CN112863760A - Bundling plate, bundling assembly and preparation device of internally-sealed optical fiber high-temperature superconducting tape - Google Patents
Bundling plate, bundling assembly and preparation device of internally-sealed optical fiber high-temperature superconducting tape Download PDFInfo
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- CN112863760A CN112863760A CN202110056971.8A CN202110056971A CN112863760A CN 112863760 A CN112863760 A CN 112863760A CN 202110056971 A CN202110056971 A CN 202110056971A CN 112863760 A CN112863760 A CN 112863760A
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Abstract
The invention relates to a bundling plate, a bundling assembly and a preparation device of an internally-sealed optical fiber high-temperature superconducting strip in the technical field of superconducting preparation devices. According to the invention, the guide limiting groove is arranged on the outer peripheral surface of the arc-shaped beam collecting plate in a penetrating manner, so that the direction and the position of the wire harness can be effectively limited in the process of packaging the superconducting strip, the structure is simple, and the packaging effect is outstanding.
Description
Technical Field
The invention relates to the technical field of superconducting preparation devices, in particular to a bundling plate, a bundling assembly and a preparation device for an internally-sealed optical fiber high-temperature superconducting tape.
Background
The high-temperature superconducting tape with the internally sealed optical fiber is a composite tape which highly fuses the measuring optical fiber in the optical fiber sensing system and the second-generation high-temperature superconducting tape. The strip synchronously encapsulates the optical fiber, the copper-plated superconducting tape and the metal tape used for armoring, so that the integrity of the integral surface appearance of the strip can be maintained, and the temperature change of the high-temperature superconducting strip in the quenching process can be timely sensed through the internally sealed measuring optical fiber, thereby realizing the rapid detection of the quenching phenomenon of the high-temperature superconducting strip.
The search shows that: chinese patent application No.: CN201410375117.8, patent name: the device is characterized by comprising a soldering tin groove for containing soldering tin in a molten state and a roller set for extrusion forming of the superconducting strip, wherein the roller set is arranged in the soldering tin groove and comprises two rollers, and a gap for extrusion passing of a superconducting strip raw material belt is formed between the two rollers.
In the actual preparation of the internally-sealed optical fiber high-temperature superconducting tape, the preparation device is described simply, so that the preparation work of the internally-sealed optical fiber high-temperature superconducting tape cannot be directly carried out through the patent. The invention designs a set of inner-sealed optical fiber high-temperature superconducting tape preparation device based on the actual preparation requirement of the inner-sealed optical fiber high-temperature superconducting tape. At present, no description or report of similar technologies of the invention is found, and similar data at home and abroad is not collected.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a bundling plate, a bundling assembly and a preparation device of an internally-sealed optical fiber high-temperature superconducting tape.
The bundling plate provided by the invention comprises a bundling plate, wherein the bundling plate is an arc-shaped plate, a guide limiting groove is formed in the outer surface of the bundling plate along the circumferential direction, and the guide limiting groove penetrates from one end of the bundling plate to the other end of the bundling plate.
In some embodiments, the thickness of the bundling plate becomes thinner from the entrance end of the guide limiting groove to the exit end of the guide limiting groove.
In some embodiments, an adjusting hole is formed along the axial direction of the bundling plate, and the adjusting hole is located between the inner surface and the outer surface of the bundling plate.
In some embodiments, the inner surface of the bundling plate is provided with a sliding groove, and the sliding groove is an arc-shaped groove arranged along the circumferential direction of the bundling plate.
In some embodiments, the arc radius of the sliding groove is the same as or different from the arc radius of the inner circumferential surface of the bundling plate between the sliding groove and the outlet end of the guide limiting groove.
In some embodiments, the guide limiting groove includes a first guide limiting groove and a second guide limiting groove, and the second guide limiting groove is located on a side surface of the first guide limiting groove.
