CN111275674A - Chip burning detection method and system and computer readable storage medium - Google Patents
Chip burning detection method and system and computer readable storage medium Download PDFInfo
- Publication number
- CN111275674A CN111275674A CN202010051378.XA CN202010051378A CN111275674A CN 111275674 A CN111275674 A CN 111275674A CN 202010051378 A CN202010051378 A CN 202010051378A CN 111275674 A CN111275674 A CN 111275674A
- Authority
- CN
- China
- Prior art keywords
- chip
- burning
- chips
- image information
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 73
- 238000003860 storage Methods 0.000 title claims abstract description 18
- 230000007547 defect Effects 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 41
- 230000002950 deficient Effects 0.000 claims abstract description 7
- 238000012216 screening Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 46
- 230000007613 environmental effect Effects 0.000 claims description 8
- 238000004364 calculation method Methods 0.000 claims description 6
- 238000012937 correction Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 230000007246 mechanism Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007667 floating Methods 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G06T5/70—
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Abstract
The invention provides a chip burning detection method, a system and a computer readable storage medium, wherein the method comprises the following steps: acquiring original image information of a PCB; adopting a template small image matching algorithm to divide each matched independent chip from the original image information and outputting the divided image information; calculating the defect rate of each chip based on the complete chip sample; judging whether the defect rate of each chip exceeds a preset defect threshold value or not, and if the defect rate of the target chip does not exceed the preset defect threshold value, marking the defect qualified rate; screening all chips with defective qualified marks from the segmented image information, and carrying out batch burning program on the chips by adopting a burning device; after the program burning is finished, the program detection is carried out on all the chips with the incomplete qualified marks through the detection device. The invention can realize batch burning detection of a plurality of chips on the PCB board, and the detection accuracy is higher.
Description
Technical Field
The invention relates to the technical field of chip burning, in particular to a chip burning detection method, a chip burning detection system and a computer readable storage medium.
Background
Most electronic products in the market at present need to be controlled by using a chip, so that programs need to be burned on the chip.
In the production field of control equipment such as an automobile ECU module and an air conditioner control module, relevant control logic programs need to be burnt into a chip after circuits are assembled. When the chip is burned, the chip or the related circuit board needs to be fixed on instruments such as a clamp and the like and is connected with a burner installed on the clamp, then the upper computer is operated to control the burner to burn the chip, and the chip or the circuit board is detached from the clamp after burning is finished, so that the burning work of one chip is completed.
The hardware structures of the control devices in the same batch are completely the same, and the control logic programs to be burned into the chips are also completely the same, so that the burning of the chips is a mechanical repeated tedious work when the control devices are produced in batches. Traditionally, this has been done manually. Firstly, an operator needs to correspond the software serial number of the chip and the position number of the chip on the circuit board one by one when burning the chip, the operation is complicated, only one chip can be burned each time, the working efficiency is low, and the requirement of mass production cannot be met; secondly, in the burning process, an operator easily makes the software serial number and the chip position number correspond to each other wrongly, so that the chip product is bad. Therefore, after the burning of the chip is completed, the burnt chip needs to be subjected to yield detection in time. The current detection mode is mostly to detect the burning program of the chip by adopting special detection equipment, the detection mode is single, and the accuracy of the whole detection of the chip is not high.
Disclosure of Invention
In order to solve at least one technical problem, the invention provides a chip burning detection method, a chip burning detection system and a computer readable storage medium.
In order to achieve the above object, a first aspect of the present invention provides a method for detecting burning of a chip, where the method includes:
acquiring original image information of a PCB (printed Circuit Board), wherein a plurality of chips are distributed on the PCB;
obtaining the chip model on the PCB, and searching the corresponding template small picture according to the chip model;
matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
calculating the defect rate of each chip based on the complete chip sample;
judging whether the defect rate of each chip exceeds a preset defect threshold value, if so, marking the target chip with unqualified defects, and if not, marking the target chip with qualified defects;
screening all chips with defective qualified marks from the segmented image information, and carrying out batch burning program on the chips by adopting a burning device;
after the program burning is finished, program detection is carried out on all the chips with the incomplete qualified marks through the detection device, and whether the corresponding chips are qualified products or not is judged according to the detection result.
In this scheme, adopt the burning device to burn the procedure in batches to it, specifically include:
carrying out image processing on the segmented image information to identify burning points of all incomplete qualified mark chips;
marking the coordinate positions of the burning points of all the incomplete qualified marking chips in the segmented image information;
and selecting the corresponding burning needle based on the coordinate positions of all the burning points, and controlling the burning needle to contact with the burning points so as to enable the burning device to carry out the burning program on each chip.
