CN111928771A - Strain detection device and strain detection method - Google Patents
Strain detection device and strain detection method Download PDFInfo
- Publication number
- CN111928771A CN111928771A CN202010783159.0A CN202010783159A CN111928771A CN 111928771 A CN111928771 A CN 111928771A CN 202010783159 A CN202010783159 A CN 202010783159A CN 111928771 A CN111928771 A CN 111928771A
- Authority
- CN
- China
- Prior art keywords
- strain
- signal processing
- processing module
- strain sensing
- sensing module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Abstract
The invention relates to the technical field of mechanical quantity detection, in particular to a strain detection device and a strain detection method. The strain detection device comprises a substrate, a detection assembly and an output terminal, wherein the substrate is configured to be mounted on a carrier to be detected; the detection assembly is fixed on the substrate and comprises a strain sensing module and a signal processing module which are arranged at intervals, and the strain sensing module is electrically connected with the signal processing module; one end of the output terminal is fixed on the substrate and electrically connected with the signal processing module, and the other end of the output terminal is configured to be electrically connected with an external controller. According to the strain detection device, the strain sensing module and the signal processing module are both arranged on the tested carrier, so that the signal transmission distance between the strain sensing module and the signal processing module is shortened, and the attenuation and interference in the signal transmission process are reduced; the strain sensing module and the signal processing module are arranged at intervals, so that the influence of heat generated by the signal processing module on the strain sensing module is reduced, and the accuracy and reliability of a detection result are improved.
Description
Technical Field
The invention relates to the technical field of mechanical quantity detection, in particular to a strain detection device and a strain detection method.
Background
The strain sensing chip is used for measuring strain generated by the mechanical component stressed deformation and converting the change of the strain on the mechanical component into resistance change. In the prior art, usually, a strain gauge (mostly a metal strain gauge) is fixed on a measured carrier, and then the strain gauge is electrically connected with an external circuit board, and then a detection signal of the strain gauge is amplified and subjected to AD conversion, so that detection data can be obtained. Because the space transmission distance from the strain gauge to the external circuit board is long, the signal transmission process is easy to attenuate or is interfered by the outside, the accuracy of the detection result is influenced, and in the signal amplification process, the noise and the interference can be amplified, so that the acquisition of real signals is not facilitated. In addition, since the strain gauge is very sensitive to temperature changes, when the ambient temperature changes, the resistance of the strain gauge changes, which easily causes adverse effects on the measurement result and affects the accuracy of the detection result.
Therefore, a strain detection device is needed to solve the above problems.
Disclosure of Invention
An object of the present invention is to provide a strain detection apparatus, which can reduce attenuation and external interference in a signal transmission process, reduce the influence of self-heat generation on a detection result, and improve accuracy and reliability of the detection result.
Another objective of the present invention is to provide a strain detection method, which can reduce interference in the signal transmission process, reduce the influence of self-generated heat on the detection result, and improve the accuracy and reliability of the detection result.
In order to realize the purpose, the following technical scheme is provided:
in one aspect, a strain detection apparatus is provided, including:
a substrate configured to be mounted on a carrier under test;
the detection assembly is fixed on the substrate and comprises a strain sensing module and a signal processing module which are arranged at intervals, and the strain sensing module is electrically connected with the signal processing module;
and an output terminal having one end fixed to the substrate and electrically connected to the signal processing module and the other end configured to be electrically connected to an external controller.
As an alternative to the strain detection device, the strain sensing module includes a temperature detection element, and the temperature detection element is configured to detect the temperature of the strain sensing module and transmit the detection result to the signal processing module.
As an alternative of the strain detection device, the strain sensing module further includes sensing resistors, and the four sensing resistors are connected to form a wheatstone bridge.
As an alternative to the strain detection device, the strain detection device further includes a package that is adhesively fixed to the substrate and covers the detection unit and a portion of the output terminal that is connected to the signal processing module.
As an alternative to the strain detection means, the package comprises:
the first packaging part is arranged around the detection assembly, covers the part of the output terminal connected with the signal processing module and is formed by high-strength glue;
and the second packaging part is filled in the area surrounded by the first packaging part and is formed by a material with low thermal expansion coefficient and low curing stress.
