CN112898920A - Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module - Google Patents

Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module Download PDF

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Publication number
CN112898920A
CN112898920A CN201911136135.XA CN201911136135A CN112898920A CN 112898920 A CN112898920 A CN 112898920A CN 201911136135 A CN201911136135 A CN 201911136135A CN 112898920 A CN112898920 A CN 112898920A
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pid
pyrophosphate
parts
adhesive film
composition
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杜柑宏
熊曦
徐骏
王梁
寇智宁
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Hangzhou First Applied Material Co Ltd
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Hangzhou First Applied Material Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2255—Oxides; Hydroxides of metals of molybdenum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/321—Phosphates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Compositions Of Macromolecular Compounds (AREA)
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Abstract

The invention provides a composition for forming a PID (potential induced degradation) resistant packaging adhesive film, the PID resistant packaging adhesive film and a solar module. The composition comprises the following components in parts by weight: 100 parts of matrix resin and 0.01-5 parts of ion exchanger, wherein the ion exchanger is selected from pyrophosphate and/or metal oxide. The two types of ion exchangers are added into the packaging adhesive film, so that the content of metal ions in a system can be effectively reduced, and the enrichment of the metal ions on a antireflection layer of the solar module is weakened or even eliminated, and the PID resistance of the photovoltaic module is favorably improved; the two types of ion exchangers have larger ion exchange capacity and low price, thereby being beneficial to maintaining the PID resistance of the component for a long time and greatly reducing the preparation cost. On the basis, the PID-resistant packaging adhesive film prepared from the composition has the advantages of excellent PID resistance, long service life, low cost and the like.

Description

Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module
Technical Field
The invention relates to the field of solar modules, in particular to a composition for forming a PID (potential induced degradation) resistant packaging adhesive film, the PID resistant packaging adhesive film and a solar module.
Background
Solar energy is a clean, noise-pollution-free renewable energy source and has the advantage of not emitting greenhouse gases. Solar energy is converted into electrical energy by utilizing the photovoltaic effect. Therefore, the preparation of the solar module capable of stably operating for a long time has important significance. However, in the conventional photovoltaic module, under the action of high voltage, leakage current exists between glass and a packaging material, and a large amount of charges are accumulated on the surface of a cell, so that the photoelectric conversion efficiency of the photovoltaic module is greatly reduced, and the reduction range can reach 80-90% in a serious case, which limits the wide application of the photovoltaic module.
In recent decades, companies and research units have conducted extensive and intensive studies on the origin of the PID phenomenon (Potential Induced Degradation), and have proposed many different ideas, among which, the most widely accepted idea is that, in a high-temperature and high-humidity environment, water vapor enters into a photovoltaic module, and through a series of chemical reactions, silicate in glass precipitates a large amount of freely movable Na ions, which are moved to the surface of a battery under the action of an external electric field and are concentrated in an anti-reflection layer, so that leakage current is increased, and the ions are recombined with carriers in a battery piece to reduce the carrier concentration in the battery piece, and finally the open-circuit voltage Voc, the short-circuit Isc, the fill factor FF and the maximum output power Pmax of the module are attenuated.
The prior literature provides a preparation method of a PID (potential induced degradation) resistant packaging adhesive film containing an ion trapping agent, which comprises the following steps: the method comprises the steps of adding an organic ion trapping agent of xanthate or dithiocarbamate derivatives into an EVA adhesive film, eliminating acetic acid generated by hydrolysis of EVA and sodium ions which are separated out from the surface of glass and can move freely, thereby eliminating the generation of a PID phenomenon. However, such sulfur-containing materials tend to yellow at high temperatures, which adversely affects the overall performance of the adhesive film.
