CN116222844A - Leadless packaging pressure sensor - Google Patents

Leadless packaging pressure sensor Download PDF

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Publication number
CN116222844A
CN116222844A CN202310249894.7A CN202310249894A CN116222844A CN 116222844 A CN116222844 A CN 116222844A CN 202310249894 A CN202310249894 A CN 202310249894A CN 116222844 A CN116222844 A CN 116222844A
Authority
CN
China
Prior art keywords
chip
pressure sensor
electrically connected
circuit board
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310249894.7A
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Chinese (zh)
Inventor
董奎
刘世林
徐林鹏
李晶晶
王淞立
赵虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xi'an Siwei Sensor Technology Co ltd
Original Assignee
Xi'an Siwei Sensor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xi'an Siwei Sensor Technology Co ltd filed Critical Xi'an Siwei Sensor Technology Co ltd
Priority to CN202310249894.7A priority Critical patent/CN116222844A/en
Publication of CN116222844A publication Critical patent/CN116222844A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • G01L1/2262—Measuring circuits therefor involving simple electrical bridges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The application relates to a leadless packaged pressure sensor, comprising: the thick film circuit board is used for bearing the chip substrate; a chip substrate for mounting a chip; the chip substrate is arranged on the thick film circuit board and is electrically connected with the thick film circuit board; the chip is used for detecting pressure; the chip is arranged on the chip substrate and is electrically connected with the chip substrate; a protective cover for protecting the chip; the protective cover is arranged on the chip. According to the leadless packaging pressure sensor, chip electrical connection can be achieved without using lead connection, and reliability is improved; the chip protection can be completed without external parts and auxiliary materials, so that the volume is effectively reduced; the whole material can endure a wide temperature range, and the adaptability of the product is improved.