As an alternative to the strain detection apparatus, the output terminal includes a circuit board and a contact terminal, one end of the circuit board is fixed on the substrate and electrically connected to the signal processing module, the other end of the circuit board is fixedly connected to the contact terminal, and the contact terminal is configured to be connected to an external controller.
As an alternative to the strain detection means, the circuit board is a flexible circuit board.
As an alternative to the strain detection device, the minimum distance between the strain sensing module and the signal processing module is greater than 0.1mm and less than 1 mm.
In another aspect, a strain detection method is provided, which includes the following steps:
pre-fixing an output terminal on a substrate;
fixing a strain sensing module and a signal processing module on the substrate at intervals, electrically connecting the strain sensing module and the signal processing module by adopting a first lead, and electrically connecting the signal processing module and one end of the output terminal by adopting a second lead;
packaging the strain sensing module, the signal processing module, the first lead and the second lead by using packaging materials;
and fixing the substrate on a tested carrier, and connecting the other end of the output terminal to an external controller so as to detect the mechanical quantity of the tested carrier.
As an alternative to the strain detection method, the encapsulation with the encapsulating material comprises the steps of:
and forming a cofferdam shape around the strain sensing module and the signal processing module by adopting high-strength glue, and then filling the cofferdam by adopting a low-thermal expansion coefficient and low-curing stress material.
As an alternative to the strain detection method, a temperature detection element for detecting the temperature of the strain sensing module is integrated on the strain sensing module, and the signal processing module can perform temperature compensation on a signal processed by the temperature detection element according to the detection result of the temperature detection element.
Compared with the prior art, the invention has the beneficial effects that:
the strain detection device comprises a substrate, a detection assembly and an output terminal, wherein a strain sensing module and a signal processing module are both arranged on a tested carrier, so that the signal transmission distance between the strain sensing module and the signal processing module is shortened, and the attenuation and interference in the signal transmission process are reduced; the strain sensing module and the signal processing module are arranged at intervals, so that the influence of heat generated by the signal processing module on the strain sensing module is reduced, and the accuracy and reliability of a detection result are improved.
The strain detection method provided by the invention can reduce the interference in the signal transmission process, reduce the influence of self heat generation on the detection result and improve the accuracy and reliability of the detection result.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is an exploded view of a strain detection device and a carrier under test according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a strain detection device (with a package removed) according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of a strain sensing device (with the package removed) provided in accordance with an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a strain detection apparatus according to an embodiment of the present invention;
fig. 5 is a cross-sectional view of a strain detecting device according to an embodiment of the present invention.
Reference numerals:
100-a test carrier; 200-fixing glue;
1-a substrate;
2-a detection component; 21-a strain sensing module; 211-temperature sensing element; 212-sense resistance; 22-a signal processing module;
3-an output terminal; 31-a circuit board; 32-contact terminals;
4-packaging; 41-a first encapsulation; 42-a second encapsulation;
5-a first wire;
6-second conductive line.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when the product is used, and are only for convenience of description of the present invention, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", and the like are used for descriptive purposes only or to distinguish between different structures or components and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-2, the present embodiment provides a strain detection apparatus including a substrate 1, a detection member 2, and an output terminal 3, the substrate 1 being configured to be mounted on a carrier 100 under test; the detection assembly 2 is fixed on the substrate 1, the detection assembly 2 comprises a strain sensing module 21 and a signal processing module 22 which are arranged at intervals, and the strain sensing module 21 is electrically connected with the signal processing module 22; one end of the output terminal 3 is fixed on the substrate 1 and electrically connected to the signal processing module 22, and the other end thereof is configured to be electrically connected to an external controller.
On one hand, the strain sensing module 21 and the signal processing module 22 are both arranged on the tested carrier 100, so that the signal transmission distance between the strain sensing module 21 and the signal processing module 22 is shortened, and the attenuation and interference in the signal transmission process are reduced; on the other hand, the strain sensing module 21 and the signal processing module 22 are arranged at intervals to reduce the power consumption of the strain sensing module 21, and simultaneously, the influence of the heat generated by the signal processing module 22 on the strain sensing module 21 is reduced, and the accuracy and reliability of the detection result are improved.
