CN112881407A - Method, system, device and medium for detecting welding quality of LED chip - Google Patents
Method, system, device and medium for detecting welding quality of LED chip Download PDFInfo
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Abstract
The invention discloses a method, a system, a device and a medium for detecting the welding quality of an LED chip, wherein the method comprises the following steps: acquiring first image information of an LED chip, and performing color space conversion on the first image information to obtain single-channel second image information; carrying out template matching positioning on the second image information and a preset template image to obtain third image information; performing image enhancement processing on the third image information to obtain fourth image information, and performing local threshold segmentation processing on the fourth image information to obtain fifth image information; and determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip. The invention improves the accuracy and reliability of the welding quality detection of the LED chip, improves the production quality of the LED chip, and can be widely applied to the technical field of machine vision.
Description
Technical Field
The invention relates to the technical field of machine vision, in particular to a method, a system, a device and a medium for detecting the welding quality of an LED chip.
Background
The LED chip, also called LED light emitting chip, is a core component of an LED lamp, i.e. the P-N junction, and its main function is to convert electrical energy into light energy. The LED chip is mainly made of monocrystalline silicon and consists of two parts, wherein one part is a P-type semiconductor, holes are dominant in the P-type semiconductor, and the other part is an N-type semiconductor, and the electron concentration of the N-type semiconductor is far greater than that of the holes; when the two semiconductors are connected, a P-N junction is formed between the two semiconductors, and when current is applied to the LED chip through the wires, electrons are pushed to a P region where they recombine with holes, and then energy is emitted in the form of photons, which is the principle of LED chip light emission.
In the production process of the LED chip, the welding quality is particularly important, and many welding types in the LED chip are only necessary to be detected manually, so that in order to ensure the detection efficiency in the production process of the LED chip and improve the production quality of the LED chip, it is urgently needed to develop an accurate and reliable welding quality detection method to realize the automatic detection of the LED chip.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
Therefore, an object of the embodiments of the present invention is to provide an accurate and reliable method for detecting the soldering quality of an LED chip.
Another object of the embodiments of the present invention is to provide a system for detecting the soldering quality of an LED chip.
In order to achieve the technical purpose, the technical scheme adopted by the embodiment of the invention comprises the following steps:
in a first aspect, an embodiment of the present invention provides a method for detecting a welding quality of an LED chip, including the following steps:
acquiring first image information of an LED chip, and performing color space conversion on the first image information to obtain single-channel second image information;
carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
performing image enhancement processing on the third image information to obtain fourth image information, and performing local threshold segmentation processing on the fourth image information to obtain fifth image information;
determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
Further, in an embodiment of the present invention, the step of acquiring first image information of an LED chip and performing color space conversion on the first image information to obtain second image information of a single channel specifically includes:
the method comprises the steps of obtaining first image information of the surface of an LED chip through shooting, carrying out color space conversion on the first image information, and selecting a G channel image as second image information.
Further, in an embodiment of the present invention, the step of performing template matching and positioning on the second image information and a preset template image to obtain third image information in the same pose as the preset template image specifically includes:
stacking a preset template image on the second image information for translation, and sequentially capturing a plurality of sub-images with the same size as the template image;
and performing similarity matching on the sub-images and the template images, and selecting the sub-image with the highest similarity as third image information.
Further, in an embodiment of the present invention, the step of performing image enhancement processing on the third image information to obtain fourth image information, and performing local threshold segmentation processing on the fourth image information to obtain fifth image information specifically includes:
enhancing the contrast of the third image information through image enhancement processing to obtain fourth image information;
determining a first gray mean value and a first standard deviation of each pixel point of the fourth image information in a preset neighborhood, and determining a first characteristic threshold of each pixel point according to the first gray mean value and the first standard deviation;
and performing local threshold segmentation processing on the fourth image information according to the first characteristic threshold to obtain fifth image information.