Description

Leadless packaging pressure sensor
Technical Field
The application relates to the field of pressure sensors, in particular to a leadless packaging pressure sensor.
Background
The pressure sensor is widely applied to the fields of aerospace, industrial control, automobile electronics and the like, and the piezoresistive pressure chip based on MEMS (micro-mechanical system) has the characteristics of high precision, low cost, good stability and the like. The traditional pressure sensor cannot meet the requirements of the system on high temperature resistance and high reliability of the sensor due to the limitations of the working principle, the structure, the packaging form and the like, and new design and process research on the structure, the packaging form and the like of the pressure sensor are urgently needed, namely, special structures and manufacturing processes are adopted to improve the performance of the pressure sensor.
The leadless package has the characteristics of small creep, strong anti-vibration and shock resistance, good stability, high reliability and the like because the lead connection in the traditional pressure welding leads is canceled, and the leadless package becomes the necessary trend of the application of the pressure sensing device package in various severe environments in the future. In terms of high temperature resistant pressure sensor structure lead packaging, a traditional pressure sensor generally uses gold wires or silicon aluminum wires to realize the connection of a chip and an external lead through methods such as thermal compression ball bonding, ultrasonic ball bonding and the like. Wire bonding is prone to failure during processing and device use, which can have a significant impact on device reliability. In order to solve the problem of lead fracture in the working process of the sensor, improve the vibration resistance of the sensor, glue is applied and reinforced at a pressure welding point, meanwhile, in order to protect the surface of a pressure chip, the inner potting glue after the enclosure is covered by the shell is also used for protection, the applied and potted glue can be aged in a wide temperature range for long-term working so as to influence the performance of the sensor, and the whole protection scheme implementation process is increased in volume, so that improvement is needed.
Disclosure of Invention
To solve or at least partially solve the above technical problems, the present application provides a leadless packaged pressure sensor.
In a first aspect, the present application provides a leadless packaged pressure sensor comprising:
the thick film circuit board is used for bearing the chip substrate;
a chip substrate for mounting a chip; the chip substrate is arranged on the thick film circuit board and is electrically connected with the thick film circuit board;
the chip is used for detecting pressure; the chip is arranged on the chip substrate and is electrically connected with the chip substrate;
a protective cover for protecting the chip; the protective cover is arranged on the chip.
Preferably, the thick film circuit board is provided with a first through hole.
Preferably, a second through hole is formed in the chip substrate, and the first through hole and the second through hole are in butt joint.
Preferably, a first bonding pad is arranged on the top surface of the thick film circuit board, and the first bonding pad is electrically connected with the chip substrate.
Preferably, a metal through hole is arranged on the chip substrate in a penetrating manner, the bottom end of the metal through hole is electrically connected with the first bonding pad, and the top end of the metal through hole is electrically connected with the chip.
Preferably, a second bonding pad is arranged on the bottom surface of the chip, and the second bonding pad is electrically connected with the top end of the metal through hole.
Preferably, a third bonding pad is arranged on the bottom surface of the thick film circuit board, and the third bonding pad is used for being electrically connected with external equipment.
Preferably, a fourth bonding pad is disposed on the top surface of the chip, and the fourth bonding pad is electrically connected with the third bonding pad.
Preferably, a membrane is disposed on the top surface of the chip, and the membrane is electrically connected with the fourth bonding pad.
Preferably, a vacuum cavity is formed between the protective cover and the top surface of the chip.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
according to the leadless packaging pressure sensor, chip electrical connection can be achieved without using lead connection, and reliability is improved; the chip protection can be completed without external parts and auxiliary materials, so that the volume is effectively reduced; the whole material can endure a wide temperature range, and the adaptability of the product is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a leadless packaged pressure sensor according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a leadless packaged pressure sensor according to an embodiment of the present application
Fig. 3 is a schematic circuit diagram of a leadless packaged pressure sensor according to an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
Fig. 1 is a schematic structural diagram of a leadless packaged pressure sensor according to an embodiment of the present application.
The application provides a leadless packaged pressure sensor, comprising:
a thick film circuit board 1 for carrying a chip substrate 2;
a chip substrate 2 for mounting a chip 3; the chip substrate 2 is arranged on the thick film circuit board 1 and is electrically connected with the thick film circuit board;
a chip 3 for detecting pressure; the chip 3 is disposed on the chip substrate 2 and electrically connected thereto;
a protective cover 4 for protecting the chip 3; the protective cover 4 is arranged on the chip 3.
When the leadless packaging pressure sensor is used, the thick film circuit board 1 is arranged at a fixed position and is electrically connected with the outside, so that power supply is realized; the chip 3 is now also electrically connected to the thick film circuit board 1 via the chip substrate 2 and can be used for sensing pressure; the protective cover 4 may function to protect the chip 3.
In this embodiment, the thick film circuit board 1 is provided with a first through hole 11.
In this embodiment, the chip substrate 2 is provided with a second through hole 21, and the first through hole 11 is abutted with the second through hole 21.