Another prior document provides a method for preparing a PID resistant packaging adhesive film containing an inorganic ion scavenger: the method comprises the steps of binding and fixing metal ions in an electric field environment by adding zirconium phosphate into an adhesive film, and reducing the free movement capacity of the metal ions in the assembly, so that the PID effect problem of the photovoltaic assembly is effectively improved. However, the anti-PID performance of the adhesive film is not ideal due to the limited ion trapping capacity of zirconium phosphate. Meanwhile, excessive addition of zirconium phosphate also causes problems of increased cost and reduced transmittance.
Therefore, the packaging material with lower water vapor permeability is adopted, or the concentration and the mobility of sodium ions in the component are reduced, so that the PID phenomenon can be avoided. However, the existing method has high cost, and is not favorable for the current requirement of the photovoltaic industry on low cost.
Disclosure of Invention
The invention mainly aims to provide a composition for forming a PID (potential induced degradation) resistant packaging adhesive film, the PID resistant packaging adhesive film and a solar module, so as to solve the problem of higher cost of the conventional PID resistant packaging adhesive film.
In order to achieve the above object, according to one aspect of the present invention, there is provided a composition for forming a PID-resistant encapsulating adhesive film, the composition comprising, in parts by weight: 100 parts of matrix resin and 0.01-5 parts of ion exchanger, wherein the ion exchanger is selected from pyrophosphate and/or metal oxide.
Further, the composition comprises the following components in parts by weight: 100 parts of matrix resin and 0.1-1 part of ion exchanger.
Further, the ion exchanger comprises pyrophosphate and metal oxide, and the pyrophosphate accounts for 10-100 wt% of the ion exchanger.
Further, the pyrophosphate is selected from one or more of magnesium pyrophosphate, nickel pyrophosphate, zinc pyrophosphate, calcium pyrophosphate, iron pyrophosphate, aluminum pyrophosphate, barium pyrophosphate, chromium pyrophosphate, tin pyrophosphate, titanium pyrophosphate and zirconium pyrophosphate.
Further, the metal oxide is selected from antimony oxide and/or molybdenum oxide.
Furthermore, the composition also comprises an auxiliary agent, wherein the auxiliary agent is selected from one or more of a peroxide crosslinking agent, a phenolic antioxidant or phosphite antioxidant, a hindered amine light stabilizer, an ultraviolet light absorber and a tackifier.
Further, the composition comprises, by weight, 0.1-10 parts of peroxide crosslinking agent, 0.05-5 parts of phenol antioxidant or phosphite antioxidant, 0.01-1 part of hindered amine light stabilizer, 0.01-2 parts of ultraviolet light absorber and 0.01-3 parts of tackifier.
Further, the matrix resin is selected from one or more of ethylene-vinyl acetate copolymer, low density polyethylene, polypropylene, polybutylene, polyvinyl butyral, metallocene catalyzed polyethylene, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, and ethylene methyl methacrylate copolymer.
The application also provides a PID (potential induced degradation) resistant packaging adhesive film which is prepared from the composition serving as a raw material.
The application further provides a solar module, which comprises an encapsulation film, wherein the encapsulation film comprises the PID-resistant encapsulation adhesive film.
By applying the technical scheme of the invention, the content of metal ions in a system can be effectively reduced by adding the two types of ion exchangers into the packaging adhesive film, and the enrichment of the metal ions on the antireflection layer of the solar module is weakened or even eliminated, so that the PID resistance of the photovoltaic module is favorably improved; meanwhile, the two types of ion exchangers have larger ion exchange capacity, so that the PID resistance of the component can be maintained for a longer time. In addition, the ion exchanger is low in price, so that the preparation cost of the PID-resistant packaging adhesive film can be greatly reduced. On the basis, the PID-resistant packaging adhesive film prepared from the composition has the advantages of excellent PID resistance, long service life, low cost and the like.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
As described in the background art, the existing PID-resistant packaging adhesive film has a problem of high cost. In order to solve the above technical problems, the present application provides a composition for forming a PID-resistant encapsulating adhesive film, comprising, in parts by weight: 100 parts of matrix resin and 0.01-5 parts of ion exchanger, wherein the ion exchanger is selected from pyrophosphate and/or metal oxide.
