WO2022161345A1

WO2022161345A1 - Electronic device and control method therefor

Info

Publication number: WO2022161345A1
Application number: PCT/CN2022/073720
Authority: WO
Inventors: 郑乐平
Original assignee: 维沃移动通信有限公司
Priority date: 2021-01-27
Filing date: 2022-01-25
Publication date: 2022-08-04
Also published as: CN112910251A

Abstract

The present application relates to the technical field of electronics. Disclosed are an electronic device and a control method therefor. The electronic device comprises: a CPU, a buck-boost converter BOB, an inductor, and a switch element. The CPU is connected to the BOB and the switch element. The BOB has at least two pairs of pins. A first pair of pins in the at least two pairs of pins are connected to two ends of the inductor, and a second pair of pins or the first pair of pins in the at least two pairs of pins are connected to two ends of the switch element. When an input voltage of the BOB is less than or equal to a voltage threshold, the BOB is switched to a bypass mode, wherein the voltage threshold is equal to an actual output voltage of the BOB divided by η, wherein η is the conversion efficiency of the BOB.

Description

An electronic device and its control method

cross reference

The present invention claims the priority of the Chinese patent application with the application number 202110111774.1 and the invention title "An electronic device and its control method" filed with the Chinese Patent Office on January 27, 2021, the entire contents of which are incorporated by reference in in the present invention.

technical field

The present application belongs to the field of electronic technology, and specifically relates to an electronic device and a control method thereof.

Background technique

Buck or Boost (BOB) power supplies (including BOBs and inductors) are often used in electronic equipment to power modules such as Low Dropout Regulators (LDOs). In the process of supplying power from the BOB power supply, it often involves switching the working mode of the BOB power supply.

In the prior art, the working mode of the BOB power supply is switched according to the magnitude relationship between the actual input voltage of the BOB power supply and the configured output voltage.

In the process of realizing the present application, the applicant found that there are at least the following problems in the prior art: the power consumption is not considered in the process of switching the working mode of the BOB power supply, and there is a problem of serious power consumption.

SUMMARY OF THE INVENTION

The present application aims to provide an electronic device and a control method thereof, at least to solve the problem that power consumption is not considered in the process of switching the working mode of the BOB power supply in the prior art, and there will be serious power consumption.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, an embodiment of the present application provides an electronic device, including: a CPU, a buck-boost converter BOB, an inductor, and a switching element, the CPU is respectively connected to the BOB and the switching element, and the The BOB has at least two pairs of pins, the first pair of pins in the at least two pairs of pins are respectively connected to both ends of the inductor, the second pair of pins in the at least two pairs of pins or the first pair of pins The pins are respectively connected to both ends of the switching element; when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB is switched to the bypass mode; wherein, the voltage threshold is equal to the BOB's Actual output voltage/η, where η is the conversion efficiency of the BOB.

In a second aspect, an embodiment of the present application provides a method for controlling the electronic device described above, including: acquiring an input voltage of a BOB; determining whether the input voltage is less than or equal to a voltage threshold; wherein the voltage threshold is equal to the The actual output voltage of the BOB/η, where η is the conversion efficiency of the BOB; when the input voltage is less than or equal to the voltage threshold, the BOB is switched to bypass mode, and the switching element is turned on.

In the embodiment of the present application, by adding a switch element in the electronic device, the switch element is connected to the CPU, and the second pair of pins or the first pair of pins of the at least two pairs of pins of the BOB are respectively connected to the At both ends of the switching element, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB is switched to the bypass mode, so that part of the power consumption of the BOB can be reduced and the effect of power saving can be achieved.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

1 is a structural block diagram of an electronic device provided by an embodiment of the present application;

FIG. 2(a) is a structural block diagram of an electronic device provided by another embodiment of the present application;

FIG. 2(b) is a structural block diagram of an electronic device provided by another embodiment of the present application;

3(a) is a schematic schematic diagram of an electronic device provided by another embodiment of the present application;

FIG. 3(b) is a schematic schematic diagram of an electronic device provided by another embodiment of the present application;

4(a) is a schematic schematic diagram of an electronic device provided by another embodiment of the present application;

FIG. 4(b) is a schematic schematic diagram of an electronic device provided by another embodiment of the present application;

5 is a schematic schematic diagram of a BOB power supply in an electronic device provided by an embodiment of the present application;

6 is a schematic diagram of a control method of an electronic device provided by an embodiment of the present application;

7 is a schematic diagram of a control method for an electronic device provided by an embodiment of the present application;

8 is a schematic diagram of a control method for an electronic device provided by an embodiment of the present application;

FIG. 9 is a schematic diagram of a control method of an electronic device provided by an embodiment of the present application.

Detailed ways

The following will describe in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The features of the terms "first" and "second" in the description and claims of this application may expressly or implicitly include one or more of such features. In the description of this application, unless stated otherwise, "plurality" means two or more. Furthermore, "and/or" in the specification and claims means at least one of the linked objects.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it may be directly connected or indirectly connected through an intermediate medium, or is the connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

The electronic devices in the embodiments of the present application may be mobile terminals such as mobile phones, ipads, smart watches, and smart glasses, which are not specifically limited here. At present, the BOB in the electronic equipment can seamlessly switch the three working modes of the BOB according to the relationship between the actual input voltage V _IN of the BOB and the output voltage V _SET configured by the BOB: buck mode, boost mode, bypass mode , allowing the BOB to regulate the output voltage over the entire input voltage range.

Specifically, by comparing the actual input voltage V _IN of the BOB with the output voltage V _SET configured by the BOB, the following three operating modes of the BOB are seamlessly switched:

When V _IN >V _SET , V _BOB =V _SET , BOB switches to step-down mode;

When V _IN < V _SET , V _BOB =V _SET , BOB switches to boost mode;

When V _IN =V _SET , V _BOB =V _SET , BOB switches to bypass mode.

Among them, V _IN is the actual input voltage of BOB; V _SET is the output voltage configured by BOB; V _BOB is the actual output voltage of BOB. The output voltage of the BOB configuration is generally equal to the actual output voltage of the BOB.

At the same time, the conversion efficiency η of BOB can also be considered in the switching process of the BOB working mode. Among them, the conversion efficiency η of BOB is the output power of BOB/input power of BOB. Under different input voltages and different output currents, the conversion efficiency η of BOB is not a fixed constant value. If the conversion efficiency η of BOB is small, then It shows that the invalid power consumption of BOB is large.

The BOB power supply in electronic equipment can be used to power other modules, such as LDO modules, flash modules, etc. In FIG. 1 , the right end of the BOB power supply can be connected in series with LDO modules (not shown in FIG. 1 ). That is, when the BOB power supply in the electronic device is used to supply power to the LDO module, the output voltage of the BOB power supply is the input voltage of the LDO module.

Among them, the working mode of the LDO module is generally a step-down mode, that is, the output voltage of the LDO can generally be lower than the input voltage. For example, when the output voltage of the BOB power supply is used as the input voltage of the LDO module, the output voltage of the BOB power supply can generally be at least 3.45V and 3.65V, that is, the input voltage of the LDO module can generally be at least 3.45V and 3.65V. When the LDO module works in the step-down mode, the output voltage of the LDO module can generally be 1.8V, 2.8V, 3.0V, 3.3V, etc.

The electronic device and the control method thereof provided by the embodiments of the present application can improve the conversion efficiency of the BOB path. Specifically, for example, in this embodiment of the present application, by comparing the conversion efficiency of the BOB channel and the conversion efficiency of the LDO channel, when the condition that the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel is satisfied, the BOB channel can be switched to an equivalent On the LDO path, the conversion efficiency of the BOB path can be improved, part of the power consumption of the BOB can be reduced, and power saving can be achieved.

