CN112865872A - Analog optical transmission module - Google Patents

Abstract

The application discloses an analog optical transmission module, which comprises N bidirectional transmission optical signal receiving and transmitting combined components, a golden finger, a receiving circuit, a transmitting circuit, N transmitting and transmitting channels and N receiving and transmitting channels, wherein each bidirectional transmission optical signal receiving and transmitting combined component comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting an electric signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an optical signal TO be output, and the receiving TO is used for converting an optical signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an electric signal TO be output; the golden finger, the receiving circuit and the transmitting circuit are all arranged in the printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, and one end of a microstrip line of the transmitting circuit is electrically connected with the golden finger; one end of the Kth transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit. It can reduce signal crosstalk between multiple channels and has small size.

Description

Analog optical transmission module

Technical Field

The application relates to the field of communication, in particular to an analog optical transmission module.

Background

Radio-over-fiber (rof) technology for radio-over-fiber (radio-over-fiber) over fiber (radio-over-fiber) (rof) is an emerging and developed wireless access technology combining optical fiber communication and wireless communication in response to the high-speed and high-capacity wireless communication demand. The microwave is modulated to the laser at the central station, then the modulated light wave is transmitted through a complex optical fiber link, and after reaching the base station, the microwave signal is demodulated through photoelectric conversion and then transmitted through an antenna for a user to use. Radio frequency (or millimeter wave) signals transmitted by the optical fiber improve wireless bandwidth, but the loss of the antenna in the atmosphere after being transmitted is increased, and the optical fiber is used as a transmission link and has the characteristics of low loss, high bandwidth and electromagnetic interference prevention. Due to the advantages, the RoF technology has wide application prospects in the fields of future wireless broadband communication, satellite communication, intelligent traffic systems and the like. Compared with the traditional system, the RoF system has the advantages of wider cellular coverage, wider bandwidth, lower cost, lower power consumption, easy installation and the like.

The existing analog optical module needs to use a special radio frequency head for signal transmission, has high cost and is difficult to realize miniaturization, thereby limiting the mass application of the analog optical module. The analog optical transmission module has high requirement on the isolation between channels, and no multi-channel small analog optical module exists at present.

Disclosure of Invention

An object of the present application is to provide a miniaturized analog optical transmission module capable of reducing signal crosstalk between multiple channels,

an analog optical transmission module comprises N bidirectional transmission optical signal receiving and transmitting combined components, a golden finger, a receiving circuit, a transmitting circuit, N transmitting and transmitting channels and N receiving and transmitting channels, wherein each bidirectional transmission optical signal receiving and transmitting combined component comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting an electric signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an optical signal TO be output, and the receiving TO is used for converting the optical signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an electric signal TO be output; the golden finger, the receiving circuit and the transmitting circuit are all arranged in the printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, and one end of a microstrip line of the transmitting circuit is electrically connected with the golden finger; one end of the Kth transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit, and the other end of the Kth transmitting transmission channel is electrically connected with the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; one end of the Kth receiving transmission channel is electrically connected with the other end of the microstrip line of the receiving circuit, and the other end of the Kth receiving transmission channel is electrically connected with the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; wherein N is a positive integer of 1 or more, and K =1, 2, …, N.

The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separated transmitting and receiving.

The grounds of the gold fingers are electrically connected to each other.

The analog radio frequency signal of the golden finger is transmitted in a single-ended signal transmission mode.

The size of the golden finger is compatible with the standard DSFP protocol.

The transmitting and transmitting channel is a transmitting flexible circuit board, and the receiving and transmitting channel is a receiving flexible circuit board.

The receiving TO is TO33 or TO46, and the transmitting TO is TO38 or TO 56.

N=2。

The upper layer and the lower layer of the golden finger are respectively arranged on two surfaces of one end of the printed circuit board, which are opposite to each other; 2 two-way transmission light signal reception and transmission combination part vertically set up side by side in the drain pan and fix on two flange face bayonets of drain pan through standard LC sleeve respectively, and printed circuit board sets up in the rear end of drain pan, and the upper cover lid fits the drain pan, carries out spacing fixed through the recess of upper cover front end bump and drain pan, and the rear end is through first set screw and the fastening of second set screw.

Further comprising:

and the heat sink is arranged between the transmitting TO and the bottom shell of the bidirectional transmission optical signal receiving and transmitting combined component and is respectively contacted with the transmitting TO and the bottom shell.