The principle of the strain detection device is as follows: the strain sensing module 21 is fixed on the substrate 1, the substrate 1 is fixed on the tested carrier 100, when the tested carrier 100 is stressed and deformed, the deformation is transmitted to the strain sensing module 21 through the substrate 1, the resistance in the strain sensing module 21 changes due to the piezoresistive effect, the change of the resistance is sensed through a circuit, the change of the mechanical quantity is converted into an analog signal, the analog signal is transmitted to the signal processing module 22, the analog signal is processed by the signal processing module 22, and the analog signal is converted into a digital signal to be output.
Preferably, the strain detecting device can be used for detecting the tensile force, the pressure force, the bending moment or the torque applied to the tested carrier 100. For example, when the strain detection apparatus is used for detecting the torque of the tested carrier 100, the strain sensing module 21 and the tested carrier 100 are arranged at an included angle of 45 °, which can improve the sensitivity of the strain sensing module 21. For example, when the strain detection apparatus is used for detecting the tensile force of the object to be detected 100, the strain sensing module 21 is disposed in parallel with the object to be detected 100, so that the sensitivity of the strain sensing module 21 can be improved.
Further, the substrate 1 is fixed to the object 100 by a fixing adhesive 200.
As shown in fig. 3 in conjunction with fig. 2, the strain sensing module 21 includes a temperature detecting element 211, and the temperature detecting element 211 is used for detecting the temperature of the strain sensing module 21 and transmitting the detection result to the signal processing module 22. The signal processing module 22 can perform temperature compensation on the processed signal according to the detection result of the temperature detection element 211 to improve the detection accuracy and reliability of the strain detection device.
Specifically, since the thermal expansion coefficient of the strain sensing module 21 is different from the thermal expansion coefficient of the tested carrier 100 and the thermal expansion coefficient of the adhesive used for adhering and fixing the strain sensing module 21, when the temperature changes, the strain may be generated, and the strain detection apparatus outputs the strain value, i.e. the temperature zero drift, which affects the detection accuracy of the strain detection apparatus. Therefore, the temperature of the strain sensing module 21 can be detected in real time by the temperature detecting element 211, and the temperature strain calibration is performed on the strain sensing module 21 in an early stage, so that the influence of the temperature zero drift can be eliminated, and the signal output by the strain detecting device is ensured to be derived from the strain generated by the stress of the tested carrier 100, but not the strain generated by the temperature action. Illustratively, the temperature detecting element 211 may be an NTC temperature sensor, or a PTC thermistor, or a triode (using the PN thermal characteristics of the triode).
Optionally, as shown in fig. 3, the strain sensing module 21 further includes sensing resistors 212, and the four sensing resistors 212 are connected to form a wheatstone bridge, so as to improve the sensitivity of the strain sensing module 21. The sensing resistor 212 and the bridge circuit are integrated on one module, so that errors and interference caused by the bridge circuit building circuit are avoided.
In the high-sensitivity strain detection device provided in this embodiment, the detection principle of the sense resistor 212 is based on the semiconductor piezoresistive effect, the strain detection sensitivity of the sense resistor is several tens times that of the metal thin film strain gauge, and the analog signal on the bridge circuit can be directly subjected to AD conversion almost without amplification, thereby improving the accuracy and reliability of the detection result.
In addition, the resistances of the four sensing resistors 212 are equal, and two adjacent sensing resistors 212 in the four sensing resistors 212 are vertically arranged, when the tested carrier 100 is not deformed by a force, the signal output is 0, and when the tested carrier 100 is strained, the bridge is unbalanced, and the signal output is not 0.
In the present embodiment, the integration of the sensing resistor 212 and the temperature detecting element 211 in the strain sensing module 21 can compensate the temperature of the detected result, improve the accuracy of the measured result,
the temperature compensation principle is as follows: firstly, under the action of different temperatures under the load of 0, the strain detection device reads the measured value N (the measured value can be a torque value, a tension value, a pressure value and the like), and fits the data, so that a relational expression T of the temperature value T and the measured value N (a) N2 + b N + c can be obtained, and a, b and c are fitting coefficients. Thereby determining the zero point of the strain gauge at different temperatures. In actual work, a zero point can be calculated according to the temperature points read in real time, and the actual loading torque is obtained by subtracting the zero point from the measured torque value.
Further, in calibration, 10 points were taken for the operating temperature and 10 points were taken for the measured value. The set of 10 x 10 data points was fitted to a working surface. In actual operation, each measured measurement point and temperature point can correspond to an actual measurement value, so that zero drift and gain drift caused by temperature can be compensated.
