CN112908963A - Substrate structure, preparation method and electronic product - Google Patents
Substrate structure, preparation method and electronic product Download PDFInfo
- Publication number
- CN112908963A CN112908963A CN202110073925.9A CN202110073925A CN112908963A CN 112908963 A CN112908963 A CN 112908963A CN 202110073925 A CN202110073925 A CN 202110073925A CN 112908963 A CN112908963 A CN 112908963A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- edge
- outer lead
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
The invention discloses a substrate structure, a preparation method and an electronic product. The substrate structure comprises a substrate layer, a middle layer and a top layer, wherein the middle layer comprises an inner lead and an outer lead, the inner lead is arranged on one side of the substrate layer, and the outer lead is arranged on the periphery of the inner lead and extends to the edge of the substrate layer; the top layer is arranged on one side of the middle layer, which is deviated from the base material layer. The outer lead is extended to the edge of the substrate layer, so that the shielding layer is convenient to arrange, and meanwhile, in the preparation process, the outer lead can be extended out of the edge of the substrate layer.
Description
Technical Field
The invention relates to the technical field of system-in-package, in particular to a substrate structure, a preparation method and an electronic product.
Background
With the development of SiP (System-in-Package) technology and the demand for miniaturization of electronic devices, the active module and the passive device are integrated into a System at a Package level by using a packaging technology to increase the device integration level, thereby reducing the device area on a PCB (Printed Circuit Board) Board and improving the integration level and simplification of the PCB. The great adoption of SiP to make customized modules is also an important way for miniaturization of current electronic devices.
In the related art, when a substrate is designed, a GND (ground end of an electric wire) copper sheet is pulled outwards, and when the substrate is spliced and cut into single pieces, redundant copper sheets are cut off and connected with a later sputtering metal shielding layer to form electromagnetic shielding. The requirement of cutting the copper sheet on cutting equipment is high, and because the ductility of copper is good, burrs are easily generated when the copper sheet is cut by ordinary equipment, and a process of sputtering a metal shielding layer by using EMI (Electromagnetic Interference) cannot be performed later.
Disclosure of Invention
The invention mainly aims to provide a substrate structure, aiming at solving the problem of burrs generated by copper cutting of equipment.
In order to achieve the above object, the substrate structure provided by the present invention comprises:
a substrate layer;
the middle layer comprises an inner lead and an outer lead, the inner lead is arranged on one side of the substrate layer, and the outer lead is arranged on the periphery of the inner lead and extends to the edge of the substrate layer; and
the top layer is arranged on one side, deviating from the base material layer, of the middle layer.
In an embodiment of the invention, the substrate structure further includes a shielding layer, the shielding layer is disposed on a side of the top layer away from the middle layer, and a periphery of the shielding layer extends to an edge of the substrate layer and is connected to the outer lead.
In an embodiment of the invention, the substrate structure further includes a connecting member, the substrate layer is provided with a via hole, and the connecting member is disposed in the via hole and connected to the inner lead through a ground pad.
In an embodiment of the present invention, the inner leads are connected end to form a closed-loop rectangular structure; the quantity of via hole is four, four the via hole is located respectively four bights of substrate layer, and respectively with four angles of inner lead are connected.
In an embodiment of the invention, the number of the intermediate layers is two, the two intermediate layers are stacked, and the two outer leads are alternately arranged.
The invention further provides a method for manufacturing a substrate structure, which is used for manufacturing the substrate structure according to the embodiment, and the method comprises the following steps:
providing a substrate layer, a middle layer and a top layer;
arranging the middle layer on one side of the substrate layer, preparing an inner lead and an outer lead in the middle layer, and externally drawing the outer lead to extend out of the edge of the substrate layer;
arranging the top layer on one side of the middle layer, which is far away from the base material layer;
and cutting the outer lead along the edge of the substrate layer, and leveling the outer lead with the edge of the substrate layer.
In an embodiment of the present invention, after the step of cutting the outer leads along the edge of the substrate layer, the method further includes:
and sputtering a metal shielding layer on one side of the top layer, which is deviated from the middle layer, and extending and sputtering to the peripheral side covering the base material layer to connect the shielding layer with the part of the outer lead exposed at the edge of the substrate.