The invention also provides a bundling assembly, which comprises a first bundling plate, a second bundling plate and a third bundling plate which are formed by adopting the bundling plate;
the first bundling plate, the second bundling plate and the third bundling plate are sequentially stacked from top to bottom, the outer peripheral surface of the first bundling plate and the inner peripheral surface of the second bundling plate are arranged in a sliding manner, and the outer peripheral surface of the second bundling plate and the inner peripheral surface of the third bundling plate are arranged in a sliding manner;
the outlet ends of the guide limiting grooves of the first bundling plate, the second bundling plate and the third bundling plate are located at the same end, and the distance between the outlet sliding surfaces of the guide limiting grooves of the three groups of the first bundling plate, the second bundling plate and the third bundling plate is adjustable.
In some embodiments, the first bundling plate is an arc plate with an equal thickness, and the thicknesses of the second bundling plate and the third bundling plate become thinner from the inlet end of the guide limiting groove to the outlet end of the guide limiting groove.
The invention also provides a device for preparing the internally sealed optical fiber high-temperature superconducting tape, which comprises a wire harness leading-out mechanism, a soldering flux adding mechanism, a wire harness packaging mechanism, an air cooling box, a traction mechanism and a take-up mechanism;
after being sequentially packaged by the wire harness leading-out mechanism, the soldering flux adding mechanism and the wire harness packaging mechanism, the superconducting tape, the two metal packaging tapes and the two measuring optical fibers sequentially pass through the air cooling box and the traction mechanism and then are collected on the take-up mechanism;
the wire harness packaging mechanism comprises a bundling assembly, a scraper, a back plate and a soldering tin groove, wherein the bundling assembly and the scraper are connected to the back plate, a superconducting tape, two metal packaging tapes and two measuring optical fibers pass through the bundling assembly and then are packaged between the two metal packaging tapes through the soldering tin groove, the two measuring optical fibers are located on two sides of the superconducting tape, and packaged strips enter the air cooling box after passing through the scraper.
In some embodiments, the wire harness packaging mechanism further includes a positioning block, a positioning press seam is arranged on the positioning block, the positioning block is arranged between the bundling assembly for superconducting tape packaging and the scraper, and the packaged tape enters the clamping interface of the scraper after passing through the positioning press seam.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the guide limiting groove is arranged on the outer peripheral surface of the arc-shaped beam collecting plate in a penetrating manner, so that the direction and the position of the wire harness can be effectively limited in the process of packaging the superconducting strip, the structure is simple, and the packaging effect is outstanding.
2. According to the invention, through the optimized design of the bundling plate structure, the thickness of the bundling plate at the outlet end of the guide limiting groove can reach a preset thinness, the requirement of the gap between the superconducting tapes or between the superconducting tapes and the packaging tape is met, the packaging effect of the superconducting tapes is improved, and in addition, the adjustability of the distance between the tapes improves the adaptability to different types of tapes.
3. The bundling assembly can adjust the position of any bundling plate through the adjusting holes, so that the gap between adjacent strips can be changed, and the adjustment requirement of the gap between the strips can be met quickly and well.
4. According to the preparation device of the internally-sealed optical fiber high-temperature superconducting tape, the positioning block with the secondary bundling function is arranged between the bundling assembly and the scraper, so that the packaging tape of the bundling assembly is integrally pressed again, the surplus objects on the surface can be removed while the positioning is further carried out, and the packaging effect is improved.
