CN112864270A - 光晶体管集成传感核心的无光栅量子点光谱探测器 - Google Patents
光晶体管集成传感核心的无光栅量子点光谱探测器 Download PDFInfo
- Publication number
- CN112864270A CN112864270A CN202110242558.0A CN202110242558A CN112864270A CN 112864270 A CN112864270 A CN 112864270A CN 202110242558 A CN202110242558 A CN 202110242558A CN 112864270 A CN112864270 A CN 112864270A
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- layer
- electrode
- quantum dots
- gate insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 60
- 238000001228 spectrum Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 230000003595 spectral effect Effects 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical class [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 2
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical class [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 claims description 2
- 150000002290 germanium Chemical class 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 150000003376 silicon Chemical class 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical class [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- GTLQJUQHDTWYJC-UHFFFAOYSA-N zinc;selenium(2-) Chemical class [Zn+2].[Se-2] GTLQJUQHDTWYJC-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910008310 Si—Ge Inorganic materials 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 8
- 238000001755 magnetron sputter deposition Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/112—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor
- H01L31/113—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
- H01L31/1136—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor the device being a metal-insulator-semiconductor field-effect transistor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110242558.0A CN112864270B (zh) | 2021-03-04 | 2021-03-04 | 光晶体管集成传感核心的无光栅量子点光谱探测器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110242558.0A CN112864270B (zh) | 2021-03-04 | 2021-03-04 | 光晶体管集成传感核心的无光栅量子点光谱探测器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112864270A true CN112864270A (zh) | 2021-05-28 |
CN112864270B CN112864270B (zh) | 2022-09-23 |
Family
ID=75991806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110242558.0A Active CN112864270B (zh) | 2021-03-04 | 2021-03-04 | 光晶体管集成传感核心的无光栅量子点光谱探测器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112864270B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114709291A (zh) * | 2022-03-31 | 2022-07-05 | 南京信息工程大学 | 基于GeSe二维纳米材料红外光谱探测器及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552131A (zh) * | 2016-01-27 | 2016-05-04 | 东南大学 | 基于量子点掺杂栅绝缘层的新型高性能光调制薄膜晶体管 |
US20170110608A1 (en) * | 2015-10-14 | 2017-04-20 | Omnivision Technologies, Inc. | Quantum dot image sensor |
CN106768331A (zh) * | 2016-12-22 | 2017-05-31 | 陈明烨 | 量子点阵列光谱传感器 |
US20190296178A1 (en) * | 2018-03-22 | 2019-09-26 | Emberion Oy | Photosensitive device with electric shutter |
CN112436070A (zh) * | 2020-12-01 | 2021-03-02 | 南京信息工程大学 | 一种量子点异质结日盲紫外探测芯片及其制备方法 |
-
2021
- 2021-03-04 CN CN202110242558.0A patent/CN112864270B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170110608A1 (en) * | 2015-10-14 | 2017-04-20 | Omnivision Technologies, Inc. | Quantum dot image sensor |
CN105552131A (zh) * | 2016-01-27 | 2016-05-04 | 东南大学 | 基于量子点掺杂栅绝缘层的新型高性能光调制薄膜晶体管 |