In an embodiment of the present invention, before the step of disposing the intermediate layer on one side of the substrate layer, preparing an inner lead and an outer lead in the intermediate layer, and pulling the outer lead out to extend out of an edge of the substrate layer, the method further includes:
drilling a through hole in the substrate layer, and preparing the connecting piece in the through hole;
preparing a grounding pad on the middle layer corresponding to the position of the via hole, so that the grounding pad is connected with the connecting piece;
and connecting the inner lead with a grounding pad.
In an embodiment of the present invention, the number of the intermediate layers is two, and the two intermediate layers are respectively a first intermediate layer and a second intermediate layer; the intermediate layer is arranged on one side of the base material layer, an inner lead and an outer lead are prepared on the intermediate layer, and the outer lead is pulled outwards to extend out of the edge of the base material layer, and the steps comprise:
arranging the first intermediate layer on one side of the substrate layer, and externally pulling the outer lead of the first intermediate layer to the edge extending out of the substrate layer;
arranging the second middle layer on one side of the substrate layer of the first middle layer, and externally pulling an outer lead of the second middle layer to extend out of the edge of the substrate layer; and the outer leads of the second intermediate layer and the outer leads of the first intermediate layer are arranged in a staggered manner.
The invention further provides an electronic product, which comprises an electronic product main body and the substrate structure in the embodiment, wherein the substrate structure is arranged on the electronic product main body.
According to the technical scheme, the outer lead is arranged in the middle layer and extends to the edge of the substrate layer, on one hand, when the shielding layer is arranged subsequently, the shielding layer is connected with the outer lead to achieve grounding, and the shielding layer is convenient to arrange, on the other hand, the outer lead can extend out of the edge of the substrate layer in the preparation process, and as the outer lead is fixed between the substrate layer and the top layer, burrs cannot be generated in the process of cutting the outer lead along the edge of the substrate layer, and the arrangement of the subsequent shielding layer can be guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a substrate structure according to an embodiment of the present invention;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a schematic view of the method for manufacturing a substrate structure according to the present invention, wherein the outer leads extend out of the edge of the substrate layer;
FIG. 4 is a schematic view of a substrate structure with a shield cover according to the present invention;
fig. 5 is a side view of fig. 4.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2 | |
| 3 | Shielding layer | 4 | Via |
| 5 | Inner lead wire | 6 | Grounding pad |
The implementation, functional features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a substrate structure 1.
In the embodiment of the present invention, as shown in fig. 1 and fig. 2, the substrate structure 1 includes a substrate layer, an intermediate layer, and a top layer, where the intermediate layer includes an inner lead 5 and an outer lead 2, the inner lead 5 is disposed on one side of the substrate layer, and the outer lead 2 is disposed on the periphery of the inner lead 5 and extends to the edge of the substrate layer; the top layer is arranged on one side of the middle layer, which deviates from the base material layer.
In this embodiment, the substrate layer includes a first surface and a second surface that are opposite to each other; the intermediate layer is arranged on the first surface; the top layer is arranged on the first surface and covers the middle layer.
According to the technical scheme, the outer lead 2 is arranged in the middle layer, and the outer lead 2 extends to the edge of the substrate layer, so that on one hand, when the shielding layer 3 is arranged subsequently, the shielding layer 3 is connected with the outer lead 2 to realize grounding, and the shielding layer 3 is convenient to arrange, on the other hand, in the preparation process, the outer lead 2 can extend out of the edge of the substrate layer, and as the outer lead 2 is fixed between the substrate layer and the top layer, burrs cannot be generated in the process of cutting the outer lead 2 along the edge of the substrate layer, and the arrangement of the subsequent shielding layer 3 can be ensured.
In this embodiment, the edge of the top layer is flush with the edge of the substrate layer. It can be understood that the substrate structure 1 of the present invention is a multilayer circuit board, which is a carrier board for integrating electronic components in electronic products, and includes a package substrate layer, a printed circuit board, and the like. The substrate structure 1 comprises a substrate layer, a middle layer and a top layer, wherein the middle layer is provided with a printed circuit diagram, and the substrate layer, the middle layer and the top layer are mutually superposed and can wrap and fix the outer lead 2, so that the outer lead 2 can be firmly fixed, and burrs cannot be generated during cutting. After the cutting, the tip of outer lead 2 flushes with the edge of substrate layer and top layer, and outer lead 2 after the cutting exposes in the edge of substrate layer and top layer, shielding layer 3's setting when being convenient for follow-up encapsulation, and follow-up only needs cover shielding layer 3 in the face that exposes to the outside, can realize electromagnetic shield's effect, and shielding layer 3 and outer lead 2's end connection realize shielding layer ground connection simultaneously.