Further, in an embodiment of the present invention, the first gray scale mean value is:
wherein m (x, y) represents a first gray average value of the pixel point (x, y) in an r neighborhood, r represents a preset neighborhood, and g (i, j) represents a gray value of the pixel point (i, j);
the first standard deviation is:
wherein s (x, y) represents a first standard deviation of the pixel point (x, y) in the neighborhood of r;
the first characteristic threshold is:
wherein, T (x, y) represents a first characteristic threshold of the pixel point (x, y), R represents a dynamic range of the first standard deviation, and k represents a correction parameter.
Further, in an embodiment of the present invention, the step of determining a solder joint area and a solder pad area according to the fifth image information, determining a first center coordinate of the solder joint area, a second center coordinate of the solder pad area, and an intersection area of the solder joint area and the solder pad area, and further determining a soldering quality of the LED chip according to the first center coordinate, the second center coordinate, and the intersection area specifically includes:
performing morphological operation on the fifth image information to determine a welding spot area and a welding pad area;
determining an intersection area of the welding spot area and the welding pad area, and determining that the welding quality of the LED chip is good when the area of the intersection area is equal to the area of the welding spot area or the area of the welding pad area;
and determining a first central coordinate of the welding spot area and a second central coordinate of the welding pad area, and determining that the welding type of the LED chip is one welding when the distance between the first central coordinate and the second central coordinate is smaller than a preset threshold value.
Further, in an embodiment of the present invention, the step of performing a morphological operation on the fifth image information to determine a welding spot area and a welding pad area specifically includes:
and constructing a first structural element, performing an opening operation of firstly corroding and then expanding on the fifth image information according to the first structural element, and removing interference points in the fifth image information, thereby determining a welding spot area and a welding pad area.
In a second aspect, an embodiment of the present invention provides a system for detecting a soldering quality of an LED chip, including:
the color space conversion module is used for acquiring first image information of the LED chip and performing color space conversion on the first image information to obtain single-channel second image information;
the template matching positioning module is used for carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
the threshold segmentation processing module is used for carrying out image enhancement processing on the third image information to obtain fourth image information and carrying out local threshold segmentation processing on the fourth image information to obtain fifth image information;
and the welding quality determining module is used for determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
In a third aspect, an embodiment of the present invention provides an apparatus for detecting a soldering quality of an LED chip, including:
at least one processor;
at least one memory for storing at least one program;
when the at least one program is executed by the at least one processor, the at least one program causes the at least one processor to implement a method of detecting a bonding quality of an LED chip as described above.
In a fourth aspect, the embodiment of the present invention further provides a computer-readable storage medium, in which a program executable by a processor is stored, and the program executable by the processor is used for executing the above-mentioned method for detecting the welding quality of the LED chip.
Advantages and benefits of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention:
according to the embodiment of the invention, the color space conversion is firstly carried out on the first image information of the LED chip to obtain the second image information, then the template matching and positioning are carried out on the second image information and the preset template image to obtain the third image information of the same pose, then the image enhancement is carried out on the third image information to obtain the fourth image information, and further the local threshold segmentation processing is carried out on the fourth image information to obtain the fifth image information, so that the welding spot area and the welding pad area can be determined according to the fifth image information, and the welding quality of the LED chip is determined through the intersection processing and the center coordinate calculation of the welding spot area and the welding pad area. The embodiment of the invention improves the accuracy and reliability of the welding quality detection of the LED chip, and can effectively detect various welding types of the LED chip, thereby improving the production quality of the LED chip.
Drawings
In order to more clearly illustrate the technical solution in the embodiment of the present invention, the following description is made on the drawings required to be used in the embodiment of the present invention, and it should be understood that the drawings in the following description are only for convenience and clarity of describing some embodiments in the technical solution of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart illustrating steps of a method for detecting a soldering quality of an LED chip according to an embodiment of the present invention;
fig. 2 is a block diagram of a welding quality detection system for an LED chip according to an embodiment of the present invention;
fig. 3 is a block diagram of a welding quality detection apparatus for an LED chip according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. The step numbers in the following embodiments are provided only for convenience of illustration, the order between the steps is not limited at all, and the execution order of each step in the embodiments can be adapted according to the understanding of those skilled in the art.
