CN210774446U - Resonant pressure sensor - Google Patents
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- CN210774446U CN210774446U CN201922194235.XU CN201922194235U CN210774446U CN 210774446 U CN210774446 U CN 210774446U CN 201922194235 U CN201922194235 U CN 201922194235U CN 210774446 U CN210774446 U CN 210774446U
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Abstract
The utility model discloses a resonant mode pressure sensor, the utility model provides a resonant mode pressure sensor simple structure, the first syntonizer through setting up simultaneously response pressure and temperature variation and the second syntonizer of only response temperature variation to set up temperature sensor and acquire sensor actual operating temperature, can realize carrying out the temperature calibration compensation to two sensitive component's frequency difference value, improved the pressure measurement precision.
Description
Technical Field
The utility model relates to a pressure sensor technical field especially relates to a resonant mode pressure sensor.
Background
The pressure sensor is widely applied to various fields such as aircrafts, marine exploration and meteorology, and along with the improvement of the technical level of various fields, the precision requirement on the pressure sensor is higher and higher.
The resonant pressure sensor is a commonly used pressure sensor at present, has the characteristics of strong anti-interference capability, good stability, digital output and the like, and has the working principle that the resonant frequency of a sensitive element can be correspondingly changed according to the change of the pressure, and the pressure received by the sensitive element can be obtained by detecting the resonant frequency of the sensitive element by calibrating the corresponding relation between the input pressure and the output frequency of the sensitive element, so that the function of the pressure sensor is realized. However, most of the package structures of the sensing elements in the conventional resonant pressure sensors are relatively complex, the resonant frequency of the sensing elements is related to not only the pressure applied to the sensing elements but also the ambient temperature of the sensing elements, and the conventional resonant pressure sensors are not provided with temperature compensation and have low measurement accuracy.
Thus, there is still a need for improvement and development of the prior art.
Disclosure of Invention
The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a resonant mode pressure sensor, aim at solving among the prior art problem that pressure sensor structure is complicated, the precision is low.
The technical scheme of the utility model as follows:
a resonant pressure sensor, wherein the resonant pressure sensor comprises: the sensor comprises a sensor shell, a first resonator and a second resonator, wherein the first resonator and the second resonator are fixed inside the sensor shell, the first resonator is used for sensing pressure change borne by the sensor shell and temperature change inside the sensor shell, the second resonator is arranged above the first resonator and is used for sensing temperature change inside the sensor shell, the resonant pressure sensor further comprises a temperature sensor fixed inside the sensor shell, and the temperature sensor is used for collecting the ambient temperature inside the sensor shell.
The resonant pressure sensor comprises a sensor shell, wherein the sensor shell comprises a first end cover and a second end cover, the first end cover and the second end cover are respectively arranged at two ends of the sensor shell, and the sensor shell is sealed to form a cavity.
The resonant pressure sensor is characterized in that a first bulge is arranged on the inner wall of the sensor shell, a second bulge is arranged on the first end cover, and the first resonator is tightly pressed on the side wall of the first bulge by the first end cover through the second bulge.
The resonant pressure sensor is characterized in that a gasket is further arranged between the first end cover and the first resonator.
The resonant pressure sensor, wherein the second resonator is fixedly connected to the second end cap.
The resonant pressure sensor is characterized in that a third bulge is arranged on the second end cover, and the second resonator is fixedly adhered to the side wall of the third bulge.
The resonant pressure sensor, wherein the second resonator is disposed perpendicular to the second end cap.
The resonant pressure sensor further comprises a sensor pin respectively connected with the first resonator, the second resonator and the temperature sensor, and the sensor pin is used for transmitting the first resonant frequency of the first resonator, the second resonant frequency of the second resonator and the ambient temperature collected by the temperature sensor in the sensor shell to a processor connected with the resonant pressure sensor.
The resonance type pressure sensor is characterized in that the sensor pin protrudes out of the outer surface of the pressure sensor.
The resonant pressure sensor is characterized in that the model of the temperature sensor is NST 1001.