The two types of ion exchangers can be prepared by adsorbing H on exchange groups+Exchange reaction with external metal cations, thereby realizing the function of adsorbing the metal cations and achieving the effect of reducing the concentration of the metal ions in the surrounding environment. And, owing to the increased content of phosphorus compared with phosphate, correspondingly exchangeable H in the exchanger+The number of (a) is increased accordingly, thereby increasing the ion exchange capacity of the ion exchanger.
The two types of ion exchangers are added into the packaging adhesive film, so that the content of metal ions in a system can be effectively reduced, and the enrichment of the metal ions on a antireflection layer of the solar module is weakened or even eliminated, and the PID resistance of the photovoltaic module is favorably improved; meanwhile, the two types of ion exchangers have larger ion exchange capacity, so that the PID resistance of the component can be maintained for a longer time. In addition, the ion exchanger is low in price, so that the preparation cost of the PID-resistant packaging adhesive film can be greatly reduced. On the basis, the PID-resistant packaging adhesive film prepared from the composition has the advantages of excellent PID resistance, long service life, low cost and the like.
In order to further improve the comprehensive performance of the anti-PID packaging adhesive film, in a preferred embodiment, the composition comprises the following components in parts by weight: 100 parts of matrix resin and 0.1-1 part of ion exchanger.
In a preferred embodiment, the pyrophosphate accounts for 10-100 wt% of the ion exchanger. Limiting the weight percentage of the pyrophosphate in the above range is beneficial to further improving the ion exchange capacity of the packaging adhesive film, thereby further improving the durability of the PID resistance of the packaging adhesive film.
In a preferred embodiment, the pyrophosphate salt includes, but is not limited to, one or more of magnesium pyrophosphate, nickel pyrophosphate, zinc pyrophosphate, calcium pyrophosphate, iron pyrophosphate, aluminum pyrophosphate, barium pyrophosphate, chromium pyrophosphate, tin pyrophosphate, titanium pyrophosphate, and zirconium pyrophosphate. Compared with other pyrophosphate, the addition of the pyrophosphate is beneficial to further improving the PID resistance of the prepared PID-resistant packaging adhesive film.
In a preferred embodiment, the metal oxide includes, but is not limited to, antimony oxide and/or molybdenum oxide. Compared with other metal oxides, the two metal oxides are added, so that the PID resistance of the PID-resistant packaging adhesive film prepared from the two metal oxides is further improved.
In order to further improve the overall performance of the encapsulating adhesive, in a preferred embodiment, the composition further comprises an auxiliary agent, which includes, but is not limited to, one or more of a peroxide-based crosslinking agent, a phenolic antioxidant or a phosphite antioxidant, a hindered amine-based light stabilizer, an ultraviolet light absorber and an adhesion promoter. More preferably, the composition further comprises 0.1-10 parts by weight of peroxide crosslinking agent, 0.05-5 parts by weight of phenol antioxidant or phosphite antioxidant, 0.01-1 part by weight of hindered amine light stabilizer, 0.01-2 parts by weight of ultraviolet absorber and 0.01-3 parts by weight of tackifier.
The addition of the peroxide crosslinking agent is beneficial to improving the crosslinking performance of the matrix resin, thereby being beneficial to improving the comprehensive performance of the anti-PID packaging adhesive film formed by the peroxide crosslinking agent. In a preferred embodiment, the peroxide-based crosslinking agent includes, but is not limited to, isopropyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5-bis (t-butylperoxy) hexane, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 2-ethylhexyl t-butylperoxycarbonate, 2, 5-dimethyl-2, 5-di (t-butylperoxy) hexane, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, 1-bis (t-amylperoxy) cyclohexane, 1-bis (t-butylperoxy) cyclohexane, 2-bis (t-butylperoxy) butane, one or more of tert-amyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (benzoylperoxy) -hexane, tert-amyl peroxy carbonate and tert-butyl peroxy-3, 3, 5-trimethylhexanoate.