The beneficial technical effect of this application is:

according TO the BOSA scheme with separated transmitting and receiving, each TO signal is transmitted by using a separate transmitting and transmitting channel and a separate receiving and transmitting channel, and the transmitting and transmitting channels and the receiving and transmitting channels are directly fixed nearby the golden fingers, so that crosstalk of radio-frequency signals in the transmission process of a printed circuit board can be reduced; the scheme adopts the golden finger to transmit the multichannel analog signals, realizes the transmission of the multichannel analog signals under the SFP packaging size, reduces the volume, increases the transmission density and has universal adaptability.

Drawings

Fig. 1 is an electrical schematic diagram of an analog optical transmission module according to an embodiment of the present disclosure;

fig. 2 is a structural diagram of an analog optical transmission module according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram for compatible side-by-side BOSA placement according to an embodiment of the present disclosure

Fig. 4 is an exploded view of an analog optical transmission module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an external connector of an analog optical transmission module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a pluggable circuit board assembly connector with gold fingers according to an embodiment of the present disclosure after being plugged in a mating manner;

fig. 7 is a schematic structural diagram of a BOSA according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of a printed circuit board compatible with side-by-side BOSA according to an embodiment of the present disclosure;

fig. 9 is a schematic diagram of an SFP + cage, an analog optical transmission module, and an optical fiber connection according to the present application;

FIG. 10 is a schematic view of a gold finger of the present application on a printed circuit board;

FIG. 11 is a schematic diagram of a PIN pinning structure of a lower layer of a golden finger according to the present application;

FIG. 12 is a schematic diagram of a PIN pinning structure of a gold finger at an upper layer of the present application;

FIG. 13 is a table of PIN definitions of gold fingers at upper and lower layers of the present application;

fig. 14 is a schematic diagram of a performance simulation result according to an embodiment of the present application.

Detailed Description

The following examples are given by way of illustration of the present application and it is necessary to note that the following examples are given by way of illustration only and should not be construed to limit the scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "clockwise," "counterclockwise," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the present application.

Furthermore, the terms "first", "second", "kth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "kth" may explicitly or implicitly include one or more of that feature. In the description of the present application, unless otherwise indicated, "a plurality" means two or more unless explicitly defined otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The analog optical transmission module is used for transmitting broadband analog signals, has a frequency range of 10M-20G, and comprises N bidirectional transmission optical signal receiving and transmitting combined components, a golden finger, a receiving circuit, a transmitting circuit, N transmitting and transmitting channels and N receiving and transmitting channels, wherein each bidirectional transmission optical signal receiving and transmitting combined component comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting electric signals input into the bidirectional transmission optical signal receiving and transmitting combined components into optical signal outputs, and the receiving TO is used for converting the optical signals input into the bidirectional transmission optical signal receiving and transmitting combined components into the electric signals TO be output; the golden finger, the receiving circuit and the transmitting circuit are all arranged in the printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, and one end of a microstrip line of the transmitting circuit is electrically connected with the golden finger; one end of the Kth transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit, and the other end of the Kth transmitting transmission channel is electrically connected with the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; one end of the Kth receiving transmission channel is electrically connected with the other end of the microstrip line of the receiving circuit, and the other end of the Kth receiving transmission channel is electrically connected with the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; wherein N is a positive integer of 1 or more, and K =1, 2, …, N. The bidirectional transmission optical signal receiving and transmitting combined component is a BOSA structure with separated transmitting and receiving. The transmitting transmission channel is a transmitting flexible circuit board, and the receiving transmission channel is a receiving flexible circuit board.

The grounds of the gold fingers 21 are electrically connected to each other. In order to further reduce crosstalk between analog signals, the ground of the golden finger 21 is subjected to via hole processing, so that the upper layer ground and the lower layer ground of the golden finger are electrically connected together through via holes, and channel crosstalk can be effectively shielded. The analog radio frequency signal of the golden finger is transmitted by using a single-ended signal transmission mode. The size of the gold finger is compatible with standard DSFP protocol.

The present application is further described below with N =2 as an example.

The application provides an analog optical transmission module, which can realize the transmission of multi-channel broadband signals and realize the stable transmission of signal frequencies from 10M to 20G. As shown in fig. 1, the multi-channel analog Optical module in the embodiment of the present application may include a gold finger port, two Bi-directional Optical signal receiving and transmitting combined components (BOSA), a transmitting circuit, a receiving circuit, and a printed circuit board assembly. The receiving circuit and the transmitting circuit control two BOSAs at the same time, namely, two signal transmitting links and two signal receiving links;

as shown in fig. 2, an analog optical transceiver module is provided in the embodiments of the present application. Compared with the packaging forms of SFP/SFP +/DSFP and the like, the structure can vertically place two BOSA structures side by side on the basis of not increasing the length and the width of the module, as shown in FIG. 3; the length and width directions of the size of the device can also accord with the standard of the SFF-8432Rev5.2 protocol, and the height direction of the device is about 2mm higher than the standard of the SFF-8432Rev5.2 protocol; the design of the rear end of the module and the height of the printed circuit board 6 conform to the SFP/SFP +/DSFP protocol; therefore, the connector is compatible with the existing connector and the LC optical fiber jumper wire in the aspect of structure, and has universality.

