value.

Wherein, the BOB works normally by comparing the actual input voltage V of the BOB mentioned above_INAnd output voltage V of BOB configuration_SETTo seamlessly switch the 3 operating modes of the BOB, which will not be described in detail below.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage meets a preset condition; and when the input voltage meets the preset condition, switching the BOB to a power-saving working state. Therefore, under the condition that the input voltage meets the preset condition, the BOB channel conversion efficiency is smaller than or equal to the LDO channel conversion efficiency, the BOB can be switched to the bypass mode by the aid of the BOB, the BOB channel is controlled to be switched to an equivalent LDO channel, part of power consumption of the BOB is reduced, and the power saving effect is achieved.

In addition, further turning on the switching element in the case where the BOB is switched to the bypass mode can reduce the on-resistance of the BOB power supply in which the BOB is in the bypass mode, so that a part of the power consumption of the BOB can be further reduced.

It should be noted that the method for controlling an electronic device shown in fig. 6 provided in the embodiment of the present application may also be applied to electronic devices shown in fig. 2(a), fig. 2(b), fig. 3(a), fig. 3(b), fig. 4(a), and fig. 4 (b).

An embodiment of the present application may provide a method for controlling an electronic device shown in fig. 2(a), an execution subject of the method for controlling an electronic device provided in the embodiment of the present application may be the electronic device mentioned above, and the method for controlling an electronic device provided in the embodiment of the present application may include:

acquiring an input voltage of the BOB;

determining whether the input voltage meets a preset condition, wherein the preset condition comprises: the input voltage of the BOB is less than or equal to a voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB; wherein the voltage threshold is equal to an actual output voltage/η of the BOB, wherein η is a conversion efficiency of the BOB;

and when the input voltage meets the preset condition, the switch element is conducted.

It should be noted that the on-resistance of the switching element can be made very low (e.g., 2m Ω), which is lower than the on-resistance of the BOB power supply in the bypass mode of the BOB in the related art.

According to the electronic equipment provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage meets a preset condition, and conducting the switch element when the input voltage meets the preset condition, so that the switch element is conducted under the condition that the input voltage of the BOB is less than or equal to a voltage threshold value, the conversion efficiency of a BOB channel can be improved, and part of power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, the on-resistance of the BOB power supply is reduced by turning on the switching element, compared with the case that the BOB is in the bypass mode in the related art, so that a part of power consumption of the BOB can be reduced, and the effect of saving power is achieved.

Before determining whether the input voltage meets a preset condition, the method for controlling the electronic device provided by the embodiment of the application further includes: obtaining V of BOB_SETThe value of output current and η.

Wherein, when the input voltage satisfies the preset condition, turning on the switching element includes:

stopping the operation of the BOB and conducting the switch element under the condition that the input voltage of the BOB is less than or equal to the voltage threshold;

or, when the input voltage of the BOB is less than or equal to a voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to a bypass mode, and the switching element is turned on.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: and when the input voltage does not meet the preset condition, closing the switch element and enabling the BOB to normally work.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the method comprises the following steps. Therefore, when the input voltage of the BOB is smaller than or equal to the voltage threshold, the BOB stops working and the switch element is conducted, or the BOB is switched to the bypass mode and the switch element is conducted to bypass the BOB power supply, so that the conversion efficiency of a BOB channel can be improved, and part of power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to the bypass mode and the switch element is turned on, so that compared with the prior art in which the BOB is in the bypass mode, the on-resistance of the BOB power supply is reduced, thereby reducing a part of power consumption of the BOB and achieving the effect of power saving.

An embodiment of the present application may provide a method for controlling an electronic device shown in fig. 2(b), an execution subject of the method for controlling an electronic device provided in the embodiment of the present application may be the electronic device mentioned above, and the method for controlling an electronic device provided in the embodiment of the present application may include:

obtaining input voltage V of BOB_IN；

and when the input voltage meets the preset condition, switching the BOB to a bypass mode and conducting the switch element.