5. The internally-encapsulated high-temperature superconducting tape prepared by the internally-encapsulated optical fiber high-temperature superconducting tape preparation device has complete surface appearance, does not have different appearance from the conventional second-generation high-temperature superconducting tape, has better encapsulation effect, and has feasibility and effectiveness in practical application.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of a bundling plate structure according to the present invention;
FIG. 2 is a schematic structural view of the bundling plate of the present invention having a plurality of guiding and limiting grooves;
FIG. 3 is a schematic view of a cluster assembly according to the present invention;
FIG. 4 is a schematic structural view of an apparatus for manufacturing an inner-sealed optical fiber high-temperature superconducting tape according to the present invention;
FIG. 5 is a schematic view of a positioning block according to the present invention;
FIG. 6 is a view showing a finished superconducting tape manufactured by the apparatus for manufacturing an internally sealed optical fiber high-temperature superconducting tape according to the present invention;
FIG. 7 is a cross-sectional microscopic view of a superconducting tape manufactured by the apparatus for manufacturing an internally sealed optical fiber high-temperature superconducting tape according to the present invention;
FIG. 8 is a diagram showing the performance test results of the superconducting tapes manufactured by the apparatus for manufacturing an internally sealed optical fiber high-temperature superconducting tape according to the present invention;
FIG. 9 is a diagram showing the effect of temperature distribution of a superconducting tape prepared by the apparatus for preparing an internally sealed optical fiber high-temperature superconducting tape according to the present invention in a liquid nitrogen environment.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1
The embodiment of the invention provides a bundling plate 100 mainly used for superconducting tape packaging, wherein the bundling plate 100 is an arc-shaped structural plate, preferably, the length of an arc section of the bundling plate 100 is more than or equal to one fourth of the circumference perimeter, a guide limiting groove 101 is arranged on the outer surface of the bundling plate 100 along the circumference direction, and the guide limiting groove 101 penetrates from one end to the other end of the bundling plate 100. The guiding and limiting groove 11 may be disposed near one side of the bundling plate 100, or along the middle of the bundling plate 100. The guide limiting groove 101 is used for placing wire harnesses such as upper and lower metal packaging belts, superconducting belts, measuring optical fibers and the like, so that the wire harnesses slide in the guide limiting groove 101 and along the guide limiting groove 101. The bundling plate 100 having an arc structure is used to change the traveling direction of the wire harness passing through the guide limiting groove 101, for example, the length of the arc of the bundling plate 100 is equal to or greater than one fourth of the circumference, and at this time, the wire harness enters the guide limiting groove 101 from the entrance end thereof in a horizontal direction, and exits the guide limiting groove 101 from the exit end thereof in a vertical direction.
According to the invention, the guide limiting groove is arranged on the outer peripheral surface of the arc-shaped beam collecting plate in a penetrating manner, so that the direction and the position of the wire harness can be effectively limited in the process of packaging the superconducting strip, the structure is simple, and the packaging effect is outstanding.
In some embodiments, the guide limiting grooves 101 formed on the outer circumferential surface of the bundling plate 100 include two sets, i.e., a first guide limiting groove 1011 and a second guide limiting groove 1012. The second guiding and limiting groove 1012 can be used for placing a measuring optical fiber, the first guiding and limiting groove 1011 is used for placing a superconducting tape, and the second guiding and limiting groove 1012 is positioned on the adjacent side of the first guiding and limiting groove 1011. When there are two sets of second guiding and limiting grooves 1012, the two sets of second guiding and limiting grooves 1012 are respectively located at two sides of the first guiding and limiting groove 1011.
Example 2
The embodiment 2 is formed on the basis of the embodiment 1, and the thickness of the bundling plate at the outlet end of the guide limiting groove reaches a preset thickness through the optimized design of the structure of the bundling plate, so that the requirement of the gap between superconducting tapes or the gap between the superconducting tapes and the packaging tape is met, the packaging effect of the superconducting tapes is improved, and the adjustability of the gap between the tapes improves the adaptability to different types of tapes. Specifically, the method comprises the following steps:
the thickness of the bundling plate 100 is designed to be thinner, the thickness of the bundling plate 100 from the inlet end of the guide limiting groove 101 to the outlet end thereof is thinner from the thickness to the outlet end of the guide limiting groove 101 to reach a preset thinness. Here, the overall thinning of the bundling plate 100 includes a gradual thinning from the inlet end of the guiding limiting groove 101 to the outlet end thereof, and also includes a discontinuous thinning process with certain discontinuity, such as thinning-flattening-thinning, or thinning-thickening-thinning. The thickness of the bundling plate 100 is designed to be thinned integrally, and the bundling plate is designed to be of a circular arc-shaped structure, after the plurality of bundling plates 100 are arranged in a stacked mode, a plurality of strips can be parallel to each other after passing through the bundling plates 100 arranged in a stacked mode, a preset distance and position fixing can be achieved, namely, on the basis that the parallelism and the position between the strips are limited and positioned through the guide limiting grooves 101, through the thinning design of the outlet end, the gap between the strips can reach a preset requirement, the requirement can be well met through the parallelism and relative position relation between the packaged strips, compared with the requirement that the laminating between the strips is achieved through the directional guide wheel in the prior art, the packaging effect of the superconducting strips is improved.