Among them, the conversion efficiency of the LDO channel is the output power of the LDO module/the input power of the LDO module. Since the input current and output current of a separate LDO channel can be approximately equal, the conversion efficiency of the LDO channel is the output voltage of the LDO module/LDO module. Input voltage. That is, LDO channel conversion efficiency=V _OUT /V _IN . Among them, V _OUT is the output voltage of the LDO module, and V _IN is the input voltage of the LDO module.

It should be pointed out that the BOB path mentioned in the embodiments of the present application may be a path including the BOB and a module (eg, an LDO module) powered by the BOB, and V _IN may also be an input voltage representing the BOB. It should be understood that, the following description only takes the BOB path including the path of the BOB and the LDO module as an example for illustration, and is not intended to be limiting.

Among them, since the right end of the BOB can be connected in series with the LDO module, the conversion efficiency of the BOB path can be the output power of the BOB path/the input power of the BOB path. Specifically, since the BOB supplies power to the LDO module, current flows in from the BOB and flows out of the LDO module. In the BOB path including BOB and LDO modules, the input power of the BOB can be used as the input power of the BOB path, and the output power of the LDO module can be used as the output power of the BOB path. Accordingly, the conversion efficiency of the BOB path can be the output power of the LDO module/the input power of the BOB.

Since the BOB is connected in series with the LDO module, the output voltage of the BOB is equal to the input voltage of the LDO module, and the output current of the BOB is equal to the input current of the LDO module, that is, the output power of the BOB is equal to the input power of the LDO module. The conversion efficiency of the BOB channel can be further extended as (output power of LDO module/input power of LDO module)*(output power of BOB/input power of BOB).

Further, the conversion efficiency of BOB (ie, output power of BOB/input power of BOB) can generally be set to η. And the input current of the LDO module is equal to the output current of the BOB, the input current of the LDO module and the output current of the LDO module can be approximately equal, and the conversion efficiency of the above BOB path is further simplified as (the output voltage of the LDO module / the input voltage of the LDO module) *Conversion efficiency of BOB. That is, BOB channel conversion efficiency=(V _OUT /V _BOB )*η. Among them, V _OUT is the output voltage of the LDO module, and V _BOB is the output voltage of BOB.

Based on the condition of BOB channel conversion efficiency≤LDO channel conversion efficiency, it can be equivalently obtained: (V _OUT /V _BOB )*η≤V _OUT /V _IN , which is simplified as: V _IN ≤V _BOB /η.

It can be seen from the above content that when the condition of V _IN ≤V _BOB /η is satisfied, the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel. At this time, since the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel, switching the BOB channel to the equivalent LDO channel (the equivalent LDO channel refers to the channel that only contains the LDO module) can improve the conversion efficiency of the BOB channel, and further Reduce part of the power consumption of BOB.

The embodiments of the present application provide an electronic device and a control method thereof, which can obtain the input voltage of the BOB of the electronic device, and when the input voltage satisfies the condition of V _IN ≤ V _BOB /η, bypass the BOB to connect the BOB to the electronic device. The BOB path is switched to an equivalent LDO path, which can improve the conversion efficiency of the BOB path and reduce part of the power consumption of the BOB.

On the other hand, the embodiment of the present application proposes another way to reduce the power consumption of the BOB power supply. Specifically, in the embodiments of the present application, the switching element can be turned on to further reduce the on-resistance of the BOB power supply, and further reduce a part of the power consumption of the BOB.

The electronic device and the control method thereof according to the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

An embodiment of the present application provides an electronic device, as shown in FIG. 1 , the electronic device includes: a central processing unit (Central Processing Unit, CPU), a BOB power supply, and a switching element, the BOB power supply includes a BOB and an inductor, and the The CPU is connected to the BOB and the switching element, respectively, and the BOB is connected to the switching element.

The BOB has at least two pairs of pins, and the first pair of pins in the at least two pairs of pins are respectively connected to two ends of the inductor. The second pair of pins or the first pair of pins in the at least two pairs of pins are respectively connected to both ends of the switching element; when the input voltage of the BOB is less than or equal to the voltage threshold, the The BOB is switched to the bypass mode; wherein, the voltage threshold is equal to the actual output voltage of the BOB/η, where η is the conversion efficiency of the BOB.

In the embodiment of the present application, by adding a switch element in the electronic device, the switch element is connected to the CPU, and the second pair of pins or the first pair of pins of the at least two pairs of pins of the BOB are respectively connected to the Both ends of the switching element switch the BOB to bypass mode when the input voltage of the BOB is less than or equal to a voltage threshold; wherein the voltage threshold is equal to the actual output voltage of the BOB/η, where , η is the conversion efficiency of the BOB, in this way, when the input voltage of the BOB is less than or equal to the actual output voltage of the BOB/η, the conversion efficiency of the BOB path is less than or equal to the conversion efficiency of the LDO path, and the BOB path is switched to an equivalent The LDO channel, specifically switching the BOB to the bypass mode, can improve the conversion efficiency of the BOB channel, thereby reducing a part of the power consumption of the BOB and achieving the effect of power saving.

In this embodiment of the present application, reference may be made to FIG. 5 for the schematic principle diagram of the BOB power supply in the electronic device shown in FIG. 1 . The BOB power supply includes a BOB and an inductor, and the BOB can be a packaged BOB chip. The block diagram of the dotted line shown in FIG. 5 is a schematic diagram of the BOB chip. The specific structure is limited. The BOB chip shown in Figure 5 may include: L1 pin, L2 pin, VIN pin, and VOUT pin; L1 pin and L2 pin are generally used to connect inductor L1; the BOB chip can have 4 switches inside : K1, K2, K3, K4, these 4 switches work together to control the flow of input current inside the chip to achieve boost and buck functions.

In addition, when V _IN =V _SET , V _BOB =V _SET , the BOB chip can also implement a bypass function. In the BOB chip, the working principle of BOB switching to bypass mode is: the switch K1 and switch K4 inside the BOB chip are turned on, the switch K2 and switch K3 are not turned on, the current can enter from the V _IN pin and flow through the switch K1 , inductor L1, switch K4, flow out from the V _OUT pin.

Optionally, as shown in FIG. 2( a ), in the electronic device provided by the embodiment of the present application, the second pair of pins may include a first voltage pin and a second voltage pin; the first voltage pin can be the V _IN pin shown in FIG. 2(a), the second voltage pin can be the V _OUT pin shown in FIG. 2(a), the V _IN pin and the V _OUT pin can be respectively connecting both ends of the switching element;

When the input voltage of the BOB is less than or equal to the voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB, the switching element is turned on;

Wherein, the voltage threshold is equal to the actual output voltage of the BOB/η, where η is the conversion efficiency of the BOB.

It should be pointed out that the on-resistance of the switching element can be made very low (for example, 2mΩ), and the on-resistance of the switching element is lower than the on-resistance of the BOB power supply in the related art when the BOB is in bypass mode.

In the embodiment of the present application, by adding a switching element in the electronic device, the switching element is connected to the CPU, and the first voltage pin and the second voltage pin of the BOB are used to connect the two ends of the switching element respectively, When the input voltage of the BOB is less than or equal to a voltage threshold, or when the input voltage of the BOB is equal to the actual output voltage of the BOB, the switching element is turned on. In this way, when the input voltage of the BOB is less than or equal to the voltage threshold, the switching element is turned on, which can improve the conversion efficiency of the BOB path, thereby reducing a part of the power consumption of the BOB; or, when the input voltage of the BOB is equal to the In the case of the actual output voltage of the BOB, by turning on the switching element, compared with the BOB in the bypass mode in the related art, the on-resistance of the BOB power supply is reduced, thereby reducing a part of the power consumption of the BOB and saving power. Effect.