According to the method for controlling the electronic device shown in fig. 2(b) provided by the embodiment of the application, the input voltage V of the BOB is obtained_IN(ii) a Determining whether the input voltage meets a preset condition; and when the input voltage meets the preset condition, switching the BOB to a bypass mode and conducting the switch element. Therefore, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB can be switched to the bypass mode and the switch element is conducted to bypass the BOB, so that the conversion efficiency of a BOB channel can be improved, and part of power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to the bypass mode and the switch element is turned on, so that compared with the prior art in which the BOB is in the bypass mode, the on-resistance of the BOB power supply is reduced, thereby reducing a part of power consumption of the BOB and achieving the effect of power saving.

In another specific embodiment of a method of controlling an electronic device as shown in fig. 2(b), the method further comprises: switching a BOB to a bypass mode and turning off the switching element if an input voltage of the BOB is less than or equal to a voltage threshold. Therefore, when the input voltage of the BOB is smaller than or equal to the voltage threshold, the BOB is switched to the bypass mode and the switch element is closed to bypass the BOB, so that the conversion efficiency of the BOB channel can be improved, and part of power consumption of the BOB can be reduced.

An embodiment of the present application may provide a method for controlling an electronic device shown in fig. 3(a), an execution subject of the method for controlling an electronic device provided in the embodiment of the present application may be the electronic device mentioned above, and the method for controlling an electronic device provided in the embodiment of the present application may include:

acquiring an input voltage of the BOB;

determining whether the input voltage satisfies V_IN≤V_BOBA/η condition;

at the input voltage satisfying V_IN≤V_BOBAnd when eta, switching the BOB to a power-saving working state.

Wherein determining whether the input voltage satisfies V_IN≤V_BOBBefore the η condition, the method for controlling an electronic device provided by the embodiment of the present application further includes: obtaining V of BOB_SETThe value of output current and η.

Wherein, the switching the BOB to a power saving working state includes:

stopping the BOB and conducting an N-channel MOSFET on the periphery of the BOB;

or, the BOB is switched to a bypass mode, and an N-channel MOSFET at the periphery of the BOB is conducted;

or switching the BOB to a bypass mode and closing an N-channel MOSFET at the periphery of the BOB.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: at the input voltage not satisfying V_IN≤V_BOBAnd when eta, closing the N-channel MOSFET at the periphery of the BOB, and enabling the BOB to work normally.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage satisfies V_IN≤V_BOBA/η condition; at an input voltage satisfying V_IN≤V_BOBAnd when the/eta condition exists, the BOB is switched to a power-saving working state. Thus, when the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, the BOB channel can be switched to an equivalent LDO channel by controlling the BOB channel, specifically: switching the BOB to a bypass mode, and closing an N-channel MOSFET at the periphery of the BOB; or stopping the BOB and conducting an N-channel MOSFET at the periphery of the BOB; alternatively, the BOB is switched to a bypass modeIn the mode, an N-channel MOSFET on the periphery of the BOB is turned on, so that the BOB power supply can be bypassed to improve the conversion efficiency of a BOB access, reduce part of power consumption of the BOB and achieve the effect of saving power.

Fig. 7 is a schematic diagram of a method for controlling an electronic device according to an embodiment of the present application. Referring to fig. 7, an embodiment of the present application may provide a method of controlling an electronic device as shown in fig. 3(b), an execution subject of the method of controlling an electronic device provided by the embodiment of the present application may be the above-mentioned electronic device, and the method of controlling an electronic device provided by the embodiment of the present application may include:

step 710, obtaining an input voltage of the BOB;

step 720, determine if the input voltage satisfies V_IN≤V_BOBA/η condition;

step 730, when the input voltage satisfies V_IN≤V_BOBAnd when eta, stopping the BOB and conducting a pair of reverse N-channel MOSFETs on the periphery of the BOB.

In addition, the method for controlling the electronic device provided by the embodiment of the application may further include: step 740, when the input voltage does not satisfy V_IN≤V_BOBAnd when eta, turning off a pair of reverse N-channel MOSFETs on the periphery of the BOB, and enabling the BOB to work normally.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage satisfies V_IN≤V_BOBA/η condition; at an input voltage satisfying V_IN≤V_BOBAnd when the/eta condition exists, the BOB is switched to a power-saving working state. Thus, satisfying V_IN≤V_BOBWhen the/eta condition is met, the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, and the BOB channel can be switched into an equivalent LDO channel by controlling the BOB channel, and the method specifically comprises the following steps: stopping the BOB and conducting a pair of reverse N-channel MOSFETs on the periphery of the BOB; or, the BOB is switched to a bypass mode, and a pair of reverse N-channel MOSFETs at the periphery of the BOB is conducted, so that the BOB can be bypassed to improve the conversion efficiency of a BOB channel, reduce part of power consumption of the BOB and achieve the effect of saving power.