In the description of the present invention, the meaning of a plurality is two or more, if there is a description to the first and the second for the purpose of distinguishing technical features, it is not understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features. Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art.
Referring to fig. 1, an embodiment of the present invention provides a method for detecting a welding quality of an LED chip, which specifically includes the following steps:
s101, acquiring first image information of an LED chip, and performing color space conversion on the first image information to obtain single-channel second image information;
specifically, in the embodiment of the present invention, the first image information adopts an RGB image, which includes three single-channel images of an R channel, a G channel, and a B channel, and the grayscale characteristics of the channels are different. Step S101 specifically includes:
and acquiring first image information of the surface of the LED chip by shooting, performing color space conversion on the first image information, and selecting a G channel image as second image information.
S102, carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
specifically, in the embodiment of the present invention, the template image is a preset image representing the LED welding portion, and the template matching is to search the second image information for a target image (i.e., third image information) in the same pose as the template image, where the target image and the template image have the same size, direction, and image elements, and the coordinate position of the target image in the second image information can be determined by using the existing template matching algorithm. Step S102 specifically includes the following steps:
s1021, superposing a preset template image on second image information for translation, and sequentially intercepting a plurality of sub-images with the same size as the template image;
and S1022, performing similarity matching on the sub-images and the template image, and selecting the sub-image with the highest similarity as third image information.
Specifically, in the embodiment of the present invention, the number of layers of the dead person matched with the template is 1, the template image moves from left to right and from top to bottom every time the template image starts from the top left corner of the second image information, and when one pixel point is reached, a sub-image with the same size as the template image is extracted from the second image information by using the pixel point as the top left corner vertex to perform similarity comparison with the template image. The correlation formula is as follows:
wherein Q (x, y) represents the similarity between the sub-image and the template image, M (x ', y') represents the pixel matrix of the template image, I (x + x ', y + y') represents the pixel matrix of the sub-image, (x ', y') represents the coordinates of the pixel points of the template image, and (x + x ', y + y') represents the coordinates of the pixel points of the sub-image in the second image information, it can be understood that (x, y) is the coordinates of the pixel points at the lower left corner of the sub-image in the second image information, and I (x, y) is the pixel matrix of the second image information.
And performing similarity calculation according to the formula, and then selecting the subimage with the highest similarity as third image information through similarity comparison, wherein the third image information is an image of the welding part of the LED chip to be detected, so that image enhancement and threshold segmentation processing can be conveniently performed subsequently to obtain a welding spot area and a welding pad area.
S103, carrying out image enhancement processing on the third image information to obtain fourth image information, and carrying out local threshold segmentation processing on the fourth image information to obtain fifth image information;
specifically, the image enhancement processing may enhance the contrast of the third image information, thereby facilitating the local threshold segmentation processing; the image coverage can be reduced by the local threshold segmentation process, thereby obtaining fifth image information that can roughly distinguish the welding point from the welding pad. Step S103 specifically includes the following steps:
s1031, enhancing the contrast of the third image information through image enhancement processing to obtain fourth image information;
s1032, determining a first gray mean value and a first standard deviation of each pixel point of the fourth image information in a preset neighborhood, and determining a first characteristic threshold of each pixel point according to the first gray mean value and the first standard deviation;
and S1033, performing local threshold segmentation processing on the fourth image information according to the first characteristic threshold to obtain fifth image information.
Optionally, the third image information is image-enhanced to enhance the contrast thereof, and the correlation formula is as follows:
wherein s iskRepresenting the grey level, p, of each pixel after image enhancementr(ri) Density function representing random variables, niIndicates the number of pixels of the third image information whose gradation value takes a specific value, and N indicates the total number of pixels of the third image information.
As a further optional implementation, the first gray scale mean value is:
wherein m (x, y) represents a first gray average value of the pixel point (x, y) in an r neighborhood, r represents a preset neighborhood, and g (i, j) represents a gray value of the pixel point (i, j);
the first standard deviation is:
wherein s (x, y) represents a first standard deviation of the pixel point (x, y) in the neighborhood of r;
the first characteristic threshold is:
wherein, T (x, y) represents a first characteristic threshold of the pixel point (x, y), R represents a dynamic range of the first standard deviation, and k represents a correction parameter.