Optionally, the minimum distance between the strain sensing module 21 and the signal processing module 22 is greater than 0.1mm and smaller than 1mm, so that signal transmission attenuation and external interference are reduced, and meanwhile, the influence of heat generated by the signal processing module 22 on the resistance of the strain sensing module 21 is avoided; in addition, the binding process of the wire can be conveniently realized.
Preferably, the strain sensing module 21 is fixed at an intermediate position of the substrate 1 to reduce the mounting stress.
Alternatively, the strain sensing module 21 is fixedly bonded to the substrate 1 by glue.
As shown in fig. 4-5, the strain detection device further includes a package 4, the package 4 is fixed on the substrate 1 in an adhering manner, and the package 4 covers the detection assembly 2 and the portion of the output terminal 3 connected to the signal processing module 22, so as to protect the electrical connection inside the detection assembly 2 and the electrical connection between the output terminal 3 and the signal processing module 22, thereby ensuring the stability of the strain detection device.
Optionally, the package 4 includes a first package portion 41 and a second package portion 42, the first package portion 41 is disposed around the detection assembly 2, the first package portion 41 covers a portion of the output terminal 3 connected to the signal processing module 22, and the first package portion 41 is formed by high-strength glue; the second encapsulating portion 42 is filled in a region surrounded by the first encapsulating portion 41, and the second encapsulating portion 42 is formed of a low thermal expansion coefficient and low stress material. Through the cooperation of first encapsulation portion 41 and second encapsulation portion 42, can realize high reliability and low solidification stress encapsulation, can enough guarantee to fix detection element 2 on base plate 1 steadily, avoid packaging material to the influence of module performance again, realize the protection to module and wire.
Alternatively, as shown in fig. 4 in conjunction with fig. 2, the output terminal 3 includes a circuit board 31 and a contact terminal 32, one end of the circuit board 31 is fixed on the substrate 1 and electrically connected to the signal processing module 22, the other end of the circuit board 31 is fixedly connected to the contact terminal 32, and the contact terminal 32 is configured to be connected to an external controller. Illustratively, the circuit board 31 is a flexible circuit board, and the flexible feature of the circuit board 31 can be compatible with the installation requirements of different positions.
Optionally, the contact terminals 32 are pluggable onto the external controller for easy and quick installation of the later connection. As shown in fig. 4 to 5, the present embodiment further provides a strain detection method, including the following steps:
s1, pre-fixing the output terminal 3 on the substrate 1;
s2, fixing the strain sensing module 21 and the signal processing module 22 on the substrate 1 at intervals, electrically connecting the strain sensing module 21 and the signal processing module 22 by using the first wire 5, and electrically connecting the signal processing module 22 and one end of the output terminal 3 by using the second wire 6;
s3, packaging the strain sensing module 21, the signal processing module 22, the first lead 5 and the second lead 6 by packaging materials;
s4, after the above steps are completed, the substrate 1 is fixed to the object 100, and the other end of the output terminal 3 is connected to an external controller to detect the dynamic quantity of the object 100.
The strain detection method can reduce the interference of the signal transmission process, reduce the influence of self heat generation on the detection result, and improve the accuracy and reliability of the detection result.
Specifically, in step S2, the electrode terminal of the strain sensing module 21 and the electrode terminal of one end of the signal processing module 22 are electrically rung by using the first wire 5, and the electrode terminal of the other end of the signal processing module 22 and the electrode terminal of one end of the output terminal 3 are electrically connected by using the second wire 6. In step S4, one surface of the substrate 1 is fixed to the test object 100.
Optionally, step S3 includes the steps of:
the strain sensing module 21 and the signal processing module 22 are surrounded by high-strength glue to form a cofferdam shape, and then the cofferdam is filled with a low-thermal expansion coefficient and low-curing stress material, so that the high-reliability and low-curing stress packaging is realized, and the strain sensing module 21, the signal processing module 22, the first lead 5 and the second lead 6 are better protected.