The technical effects of the utility model: the utility model discloses an inside first syntonizer, second syntonizer and the temperature sensor of setting up of sensor housing to it is fixed through simple mechanical compression method first syntonizer is fixed through with second end cover fixed connection method the second syntonizer has realized the first resonant frequency of first syntonizer receives pressure and ambient temperature's influence, the second resonant frequency of second syntonizer only receives ambient temperature's influence to set up the temperature sensor who gathers the inside actual ambient temperature of sensor housing, can realize the basis ambient temperature is right first resonant frequency with the difference of second resonant frequency carries out the compensation calculation, has obtained the higher pressure measurement result of precision.
Drawings
Fig. 1 is a schematic overall appearance diagram of a resonant pressure sensor according to a preferred embodiment of the present invention;
fig. 2 is a central cross-sectional view of a preferred embodiment of a resonant pressure sensor provided by the present invention;
fig. 3 is a schematic structural diagram of a sensor housing according to a preferred embodiment of the resonant pressure sensor provided in the present invention;
fig. 4 is a schematic diagram of a fixing structure of a second resonator according to a preferred embodiment of the resonant pressure sensor of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-2, fig. 1 is an overall structural diagram of a preferred embodiment of a resonant pressure sensor according to the present invention, and fig. 2 is a central sectional view of the resonant pressure sensor.
As can be seen from fig. 1-2, the resonant pressure sensor in the present embodiment includes a sensor housing 100, and a first resonator 110 and a second resonator 120 fixed within the sensor housing 100.
Preferably, the first resonator 110 and the second resonator 120 are embodied as a QCM (Quartz crystal microbalance) structure, which is made of a Quartz crystal, and when an external electric field is applied to the resonator, the Quartz crystal is mechanically deformed, and if an alternating electric field is applied, the Quartz crystal is mechanically deformed, i.e., mechanically vibrated, and when an excitation signal of the applied electric field is equal to a natural frequency of the Quartz crystal, a vibration amplitude of the Quartz crystal is sharply increased, and a piezoelectric resonance is generated, and in the technical field, a frequency at which the Quartz crystal generates the piezoelectric resonance is referred to as a resonance frequency. It is obvious from the above description that the resonant frequency of the quartz resonator can be obtained by connecting the quartz resonator to an appropriate circuit, which is the prior art and will not be described herein.
The natural frequency of the quartz crystal is related to the pressure to which the quartz crystal is subjected. That is to say, when the pressure applied to the resonator changes, the resonant frequency of the resonator changes, and the conventional resonant pressure sensor is applied to the resonant pressure sensor, and the purpose of measuring the pressure is achieved by calibrating the corresponding relationship between the pressure change applied to the quartz crystal and the change of the resonant frequency and measuring the resonant frequency of the quartz crystal. However, when the temperature of the environment in which the quartz crystal is located changes, the resonant frequency of the quartz crystal also changes. When the resonant pressure sensor is used in the fields of aircrafts, marine exploration and the like, the resonant frequency of the resonator is greatly influenced by the temperature due to rapid temperature change in a short time, so that the measurement precision is seriously reduced, in order to solve the problem, the present invention provides a resonant pressure sensor, in which two resonators are disposed in the sensor housing 100, wherein the first resonator 110 is configured to sense pressure changes experienced by the sensor housing 100 and temperature changes within the sensor housing 100, the second resonator 120 is used to sense temperature changes inside the sensor housing 100, and the resonance frequency difference value of the first resonator 110 and the second resonator 120 is calibrated and compensated according to the actual temperature inside the sensor housing 100, so that a resonance type pressure sensor with higher precision is realized.
Specifically, the sensor housing 100 includes a first end cap 130 and a second end cap 140, the first end cap 130 and the second end cap 140 are respectively disposed at two ends of the sensor housing 100, the sensor housing 100 is closed to form a cavity, the first resonator 110 and the second resonator 120 are accommodated in the cavity, and a temperature sensor 150 is fixed in the cavity, it can be seen that, because the sensor housing 110 is a package structure, the first resonator 110, the second resonator 120 and the temperature sensor 150 are located in one cavity, and therefore, the ambient temperatures of the three are the same, and the temperature data obtained by the temperature sensor 150 is the ambient temperature of the first resonator 110 and the second resonator 120.
