CN112888289B - Microwave module packaging structure and microwave module packaging method - Google Patents
Microwave module packaging structure and microwave module packaging method Download PDFInfo
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- CN112888289B CN112888289B CN202110066819.8A CN202110066819A CN112888289B CN 112888289 B CN112888289 B CN 112888289B CN 202110066819 A CN202110066819 A CN 202110066819A CN 112888289 B CN112888289 B CN 112888289B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0056—Casings specially adapted for microwave applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention is suitable for the technical field of electronic packaging, and provides a microwave module packaging structure, a microwave module packaging method and application, wherein the microwave module packaging structure comprises: the utility model provides a microwave module packaging structure, includes base plate and shield cover, and the base plate setting still includes in one side of shield cover: a communication unit disposed at one side of the substrate; the connecting assembly is arranged between the substrate and the shielding cover; the connecting assembly comprises a welding leg and a sealing element, the welding leg is arranged on one side of the shielding cover close to the substrate, and the sealing element is arranged at the joint of the substrate and the shielding cover; embedding a communication unit into the substrate to receive and process microwave signals, welding the substrate and the shielding case through welding pins, and coating and sealing the joint of the substrate and the shielding case through a sealing piece; the structure is convenient to operate, the welding method is simple and convenient, welding and packaging can be carried out by using a common reflow furnace or a hot plate, the operation difficulty is reduced, and the packaging cost is reduced.
Description
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to a microwave module packaging structure and a microwave module packaging method.
Background
Phased Array Radars (PAR), i.e., phase-controlled electronically scanned Array radars, utilize a large number of individually controlled small antenna elements to arrange into an antenna Array, each antenna element is controlled by an independent phase-shifting switch, and different phase beams can be synthesized by controlling the phase emitted by each antenna element;
the T/R assembly and other microwave modules of the important components of the phased array radar system generally have the requirements of multiple functions, light weight, small space and the like; in order to meet the requirements, aluminum-silicon alloy is generally adopted as a box body material in the industry at present, and laser is used for sealing and welding; the box body is mechanically connected with an external whole machine through a complex structure and is electrically connected with the external whole machine through a low-frequency connector and/or a radio-frequency connector;
the sealing method in the packaging mode is complex, the price of packaging equipment is expensive, and the effects of low cost and high energy efficiency cannot be achieved.
Disclosure of Invention
Embodiments of the present invention provide a microwave module packaging structure and a microwave module packaging method, which are intended to solve the problems in the background art.
The embodiment of the present invention is implemented as follows, a microwave module package structure, including a substrate and a shielding member, where the substrate is disposed on one side of the shielding member, and the microwave module package structure further includes:
the communication assembly is arranged on one side of the substrate and is used for controlling and processing transmission of microwave signals;
a connecting assembly disposed between the substrate and the shield, the connecting assembly for connecting and encapsulating the substrate and the shield;
the connecting assembly comprises a welding leg and a sealing element, the welding leg is arranged on one side of the base plate close to the shielding element, the sealing element is arranged on the base plate and at the joint of the shielding element, the welding leg is used for welding the base plate with the shielding element, and the sealing element is used for sealing the base plate with the shielding element.
Another object of an embodiment of the present invention is to provide a microwave module packaging method, which includes the following steps: embedding the communication assembly into the substrate, soldering the substrate and the shield member through the solder tail, and coating at a joint of the substrate and the shield member through the sealing member.
Another object of the embodiments of the present invention is to provide an application of the above microwave module packaging method in a phased array radar system.
Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following technical effects:
according to the microwave module packaging structure provided by the embodiment of the invention, the communication assembly is embedded into the substrate to integrate a passive radio frequency circuit, the substrate and the shielding piece are welded through the welding feet, and then the sealing piece is coated at the joint of the substrate and the shielding piece; the structure is convenient and fast to operate, the welding method is simple and convenient, most of welding equipment can be applied to welding and packaging, the operation difficulty is reduced, and the packaging cost is reduced.
Drawings
Fig. 1 is a three-dimensional structural view of a microwave module packaging structure according to an embodiment of the present invention;
FIG. 2 is a schematic view of a connection mechanism of the communication assembly of FIG. 1;
FIG. 3 is a schematic view of the structure of the substrate shown in FIG. 1;
fig. 4 is a perspective view of the shield of fig. 1.