Optionally, a temperature detection element 211 for detecting the temperature of the strain sensing module 21 is integrated on the strain sensing module 21, and the signal processing module 22 can perform temperature compensation on a signal processed by the temperature detection element 211 according to a detection result of the temperature detection element 211, so as to improve accuracy of a detection result of the strain detection method.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (11)
1. A strain sensing device, comprising:
a substrate (1) configured to be mounted on a carrier (100) under test;
the detection assembly (2) is fixed on the substrate (1), the detection assembly (2) comprises a strain sensing module (21) and a signal processing module (22) which are arranged at intervals, and the strain sensing module (21) is electrically connected with the signal processing module (22);
and an output terminal (3) having one end fixed to the substrate (1) and electrically connected to the signal processing module (22), and the other end configured to be electrically connected to an external controller.
2. The strain detection device according to claim 1, wherein the strain sensing module (21) comprises a temperature detection element (211), and the temperature detection element (211) is used for detecting the temperature of the strain sensing module (21) and transmitting the detection result to the signal processing module (22).
3. The strain sensing device according to claim 1, wherein the strain sensing module (21) further comprises sensing resistors (212), and four sensing resistors (212) are connected in a wheatstone bridge.
4. The strain detection device according to claim 1, further comprising a package (4), wherein the package (4) is fixed on the substrate (1) by bonding, and the package (4) covers the detection assembly (2) and the portion of the output terminal (3) connected to the signal processing module (22).
5. The strain detection device according to claim 4, wherein the package (4) comprises:
the first packaging part (41) is arranged around the detection assembly (2), the first packaging part (41) covers the part, connected with the signal processing module (22), of the output terminal (3), and the first packaging part (41) is formed by high-strength glue;
and the second packaging part (42) is filled in the area surrounded by the first packaging part (41), and the second packaging part (42) is formed by a material with a low thermal expansion coefficient and a low curing stress.
6. The strain detection device according to any one of claims 1 to 5, wherein the output terminal (3) comprises a circuit board (31) and a contact terminal (32), one end of the circuit board (31) is fixed on the substrate (1) and electrically connected with the signal processing module (22), the other end of the circuit board (31) is fixedly connected with the contact terminal (32), and the contact terminal (32) is configured to be connected to an external controller.
7. The strain detection device according to claim 6, wherein the circuit board (31) is a flexible circuit board.
8. Strain gauge according to any of claims 1-5, wherein the minimum distance between the strain sensing module (21) and the signal processing module (22) is larger than 0.1mm and smaller than 1 mm.
9. A strain detection method is characterized by comprising the following steps:
pre-fixing an output terminal (3) on a substrate (1);
fixing a strain sensing module (21) and a signal processing module (22) on the substrate (1) at intervals, electrically connecting the strain sensing module (21) with the signal processing module (22) by adopting a first lead (5), and electrically connecting the signal processing module (22) with one end of the output terminal (3) by adopting a second lead (6);
encapsulating the strain sensing module (21), the signal processing module (22), the first lead (5) and the second lead (6) with an encapsulating material;
a substrate (1) is fixed on a carrier (100) to be measured, and the other end of an output terminal (3) is connected to an external controller to detect a mechanical quantity of the carrier (100) to be measured.
10. The strain sensing method of claim 9, wherein encapsulating with an encapsulating material comprises the steps of:
and forming a cofferdam shape around the strain sensing module (21) and the signal processing module (22) by adopting high-strength glue, and then filling the cofferdam by adopting a material with low thermal expansion coefficient and low curing stress.