As shown in fig. 3, in the present embodiment, the first protrusion 101 protrudes from the inside of the sensor housing 100 in the circumferential direction, so that the sidewall of the first protrusion 101 forms an annular supporting surface 102, and the first resonator 110 is disposed on the supporting surface 102, so that when the first resonator 110 is pressed, the contact area with the first protrusion 101 is relatively large, and the first resonator 110 is not easily damaged by pressure. As shown in fig. 2, the first end cap 130 is provided with a second protrusion 131, when the first end cap 130 is assembled on the sensor housing 100, the second protrusion 131 extends into the sensor housing to press and fix the first resonator 110 on the supporting surface 102, so that when the resonant pressure sensor receives a pressure, the pressure is applied to the sensor housing, the first end cap 130 slightly deforms, and the received pressure is transmitted to the first resonator 110.
In order to prevent the machined surface of the first end cap 130 from being uneven, which may cause the pressure on the first resonator 110 not to be evenly distributed, and affect the reliability of the first resonator 110, in this embodiment, a gasket 160 is further disposed between the first resonator 110 and the first end cap 130, so that the first resonator 110 can be uniformly pressed.
It can be seen that the first resonator 110 is exposed in the sensor housing 100, so that the first resonator 110 can sense the temperature change inside the sensor housing 100 in addition to the pressure change received by the resonant pressure sensor. The first resonance frequency of the first resonator 110 is influenced by both the pressure to which the first resonator 110 is subjected and the temperature inside the sensor.
In this embodiment, the second resonator 120 is directly and fixedly connected to the second end cap 140, specifically, in this embodiment, preferably, the second resonator 120 is fixedly attached to the second end cap 140 by gluing, as shown in fig. 4, a third protruding portion 141 is disposed on the second end cap 140, a side wall of the third protruding portion 141 provides a fixing surface 142 of the second resonator 120, and the second resonator 120 is attached to the fixing surface 142 by gluing. Of course, the second resonator 120 may also be fixed to the second end cap 140 by other methods, such as riveting, welding, etc., and the present invention is not limited thereto. Obviously, since the second resonator 120 is fixedly connected to the second end cap 140, the second resonator 120 and the second end cap 140 are integrated, there is no gap therebetween, and no pressure is transmitted, when the resonant pressure sensor is subjected to pressure and the second end cap 140 is deformed by a force, the second resonator 120 moves along with the deformation of the second end cap 140 without being affected by the deformation, that is, the second resonator is not subjected to pressure. Similarly, the second resonator 120 is exposed in the sensor housing 100, and the second resonator 120 can sense the temperature change inside the sensor housing 100. That is, the second resonant frequency of the second resonator 120 is affected only by the ambient temperature.
As shown in fig. 2, in this embodiment, preferably, the second resonator 120 is vertically adhered to the second end cap 140, that is, is vertically disposed to the second end cap 140, on one hand, the distance between the second resonator 120 and the first resonator 110 may be made shorter, so that the difference between the ambient temperatures of the two resonators is smaller, and the measurement result accuracy of the resonant pressure sensor is made higher. On the other hand, the second resonator 120 is vertically arranged, so that the poor connection between the second resonator 120 and the second end cap 140 can be prevented, and when a gap is generated, the deformation of the second end cap 140 may generate pressure on the pressure sensing surface of the second resonator 120, thereby affecting the measurement accuracy of the resonator sensor.
As can be seen from the above description, the first resonant frequency of the first resonator 110 is influenced by the pressure to which the first resonator 110 is subjected and the temperature inside the sensor housing 100, and can be expressed by the formula: f. ofR1-fR1_T1＝fp+ΔT1·TCF1Wherein f isR1At the first resonance frequency, fR1_T1Is a first reference resonance frequency, which is the first resonator 110 at a reference temperature T1The resonant frequency in the absence of any pressure, f, can be obtained by testingR1-fR1_T1Is the overall change in resonant frequency of the first resonator 110, which includes a change in resonant frequency due to pressure and a change in resonant frequency due to temperature, fpIs the pressure-sensitive resonance frequency of the first resonator 110, i.e. the part of the resonance frequency change of the first resonator 110 caused by the pressure, Δ T1Representing the ambient temperature of the first resonator 110 and the reference temperature T1I.e. the current ambient temperature with respect to said reference temperature T1Temperature change data of (TCF)1Is a temperature-sensitive resonance coefficient of the first resonator 110, which is a characteristic value of the first resonator 110, and may not change after the first resonator 110 is processed, and may be obtained through a test after the first resonator 110 is processed, Δ T1·TCF1The first temperature-sensitive resonant frequency of the first resonator 110 is a part of the resonant frequency change of the first resonator 110 caused by the temperature.