The outer leads are made of a material having good electrical conductivity, such as gold, silver, copper, aluminum, or an alloy thereof. In this embodiment, the second surface of the substrate layer may be used to prepare solder balls and the like for mounting electronic components.
In an embodiment of the present invention, as shown in fig. 4 and 5, the substrate structure 1 further includes a shielding layer 3, the shielding layer 3 is disposed on a side of the top layer away from the middle layer, and a peripheral edge of the shielding layer 3 extends to an edge of the substrate layer and is connected to the outer lead 2. .
In this embodiment, the shielding coating is a metal coating prepared by a plating process such as sputtering. Shielding layer 3 is located the top layer deviates from one side of substrate layer, just shielding layer 3's periphery extends to the edge of substrate layer, and with outer lead 2 is connected, forms faraday cage, realizes electromagnetic shield's effect. The shielding layer 3 is made of a metal material, so that a good shielding effect can be ensured. In this embodiment, the top layer is provided with an electronic component, and the electronic component is encapsulated by filling the encapsulation resin, so that the electronic layer is encapsulated in the middle layer and electrically connected with the middle layer, thereby realizing encapsulation and shielding of the substrate structure. The electronic component includes a protected component or a sensitive electronic component.
In an embodiment of the present invention, the substrate structure 1 further includes a connecting member, the substrate layer is provided with a via hole 4, the via hole 4 extends to penetrate through the intermediate layer, and the connecting member is disposed in the via hole 4; and connected with the inner lead through a grounding pad.
In this embodiment, the inner leads 5 are connected end to form a closed loop structure; the inner lead 5 and the connecting piece are connected through a grounding pad to be grounded.
It can be understood that, circuit signal in the intermediate layer is connected through inner lead 5, and inner lead 5 passes through the grounding pad and is connected with the connecting piece, realizes ground connection, and outer lead 2 is connected with inner lead 5, and consequently outer lead 2 has just also realized ground connection, is connected the back at shielding lid and outer lead 2, can realize the ground connection of shielding lid, and the ground connection project organization of the shielding lid of this embodiment is ingenious, can reach fine shielding effect.
In this embodiment, the connecting member may be formed in the via hole by plating metal or the like. More specifically, the via may be a metalized via with a copper plating, in which case the connecting element is a copper layer with a conductive effect.
In this embodiment, the grounding pad is disposed in the intermediate layer, the grounding pad and the via hole are disposed in a one-to-one correspondence, and the inner lead is connected to the connecting member in the via hole through the grounding pad, so as to achieve grounding.
In this embodiment, set up inner lead 5 to end-to-end's structure, can guarantee that shielding lid and outer lead 2 are connected the back, form the Faraday cage, ensure the shielding effect of shielding lid.
In this embodiment, the outer leads 2 and the inner leads 5 are orthogonal, the plurality of outer leads 2 are arranged around the inner leads 5, one end of each outer lead 2 is connected with the inner lead 5, and the other end of each outer lead extends to the edge of the substrate layer.
In an embodiment of the present invention, the inner leads are connected end to form a closed-loop rectangular structure; the number of the through holes 4 is four, and the four through holes 4 are respectively arranged at four corners of the substrate layer and are respectively connected with four corners of the inner lead; the number of the outer leads 2 is multiple, and the outer leads 2 are arranged at intervals.
It will be appreciated that the above design may improve the shielding stability and shielding effectiveness of the shielding cover.
It should be noted that the number of the vias 4 is not limited to four, which is only an exemplary example for explaining the present invention, and in the specific implementation, any number of vias, for example, more vias larger than 4, may be provided according to actual needs, and the like, and all of the vias are within the protection scope of the present invention.
In an embodiment of the present invention, the number of the intermediate layers is two, two of the intermediate layers are stacked, and the outer leads 2 of the two intermediate layers are alternately arranged.