In this scheme, calculate the incomplete rate of every chip based on complete chip sample, specifically include:
carrying out gray processing on the segmented image information;
carrying out image enhancement processing on the grayed image;
carrying out binarization processing on the image after enhancement processing;
denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y);
calculating the incomplete area of the target chip as
Wherein L and W are respectively the length and width x of the target chip0，y0As the coordinates of the upper left corner of the target chip image,
t is a preset gray level threshold value;
according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
In this scheme, calculate the incomplete rate of every chip based on complete chip sample, specifically still include:
respectively calculating the incomplete areas S of n different positions in the target chip according to the image recognition technology1，S2，...，Sn；
Weight W based on each position1，W2，...，WnRespectively calculating corresponding weighted areas S1W1，S2W2，...，SnWn；
Summarizing the weighted area S of each location1W1+S2W2+…+SnWnAnd combined with the complete chip sample area SSample (A)Calculating the defect rate of the target chip
In this scheme, carry out the procedure detection through detection device to all incomplete qualified mark's chip, specifically still include:
different detection environmental conditions are created through the detection equipment, and the detection environmental conditions comprise a vibration environment, a high-temperature environment, a low-temperature environment and a high-humidity environment;
and respectively placing all the chips with the incomplete qualified marks in different detection environment conditions for program detection so as to detect the virtual welding points on the chips.
In this scheme, matching the template small image with the original image information by using a template small image matching algorithm specifically includes:
traversing each region in the original image information by adopting the template small image, and comparing the first similarity of each region and the template small image;
and when the first similarity of a certain region and the template small image exceeds a first preset threshold value, judging the region to be an independent chip region.
In this scheme, after acquiring and acquiring original image information of the PCB, the method further includes:
matching the original image information with a front template image of the PCB;
calculating a second similarity between the original image information and the front template image of the PCB;
when the second similarity exceeds a second preset threshold value, the original image information is judged to correspond to the front side of the PCB, and when the second similarity is smaller than the second preset threshold value, the original image information is matched with the back side template image of the PCB;
calculating a third similarity between the original image information and the reverse side template image of the PCB;
and when the third similarity exceeds a third preset threshold, judging that the original image information corresponds to the reverse side of the PCB, prompting correction, and when the third similarity is smaller than the third preset threshold, sending an alarm signal.
The second aspect of the present invention further provides a chip burning detection system, which includes:
the system comprises an image acquisition module, a processing module and a display module, wherein the image acquisition module is used for acquiring and acquiring original image information of a PCB (printed circuit board), and a plurality of chips are distributed on the PCB;
the image processing module is used for acquiring the chip model on the PCB and searching the corresponding template thumbnail according to the chip model; matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
the calculation module is used for calculating the defect rate of each chip based on the complete chip sample;
the judgment marking module is used for judging whether the defect rate of each chip exceeds a preset defect threshold value, if the defect rate of the target chip exceeds the preset defect threshold value, performing defect unqualified marking on the target chip, and if the defect rate of the target chip does not exceed the preset defect threshold value, performing defect qualified marking on the target chip;
the burning device screens all chips with incomplete qualified marks from the segmented image information and carries out batch burning procedures on the chips;
and the detection device is used for carrying out program detection on all the incomplete qualified marked chips and judging whether the corresponding chips are qualified products or not according to the detection result.
In the scheme, the computing module is also used for carrying out gray processing on the segmented image information; carrying out image enhancement processing on the grayed image; carrying out binarization processing on the image after enhancement processing; denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y); calculating the incomplete area of the target chip as
Wherein L and W are respectively the length and width x of the target chip0，y0For the upper left corner of the target chip imageThe coordinates of the position of the object to be imaged,
t is a preset gray level threshold value; according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
The third aspect of the present invention also provides a computer-readable storage medium, which includes instructions, when the instructions are executed on a computer, causing the computer to execute the steps of the chip burning detection method as described above.
The invention provides a chip burning detection method, a chip burning detection system and a computer readable storage medium, which can realize batch burning detection of a plurality of chips on a PCB and have higher detection accuracy.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a flow chart of a chip burning detection method according to the present invention;
FIG. 2 is a schematic diagram of a burning apparatus of the present invention;
FIG. 3 shows a schematic view of a PCB board of the present invention;
FIG. 4 is a block diagram of a system for detecting burning of chips according to the present invention;
reference numerals:
1PCB board, 11 chips, 111 burning points, 112 metal terminals, 2 burning devices and 21 burning pins.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Fig. 1 shows a flowchart of a chip burning detection method according to the present invention.