In the drawings: 1-microwave layer; 2-a digital layer; 3-a connector; 4-a pad; 5-welding feet; 6-a substrate; 7-a shield; 8-an isolation layer; 9-interconnecting holes; 10-a power supply layer; 11-sealing member.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the invention. In order to make the technical solution of the present invention more clear, the process steps and device structures well known in the art are omitted here. It should be understood that like reference numerals refer to like elements throughout. Further, various elements and regions in the drawings are schematically illustrated. Accordingly, the concepts of the present invention are not limited to the relative sizes or spacings shown in the figures.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1, a structure diagram of a microwave module package structure provided for an embodiment of the present invention includes:
a microwave module package structure, comprising a substrate 6 and a shield 7, the substrate 6 being disposed on one side of the shield 7, the microwave module package structure further comprising:
the communication assembly is arranged on one side of the substrate 6 and is used for controlling transmission of microwave signals;
a connecting member provided between the substrate 6 and the shield 7, the connecting member being for connecting and encapsulating the substrate 6 and the shield 7;
the connecting assembly comprises a welding leg 5 and a sealing element 11, wherein the welding leg 5 is arranged on one side of the shielding element 7 close to the substrate 6, the sealing element 11 is arranged at the joint of the substrate 6 and the shielding element 7, the welding leg 5 is used for welding the substrate 6 with the shielding element 7, and the sealing element 11 is used for sealing the substrate 6 with the shielding element 7;
the substrate 6, the material of the substrate 6 can adopt a printed circuit board, a ceramic substrate, etc., and herein, a high-frequency hybrid laminated printed circuit board is preferably adopted, so as to divide different circuits on different circuit layers, and the different circuit layers are isolated by the isolating layer 8, and the circuit layers of different types are interconnected in a through hole manner through the interconnecting hole 9;
a plurality of solder fillets 5 are arranged on the shielding piece 7, so that the substrate 6 and the shielding piece 7 are firmly welded;
the sealing element 11 is preferably a sealant manufactured by electronics technologies ltd of guangzhou city union, model number EB-7408, and may be selected according to requirements, the coating device preferably used in the sealing element 11 is a dispenser, and may also be selected according to requirements, and the sealing element 11 is used for preventing corrosion caused by contact between the solder, the conductive adhesive, and the like inside the substrate 6 and the shielding element 7 with the atmospheric environment;
the substrate 6 and the shielding member 7 are connected by welding, the welding equipment can adopt a reflow oven, a hot plate and the like, the reflow oven is preferably adopted, and the local welding technology is adopted in the welding mode, so that the cost of the sealing equipment is reduced;
in the embodiment of the present invention, the communication module is embedded in the substrate 6 to integrate a passive radio frequency circuit, the substrate 6 and the shielding element 7 are soldered by the solder foot 5, and then the sealing element 11 is coated at the joint of the substrate 6 and the shielding element 7; the structure is convenient to operate, the welding method is simple and convenient, most welding equipment can be applied to welding and packaging, the operation difficulty is reduced, and the packaging cost is reduced.
As shown in fig. 2, as a preferred embodiment of the present invention, the communication assembly includes a control mechanism and a communication mechanism, the control mechanism is disposed on one side of the substrate 6, the communication mechanism is disposed inside the control mechanism, the control mechanism is configured to receive and process a microwave signal, and the communication mechanism is configured to prevent interference of a signal inside the control mechanism and perform transmission of the signal inside the control mechanism.
As shown in fig. 2, as another preferred embodiment of the present invention, the control mechanism includes a microwave layer 1, a digital layer 2 and a power supply layer 10, the microwave layer 1 is disposed on one side of the substrate 6, the digital layer 2 is disposed on one side of the substrate 6 close to the microwave layer 1, the power supply layer 10 is disposed on one side of the digital layer 2, the microwave layer 1, the digital layer 2 and the power supply layer 10 are connected through the communication mechanism, the microwave layer 1 is configured to receive and process microwave signals, the digital layer 2 is configured to receive digital control signals, and the power supply layer 10 is configured to provide power;
the digital layer 2 is used for receiving a digital control signal, transmitting the control signal to the microwave layer 1 and issuing a control command to the microwave layer 1;
the microwave layer 1 is used for receiving microwave signals and processing the received microwave signals through the control signals of the digital layer 2;
and the power supply layer 10 is connected with the digital layer 2, and the power supply layer 10 is used for providing power loss required by the system by connecting with an external power supply digital circuit.
As shown in fig. 2, as another preferred embodiment of the present invention, the communication mechanism includes an isolation layer 8 and an interconnection hole 9, the isolation layer 8 is disposed between the microwave layer 1, the digital layer 2 and the power supply layer 10, the interconnection hole 9 is disposed on the isolation layer 8, the isolation layer 8 is used for isolating the microwave layer 1, the digital layer 2 and the power supply layer 10, and the interconnection hole 9 is used for transmitting signals in the control mechanism;
the isolation layer 8 is used for isolating the multilayer boards, and a ground isolation method is adopted to isolate the microwave layer 1, the digital layer 2 and the power supply layer;
and the interconnection holes 9 are used for interconnecting different types of circuit layers in a through hole mode, and the interconnection holes 9 are used for interconnecting different types of circuit layers in a through hole mode.