In other embodiments, the two layers of outer leads 2 may also be in a non-offset arrangement, i.e. spaced up and down and stacked. In this embodiment, with two-layer outer lead 2 dislocation design about will, do benefit to the cutting in order to guarantee when cutting outer lead 2, guarantee that cutting outer lead 2 is difficult for the wire drawing.
The present invention further provides a method for manufacturing a substrate structure 1, which is used for manufacturing the substrate structure 1 according to the above embodiment, and the method includes the following steps:
providing a substrate layer, a middle layer and a top layer;
arranging the middle layer on one side of the substrate layer, preparing an inner lead 3 and an outer lead 2 in the middle layer, and externally drawing the outer lead 2 to extend out of the edge of the substrate layer;
arranging the top layer on one side of the middle layer, which is far away from the base material layer;
and cutting the outer lead along the edge of the substrate layer, and leveling the outer lead with the edge of the substrate layer.
In this embodiment, the top layer covers the outer leads 2, so that the outer leads 2 are fixed on the substrate layer; and cutting the outer leads 2 along the edge of the substrate layer to enable the outer leads 2 to be exposed at the edge of the substrate layer.
In this embodiment, the edge parallel and level of the top layer of substrate layer sets up, when setting up outer lead 2, at first with outer lead 2 outer draw to stretching out the edge of substrate layer, after substrate layer and top layer fix outer lead 2, can follow the edge cutting outer lead 2 of substrate layer and top layer, with the partial excision that stretches out, the terminal surface of remaining outer lead 2 just appears in the edge of substrate layer and top layer to with the edge parallel and level of substrate layer and top layer. Because substrate layer and top layer are fixed to outer lead 2, when cutting outer lead 2 along substrate layer and top layer edge, can guarantee the dry and brittle of cutting, be difficult for producing deckle edge, can ensure the normal setting of follow-up shielding lid.
As shown in fig. 3, there is shown a step of providing the intermediate layer on one side of the substrate layer and drawing the outer leads 2 out to extend beyond the edge of the substrate layer.
In an embodiment of the present invention, after the step of cutting the outer lead 2 along the edge of the substrate layer, the method further includes:
and sputtering a metal shielding layer 3 on one side of the top layer departing from the middle layer, and extending and sputtering to the peripheral side covering the base material layer to connect the shielding layer with the part of the outer lead exposed at the edge of the substrate.
In this embodiment, the substrate layer, the intermediate layer, and the top layer are stacked to form a square structure, and the shielding layer 3 covers one side surface and the peripheral side of the square structure, that is, only the second surface of the substrate layer is not covered with the shielding layer 3, thereby realizing shielding of the package of the substrate structure 1.
In an embodiment of the present invention, before the step of disposing the intermediate layer on one side of the substrate layer, preparing an inner lead and an outer lead in the intermediate layer, and pulling the outer lead out to extend out of an edge of the substrate layer, the method further includes:
drilling holes in the base material layer and the top layer to form through holes 4, and preparing the connecting piece in the through holes 4;
preparing a grounding pad on the middle layer corresponding to the position of the via hole, so that the grounding pad is connected with the connecting piece;
and connecting the inner lead with a grounding pad.
In this embodiment, the connecting member may be formed by pouring metal or the like in the via hole.
The circuit signal in the intermediate layer is connected through inner lead 5, inner lead 5 and connecting piece, and inner lead 5 realizes ground connection through grounding pad and connecting piece, and outer lead 2 is connected with inner lead 5, and consequently outer lead 2 has just also realized ground connection, is connected the back at shielding lid and outer lead 2, can realize the ground connection of shielding lid, and the ground connection project organization of the shielding lid of this embodiment is ingenious, can reach fine shielding effect.
In an embodiment of the present invention, the number of the intermediate layers is two, and the two intermediate layers are respectively a first intermediate layer and a second intermediate layer; the intermediate layer is arranged on one side of the base material layer, an inner lead and an outer lead are prepared on the intermediate layer, and the outer lead is pulled outwards to extend out of the edge of the base material layer, and the steps comprise:
arranging the first intermediate layer on one side of the substrate layer, and externally pulling the outer lead of the first intermediate layer to the edge extending out of the substrate layer;
arranging the second middle layer on one side of the substrate layer of the first middle layer, and externally pulling an outer lead of the second middle layer to extend out of the edge of the substrate layer; and the outer leads of the second intermediate layer and the outer leads of the first intermediate layer are arranged in a staggered manner.