An embodiment of the present application may provide a method for controlling an electronic device shown in fig. 4(a), an execution subject of the method for controlling an electronic device provided in the embodiment of the present application may be the electronic device mentioned above, and the method for controlling an electronic device provided in the embodiment of the present application may include:

acquiring an input voltage of the BOB;

obtaining V of BOB_SETThe values of output current and η;

determining whether the input voltage satisfies V_IN≤V_BOBA/η condition;

at the input voltage satisfying V_IN≤V_BOBWhen eta, the BOB is switched to a power-saving working state;

wherein, the switching the BOB to a power saving working state includes: switching the BOB to a bypass mode and conducting an N-channel MOSFET on the periphery of the BOB; or switching the BOB to a bypass mode and closing an N-channel MOSFET at the periphery of the BOB.

The method for controlling the electronic device provided by the embodiment of the application further comprises the following steps: at the input voltage not satisfying V_IN≤V_BOBAnd when eta, turning off an N-channel MOSFET on the periphery of the BOB, and enabling the BOB to work normally.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage satisfies V_IN≤V_BOBA/η condition; at an input voltage satisfying V_IN≤V_BOBAnd when the/eta condition exists, the BOB is switched to a power-saving working state. Thus, satisfying V_IN≤V_BOBWhen the/eta condition is met, the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, and the BOB channel can be switched into an equivalent LDO channel by controlling the BOB channel, and the method specifically comprises the following steps: switching the BOB to a bypass mode, and closing an N-channel MOSFET at the periphery of the BOB; or, the BOB is switched to a bypass mode, and an N-channel MOSFET at the periphery of the BOB is switched on, so that the BOB can be bypassed to improve the conversion efficiency of a BOB channel, reduce part of power consumption of the BOB and achieve the effect of saving power.

Fig. 8 is a schematic diagram of a method for controlling an electronic device according to an embodiment of the present application, and referring to fig. 8, an embodiment of the present application may provide a method for controlling an electronic device shown in fig. 4(b), an execution subject of the method for controlling an electronic device according to the embodiment of the present application may be the electronic device mentioned above, and the method for controlling an electronic device according to the embodiment of the present application may include:

step 810: obtaining input voltage V of BOB_IN；

Step 820: obtaining V of BOB_SETThe values of output current and η;

step 830: determining whether the input voltage satisfies V_IN≤V_BOBA/η condition;

at the input voltage satisfying V_IN≤V_BOBAnd when eta, the BOB is switched to a bypass mode, and a pair of inverted N-channel MOSFETs on the periphery of the BOB is conducted.

The method for controlling the electronic device provided by the embodiment of the application further comprises the following steps: step 840 where the input voltage does not satisfy V_IN≤V_BOBAnd when eta, turning off a pair of inverted N-channel MOSFETs on the periphery of the BOB, and enabling the BOB to work normally.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage satisfies V_IN≤V_BOBA/η condition; at an input voltage satisfying V_IN≤V_BOBAnd when the/eta condition exists, the BOB is switched to a power-saving working state. Thus, satisfying V_IN≤V_BOBWhen the/eta condition is met, the BOB channel conversion efficiency is less than or equal to the LDO channel conversion efficiency, and the BOB channel can be switched into an equivalent LDO channel by controlling the BOB channel, and the method specifically comprises the following steps: and switching the BOB to a bypass mode, and conducting a pair of reverse N-channel MOSFETs on the periphery of the BOB, so that part of power consumption of the BOB can be reduced, and the effect of saving power is achieved.