While the second resonant frequency of the second resonator 120 is affected only by the temperature inside the sensor housing 100, it can be expressed by the formula: f. ofR2-fR2_T1＝ΔT2·TCF2Wherein f isR2Is the second resonance frequencyRate, fR2_T1Is a second reference resonance frequency, which is the second resonator 120 at a reference temperature T1The resonant frequency in the absence of any pressure, f, can be obtained by testingR2-fR2_T1That is, the overall resonant frequency of the second resonator 120 is changed, and the change in resonant frequency includes only the temperature-induced change in resonant frequency, Δ T2Representing the ambient temperature of the second resonator 120 and the reference temperature T1I.e. the current ambient temperature with respect to said reference temperature T1Temperature change data of (TCF)2Is the temperature-sensitive resonance coefficient of the second resonator 120, which is the characteristic value of the second resonator 120, and may not change after the second resonator 120 is processed, and may be obtained through testing after the second resonator 120 is processed, Δ T2·TCF2The second temperature-sensitive resonant frequency of the second resonator 120, i.e. the resonant frequency of the second resonator 120 changes due to the temperature.
Thus, we can obtain that the difference between the first resonance frequency of the first resonator 110 and the second resonance frequency of the second resonator 120 is: f. ofR1-fR2＝(fR1_T1-fR2_T1)+fp+(ΔT1·TCF1-ΔT2·TCF2) In the resonant pressure sensor provided by the present invention, the first resonator 110 and the second resonator 120 are in the same cavity, so the ambient temperature of the two resonators is the same, and is relative to the reference temperature T1As well as temperature change data, i.e., Δ T1＝ΔT2For convenience of description, Δ T is used collectively. Then, the difference between the first resonant frequency and the second resonant frequency is: f. ofR1-fR2＝(fR1_T1-fR2_T1)+fp+ΔT·(TCF1-TCF2). As can be seen from the formula, the reference resonance frequency of the first resonator 110 and the reference resonance frequency of the second resonator 120 are the same, i.e., the first reference resonance frequency fR1_T1Is equal to the second reference resonance frequency fR2_T1And the first resonator110 and the second resonator 120 have the same sensitivity to temperature, i.e. the temperature-sensitive resonance coefficient TCF of the first resonator 1101And a temperature-sensitive resonance coefficient TCF of the second resonator 1202In the same case, the difference between the first resonant frequency of the first resonator 110 and the second resonant frequency of the second resonator 120 is: f. ofR1-fR2＝fpThat is, the difference between the first resonant frequency and the second resonant frequency represents the pressure-sensitive resonant frequency of the first resonator 110.
However, in practical cases, since it is impossible to have two identical quartz crystals and the characteristics of the first resonator 110 and the second resonator 120 are identical, it is not accurate to simply obtain the difference between the first resonance frequency and the second resonance frequency to obtain the pressure-sensitive resonance frequency of the first resonator 110 and thus the pressure to which the first resonator 110 is subjected. In order to further improve the accuracy of obtaining the pressure applied to the first resonator 110 according to the difference between the resonant frequencies of the first resonator 110 and the second resonator 120, in this embodiment, the temperature sensor 150 is further provided, as described above, the temperature sensor 150 is also provided inside the sensor housing 100, and is located in the same cavity inside the sensor housing 100 as the first resonator 110 and the second resonator 120, and the ambient temperatures of the three are the same, so that the temperature sensor 150 can collect the actual temperature inside the sensor housing 100, and further obtain the actual temperature change data Δ T of the first resonator 110 and the second resonator 120, thereby obtaining the actual temperature change data Δ T of the first resonator 110 and the second resonator 120 according to the formula fR1-fR2＝(fR1_T1-fR2_T1)+fp+ΔT·(TCF1-TCF2) And performing actual temperature compensation calculation on the pressure sensing resonant frequency to obtain a more accurate pressure sensing resonant frequency of the first resonator 110. In this embodiment, the model of the temperature sensor is NST1001, which has the advantages of small size, high accuracy, good stability, and the like, and of course, those skilled in the art may select other models of temperature sensors according to actual situations.