The addition of the phenol antioxidant or phosphite antioxidant is favorable for improving the stability of the anti-PID packaging adhesive film formed by the antioxidant, thereby prolonging the service life. In a preferred embodiment, the above-mentioned phenolic antioxidant or phosphite antioxidant includes, but is not limited to, 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, 5-triazine-2, 4, 6- (1H,3H,5H) -trione, 2 '-methylene-bis- (4-ethyl-6-tert-butylphenol), 2' -methylene-bis- (4-methyl-6-tert-butylphenol), n-octadecyl beta- (4-hydroxy-3, 5-di-tert-butylphenyl) propionate, tris (2, 4-di-tert-butylphenyl) phosphite, bis (2, 4-dicumylphenyl) pentaerythritol diphosphite, di (2, 4-dicumylphenyl) pentaerythritol diphosphite, one or more of distearyl pentaerythritol diphosphite and tris (nonylphenyl) phosphite. Compared with other antioxidants, the antioxidant has more excellent antioxidant performance, so that the stability of the formed PID-resistant packaging adhesive film is further improved, and the service life is further prolonged.
The addition of the hindered amine light stabilizer is beneficial to improving the aging resistance and the weather resistance of the PID (potential induced degradation) resistant packaging adhesive film formed by the composition. In a preferred embodiment, the above-mentioned hindered amine light stabilizer includes, but is not limited to, hexadecyl 3, 5-di-t-butyl-4-hydroxy-benzoate, tris (1, 2,2, 6, 6-pentamethyl-4-piperidyl) phosphite, bis-2, 2, 6, 6-tetramethylpiperidyl sebacate, bis-1-decyloxy-2, 2, 6, 6-tetramethylpiperidin-4-ol sebacate, a polymer of succinic acid and 4-hydroxy-2, 2, 6, 6-tetramethyl-1-piperidinol, N' -bis (2, 2, 6, 6-tetramethyl-4-piperidyl) -1, 6-hexanediamine and 2, 4-dichloro-6- (1, 1, 3, 3-tetramethylbutyl) amino-1, 3, 5-triazine, N' -bis (2, 2, 6, 6-pentamethyl-4-piperidinyl) -1, 6-hexanediamine, and morpholine-2, 4, 6-trichloro-1, 3, 5-triazine. Compared with other hindered amine light stabilizers, the hindered amine light stabilizers are selected to further improve the performance stability, light transmittance and the like of the formed PID-resistant packaging adhesive film.
The addition of the ultraviolet light absorbent can adjust the color of the PID-resistant packaging adhesive film formed by the composition, thereby being beneficial to improving the light transmittance. In a preferred embodiment, the above ultraviolet light absorbers include, but are not limited to, 2 '- (1, 4-phenylene) bis (4H-3, 1-benzoxazin-4-one), 2' -bis (3, 1-benzoxazin-4-one), 2 '-tetramethylenebis (3, 1-benzoxazin-4-one), 2' -decamethylenebis (3, 1-benzoxazin-4-one), 2 '-p-phenylenebis (3, 1-benzoxazin-4-one), 2' -m-methylenebis (3, 1-benzoxazin-4-one), 1, 3, 5-tris (3, 1-benzoxazin-4-one-2-yl) benzene, 2, 4, 6-tris (3, 1-benzoxazin-4-one-2-yl) naphthalene, 2, 8-dimethyl-4H, 6H-benzo (1, 2-d; 5, 4-d ') bis (1, 3) -oxazine-4, 6-dione, 6 ', 6-sulfonylbis (2-methyl-4H, 3, 1-benzoxazin-4-one), 6, 7 ' -methylenebis (2-methyl-4H, 3, 1-benzoxazin-4-one), 2-hydroxy-4-methoxybenzophenone, 2, 4-dihydroxybenzophenone, 2-hydroxy-4-n-octyloxybenzophenone, 2-hydroxy-4-methoxy-2 ' -carboxybenzophenone, 2, 8-dimethyl-4H, 6H-benzo (1, 2-d; 5, 4-d ') bis (1, 3) -oxazine-4, 2,2 '-dihydroxy-4, 4' -dimethoxybenzophenone, 2-hydroxy-5-chlorobenzophenone, bis- (2-methoxy-4-hydroxy-5-benzoylphenyl) methane, 2- (2 '-hydroxyphenyl) benzotriazole, 2- (2' -hydroxy-5-methylphenyl) benzotriazole, butyl 2- (2 '-hydroxy-5-methylphenyl) -5-carboxylate benzotriazole, 2- (2' -hydroxy-5 '-methylphenyl) -5, 6-dichlorobenzotriazole, 2- (2' -hydroxy-5-methylphenyl) -5-ethylsulfonic acid benzotriazole, bis (2-methoxy-4-hydroxy-5-benzoylphenyl) methyl ether, bis (2-hydroxy-5-methylphenyl) methyl ether, bis (2-hydroxy-5-benzoylphenyl) methyl ether, bis (2-hydroxy, 2- (2 '-hydroxy-5' -tert-butylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-5' -tert-butylphenyl) benzotriazole, 2- (2 '-hydroxy-5' -aminophenyl) benzotriazole, 2- (2 '-hydroxy-3', -5 '-dimethylphenyl) benzotriazole, 2- (2' -methyl-4 '-hydroxyphenyl) benzotriazole, ethyl 2- (2' -hydroxy-5-carboxyphenyl) benzotriazole, 2- (2 '-hydroxy-3' methyl-5 '-tert-butylphenyl) benzotriazole, 2- (2' -octadecyloxy-3 ', 5' -dimethylphenyl) -5-methylbenzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-3 '-tert-butyl-5' -methylphenyl) -5-chlorobenzotriazole, 2- (2 '-hydroxy-5' -methoxyphenyl) benzotriazole, 2- (2 '-hydroxy-3', 5 '-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2' -hydroxy-5 '-cyclohexylphenyl) benzotriazole, 2- (2' -hydroxy-4 ', 5' -dimethylphenyl) -5-carboxylic acid benzotriazole butyl ester, 2- (2 '-hydroxy-3', 5 ' -dichlorophenyl) benzotriazole, 2- (2 ' -hydroxy-4 ', 5 ' -dichlorophenyl) benzotriazole, 2- (2 ' -hydroxy-3 ', 5 ' -dimethylphenyl) -5-ethylsulfonylbenzotriazole, 2- (2 ' -hydroxy-4 ' -octyloxyphenyl) benzotriazole, 2- (2 '-hydroxy-5' -methoxyphenyl) -5-methylbenzotriazole, 2- (2 '-hydroxy-5' -methylphenyl) -5-carboxylate benzotriazole, 2- (2 '-hydroxy-5' -tert-octylphenyl) -5-benzotriazole, or 2- (2 '-acetoxy-5' -methylphenyl) benzotriazole.
The addition of the tackifier is beneficial to improving the bonding property of the packaging adhesive film, so that the sealing property between the protective glass and the silicon wafer is enhanced. In a preferred embodiment, the adhesion promoter includes, but is not limited to, one or more of gamma-aminopropyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, gamma-glycidoxypropyltrimethylsilane, 3-aminopropyltrimethylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, octyltrimethoxysilane, and octyltriethoxysilane. Compared with other tackifiers, the performance stability of the anti-PID packaging adhesive film formed by the composition is further improved by selecting the above components.
In a preferred embodiment, the matrix resin includes, but is not limited to, one or more of ethylene vinyl acetate, low density polyethylene, polypropylene, polybutylene, polyvinyl butyral, metallocene catalyzed polyethylene, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, ethylene methyl methacrylate copolymer. Compared with other resins, the matrix resin is beneficial to further improving the uniformity and performance stability of the formed packaging adhesive film.