Optionally, as shown in FIG. 2( b ), in the electronic device provided in the embodiment of the present application, the first pair of pins may include a first inductance pin and a second inductance pin; the first inductance The pin can be the L1 pin shown in Figure 2(b), the second inductor pin can be the L2 pin shown in Figure 2(b), the L1 pin and the L2 pin can be connected respectively both ends of the switching element;

Under the condition that the input voltage of the BOB is less than or equal to the voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to a bypass mode, and the switching element is turned on;

In the embodiment of the present application, by adding a switch element in the electronic device, the switch element is connected to the CPU, and the first inductance pin and the second inductance pin of the BOB are used to connect the two ends of the switch element respectively. When the input voltage of the BOB is less than or equal to the voltage threshold, or when the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to the bypass mode, and the switching element is turned on. In this way, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB is switched to the bypass mode, and the switching element is turned on to bypass the BOB, which can improve the conversion efficiency of the BOB path, thereby reducing a part of the BOB. power consumption; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, by switching the BOB to the bypass mode and turning on the switching element, compared with the BOB in the bypass mode in the related art, The on-resistance of the BOB power supply is reduced, so that part of the power consumption of the BOB can be reduced to achieve the effect of power saving.

Optionally, in the electronic device provided in the embodiment of the present application, the switching element may be a component having a switching function and low on-resistance. For example, the switching element may include a Metal-Oxide-Semiconductor Field-Effect Tran sistor (MOSFET). Among them, the on-resistance of the MOSFET can be made very low, such as 2mΩ. The switching element may also include other common switches with switching function and low on-resistance, and the type of the switching element is not specifically limited here.

In this embodiment of the present application, the number of MOSFETs may be one or more. The types of MOSFETs can also be various. For example, it may be an N-channel MOSFET (N-channel MOSFET) or a P-channel MOSFET (P-channel MOSFET). The embodiments of the present application do not limit the specific number and type of MOSFETs.

For example, when the switching element includes a MOSFET, the switching element may include an N-channel MOSFET; alternatively, the switching element may include a P-channel MOSFET.

In this embodiment of the present application, an N-channel MOSFET or a P-channel MOSFET can be selected as the switching element. The on-resistance of N-channel MOSFET can generally be 2mΩ, and the on-resistance of N-channel MOSFET is generally lower than that of P-channel MOSFET, that is, compared with P-channel MOSFET, N-channel MOSFET More energy consumption can be saved. At the same time, compared with N-channel MOSFET, in electronic equipment, it is generally necessary to use a higher voltage to turn on P-channel MOSFET. For example, an additional high-voltage power supply may be required to turn on P-channel MOSFET, which is convenient for use. In nature, P-channel MOSFETs are not as convenient as N-channel MOSFETs.

For another example, when the switching element includes a pair of reversely connected MOSFETs, the switching element may include a pair of reversed N-channel MOSFETs; or, the switching element may include a pair of reversed P-channel MOSFETs MOSFETs.

In the embodiments of the present application, a pair of reversely connected MOSFETs (eg, a pair of reversed N-channel MOSFETs, or a pair of reversed P-channel MOSFETs) is more practical than one MOSFET. If the switching element is an N-channel MOSFET, when the BOB is in buck mode, the external switching element (an N-channel MOSFET) may leak current due to the body diode existing inside the N-channel MOSFET. If the switching element is a pair of reversed N-channel MOSFETs, when the BOB is in step-down mode, since a pair of N-channel MOSFETs are connected in reverse, the body diodes inside the two MOSFETs are also in opposite directions, so there is no risk of leakage. Improves the security of electronic equipment.

Optionally, in the electronic device provided in the embodiment of the present application, the switching element includes a MOSFET, the MOSFET has a gate, a source and a drain, the gate is connected to the CPU, and the second The pair of pins includes a first voltage pin and a second voltage pin, and the first voltage pin and the second voltage pin are respectively connected to the source and the drain of the MOSFET. The CPU can control the conduction of the MOSFET by sending an enable signal to the gate of the MOSFET.

In the embodiment of the present application, by adding a MOSFET in the electronic device, the gate of the MOSFET is connected to the CPU, and the first voltage pin and the second voltage pin of the BOB are respectively connected to the source of the MOSFET and drain, in this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the MOSFET, thereby reducing a part of the power consumption of the BOB and achieving the effect of power saving.

In the embodiment of the present application, depending on the type of the MOSFET, the connection of the first voltage pin and the second voltage pin to the source electrode and the drain electrode of the MOSFET, respectively, may include the following two situations: one, The first voltage pin is connected to the source of the MOSFET, the second voltage pin is connected to the drain of the MOSFET; secondly, the first voltage pin is connected to the drain of the MOSFET, the The second voltage pin is connected to the source of the MOSFET.

In the electronic device provided by the embodiment of the present application, as shown in FIG. 3( a ), the MOSFET may be an N-channel MOSFET. Correspondingly, in this case, the VIN pin can be connected to the source of the N-channel MOSFET, and the VOUT pin can be connected to the drain of the N-channel MOSFET. Wherein, the gate of the N-channel MOSFET can be connected to the central processing unit CPU (not shown in the figure).

In the embodiment of the present application, by adding an N-channel MOSFET in the electronic device, the gate of the N-channel MOSFET is connected to the CPU, and the VIN pin is used to connect the source of the N-channel MOSFET, so the The VOUT pin is connected to the drain of the N-channel MOSFET. In this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the N-channel MOSFET, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving. Moreover, in the embodiments of the present application, compared with a P-channel MOSFET, the on-resistance of an N-channel MOSFET is lower, which can further reduce a part of the power consumption of the electronic device.

In the electronic device provided by another embodiment of the present application, the MOSFET may be a P-channel MOSFET. Correspondingly, in this case, the VIN pin is connected to the drain of the P-channel MOSFET, the VOUT pin is connected to the source of the P-channel MOSFET; the gate of the P-channel MOSFET is connected to the central processing unit. CPU (not shown).

In the embodiment of the present application, by adding a P-channel MOSFET in the electronic device, the gate of the P-channel MOSFET is connected to the CPU, and the VIN pin is used to connect the drain of the P-channel MOSFET, and the VOUT The pin is connected to the source of the P-channel MOSFET. In this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the P-channel MOSFET, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving.

Optionally, in the electronic device provided in the embodiment of the present application, the switching element may include a pair of MOSFETs connected in opposite directions, and the second pair of pins includes a first voltage pin and a second voltage pin, so The first voltage pin, the pair of oppositely connected MOSFETs and the second voltage pin are sequentially connected in series.

In the embodiment of the present application, a pair of reversely connected MOSFETs are added in the electronic device, and the second pair of pins of the BOB is used, and the second pair of pins includes a first voltage pin and a second voltage pin. pin, the first voltage pin, the pair of reversely connected MOSFETs and the second voltage pin are connected in series in sequence, so that BOB can be reduced by controlling the conduction of a pair of reversely connected MOSFETs The on-resistance of the power supply can reduce part of the power consumption of the BOB and achieve the effect of power saving.