In order to acquire the first resonant frequency, the second resonant frequency and the temperature variation data and output the data to a processor for calculation to obtain the pressure sensing resonant frequency, in this embodiment, as shown in fig. 1-2, the resonant pressure sensor is further provided with three signal pins 170, preferably, the three signal pins 170 are respectively connected to the first resonator 110, the second resonator 120 and the temperature sensor 150, so that the first resonant frequency of the first resonator 110, the second resonant frequency of the second resonator 120 and the ambient temperature in the sensor housing 100 acquired by the temperature sensor 150 can be acquired, and specifically, as described above, the first resonant frequency and the second resonant frequency can be acquired by connecting the first resonator 110 and the second resonator 120 to an appropriate circuit, in this embodiment, the signal pin 170 is connected to the first resonator 110 and the second resonator 120 through a circuit (not shown in the specific measurement circuit) connected to the first resonator 110 and the second resonator 120, so as to obtain the first resonant frequency and the second resonant frequency, the temperature sensor 150 can output the ambient temperature in the sensor housing 100, and the signal pin 170 is connected to the output end of the temperature sensor 150, so as to obtain the ambient temperature in the sensor housing 100 measured by the temperature sensor 150. The signal pin 170 protrudes from an outer surface of the resonant temperature sensor, so that the signal pin 170 can be inserted into a signal interface of a processor connected to the resonant pressure sensor, so as to transmit the first resonant frequency, the second resonant frequency and the ambient temperature to the processor. And the first reference resonance frequency fR1_T1The second reference resonance frequency fR2_T1And a temperature-sensitive resonance coefficient TCF of the first resonator 1101And a temperature-sensitive resonance coefficient TCF of the second resonator 1202May be measured by testing after the first resonator 110 and the second resonator 120 are processed and stored in the processor, and the temperature change may be measured by testingData Δ T is the ambient temperature inside the sensor housing 100 collected by the temperature sensor and the reference temperature T1The difference of (a). Therefore, when the processor receives the first resonant frequency, the second resonant frequency and the ambient temperature, the formula f can be obtainedR1-fR2＝(fR1_T1-fR2_T1)+fp+ΔT·(TCF1-TCF2) The pressure-sensitive resonance frequency of the first resonator 110 is calculated.
The pressure-sensitive resonant frequency and the pressure applied to the first resonator 110 have a corresponding relationship, which is determined by the characteristics of the resonator 110, and the corresponding relationship is determined to be unchanged after the resonator 110 is processed, so that the pressure-sensitive resonant frequency and the pressure applied to the first resonator 110 can be obtained through testing. After the pressure-sensing resonant frequency is obtained, the pressure applied to the first resonator 110 can be obtained according to the corresponding relationship.
And the pressure to which the first resonator 110 is subjected is composed of the assembly pressure and the pressure to which the resonant sensor is subjected. As described above, since the first end cap 130 presses and fixes the first resonator 110, when the resonant sensor is pressed, the pressure is transmitted to the first resonator 110 through the first end cap 130. The assembling pressure is that, in order to ensure that the pressure applied to the resonant sensor can be transmitted to the first resonator 110 through the first end cap 130, in an initial state of the resonant sensor being assembled, the first end cap 130 needs to press the first resonator 110, and this pressure is referred to as assembling pressure. If the pressure to which the resonant sensor is subjected needs to be obtained, the assembly pressure needs to be subtracted from the pressure to which the first resonator 110 is subjected. From the foregoing description, it will be readily apparent that only the formula f is requiredR1-fR2＝(fR1_T1-fR2_T1)+fp+ΔT·(TCF1-TCF2) Placing the resonant pressure sensor at the reference temperature T1Until the ambient temperature inside the sensor housing 100 and the outsideThe ambient temperature is uniform and is also T1When Δ T is 0, the influence of the ambient temperature on the first resonance frequency may be removed, the pressure-sensitive resonance frequency of the first resonator 110 only under the influence of the assembly pressure is obtained, and the assembly pressure is obtained through the pressure-sensitive resonance frequency. The assembly pressure is stored in the processor, and after the processor obtains the pressure applied to the first resonator 110, the external pressure applied to the resonant pressure sensor can be obtained according to the pressure applied to the first resonator 110.