As shown in fig. 1, a first aspect of the present invention provides a method for detecting burning of a chip, where the method includes:
s102, acquiring original image information of a PCB (printed Circuit Board), wherein a plurality of chips are distributed on the PCB;
s104, acquiring the chip model on the PCB, and searching the corresponding template thumbnail according to the chip model;
s106, matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
s108, calculating the defect rate of each chip based on the complete chip sample;
s110, judging whether the defect rate of each chip exceeds a preset defect threshold value, if so, marking the target chip with unqualified defects, and if not, marking the target chip with qualified defects;
s112, screening all chips with the incomplete qualified marks from the segmented image information, and carrying out batch burning program on the chips by adopting a burning device;
and S114, after the program burning is finished, performing program detection on all the chips with the incomplete qualified marks through the detection device, and judging whether the corresponding chips are qualified products or not according to the detection result.
Before the chip is burned, the incomplete chip is identified through an image, the judgment is carried out based on the incomplete rate of the chip, a preset incomplete threshold value is set, when the incomplete rate is larger than the incomplete threshold value, the integral disqualification of the chip is directly judged, the disqualification marking is carried out on the chip, and the subsequent burning device does not carry out burning programs on the disqualified chip, so that unnecessary burning operation on the disqualified chip is avoided. Meanwhile, the chip yield detection method firstly carries out defect detection and then carries out program detection, and through a plurality of detection procedures, the accuracy of chip yield detection is further improved.
According to the embodiment of the invention, the batch burning program is carried out by adopting the burning device, which specifically comprises the following steps:
carrying out image processing on the segmented image information to identify burning points of all incomplete qualified mark chips;
marking the coordinate positions of the burning points of all the incomplete qualified marking chips in the segmented image information;
and selecting the corresponding burning needle based on the coordinate positions of all the burning points, and controlling the burning needle to contact with the burning points so as to enable the burning device to carry out the burning program on each chip.
It should be noted that, a corresponding chip model may be marked on the PCB, and the chip model may be identified and obtained through an image recognition technology, or a chip model input by a user through a human-computer interface may be directly obtained, but is not limited thereto. After the chip model is obtained, the matched template small picture can be searched in the template database.
It should be noted that a plurality of identical chips are arranged on a PCB, each chip has a plurality of burning points (e.g., two or three), and different burning points of a single chip respectively undertake different functions. For example, for a chip with two burning points, one burning point is used for inputting the burning program, and the other burning point is used for outputting the burning result. Correspondingly, the burning device should also have two terminals, one terminal is used for inputting programs to the chip, and the other terminal is used for receiving the burning result output by the chip. For the same chip, the burning can be successfully realized only if the two burning points of the chip respectively correspond to the two wiring terminals one by one, and the burning can not be successfully realized if the two burning points simultaneously correspond to the same wiring terminal of the burning device. According to the invention, after the burning needle of the burning device contacts all burning points, all the burning points are divided based on different chips, so that the burning points of each chip can successfully correspond to the wiring terminal of the burning device, and batch burning of a plurality of chips is realized.
According to the embodiment of the invention, the calculation of the defect rate of each chip based on the complete chip sample specifically comprises the following steps:
carrying out gray processing on the segmented image information;
carrying out image enhancement processing on the grayed image;
carrying out binarization processing on the image after enhancement processing;
denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y);
calculating the incomplete area of the target chip as
Wherein L and W are respectively the length and width x of the target chip0，y0As the coordinates of the upper left corner of the target chip image,
t is a preset gray level threshold value;
according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
It should be noted that, the chip defects are generally divided into three types: edge, hole, corner. The ratio of the incomplete area in the complete chip sample can be used for calculating the incomplete rate, and whether the incomplete rate meets the preset incomplete rate standard or not is judged.
When the image is obtained, a black bottom plate can be used as a background color, and due to possible noise and the like, some black point areas with the gray value close to the background color exist on the chip. During the recognition process, the system may calculate these black points as the incomplete area (number of pixels), thereby causing a false judgment phenomenon. Therefore, after the image binarization, fine hole elimination and boundary smoothing are performed, and then area calculation is performed.
Further, calculating the defect rate of each chip based on the complete chip sample specifically includes:
respectively calculating the incomplete areas S of n different positions in the target chip according to the image recognition technology1，S2，...，Sn；
Weight W based on each position1，W2，...，WnRespectively calculating corresponding weighted areas S1W1，S2W2，...，SnWn；
Summarizing the weighted area S of each location1W1+S2W2+…+SnWnAnd combined with the complete chip sample area SSample (A)Calculating the defect rate of the target chip
It should be noted that some positions of the chip are not important, and even if the area has a defect, the influence is small; e.g., a border, and thus the weight of the region is relatively low. Some positions of the chip are important, for example, near the metal terminals, and the like, the region has small defects and can bring large influence, so that the weight of the position region is relatively high, reasonable yield detection can be effectively performed according to different defective parts of the chip by adding weight factors, and the accuracy of the yield detection is improved.
According to the embodiment of the invention, the program detection is performed on all the chips with the defective qualified marks through the detection device, and the method specifically comprises the following steps:
different detection environmental conditions are created through the detection equipment, and the detection environmental conditions comprise a vibration environment, a high-temperature environment, a low-temperature environment and a high-humidity environment;
and respectively placing all the chips with the incomplete qualified marks in different detection environment conditions for program detection so as to detect the virtual welding points on the chips.
