CN112859964A - Calibration platform temperature control system and control method thereof - Google Patents

Calibration platform temperature control system and control method thereof Download PDF

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Publication number
CN112859964A
CN112859964A CN202110052256.7A CN202110052256A CN112859964A CN 112859964 A CN112859964 A CN 112859964A CN 202110052256 A CN202110052256 A CN 202110052256A CN 112859964 A CN112859964 A CN 112859964A
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resistor
temperature
pin
diode
chip
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CN202110052256.7A
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CN112859964B (en
Inventor
任利
谢和平
张茹
张泽天
陈领
高明忠
张志龙
李怡航
杨阳
李佳南
黄伟
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Sichuan University
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Sichuan University
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1951Control of temperature characterised by the use of electric means with control of the working time of a temperature controlling device
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Remote Sensing (AREA)
  • Control Of Temperature (AREA)

Abstract

The invention discloses a calibration platform temperature control system and a control method thereof, which are applied to a deep in-situ fidelity coring 'five-protection' capability calibration platform. The control system can accurately restore the occurrence environment of deep high temperature and high pressure in the deep in-situ high temperature and high pressure environment simulation cabin, and temperature and pressure regulation and control are carried out through various sensors. The liquid in the system is heated synchronously with the cabin body, so that the high-temperature and high-pressure experimental device can be prevented from being damaged due to temperature difference.

Description

Calibration platform temperature control system and control method thereof
Technical Field
The invention belongs to the technical field of temperature control, and particularly relates to a calibration platform temperature control system and a control method thereof.
Background
At present, mineral resources in the shallow part of the earth are gradually exhausted, resource development continuously moves to the deep part of the earth, the coal mining depth reaches 1500m, the geothermal mining depth exceeds 3000m, the metal mining depth exceeds 4350m, the oil and gas resource mining depth reaches 7500m, and deep resource mining becomes a normal state.
The deep rock characteristics are proved, powerful support is provided for deep marching, the deep environment must be restored in a laboratory before deep in-situ fidelity coring work of actual engineering, and the reliability of a coring system is tested. The existing temperature and pressure control device for the reduction in-situ environment experiment basically stays in a shallow rock mechanics experiment stage, even a normal temperature and pressure stage; meanwhile, the condition of stress-temperature-osmotic pressure three-field coupling is rarely considered, and a core drilling or mechanical experiment may be started when each point in the sample is not uniform, so that large deviation is caused, the in-situ environment of the rock cannot be correctly restored, and the obtained experimental conclusion or the taken core has errors with the actual condition.
In a deep ground environment, the most obvious difference from a shallow part is the environment with high temperature and high pressure, the temperature and pressure environment can reach 100 ℃ and more than 100MPa, in order to research deep in-situ coring, various properties under the condition of deep in-situ temperature and pressure must be known, and the invention provides a temperature control system and a control method for the deep in-situ fidelity coring simulation cabin. In some simulated coring or in-situ experiments, a temperature and pressure loading path is very important, particularly in a temperature and pressure environment of 100+ DEG C and 100+ MPa in deep ground, if the temperature and pressure loading path is inconsistent, water body gasification can be caused, and great disturbance is caused to the whole experiment system.
Disclosure of Invention
The invention aims to solve the temperature control problem and provides a calibration platform temperature control system and a control method thereof, which can keep the temperature and pressure applying process stable and prevent the temperature and pressure environment from exceeding the single control limit due to the temperature and pressure coupling effect while ensuring that the phase change of fluid does not occur in the temperature and pressure applying process.