Preferably, an adjusting hole 102 for fixed adjustment is further provided along the axial direction of the bundling plate 100, and the adjusting hole 102 is located between the upper and lower surfaces of the bundling plate 100. The adjustment holes 102 are preferably racetrack-type holes, and the long axis of the racetrack-type adjustment holes 102 is arranged along the circumferential direction of the bundling plate 100. When a plurality of bundling plates 100 are stacked, the height position of the outlet end of the adjacent bundling plate 100 can be adjusted through the adjusting hole 102, that is, the port of the outlet end of the guide limiting groove 101 of the bundling plate 100 can be higher than, lower than or flush with the outlet end of the guide limiting groove 101 of the adjacent bundling plate 100 through the adjusting hole 102, and because the bundling plate 100 is of a circular arc structure, the height of the outlet end of the guide limiting groove 101 is different, the gap between the strip sliding out along the outlet end of the guide limiting groove 101 and the strip sliding out of the outlet end of the adjacent guide limiting groove 101 can be changed, and the problem that the gap requirements of different types of strips are different is solved.
Further, the inner surface of the bundling plate 100 is provided with a sliding groove 103, and the sliding groove 103 is an arc-shaped groove arranged along the circumferential direction of the bundling plate 100. Preferably, the sliding groove 103 is disposed at the inlet end of the bundling plate 100, i.e. at a position adjacent to the inlet end of the guiding and limiting groove 101. The arc radius of the sliding groove 103 may be the same as or different from the arc radius of the inner circumferential surface of the bundling plate 100 from the sliding groove 103 to the outlet end of the guide limiting groove 101. When the arc radius of the sliding groove 103 is the same as the arc radius of the inner circumferential surface of the bundling plate 100 from the sliding groove 103 to the outlet end of the guide limiting groove 101, when a plurality of bundling plates 100 are stacked, if the bundling plate 100 on the upper layer is located in the sliding groove 103, because the sliding groove 103 is located at the inlet end of the bundling plate 100 with a larger thickness, the distance between the bundling plate 100 on the upper layer and the bundling plate 100 on the lower layer can be increased, the original gap of the large-span strip can be obtained, and the gap setting requirement of different types of strips is further met. When the arc radius of the sliding groove 103 is different from the arc radius of the inner circumferential surface of the bundling plate 100 from the sliding groove 103 to the outlet end of the guide limiting groove 101, namely, larger or smaller than the arc radius, when the bundling plates 100 are stacked, the arc radius of the sliding groove 103 can be adjusted to obtain different radians, and the bundling plates 100 of various different types are mutually arranged.
Example 3
In this embodiment 3, the bundling assembly is formed based on embodiment 1 or embodiment 2, and the bundling assembly mainly includes three bundling plates 100, which are respectively referred to as a first bundling plate 110, a second bundling plate 120, and a third bundling plate 130, the three bundling plates are sequentially stacked from top to bottom, the first bundling plate 110 is located at the uppermost layer, the third bundling plate 130 is located at the lowermost layer, and the second bundling plate 120 is located at the intermediate layer. The three bundling plates are slidably disposed, that is, the outer peripheral surface of the first bundling plate 110 is located on the inner peripheral surface of the second bundling plate 130, and it may be located on the sliding groove 103 on the inner peripheral surface of the second bundling plate 130, or may be located on the inner peripheral surface of the second bundling plate 130 from the sliding groove 103 to the outlet end of the guide limiting groove 101. Similarly, the outer periphery of the second bundling plate 120 and the inner periphery of the third bundling plate 130 are disposed similarly to the first bundling plate 110 and the second bundling plate 120, and they may be the same or different, and are disposed mainly according to the gap requirement of the packaging tape.
After the first bundling plate 110, the second bundling plate 120 and the third bundling plate 130 are slidably connected, the outlet ends of the guide limiting grooves 101 of the three bundling plates are located at the same end and adjacent to each other, and the position of any bundling plate can be adjusted through the adjusting hole 102, so that the gap between adjacent strips can be changed, and the adjustment requirement of the gap between the strips can be met quickly and well.