Specifically, in the embodiment of the present invention, an eight-bit grayscale image is taken as an example, and the value of R is 128; in the present embodiment, k has a value in the range of [0,1 ].
S104, determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
Specifically, the fifth image information after the local threshold segmentation processing can roughly distinguish welding points and welding pads, morphological operations are performed on rough areas of the welding points and the welding pads in the fifth image information, and accurate welding point areas and welding pad areas can be determined; and judging the welding quality of the LED chip according to the determined area of the intersection region of the welding spot region and the welding pad region and the distance between the center coordinates of the two regions. Step S104 specifically includes the following steps:
s1041, performing morphological operation on the fifth image information, and determining a welding spot area and a welding pad area;
s1042, determining an intersection area of the welding spot area and the welding pad area, and determining that the welding quality of the LED chip is good when the area of the intersection area is equal to the area of the welding spot area or the area of the welding pad area;
s1043, determining a first center coordinate of the welding spot area and a second center coordinate of the welding pad area, and determining that the welding type of the LED chip is one welding when the distance between the first center coordinate and the second center coordinate is smaller than a preset threshold value.
Specifically, an intersection operation is performed on a welding spot area and a welding pad area, central coordinates of the two areas are calculated, if the area of the intersection area obtained by the intersection operation is equal to one of the areas of the two areas, it is judged that the welding quality of the LED chip is good, and if the area of the intersection area is smaller than the area of the two areas, it is indicated that the LED chip belongs to partial welding; and for the LED chip with good welding quality, calculating the distance according to the center coordinates of the welding spot area and the welding pad area, wherein when the distance is smaller than a set threshold value, the welding type of the LED chip is one welding, and otherwise, the welding type of the LED chip is an eccentric ball. In the embodiment of the present invention, the threshold is 10.
Further as an optional implementation manner, step S1041 specifically includes:
and constructing a first structural element, performing an opening operation of firstly corroding and then expanding the fifth image information according to the first structural element, and removing interference points in the fifth image information, thereby determining a welding spot area and a welding pad area.
Specifically, in the embodiment of the present invention, a circle with a pixel radius of 5 is selected as the first structural element, and the opening operation of erosion and then expansion is performed on the fifth image information. The corrosion is to use an algorithm to corrode the edge of the image, and the function is to kick and remove 'burrs' of the edge of the target; dilation is the use of algorithms to expand the edges of the image, which act to fill in the target's edges or internal pits. The relevant processes of the expansion treatment and the corrosion treatment are as follows:
the expansion treatment process comprises the following steps: and defining a structural element, moving the structural element in the whole image to each pixel point, and if the structural element is equal to at least one pixel of the pixel value of the corresponding pixel point on the image, keeping the value of the pixel point.
And (3) corrosion treatment process: and defining a structural element, wherein the structural element moves in the whole image and moves to each pixel point, and the value of the pixel point is reserved only when the structural element is equal to the pixel value of the corresponding pixel point on the image.
According to the embodiment of the invention, through the opening operation of firstly corroding and then expanding, the interference points in the fifth image information can be eliminated, and the target surfaces of the welding spot area and the welding pad area are smoother, so that the welding spot area and the welding pad area can be accurately determined.
The method steps of the embodiments of the present invention are described above. According to the embodiment of the invention, the color space conversion is firstly carried out on the first image information of the LED chip to obtain the second image information, then the template matching and positioning are carried out on the second image information and the preset template image to obtain the third image information of the same pose, then the image enhancement is carried out on the third image information to obtain the fourth image information, and further the local threshold segmentation processing is carried out on the fourth image information to obtain the fifth image information, so that the welding spot area and the welding pad area can be determined according to the fifth image information, and the welding quality of the LED chip is determined through the intersection processing and the center coordinate calculation of the welding spot area and the welding pad area. The embodiment of the invention improves the accuracy and reliability of the welding quality detection of the LED chip, and can effectively detect various welding types of the LED chip, thereby improving the production quality of the LED chip.