On the other hand, it is mentioned above that in the BOB power supply, the operation principle of switching the BOB to the bypass mode is as follows: the switch K1 and the switch K4 inside the BOB chip are conducted, the switch K2 and the switch K3 are not conducted, and the current can be changed from V_INThe pin enters and flows through the switch K1, the inductor L1 and the switch K4 from V_OUTAnd the pin flows out. Specifically, when V_IN＝V_SET,V_BOB＝V_SETWhen the operation of the BOB is switched to the bypass mode, and in the bypass mode, when the operation current of the BOB flows through the switch K1, the inductor L1, and the switch K4 as shown in fig. 5, the BOB has an operation loss, and the loss power is I R. Wherein, I is the output current of the BOB, R is the sum of the on-resistances of 3 components, i.e., the switch K1, the inductor L, and the switch K4, in the BOB power supply (refer to the TPS63027 chip specification, the on-resistances of 3 components, i.e., the switch K1, the inductor L, and the switch K4, are 48m Ω, 30m Ω, and 33m Ω, respectively, and the sum of the impedances of 3 components is 111m Ω). Accordingly, an embodiment of the present application provides another method for controlling an electronic device, where a switch element is additionally arranged on a periphery of a BOB chip, and an on-resistance of the switch element is smaller than a sum of on-resistances of an interior of a BOB power supply in a BOB bypass mode, and the on-resistance of the BOB power supply in the BOB bypass mode is reduced by controlling the on-resistance of the switch element, so that a part of power consumption of the BOB may be saved.

An embodiment of the present application provides another method for controlling an electronic device shown in fig. 1, and fig. 9 is a schematic diagram of a method for controlling an electronic device provided in an embodiment of the present application, where the method for controlling an electronic device provided in the embodiment of the present application includes:

step 910: acquiring an input voltage of the BOB;

step 920: determining whether the input voltage meets a preset condition;

step 930: and when the input voltage meets the preset condition, switching the BOB to a power-saving working state.

The obtaining the input voltage of the BOB comprises the following steps: acquiring an input voltage of the BOB by the BOB;

the determining whether the input voltage satisfies a preset condition includes: determining, by the BOB, whether the input voltage is equal to an actual output voltage of the BOB;

for example, at the input voltage V of BOB_INThen, the input voltage V of the BOB is judged_INWhether or not it is equal to the actual output voltage V of the BOB_BOB。

Wherein the switching the BOB to a power saving operating state comprises:

stopping the BOB and conducting the switch element;

or, the BOB is switched to a bypass mode, and the switching element is turned on.

The method for controlling the electronic device provided by the embodiment of the application further comprises the following steps: step 940: and when the input voltage does not meet the preset condition, closing the switch element and enabling the BOB to normally work.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining whether the input voltage meets a preset condition; and when the input voltage meets the preset condition, switching the BOB to a power-saving working state. Thus, the switching elements are added at the periphery of the BOB, and since the switching elements at the periphery of the BOB are not affected by the package of the BOB chip, the on-resistance of the switching elements can be made very low (within 10m Ω can be selected, for example, the on-resistance of the switching elements is 10m Ω). That is to say, the bypass mode of the BOB is switched to the peripheral switching element to operate, or the bypass mode of the BOB and the peripheral switching element operate simultaneously, and since the on-resistance of the peripheral switching element is smaller than the sum of the on-resistances of the interior of the BOB in the bypass mode (10m Ω is obviously much smaller than 111m Ω), the on-resistance in the BOB bypass mode is reduced, a part of power consumption of the BOB can be saved, and the power saving effect is achieved.

It should be noted that the method for controlling an electronic device shown in fig. 9 provided in the embodiment of the present application may also be applied to electronic devices shown in fig. 2(a), fig. 2(b), fig. 3(a), fig. 3(b), fig. 4(a), and fig. 4 (b).

An embodiment of the present application provides a method for controlling an electronic device shown in fig. 2(a), where the method for controlling an electronic device includes:

acquiring an input voltage of the BOB;

determining input voltage V of BOB_INWhether or not it is equal to the actual output voltage V of the BOB_BOB；

At the input voltage V_INActual output voltage V equal to BOB_BOBAnd switching the BOB to a power-saving working state.