In the embodiment of the present application, depending on the type of MOSFET, the sequential connection of the first voltage pin, the pair of oppositely connected MOSFETs, and the second voltage pin in series may include the following two situations: First, the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain of the first MOSFET is connected to the drain of the second MOSFET, the source of the first MOSFET is connected to the first voltage pin, and the source of the second MOSFET is connected to the first voltage pin. The source is connected to the second voltage pin; secondly, the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, and the drain of the first MOSFET is connected The first voltage pin, the drain of the second MOSFET is connected to the second voltage pin.

In the electronic device provided by the embodiment of the present application, the pair of oppositely connected MOSFETs includes a first MOSFET and a second MOSFET. As shown in Figure 3(b), the first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain of the first MOSFET is connected to the drain of the second MOSFET, and the source of the first MOSFET is connected to the VIN pin , the source of the second MOSFET is connected to the VOUT pin. The gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU (not shown).

In the embodiments of the present application, a pair of reversely connected N-channel MOSFETs are added in the electronic equipment, the gates of the N-channel MOSFETs are connected to the CPU, and the drains of the first MOSFET and the second MOSFET are used to The drain is connected, the source of the first MOSFET is connected to the VIN pin, and the source of the second MOSFET is connected to the VOUT pin. In this way, it can be reduced by controlling the conduction of a pair of reversely connected N-channel MOSFETs. The on-resistance of the small BOB power supply can reduce part of the power consumption of the BOB and achieve the effect of power saving. In addition, in the embodiments of the present application, compared with a pair of reversely connected P-channel MOSFETs, the on-resistance of a pair of reversely connected N-channel MOSFETs is lower, which can further reduce a part of the power of the electronic device. consumption. Compared with one N-channel MOSFET, the directions of the two body diodes inside a pair of reversely connected N-channel MOSFETs are also opposite, so that there is no risk of leakage in the electronic device, which improves the safety of the electronic device.

In the electronic device provided by another embodiment of the present application, the pair of oppositely connected MOSFETs includes a first MOSFET and a second MOSFET. The first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, the drain of the first MOSFET is connected to the first voltage pin, and the drain of the second MOSFET is connected to the first voltage pin. The second voltage pin is connected, and both the gate of the first MOSFET and the gate of the second MOSFET are connected to the CPU (not shown).

In the embodiment of the present application, a pair of reversely connected P-channel MOSFETs are added in the electronic equipment, the gates of the pair of reversely connected P-channel MOSFETs are connected to the CPU, and the source of the first MOSFET is used to connect to the CPU. The source of the second MOSFET is connected to the VIN pin, the drain of the first MOSFET is connected to the VOUT pin, and the drain of the second MOSFET is connected to the VOUT pin. It is turned on to reduce the on-resistance of the BOB power supply, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving. In addition, in the embodiments of the present application, compared with one P-channel MOSFET, the two body diodes inside a pair of reversely connected P-channel MOSFETs are also in opposite directions, so that there is no risk of leakage in the electronic device, which improves the reliability of the electronic device. safety.

In the electronic device provided by the embodiment of the present application, in addition to using the second pair of pins including the first voltage pin and the second voltage pin to connect the switch elements as described above, the switch element may also be connected by using a second pair of pins including a first voltage pin and a second voltage pin. The first pair of pins of the first inductor pin and the second inductor pin are respectively connected to the switching element.

In an embodiment of the electronic device provided in the present application, the switching element includes a MOSFET, the MOSFET has a gate, a source and a drain, the gate is connected to the CPU, and the first pair of leads The pin includes a first inductance pin and a second inductance pin, and the first inductance pin and the second inductance pin are respectively connected to the source and the drain of the MOSFET.

In the embodiment of the present application, by adding a MOSFET in the electronic device, the gate of the MOSFET is connected to the CPU, and the first inductance pin and the second inductance pin of the BOB are respectively connected to the source of the MOSFET and drain, in this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the MOSFET, thereby reducing a part of the power consumption of the BOB and achieving the effect of power saving.

In the embodiment of the present application, depending on the type of MOSFET, the connection of the first inductance pin and the second inductance pin to the source and drain of the MOSFET, respectively, may include the following two situations: one, The first inductance pin is connected to the source of the MOSFET, the second inductance pin is connected to the drain of the MOSFET; secondly, the first inductance pin is connected to the drain of the MOSFET, the The second inductor pin is connected to the source of the MOSFET.

In the electronic device provided by the embodiment of the present application, as shown in FIG. 4( a ), the MOSFET may be an N-channel MOSFET. Correspondingly, in this case, the first inductor pin and all The second inductance pin is connected to the source and drain of the MOSFET respectively, which may be specifically: the L1 pin is connected to the source of the N-channel MOSFET, and the L2 pin is connected to the drain of the N-channel MOSFET. . The gate of the N-channel MOSFET is connected to the central processing unit CPU (not shown in the figure).

In the embodiment of the present application, by adding an N-channel MOSFET in the electronic device, the gate of the N-channel MOSFET is connected to the CPU, and the L1 pin is used to connect the source of the N-channel MOSFET, so the The L2 pin is connected to the drain of the N-channel MOSFET. In this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the N-channel MOSFET, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving. Moreover, in the embodiments of the present application, compared with a P-channel MOSFET, the on-resistance of an N-channel MOSFET is lower, which can further reduce a part of the power consumption of the electronic device.

In the electronic device provided by another embodiment of the present application, the MOSFET may be a P-channel MOSFET. Correspondingly, in this case, the first inductor pin and the second inductor pin are respectively connected The source and drain of the MOSFET can be specifically: the L1 pin is connected to the drain of the P-channel MOSFET, the L2 pin is connected to the source of the P-channel MOSFET; the gate of the P-channel MOSFET is connected to the The central processing unit CPU (not shown in the figure).

In the embodiment of the present application, by adding a P-channel MOSFET in the electronic device, the gate of the P-channel MOSFET is connected to the CPU, and the L1 pin is used to connect the drain of the P-channel MOSFET, the L2 The pin is connected to the source of the P-channel MOSFET. In this way, the on-resistance of the BOB power supply can be reduced by controlling the conduction of the P-channel MOSFET, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving.

Optionally, in the electronic device provided in the embodiment of the present application, the switching element may include a pair of MOSFETs connected in opposite directions, and the first pair of pins includes a first inductance pin and a second inductance pin, so The first inductance pin, the pair of oppositely connected MOSFETs and the second inductance pin are sequentially connected in series.

In the embodiment of the present application, a pair of reversely connected MOSFETs are added in the electronic device, and the first pair of pins of the BOB is used, and the first pair of pins includes a first inductance pin and a second inductance pin pin, the first inductance pin, the pair of reversely connected MOSFETs and the second inductance pin are connected in series in sequence, so that BOB can be reduced by controlling the conduction of a pair of reversely connected MOSFETs The on-resistance of the power supply can reduce part of the power consumption of the BOB and achieve the effect of power saving.

In the embodiment of the present application, depending on the type of MOSFET, the serial connection of the first inductor pin, the pair of oppositely connected MOSFETs, and the second inductor pin may include the following two situations: 1. Both the first MOSFET and the second MOSFET are N-channel MOSFETs; the drain of the first MOSFET is connected to the drain of the second MOSFET, the source of the first MOSFET is connected to the first inductor pin, and the second MOSFET is connected to the drain of the second MOSFET. The source is connected to the second inductor pin; secondly, the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, and the drain of the first MOSFET is connected The first inductor pin and the drain of the second MOSFET are connected to the second inductor pin.