Preferably, the first bundling plate 110 is located at the uppermost layer, and is preferably a bundling plate with a constant thickness, so that the manufacturing process is simple, the use of the bundling plate with a variable thickness is saved, and the cost is reduced. Meanwhile, the second bundling plate 120 and the third bundling plate 130 are selected to be bundling plates with a reduced thickness according to the bonding requirement of the strip outlet end.
Example 4
In this embodiment 4, the device for preparing an internally sealed optical fiber high temperature superconducting tape formed on the basis of embodiment 3 is configured to form a wire harness packaging mechanism by using the bundling assembly described in embodiment 3, and further includes a wire harness leading-out mechanism, a flux adding mechanism, a wire harness packaging mechanism, an air cooling box, a pulling mechanism, and a wire rewinding mechanism. And one superconducting tape, two metal packaging tapes and two measuring optical fibers sequentially pass through a wire harness leading-out mechanism, a scaling powder adding mechanism, a wire harness packaging mechanism, an air cooling box and a traction mechanism and then are collected on a wire collecting mechanism.
The wire harness leading-out mechanism comprises a first metal packaging tape material wire coil 1, a second metal packaging tape material wire coil 2, a first measurement optical fiber material wire coil 3, a second measurement optical fiber material wire coil 4, a superconducting tape material wire coil 5, a tension controller 6, a directional guide wheel 7 and a first box body 8 for combining and fixing the components. The first metal packaging material wire coil 1 is used for placing and conveying an upper metal packaging belt, the second metal packaging material wire coil 2 is used for placing and conveying a lower metal packaging belt, the first measuring optical fiber material wire coil 3 is used for placing and conveying a first measuring optical fiber, the second measuring optical fiber material wire coil 4 is used for placing and conveying a second measuring optical fiber, and the superconducting tape material wire coil 5 is used for placing and conveying a copper-plated superconducting tape. The first to fifth positioning guide wheels 7 are used for changing the conveying direction of the materials, and the tension controller 6 is used for applying a damping effect on the first metal packaging tape material wire coil 1, the second metal packaging tape material wire coil 2, the first measurement optical fiber material wire coil 3, the second measurement optical fiber material wire coil 4 and the superconducting tape material wire coil 5, so that the materials are in a stretched state in the whole tape packaging preparation process.
The soldering flux adding mechanism mainly comprises a first soldering flux groove 9, a second soldering flux groove 10, a third soldering flux groove 11 and a second box body 12 for fixing. The first scaling powder groove 9 is used for evenly spreading scaling powder on the upper metal packaging belt, the second scaling powder groove 10 is used for evenly spreading scaling powder on the copper-plated superconducting belt, and the third scaling powder groove 11 is used for evenly spreading scaling powder on the lower metal packaging belt.
The wiring harness packaging mechanism comprises a bundling assembly, a scraper 13, a back plate 14 and a soldering tin groove 15, the bundling assembly and the scraper are connected to the back plate 14, one superconducting tape, two metal packaging tapes and two measuring optical fibers are packaged between the two metal packaging tapes through the soldering tin groove 15 after passing through the bundling assembly, the two measuring optical fibers are located on two sides of the one superconducting tape, and the packaged tapes enter the air cooling box 17 after passing through the scraper. The second bundling plate 120 has a first guiding and limiting groove 1011 and a second guiding and limiting groove 1012, and the second guiding and limiting grooves 1012 are divided into two groups and arranged on two sides of the first guiding and limiting groove 1011. The wire harness packaging mechanism further comprises a directional guide wheel 7, so that the packaging tape material is turned before entering the bundling plate, and then enters the bundling plate in a better state. Preferably, the conveying direction of the material is changed by two groups of five directional guide wheels 7, and 10 directional guide wheels are connected to the back plate. The scraper 13 comprises a first scraper and a second scraper, and the upper surface and the lower surface of the inner-sealed optical fiber superconducting tape are clamped in the scraper 13 to remove redundant soldering tin on the surface of the tape. The tin soldering groove with the functions of lifting and temperature control can contain tin soldering, and the temperature of the internal tin soldering can be controlled. Preferably, the first scraper and the second scraper are made of ceramic materials, and the rest of the components are made of stainless steel materials
The air cooling box 17 is used for reducing the temperature of the high-temperature superconducting tape of the internally sealed optical fiber.