The switching the BOB to the power saving working state comprises: at the input voltage V_INIs equal to the actual output voltage V of the BOB_BOBWhen the BOB is started, the BOB stops working and the switch element is conducted;

or, at said input voltage V_INIs equal to the actual output voltage V of the BOB_BOBWhen the BOB is switched to the bypass mode, the switch element is turned on.

It should be noted that the first power saving operating state is: and stopping the BOB and conducting the switch element. The second power-saving working state is as follows: switching the BOB to a bypass mode and turning on the switching element. Since the on-resistance of the switching element is smaller than the sum of the internal on-resistances in the BOB bypass mode, the on-resistance of the BOB power supply in the first power-saving operating state is smaller than the on-resistance in the BOB power supply bypass mode. And the on-resistance of the BOB power supply in the second power-saving working state is the internal on-resistance of the switch element in the parallel BOB bypass mode, and the on-resistance of the BOB power supply in the second power-saving working state is smaller than that of the BOB power supply in the first power-saving working state, so that the on-resistance in the BOB bypass mode is further reduced.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: input voltage V at BOB_INNot equal to the actual output voltage V of the BOB_BOBAnd when the BOB is started, the switch element is closed, and the BOB works normally.

According to the method for controlling the electronic equipment, provided by the embodiment of the application, the input voltage of the BOB is obtained; determining input voltage V of BOB_INWhether or not it is equal to the actual output voltage V of the BOB_BOB(ii) a At an input voltage satisfying V_IN＝V_BOBAnd when the condition is met, the BOB is switched to a power-saving working state. Therefore, the on-resistance in the BOB bypass mode is reduced, part of power consumption of the BOB can be saved, the power saving effect is achieved, and the power saving effect is achieved.

The method for controlling the electronic device shown in fig. 2(a) provided in the embodiment of the present application may also be applied to the electronic device shown in fig. 3(a) (b), for example, the embodiment of the present application also provides a method for controlling the electronic device shown in fig. 3(a), and the method for controlling the electronic device provided in the embodiment of the present application includes:

acquiring an input voltage of the BOB;

The switching the BOB to the power saving working state comprises: at the input voltage V_INIs equal to the actual output voltage V of the BOB_BOBWhen the BOB is started, the BOB stops working, and an N-channel MOSFET at the periphery of the BOB is conducted;

or, at said input voltage V_INIs equal to the actual output voltage V of the BOB_BOBAnd when the BOB is switched to a bypass mode, and an N-channel MOSFET at the periphery of the BOB is conducted.

It should be noted that the first power saving operating state is: and stopping the BOB and conducting an N-channel MOSFET at the periphery of the BOB. The second power-saving working state is as follows: and switching the BOB to a bypass mode, and conducting an N-channel MOSFET on the periphery of the BOB. Since the on-resistance of an N-channel MOSFET at the periphery of the BOB is smaller than the sum of the internal on-resistances in the BOB bypass mode, the on-resistance of the BOB power supply in the first power-saving operating state is smaller than the on-resistance in the BOB bypass mode. And the on-resistance of the BOB power supply in the second power-saving working state is the internal on-resistance of an N-channel MOSFET (metal-oxide-semiconductor field effect transistor) at the periphery of the BOB in the parallel BOB bypass mode, and the on-resistance of the BOB power supply in the second power-saving working state is smaller than that of the BOB power supply in the first power-saving working state, so that the on-resistance in the BOB bypass mode is further reduced.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: input voltage V at BOB_INNot equal to the actual output voltage V of the BOB_BOBAnd when the BOB is in the normal working state, closing an N-channel MOSFET at the periphery of the BOB and enabling the BOB to work normally.

The method for controlling the electronic device shown in fig. 2(a) provided in the embodiment of the present application may also be applied to the electronic device shown in fig. 3(b), which is not described in detail below.

An embodiment of the present application provides a method for controlling an electronic device shown in fig. 2(b), where the method for controlling an electronic device includes:

acquiring an input voltage of the BOB;

The switching the BOB to a power saving working state includes: switching the BOB to a bypass mode and turning on the switching element.