11. The strain detection method according to claim 9, wherein a temperature detection element (211) for detecting the temperature of the strain sensing module (21) is integrated on the strain sensing module (21), and the signal processing module (22) is capable of performing temperature compensation on a signal processed by the temperature detection element (211) according to a detection result of the temperature detection element (211).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783159.0A CN111928771A (en) | 2020-08-06 | 2020-08-06 | Strain detection device and strain detection method |
| PCT/CN2021/104956 WO2022028193A1 (en) | 2020-08-06 | 2021-07-07 | Strain measurement apparatus and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010783159.0A CN111928771A (en) | 2020-08-06 | 2020-08-06 | Strain detection device and strain detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111928771A true CN111928771A (en) | 2020-11-13 |
Family
ID=73307180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010783159.0A Pending CN111928771A (en) | 2020-08-06 | 2020-08-06 | Strain detection device and strain detection method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111928771A (en) |
| WO (1) | WO2022028193A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113465529A (en) * | 2021-08-31 | 2021-10-01 | 武汉飞恩微电子有限公司 | Chip strain measurement method and system based on visual identification |
| CN113654635A (en) * | 2021-08-13 | 2021-11-16 | 中车青岛四方机车车辆股份有限公司 | Weighing system and device for magnetic levitation vehicle |
| WO2022028193A1 (en) * | 2020-08-06 | 2022-02-10 | 广东高标电子科技有限公司 | Strain measurement apparatus and manufacturing method therefor |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1122631A (en) * | 1993-05-05 | 1996-05-15 | 罗斯蒙德公司 | Strain gage sensor with integral temperature signal |
| JPH08292065A (en) * | 1995-04-21 | 1996-11-05 | Kyowa Electron Instr Co Ltd | Compensation circuit of transient temperature characteristic in strain gauge type converter and its compensation method |
| JP2002504674A (en) * | 1998-02-20 | 2002-02-12 | テクスカン・インコーポレーテッド | Grasping force measurement sensor |
| US20100192697A1 (en) * | 2005-02-14 | 2010-08-05 | Hiroyuki Ohta | Rotating body dynamic quantity measuring device and system |
| CN102565309A (en) * | 2011-12-12 | 2012-07-11 | 上海兰宝传感科技股份有限公司 | Equipment and method for detecting burst tendency of glass of curtain wall |
| WO2013128643A1 (en) * | 2012-03-02 | 2013-09-06 | 株式会社日立製作所 | Mechanical quantity measurement device |
| CN205141013U (en) * | 2015-11-05 | 2016-04-06 | 深圳市未林森科技有限公司 | LED lamp encloses gluey packaging structure and LED lamp |
| CN108027291A (en) * | 2015-09-30 | 2018-05-11 | 日立汽车系统株式会社 | Mechanical measurement device and use its pressure sensor |
| EP3499204A1 (en) * | 2017-12-14 | 2019-06-19 | Koninklijke Philips N.V. | An apparatus for determining a force applied thereto |
| CN110146201A (en) * | 2019-04-13 | 2019-08-20 | 复旦大学 | A kind of transducing signal conditioning system and temperature-compensation method with temperature-compensating |
| CN209617354U (en) * | 2018-12-04 | 2019-11-12 | 杭州骑客智能科技有限公司 | Pressure acquisition circuit and human-computer interaction body-sensing vehicle |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4329478B2 (en) * | 2003-10-06 | 2009-09-09 | 株式会社日立製作所 | Mechanical quantity measuring device |
| CN201449300U (en) * | 2009-07-17 | 2010-05-05 | 昆山诺金传感技术有限公司 | Programmable pressure sensor |
| CN109084926A (en) * | 2018-08-08 | 2018-12-25 | 武汉理工大学 | Torque of rotating shaft measurement method and system based on wireless technology |
| CN109186819B (en) * | 2018-09-10 | 2021-09-28 | 上海平脉科技有限公司 | MEMS pressure sensor module |
| CN110595655A (en) * | 2019-10-22 | 2019-12-20 | 广东高标电子科技有限公司 | Electric bicycle torque detection device and electric bicycle |
| CN111928771A (en) * | 2020-08-06 | 2020-11-13 | 广东高标电子科技有限公司 | Strain detection device and strain detection method |
-
2020
- 2020-08-06 CN CN202010783159.0A patent/CN111928771A/en active Pending
-
2021
- 2021-07-07 WO PCT/CN2021/104956 patent/WO2022028193A1/en active Application Filing
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1122631A (en) * | 1993-05-05 | 1996-05-15 | 罗斯蒙德公司 | Strain gage sensor with integral temperature signal |
