CN112885253B - Manufacturing process of flexible transparent LED display screen - Google Patents
Manufacturing process of flexible transparent LED display screen Download PDFInfo
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- CN112885253B CN112885253B CN202110396956.8A CN202110396956A CN112885253B CN 112885253 B CN112885253 B CN 112885253B CN 202110396956 A CN202110396956 A CN 202110396956A CN 112885253 B CN112885253 B CN 112885253B
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The invention discloses a manufacturing process of a flexible transparent LED display screen, which comprises the steps that conductive circuits are arranged on one side or two sides of a flexible transparent substrate, and at least part of the conductive circuits are arranged in a grid shape; a first low-reflection layer is arranged on the conductive circuit, and the reflectivity of the first low-reflection layer is less than 35%; a bonding pad is arranged on the first low reflection layer or the conductive circuit and is positioned in a lamp bead welding area of the LED display screen; and welding LED lamp beads on the bonding pads. The manufacturing process of the flexible transparent LED display screen can manufacture the flexible transparent LED display screen with low cost and high transparency.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to a manufacturing process of a flexible transparent LED display screen.
Background
Transparent LED displays are increasingly being used in the marketplace and various product forms have evolved. A transparent LED display technology in which LED lamps are arrayed on a transparent substrate is coming into existence. The LED display screen generally adopts transparent conductive materials to manufacture a power supply circuit and a signal transmission circuit of the LED lamp beads.
The transparent conductive material is usually ITO (indium tin oxide), but ITO is expensive and has low economic benefit. Instead, LED display screens using copper as a conductive material appear in the market, but the reflectance of copper wires is high, which is not beneficial to improving the transparency of the LED display screen.
Therefore, it is desirable to provide a low-cost and high-transparency process for manufacturing an LED display screen.
Disclosure of Invention
The embodiment of the application aims to provide a manufacturing process of the LED display screen with low cost and high transparency by providing a manufacturing process of the flexible transparent LED display screen.
In order to achieve the above objective, an embodiment of the present application provides a process for manufacturing a flexible transparent LED display screen, including:
arranging conductive circuits on one side or two sides of a flexible transparent substrate, wherein at least part of the conductive circuits are arranged in a grid shape;
a first low-reflection layer is arranged on the conductive circuit, and the reflectivity of the first low-reflection layer is less than 35%;
a bonding pad is arranged on the first low reflection layer or the conductive circuit, and the bonding pad is positioned in a lamp bead welding area of the LED display screen;
and welding LED lamp beads on the bonding pads.
In one embodiment, disposing a first low reflection layer on the conductive trace comprises:
and plating a first low-reflection layer on the conductive circuit by electroplating, electroless plating or vacuum plating.
In one embodiment, the plating of the first reflective layer on the conductive line by electroplating or electroless plating includes:
and adding an oxidant into the electroplating or electroless plating solution, and oxidizing the metal plating layer deposited on the conductive circuit by the oxidant to obtain the first low-reflection layer.
In one embodiment, the vacuum plating includes vacuum sputtering and vacuum evaporation;
coating a first reflecting layer on the conductive circuit in a vacuum plating mode, wherein the first reflecting layer comprises:
and adding a reaction gas in the carrier atmosphere of vacuum sputtering or vacuum evaporation, and oxidizing the plating metal on the conductive line by the reaction gas to obtain the first low-reflection layer.
In an embodiment, before the conductive lines are disposed on one side or two sides of the flexible transparent substrate, the manufacturing process of the flexible transparent LED display screen further includes:
arranging an adhesive layer on one side or two sides of the flexible transparent substrate, wherein the adhesive force between the adhesive layer and the flexible transparent substrate is more than 0.5kg/cm 2 The conductive circuit is arranged on the bonding layer.
In an embodiment, before the conductive lines are disposed on one side or two sides of the flexible transparent substrate, the manufacturing process of the flexible transparent LED display screen further includes:
and if the bonding layer meets the preset coloring condition, setting a second low-reflection layer on the bonding layer, wherein the reflectivity of the second low-reflection layer is lower than 35%, and the conductive circuit is arranged on the second low-reflection layer.
In one embodiment, whether the adhesive layer meets a preset coloring condition is determined according to at least one of the thickness, extinction coefficient and refractive index of the adhesive layer.
In one embodiment, the conductive circuit is disposed on one side or both sides of the flexible transparent substrate, including:
a conductive layer is arranged on the bonding layer;
etching the conductive layer into a conductive line conforming to a preset line design.
In one embodiment, the adhesive layer is coated on the flexible transparent substrate by electroplating, electroless plating or vacuum plating; and/or the number of the groups of groups,
and plating a conductive layer on the adhesive layer by electroplating, electroless plating or vacuum plating.
In an embodiment, after the LED beads are soldered on the bonding pads, the flexible transparent LED display screen manufacturing process further includes:
and packaging the LED lamp beads by using a surface-dryable optical resin with an acid value of less than 5 (KOH)/(mg/g) and a curing agent.
According to the manufacturing process of the flexible transparent LED display screen, the first low-reflection layer is arranged on the conductive circuit, and the reflectivity of the first low-reflection layer is controlled to be smaller than 35%, so that the reflectivity of the conductive circuit can be reduced through the first low-reflection layer, and then the lamp bead circuit with low reflectivity (namely, the lamp bead circuit with low visibility) can be obtained. Therefore, even if the conductive circuit of the transparent LED display screen is manufactured by adopting the conductive material (such as copper, nickel, iron and the like) with low cost and high reflectivity, the low visibility of the lamp bead circuit of the LED display screen can be ensured, and the LED display screen with low cost and high transparency can be manufactured. In addition, the conductive lines are at least partially arranged in a grid shape, so that the coverage area of the conductive lines is facilitated, and the transparency of the transparent LED display screen can be further improved. Therefore, compared with a common transparent LED display screen, the manufacturing process of the flexible transparent LED display screen can manufacture the flexible transparent LED display screen with low cost and high transparency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of an embodiment of a process for manufacturing a flexible transparent LED display screen according to the present invention;
FIG. 2 is a schematic flow chart of another embodiment of the flexible transparent LED display screen manufacturing process of the invention;
FIG. 3 is a schematic flow chart of a process for manufacturing a flexible transparent LED display screen according to another embodiment of the invention;
FIG. 4 is a schematic flow chart of a flexible transparent LED display screen manufacturing process according to another embodiment of the invention;
fig. 5 is a schematic flow chart of a manufacturing process of a flexible transparent LED display screen according to another embodiment of the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B meet at the same time. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1, fig. 1 is an embodiment of a flexible transparent LED display screen manufacturing process according to the present invention, specifically, the flexible transparent LED display screen manufacturing process includes the following steps:
s10, arranging conductive circuits on one side or two sides of the flexible transparent substrate, wherein at least part of the conductive circuits are arranged in a grid shape.
The flexible transparent substrate can be glass or transparent polymer substrate. In particular, glass substrates include, but are not limited to, soda-silica glass, soda-lime-silica glass, potash-silica glass, aluminosilicate glass. Transparent polymeric substrates include, but are not limited to, PET (English name: polyethylene terephthalate, chinese name: polyethylene terephthalate), PMMA (English name: polymethyl methacrylate, chinese name: polymethyl methacrylate), transparent PI (English name: polyimide), PC (Chinese name: polycarbonate, english name: polycarbonate). The substrate is made of a material with flexibility and transparency, so that the transparency of the LED display screen is improved, and the LED display screen can be bent freely.
The conductive circuit is arranged on one side or two sides of the flexible transparent substrate, which means that the conductive circuit can be arranged on one side of the flexible transparent substrate, and the conductive circuit can be arranged on two sides of the flexible transparent substrate. Wherein, when the conductive circuit is arranged on one side of the flexible transparent substrate, only one side of the flexible transparent LED display screen can be used for displaying pictures; and when the conductive lines are arranged on the two sides of the flexible transparent substrate, the two sides of the flexible transparent LED display screen can be used for displaying pictures. Specifically, according to the actual requirement of the product, the conductive circuit can be selectively arranged on one side or two sides of the flexible transparent substrate.
Specifically, the conductive circuit comprises an electrode wire and a signal wire, wherein the electrode wire is used for supplying power to the LED lamp beads and comprises an anode electrode wire and a cathode electrode wire; and the signal wire is used for transmitting control signals between the LED lamp beads and the control chip (module). In this embodiment, the positive electrode line and the negative electrode line are all arranged in a grid shape (i.e., the electrode lines are arranged in a grid shape), and it can be understood that the electrode lines are arranged in a grid shape, which is favorable for improving the light transmittance of the lamp bead line, and further is favorable for improving the transparency of the flexible transparent LED display screen. In addition, the electrode wires arranged in a grid shape are beneficial to improving the heat dissipation capacity of the electrode wires so as to ensure the stability of power supply of the electrode wires.
It should be noted that, when the conductive lines are disposed on both sides of the flexible transparent substrate, the projections of the conductive lines on both sides of the flexible transparent substrate on the flexible transparent substrate overlap. That is, the conductive lines on both sides of the flexible transparent substrate correspond to each other. By the arrangement, the light transmission areas (wireless road coverage areas) on the two sides of the flexible transparent substrate can be kept consistent, so that light can penetrate through the LED display screen, and the transparency of the flexible transparent LED display screen can be effectively improved. And the design of the conductive lines with the same two sides is also beneficial to reducing the production cost of the flexible transparent LED display screen.
S20, arranging a first low-reflection layer on the conductive circuit, wherein the reflectivity of the first low-reflection layer is less than 35%.
After the first low reflection layer is arranged on the conductive line, the first low reflection layer can be matched with the conductive line to form a lamp bead line of the LED display screen.
The reflectivity is understood to be the reflectivity, and the reflectivity of the first low reflective layer is less than 35%, i.e. the reflectivity of the first low reflective layer is less than 35%. It is worth noting that the higher the reflectivity of the object surface, the higher the visibility of the object at that time, whereas the lower the reflectivity of the object surface, the lower the visibility of the object. Generally, when the reflectance is higher than 35%, the object has a certain visibility under light. Then, the first low reflection layer with the reflectivity lower than 35% is covered on the conductive circuit, so that the reflectivity of the conductive circuit can be reduced through the first low reflection layer, and then the lamp bead circuit with low reflectivity (namely, the lamp bead circuit with low visibility) can be obtained. Therefore, even if the conductive circuit of the transparent LED display screen is manufactured by adopting the conductive material (such as copper, nickel, iron and the like) with low cost and high reflectivity, the low visibility of the lamp bead circuit can be ensured, and the LED display screen with low cost and high transparency can be manufactured.
Specifically, after the conductive circuit is arranged on the flexible transparent substrate, a first low-reflection layer can be further arranged on the conductive circuit so as to reduce the reflectivity of the lamp bead circuit of the LED display screen.
And S30, arranging a bonding pad on the first low reflection layer or the conductive circuit, wherein the bonding pad is positioned in a lamp bead bonding area of the LED display screen.
The bead welding areas are areas for welding the LED beads on the bead lines of the LED display screen, a plurality of bead welding areas are usually arranged on the bead lines, and a bonding pad is arranged in each bead welding area, and each of the positive electrode line, the negative electrode line and each of the signal lines.
Specifically, if the first low reflection layer is not covered at the pad position of the conductive line in step S20, the pad may be directly disposed on the conductive line, and if the first low reflection layer is covered at the pad position of the conductive line in step S20, the pad may be directly disposed on the first low reflection layer.
Illustratively, the material of the bond pad is typically tin.
S40, welding LED lamp beads on the bonding pads.
Specifically, the LED lamp beads are provided with a plurality of welding pins, the welding pins are in one-to-one correspondence with all the welding pads in the lamp bead welding area, and the LED lamp beads are welded on the welding pads through the welding pins.
It can be appreciated that according to the manufacturing process of the flexible transparent LED display screen, the first low-reflection layer is arranged on the conductive circuit, and the reflectivity of the first low-reflection layer is controlled to be less than 35%, so that the reflectivity of the conductive circuit can be reduced through the first low-reflection layer, and then the lamp bead circuit with low reflectivity (namely, the lamp bead circuit with low visibility) can be obtained. Therefore, even if the conductive circuit of the transparent LED display screen is manufactured by adopting the conductive material (such as copper, nickel, iron and the like) with low cost and high reflectivity, the low visibility of the lamp bead circuit of the LED display screen can be ensured, and the LED display screen with low cost and high transparency can be manufactured. In addition, the conductive lines are at least partially arranged in a grid shape, so that the coverage area of the conductive lines is facilitated, and the transparency of the transparent LED display screen can be further improved. Therefore, compared with a common transparent LED display screen, the manufacturing process of the flexible transparent LED display screen can manufacture the flexible transparent LED display screen with low cost and high transparency.
It is worth noting that, when the conductive circuit of the transparent LED display screen is made of conductive materials with higher cost, such as silver, indium Tin Oxide (ITO), etc., the high transparency of the flexible transparent LED display screen can still be ensured by the flexible transparent LED display screen manufacturing process of the present application. In one embodiment, the conductive circuit is made of metal or a mixture of metal and polymer. Specifically, the metal includes pure metals including, but not limited to, nickel, titanium, chromium, copper, iron, and metal alloys. The alloy may be an alloy of at least two metals of nickel, titanium, chromium, copper, iron. The polymer includes, but is not limited to, non-volatile acrylic resins, non-volatile epoxy-acrylic resins, modified products of any of the three, silica gels, solvent-free thermoplastic resins, and the like. Exemplary solvent-free thermoplastic resins include, but are not limited to, hot melt adhesives, polyphenylene sulfide (PPS), polysulfone (PSU), polysulfone (PES), polyetheretherketone (PEEK), aromatic polyester Liquid Crystal Polymer (LCP), polyetherimide (PEI), polyamideimide (PAI), polyacetal (POM), nylon (nylon Long nylon) (PA), polycarbonate (PC), polybutylene terephthalate (PBT), polyethylene terephthalate (dacron) (PET), polyphenylene oxide (polyoxyxylene, PPE, PPO), ABS resin (ABS), styrene acrylic acrylonitrile (ASA), polystyrene (PS), polymethyl methacrylate (PMMA), styrene copolymer (MS), cellulose Acetate (CA), thermoplastic Polyurethane (TPU), thermoplastic polyester elastomer (TPEE), styrene-based elastomer (TPS), nylon 12 elastomer (PAE), polytetrafluoroethylene (PTFE), vinylon (vinylon), polypropylene (PP), polyethylene (PE), ethylene/vinyl acetate copolymer (EVA), polyvinyl chloride (PVC), and the like.
It can be understood that the conductive circuit prepared by metal has the advantage of good conductivity, and the conductive circuit prepared by the mixture of metal and high polymer substance can improve the transparency of the conductive circuit on the basis of ensuring the conductivity of the conductive circuit and is beneficial to improving the adhesion capability of the conductive circuit on the flexible transparent substrate, thereby prolonging the service life of the LED display screen.
Specifically, the thickness of the conductive circuit is 0.1um to 300um. If the thickness of the conductive line is too thin, for example, less than 0.1um, the conductivity of the bead line formed by the conductive line is weak, so that the display effect, such as brightness and uniformity, of the LED display screen can be affected, and if the thickness of the conductive line is too large, for example, greater than 300um, the light transmittance of the conductive line can be affected, so that the transparency of the LED display screen can be affected, and the manufacturing cost of the LED display screen can be increased. Therefore, the thickness of the conductive circuit is limited to 0.1 um-300 um, and the conductivity, the transparency and the manufacturing cost of the LED display screen of the conductive layer circuit can be simultaneously considered. Exemplary, the conductive line may have a thickness of 0.1um, 0.2um, 0.3um, 0.4um, 0.5um, 0.6um, 0.7um, 0.8um, 0.9um, 1um, 2um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, 20um, 30um, 40um, 50um, 60um, 70um, 80um, 90um, 100um, 110um, 120um, 130um, 140um, 150um, 160um, 170um, 180um, 190um, 200um, 210um, 220um, 230um, 240um, 250um, 300um, 400um, 500um, 600um, 700um, 800um, 900um, 1000um, 1500um, 2000um, 2500um, 3000um, etc.
Preferably, the thickness of the conductive circuit is 0.5um to 50um. In the range of 0.5um to 50um, the conductive circuit can be ensured to have good conductivity and transparency, and the manufacturing cost of the LED display screen can be effectively controlled.
As shown in fig. 2, in an embodiment, the conductive circuit is disposed on one side or both sides of the flexible transparent substrate, and further includes:
s11, arranging a conductive layer on the flexible transparent substrate.
Specifically, the conductive layer may be coated on the flexible transparent substrate by electroplating, electroless plating or vacuum plating. Wherein, the vacuum plating comprises vacuum evaporation and vacuum sputtering.
It can be understood that the conductive layer is coated on the bonding layer by electroplating, chemical plating or vacuum plating, so that the process difficulty is low, the cost is controllable, the bonding compactness of the bonding layer and the conductive layer is improved, and the uniformity and the thickness of the conductive layer are controlled.
And S12, etching the conductive layer into a conductive circuit conforming to a preset circuit design.
The preset circuit design refers to a conductive circuit structure designed according to an actual product, and the conductive circuit structure comprises the length, the width, the distance between adjacent circuits, the distance between lamp bead welding areas, the number and the like of the circuits.
Specifically, the specific flow of etching is as follows:
1. covering a yellow type resist layer on the surface of the conductive layer, wherein the resist layer can be any one of positive type photoresist, negative type dry film, printing type anti-etching ink or yellow ink;
2. exposing the yellow type resist layer by using a glass photomask or a negative film to define the shape of the resist layer circuit (the shape is consistent with the design of a preset circuit);
3. and removing the redundant conductive layer by using a developing-etching-stripping mode, so as to obtain the required conductive circuit conforming to the preset circuit design.
It should be noted that, if the conductive layer is adhered to the flexible transparent substrate by the adhesive layer, after etching, the non-overlapping portion of the adhesive layer and the conductive line is removed simultaneously.
It will be appreciated that the conductive layer is etched in advance to prepare the conductive trace before the first reflective layer is provided, so that when the first reflective layer is coated, not only the surface of the conductive trace will be coated with the first reflective layer, but also the side surface of the conductive trace (and the adhesive layer) will be coated with the first reflective layer, thereby reducing the reflectivity of the conductive trace (and the adhesive layer) in all directions to improve the transparency of the LED display screen.
Of course, the design of the present application is not limited thereto, and in other embodiments, the first low reflection layer may be disposed on the conductive layer before the wire is prepared.
In one embodiment, the thickness of the first low reflection layer is 1nm to 3000nm. If the thickness of the first low reflection layer is too thin, for example, less than 1nm, on one hand, the coverage effect on the conductive circuit is reduced, and the reflectivity of the conductive circuit cannot be effectively reduced, so that the reflectivity of the lamp bead circuit is affected; on the other hand, the manufacturing process of the first low reflection layer is complicated, which is not beneficial to control the cost. If the thickness of the first low reflection layer is too thick, for example, greater than 3000nm, it is not beneficial to control the reflectivity and transmittance of the first low reflection layer, which affects the transparency of the LED display. Furthermore, too thick a first low reflection layer will also lead to increased costs of the LED display screen. Therefore, the thickness of the first low-reflection layer is limited to 1 nm-3000 nm, and the low reflectivity of the first low-reflection layer and the production cost of the LED display screen can be simultaneously considered.
The first low reflection layer may have a thickness of 1nm, 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000nm, 1500nm, 2000nm, 2500nm, 3000nm, etc. by way of example.
Preferably, the thickness of the first low reflection layer is 20 nm-250 nm. In the range of 20nm to 250nm, the first low-reflection layer can be ensured to have good low reflectivity, and the production cost of the LED display screen can be easily controlled.
Specifically, the material of the first low reflection layer includes at least one of metal, alloy, metal compound and metal oxide. Wherein the metal includes but is not limited to nickel, titanium, chromium, copper, iron. The alloy may be an alloy of at least two metals of nickel, titanium, chromium, copper, iron. The metal compound can be obtained by combining any two metals of nickel, titanium, chromium, copper and iron. The metal oxide can be obtained by reacting any one metal of nickel, titanium, chromium, copper and iron with the oxide.
In one embodiment, disposing a first low reflection layer on the conductive trace comprises:
and plating a first low-reflection layer on the conductive circuit by electroplating, electroless plating or vacuum plating.
Among these, vacuum plating includes vacuum evaporation and vacuum sputtering.
It can be understood that the first reflective layer is coated on the conductive circuit by electroplating, electroless plating or vacuum plating, so that the process difficulty is low, the cost is controllable, the bonding compactness of the first low reflective layer and the conductive circuit is improved, and the uniformity and thickness of the first low reflective layer are controlled.
In one embodiment, the plating of the first reflective layer on the conductive line by electroplating or electroless plating includes:
and adding an oxidant into the electroplating or electroless plating solution, and oxidizing the metal plating layer deposited on the conductive circuit by the oxidant to obtain the first low-reflection layer.
The oxidant may be added to the plating solution before the plating or electroless plating is started, or may be added to the plating solution during the plating or electroless plating, or may be added to the plating solution after the plating or electroless plating is completed. The time of addition of the oxidizing agent is not limited, since the oxidizing agent only reacts with the metal plating layer deposited on the conductive line.
The plating solution may be, for example, a copper sulfate plating solution or a nickel sulfate plating solution, and the oxidizing agent may be hydrogen peroxide.
Specifically, when the first low reflection layer is disposed on the conductive line by electroplating or electroless plating, hydrogen peroxide can be added into the copper sulfate plating solution or the nickel sulfate plating solution, so that the metal plating layer on the conductive line can be oxidized to form deep black copper oxide or nickel oxide, and then the required first low reflection layer is formed on the conductive line.
It can be understood that the first low reflection layer with conductivity can be arranged on the conductive circuit by adopting an electroplating or chemical plating mode, so that the conductive performance, such as conductive uniformity, conductivity and the like, of the bead circuit of the LED display screen can be improved in an auxiliary manner through the first low reflection layer, and the working stability of the LED display screen can be improved. Meanwhile, the conductive circuit also comprises metal related materials, so that the first low-reflection layer containing the metal materials is prepared, and the combination of the first low-reflection layer and the conductive circuit is facilitated, so that the service life of the LED display screen is prolonged. In addition, when the first low reflection layer with conductivity is obtained, the bonding pad can be directly arranged on the first low reflection layer, so that the bonding pad can be conveniently arranged, and the process difficulty of the LED display screen is reduced.
In one embodiment, the first reflective layer is coated on the conductive circuit by vacuum plating, including:
and adding a reaction gas in the carrier atmosphere of vacuum sputtering or vacuum evaporation, and oxidizing the plating metal on the conductive line by the reaction gas to obtain the first low-reflection layer.
The reactive gas may be added to the carrier atmosphere before the start of vacuum sputtering or vacuum vapor deposition, or may be added to the carrier atmosphere during plating or electroless plating, or may be added to the carrier atmosphere after the end of plating or electroless plating. The reaction gas only reacts with the plating metal plated on the conductive circuit, so the addition time of the reaction gas is not limited.
The carrier atmosphere is illustratively an argon atmosphere, and the reactant gases may be nitrogen and oxygen.
Specifically, when the first low reflection layer is disposed on the conductive line by vacuum sputtering or vacuum evaporation, a reaction gas such as nitrogen and oxygen may be additionally added under a carrier atmosphere (original argon atmosphere) of vacuum sputtering or vacuum evaporation, so as to form a deep black copper nitride, a deep black copper oxide, a deep black nickel oxide layer or other oxygen-deficient oxides on the metal plating layer on the conductive line, so as to obtain the required first low reflection layer.
It can be understood that the first low reflection layer with conductivity can be disposed on the conductive circuit by vacuum sputtering or vacuum vapor deposition, so that the conductive performance, such as conductive uniformity and conductivity, of the bead circuit of the LED display screen can be improved by the first low reflection layer, so as to improve the working stability of the LED display screen. Meanwhile, the conductive circuit also comprises metal related materials, so that the first low-reflection layer containing the metal materials is prepared, and the combination of the first low-reflection layer and the conductive circuit is facilitated, so that the service life of the LED display screen is prolonged. In addition, when the first low reflection layer with conductivity is obtained, the bonding pad can be directly arranged on the first low reflection layer, so that the bonding pad can be conveniently arranged, and the process difficulty of the LED display screen is reduced.
As shown in fig. 3, in an embodiment, before the conductive lines are disposed on one side or both sides of the flexible transparent substrate, the manufacturing process of the flexible transparent LED display screen further includes:
s110, arranging adhesive layers on one side or two sides of the flexible transparent substrate, wherein the adhesive force between the adhesive layers and the flexible transparent substrate is greater than 0.5kg/cm 2 The conductive circuit is arranged on the bonding layer.
The adhesive force refers to the adhesive strength between the adhesive layer and the flexible transparent substrate, and is understood to be the tackiness between the adhesive layer and the flexible transparent substrate. In general, the higher the adhesion force, the stronger the adhesion between the adhesive layer and the flexible transparent substrate, and the more stable the adhesion between the adhesive layer and the flexible transparent substrate.
Specifically, an adhesive layer may be provided on the flexible transparent substrate before the conductive traces are provided.
It can be understood that, since the flexible transparent substrate is made of glass or organic polymer, and the conductive layer (conductive circuit) is made of metal, both are not of the same type, if the conductive layer is directly disposed on the flexible transparent substrate, the adhesion between the conductive layer and the flexible transparent substrate is poor. Based on this, through setting up the adhesive linkage on flexible transparent substrate, flexible transparent substrate and conducting layer can be bonded through the mode of bonding, can improve the firm nature of conducting layer on flexible transparent substrate adhesion, and then can improve the firm nature of conducting wire on flexible transparent substrate adhesion. In addition, by limiting the adhesive force of the adhesive layer to not less than 0.5kg/cm 2 The adhesion stability of the adhesive layer on the flexible transparent substrate can be ensured.
Specifically, the material of the adhesive layer includes at least one of metal, alloy, metal compound, metal oxide and transparent polymer. Wherein the metal includes but is not limited to nickel, titanium, chromium, copper, iron. The alloy may be an alloy of at least two metals of nickel, titanium, chromium, copper, iron. The metal compound can be obtained by combining any two metals of nickel, titanium, chromium, copper and iron. The metal oxide can be obtained by reacting any one metal of nickel, titanium, chromium, copper and iron with the oxide. The transparent polymer may be at least one of a non-volatile acrylic resin, a non-volatile epoxy-acrylic resin, and a modified product of the three.
In one embodiment, when the material of the bonding layer includes at least one of metal, alloy, metal compound and metal oxide, the thickness of the bonding layer is 1nm to 3000nm. If the thickness of the adhesive layer is too small, for example, less than 1nm, on the one hand, the adhesion ability of the adhesive layer is lowered, and it is difficult to ensure the adhesion between the flexible transparent substrate and the conductive layer, on the other hand, the manufacturing process of the adhesive layer is complicated, which is disadvantageous in terms of cost control. If the thickness of the bonding layer is too thick, if the thickness is larger than 3000nm, the thickness of the LED display screen is increased, and the transparency of the LED display screen is affected. And will result in an increase in the cost of the LED display screen. Therefore, the thickness of the bonding layer is limited to 1 nm-3000 nm, and the bonding capability of the bonding layer and the production cost of the LED display screen can be simultaneously considered.
The thickness of the adhesive layer may be 1nm, 10nm, 20nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000nm, 1500nm, 2000nm, 2500nm, 3000nm, etc. by way of example.
Preferably, the thickness of the adhesive layer is 20 nm-250 nm. In the range of 20nm to 250nm, the bonding layer can be ensured to have good bonding property, and the production cost of the LED display screen can be effectively controlled.
In one embodiment, the adhesive layer may be plated on the flexible transparent substrate by electroplating, electroless plating or vacuum plating.
It can be understood that the bonding layer is coated on the flexible transparent substrate by electroplating, chemical plating or vacuum plating, so that the process difficulty is low, the cost is controllable, the bonding tightness between the bonding layer and the flexible transparent substrate is improved, and the uniformity and the thickness of the bonding layer are controlled.
In an embodiment, when the material of the adhesive layer is a transparent polymer, the thickness of the adhesive layer is 1um to 100um. When the organic layer is made of a transparent polymer, a transparent organic coating may be first prepared and then applied to the flexible transparent substrate. Because of certain limitation of the coating mode and good light transmittance of the transparent organic polymer material, the thickness of the adhesive layer manufactured by the adhesive layer can be between 1um and 100um. If the thickness of the bonding layer is less than 1um, the bonding performance is not easily exerted, and if the thickness of the bonding layer is greater than non-100 um, the thickness and the cost of the LED display screen are affected by the excessive thickness of the bonding layer, so that the thickness of the bonding layer is limited to 1 um-100 um, and the bonding capability of the bonding layer and the production cost of the LED display screen can be simultaneously considered.
Illustratively, the adhesive layer may have a thickness of 1um, 2um, 3um, 4um, 5um, 6um, 7um, 8um, 9um, 10um, 15um, 20um, 25um, 30um, 40um, 50um, 60um, 70um, 80um, 90um, 100um, etc.
Preferably, the thickness of the adhesive layer is between 5um and 30um. In the range of 5um to 30um, good adhesiveness of the adhesive layer can be ensured, and the production cost of the LED display screen can be effectively controlled.
As shown in fig. 3, in an embodiment, before the conductive lines are disposed on one side or both sides of the flexible transparent substrate, the manufacturing process of the flexible transparent LED display screen further includes:
and S220, if the bonding layer meets the preset coloring condition, setting a second low-reflection layer on the bonding layer, wherein the reflectivity of the second low-reflection layer is lower than 35%, and the conductive circuit is arranged on the second low-reflection layer.
Specifically, the preset coloring condition includes at least one of a thickness, an extinction coefficient, and a refractive index of the adhesive layer. If the thickness of the bonding layer is larger than the preset thickness, or the extinction coefficient is larger than the preset extinction coefficient, or the refractive index is larger than the preset refractive index, the bonding layer is judged to meet the preset coloring condition. Among these, thickness, extinction coefficient, and refractive index can be used to reflect the reflectivity of the adhesive layer. For example, the preset thickness may be 60nm, that is, if the thickness of the adhesive layer is greater than 60nm, it is indicated that the adhesive layer satisfies the preset coloring condition. It should be noted that the preset thickness, the preset extinction coefficient and the preset refractive index may be adaptively adjusted according to different materials of the actual bonding layer, which is not specifically limited in the present application.
It can be understood that after the bonding layer meets the preset coloring condition, the second reflecting layer is arranged on the bonding layer, so that the reflectivity of the bonding layer can be effectively reduced, and the transparency of the LED display screen can be improved.
It should be noted that, the material and the manufacturing manner of the second low reflection layer may refer to the first low reflection layer, which is not described herein.
As shown in fig. 5, in an embodiment, after the LED beads are soldered on the bonding pads, the flexible transparent LED display screen manufacturing process further includes:
s350, packaging the LED lamp beads by using a surface-drying type optical resin with an acid value less than 5 (KOH)/(mg/g) and a curing agent.
Where (in chemistry) acid number (or neutralization number, acid number, acidity) refers to the milligrams of potassium hydroxide (KOH) required to neutralize 1 gram of chemical. Acid number is a measure of the number of free carboxylic acid groups in a compound (e.g., fatty acid) or mixture. A typical measurement procedure is to dissolve a portion of a known sample in an organic solvent, titrate with a known concentration of potassium hydroxide solution, and use a phenolphthalein solution as a color indicator. The acid value can be used as an index of the deterioration degree of the grease.
Alternatively, the acid number of the resin may be 4 (KOH)/(mg/g), 3 (KOH)/(mg/g), 2 (KOH)/(mg/g), 1 (KOH)/(mg/g), 0 (KOH)/(mg/g).
Preferably, the LED lamp beads are encapsulated with a resin having no acid value (i.e., an acid value of 0 (KOH)/(mg/g)).
Surface drying, i.e., surface drying. Refers to the process that the paint is coated on the surface of a substrate in the coating engineering, and the surface is primarily dried after a certain period of time. Based on this, the resin has a surface-drying property.
Optical grade resin refers to a resin that can meet the transparency requirements of an LED display screen, for example, the transparency of the resin is greater than 90% after the resin is cured.
Curing agents, also known as hardeners, curing agents or setting agents, are a class of substances or mixtures that enhance or control the curing reaction.