In one embodiment, as shown in fig. 2-4, the first BOSA7 and the second BOSA8 are fixed on the two flange surface bayonets of the bottom shell 1 through the standard LC sleeve 14, and the positions in the optical port are consistent, so that the optical fiber connector can be compatible with a standard LC optical fiber connector and can be plugged, as shown in fig. 9. The printed circuit board 6 is disposed in the rear end of the bottom case 1. The upper cover 5 covers the bottom shell, the salient point at the front end of the upper cover 5 and the groove of the bottom shell 1 are used for limiting and fixing, and the rear end of the upper cover 5 only needs two screws, namely a first fixing screw 9 and a second fixing screw 11, to fasten and fix the bottom shell 1 and the upper cover 5, so that the optical module is simple and reliable in structure and convenient to assemble and repair. The EMI shielding elastic sheet 2 is approximately U-shaped, the U-shaped opening is provided with oppositely-opposite raised clamping claws, the front end of the bottom shell 1 is positioned in the EMI shielding elastic sheet 2, the clamping claws of the EMI shielding elastic sheet 2 buckle the upper cover 5, and the EMI shielding elastic sheet 2 is wrapped outside the bottom shell 1 and the upper cover 5 and used for locking the module. The pull ring 3 is arranged at the front end of the bottom shell 1 and used for drawing the application. The bottom shell 1 and the upper cover 5 form a shell for protecting the devices inside the application and isolating electromagnetic signals. A spring 10 is mounted on the upper cover 5 for releasing the elastic force. The slider 4 is mounted on the upper cover 5 and accommodates the spring 10 therein, and the spring 10 provides an elastic force for returning the slider 4 to an original position after sliding. The bottom shell 1 further comprises an optical port for placing an output optical end of the BOSA.

In one embodiment, the rf connection port may be a hot-pluggable structure, as shown in fig. 5 and 6, which facilitates installation and maintenance of the analog optical transmission module of the present application. One end of the plug can be a pluggable circuit board component 12 with golden fingers, the other end is assembled with the external connector 13, and the size of the pluggable circuit board component 12 can be compatible with a Small form-factor pluggable transceiver plus (SFP +)/double Small form-pluggable optical signal transceiver (DSFP) and the like. In one embodiment, the external connector 13 is compatible with a standard SFP +/DSFP connector, which improves compatibility and ensures the universality of the rf connector; the gold finger 21 in the pluggable circuit board assembly 12 with gold finger may be connected to the receiving circuit 23 and the transmitting circuit 22 through a dc current signal, and may also be connected to the first BOSA7 and the second BOSA8 through a broadband rf signal. As shown in fig. 10, the upper layer and the lower layer of the gold finger 21 are respectively disposed on two opposite surfaces of one end of the printed circuit board, and the grounds of the upper layer and the lower layer are electrically connected together through a via hole. The PIN definition of the gold finger 21 is shown in fig. 11-13.

In one embodiment, the first BOSA7 and the second BOSA8 are respectively provided with the addition of a heat sink 18, and the heat sink 18 is arranged between the transmitting TO and the bottom shell 1 of the bidirectional transmission optical signal receiving and transmitting combined component and is respectively contacted with the transmitting TO and the bottom shell 1. Specifically, as shown in fig. 8, the upper surface of the heat sink 18 is concave for contacting the reflective TO17 of the first BOSA7, and the contact portion is generally filled with a heat dissipation film or silica gel TO improve the heat dissipation effect; the lower surface of the heat sink 18 is contacted with the bottom shell 1, generally, a contact part can be filled with a heat dissipation film or silica gel to improve the heat dissipation effect, the heat sink can be made of metal with different heat conduction coefficients, the heat dissipation of the module is promoted, the BOSA optical device is protected, and the structure and the shape of the heat sink 18 can be adjusted according to different packaging sizes to match different optical module packages; in another embodiment, the heat sink is directly grown on the bottom case 1 using the same material of the bottom case for eliminating the assembly step. The second BOSA8 is provided with heat sinks in the same manner as the first BOSA 7.