The packaging adhesive film can be prepared by adopting a method commonly used in the field. Another aspect of the present application also provides a method for preparing a preferred PID-resistant packaging adhesive film, which includes:
s1, stirring the optional peroxide cross-linking agent, the optional phenol or phosphite antioxidant, the optional hindered amine light stabilizer, the optional ultraviolet light absorber and the optional tackifier together in a water bath at 50-70 ℃ for 10-30 min to obtain a mixed assistant for later use;
s2, adding the matrix resin material into a mixer;
optionally, S3, adding the mixing aid obtained in the step S1 of 1/3-2/3 into a mixer, and stirring for 1-2 min; adding the rest of the mixing auxiliary agent into a mixer, and continuously stirring for 1-2 min;
s4, adding an ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture;
and S5, pouring the mixture obtained in the step S4 into an extruder, extruding at the temperature of 80-100 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the required PID-resistant packaging adhesive film material.
The application also provides a PID (potential induced degradation) resistant packaging adhesive film which is prepared from the composition serving as a raw material.
The pyrophosphate compound is added into the packaging adhesive film, so that the content of metal ions in the system can be effectively reduced, and the enrichment of the pyrophosphate compound in the anti-reflection layer of the cell can be weakened or even eliminated, thereby being beneficial to improving the PID resistance of the photovoltaic module; meanwhile, the pyrophosphate has larger ion exchange capacity, so that the PID resistance of the component can be maintained for a longer time. In addition, because the pyrophosphate is low in price, the preparation cost of the PID-resistant packaging adhesive film can be greatly reduced. On the basis, the PID-resistant packaging adhesive film prepared from the composition has the advantages of excellent PID resistance, long service life, low cost and the like.
Still another aspect of the present application provides a solar module, which includes an encapsulation film, which includes the above-mentioned PID-resistant encapsulation adhesive film.
When the packaging adhesive film prepared from the composition serving as a raw material is applied to a solar module (especially a double-sided solar cell), the probability of PID (potential induced degradation) phenomenon can be effectively reduced. Meanwhile, the preparation cost of the packaging adhesive film can be greatly reduced.
The present application is described in further detail below with reference to specific examples, which should not be construed as limiting the scope of the invention as claimed.
Example 1
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33%), 0.1 part of titanium pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite ester compound (weight ratio is 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio is 1:2), and 3 parts of tackifier Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-1.
Example 2
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33%), 0.1 part of stannic pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite ester compound (weight ratio is 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio is 1:2), and 3 parts of tackifier Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-2.
Example 3
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont, U.S. A., 33 percent of VA by weight), 0.1 part of aluminum pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (weight ratio is 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight) Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-3.
Example 4
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont, U.S. A., 33 percent of VA by weight), 0.1 part of zirconium pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (weight ratio 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 1:2) Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-4.
Example 5
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont, U.S. A., 33 percent of VA by weight), 0.5 part of zirconium pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (weight ratio 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 1:2) Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-5.
Example 6
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33%), 1 part of zirconium pyrophosphate, 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (weight ratio is 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight percentage content of tackifier) Ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-6.
Example 7
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 portions of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33 percent), 0.2 portion of mixture of zirconium pyrophosphate and antimony oxide (the weight ratio is 1:1), 0.2 portion of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 portion of antioxidant 1, 3, 5-tri (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tri (2, 4-di-tert-butylphenyl) phosphite ester compound (the weight ratio is 1:2), 0.2 portion of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.1 portion of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-7.
Example 8
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 portions of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33 percent), 0.1 portion of metal oxide (molybdenum oxide), 0.2 portion of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidyl sebacate, 0.2 portion of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite compound (the weight ratio is 1:2), 0.2 portion of cross-linking agent tert-butyl peroxyisopropyl carbonate, 0.1 portion of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-8.