After the setting of the two intermediate layers and the two outer leads 2 is completed, a top layer is prepared on one side of the second intermediate layer, which deviates from the first intermediate layer, and the two outer leads 2 are fixed on the base material layer by the top layer.
It should be noted that insulating layers are respectively arranged between the substrate layer, the first intermediate layer, the second intermediate layer and the top layer, and the insulating layer wraps the outer lead 2, so that the outer lead 2 is fixed between the substrate layer and the top layer, and plays a role in insulating and isolating.
The present invention further provides an electronic product, which includes an electronic product main body and a substrate structure 1, and the specific structure of the substrate structure 1 refers to the above embodiments, and since the electronic product adopts all technical solutions of all the above embodiments, the electronic product at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. The substrate structure 1 is disposed on the electronic product main body.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A substrate structure, comprising:
a substrate layer;
the middle layer comprises an inner lead and an outer lead, the inner lead is arranged on one side of the substrate layer, and the outer lead is arranged on the periphery of the inner lead and extends to the edge of the substrate layer; and
the top layer is arranged on one side, deviating from the base material layer, of the middle layer.
2. The substrate structure of claim 1, further comprising a shielding layer disposed on a side of the top layer facing away from the middle layer, wherein a periphery of the shielding layer extends to an edge of the substrate layer and is connected to the outer lead.
3. The substrate structure of claim 1, further comprising a connector, wherein the substrate layer defines a via hole, and the connector is disposed in the via hole and connected to the inner lead via a ground pad.
4. The substrate structure of claim 3, wherein the inner leads are connected end-to-end to form a closed-loop rectangular structure; the quantity of via hole is four, four the via hole is located respectively four bights of substrate layer, and respectively with four angles of inner lead are connected.
5. The substrate structure according to claim 1, wherein the number of the intermediate layers is two, two of the intermediate layers are stacked, and two of the outer leads are alternately arranged.
6. A method of manufacturing a substrate structure for making a substrate structure according to any of claims 1 to 5, comprising the steps of:
providing a substrate layer, a middle layer and a top layer;
arranging the middle layer on one side of the substrate layer, preparing an inner lead and an outer lead in the middle layer, and externally drawing the outer lead to extend out of the edge of the substrate layer;
arranging the top layer on one side of the middle layer, which is far away from the base material layer;
and cutting the outer lead along the edge of the substrate layer, and leveling the outer lead with the edge of the substrate layer.
7. The method of manufacturing a substrate structure according to claim 6, wherein the step of cutting the outer leads along the edge of the base material layer further comprises:
and sputtering a metal shielding layer on one side of the top layer, which is deviated from the middle layer, and extending and sputtering to the peripheral side covering the base material layer to connect the shielding layer with the part of the outer lead exposed at the edge of the substrate.
8. The method of manufacturing a substrate structure according to claim 6, wherein the step of providing the intermediate layer on one side of the substrate layer, preparing inner leads and outer leads in the intermediate layer, and drawing the outer leads out to extend beyond the edge of the substrate layer further comprises:
drilling a through hole in the substrate layer, and preparing the connecting piece in the through hole;
preparing a grounding pad on the middle layer corresponding to the position of the via hole, so that the grounding pad is connected with the connecting piece;
and connecting the inner lead with a grounding pad.
9. The method of manufacturing a substrate structure according to claim 6, wherein the number of the intermediate layers is two, being a first intermediate layer and a second intermediate layer, respectively; the intermediate layer is arranged on one side of the base material layer, an inner lead and an outer lead are prepared on the intermediate layer, and the outer lead is pulled outwards to extend out of the edge of the base material layer, and the steps comprise:
arranging the first intermediate layer on one side of the substrate layer, and externally pulling the outer lead of the first intermediate layer to the edge extending out of the substrate layer;
arranging the second middle layer on one side of the substrate layer of the first middle layer, and externally pulling an outer lead of the second middle layer to extend out of the edge of the substrate layer; and the outer leads of the second intermediate layer and the outer leads of the first intermediate layer are arranged in a staggered manner.