In one embodiment, for the first BOSA7 and second BOSA8 sections described above, the first BOSA is composed of first receiving TO15, first BOSA shell 16, and first transmitting TO17, as shown in fig. 7. The first receiving TO15 is TO33 (TO 33 is a size standard of a TO base), the first transmitting TO17 is TO38 (TO 38 is a size standard of a TO base), and the small-size TO can be used for making the whole structure small and compatible with an SFP (small form factor pluggable) package; the first BOSA shell 16 is a metal structural member and is used for fixing the first receiving TO15 and the first emitting TO17, and meanwhile, an optical filter is arranged in the first BOSA shell 16 TO realize the light splitting and light combining effects of different wavelengths; the TO38 transmitting terminal has no cooling function, but has small volume and is easy TO assemble in the shell 1. The second BOSA is composed of a second receiving TO, a second BOSA shell and a second transmitting TO, and the connection structure of the second receiving TO, the second BOSA shell and the second transmitting TO is the same as that of the first BOSA7, which is specifically referred TO the description of the connection structure of the first BOSA 7.

In one embodiment, for the first BOSA7 and the second BOSA8, as shown in fig. 7, the first BOSA7 is externally composed of a first transmitting flexible circuit board 19, a first receiving flexible circuit board 20 and a first BOSA light port LC sleeve 14, the first transmitting flexible circuit board 19 is fixed at one end on the printed circuit board 6 and connected with a transmitting circuit 22, and the first receiving flexible circuit board 20 is fixed at one end on the printed circuit board 6 and connected with a receiving circuit 23; the other end of the first transmitting flexible circuit board 19 is fixed on the first transmitting TO17 pin of the first BOSA7, and the other end of the first receiving flexible circuit board 20 is fixed on the first receiving TO15 pin. Similarly, the second BOSA also has a second launch flexible circuit board, a second receive flexible circuit board, and a second BOSA optical port LC sleeve, which is the same as that of the first BOSA 7. The aforementioned fixing may be, but is not limited to, high temperature solder soldering. The first and second transmitting flexible circuit boards and the first and second receiving flexible circuit boards can pass through direct current signals and broadband radio frequency signals; the first BOSA optical port LC sleeve 14 and the second BOSA optical port LC sleeve can realize the access and emission of light, namely, single-fiber bidirectional transmission signals can simultaneously transmit the emission light signals of 1270nm (1260-. If the first BOSA7 transmits the emitted light signal of 1270nm (1260-; on the contrary, if the second BOSA7 transmits the emitted light signal of 1270nm (1260-.

In another embodiment, the wavelengths can also transmit 1270nm (1260-.

In another embodiment, TO emission TO can also use cooled TO56 (TO 56 is a size standard for TO bases) for stable output of emission TO, and TO56 emission has larger size and larger heat generation compared TO38 emission, but with TEC temperature control, has more stable performance output under severe ambient temperature conditions. The TO56 transmitter could also be integrated into the BOSA and then mounted in the structure of the housing 1.

In one embodiment, as in functional fig. 8, the printed circuit board includes a transmit circuit 22, a receive circuit 23, a processor chip 24, a gold finger 21; the transmitting circuit 22 comprises a transmitting power supply function, a gain automatic equalization function and a microstrip transmission function; the transmitting circuit 22 is connected with the first transmitting TO17 through the first transmitting flexible circuit board 19, and the other end of the transmitting circuit is connected TO the external connector 13 through a golden finger; the transmitting circuit 22 provides power for the first transmitting TO17 of the first BOSA7 TO realize the power supply function; when the external environment temperature changes, the transmitting circuit 22 performs gain change feedback to realize gain equalization control, so that the gains are kept basically consistent under different environment temperature conditions; the microstrip line in the transmitting circuit 22 transmits the broadband radio frequency signal from the gold finger 21 to the first transmitting flexible circuit board 19. The receiving circuit 23 includes a function of receiving TO power supply and a microstrip transmission function; the receiving circuit 23 is connected TO the first receiving TO15 through the first receiving flexible circuit board 20, and the other end is connected TO the external connector 13 through the gold finger 21; the receiving circuit 23 supplies power TO the first receiving TO15 of the first BOSA7 TO realize a power supply function; the microstrip line in the receiving circuit 23 transmits the broadband radio frequency signal from the first receiving flexible circuit board 20 to the gold finger. The printed circuit board is connected with the second BOSA8 through the second transmitting flexible circuit board and the second receiving flexible circuit board in the same way as the first BOSA7, namely, the connection of the second BOSA8 with the transmitting circuit 22, the receiving circuit 23, the processor chip 24 and the gold finger 21 through the second transmitting flexible circuit board and the second receiving flexible circuit board is the same as the connection of the first BOSA7 with the transmitting circuit 22, the receiving circuit 23, the processor chip 24 and the gold finger 21 through the first transmitting flexible circuit board 19 and the first receiving flexible circuit board 20. The processor chip 24 is used for monitoring the working states of the first BOSA7 and the second BOSA 8; the gold finger 21 is used for transmission of electrical signals and broadband radio frequency signals.