Example 9
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 portions of ethylene-vinyl acetate copolymer (DuPont company, U.S. A, the weight percentage content of VA is 33 percent), 0.2 portion of mixture of zirconium pyrophosphate and antimony oxide (the weight ratio is 5:95), 0.2 portion of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 portion of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite compound (the weight ratio is 1:2), 0.2 portion of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 portion of ultraviolet absorbent 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-9.
Example 10
The anti-PID photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont, U.S. A., 33% of VA by weight), 3 parts of a mixture of zirconium pyrophosphate and antimony oxide (5: 95 by weight), 0.2 part of a hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of an antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (1: 2 by weight), 0.2 part of a crosslinking agent of tert-butyl peroxyisopropyl carbonate, 0.1 part of an ultraviolet absorber of 2, 2-tetramethylenebis (1, 3-benzoxazin-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio 3: 1).
The anti-PID photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, continuously stirring for 1-2 min, finally adding the ion exchanger into the mixer, and stirring for 3-5 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the PID-resistant packaging material R-10.
Comparative example 1
The photovoltaic packaging material comprises the following main raw materials in parts by weight: 100 parts of ethylene-vinyl acetate copolymer (DuPont, U.S. A., the weight percentage content of VA is 33%), 0.2 part of hindered amine light stabilizer bis-2, 2, 6, 6-tetramethylpiperidinol sebacate, 0.2 part of antioxidant 1, 3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) -1, 3, -triazine-2, 4, 6- (1H,3H,5H) -trione and tris (2, 4-di-tert-butylphenyl) phosphite complex (weight ratio is 1:2), 0.2 part of crosslinking agent tert-butyl peroxyisopropyl carbonate, 0.1 part of ultraviolet absorber 2, 2-tetramethylene bis (1, 3-benzoxazine-4-one), 3 parts of tackifier vinyltriethoxysilane and gamma-methacryloxypropyltrimethoxysilane (weight ratio is 3: 1).
The photovoltaic packaging material is prepared by the following method:
(1) the peroxide cross-linking agent, the phenol or phosphite antioxidant, the hindered amine light stabilizer, the ultraviolet light absorber and the tackifier in the formula amount are stirred together in a water bath at 60 ℃ for 20min to obtain a mixed assistant for later use.
(2) Adding a photovoltaic packaging base material in a formula amount into a mixer, adding the mixing aid obtained in the step (1) of 1/3-2/3 into the mixer, and stirring for 1-2 min; and adding the rest of the mixing auxiliary agent into a mixer, and continuously stirring for 1-2 min to obtain a mixture.
(3) And (3) pouring the mixture obtained in the step (2) into an extruder, extruding at the temperature of 90 ℃, and performing casting film forming, cooling, slitting and rolling to obtain the packaging material C-1.
The laminates made with the encapsulation materials of examples 1-10 and comparative example 1 were subjected to light transmittance, volume resistivity and PID tests. The thickness of the adhesive film of each example and each comparative example after lamination is 0.45nm, wherein the light transmittance is measured according to GB/T2410-2008, and the volume resistivity is measured according to GB/T1410-2006. The EVA packaging adhesive film obtained in the embodiment and the comparative example, the same cell piece and the same glass are processed into the photovoltaic module by the same process. The PID test of the photovoltaic module is carried out according to IECTS 2804-1: 2015, wherein the test conditions are tightened to 85 ℃, 85% RH, a negative 1500V constant direct current voltage is applied, 192h later, the power attenuation before and after the PID test of the photovoltaic module is measured, and the test results are shown in Table 1.