CN106768331A (zh) * | 2016-12-22 | 2017-05-31 | 陈明烨 | 量子点阵列光谱传感器 |
US20190296178A1 (en) * | 2018-03-22 | 2019-09-26 | Emberion Oy | Photosensitive device with electric shutter |
CN112436070A (zh) * | 2020-12-01 | 2021-03-02 | 南京信息工程大学 | 一种量子点异质结日盲紫外探测芯片及其制备方法 |
Non-Patent Citations (2)
Title |
---|
G. ARIYAWANSA 等: "Multi-color tunneling quantum dot infrared photodetectors operating at room temperature", 《INFRARED PHYSICS & TECHNOLOGY》 * |
胡伟达 等: "具有变革性特征的红外光电探测器", 《物理学报》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114709291A (zh) * | 2022-03-31 | 2022-07-05 | 南京信息工程大学 | 基于GeSe二维纳米材料红外光谱探测器及其制备方法 |
CN114709291B (zh) * | 2022-03-31 | 2023-10-10 | 南京信息工程大学 | 基于GeSe二维纳米材料红外光谱探测器及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112864270B (zh) | 2022-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Liu et al. | A near-infrared colloidal quantum dot imager with monolithically integrated readout circuitry | |
CN105489693B (zh) | 基于二维层状薄膜材料p‑g‑n异质结光电子器件 | |
Peng et al. | Pyro-phototronic effect enhanced ZnO nanowire-based tri-layer heterojunction for visible light sensing and communication | |
WO2013143295A1 (zh) | X射线检测装置的阵列基板及其制造方法 | |
CN105552131A (zh) | 基于量子点掺杂栅绝缘层的新型高性能光调制薄膜晶体管 | |
CN102007607A (zh) | 光敏结构和包括这种结构的装置 | |
CN108981910A (zh) | 光电探测电路以及光电探测器 | |
CN112864270B (zh) | 光晶体管集成传感核心的无光栅量子点光谱探测器 | |
CN109686844A (zh) | 一种基于钙钛矿自供电行为的光敏传感器 | |
WO2020215860A1 (zh) | 传感器及其制备方法 | |
CN101494256B (zh) | X射线感测器及其制作方法 | |
Zhou et al. | Vertically integrated optical sensor with photoconductive gain> 10 and fill factor> 70% | |
Zhu et al. | Vacuum-ultraviolet (λ< 200 nm) photodetector array | |
Huang et al. | Easily processable Cu2O/Si self-powered photodetector array for image sensing applications | |
CN111599830B (zh) | 一种基于单层石墨烯/绝缘层/硅/多层石墨烯结构的电荷注入器件 | |
CN110021615A (zh) | 阵列基板、包括其的数字x射线检测器及其制造方法 | |
CN111262531B (zh) | 一种探测电路、其制作方法及探测面板 | |
CN101661944B (zh) | 一种紫外图像传感器的像素单元结构及其制备方法 | |
CN111370524A (zh) | 感光传感器及其制备方法、阵列基板、显示面板 | |
CN110767769A (zh) | 一种探测单元、超宽带光探测器及探测方法 | |
US11894399B2 (en) | Compact hyperspectral spectrometers based on semiconductor nanomembranes | |
CN101661943B (zh) | 一种单片集成紫外图像传感器及其像素单元以及制备方法 | |
Zhou et al. | 39‐2: Highly Sensitive a‐Si: H PIN Photodiode Gated LTPS TFT for Optical In‐Display Fingerprint Identification | |
US11810942B2 (en) | X-ray detection device | |
CN105679883B (zh) | 基于ZnO半导体的数字化X射线影像探测器及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230420 Address after: Building 2, 2nd Floor, No. 101 Fuli Road, Guangfu Town, Wuzhong District, Suzhou City, Jiangsu Province, 215159 Patentee after: Smoke Detection Technology (Suzhou) Co.,Ltd. Address before: 210044 No. 219 Ning six road, Jiangbei new district, Nanjing, Jiangsu Patentee before: Nanjing University of Information Science and Technology |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240927 Address after: No. 1699 Zuchongzhi South Road, Yushan Town, Kunshan City, Jiangsu Province, China. North Building, Comprehensive Building, Auxiliary Building 1-072 Patentee after: Liangchu Technology (Kunshan) Co.,Ltd. Country or region after: China Address before: Building 2, 2nd Floor, No. 101 Fuli Road, Guangfu Town, Wuzhong District, Suzhou City, Jiangsu Province, 215159 Patentee before: Smoke Detection Technology (Suzhou) Co.,Ltd. Country or region before: China |