It should be noted that many virtual solder joints on the chip are caused by improper production process in the production process, and the virtual solder joints mainly exist at the welding positions of the metal terminals and the chip main body, which easily causes an unstable state that the chip is not connected when being connected, so that the virtual solder joints are not easily detected in a stable environment.
According to the embodiment of the invention, the matching of the template small image and the original image information is carried out by adopting a template small image matching algorithm, which specifically comprises the following steps:
traversing each region in the original image information by adopting the template small image, and comparing the first similarity of each region and the template small image;
and when the first similarity of a certain region and the template small image exceeds a first preset threshold value, judging the region to be an independent chip region.
It should be noted that, the template small image matching algorithm is to find an image similar to the template small image in the original image information to be segmented. In specific operation, the template thumbnail can be used to traverse each possible region in the original image information, whether each region is similar to the template thumbnail or not is compared, and when the similarity is high enough, a conforming target region (i.e. a region where a chip is located) is considered to be found, and segmentation processing is performed.
Preferably, the first preset threshold may be set to 0.9, that is, when the similarity between a certain region and the template thumbnail is greater than or equal to 0.9, the certain region is considered as the target region. It is understood that the first predetermined threshold should be less than or equal to 1.
According to an embodiment of the present invention, before acquiring and acquiring original image information of a PCB, the method further includes:
and moving the PCB to be below the burning device, and enabling a plurality of burning pins arranged in an array on the burning device to cover each chip in the PCB.
According to the embodiment of the invention, the image processing is carried out on the divided image information to identify the burning points of all the defective qualified mark chips, and the method specifically comprises the following steps:
performing image processing on the segmented image information to obtain a corresponding gray image, analyzing the gray value of each point location in the gray image, and judging the point location with the gray value larger than a preset value as an electric connection point, wherein the electric connection point comprises a burning point and a metal terminal;
and analyzing the size of each electric connection point, and judging the electric connection points with the size smaller than a preset value as burning points.
As shown in fig. 2, a plurality of independent chips 11 are arranged on the PCB 1, each chip 11 is provided with two electrical connection points, namely a burning point 111 and a metal terminal 112, the burning point 111 is mainly used for burning programs, and the metal terminal 112 is mainly used for electrically connecting with a terminal device, so that the terminal device performs data interaction with the chip through the metal terminal. The terminal equipment can be a mobile phone, a computer, a PAD and the like. But is not limited thereto.
As shown in fig. 3, the burning apparatus 2 includes a burner (not shown), a controller (not shown), a floating mechanism (not shown), and a plurality of burning pins 21. The burner can be electrically connected with the plurality of burning needles 21, the corresponding burning needles 21 are contacted with the burning points of the chip, and the burner burns programs to the chip by means of the corresponding burning needles. The controller is used for controlling the floating mechanism, and the floating mechanism acts on the plurality of burning needles. It can be understood that the number of the burning needles is larger than that of the burning points on the PCB, when the PCB moves to the burning device, only part of the burning needles can be aligned to the burning points on the PCB, and other burning needles are not aligned to the burning points on the PCB and are idle. The controller controls the floating mechanism to descend the burning needle at the burning point, and the burning needle is accurately contacted with the corresponding burning point. Compared with the traditional manual operation mode, the automatic chip burning method has the advantages that the full-automatic chip burning process is realized, the accuracy of butt joint of the burning needle and the burning point is improved, and the yield of chip burning is further improved.
Furthermore, the PCB with the plurality of independent chips arranged is moved to the position under the burning device through the conveyor belt, and then the PCB is positioned through the corresponding positioning mechanism, so that the position relation between the burning device and the PCB is kept unchanged, the subsequent burning is facilitated to be positioned at a burning point, and the reliability of the chip burning process is improved.
Specifically, the number of burning points on each independent chip may be two, three, four, etc., and preferably two. The metal terminals on each individual chip may be two, three, four, etc., preferably two.
The gray scale value of the invention divides the white and the black into a plurality of levels according to the logarithmic relation, which is also called gray scale. Typically ranging from 0 to 255, 255 for white and 0 for black. For a grayscale image, a higher grayscale value for a certain point indicates a higher brightness for the point. The invention identifies the electric connection points (namely burning points and metal terminals) by judging the gray value of each point position. However, the brightness of the electrical connection points is different for different kinds of chips. For example: the brightness of the aluminum material electrical connection point is higher than that of the copper material electrical connection point, so that when the first preset threshold value is set, the brightness is set according to actual conditions, the gray value 200 can be selected as the first preset threshold value for the aluminum material electrical connection point, and the gray value 180 can be selected as the first preset threshold value for the copper material electrical connection point.