Fig. 9 is a schematic diagram of an SFP + cage 26 connected to an analog optical transmission module 25 and an optical fiber 27 according to an embodiment of the present application.

Compared with a digital optical module, the analog optical module belongs to broadband signal transmission, and the gain within the whole signal frequency range needs to be ensured to be flat, so that the gain loss within the whole signal frequency range is small; traditional analog optical module needs special radio frequency head to carry out broadband radio frequency signal transmission, uses the golden finger of the relative low price to carry out broadband radio frequency signal transmission for the first time in this application, uses differential signal transmission for digital module, and this application uses single-ended signal transmission, has realized transmitting broadband radio frequency signal better.

This application has realized 10M ~ 20G's broadband analog signal transmission, and 4 passageways are inserted and is decreased, and the reflection is little, and the isolation is big between the passageway, refers to fig. 14.

It should be noted that the various features described in the foregoing embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the present application does not describe every possible combination.

The present application has been described in detail with reference to the embodiments, which are illustrative rather than restrictive, and variations and modifications thereof are possible within the scope of the present application without departing from the general concept thereof.

Claims (11)

1. An analog optical transmission module is characterized by comprising N bidirectional transmission optical signal receiving and transmitting combined components, a golden finger, a receiving circuit, a transmitting circuit, N transmitting and transmitting channels and N receiving and transmitting channels, wherein each bidirectional transmission optical signal receiving and transmitting combined component comprises a transmitting TO and a receiving TO, the transmitting TO is used for converting an electric signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an optical signal TO be output, and the receiving TO is used for converting the optical signal input into the bidirectional transmission optical signal receiving and transmitting combined component into an electric signal TO be output; the golden finger, the receiving circuit and the transmitting circuit are all arranged in the printed circuit board, one end of a microstrip line of the receiving circuit is electrically connected with the golden finger, and one end of a microstrip line of the transmitting circuit is electrically connected with the golden finger; one end of the Kth transmitting transmission channel is electrically connected with the other end of the microstrip line of the transmitting circuit, and the other end of the Kth transmitting transmission channel is electrically connected with the output end of the transmitting TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; one end of the Kth receiving transmission channel is electrically connected with the other end of the microstrip line of the receiving circuit, and the other end of the Kth receiving transmission channel is electrically connected with the input end of the receiving TO of the Kth bidirectional transmission optical signal receiving and transmitting combined component; wherein N is a positive integer of 1 or more, and K =1, 2, …, N.

2. The analog optical transmission module of claim 1, wherein the bidirectional optical signal receiving and transmitting combination is a BOSA architecture with separate transmission and reception.

3. The analog light transmission module of claim 1 wherein the grounds of the gold fingers are electrically connected to each other.

4. The analog optical transmission module of claim 1, wherein the analog rf signal of the gold finger is transmitted using single-ended signal transmission.

5. The analog optical transmission module of claim 1, wherein the gold finger is sized to comply with standard DSFP protocols.

6. The analog optical transmission module of claim 1, wherein the transmitting channel is a transmitting flexible circuit board and the receiving channel is a receiving flexible circuit board.

7. The analog optical transmission module of claim 1, wherein the receiving TO is TO33 or TO46, and the transmitting TO is TO38 or TO 56.

8. The analog optical transmission module of claim 1, wherein the analog optical transmission module is configured to transmit analog signals in a wide frequency range from 10M to 20G.

9. The analog optical transmission module of any of claims 1-8, wherein N = 2.

10. The analog optical transmission module of claim 9, further comprising a bottom case and an upper cover, wherein the upper layer and the lower layer of the gold finger are respectively disposed on two opposite surfaces of one end of the printed circuit board; 2 two-way transmission light signal reception and transmission combination part vertically set up side by side in the drain pan and fix on two flange face bayonets of drain pan through standard LC sleeve respectively, and printed circuit board sets up in the rear end of drain pan, and the upper cover lid fits the drain pan, carries out spacing fixed through the recess of upper cover front end bump and drain pan, and the rear end is through first set screw and the fastening of second set screw.

11. The analog optical transmission module of claim 10, further comprising:

and the heat sink is arranged between the transmitting TO and the bottom shell of the bidirectional transmission optical signal receiving and transmitting combined component and is respectively contacted with the transmitting TO and the bottom shell.

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