The technical scheme of the invention is as follows: a calibration platform temperature control system comprises a cooling pond, a sewage pond, a cooling coil, a heating pipeline, a first high-frequency induction coil, a second high-frequency induction coil, a low-pressure pump, a high-pressure pump, a first temperature and pressure sensor, a second temperature and pressure sensor, a third temperature and pressure sensor, a first pressure transmitter, a second pressure transmitter, a first hydraulic control valve, a second hydraulic control valve, a third hydraulic control valve, a fourth hydraulic control valve, a first safety valve, a second safety valve, a third safety valve, a simulation cabin body, a first normal temperature pipeline, a second normal temperature pipeline and a third normal temperature pipeline;
the cooling coil is fixedly arranged in the cooling pool; the input end of the cooling coil is fixedly connected with the simulation cabin body through a second normal temperature pipeline, and the output end of the cooling coil is fixedly arranged in the sewage pool; one end of the heating pipeline and one end of the third normal-temperature pipeline are both fixedly arranged in the cooling pond; a first high-frequency induction coil, a low-pressure pump, a first temperature and pressure sensor and a second high-frequency induction coil are sequentially and fixedly arranged on the outer wall of the heating pipeline; the other end of the heating pipeline is fixedly connected with one end of the first normal-temperature pipeline through a high-pressure pump; a second hydraulic control valve, a first safety valve, a first pressure transmitter and a second temperature and pressure sensor are fixedly arranged on the outer wall of a first branch of the first normal temperature pipeline, and a third hydraulic control valve, a second safety valve and a second pressure transmitter are fixedly arranged on the outer wall of a second branch of the first normal temperature pipeline; the other end of the first branch and the other end of the second branch are both fixedly connected with the simulation cabin body; the high-pressure pump is also fixedly connected with one end of a third normal-temperature pipeline; the other end of the third normal-temperature pipeline is fixedly arranged in the cooling pool; a first hydraulic control valve and a third temperature and pressure sensor are fixedly arranged on the outer wall of the third normal temperature pipeline; a fourth hydraulic control valve is fixedly arranged on the outer wall of the second normal-temperature pipeline;
the low-pressure pump, the high-pressure pump, the first pressure transmitter and the second pressure transmitter are all in communication connection with the computer.
The invention has the beneficial effects that:
(1) according to the invention, the temperature and pressure sensors are arranged on a plurality of monitoring points in the simulation cabin body and the pipeline, so that the safety of the high-temperature and high-pressure pipeline is ensured, a reliable temperature and pressure control system is provided for the deep in-situ high-temperature and high-pressure environment simulation cabin device, and basic pre-research conditions can be provided for deep in-situ rock mechanics and deep scientific front exploration.
(2) The control system can accurately restore the occurrence environment of deep high temperature and high pressure in the deep in-situ high temperature and high pressure environment simulation cabin, and temperature and pressure regulation and control are carried out through various sensors. Meanwhile, liquid (water and oil) in the system needs to be heated synchronously with the cabin body, so that the high-temperature and high-pressure experimental device can be prevented from being damaged due to temperature difference.
(3) The temperature control system is additionally provided with the filtering device, so that silt in liquid passing through a sample in the simulation cabin can be filtered, and other systems are prevented from being damaged.
Further, a filtering system is arranged in the sewage tank.
The beneficial effects of the further scheme are as follows: in the invention, the filtering system can filter out silt in the liquid passing through the sample in the simulation cabin, thereby preventing other systems from being damaged.
Further, the outer walls of the heating pipeline, the first normal temperature pipeline, the second normal temperature pipeline and the third normal temperature pipeline are all fixedly provided with heat insulation layers.
The beneficial effects of the further scheme are as follows: in the invention, the outer surface of the liquid pipeline is insulated by the heat insulation layer, so that the heat loss is reduced, and the heat utilization rate is improved.
Further, the first high-frequency induction coil and the low-pressure pump form a primary heating and pressurizing unit which is used for heating water at normal temperature and normal pressure to 90 ℃ and pressurizing the water to 5 MPa; the second high-frequency induction coil and the high-pressure pump form a secondary heating and pressurizing unit which is used for heating water at normal temperature and normal pressure to 150 ℃ and pressurizing the water to 140 MPa.