Referring to fig. 2, an embodiment of the present invention provides a system for detecting a soldering quality of an LED chip, including:
the color space conversion module is used for acquiring first image information of the LED chip and performing color space conversion on the first image information to obtain single-channel second image information;
the template matching positioning module is used for carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
the threshold segmentation processing module is used for carrying out image enhancement processing on the third image information to obtain fourth image information and carrying out local threshold segmentation processing on the fourth image information to obtain fifth image information;
and the welding quality determining module is used for determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
The contents in the above method embodiments are all applicable to the present system embodiment, the functions specifically implemented by the present system embodiment are the same as those in the above method embodiment, and the beneficial effects achieved by the present system embodiment are also the same as those achieved by the above method embodiment.
Referring to fig. 3, an embodiment of the present invention provides a device for detecting a soldering quality of an LED chip, including:
at least one processor;
at least one memory for storing at least one program;
when the at least one program is executed by the at least one processor, the at least one processor is enabled to implement the method for detecting the welding quality of the LED chip.
The contents in the above method embodiments are all applicable to the present apparatus embodiment, the functions specifically implemented by the present apparatus embodiment are the same as those in the above method embodiments, and the advantageous effects achieved by the present apparatus embodiment are also the same as those achieved by the above method embodiments.
The embodiment of the invention also provides a computer readable storage medium, wherein a program executable by a processor is stored, and the program executable by the processor is used for executing the welding quality detection method of the LED chip when being executed by the processor.
The computer-readable storage medium of the embodiment of the invention can execute the welding quality detection method of the LED chip provided by the embodiment of the method of the invention, can execute any combination of the implementation steps of the embodiment of the method, and has corresponding functions and beneficial effects of the method.
The embodiment of the invention also discloses a computer program product or a computer program, which comprises computer instructions, and the computer instructions are stored in a computer readable storage medium. The computer instructions may be read by a processor of a computer device from a computer-readable storage medium, and executed by the processor to cause the computer device to perform the method illustrated in fig. 1.
In alternative embodiments, the functions/acts noted in the block diagrams may occur out of the order noted in the operational illustrations. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality/acts involved. Furthermore, the embodiments presented and described in the flow charts of the present invention are provided by way of example in order to provide a more thorough understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and in which sub-operations described as part of larger operations are performed independently.
Furthermore, although the present invention is described in the context of functional modules, it should be understood that, unless otherwise stated to the contrary, one or more of the above-described functions and/or features may be integrated in a single physical device and/or software module, or one or more of the functions and/or features may be implemented in a separate physical device or software module. It will also be appreciated that a detailed discussion of the actual implementation of each module is not necessary for an understanding of the present invention. Rather, the actual implementation of the various functional modules in the apparatus disclosed herein will be understood within the ordinary skill of an engineer, given the nature, function, and internal relationship of the modules. Accordingly, those skilled in the art can, using ordinary skill, practice the invention as set forth in the claims without undue experimentation. It is also to be understood that the specific concepts disclosed are merely illustrative of and not intended to limit the scope of the invention, which is defined by the appended claims and their full scope of equivalents.
The above functions, if implemented in the form of software functional units and sold or used as a separate product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the above method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Further, the computer readable medium could even be paper or another suitable medium upon which the above described program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
In the foregoing description of the specification, reference to the description of "one embodiment/example," "another embodiment/example," or "certain embodiments/examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A welding quality detection method of an LED chip is characterized by comprising the following steps:
acquiring first image information of an LED chip, and performing color space conversion on the first image information to obtain single-channel second image information;
carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
performing image enhancement processing on the third image information to obtain fourth image information, and performing local threshold segmentation processing on the fourth image information to obtain fifth image information;
determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
2. The method for detecting the welding quality of the LED chip according to claim 1, wherein the step of obtaining first image information of the LED chip and performing color space conversion on the first image information to obtain second image information of a single channel specifically comprises:
the method comprises the steps of obtaining first image information of the surface of an LED chip through shooting, carrying out color space conversion on the first image information, and selecting a G channel image as second image information.