The traction mechanism comprises a motor 18, a first traction roller 19, a second traction roller 20, a positioning guide wheel 7 and a third box 21 for combining and fixing the components. The first traction roller 19 and the second traction roller 20 are used for drawing the prepared inner-sealed optical fiber high-temperature superconducting tape, and the drawing speed is controlled by the motor 18; the positioning guide wheel 7 is used for changing the conveying direction of the high-temperature superconducting tape of the internally-sealed optical fiber. Preferably, the surfaces of the first traction roller 19 and the second traction roller 20 are made of rubber.
The take-up mechanism includes a take-up reel 22, a take-up device 23, and a fourth casing 24 for fixing. The take-up reel 22 is arranged on the take-up device 23 and is used for taking up the prepared inner-sealed optical fiber high-temperature superconducting tape; the fourth box body is used for combining and fixing the take-up reel and the take-up device.
The working steps of the device for preparing the internally-sealed optical fiber high-temperature superconducting tape provided by the embodiment of the invention are as follows:
And 2, fixing a first metal packaging tape material wire coil, a second metal packaging tape material wire coil, a first measurement optical fiber material wire coil, a second measurement optical fiber material wire coil and a superconducting tape material wire coil on the first box body.
And 3, leading the upper metal packaging belt out of the first metal packaging belt material wire coil, sequentially passing through a first positioning guide wheel, a first scaling powder groove, a sixth positioning guide wheel, an eleventh positioning guide wheel, a groove of the first buncher, a first scraper, a second scraper and an air cooling box, and then fixing the upper metal packaging belt through a first traction roller and a second traction roller.
And 4, leading out the first measuring optical fiber from the first measuring optical fiber material wire coil, sequentially passing through a second positioning guide wheel, a seventh positioning guide wheel, a twelfth positioning guide wheel, a left side fine groove of the second buncher, a first scraper, a second scraper and an air cooling box, and then fixing the first measuring optical fiber through a first traction roller and a second traction roller. Preferably, the first measurement optical fiber coating layer is made of a material with high temperature, such as metal or polyimide.
And 5, leading out a second measuring optical fiber from a second measuring optical fiber material wire coil, sequentially passing through a third positioning guide wheel, an eighth positioning guide wheel, a thirteenth positioning guide wheel, a right side fine groove of the second buncher, a first scraper, a second scraper and an air cooling box, and then fixing the second measuring optical fiber through a first traction roller and a second traction roller. Preferably, the second measurement optical fiber coating layer is made of a material with high temperature, such as metal or polyimide.
And 6, leading the copper-plated superconducting tape out of a superconducting tape material wire coil, sequentially passing through a fourth positioning guide wheel, a second scaling powder groove, a ninth positioning guide wheel, a fourteenth positioning guide wheel, a middle groove of a second buncher, a first scraper, a second scraper and an air cooling box, and fixing the copper-plated superconducting tape through a first traction roller and a second traction roller.
And 7, leading the lower metal packaging belt out of a second metal packaging belt material wire coil, sequentially passing through a fifth positioning guide wheel, a third scaling powder groove, a tenth positioning guide wheel, a fifteenth positioning guide wheel, a groove of a third buncher, a first scraper, a second scraper and an air cooling box, and then fixing the lower metal packaging belt through a first traction roller and a second traction roller.
And 8, lifting the soldering tin groove to enable the soldering tin liquid level in the internal molten state to superconduct the uppermost ends of the three bunchers.
And 9, turning on the motor and controlling the rotating speed of the first traction roller and the second traction roller to enable the two traction rollers to rotate in a face-to-face mode, so that the materials are pulled at the same speed.
And step 10, opening the tension controller to enable the five material trays to generate reverse damping effect, so that each material is in a stretched state.