The beneficial effects of the further scheme are as follows: in the present invention, a high-frequency induction heating coil heating method is adopted, and high-frequency induction is performed by heating a conductor itself by using an induction current (eddy current loss) generated by the conductor under the action of a high-frequency magnetic field and hysteresis loss due to the action of a magnetic field in the conductor. Its advantages are high heat efficiency, low power and saving energy.
Furthermore, the first pressure transmitter and the second pressure transmitter have the same structure and respectively comprise resistors R1-R16, slide rheostats RP1-RP3, a capacitor C1, diodes D1-D8, triodes T1-T5, a composite triode T6 and operational amplifiers LM1-LM 2;
the cathode of the diode D1 is connected to the drain of the transistor T1, the collector of the transistor T5, one end of the resistor R8, one end of the resistor R16 and the first stationary end of the slide rheostat RP 2; the source of the triode T1 is connected with one end of the resistor R1; the grid electrode of the triode T1 is respectively connected with the other end of the resistor R1, the negative electrode of the diode D2 and the base electrode of the triode T5; the anode of the diode D2 is connected to the cathode of the diode D3 and one end of the resistor R2; the anode of the diode D3 is connected with the anode of the diode D4; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and the non-inverting input end of the operational amplifier LM 1; the inverting input end of the operational amplifier LM1 is connected with the moving end of the slide rheostat RP 1; the negative power supply end of the operational amplifier LM1 is connected with the emitter of the triode T5, and the output end of the operational amplifier LM1 is connected with one end of the resistor R4; the other end of the resistor R4 is connected with the base electrode of the compound triode T6; the emitter of the compound triode T6 is connected with the first fixed end of the slide rheostat RP 1; the second fixed end of the slide rheostat RP1 is connected with one end of the resistor R5; the collector of the compound triode T6 is respectively connected with one end of the resistor R10 and one end of the resistor R11; the other end of the resistor R10 is connected with the first fixed end of the slide rheostat RP 3; the second fixed end of the slide rheostat RP3 is connected with the other end of the resistor R8, and the moving ends of the slide rheostat RP3 are respectively connected with one end of the capacitor C1 and the non-inverting input end of the operational amplifier LM 2; the inverting input end of the operational amplifier LM2 is respectively connected with the other end of the capacitor C1, the other end of the resistor R11 and one end of the resistor R9; the other end of the resistor R9 is connected with one end of the resistor R15; the other end of the resistor R15 is respectively connected with the other end of the resistor R16, the movable end of the slide rheostat RP2, the second fixed end of the slide rheostat RP2, the negative electrode of the diode D5, the positive power end of the operational amplifier LM2, one end of the resistor R12 and one end of the resistor R13; the output end of the operational amplifier LM2 is connected with one end of a resistor R14; the other end of the resistor R14 is connected with the cathode of the diode D6; the anode of the diode D6 is connected with the cathode of the diode D7; the anode of the diode D7 is connected with the cathode of the diode D8; the anode of the diode D8 is respectively connected with the other end of the resistor R12 and the base of the diode T2; the emitter of the diode T2 is connected with the other end of the resistor R13; the drain electrode of the triode T3 is respectively connected with the anode of the diode D5 and the base electrode of the triode T4; the source of the triode T3 is connected with one end of the resistor R6; the collector of the triode T4 is connected with one end of the resistor R7; the collector of the triode T2, the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R6, the other end of the resistor R7, the positive power supply end of the operational amplifier LM1, the negative electrode of the diode D4 and the positive electrode of the diode D1 are all connected with the power supply end of the temperature control system.