As shown in fig. 3, as another preferred embodiment of the present invention, the connecting component includes a pad 4 and a connecting board 3, the pad 4 is disposed on one side of the substrate 6, the connecting board 3 is disposed on one side of the substrate 6 close to the pad 4, the pad 4 is used for connecting the substrate 6 with electricity, and the connecting board 3 is used for grounding and heat conduction of the substrate 6.
The material of the bonding pad 4 is conductive material, the bonding pad 4 is interconnected with an external circuit by adopting a surface mounting process, the bonding pad 4 adopts a shape method similar to that in a QFN (quad Flat No lead) chip packaging method, and the bonding pad 4 is provided with a plurality of groups of bonding pads which are placed at the edge of the bottom surface of the substrate 6;
and the connecting plate 3 is arranged in the middle of the bonding pad 4 and is used for grounding and heat conduction of the microwave module so as to prevent certain damage caused by short circuit and overheating of a circuit in the microwave module.
As shown in fig. 1, as another preferred embodiment of the present invention, a heat dissipation member and a control member are further disposed on the base plate 6;
the heat dissipation member is preferably a heat sink and can be selected according to requirements, the heat dissipation member is a micro heat dissipation member and is used for cooling an electronic chip, and the heat dissipation member and the substrate 6 are assembled in a welding mode and can be selected according to requirements;
the control piece comprises a chip and a component, the chip is used for controlling and processing microwave signals, the component is used for adjusting circuit signal connection in the substrate 6, the chip is bonded with the substrate 6 through conductive adhesive, and the component is assembled with the substrate 6 through a lead bonding mode or can be selected according to requirements.
As shown in fig. 1, as another preferred embodiment of the present invention, the shielding element 7 is made of a metal or alloy material that can be formed by stamping;
the shielding member 7 is made of a metal sheet which is easy to punch and weld, the cost of the material is greatly reduced compared with aluminum-silicon alloy and the punching and forming processing of the material compared with the processing and surface treatment of an aluminum-silicon alloy machine, and the material can be made of foreign white copper, galvanized iron and the like and can be selected according to requirements.
As shown in fig. 1, as another preferred embodiment of the present invention, a preformed soldering lug is arranged on the soldering foot 5;
the pre-formed solder lug is preferably a pre-flux solder lug, and may be selected according to requirements, and the shielding element 7 and the substrate 6 are locally soldered by the pre-formed solder lug.
As shown in fig. 1 to 4, as another preferred embodiment of the present invention, there is provided a microwave module packaging method, including the above microwave module packaging structure, the microwave module packaging method further including: embedding the communication assembly in the substrate 6, soldering the substrate 6 and the shield 7 by the solder leg 5, and coating at the joint of the substrate 6 and the shield 7 by the sealing member 11;
in this embodiment, the microwave module packaging method includes the following steps:
step 1: assembling the heat sink and the control piece with the substrate 6 by welding, bonding with conductive adhesive and wire bonding;
step 2: assembling the communication assembly with the substrate 6;
and step 3: placing the pre-formed soldering lug on the soldering foot 5, and soldering the substrate 6 and the shielding member 7 by local soldering through the soldering foot 5;
and 4, step 4: interconnecting the substrate 6 and the shielding piece 7 with an external circuit by adopting a mounting process;
and 5: the joint between the substrate 6 and the shield 7 is coated by the seal 11.
In another embodiment of the present invention, a specific embodiment is provided:
in a modern radar such as a phased array radar system, a T/R assembly and other microwave modules can occupy more than 2/3 of the cost of the whole radar, a microwave module packaging method is reasonably designed, and the reduction of the packaging cost is an important aspect of microwave module design; by the microwave module packaging structure and the method, the packaging cost can be reduced in the aspects of packaging materials, sealing and welding equipment and assembling methods.
The embodiment of the invention provides a microwave module packaging structure, and a microwave module packaging method based on the microwave module packaging structure, the communication assembly is embedded into the substrate 6 to integrate a passive radio frequency circuit, the substrate 6 and the shielding piece 7 are welded through the welding foot 5, and then the sealing piece 11 is coated at the joint of the substrate 6 and the shielding piece 7; the structure is convenient to operate, the welding method is simple and convenient, most welding equipment can be applied to welding and packaging, the operation difficulty is reduced, and the packaging cost is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
In addition, the technical solutions of the present application are not limited to the above-described embodiments, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined, so that other embodiments that can be understood by those skilled in the art may be formed.