In the electronic device provided by the embodiment of the present application, the pair of MOSFETs connected in opposite directions include a first MOSFET and a second MOSFET. As shown in FIG. 4( b ), the first MOSFET and the second MOSFET are both N-channel MOSFET; the drain of the first MOSFET is connected to the drain of the second MOSFET, the source of the first MOSFET is connected to the L1 pin, and the source of the second MOSFET is connected to the L2 pin. The gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU (not shown).

In the embodiments of the present application, a pair of reversely connected N-channel MOSFETs are added in the electronic equipment, the gates of the N-channel MOSFETs are connected to the CPU, and the drains of the first MOSFET and the second MOSFET are used to The drain is connected, the source of the first MOSFET is connected to the L1 pin, and the source of the second MOSFET is connected to the L2 pin. In this way, it can be reduced by controlling the conduction of a pair of reversely connected N-channel MOSFETs. The on-resistance of the small BOB power supply can reduce part of the power consumption of the BOB and achieve the effect of power saving. In addition, in the embodiments of the present application, compared with a pair of reversely connected P-channel MOSFETs, the on-resistance of a pair of reversely connected N-channel MOSFETs is lower, which can further reduce a part of the power of the electronic device. consumption. Compared with one N-channel MOSFET, the directions of the two body diodes inside a pair of reversely connected N-channel MOSFETs are also opposite, so that there is no risk of leakage in the electronic device, which improves the safety of the electronic device.

In the electronic device provided by another embodiment of the present application, the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, and the drain of the first MOSFET is connected to the source of the second MOSFET. the first inductor pin, the drain of the second MOSFET is connected to the second inductor pin, and the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU (not shown).

In the embodiment of the present application, a pair of reversely connected P-channel MOSFETs are added in the electronic equipment, the gates of the pair of reversely connected P-channel MOSFETs are connected to the CPU, and the source of the first MOSFET is used to connect to the CPU. The source of the second MOSFET is connected, the drain of the first MOSFET is connected to the L1 pin, and the drain of the second MOSFET is connected to the L2 pin. It is turned on to reduce the on-resistance of the BOB power supply, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving. In addition, in the embodiments of the present application, compared with one P-channel MOSFET, the two body diodes inside a pair of reversely connected P-channel MOSFETs are also in opposite directions, so that there is no risk of leakage in the electronic device, which improves the reliability of the electronic device. safety.

The above-mentioned electronic equipment provided by the embodiments of the present application can improve the conversion efficiency of the BOB path by bypassing the BOB, and reduce a part of the power consumption of the BOB; at the same time, by turning on the switching element, the on-resistance of the BOB power supply can be reduced, reducing the BOB power supply. part of the power consumption.

FIG. 6 is a schematic diagram of a method for controlling an electronic device provided by an embodiment of the present application. 6, an embodiment of the present application may provide a method for controlling an electronic device as shown in The method for controlling an electronic device provided by the embodiment may include:

Step 610, obtaining the input voltage of the BOB;

Step 620, determining whether the input voltage satisfies a preset condition;

Step 630, when the input voltage satisfies the preset condition, switch the BOB to a power saving working state.

In the electronic device control method provided by the embodiment of the present application, the input voltage of the BOB can be obtained, and when the input voltage meets the preset condition, the BOB can be switched to a power-saving working state. It can realize fast switching of power-saving working state.

Wherein, before determining whether the input voltage satisfies a preset condition, the method for controlling an electronic device provided by the embodiment of the present application further includes: acquiring the values of the configuration output voltage V _SET , the output current and η of the BOB;

Wherein, determining whether the input voltage satisfies a preset condition may include: determining whether the input voltage is less than or equal to a voltage threshold, where the voltage threshold is equal to the actual output voltage of the BOB/η, where η is the conversion of the BOB efficiency.

It can be understood that when the input voltage of BOB is less than or equal to the voltage threshold (that is, V _IN ≤ V _BOB /η), the conversion efficiency of LDO is greater than or equal to the conversion efficiency of BOB channel. The channel is switched to the equivalent LDO channel, which can improve the conversion efficiency of the BOB channel and reduce part of the power consumption of the BOB.

The switching of the BOB to the power-saving working state includes: switching the BOB to a bypass mode and turning off the switching element; or, switching the BOB to a bypass mode and turning on all the the switching element.

It can be understood that the above two switching methods can bypass the BOB (that is, switch the BOB path to the equivalent LDO path), improve the conversion efficiency of the BOB path, and reduce part of the power consumption of the BOB; By turning on the switching element at the same time in the bypass mode, the on-resistance of the BOB power supply can be further reduced, thereby reducing part of the power consumption of the BOB.

In addition, the method for controlling an electronic device provided by the embodiment of the present application further includes: step 640 , when the input voltage is greater than the voltage threshold, the switching element is turned off, and the BOB is made to work normally.

The normal operation of the BOB refers to the three working modes of the BOB that can be seamlessly switched by comparing the actual input voltage V _IN of the BOB with the output voltage V _SET configured by the BOB, which will not be repeated below.

According to the method for controlling the above-mentioned electronic device provided by the embodiment of the present application, by acquiring the input voltage of the BOB; determining whether the input voltage satisfies the preset condition; when the input voltage satisfies the preset condition, switching the BOB to save power working status. In this way, when the input voltage meets the preset conditions, the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel, and the BOB channel can be switched to the bypass mode to control the BOB channel to be switched to the equivalent LDO channel, reducing BOB part of the power consumption to achieve the effect of power saving.

In addition, when the BOB is switched to the bypass mode, the switching element is further turned on, which can reduce the on-resistance of the BOB power supply when the BOB is in the bypass mode, thereby further reducing part of the power consumption of the BOB.

It should be pointed out that the method for controlling an electronic device as shown in FIG. 6 provided in the embodiment of the present application can also be applied to FIG. 2(a), FIG. 2(b), FIG. 3(a), and FIG. 3(b). ), the electronic equipment shown in Figure 4(a) and Figure 4(b).

The embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 2( a ). The execution subject of the method for controlling an electronic device provided by the embodiment of the present application may be the electronic device mentioned above. An example provided method of controlling an electronic device may include:

Get the input voltage of BOB;

Determining whether the input voltage satisfies a preset condition, the preset condition includes: the input voltage of the BOB is less than or equal to a voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB; wherein the BOB The voltage threshold is equal to the actual output voltage/η of the BOB, where η is the conversion efficiency of the BOB;

When the input voltage satisfies the preset condition, the switching element is turned on.

It should be pointed out that the on-resistance of the switching element can be made very low (for example, 2mΩ), which can be lower than the on-resistance of the BOB power supply in the related art when the BOB is in the bypass mode.

The electronic device provided by the embodiment of the present application determines whether the input voltage satisfies a preset condition by acquiring the input voltage of the BOB, and when the input voltage satisfies the preset condition, the switching element is turned on. When the input voltage of the BOB is less than or equal to the voltage threshold, turning on the switching element can improve the conversion efficiency of the BOB path, thereby reducing a part of the power consumption of the BOB; or, when the input voltage of the BOB is equal to the actual value of the BOB In the case of output voltage, by turning on the switching element, compared with the related art when the BOB is in bypass mode, the on-resistance of the BOB power supply is reduced, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving.

Wherein, before determining whether the input voltage satisfies a preset condition, the method for controlling an electronic device provided by the embodiment of the present application further includes: acquiring the values of V _SET , output current and η of the BOB.