Specifically, the first through hole 11 and the second through hole 21 are used for the medium to be tested to pass through and approach the chip 3 for pressure detection.
In this embodiment, a first bonding pad 12 is disposed on the top surface of the thick film circuit board 1, and the first bonding pad 12 is electrically connected to the chip substrate 2.
In this embodiment, the chip substrate 2 is provided with a metal through hole 22, the bottom end of the metal through hole 22 is electrically connected to the first bonding pad 12, and the top end of the metal through hole 22 is electrically connected to the chip 3.
Specifically, the first bonding pad 12 and the metal through hole 22 are electrically connected for supplying power between the thick film circuit board 1 and the chip substrate 2.
In this embodiment, a second bonding pad is disposed on the bottom surface of the chip 3, and the second bonding pad is electrically connected to the top end of the metal through hole 22.
Specifically, the second bonding pad is electrically connected to the metal through hole 22 for supplying power between the chip 3 and the chip substrate 2.
In this embodiment of the present application, a third pad is disposed on the bottom surface of the thick film circuit board 1, and the third pad is used for electrically connecting with an external device.
Specifically, the external device is electrically connected with the thick film circuit board 1 through the third bonding pad, and is used for realizing power supply and signal transmission.
In this embodiment, a fourth bonding pad 32 is disposed on the top surface of the chip 3, and the fourth bonding pad 32 is electrically connected to the third bonding pad.
In this embodiment, a membrane 31 is disposed on the top surface of the chip 3, and the membrane 31 is electrically connected to the fourth bonding pad 32.
Specifically, the diaphragm 31 is used to sense a pressure change, and the pressure change value is transmitted to the chip substrate 2 through the fourth pad 32.
In the embodiment of the present application, a vacuum cavity is formed between the protective cover 4 and the top surface of the chip 3.
Specifically, the protective cover 4 is used to protect the chip 3.
As shown in fig. 3, the measurement principle of the leadless package pressure sensor is approximately as follows: when the pressure sensor measures pressure, the measured medium acts on the diaphragm 31 of the chip 3 through the first through hole 11 of the thick film circuit board 1 and the second through hole 21 of the chip substrate 2 respectively, the chip 3 converts the sensed pressure into resistance value change by using piezoresistance effect, the equivalent circuit is shown in figure 3, the chip 3 integrates 4 piezoresistors to form a Wheatstone bridge, when the pressure acts, the resistance values of R1 and R3 are increased, and the resistance values of R2 and R4 are reduced. The external power supply supplies power to the first bonding pad 12 on the thick film circuit board 1, electric energy is led to the chip 3 through the electric connection part, when the pressure changes, an output signal V0 of the chip 3 is transmitted to an external circuit through the electric connection part by means of the first bonding pad 12 on the thick film circuit board 1, and the pressure measurement function can be completed by monitoring the external output signal.
According to the leadless packaging pressure sensor, chip electrical connection can be achieved without using lead connection, and reliability is improved; the chip protection can be completed without external parts and auxiliary materials, so that the volume is effectively reduced; the whole material can endure a wide temperature range, and the adaptability of the product is improved.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A leadless packaged pressure sensor comprising:
the thick film circuit board is used for bearing the chip substrate;
a chip substrate for mounting a chip; the chip substrate is arranged on the thick film circuit board and is electrically connected with the thick film circuit board;
the chip is used for detecting pressure; the chip is arranged on the chip substrate and is electrically connected with the chip substrate;
a protective cover for protecting the chip; the protective cover is arranged on the chip.
2. The leadless packaged pressure sensor of claim 1 wherein the thick film circuit board is provided with a first through hole therethrough.
3. The leadless packaged pressure sensor of claim 2 wherein the chip substrate is provided with a second via, the first via and the second via interfacing.
4. The leadless packaged pressure sensor of claim 1 wherein a first pad is disposed on a top surface of the thick film circuit board, the first pad being electrically connected to the chip substrate.
5. The leadless packaged pressure sensor of claim 4 wherein a metal via is disposed through the die substrate, a bottom end of the metal via is electrically connected to the first pad, and a top end of the metal via is electrically connected to the die.
6. The leadless packaged pressure sensor of claim 5 wherein a second pad is disposed on a bottom surface of the chip, the second pad being electrically connected to a top end of the metal via.
7. The leadless packaged pressure sensor of claim 1 wherein a third pad is disposed on a bottom surface of the thick film circuit board, the third pad for electrical connection with an external device.
8. The leadless packaged pressure sensor of claim 6 wherein a fourth pad is disposed on a top surface of the chip, the fourth pad being electrically connected to the third pad.
9. The leadless packaged pressure sensor of claim 8 wherein a diaphragm is disposed on a top surface of the chip, the diaphragm being electrically connected to the fourth bonding pad.
10. The leadless packaged pressure sensor of claim 1 wherein a vacuum cavity is formed between the protective cover and the top surface of the chip.
CN202310249894.7A 2023-03-15 2023-03-15 Leadless packaging pressure sensor Pending CN116222844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310249894.7A CN116222844A (en) 2023-03-15 2023-03-15 Leadless packaging pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310249894.7A CN116222844A (en) 2023-03-15 2023-03-15 Leadless packaging pressure sensor

Publications (1)

Publication Number Publication Date
CN116222844A true CN116222844A (en) 2023-06-06

Family

ID=86576756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310249894.7A Pending CN116222844A (en) 2023-03-15 2023-03-15 Leadless packaging pressure sensor

Country Status (1)

Country Link
CN (1) CN116222844A (en)

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