3. The method for detecting the welding quality of the LED chip according to claim 1, wherein the step of performing template matching positioning on the second image information and the preset template image to obtain third image information with the same pose as the preset template image specifically comprises:
stacking a preset template image on the second image information for translation, and sequentially capturing a plurality of sub-images with the same size as the template image;
and performing similarity matching on the sub-images and the template images, and selecting the sub-image with the highest similarity as third image information.
4. The method of claim 1, wherein the step of performing image enhancement processing on the third image information to obtain fourth image information and performing local threshold segmentation processing on the fourth image information to obtain fifth image information specifically comprises:
enhancing the contrast of the third image information through image enhancement processing to obtain fourth image information;
determining a first gray mean value and a first standard deviation of each pixel point of the fourth image information in a preset neighborhood, and determining a first characteristic threshold of each pixel point according to the first gray mean value and the first standard deviation;
and performing local threshold segmentation processing on the fourth image information according to the first characteristic threshold to obtain fifth image information.
5. The method for detecting the welding quality of the LED chip as claimed in claim 4, wherein the first gray-scale mean value is as follows:
wherein m (x, y) represents a first gray average value of the pixel point (x, y) in an r neighborhood, r represents a preset neighborhood, and g (i, j) represents a gray value of the pixel point (i, j);
the first standard deviation is:
wherein s (x, y) represents a first standard deviation of the pixel point (x, y) in the neighborhood of r;
the first characteristic threshold is:
wherein, T (x, y) represents a first characteristic threshold of the pixel point (x, y), R represents a dynamic range of the first standard deviation, and k represents a correction parameter.
6. The method according to claim 1, wherein the step of determining a solder joint area and a solder pad area according to the fifth image information, determining a first center coordinate of the solder joint area, a second center coordinate of the solder pad area, and an intersection area of the solder joint area and the solder pad area, and further determining the solder quality of the LED chip according to the first center coordinate, the second center coordinate, and the intersection area specifically comprises:
performing morphological operation on the fifth image information to determine a welding spot area and a welding pad area;
determining an intersection area of the welding spot area and the welding pad area, and determining that the welding quality of the LED chip is good when the area of the intersection area is equal to the area of the welding spot area or the area of the welding pad area;
and determining a first central coordinate of the welding spot area and a second central coordinate of the welding pad area, and determining that the welding type of the LED chip is one welding when the distance between the first central coordinate and the second central coordinate is smaller than a preset threshold value.
7. The method as claimed in claim 6, wherein the step of determining the solder joint area and the solder pad area by performing morphological operations on the fifth image information specifically comprises:
and constructing a first structural element, performing an opening operation of firstly corroding and then expanding on the fifth image information according to the first structural element, and removing interference points in the fifth image information, thereby determining a welding spot area and a welding pad area.
8. A welding quality detection system of an LED chip is characterized by comprising:
the color space conversion module is used for acquiring first image information of the LED chip and performing color space conversion on the first image information to obtain single-channel second image information;
the template matching positioning module is used for carrying out template matching positioning on the second image information and a preset template image so as to obtain third image information with the same pose as the preset template image;
the threshold segmentation processing module is used for carrying out image enhancement processing on the third image information to obtain fourth image information and carrying out local threshold segmentation processing on the fourth image information to obtain fifth image information;
and the welding quality determining module is used for determining a welding spot area and a welding pad area according to the fifth image information, determining a first central coordinate of the welding spot area, a second central coordinate of the welding pad area and an intersection area of the welding spot area and the welding pad area, and further determining the welding quality of the LED chip according to the first central coordinate, the second central coordinate and the intersection area.
9. A welding quality detection device of an LED chip is characterized by comprising:
at least one processor;
at least one memory for storing at least one program;
when executed by the at least one processor, the at least one program causes the at least one processor to implement a method of detecting solder quality of an LED chip as claimed in any one of claims 1 to 7.
10. A computer-readable storage medium in which a program executable by a processor is stored, wherein the program executable by the processor is used for executing a method for detecting a soldering quality of an LED chip according to any one of claims 1 to 7 when executed by the processor.
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