Claims (8)
1. The utility model provides a microwave module packaging structure, includes base plate and shielding piece, the base plate sets up one side of shielding piece, its characterized in that, microwave module packaging structure still includes:
the communication assembly is arranged on one side of the substrate and is used for controlling and processing transmission of microwave signals;
a connection assembly disposed between the substrate and the shield, the connection assembly for connecting the substrate and the shield in a package;
the connecting assembly comprises a welding leg and a sealing element, the welding leg is arranged on one side, close to the base plate, of the shielding element, the sealing element is arranged at the joint of the base plate and the shielding element, the welding leg is used for welding the base plate and the shielding element, and the sealing element is used for sealing the base plate and the shielding element;
the connecting assembly comprises a bonding pad and a connecting plate, the bonding pad is arranged on one side of the substrate, the connecting plate is arranged on one side of the substrate close to the bonding pad, the bonding pad is used for connecting the substrate with electricity, and the connecting plate is used for grounding and heat conduction of the substrate;
the bonding pad is interconnected with an external circuit by adopting a surface mounting process.
2. A microwave module package structure according to claim 1, wherein the communication assembly includes a control mechanism and a communication mechanism, the control mechanism is disposed at one side of the substrate, the communication mechanism is disposed inside the control mechanism, the control mechanism is configured to receive and process microwave signals, and the communication mechanism is configured to prevent interference of signals in the control mechanism and transmit signals in the control mechanism.
3. The microwave module package structure of claim 2, wherein the control mechanism comprises a microwave layer, a digital layer and a power supply layer, the microwave layer is disposed on one side of the substrate, the digital layer is disposed on one side of the substrate close to the microwave layer, the power supply layer is disposed on one side of the digital layer, the microwave layer, the digital layer and the power supply layer are connected through the communication mechanism, the microwave layer is configured to receive and process microwave signals, the digital layer is configured to receive digital control signals, and the power supply layer is configured to provide power.
4. A microwave module package structure according to claim 3, wherein the communication mechanism includes an isolation layer and an interconnection hole, the isolation layer is disposed between the microwave layer, the digital layer and the power supply layer, the interconnection hole is disposed on the isolation layer, the isolation layer is used for isolating the microwave layer, the digital layer and the power supply layer, and the interconnection hole is used for transmitting signals in the control mechanism.
5. A microwave module package structure according to claim 1, wherein a heat sink and a control member are further provided on the substrate.
6. A microwave module package structure according to claim 1, characterized in that the shielding member is made of a stampable metal or alloy material.
7. A microwave module package structure according to claim 1, characterized in that the solder foot is provided with a preformed solder tab.
8. A microwave module packaging method, characterized in that a microwave module packaging structure according to any one of claims 1-7 is adopted, the microwave module packaging method comprising the steps of: embedding the communication assembly into the substrate, welding the substrate and the shielding piece through the welding feet, and coating the joint of the substrate and the shielding piece through the sealing piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110066819.8A CN112888289B (en) | 2021-01-19 | 2021-01-19 | Microwave module packaging structure and microwave module packaging method |
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| CN202110066819.8A CN112888289B (en) | 2021-01-19 | 2021-01-19 | Microwave module packaging structure and microwave module packaging method |
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| CN112888289B true CN112888289B (en) | 2022-10-14 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109156091A (en) * | 2016-05-04 | 2019-01-04 | 三星电子株式会社 | Hollow shielding construction and its manufacturing method for different types of circuit element |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008124273A (en) * | 2006-11-13 | 2008-05-29 | Toyota Industries Corp | Shield structure substrate, and its manufacturing method |
| CN105870106A (en) * | 2016-06-01 | 2016-08-17 | 爱普科斯科技（无锡）有限公司 | Packaging structure of radio frequency filtration module and packaging technology of packaging structure |
| CN106100677B (en) * | 2016-06-22 | 2019-05-21 | 安徽天兵电子科技股份有限公司 | A kind of packaging method of the multidimensional power division network of TR component |
| KR102572559B1 (en) * | 2017-01-25 | 2023-09-01 | 삼성전자주식회사 | Emi shielding structure |
| CN111052367A (en) * | 2017-01-31 | 2020-04-21 | 天工方案公司 | Control of underfill for dual-sided ball grid array packages |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109156091A (en) * | 2016-05-04 | 2019-01-04 | 三星电子株式会社 | Hollow shielding construction and its manufacturing method for different types of circuit element |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
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