In general, the size of the burning point is smaller than that of the metal terminal, so the middle size between the burning point and the metal terminal can be selected as a predetermined value. However, for different types of chips, the size of the burning point and the size of the metal terminal are not fixed, and therefore, when the predetermined value is set, the predetermined value should be set according to the type of the actual chip.
According to the embodiment of the invention, acquiring the original image information of the PCB specifically comprises the following steps:
irradiating the upper surface of the PCB by a light source;
and a camera is adopted to shoot the original image information of the PCB.
Preferably, the camera is a CCD camera, and the light source is an LED lamp, but is not limited thereto.
It should be noted that an acute angle may be formed between the irradiation direction of the light source and the plane of the PCB, and the camera is located in the reflection direction of the light source after irradiating the PCB. It can be understood that when the light source irradiates the silica gel part of the chip, the generated reflected light is weak, and when the camera captures image information, the brightness of the chip is not high; when the light source irradiates the burning needle or the metal terminal of the chip, the burning needle or the metal terminal is made of metal, and strong reflection light can be generated by the burning needle or the metal terminal according to the reflection characteristic of the metal material, when the image is shot through the camera, the brightness of the image is obviously higher than that of other parts (such as a silicon surface, a plastic surface and the like) of the chip, namely, the gray value of the corresponding gray image is also the highest, and the burning needle or the metal terminal can be conveniently cut off from the PCB.
According to an embodiment of the present invention, after acquiring and acquiring original image information of the PCB, the method further includes:
matching the original image information with a front template image of the PCB;
calculating a second similarity between the original image information and the front template image of the PCB;
when the second similarity exceeds a second preset threshold value, the original image information is judged to correspond to the front side of the PCB, and when the second similarity is smaller than the second preset threshold value, the original image information is matched with the back side template image of the PCB;
calculating a third similarity between the original image information and the reverse side template image of the PCB;
and when the third similarity exceeds a third preset threshold, judging that the original image information corresponds to the reverse side of the PCB, prompting correction, and when the third similarity is smaller than the third preset threshold, sending an alarm signal.
It should be noted that, in the present invention, the side of the PCB board provided with the burning point is defined as a front side, and the side of the PCB board not provided with the burning point is defined as a back side. It can be understood that the burning device is located above the PCB, and when the front of the PCB faces upward, the burning pin of the burning device can contact the burning point. According to the invention, through a template matching algorithm, whether the front side of the PCB is upward or not is judged firstly, if the front side is upward, a subsequent chip burning process can be carried out, and if the back side is upward, correction prompt information can be sent out to prompt an operator or a manipulator to carry out turnover correction.
It can be understood that if the original image information is not matched with the front template image and the back template image, it is determined that the PCB and the PCB on which the chip burning has been previously completed do not belong to the same batch or the same class, and the burning procedures may be different for different batches or different classes of PCBs, and if the chip burning is performed on the PCB according to the previous procedure, the risk of chip burning failure may be caused. However, the original image information is sequentially matched with the front template image and the back template image, so that PCB boards except the original batch are effectively removed, and the yield of chip burning is improved.
According to the embodiment of the invention, the sectional area of the single burning needle is smaller than the contact area of the single burning point.
It can be understood that the sectional area of the burning needle is not too large, and the sectional area of the burning needle is reduced as much as possible while the electric connectivity is not affected, so that the burning needle can accurately contact the target point of the chip. The sectional area of a single burning needle is smaller than the contact area of a single burning point, so that the condition that the sectional area of the single burning needle is too large and the single burning needle is mistakenly connected to other point positions of the chip is effectively avoided, and the yield of chip burning is further improved.
According to the embodiment of the invention, the contact surface of a single burning point is circular, and in the plurality of burning pins arranged in an array, the distance between any two adjacent burning pins is smaller than or equal to the diameter of the circular contact surface of each burning point.
It should be noted that, because the position of each burning point on the chip or the PCB is not fixed, that is, the positions of the burning points of different types of chips are not fixed. According to the invention, by limiting the array arrangement density of the plurality of burning pins, when the plurality of burning pins arranged in the array cover all chips of the PCB, the distance between any two adjacent burning pins is smaller than or equal to the diameter of the circular contact surface of each burning point, so that the burning pins can be ensured to be aligned to the burning points on all chips, and the stability and the reliability of full-automatic burning of the chips are improved.
It should be noted that, because the metal terminals and the burning points may be respectively located on the front and back sides of the PCB, the burning device needs to burn at the burning points, and the detection device needs to perform program detection at the metal terminals; after the program burning is finished, the program needs to be turned over manually or by a manipulator, and then the program detection is carried out. Prior to program detection, the method of the present invention further comprises: the front and back sides of the PCB are detected through a template matching method (the front side indicates that a burning point faces upwards, and the back side indicates that a metal terminal faces upwards), subsequent program detection is carried out when the current PCB is in a back side posture, an operator needs to be reminded to turn over when the current PCB is in a front side posture, and program detection can be carried out after turning over.