10. An electronic product, comprising an electronic product main body and the substrate structure according to any one of claims 1 to 5, wherein the substrate structure is disposed on the electronic product main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110073925.9A CN112908963B (en) | 2021-01-19 | 2021-01-19 | Substrate structure, preparation method and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110073925.9A CN112908963B (en) | 2021-01-19 | 2021-01-19 | Substrate structure, preparation method and electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112908963A true CN112908963A (en) | 2021-06-04 |
| CN112908963B CN112908963B (en) | 2022-12-23 |
Family
ID=76116498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110073925.9A Active CN112908963B (en) | 2021-01-19 | 2021-01-19 | Substrate structure, preparation method and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112908963B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101755496A (en) * | 2007-05-25 | 2010-06-23 | 爱克泰克公司 | Interference shielded electronics module and method for providing the same |
| US20130133940A1 (en) * | 2011-11-25 | 2013-05-30 | Askey Computer Corporation | System in package module and method of fabricating the same |
| CN106340498A (en) * | 2016-10-20 | 2017-01-18 | 江苏长电科技股份有限公司 | Packaging structure with electromagnetic shielding grounding function and manufacturing method thereof |
| CN109803523A (en) * | 2019-02-23 | 2019-05-24 | 华为技术有限公司 | A kind of encapsulation shielding construction and electronic equipment |
| CN111834337A (en) * | 2019-04-22 | 2020-10-27 | 三星电机株式会社 | Electronic component module and method for manufacturing electronic component module |
-
2021
- 2021-01-19 CN CN202110073925.9A patent/CN112908963B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101755496A (en) * | 2007-05-25 | 2010-06-23 | 爱克泰克公司 | Interference shielded electronics module and method for providing the same |
| US20130133940A1 (en) * | 2011-11-25 | 2013-05-30 | Askey Computer Corporation | System in package module and method of fabricating the same |
| CN106340498A (en) * | 2016-10-20 | 2017-01-18 | 江苏长电科技股份有限公司 | Packaging structure with electromagnetic shielding grounding function and manufacturing method thereof |
| CN109803523A (en) * | 2019-02-23 | 2019-05-24 | 华为技术有限公司 | A kind of encapsulation shielding construction and electronic equipment |
| CN111834337A (en) * | 2019-04-22 | 2020-10-27 | 三星电机株式会社 | Electronic component module and method for manufacturing electronic component module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112908963B (en) | 2022-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7261596B2 (en) | Shielded semiconductor device | |
| CN108807304B (en) | Semiconductor package device | |
| US8946886B1 (en) | Shielded electronic component package and method | |
| US20180197824A1 (en) | Anti-emi shielding package and method of making same | |
| US9362209B1 (en) | Shielding technique for semiconductor package including metal lid | |
| US8772088B2 (en) | Method of manufacturing high frequency module and high frequency module | |
| US7411278B2 (en) | Package device with electromagnetic interference shield | |
| US20010017411A1 (en) | Semiconductor chip and semiconductor device having the chip | |
| US9144183B2 (en) | EMI compartment shielding structure and fabricating method thereof | |
| CN108807360A (en) | The method of semiconductor packaging device and manufacture semiconductor packaging device | |
| CN103858227A (en) | Wafer level applied RF shields | |
| US8377749B1 (en) | Integrated circuit transmission line | |
| CN107452696B (en) | It is electromagnetically shielded packaging body and manufacturing method | |
| CN112259528A (en) | SIP structure with double-sided selective electromagnetic shielding package and preparation method thereof | |
| US6800944B2 (en) | Power/ground ring substrate for integrated circuits | |
| KR20140083084A (en) | Semiconductor chip package having Electromagnetic interference shielding layer and method for manufacturing the same | |
| KR20140043568A (en) | Semiconductor package and methods for fabricating the same | |
| CN112908963B (en) | Substrate structure, preparation method and electronic product | |
| CN108666279B (en) | Electronic package and manufacturing method thereof | |
| US10334728B2 (en) | Reduced-dimension via-land structure and method of making the same | |
| JP4026188B2 (en) | Printed wiring board | |
| US20210035916A1 (en) | Semiconductor package | |
| CN111081696A (en) | Semiconductor package and method of manufacturing the same | |
| US20130113089A1 (en) | Module ic package structure having a metal shielding function for preventing electrical malfunction induced by short-circuit | |
| CN109509728B (en) | Electronic package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |