CN112881813A - Can improve optical electric field sensor output noise's encapsulation tube shell - Google Patents
Can improve optical electric field sensor output noise's encapsulation tube shell Download PDFInfo
- Publication number
- CN112881813A CN112881813A CN202110039311.9A CN202110039311A CN112881813A CN 112881813 A CN112881813 A CN 112881813A CN 202110039311 A CN202110039311 A CN 202110039311A CN 112881813 A CN112881813 A CN 112881813A
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- hole
- optical sensor
- pigtail
- main body
- cover plate
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- 230000003287 optical effect Effects 0.000 title claims abstract description 82
- 230000005684 electric field Effects 0.000 title claims abstract description 22
- 238000005538 encapsulation Methods 0.000 title description 2
- 239000000835 fiber Substances 0.000 claims abstract description 42
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000741 silica gel Substances 0.000 abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 abstract description 9
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 abstract description 7
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000011257 shell material Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
- G01R29/0885—Sensors; antennas; probes; detectors using optical probes, e.g. electro-optical, luminescent, glow discharge, or optical interferometers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The packaging tube shell comprises a main body and a cover plate, wherein the main body comprises a bottom plate and a plurality of side plates, the bottom plate and the side plates form an accommodating space, two opposite side plates in the side plates are respectively provided with tail fiber through holes, a supporting table is arranged in the accommodating space, the supporting table is provided with a mounting groove, the mounting groove is used for fixing optical electric field sensor chips with matched sizes, a lithium niobate gasket is not needed, and noise superposed on a measurement result due to resonance caused by the gasket is eliminated. The axes of the first tail fiber through hole and the second tail fiber through hole in the main body are not in the same straight line, so that the stress borne by the tail fiber is eliminated, and the breakage at the tail fiber of the optical sensor is favorably avoided. The cover plate is of a step structure, the size of the cover plate is matched with the size of the inner diameter of the main body, the silica gel fills the gaps around the joint of the cover plate and the main body, and the silica gel fixes the tail fiber sheath, so that the sealing performance of the tube shell is ensured, and the influence of environment humidity on the performance of the optical sensor wafer is favorably avoided.
Description
Technical Field
The invention belongs to the field of photoelectricity, and particularly relates to a packaging tube shell capable of improving output noise of an optical electric field sensor.
Background
The integrated optical electric field sensor has wide application in the field of electric field measurement due to the advantages of wide frequency band, small volume and the like. The basic principle of measuring the electric field of the integrated optical electric field sensor is based on the electro-optic effect of a specific crystal, the phase of polarized light transmitted in the integrated optical electric field sensor is modulated by the electric field to be measured, the polarized light carrying information of the electric field to be measured is generated, and the modulated polarized light signal is subjected to photoelectric conversion and amplification to form an electric signal.
Lithium niobate is a common electro-optic crystal for an integrated optical electric field sensor, and has piezoelectric effect, elasto-optic effect and the like besides the electro-optic effect, and the measurement effect of the integrated optical electric field sensor can be influenced by the piezoelectric effect, the elasto-optic effect and the like. For a lithium niobate wafer with a certain geometric dimension, a certain resonant frequency exists; when the electric field to be measured has the same frequency component, resonance can be caused; noise at the resonance frequency appears on the measurement results.
In order to buffer the thermal expansion difference between the tube shell material and the lithium niobate wafer, another lithium niobate crystal is generally used as a cushion block of the conventional packaging tube shell, and the geometric dimension of the cushion block is generally larger than that of the lithium niobate wafer, so that noise of a certain resonant frequency is introduced, and the measurement result is influenced.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a package that can improve the output noise of an optical electric field sensor.
A package for improving the output noise of an optical electric field sensor comprises a main body and a cover plate,
the main body comprises a bottom plate and a plurality of side plates, the bottom plate and the side plates form an accommodating space, and two opposite side plates in the side plates are respectively provided with tail fiber through holes;
an optical sensor wafer supporting table is arranged in the accommodating space, and an optical sensor wafer mounting groove is formed in the optical sensor wafer supporting table;
the cover plate is characterized in that the length and the width of the cover plate are consistent with those of the main body, the cover plate can be tightly connected with the main body, the cover plate is of a step structure, and the size of the step structure of the cover plate is matched with the size of the inner diameter of the main body.
Further, the plurality of side plates comprise a first side plate, a second side plate, a third side plate and a fourth side plate, the first side plate is provided with a first tail fiber through hole, and the second side plate is provided with a second tail fiber through hole.
Further, the axes of the first tail fiber through hole and the second tail fiber through hole are not in the same straight line.
Further, the height setting criterion of the optical sensor wafer support stage is that the pigtail of the optical sensor wafer passes through the first pigtail through-hole and the second pigtail through-hole.
Furthermore, the optical sensor wafer mounting groove is located on the optical sensor wafer support platform, and the axis of the optical sensor wafer mounting groove and the axes of the first pigtail through hole and the second pigtail through hole are not in the same straight line and are in parallel relation.
Further, the main body and the cover plate are made of any one of polytetrafluoroethylene, polysulfone and polyether-ether-ketone materials.
Further, the width and depth of the optical sensor wafer mounting groove are matched with the width and thickness of the optical sensor wafer.
Further, the first pigtail through-hole and the second pigtail through-hole may have any one of a circular shape, a square shape, and a rectangular shape.
The packaging tube shell comprises a main body and a cover plate, wherein the main body comprises a first tail fiber through hole, a second tail fiber through hole, an optical sensor wafer supporting platform and an optical sensor wafer mounting groove. The optical sensor wafer mounting groove can fix the chip of the optical electric field sensor with matched size, a lithium niobate gasket is not needed, and noise superposed on a measurement result due to resonance caused by the gasket is eliminated. The axes of the first tail fiber through hole and the second tail fiber through hole are not in the same straight line, so that the stress borne by the tail fiber can be eliminated, and the breakage at the tail fiber of the optical sensor can be avoided. The cover plate is of a step structure, the size of the step structure of the cover plate is matched with the inner diameter of the main body, so that the cover plate is tightly matched with the main body, the gaps at the periphery of the joint of the cover plate and the main body are filled by using silica gel, and the silica gel is fixedly penetrated through the tail fiber protective sleeve of the optical sensor wafer at the through holes of the first tail fiber and the second tail fiber, so that the sealing property of the tube shell can be ensured, and the influence of environment humidity on the performance of the optical sensor wafer can be avoided.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a main body of a package in the present embodiment;
fig. 2 is a cover plate of the package can in the present embodiment;
1. first tail optical fiber through hole, 2, second tail optical fiber through hole, 3, optical sensor wafer supporting bench, 4, optical sensor wafer mounting groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention particularly relates to a packaging tube shell capable of improving the output noise of an optical electric field sensor, which comprises a main body and a cover plate, wherein the main body and the cover plate are matched for use, and the main body and the cover plate are made of any one of polytetrafluoroethylene materials, polysulfone or polyether ether ketone. The length of the outline of the main body is 30mm, the width is determined by the electrode and the antenna of the integrated optical electric field sensor, the typical width is 18mm, and the height is 8 mm.
As shown in fig. 1, the package body according to the embodiment of the present invention is a cubic structure, but the present invention is not limited to the cubic structure, and includes other shape structures such as a cylindrical structure, a prismatic structure, etc. that can be used in the present invention. The packaging tube shell comprises a main body and a cover plate, wherein the main body comprises a bottom plate and a plurality of side plates, the bottom plate and the side plates form an accommodating space, two opposite side plates of the side plates are respectively provided with tail fiber through holes, an optical sensor wafer supporting table 3 is arranged in the accommodating space, the optical sensor wafer supporting table 3 is of a plate-shaped structure, the optical sensor wafer supporting table 3 is fixed in the accommodating space in an adhering or welding mode, but the optical sensor wafer supporting table 3 is not only fixed in the accommodating space in an adhering or welding mode, any mode capable of fixing the optical sensor wafer supporting table 3 in the accommodating space is within the protection range of the invention, and an optical sensor wafer mounting groove 4 is arranged on the optical sensor wafer supporting table 3. The shape of the cover plate is matched with the opening of the main body, the overall length and the width of the cover plate are consistent with those of the main body, the cover plate is of a step structure, and the size of the step structure of the cover plate is matched with the size of the inner diameter of the main body, so that the cover plate is tightly matched with the main body.
The side plates comprise a first side plate, a second side plate, a third side plate and a fourth side plate, the first side plate is provided with a first tail fiber through hole 1, and the second side plate is provided with a second tail fiber through hole 2. The axes of the first pigtail through hole 1 and the second pigtail through hole 2 are not on the same straight line, and the shape of the first pigtail through hole 1 and the second pigtail through hole 2 is any one of a circle, a square and a rectangle. The height setting criteria of the optical sensor wafer support stage 3 is that the pigtail of the optical sensor wafer passes through the first pigtail through-hole 1 and the second pigtail through-hole 2. The distance between the axes of the first pigtail through hole 1 and the second pigtail through hole 2 is 1mm to 1.5mm, and the distance between the axes of the first pigtail through hole 1 and the second pigtail through hole 2 is preferably, but not limited to, 1mm to 1.5mm, and the distance between the axes of the first pigtail through hole 1 and the second pigtail through hole 2 is within the protection scope of the present invention, the first pigtail through hole 1 and the second pigtail through hole 2 are used for the pigtail of the integrated optical electric field sensor to pass through, the shape of the first pigtail through hole 1 and the second pigtail through hole 2 is any one of a circle, a square and a rectangle, but not limited to the shape of the first pigtail through hole 1 and the second pigtail through hole 2 is a circle, a square and a rectangle, and other shapes that can be used for the first pigtail through hole 1 and the second pigtail through hole 2 are within the protection scope of the present invention. The height setting criteria of the optical sensor wafer support stage 3 is that the pigtail of the optical sensor wafer passes through the first pigtail through-hole 1 and the second pigtail through-hole 2. The optical sensor wafer mounting groove 4 is located on the optical sensor wafer support stage 3, the axis of the optical sensor wafer mounting groove 4 is not in line with the axes of the first pigtail through hole 1 and the second pigtail through hole 2, the optical sensor wafer mounting groove 4 is a long and narrow rectangular groove, the axis along the long side of the rectangular groove is parallel to the axis of the first pigtail through hole 1 and the second pigtail through hole 2, the optical sensor wafer mounting groove 4 is located at an intermediate position of the optical sensor wafer support stage 3, but not limited to, the optical sensor wafer mounting groove 4 being located at an intermediate position of the optical sensor wafer support stage 3, any position where the optical sensor wafer mounting groove 4 can be provided on the optical sensor wafer support stage 3 is within the scope of the present invention, the width and depth of the optical sensor wafer mounting groove 4 matching the width and thickness of the optical sensor wafer. The axis of the optical sensor wafer mounting groove 4 and the axes of the first pigtail through hole 1 and the second pigtail through hole 2 are not in a straight line and are in parallel relation.
As shown in fig. 2, the cover plate of the packaging tube shell according to the embodiment of the present invention is a cover plate of the packaging tube shell, and the main body and the cover plate are made of any one of teflon, polysulfone and polyetheretherketone, but not limited to teflon, polysulfone and polyetheretherketone, and any material that can be used to make the main body and the cover plate is within the protection scope of the present invention. The embodiment of the invention takes polytetrafluoroethylene as an example, and the steps for manufacturing the packaging tube shell are as follows:
the invention selects polytetrafluoroethylene materials, processes into a main body and a cover plate, and performs edge blunting and deburring on the processed main body and the processed cover plate. The optical sensor wafer with the tail fiber is installed in the installation groove 4, the optical sensor wafer is fixed through low-stress silica gel, the tail fiber of the optical sensor wafer penetrates out of the packaging tube shell from the first tail fiber through hole 1 and the second tail fiber through hole 2 and keeps a loose state, the tail fiber sheath of the optical sensor wafer penetrates through the first tail fiber through hole 1 and the second tail fiber through hole 2, and the tail fiber sheath of the optical sensor wafer penetrating through the first tail fiber through hole 1 and the second tail fiber through hole 2 is fixed through silica gel. The cover plate is placed on the main body and is tightly pressed, and the gaps around the joint of the cover plate and the main body are filled with silica gel, so that the sealing performance of the pipe shell is ensured.