Further, the first temperature and pressure sensor, the second temperature and pressure sensor and the third temperature and pressure sensor have the same structure and respectively comprise a temperature sensor and a pressure sensor;
the temperature sensor comprises resistors R17-R18, a grounding resistor R19, a resistor R20, a grounding capacitor C2-C3, a voltage reference chip IC1 with the model of REF3030, an amplification chip IC2 with the model of AD623 and a temperature sensing chip RT1 with the model of PT 100;
a VIN pin of the chip IC1 is respectively connected with a power supply end of a temperature control system and a grounding capacitor C3; the GND pin of the chip IC1 is grounded; a VOUT pin of the chip IC1 is respectively connected with one end of the resistor R17 and one end of the resistor R18; the B1 pin of the chip RT1 is connected with the + IN pin of the chip IC 2; the B2 pin of the chip RT1 is connected with the other end of the resistor R17; pin A of the chip RT1 is grounded; the-RG pin of the chip IC2 is connected with one end of the resistor R20; the-IN pin of the chip IC2 is respectively connected with the other end of the resistor R18 and the grounding resistor R19; the-Vs pin of chip IC2 is grounded; the + RG pin of the chip IC2 is connected with the other end of the resistor R20; a + Vs pin of the chip IC2 is respectively connected with a grounding capacitor C2 and a power supply end of the temperature control system; the REF pin of chip IC2 is grounded;
the amplifying circuit of the pressure sensor comprises resistors R21-R32, slide rheostats RP4-RP5, capacitors C7-C9, triodes Q1-Q2, amplifiers A1-A4 and a diode D9;
the 1 st pin of the amplifier A1 is respectively connected with one end of a resistor R21 and one end of a resistor R22, and the 2 nd pin thereof is respectively connected with one end of a resistor R23 and one end of a resistor R24; the other end of the resistor R21 is respectively connected with the other end of the resistor R23, the first fixed end of the slide rheostat RP5, one end of the capacitor C9, the emitter of the triode Q2 and one end of the resistor R31; the other end of the resistor R22 is respectively connected with the second fixed end of the slide rheostat RP5, the other end of the resistor R24, one end of the capacitor C8, the emitter of the triode Q1, one end of the resistor R32, the 1 st pin of the amplifier A3 and one end of the capacitor C7; the 4 th pin of the amplifier A1 is connected with the movable end of the slide rheostat RP 5; the 3 rd pin of the amplifier A1 is connected with the first fixed end of the slide rheostat RP 4; the movable end of the slide rheostat RP4 is connected with one end of the resistor R27; the other end of the resistor R27 is connected with the 2 nd pin of the amplifier A2; the 1 st pin of the amplifier A2 is respectively connected with one end of a resistor R25 and one end of a resistor R26; the base of the triode Q1 is connected with one end of the resistor R29; the other end of the resistor R29 is respectively connected with the 3 rd pin of the amplifier A3 and the other end of the capacitor C7; the 1 st pin of the amplifier A4 is respectively connected with the other end of the resistor R32, one end of the capacitor C10 and the other end of the resistor R31, and the 3 rd pin of the amplifier A4 is respectively connected with the other end of the capacitor C10 and one end of the resistor R30; the other end of the resistor R30 is connected with the base electrode of the triode Q2; the 2 nd pin of the amplifier A3 is respectively connected with one end of a resistor R28 and the cathode of a diode D9; the collector of the transistor Q2, the second fixed end of the sliding rheostat RP4, the other end of the capacitor C8, the other end of the capacitor C9, the other end of the resistor R28, the anode of the diode D9, the collector of the transistor Q1, the other end of the resistor R25, the other end of the resistor R26 and the 3 rd pin of the amplifier A2 are connected.
The beneficial effects of the further scheme are as follows: in the invention, the temperature and pressure sensor can be arranged at the water outlet end of the water pool and the ultrahigh pressure pump, the water inlet of the cabin body, the inlet of the lower section drill rod cabin, the upper part of the sample cabin close to the sample and the lower part of the sample cabin close to the sample, so as to complete the temperature measurement and control of the water in the cabin. Meanwhile, the cabin body is installed on the cabin wall in a mode of not penetrating through the cabin wall, and the safety of the cabin body is guaranteed.