It should be noted that the third provincial electric operating states are: switching the BOB to a bypass mode and turning on the switching element. Since the on-resistance of the switching element is smaller than the on-resistance of the inductor inside the BOB in the bypass mode of the BOB power supply (for example, 10m Ω is obviously smaller than 30m Ω), the on-resistance of the BOB power supply in the third power saving operation state is smaller than the on-resistance in the BOB bypass mode.

In addition, the method for controlling the electronic device provided by the embodiment of the application further includes: input voltage V at BOB_INNot equal to the actual output voltage V of the BOB_BOBWhile closing the switchAnd elements and enables the BOB to work normally.

The method for controlling the electronic device shown in fig. 2(b) provided in the embodiment of the present application may also be applied to the electronic devices shown in fig. 4(a) and fig. 4(b), which is not described in detail below.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device comprising a CPU, a buck-boost converter BOB, an inductor, and a switching element, wherein the CPU is connected to the BOB and the switching element respectively,

the BOB is provided with at least two pairs of pins, a first pair of pins in the at least two pairs of pins are respectively connected with two ends of the inductor, and a second pair of pins or the first pair of pins in the at least two pairs of pins are respectively connected with two ends of the switch element;

switching the BOB to a bypass mode if an input voltage of the BOB is less than or equal to a voltage threshold;

2. The electronic device of claim 1, wherein the switching element comprises a metal-oxide semiconductor field effect transistor (MOSFET) having a gate, a source, and a drain, the gate being connected to the CPU, the second pair of pins comprising a first voltage pin and a second voltage pin, the first voltage pin and the second voltage pin being connected to the source and the drain of the MOSFET, respectively.

3. The electronic device of claim 1, wherein the switching element comprises a pair of oppositely connected MOSFETs, wherein the second pair of pins comprises a first voltage pin and a second voltage pin, and wherein the first voltage pin, the pair of oppositely connected MOSFETs, and the second voltage pin are sequentially connected in series.

4. The electronic device of claim 3, wherein the pair of reverse-connected MOSFETs includes a first MOSFET and a second MOSFET;

the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the first voltage pin, the source electrode of the second MOSFET is connected with the second voltage pin, and the grid electrode of the first MOSFET and the grid electrode of the second MOSFET are both connected with the CPU;

or the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source electrode of the first MOSFET is connected with the source electrode of the second MOSFET, the drain electrode of the first MOSFET is connected with the first voltage pin, the drain electrode of the second MOSFET is connected with the second voltage pin, and the grid electrode of the first MOSFET and the grid electrode of the second MOSFET are both connected with the CPU.

5. The electronic device of claim 1, wherein the switching element comprises a MOSFET having a gate, a source, and a drain, the gate being connected to the CPU, the first pair of pins comprising a first inductive pin and a second inductive pin, the first inductive pin and the second inductive pin being connected to the source and the drain of the MOSFET, respectively.

6. The electronic device of claim 1, wherein the switching element comprises a pair of oppositely connected MOSFETs, wherein the first pair of pins comprises a first inductive pin and a second inductive pin, and wherein the first inductive pin, the pair of oppositely connected MOSFETs, and the second inductive pin are sequentially connected in series.

7. The electronic device of claim 6, wherein the pair of reverse-connected MOSFETs includes a first MOSFET and a second MOSFET;

the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the source electrode of the first MOSFET is connected with the first inductance pin, the source electrode of the second MOSFET is connected with the second inductance pin, and the grid electrode of the first MOSFET and the grid electrode of the second MOSFET are both connected with the CPU;

or the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source electrode of the first MOSFET is connected with the source electrode of the second MOSFET, the drain electrode of the first MOSFET is connected with the first inductance pin, the drain electrode of the second MOSFET is connected with the second inductance pin, and the grid electrode of the first MOSFET and the grid electrode of the second MOSFET are both connected with the CPU.

8. A method of controlling the electronic device of any of claims 1-7, the method comprising:

acquiring an input voltage of the BOB;

determining whether the input voltage is less than or equal to a voltage threshold; wherein the voltage threshold is equal to an actual output voltage/η of the BOB, wherein η is a conversion efficiency of the BOB;

switching the BOB to a bypass mode and turning on the switching element if the input voltage is less than or equal to a voltage threshold.

9. The method of claim 8, further comprising:

turning off the switching element if the input voltage is greater than a voltage threshold.