The packaging tube shell comprises a main body and a cover plate, wherein the main body comprises a first tail fiber through hole 1, a second tail fiber through hole 2, an optical sensor wafer supporting platform 3 and an optical sensor wafer mounting groove 4. The optical sensor wafer mounting groove 4 can fix a chip of the optical electric field sensor of a matched size without a lithium niobate spacer, eliminating noise superimposed on the measurement result due to resonance caused by the spacer. The axes of the first tail fiber through hole 1 and the second tail fiber through hole 2 are not in the same straight line, so that the stress borne by the tail fiber can be eliminated, and the breakage at the tail fiber of the optical sensor can be avoided. The apron is the stair structure, and the size of apron stair structure matches with the internal diameter size of main part for apron and main part closely cooperate, use silica gel to fill up the gap all around of apron and main part junction simultaneously, and the fixed tail optical fiber sheath of wearing the optical sensor wafer in first tail optical fiber through hole 1 and second tail optical fiber through hole 2 department of silica gel can guarantee the leakproofness of tube, is favorable to avoiding the performance influence of ambient humidity to the optical sensor wafer.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A package for improving the output noise of an optical electric field sensor, comprising a main body and a cover plate,
the main body comprises a bottom plate and a plurality of side plates, the bottom plate and the side plates form an accommodating space, and two opposite side plates in the side plates are respectively provided with tail fiber through holes;
an optical sensor wafer supporting table (3) is arranged in the accommodating space, and an optical sensor wafer mounting groove (4) is formed in the optical sensor wafer supporting table (3);
the cover plate is characterized in that the length and the width of the cover plate are consistent with those of the main body, the cover plate can be tightly connected with the main body, the cover plate is of a step structure, and the size of the step structure of the cover plate is matched with the size of the inner diameter of the main body.
2. The package case according to claim 1, wherein the plurality of side plates includes a first side plate, a second side plate, a third side plate and a fourth side plate, the first side plate is provided with a first tail fiber through hole (1), and the second side plate is provided with a second tail fiber through hole (2).
3. The package according to claim 2, characterized in that the axes of the first pigtail through-hole (1) and the second pigtail through-hole (2) are not aligned.
4. The package according to claim 1, wherein the optical sensor wafer mount (3) has a height setting criterion that the pigtail of the optical sensor wafer passes through the first pigtail through-hole (1) and the second pigtail through-hole (2).
5. The package according to claim 1, wherein the optical sensor die mounting groove (4) is located on the optical sensor die support table (3), and the axis of the optical sensor die mounting groove (4) is not in a straight line with the axis of the first pigtail through-hole (1) and the second pigtail through-hole (2), and the three are in a parallel relationship.
6. The package cartridge as in claim 1, wherein the body and cover are made of any one of teflon, polysulfone, and polyetheretherketone.
7. Package housing according to claim 1, characterized in that the width and depth of the optical sensor wafer mounting groove (4) match the width and thickness of the optical sensor wafer.
8. The package according to claim 2, wherein the first pigtail through-hole (1) and the second pigtail through-hole (2) have any one of a circular shape, a square shape, and a rectangular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110039311.9A CN112881813B (en) | 2021-01-12 | 2021-01-12 | Can improve optical electric field sensor output noise's encapsulation tube shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110039311.9A CN112881813B (en) | 2021-01-12 | 2021-01-12 | Can improve optical electric field sensor output noise's encapsulation tube shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112881813A true CN112881813A (en) | 2021-06-01 |
| CN112881813B CN112881813B (en) | 2022-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110039311.9A Active CN112881813B (en) | 2021-01-12 | 2021-01-12 | Can improve optical electric field sensor output noise's encapsulation tube shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113484624A (en) * | 2021-06-30 | 2021-10-08 | 清华大学 | Optical electric field sensor packaging device and packaging method for high-humidity environment |
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| CN101325205A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image sensing chip |
| KR100986186B1 (en) * | 2010-06-21 | 2010-10-07 | 엘아이지넥스원 주식회사 | Manufacturing method of optical waveguide by high temperature proton exchange |
| CN106483683A (en) * | 2015-09-01 | 2017-03-08 | 江西飞信光纤传感器件有限公司 | A kind of lithium niobate modulator part of air-tight packaging |
| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
| CN207248926U (en) * | 2017-09-08 | 2018-04-17 | 南方电网科学研究院有限责任公司 | Integrated optics strong electric field sensor packaging shell |
-
2021
- 2021-01-12 CN CN202110039311.9A patent/CN112881813B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101325205A (en) * | 2007-06-14 | 2008-12-17 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image sensing chip |
| KR100986186B1 (en) * | 2010-06-21 | 2010-10-07 | 엘아이지넥스원 주식회사 | Manufacturing method of optical waveguide by high temperature proton exchange |
| CN106483683A (en) * | 2015-09-01 | 2017-03-08 | 江西飞信光纤传感器件有限公司 | A kind of lithium niobate modulator part of air-tight packaging |
| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
| CN207248926U (en) * | 2017-09-08 | 2018-04-17 | 南方电网科学研究院有限责任公司 | Integrated optics strong electric field sensor packaging shell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113484624A (en) * | 2021-06-30 | 2021-10-08 | 清华大学 | Optical electric field sensor packaging device and packaging method for high-humidity environment |
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| CN112881813B (en) | 2022-05-20 |
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