And step 11, starting the air cooling box to reduce the temperature of the high-temperature superconducting tape of the internally sealed optical fiber.
And step 12, after the first traction roller and the second traction roller pull out the inner-sealed optical fiber high-temperature superconducting tape, cutting off materials at the front end, and after the output inner-sealed optical fiber high-temperature superconducting tape passes through a sixteenth positioning roller, taking up the inner-sealed optical fiber high-temperature superconducting tape by a take-up reel fixed on a take-up device.
In order to demonstrate the preparation effect of the device for preparing the internally-sealed optical fiber high-temperature superconducting tape provided by the embodiment, the method of the invention is adopted to continuously prepare the 76-meter-long internally-sealed optical fiber high-temperature superconducting tape, and the cross section microstructure, the critical current uniformity and the temperature distribution condition of the tape in the liquid nitrogen environment of the composite tape are further tested.
FIG. 6 is a finished product of a 76m long inner-sealed optical fiber high-temperature superconducting tape, which shows that the inner-sealed optical fiber high-temperature superconducting tape prepared by the present invention has a complete surface appearance, and has no difference from the appearance of the conventional second-generation high-temperature superconducting tape.
FIG. 7 is a cross-sectional microscopic structural view of an internally sealed optical fiber high-temperature superconducting tape, showing a measurement optical fiber and a copper-coated superconducting tape integrally encapsulated by upper and lower metal tapes,
fig. 8 shows the critical current uniformity of the inner-sealed optical fiber high-temperature superconducting tape, and the test result shows that the mean value of the critical current of the inner-sealed optical fiber high-temperature superconducting tape with the length of 76m is about 520A, the overall uniformity changes about +/-4%, and the inner-sealed optical fiber high-temperature superconducting tape has engineering application value.
Fig. 9 shows the temperature distribution of the high-temperature superconducting tape of the inner-sealed optical fiber in a liquid nitrogen environment, and the average value of the temperature distribution of the current tape along the length direction is 196 ℃ below zero, so that the temperature distribution of the current superconducting tape can be well reflected.
Therefore, the internally-encapsulated high-temperature superconducting tape prepared by the internally-encapsulated optical fiber high-temperature superconducting tape preparation device provided by the embodiment has the advantages of complete surface appearance, no difference with the appearance of the conventional second-generation high-temperature superconducting tape, good encapsulation effect and feasibility and effectiveness in practical application. Meanwhile, the device can rapidly and efficiently continuously prepare the internally sealed optical fiber high-temperature superconducting tape, reduce tape preparation risks caused by human factors, and establish a standardized production process of the internally sealed optical fiber high-temperature superconducting tape.
Example 5
The embodiment 5 is formed on the basis of the embodiment 4, and the positioning block with the secondary bundling function is designed between the bundling assembly and the scraper, so that the packaging tape of the bundling assembly is integrally pressed again, the surplus on the surface can be removed while the further positioning is carried out, and the packaging effect is improved.
A structural member with a secondary bundling function is designed between the bundling assembly and the scraper and is a positioning block 16, the positioning block 16 is a stool-shaped structural block, structures protruding from two ends of the positioning block are used for fixing with the back plate, a positioning pressing seam 161 is formed in the middle of the positioning block in a penetrating mode, the packaged strip material passes through the positioning pressing seam 161, the packaged strip material is integrally pressed and connected through the positioning pressing seam again, and when the packaged strip material is further positioned, redundant welding materials in the packaged strip material can be extruded out and the redundant materials on the surface can be removed.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. The bundling plate is characterized by comprising a bundling plate (100), wherein the bundling plate (100) is an arc-shaped plate, a guide limiting groove (101) is formed in the outer surface of the bundling plate (100) along the circumferential direction, and the guide limiting groove (101) penetrates through from one end of the bundling plate (100) to the other end.
2. The bundling plate according to claim 1, wherein the thickness of the bundling plate (100) becomes thinner from the entrance end of the guide-limiting groove (101) to the exit end of the guide-limiting groove (101).
3. The bundling plate according to claim 1 or 2, wherein an adjustment hole (102) is opened in an axial direction of the bundling plate (100), the adjustment hole (102) being located between inner and outer surfaces of the bundling plate (100).