Wherein, when the input voltage meets the preset condition, turning on the switching element includes:

When the input voltage of the BOB is less than or equal to the voltage threshold, the BOB is stopped from working, and the switching element is turned on;

Alternatively, when the input voltage of the BOB is less than or equal to the voltage threshold, or the input voltage of the BOB is equal to the actual output voltage of the BOB, the BOB is switched to the bypass mode, and the switch is turned on element.

In addition, the method for controlling an electronic device provided by the embodiment of the present application further includes: when the input voltage does not meet a preset condition, turning off the switching element and making the BOB work normally.

According to the method for controlling the above electronic device provided by the embodiments of the present application, pass. In this way, when the input voltage of the BOB is less than or equal to the voltage threshold, stop the operation of the BOB and turn on the switching element, or switch the BOB to the bypass mode and turn on the switching element to bypass the power supply of the BOB, which can improve the BOB The conversion efficiency of the channel can be reduced, so that part of the power consumption of the BOB can be reduced; or, when the input voltage of the BOB is equal to the actual output voltage of the BOB, by switching the BOB to the bypass mode and turning on the switching element, which is the same as the BOB in the related art. Compared with the bypass mode, the on-resistance of the BOB power supply is reduced, thereby reducing part of the power consumption of the BOB and achieving the effect of power saving.

The embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 2(b), and the execution subject of the method for controlling an electronic device provided by the embodiment of the present application may be the electronic device mentioned above, which is implemented in the present application. An example provided method of controlling an electronic device may include:

Get the input voltage V _IN of BOB;

When the input voltage satisfies the preset condition, the BOB is switched to a bypass mode, and the switching element is turned on.

According to the method for controlling the electronic device shown in FIG. 2(b) provided by the embodiment of the present application, by acquiring the input voltage V _IN of the BOB; determining whether the input voltage satisfies the preset condition; when the input voltage satisfies the preset condition , switches BOB to bypass mode and turns on the switching element. In this way, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB can be switched to the bypass mode and the switching element is turned on to bypass the BOB, which can improve the conversion efficiency of the BOB path, thereby reducing a part of the BOB. power consumption; or, in the case where the input voltage of the BOB is equal to the actual output voltage of the BOB, by switching the BOB to the bypass mode and turning on the switching element, compared with the BOB in the bypass mode in the related art, it is reduced The on-resistance of the BOB power supply can reduce part of the power consumption of the BOB and achieve the effect of power saving.

In another specific embodiment of the method for controlling an electronic device as shown in FIG. 2(b), the method further includes: when the input voltage of the BOB is less than or equal to a voltage threshold, switching the BOB to a side circuit mode and turn off the switching element. In this way, when the input voltage of the BOB is less than or equal to the voltage threshold, the BOB can be switched to the bypass mode and the switching element is turned off to bypass the BOB, which can improve the conversion efficiency of the BOB path, thereby reducing a part of the power of the BOB. consumption.

The embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 3( a ). The execution subject of the method for controlling an electronic device provided by the embodiment of the present application may be the electronic device mentioned above. An example provided method of controlling an electronic device may include:

Get the input voltage of BOB;

determining whether the input voltage satisfies the condition of V _IN ≤ V _BOB /n;

When the input voltage satisfies V _IN ≤ V _BOB /n, the BOB is switched to a power-saving working state.

Wherein, before determining whether the input voltage satisfies the condition of V _IN ≤V _BOB /η, the method for controlling an electronic device provided by the embodiment of the present application further includes: acquiring the values of V _SET , output current and η of BOB.

Wherein, the switching of the BOB to a power-saving working state includes:

Stop the BOB from working, and turn on an N-channel MOSFET around the BOB;

Or, switch the BOB to bypass mode, and turn on an N-channel MOSFET on the periphery of the BOB;

Alternatively, switch the BOB to bypass mode and turn off an N-channel MOSFET at the periphery of the BOB.

In addition, the method for controlling an electronic device provided by the embodiment of the present application further includes: when the input voltage does not satisfy V _IN ≤ V _BOB /n, turning off the N-channel MOSFET on the periphery of the BOB, and making the BOB work normally.

According to the method for controlling the above electronic device provided by the embodiments of the present application, the input voltage of BOB is obtained; it is determined whether the input voltage satisfies the condition of V _IN ≤V _BOB /η; when the input voltage satisfies the condition of V _IN ≤V _BOB /η when the BOB is switched to a power saving working state. In this way, when the conversion efficiency of the BOB channel is less than or equal to the conversion efficiency of the LDO channel, the BOB channel can be switched to an equivalent LDO channel by controlling the BOB channel. Specifically, the BOB is switched to the bypass mode, and an N channel around the BOB is closed MOSFET; or, stop the BOB from working, and turn on an N-channel MOSFET on the periphery of the BOB; or switch the BOB to bypass mode and turn on an N-channel MOSFET on the periphery of the BOB. The BOB power supply is bypassed to improve the conversion efficiency of the BOB path, reduce part of the power consumption of the BOB, and achieve the effect of power saving.

FIG. 7 is a schematic diagram of a method for controlling an electronic device provided by an embodiment of the present application. Referring to FIG. 7 , an embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 3( b ), and the execution subject of the method for controlling an electronic device provided by an embodiment of the present application may be the electronic device mentioned above , the method for controlling an electronic device provided by the embodiment of the present application may include:

Step 710, obtaining the input voltage of the BOB;

Step 720, determining whether the input voltage satisfies the condition of V _IN≤V _BOB /n;

Step 730, when the input voltage satisfies V _IN ≤ V _BOB /n, stop the BOB from working, and turn on a pair of reverse N-channel MOSFETs around the BOB.

In addition, the method for controlling an electronic device provided by the embodiment of the present application may further include: step 740, when the input voltage does not satisfy V _IN ≤ V _BOB /n, turning off a pair of reversed N-channels on the periphery of the BOB MOSFET, and make the BOB work properly.

According to the method for controlling the above-mentioned electronic device provided by the embodiments of the present application, the input voltage of BOB is obtained; it is determined whether the input voltage satisfies the condition of V _IN ≤V _BOB /η; when the input voltage satisfies the condition of V _IN ≤V _BOB /η when the BOB is switched to a power saving working state. In this way, when the condition of V _IN ≤V _BOB /η is satisfied, the conversion efficiency of the BOB path is less than or equal to the conversion efficiency of the LDO path, and the BOB path can be switched to an equivalent LDO path by controlling the BOB path, specifically: stop the BOB from working, and conduct the BOB path. Turn on a pair of reverse N-channel MOSFETs on the periphery of the BOB; or, switch the BOB to bypass mode and turn on a pair of reverse N-channel MOSFETs on the periphery of the BOB, both of which can bypass the BOB to improve the The conversion efficiency of the BOB channel can reduce part of the power consumption of the BOB and achieve the effect of power saving.

This embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 4( a ). The execution subject of the method for controlling an electronic device provided by the embodiment of the present application may be the above-mentioned electronic device. An example provided method of controlling an electronic device may include:

Get the input voltage of BOB;

Obtain the values of V _SET , output current and η of BOB;

When the input voltage satisfies V _IN≤V _BOB /n, switching the BOB to a power-saving working state;

Wherein, the switching the BOB to the power-saving working state includes: switching the BOB to the bypass mode, and turning on an N-channel MOSFET on the periphery of the BOB; or, switching the BOB to the bypass mode , and turn off an N-channel MOSFET on the periphery of BOB.

The method for controlling an electronic device provided by the embodiment of the present application further includes: when the input voltage does not satisfy V _IN ≤ V _BOB /η, turning off an N-channel MOSFET on the periphery of the BOB, and making the BOB work normally.