Fig. 4 is a block diagram of a chip burning detection system according to the present invention.
As shown in fig. 4, a second aspect of the present invention further provides a system for detecting burning of a chip, where the system includes:
the system comprises an image acquisition module, a processing module and a display module, wherein the image acquisition module is used for acquiring and acquiring original image information of a PCB (printed circuit board), and a plurality of chips are distributed on the PCB;
the image processing module is used for acquiring the chip model on the PCB and searching the corresponding template thumbnail according to the chip model; matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
the calculation module is used for calculating the defect rate of each chip based on the complete chip sample;
the judgment marking module is used for judging whether the defect rate of each chip exceeds a preset defect threshold value, if the defect rate of the target chip exceeds the preset defect threshold value, performing defect unqualified marking on the target chip, and if the defect rate of the target chip does not exceed the preset defect threshold value, performing defect qualified marking on the target chip;
the burning device screens all chips with incomplete qualified marks from the segmented image information and carries out batch burning procedures on the chips;
and the detection device is used for carrying out program detection on all the incomplete qualified marked chips and judging whether the corresponding chips are qualified products or not according to the detection result.
It should be noted that the system of the present invention can be operated in a terminal device such as a PC, a mobile phone, a PAD, etc.
The system further comprises a transmission module, wherein the transmission module is used for moving the PCB with the plurality of independent chips arranged to the position under the burning device or the detection device, when the PCB is under the burning device, the plurality of burning needles arranged in an array on the burning device cover burning points on each independent chip in the PCB, and when the PCB is under the detection device, the plurality of burning needles arranged in an array on the burning device cover metal terminals on each independent chip in the PCB.
Further, the burning device is also used for carrying out image processing on the segmented image information so as to identify burning points of all incomplete qualified mark chips; marking the coordinate positions of the burning points of all the incomplete qualified marking chips in the segmented image information; and selecting the corresponding burning needle based on the coordinate positions of all the burning points, and controlling the burning needle to contact with the burning points so as to carry out a burning program on each chip.
Further, the computing module is used for carrying out gray processing on the segmented image information; carrying out image enhancement processing on the grayed image; carrying out binarization processing on the image after enhancement processing; denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y); computing defects of target chipArea of
Wherein L and W are respectively the length and width x of the target chip0，y0As the coordinates of the upper left corner of the target chip image,
t is a preset gray level threshold value; according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
Furthermore, the calculation module is further configured to calculate incomplete areas S at n different positions in the target chip according to an image recognition technique1，S2，...，Sn(ii) a Weight W based on each position1，W2，...，WnRespectively calculating corresponding weighted areas S1W1，S2W2，...，SnWn(ii) a Summarizing the weighted area S of each location1W1+S2W2+…+SnWnAnd combined with the complete chip sample area SSample (A)Calculating the defect rate of the target chip
Furthermore, the detection device also creates different detection environmental conditions through the detection equipment, wherein the detection environmental conditions comprise a vibration environment, a high-temperature environment, a low-temperature environment and a high-humidity environment; and respectively placing all the chips with the incomplete qualified marks in different detection environment conditions for program detection so as to detect the virtual welding points on the chips.
Further, the image processing module traverses each region in the original image information by using the template small image, and compares the first similarity of each region and the template small image; and when the first similarity of a certain region and the template small image exceeds a first preset threshold value, judging the region to be an independent chip region.
Further, the image processing module is also used for matching the original image information with a front template image of the PCB; calculating a second similarity between the original image information and the front template image of the PCB; when the second similarity exceeds a second preset threshold value, the original image information is judged to correspond to the front side of the PCB, and when the second similarity is smaller than the second preset threshold value, the original image information is matched with the back side template image of the PCB; calculating a third similarity between the original image information and the reverse side template image of the PCB; and when the third similarity exceeds a third preset threshold, judging that the original image information corresponds to the reverse side of the PCB, prompting correction, and when the third similarity is smaller than the third preset threshold, sending an alarm signal.
The third aspect of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium includes instructions, and when the instructions are executed on a computer, the instructions cause the computer to perform the steps of the chip burning detection method as described above.