To sum up, the utility model provides a pair of resonant mode pressure sensor, through inside first syntonizer, second syntonizer and the temperature sensor of setting up of sensor housing to it is fixed through simple machinery compresses tightly the method first syntonizer, it is fixed through sticky fixed method the second syntonizer has realized the first resonant frequency of first syntonizer receives pressure and ambient temperature's influence, the second resonant frequency of second syntonizer only receives ambient temperature's influence, and sets up the inside actual ambient temperature of sensor housing is surveyed to temperature sensor, has realized the basis ambient temperature is right first resonant frequency with the difference of second resonant frequency carries out the compensation calculation, has obtained the higher pressure measurement result of precision.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A resonant pressure sensor, comprising: the sensor comprises a sensor shell, a first resonator and a second resonator, wherein the first resonator and the second resonator are fixed inside the sensor shell, the first resonator is used for sensing pressure change borne by the sensor shell and temperature change inside the sensor shell, the second resonator is arranged above the first resonator and is used for sensing temperature change inside the sensor shell, the resonant pressure sensor further comprises a temperature sensor fixed inside the sensor shell, and the temperature sensor is used for collecting the ambient temperature inside the sensor shell.
2. The resonant pressure sensor according to claim 1, wherein the sensor housing comprises a first end cap and a second end cap, the first end cap and the second end cap being respectively disposed at two ends of the sensor housing to enclose the sensor housing to form a cavity.
3. The resonant pressure sensor according to claim 2, wherein the sensor housing inner wall is provided with a first protrusion, the first end cap is provided with a second protrusion, and the first end cap presses the first resonator against a side wall of the first protrusion via the second protrusion.
4. The resonant pressure sensor according to claim 3, wherein a spacer is further disposed between the first end cap and the first resonator.
5. The resonant pressure sensor of claim 2, wherein the second resonator is fixedly attached to the second end cap.
6. The resonant pressure sensor according to claim 5, wherein the second end cap has a third protrusion, and the second resonator is fixed to a sidewall of the third protrusion.
7. The resonant pressure sensor of claim 6, wherein the second resonator is disposed perpendicular to the second end cap.
8. The resonant pressure sensor according to claim 2, further comprising sensor pins respectively connected to the first resonator, the second resonator, and the temperature sensor, for transmitting the first resonant frequency of the first resonator and the second resonant frequency of the second resonator and the ambient temperature inside the sensor housing collected by the temperature sensor to a processor connected to the resonant pressure sensor.
9. The resonant pressure sensor according to claim 8, wherein the sensor pin protrudes from an outer surface of the pressure sensor.
10. The resonant pressure sensor according to claim 1, wherein the temperature sensor is of type NST 1001.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115452215A (en) * | 2022-09-15 | 2022-12-09 | 深圳大学 | Thermal stress measurement method of nano-cavity opto-mechanical resonator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115452215A (en) * | 2022-09-15 | 2022-12-09 | 深圳大学 | Thermal stress measurement method of nano-cavity opto-mechanical resonator |
| CN115452215B (en) * | 2022-09-15 | 2023-07-25 | 深圳大学 | Thermal stress measurement method of nano-cavity opto-mechanical resonator |
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Effective date of registration: 20211126 Address after: 518000 1403, building A1, building A1, Guangming Science Park, China Merchants Group, sightseeing Road, Fenghuang community, Fenghuang street, Guangming District, Shenzhen, Guangdong Patentee after: Huiyuen Technology (Shenzhen) Co.,Ltd. Address before: 518060 No. 3688 Nanhai Road, Shenzhen, Guangdong, Nanshan District Patentee before: SHENZHEN University |