According to the method for controlling the above-mentioned electronic device provided by the embodiments of the present application, the input voltage of BOB is obtained; it is determined whether the input voltage satisfies the condition of V _IN ≤V _BOB /η; when the input voltage satisfies the condition of V _IN ≤V _BOB /η when the BOB is switched to a power saving working state. In this way, when the condition of V _IN ≤V _BOB /η is satisfied, the conversion efficiency of the BOB path is less than or equal to the conversion efficiency of the LDO path, and the BOB path can be switched to an equivalent LDO path by controlling the BOB path, specifically: switching the BOB to the bypass mode , and turn off an N-channel MOSFET on the periphery of the BOB; or, switch the BOB to bypass mode and turn on an N-channel MOSFET on the periphery of the BOB to bypass the BOB to improve the conversion efficiency of the BOB path. Reduce part of the power consumption of BOB to achieve the effect of power saving.

FIG. 8 is a schematic diagram of a method for controlling an electronic device provided by an embodiment of the present application. Referring to FIG. 8 , an embodiment of the present application may provide a method for controlling an electronic device as shown in FIG. 4( b ). The executive body of the provided method for controlling an electronic device may be the electronic device mentioned above, and the method for controlling an electronic device provided by the embodiments of the present application may include:

Step 810: Obtain the input voltage V _IN of the BOB;

Step 820: Obtain the values of V _SET , output current and η of BOB;

Step 830: Determine whether the input voltage satisfies the condition of V _IN ≤ V _BOB /η;

When the input voltage satisfies V _IN ≤ V _BOB /n, the BOB is switched to a bypass mode, and a pair of reverse N-channel MOSFETs around the BOB are turned on.

The method for controlling an electronic device provided by the embodiment of the present application further includes: step 840, when the input voltage does not satisfy V _IN ≤ V _BOB /n, turning off a pair of reverse N-channel MOSFETs on the periphery of the BOB, and making the BOB normal Work.

According to the method for controlling the above-mentioned electronic device provided by the embodiments of the present application, the input voltage of BOB is obtained; it is determined whether the input voltage satisfies the condition of V _IN ≤V _BOB /η; when the input voltage satisfies the condition of V _IN ≤V _BOB /η when the BOB is switched to a power saving working state. In this way, when the condition of V _IN ≤V _BOB /η is satisfied, the conversion efficiency of the BOB path is less than or equal to the conversion efficiency of the LDO path, and the BOB path can be switched to an equivalent LDO path by controlling the BOB path, specifically: switching the BOB to the bypass mode , and turn on a pair of reverse N-channel MOSFETs around the BOB, which can reduce part of the power consumption of the BOB and achieve the effect of power saving.

On the other hand, as mentioned above, in the BOB power supply, the working principle of BOB switching to bypass mode is: switch K1 and switch K4 inside the BOB chip are turned on, switch K2 and switch K3 are not turned on, and the current can be led from V _IN The pin enters, flows through the switch K1, the inductor L1, and the switch K4, and flows out from the V _OUT pin. Specifically, when V _IN =V _SET , V _BOB =V _SET , the operation of the BOB switches to the bypass mode. In the bypass mode, the working current of the BOB flows through the switch K1 , the inductor L1 and the switch K4 as shown in FIG. 5 . When , BOB has operating loss, power loss=I*I*R. Among them, I is the output current of the BOB, and R is the sum of the on-resistance of the three components of the switch K1, the inductor L, and the switch K4 inside the BOB power supply (refer to the TPS63027 chip specification, the switch K1, the inductor L, and the switch K4). The on-resistances of the components are 48mΩ, 30mΩ, and 33mΩ, respectively; the sum of the impedances of the three components=111mΩ). Accordingly, the embodiments of the present application provide another method for controlling an electronic device. A switching element is added at the periphery of the BOB chip, and the on-resistance of the switching element is less than the on-resistance of the internal on-resistance of the BOB power supply in the bypass mode of the BOB. And, by controlling the conduction of the switching element to reduce the on-resistance of the BOB power supply in the bypass mode of the BOB, part of the power consumption of the BOB can be saved.

An embodiment of the present application provides another method for controlling an electronic device as shown in FIG. 1 , FIG. 9 is a schematic diagram of a method for controlling an electronic device provided by an embodiment of the present application, and the method for controlling an electronic device provided by an embodiment of the present application include:

Step 910: Obtain the input voltage of the BOB;

Step 920: Determine whether the input voltage satisfies a preset condition;

Step 930: When the input voltage satisfies the preset condition, switch the BOB to a power saving working state.

The obtaining the input voltage of the BOB includes: obtaining the input voltage of the BOB from the BOB;

The determining whether the input voltage satisfies a preset condition includes: determining by the BOB whether the input voltage is equal to the actual output voltage of the BOB;

For example, after obtaining the input voltage V _IN of the BOB, it is determined whether the input voltage V _IN of the BOB is equal to the actual output voltage V BOB of the _BOB .

Wherein, the switching of the BOB to the power-saving working state includes:

make the BOB stop working, and turn on the switching element;

Alternatively, the BOB is switched to bypass mode and the switching element is turned on.

The method for controlling an electronic device provided by the embodiment of the present application further includes: Step 940 : when the input voltage does not meet the preset condition, turn off the switch element and make the BOB work normally.

According to the method for controlling the above-mentioned electronic device provided by the embodiment of the present application, by acquiring the input voltage of the BOB; determining whether the input voltage satisfies the preset condition; when the input voltage satisfies the preset condition, switching the BOB to save power working status. In this way, switching elements are added at the periphery of the BOB. Since the switching elements at the periphery of the BOB are not affected by the packaging of the BOB chip, the on-resistance of the switching elements can be very low (selectable within 10mΩ, for example, the conduction of the switching elements impedance is 10mΩ). That is to say, the bypass mode of BOB is switched to the operation of the peripheral switching elements, or, the bypass mode of the BOB and the peripheral switching elements work at the same time, because the on-resistance of the peripheral switching elements is smaller than that of the internal BOB in the bypass mode. The sum of the on-resistance (10mΩ is obviously much smaller than 111mΩ) reduces the on-resistance in the BOB bypass mode, which can save part of the power consumption of the BOB and achieve the effect of power saving.

It should be pointed out that the method for controlling an electronic device as shown in FIG. 9 provided in the embodiment of the present application can also be applied to FIG. 2(a), FIG. 2(b), FIG. 3(a), and FIG. 3(b). ), the electronic equipment shown in Figure 4(a) and Figure 4(b).

An embodiment of the present application provides a method for controlling an electronic device as shown in FIG. 2( a ). The method for controlling an electronic device provided by an embodiment of the present application includes:

Get the input voltage of BOB;

determining whether the input voltage V _IN of the BOB is equal to the actual output voltage V BOB of the _BOB ;

When the input voltage V _IN is equal to the actual output voltage V _BOB of the BOB, the BOB is switched to a power saving working state.

The switching of the BOB to the power-saving working state includes: when the input voltage V _IN is equal to the actual output voltage V _BOB of the BOB, stopping the BOB and turning on the switching element;

Alternatively, when the input voltage V _IN is equal to the actual output voltage V _BOB of the BOB, the BOB is switched to a bypass mode, and the switching element is turned on.