The invention provides a chip burning detection method, a chip burning detection system and a computer readable storage medium, which can realize batch burning detection of a plurality of chips on a PCB and have higher detection accuracy.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units; can be located in one place or distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all the functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Alternatively, the integrated unit of the present invention may be stored in a computer-readable storage medium if it is implemented in the form of a software functional module and sold or used as a separate product. Based on such understanding, the technical solutions of the embodiments of the present invention may be essentially implemented or a part contributing to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A chip burning detection method is characterized by comprising the following steps:
acquiring original image information of a PCB (printed Circuit Board), wherein a plurality of chips are distributed on the PCB;
obtaining the chip model on the PCB, and searching the corresponding template small picture according to the chip model;
matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
calculating the defect rate of each chip based on the complete chip sample;
judging whether the defect rate of each chip exceeds a preset defect threshold value, if so, marking the target chip with unqualified defects, and if not, marking the target chip with qualified defects;
screening all chips with defective qualified marks from the segmented image information, and carrying out batch burning program on the chips by adopting a burning device;
after the program burning is finished, program detection is carried out on all the chips with the incomplete qualified marks through the detection device, and whether the corresponding chips are qualified products or not is judged according to the detection result.
2. The method for detecting burning of the chip as claimed in claim 1, wherein the burning device is used for performing a batch burning procedure, and the method specifically comprises:
carrying out image processing on the segmented image information to identify burning points of all incomplete qualified mark chips;
marking the coordinate positions of the burning points of all the incomplete qualified marking chips in the segmented image information;
and selecting the corresponding burning needle based on the coordinate positions of all the burning points, and controlling the burning needle to contact with the burning points so as to enable the burning device to carry out the burning program on each chip.
3. The method for detecting burning of chips of claim 1, wherein the calculating of the defect rate of each chip based on the complete chip samples comprises:
carrying out gray processing on the segmented image information;
carrying out image enhancement processing on the grayed image;
carrying out binarization processing on the image after enhancement processing;
denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y);
calculating the incomplete area of the target chip as
Wherein L and W are respectively the length and width x of the target chip0，y0As the coordinates of the upper left corner of the target chip image,
t is a preset gray level threshold value;
according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
4. The method for detecting burning of chips of claim 1, wherein the defect rate of each chip is calculated based on the complete chip samples, and further comprising:
respectively calculating the incomplete areas S of n different positions in the target chip according to the image recognition technology1，S2，...，Sn；
Weight W based on each position1，W2，...，WnRespectively calculating corresponding weighted areas S1W1，S2W2，...，SnWn；
Summarizing the weighted area S of each location1W1+S2W2+…+SnWnAnd combined with the complete chip sample area SSample (A)Calculating the defect rate of the target chip
5. The method for detecting burning of chips of claim 1, wherein the detecting device is used to perform program detection on all chips with defective qualified marks, and further comprising:
different detection environmental conditions are created through the detection equipment, and the detection environmental conditions comprise a vibration environment, a high-temperature environment, a low-temperature environment and a high-humidity environment;
and respectively placing all the chips with the incomplete qualified marks in different detection environment conditions for program detection so as to detect the virtual welding points on the chips.
6. The method for detecting burning of the chip as claimed in claim 1, wherein matching the template small image with the original image information by using a template small image matching algorithm specifically comprises:
traversing each region in the original image information by adopting the template small image, and comparing the first similarity of each region and the template small image;
and when the first similarity of a certain region and the template small image exceeds a first preset threshold value, judging the region to be an independent chip region.
7. The method for detecting burning of chips as claimed in claim 1, wherein after acquiring the original image information of the PCB, the method further comprises:
matching the original image information with a front template image of the PCB;
calculating a second similarity between the original image information and the front template image of the PCB;
when the second similarity exceeds a second preset threshold value, the original image information is judged to correspond to the front side of the PCB, and when the second similarity is smaller than the second preset threshold value, the original image information is matched with the back side template image of the PCB;
calculating a third similarity between the original image information and the reverse side template image of the PCB;
and when the third similarity exceeds a third preset threshold, judging that the original image information corresponds to the reverse side of the PCB, prompting correction, and when the third similarity is smaller than the third preset threshold, sending an alarm signal.
8. A system for detecting burning of chips, the system comprising:
the system comprises an image acquisition module, a processing module and a display module, wherein the image acquisition module is used for acquiring and acquiring original image information of a PCB (printed circuit board), and a plurality of chips are distributed on the PCB;
the image processing module is used for acquiring the chip model on the PCB and searching the corresponding template thumbnail according to the chip model; matching the template small image with the original image information by adopting a template small image matching algorithm, segmenting each matched independent chip from the original image information, and outputting segmented image information;
the calculation module is used for calculating the defect rate of each chip based on the complete chip sample;
the judgment marking module is used for judging whether the defect rate of each chip exceeds a preset defect threshold value, if the defect rate of the target chip exceeds the preset defect threshold value, performing defect unqualified marking on the target chip, and if the defect rate of the target chip does not exceed the preset defect threshold value, performing defect qualified marking on the target chip;
the burning device screens all chips with incomplete qualified marks from the segmented image information and carries out batch burning procedures on the chips;
and the detection device is used for carrying out program detection on all the incomplete qualified marked chips and judging whether the corresponding chips are qualified products or not according to the detection result.