| JPH08292065A (en) * | 1995-04-21 | 1996-11-05 | Kyowa Electron Instr Co Ltd | Compensation circuit of transient temperature characteristic in strain gauge type converter and its compensation method |
| JP2002504674A (en) * | 1998-02-20 | 2002-02-12 | テクスカン・インコーポレーテッド | Grasping force measurement sensor |
| US20100192697A1 (en) * | 2005-02-14 | 2010-08-05 | Hiroyuki Ohta | Rotating body dynamic quantity measuring device and system |
| CN102565309A (en) * | 2011-12-12 | 2012-07-11 | 上海兰宝传感科技股份有限公司 | Equipment and method for detecting burst tendency of glass of curtain wall |
| WO2013128643A1 (en) * | 2012-03-02 | 2013-09-06 | 株式会社日立製作所 | Mechanical quantity measurement device |
| CN108027291A (en) * | 2015-09-30 | 2018-05-11 | 日立汽车系统株式会社 | Mechanical measurement device and use its pressure sensor |
| CN205141013U (en) * | 2015-11-05 | 2016-04-06 | 深圳市未林森科技有限公司 | LED lamp encloses gluey packaging structure and LED lamp |
| EP3499204A1 (en) * | 2017-12-14 | 2019-06-19 | Koninklijke Philips N.V. | An apparatus for determining a force applied thereto |
| CN209617354U (en) * | 2018-12-04 | 2019-11-12 | 杭州骑客智能科技有限公司 | Pressure acquisition circuit and human-computer interaction body-sensing vehicle |
| CN110146201A (en) * | 2019-04-13 | 2019-08-20 | 复旦大学 | A kind of transducing signal conditioning system and temperature-compensation method with temperature-compensating |
Non-Patent Citations (2)
| Title |
|---|
| 倪丽珺等: "《电子技能实训教程》", 31 May 2016 * |
| 张建强等: "《电子电路设计与实践》", 31 January 2019 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022028193A1 (en) * | 2020-08-06 | 2022-02-10 | 广东高标电子科技有限公司 | Strain measurement apparatus and manufacturing method therefor |
| CN113654635A (en) * | 2021-08-13 | 2021-11-16 | 中车青岛四方机车车辆股份有限公司 | Weighing system and device for magnetic levitation vehicle |
| CN113465529A (en) * | 2021-08-31 | 2021-10-01 | 武汉飞恩微电子有限公司 | Chip strain measurement method and system based on visual identification |
| CN113465529B (en) * | 2021-08-31 | 2021-11-23 | 武汉飞恩微电子有限公司 | Chip strain measurement method and system based on visual identification |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022028193A1 (en) | 2022-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111928771A (en) | Strain detection device and strain detection method | |
| EP0354479B1 (en) | Semiconductor pressure sensor | |
| US6003380A (en) | Strain gage pressure sensor wherein a gap is maintained between the diaphragm and the substrate | |
| US8631708B2 (en) | Apparatus and method for minimizing drift of a piezo-resistive pressure sensor due to the progressive release of mechanical stress over time | |
| CN107445133B (en) | Compact load cell device with low sensitivity to thermo-mechanical package stress | |
| CN101983303B (en) | Pressure-measuring glow plug | |
| US20090288484A1 (en) | Integrated mechanical package design for combi sensor apparatus | |
| US10768069B2 (en) | Pressure measuring device for protection of pressure sensor from thermomechanical stress | |
| US7597005B2 (en) | Pressure sensor housing and configuration | |
| CN105953970A (en) | Packaged sensor with multiple sensors elements | |
| JPH06102116A (en) | Process state detector, semiconductor sensor and process state display device | |
| CN111238698A (en) | Built-in self-testing device and testing method of MEMS piezoresistive sensor | |
| US8552514B2 (en) | Semiconductor physical quantity sensor | |
| KR101808928B1 (en) | Strain transmitter | |
| US20040226373A1 (en) | Acceleration sensor device | |
| RU2392592C1 (en) | Pressure sensor | |
| EP3332702B1 (en) | Method of inspecting pressure pulse wave sensor, and method of manufacturing pressure pulse wave sensor | |
| KR102179016B1 (en) | Loadcell With Semiconductor Strain Gauge | |
| US11344207B2 (en) | Pressure pulse wave sensor and biological information measurement device | |
| EP3660476B1 (en) | Cost overmolded leadframe force sensor with multiple mounting positions | |
| JPH109979A (en) | Type pressure detector | |
| CN115096481A (en) | Universal adjusting method for high-precision quartz sensor wafer | |
| CN216246925U (en) | MEMS pressure sensor chip capable of reducing output drift | |
| Divay et al. | Highly sensitive force sensor featuring a MEMS-instrumented buckling lamella | |
| CN116222844A (en) | Leadless packaging pressure sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201113 |
|
| RJ01 | Rejection of invention patent application after publication |