It should be noted that the first power-saving working state is: stop the BOB from working and turn on the switching element. The second power-saving working state is: switching the BOB to a bypass mode and turning on the switching element. Since the on-resistance of the switching element is smaller than the sum of the internal on-resistances in the BOB bypass mode, the on-resistance of the BOB power supply in the first power saving working state is smaller than the on-resistance of the BOB power supply bypass mode. In the second power-saving working state, the on-resistance of the BOB power supply is the on-resistance of the switching element and the internal on-resistance in the BOB bypass mode. The on-resistance of the BOB power supply in the electrical working state is smaller, which further reduces the on-resistance in the BOB bypass mode.

In addition, the method for controlling an electronic device provided by the embodiment of the present application further includes: when the input voltage V _IN of the BOB is not equal to the actual output voltage V _BOB of the BOB, turning off the switching element and making the BOB work normally.

According to the method for controlling the above electronic device provided by the embodiments of the present application, by obtaining the input voltage of the BOB; determining whether the input voltage V _IN of the BOB is equal to the actual output voltage V _{BOB of the BOB} ; when the input voltage satisfies V _IN =V _BOB When conditions are met, the BOB is switched to a power-saving working state. In this way, the on-resistance in the BOB bypass mode is reduced, part of the power consumption of the BOB can be saved, and the effect of power saving is achieved.

The above-mentioned method for controlling the electronic device shown in FIG. 2(a) provided by the embodiment of the present application can also be applied to the electronic device shown in FIG. 3(a)(b). For example, the embodiment of the present application further provides a The method for controlling the electronic device as shown in FIG. 3(a), the method for controlling the electronic device provided by the embodiment of the present application includes:

Get the input voltage of BOB;

The switching of the BOB to a power-saving working state includes: when the input voltage V _IN is equal to the actual output voltage V _BOB of the BOB, the BOB is stopped from working, and an N-channel peripheral of the BOB is turned on. MOSFET;

Alternatively, when the input voltage V _IN is equal to the actual output voltage V _BOB of the BOB, the BOB is switched to a bypass mode, and an N-channel MOSFET on the periphery of the BOB is turned on.

It should be pointed out that the first power saving working state is: stop the BOB from working, and turn on an N-channel MOSFET on the periphery of the BOB. The second power-saving working state is: switching the BOB to the bypass mode, and turning on an N-channel MOSFET on the periphery of the BOB. Since the on-resistance of an N-channel MOSFET on the periphery of the BOB is less than the sum of the internal on-resistances in the BOB bypass mode, the on-resistance of the BOB power supply in the first power-saving working state is smaller than that in the BOB power supply bypass mode. impedance. In the second power-saving working state, the on-resistance of the BOB power supply is the on-resistance of an N-channel MOSFET on the periphery of the BOB and the internal on-resistance in the BOB bypass mode. The on-resistance is smaller than the on-resistance of the BOB power supply in the first power-saving working state, which further reduces the on-resistance in the BOB bypass mode.

In addition, the method for controlling an electronic device provided by the embodiment of the present application further includes: when the input voltage V _IN of the BOB is not equal to the actual output voltage V _BOB of the BOB, turning off an N-channel MOSFET on the periphery of the BOB, and making the BOB normal Work.

The above-mentioned method for controlling the electronic device shown in FIG. 2( a ) provided by the embodiments of the present application can also be applied to the electronic device shown in FIG. 3( b ), which will not be described in detail below.

An embodiment of the present application provides a method for controlling an electronic device as shown in FIG. 2(b). The method for controlling an electronic device provided by an embodiment of the present application includes:

Get the input voltage of BOB;

The switching of the BOB to a power-saving working state includes: switching the BOB to a bypass mode, and turning on the switching element.

It should be noted that the third power saving working state is: switching the BOB to the bypass mode and turning on the switching element. Since the on-resistance of the switching element is smaller than the on-resistance of the inductance inside the BOB power supply in the bypass mode (for example, 10mΩ is obviously less than 30mΩ), the on-resistance of the BOB power supply in the third power-saving working state is smaller than that of the BOB side On-resistance in circuit mode.

The above-mentioned method for controlling the electronic device shown in FIG. 2(b) provided by the embodiment of the present application can also be applied to the electronic device shown in FIG. 4(a) and FIG. 4(b), and details are not described below.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims

An electronic device, comprising a CPU, a buck-boost converter BOB, an inductor, and a switching element, wherein the CPU is respectively connected with the BOB and the switching element,

The BOB has at least two pairs of pins, the first pair of pins in the at least two pairs of pins are respectively connected to both ends of the inductor, and the second pair of pins in the at least two pairs of pins or the The first pair of pins are respectively connected to both ends of the switching element;

switching the BOB to a bypass mode when the input voltage of the BOB is less than or equal to a voltage threshold;

Wherein, the voltage threshold is equal to the actual output voltage of the BOB/η, where η is the conversion efficiency of the BOB.
The electronic device of claim 1, wherein the switching element comprises a metal-oxide semiconductor field effect transistor (MOSFET), the MOSFET having a gate, a source and a drain, the gate being connected to the CPU , the second pair of pins includes a first voltage pin and a second voltage pin, and the first voltage pin and the second voltage pin are respectively connected to the source and drain of the MOSFET.
The electronic device of claim 1, wherein the switching element comprises a pair of oppositely connected MOSFETs, the second pair of pins comprises a first voltage pin and a second voltage pin, the first voltage The pin, the pair of oppositely connected MOSFETs and the second voltage pin are sequentially connected in series.
The electronic device of claim 3, wherein the pair of oppositely connected MOSFETs comprises a first MOSFET and a second MOSFET;

The first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain of the first MOSFET is connected to the drain of the second MOSFET, the source of the first MOSFET is connected to the first voltage pin, and the source of the second MOSFET is connected to the first voltage pin. connecting the second voltage pin, the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU;

Alternatively, the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, the drain of the first MOSFET is connected to the first voltage pin, and the second MOSFET is connected to the source of the second MOSFET. The drain is connected to the second voltage pin, and the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU.
The electronic device of claim 1, wherein the switching element comprises a MOSFET having a gate, a source and a drain, the gate is connected to the CPU, the first pair of pins It includes a first inductance pin and a second inductance pin, and the first inductance pin and the second inductance pin are respectively connected to the source and the drain of the MOSFET.
The electronic device of claim 1, wherein the switching element comprises a pair of oppositely connected MOSFETs, the first pair of pins comprises a first inductance pin and a second inductance pin, the first inductance The pins, the pair of oppositely connected MOSFETs and the second inductor pins are sequentially connected in series.
The electronic device of claim 6, wherein the pair of oppositely connected MOSFETs includes a first MOSFET and a second MOSFET;

The first MOSFET and the second MOSFET are both N-channel MOSFETs; the drain of the first MOSFET is connected to the drain of the second MOSFET, the source of the first MOSFET is connected to the first inductor pin, and the source of the second MOSFET connecting the second inductor pin, the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU;

Alternatively, the first MOSFET and the second MOSFET are both P-channel MOSFETs; the source of the first MOSFET is connected to the source of the second MOSFET, the drain of the first MOSFET is connected to the first inductor pin, and the second MOSFET The drain is connected to the second inductor pin, and the gate of the first MOSFET and the gate of the second MOSFET are both connected to the CPU.
A method of controlling the electronic device according to any one of claims 1-7, the method comprising:

Get the input voltage of BOB;

Determine whether the input voltage is less than or equal to a voltage threshold; wherein, the voltage threshold is equal to the actual output voltage of the BOB/η, where η is the conversion efficiency of the BOB;

When the input voltage is less than or equal to a voltage threshold, the BOB is switched to bypass mode and the switching element is turned on.
The method of claim 8, wherein the method further comprises:

When the input voltage is greater than a voltage threshold, the switching element is turned off.