Specifically, after the LED lamp beads are welded, the surface-drying type optical resin with the acid value smaller than 5 (KOH)/(mg/g) can be used for matching with a curing agent to package the LED lamp beads, and the packaging mode can be coating, dispensing or bonding operation after the colloid is semi-cured into solid optical adhesive.
It can be understood that the weather resistance and the reliability of the LED display screen can be effectively improved by packaging the LED lamp beads.
It should be noted that, when the resin is used to encapsulate the LED lamp beads, the resin may cover only the LED lamp beads in whole, or may cover only the solder tail portions of the LED lamp beads.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the invention
Clear spirit and scope. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (7)
1. The manufacturing process of the flexible transparent LED display screen is characterized by comprising the following steps of:
arranging conductive circuits on one side or two sides of a flexible transparent substrate, wherein at least part of the conductive circuits are arranged in a grid shape;
a first low-reflection layer is arranged on the conductive circuit, and the reflectivity of the first low-reflection layer is less than 35%;
a bonding pad is arranged on the first low reflection layer or the conductive circuit, and the bonding pad is positioned in a lamp bead welding area of the LED display screen;
welding LED lamp beads on the bonding pads;
before the conductive lines are arranged on one side or two sides of the flexible transparent substrate, the manufacturing process of the flexible transparent LED display screen further comprises the following steps:
arranging an adhesive layer on one side or two sides of the flexible transparent substrate, wherein the adhesive force between the adhesive layer and the flexible transparent substrate is more than 0.5kg/cm 2 The conductive circuit is arranged on the bonding layer; and
if the bonding layer meets preset coloring conditions, a second low-reflection layer is arranged on the bonding layer, wherein the reflectivity of the second low-reflection layer is lower than 35%, and the conductive circuit is arranged on the second low-reflection layer; and judging whether the bonding layer meets preset coloring conditions or not according to at least one of the thickness, the extinction coefficient and the refractive index of the bonding layer.
2. The flexible transparent LED display manufacturing process of claim 1, wherein disposing a first low reflection layer on the conductive trace comprises:
and plating a first low-reflection layer on the conductive circuit by electroplating, electroless plating or vacuum plating.
3. The flexible transparent LED display manufacturing process of claim 2, wherein plating the first reflective layer on the conductive line by electroplating or electroless plating comprises:
and adding an oxidant into the electroplating or electroless plating solution, and oxidizing the metal plating layer deposited on the conductive circuit by the oxidant to obtain the first low-reflection layer.
4. The flexible transparent LED display panel manufacturing process of claim 2, wherein the vacuum plating comprises vacuum sputtering and vacuum evaporation;
coating a first reflecting layer on the conductive circuit in a vacuum plating mode, wherein the first reflecting layer comprises:
and adding a reaction gas in the carrier atmosphere of vacuum sputtering or vacuum evaporation, and oxidizing the plating metal on the conductive line by the reaction gas to obtain the first low-reflection layer.
5. The flexible transparent LED display panel manufacturing process of claim 1, wherein the disposing of the conductive traces on one or both sides of the flexible transparent substrate comprises:
a conductive layer is arranged on the bonding layer;
etching the conductive layer into a conductive line conforming to a preset line design.
6. The flexible transparent LED display panel manufacturing process according to claim 5,
plating a film adhesive layer on the flexible transparent substrate by electroplating, chemical plating or vacuum plating; and/or the number of the groups of groups,
and plating a conductive layer on the adhesive layer by electroplating, electroless plating or vacuum plating.
7. The flexible transparent LED display manufacturing process of claim 1, wherein after the LED beads are soldered on the bonding pads, the flexible transparent LED display manufacturing process further comprises:
and packaging the LED lamp beads by using a surface-dryable optical resin with an acid value of less than 5 (KOH)/(mg/g) and a curing agent.
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| CN105316736A (en) * | 2014-08-05 | 2016-02-10 | 上海蓝沛信泰光电科技有限公司 | Preparation method for low-reflectivity transparent conducting circuits |
| CN208819542U (en) * | 2018-08-30 | 2019-05-03 | 厦门福相传媒有限公司 | A kind of transparent display screen |
| CN110796956A (en) * | 2019-11-15 | 2020-02-14 | 大连集思特科技有限公司 | Flexible transparent display screen and manufacturing method thereof |
| CN111653556A (en) * | 2020-07-09 | 2020-09-11 | 蚌埠明微光电玻璃科技有限公司 | Transparent luminous component for visible colored line |
| CN212342654U (en) * | 2020-07-24 | 2021-01-12 | 东莞市中晶半导体科技有限公司 | LED chip, display screen module and display screen |
| CN111901968A (en) * | 2020-07-29 | 2020-11-06 | 厦门爱谱生电子科技有限公司 | Micro LED flexible circuit board manufacturing method |
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