9. The system for burning detection of chips of claim 8, wherein the computing module is configured to perform graying processing on the segmented image information; carrying out image enhancement processing on the grayed image; carrying out binarization processing on the image after enhancement processing; denoising the image after the binarization processing to obtain the gray level image, wherein the gray level value of the gray level image at the coordinate (x, y) is G (x, y); calculating the incomplete area of the target chip as
Wherein L and W are respectively the length and width x of the target chip0，y0As the coordinates of the upper left corner of the target chip image,
t is a preset gray level threshold value; according to the incomplete area S and the complete chip sample area SSample (A)Calculating the defect rate of the target chip
10. A computer-readable storage medium comprising instructions which, when executed on a computer, cause the computer to perform the steps of a method for chip burning detection as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010051378.XA CN111275674A (en) | 2020-01-17 | 2020-01-17 | Chip burning detection method and system and computer readable storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010051378.XA CN111275674A (en) | 2020-01-17 | 2020-01-17 | Chip burning detection method and system and computer readable storage medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111275674A true CN111275674A (en) | 2020-06-12 |
Family
ID=71001093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010051378.XA Withdrawn CN111275674A (en) | 2020-01-17 | 2020-01-17 | Chip burning detection method and system and computer readable storage medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111275674A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881407A (en) * | 2021-01-14 | 2021-06-01 | 广州大学 | Method, system, device and medium for detecting welding quality of LED chip |
| CN113326219A (en) * | 2021-06-06 | 2021-08-31 | 深圳市昂科技术有限公司 | Communication method based on burning system, burning method and computer storage medium |
| CN115423814A (en) * | 2022-11-07 | 2022-12-02 | 江西兆驰半导体有限公司 | Chip origin positioning method and device, readable storage medium and electronic equipment |
-
2020
- 2020-01-17 CN CN202010051378.XA patent/CN111275674A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881407A (en) * | 2021-01-14 | 2021-06-01 | 广州大学 | Method, system, device and medium for detecting welding quality of LED chip |
| CN113326219A (en) * | 2021-06-06 | 2021-08-31 | 深圳市昂科技术有限公司 | Communication method based on burning system, burning method and computer storage medium |
| CN113326219B (en) * | 2021-06-06 | 2022-06-07 | 深圳市昂科技术有限公司 | Burning method based on burning system and computer storage medium |
| CN115423814A (en) * | 2022-11-07 | 2022-12-02 | 江西兆驰半导体有限公司 | Chip origin positioning method and device, readable storage medium and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111275674A (en) | Chip burning detection method and system and computer readable storage medium | |
| US6246788B1 (en) | System and method of optically inspecting manufactured devices | |
| JP4595705B2 (en) | Substrate inspection device, parameter setting method and parameter setting device | |
| CN105510348A (en) | Flaw detection method and device of printed circuit board and detection equipment | |
| CN106651857B (en) | A kind of printed circuit board patch defect inspection method | |
| JP2013148361A (en) | Method for registering inspection standard for soldering inspection, and board inspection apparatus based on said method | |
| JP5045591B2 (en) | Method for creating area setting data for inspection area and board appearance inspection apparatus | |
| CN111929239A (en) | AOI detection device and detection method for PCB part defects | |
| JP3993107B2 (en) | Component recognition data creation method and creation apparatus, and component recognition data creation program | |
| JP4506395B2 (en) | Substrate inspection device, parameter setting method and parameter setting device | |
| CN111273921A (en) | Chip burning method, system and computer readable storage medium | |
| JP2007033126A (en) | Substrate inspection device, parameter adjusting method thereof and parameter adjusting device | |
| CN113933309B (en) | Method for retesting blind hole Kong Nabu of AOI machine | |
| CN115100166A (en) | Welding spot defect detection method and device | |
| CN111275716A (en) | Chip burning method, system and computer readable storage medium | |
| CN111273155A (en) | Chip burning detection method and system and computer readable storage medium | |
| JPH11271234A (en) | Inspecting device and method, and inspecting reference data forming device | |
| WO2008124392A1 (en) | 2d/3d inspection method and system | |
| WO1997034258A1 (en) | Inspection device and method using pattern matching | |
| JP4419778B2 (en) | Substrate inspection device, parameter setting method and parameter setting device | |
| CN113409251B (en) | Data processing method for integrated circuit manufacturing | |
| JP2003270304A (en) | Probe device and method for recognizing probe tip | |
| JPH0989525A (en) | Position detecting method for lead shoulder and for lead end | |
| CN117132599B (en) | Circuit board defect detection method and device, electronic equipment and storage medium | |
| US20230029432A1 (en) | Soldering quality inspection method and soldering quality inspection apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200612 |
|
| WW01 | Invention patent application withdrawn after publication |