TABLE 1
Figure BDA0002279641660000121
As can be seen from the comparison of the performance test data of the examples and comparative examples described in Table 1 above:
according to the solar cell packaging material provided by the scheme of the invention, the ion exchanger is added, so that the content of metal ions can be effectively reduced, and the obtained EVA adhesive film has higher volume resistance (10%) while high light transmittance (up to more than 90%) is maintained16Ω · cm). The test assembly power decay was below 5% for a long period of time.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A composition for forming a PID resistant encapsulating adhesive film, wherein the composition comprises, in parts by weight: 100 parts of matrix resin and 0.01-5 parts of ion exchanger, wherein the ion exchanger is selected from pyrophosphate and/or metal oxide.
2. The composition of claim 1, wherein the composition comprises, in parts by weight: 100 parts of the matrix resin and 0.1-1 part of the ion exchanger.
3. The composition as claimed in claim 1 or 2, wherein the ion exchanger comprises the pyrophosphate and the metal oxide, and the pyrophosphate accounts for 10-100 wt% of the ion exchanger.
4. The composition of claim 1 or 2, wherein the pyrophosphate salt is selected from one or more of magnesium pyrophosphate, nickel pyrophosphate, zinc pyrophosphate, calcium pyrophosphate, iron pyrophosphate, aluminum pyrophosphate, barium pyrophosphate, chromium pyrophosphate, tin pyrophosphate, titanium pyrophosphate, and zirconium pyrophosphate.
5. Composition according to claim 1 or 2, characterized in that the metal oxide is chosen from antimony oxide and/or molybdenum oxide.
6. The composition according to any one of claims 1 to 5, further comprising an auxiliary agent selected from one or more of a peroxide-based crosslinking agent, a phenolic antioxidant or a phosphite antioxidant, a hindered amine-based light stabilizer, an ultraviolet light absorber and an adhesion promoter.
7. The composition of claim 6, further comprising 0.1 to 10 parts by weight of the peroxide crosslinking agent, 0.05 to 5 parts by weight of the phenolic antioxidant or the phosphite antioxidant, 0.01 to 1 part by weight of the hindered amine light stabilizer, 0.01 to 2 parts by weight of the ultraviolet light absorber, and 0.01 to 3 parts by weight of the tackifier.
8. The composition of claim 6, wherein the matrix resin is selected from one or more of ethylene vinyl acetate, low density polyethylene, polypropylene, polybutylene, polyvinyl butyral, metallocene catalyzed polyethylene, ethylene octene copolymer, ethylene pentene copolymer, ethylene methyl acrylate copolymer, and ethylene methyl methacrylate copolymer.
9. An anti-PID packaging adhesive film, which is prepared from the composition of any one of claims 1 to 8.
10. A solar module comprising an encapsulant film comprising the PID resistant encapsulant film of claim 9.
CN201911136135.XA 2019-11-19 2019-11-19 Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module Pending CN112898920A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103254802A (en) * 2013-03-19 2013-08-21 江苏鹿山光伏科技有限公司 EVA packaging adhesive film for resisting potential-induced degradation of photovoltaic module
WO2015107905A1 (en) * 2014-01-20 2015-07-23 東洋インキＳｃホールディングス株式会社 Resin composition for solar cell sealing materials, master batch for solar cell sealing materials, and solar cell sealing material
CN107841256A (en) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 Anti- PID types photovoltaic EVA packaging adhesive films and preparation method thereof
CN108034372A (en) * 2017-12-27 2018-05-15 杭州福斯特应用材料股份有限公司 A kind of photovoltaic encapsulation material EVA adhesive film of resisting potential induced degradation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103254802A (en) * 2013-03-19 2013-08-21 江苏鹿山光伏科技有限公司 EVA packaging adhesive film for resisting potential-induced degradation of photovoltaic module
WO2015107905A1 (en) * 2014-01-20 2015-07-23 東洋インキＳｃホールディングス株式会社 Resin composition for solar cell sealing materials, master batch for solar cell sealing materials, and solar cell sealing material
CN107841256A (en) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 Anti- PID types photovoltaic EVA packaging adhesive films and preparation method thereof
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