4. The bundling plate according to claim 3, wherein the inner surface of the bundling plate (100) is provided with a sliding groove (103), and the sliding groove (103) is an arc-shaped groove arranged along the circumferential direction of the bundling plate (100).
5. The bundling plate according to claim 4, wherein the radius of the arc of the sliding groove (103) is the same or different from the radius of the arc of the inner circumferential surface of the bundling plate (100) between the sliding groove (103) and the outlet end of the guide stopper groove (101).
6. The cluster plate of claim 1, wherein the guide limit groove (101) comprises a first guide limit groove (1011) and a second guide limit groove (1012), and the second guide limit groove (1012) is located at the side of the first guide limit groove (1011).
7. A bundling assembly, comprising a first bundling plate (110), a second bundling plate (120) and a third bundling plate (130) formed by using the bundling plate according to any one of claims 1-6;
the first bundling plate (110), the second bundling plate (120) and the third bundling plate (130) are sequentially stacked from top to bottom, the outer circumferential surface of the first bundling plate (110) and the inner circumferential surface of the second bundling plate (120) are arranged in a sliding manner, and the outer circumferential surface of the second bundling plate (120) and the inner circumferential surface of the third bundling plate (130) are arranged in a sliding manner;
the outlet ends of the guide limiting grooves (11) of the first bundling plate (110), the second bundling plate (120) and the third bundling plate (130) are located at the same end, and the distance between the outlet sliding surfaces of the guide limiting grooves (101) of the three groups of the first bundling plate (110), the second bundling plate (120) and the third bundling plate (130) is adjustable.
8. The bundling assembly according to claim 7, wherein the first bundling plate (110) is a circular arc plate with equal thickness, and the thickness of the second bundling plate (120) and the third bundling plate (130) becomes thinner from the inlet end of the guide limiting groove (101) to the outlet end of the guide limiting groove (101).
9. The device for preparing the internally-sealed optical fiber high-temperature superconducting tape is characterized by comprising a wire harness leading-out mechanism, a soldering flux adding mechanism, a wire harness packaging mechanism, an air cooling box, a traction mechanism and a wire rewinding mechanism;
after being sequentially packaged by the wire harness leading-out mechanism, the soldering flux adding mechanism and the wire harness packaging mechanism, the superconducting tape, the two metal packaging tapes and the two measuring optical fibers sequentially pass through the air cooling box and the traction mechanism and then are collected on the take-up mechanism;
the wire harness packaging mechanism adopts the bundling assembly as claimed in any one of claims 7 to 8, and further comprises a scraper, a back plate and a soldering tin groove, wherein the bundling assembly and the scraper are connected to the back plate, a superconducting tape, two metal packaging tapes and two measuring optical fibers pass through the bundling assembly and then are packaged between the two metal packaging tapes through the soldering tin groove, the two measuring optical fibers are positioned on two sides of the superconducting tape, and the packaged tapes pass through the scraper and then enter the air cooling box.
10. The apparatus according to claim 9, wherein the wire harness packaging mechanism further comprises a positioning block, the positioning block is provided with a positioning press seam, the positioning block is disposed between the bundling assembly for superconducting tape packaging and the scraper, and the packaged tape passes through the positioning press seam and then enters a clamping interface of the scraper.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110056971.8A CN112863760B (en) | 2021-01-15 | 2021-01-15 | Bundling assembly for superconducting tape packaging and inner-packaging optical fiber high-temperature superconducting tape preparation device thereof |
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| CN202110056971.8A CN112863760B (en) | 2021-01-15 | 2021-01-15 | Bundling assembly for superconducting tape packaging and inner-packaging optical fiber high-temperature superconducting tape preparation device thereof |
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| CN112863760A true CN112863760A (en) | 2021-05-28 |
| CN112863760B CN112863760B (en) | 2022-06-28 |
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Cited By (1)
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| CN114262879A (en) * | 2021-12-24 | 2022-04-01 | 苏州新材料研究所有限公司 | Arc plate for improving motion stability of strip in MOCVD deposition |
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| CN112863760B (en) | 2022-06-28 |
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