Further, the outer wall of the simulation cabin body comprises a heating layer, a heat conduction layer, a heat insulation layer, a power supply unit and a temperature control unit;
a heat conduction layer is fixedly arranged between the heating layer and the heat insulation layer; a temperature control unit is fixedly arranged on the inner wall of the heat conduction layer; the power supply unit is electrically connected with the temperature control unit; the positive electrode and the negative electrode of the power supply unit are respectively connected with the positive electrode and the negative electrode of the heating layer through leads; the heating layer comprises a silicon rubber heating belt and an alkali-free glass fiber layer; the silicon rubber heating belt is wound on the outer wall of the cabin body of the simulation cabin;
the temperature control unit comprises resistors R41-R44 and a heater RLThermistor RtThe integrated chip IC comprises a sliding rheostat VR1, a rectifier diode D16, a voltage stabilizing diode D17, a bidirectional thyristor V, capacitors C21-C23 and a model NE 555;
the 1 st pin of the chip IC is respectively connected with one end of a resistor R44, a T2 pin of a bidirectional thyristor V, one end of a capacitor C22, one end of a capacitor C23 and the anode of a voltage stabilizing diode D17, and the connection point of the 1 st pin of the chip IC is also connected with the power supply end of a power supply unit; the No. 2 pin of the chip IC is respectively connected with the other end of the resistor R44 and the thermistor RtIs connected with one end of the connecting rod; thermistor RtThe other end of the slide rheostat VR1 is connected with the first fixed end of the slide rheostat; the 3 rd pin of the chip IC is connected with one end of the resistor R43; the other end of the resistor R43 andthe pin D of the bidirectional thyristor V is connected; the 4 th pin of the chip IC is respectively connected with the second fixed end of the slide rheostat VR1, the movable end of the slide rheostat VR1, one end of the resistor R42, the cathode of the voltage stabilizing diode D17, the other end of the capacitor C22, the cathode of the rectifying diode D16 and the 8 th pin of the chip IC; the 5 th pin of the chip IC is respectively connected with the other end of the capacitor C23, the other end of the resistor R42 and the 7 th pin of the chip IC; the anode of the rectifying diode D16 is respectively connected with one end of the capacitor C21 and one end of the resistor R41; the other end of the resistor R41 is connected with the other end of the capacitor C21 and the heater R respectivelyLIs connected with the power supply end of the power supply unit; heater RLAnd the other end thereof is connected to a T1 pin of the triac V.
The beneficial effects of the further scheme are as follows: in the invention, the cabin body is heated by a silicon rubber heating belt for 10 hours, the temperature control precision is +/-1 ℃ when the cabin body and the internal sample are heated to 150 ℃, and the thermal efficiency of the system can be improved. The heat insulation layer can prevent a normal temperature medium from entering the cabin to cause rapid temperature change in the cabin, so that the temperature control is more accurate. The silicone rubber heating belt may be a nichrome wire.
Based on the system, the invention also provides a calibration platform temperature control system, which comprises the following steps:
s1: heating the cabin body for 10 hours by utilizing a silicon rubber heating belt on the outer wall of the simulated cabin body to raise the temperature of the cabin body to 150 ℃ so as to finish the heating of the cabin body;
s2: heating normal-temperature normal-pressure water in a cooling pool to 150 ℃ through a heating pipeline, and pressurizing to 140 MPa;
s3: the heated and pressurized liquid flows out from the lower part of a drill rod of the simulation cabin body through an internal pipeline of the simulation cabin body;
s4: inputting liquid flowing out of the lower part of a drill rod of the simulated cabin body into a cooling pool through a normal-temperature pipeline;
s5: cooling the liquid by using a cooling coil in the cooling pond, and flowing into a sewage pond;
s6: and (4) carrying out silt filtration on the liquid by using a filtration system in the sewage tank, enabling the filtered liquid to flow into the cooling tank, and entering the next cycle to finish temperature control.
The invention has the beneficial effects that: the heating mode of the invention mainly comprises two modes of a high-frequency heating pipeline and a silicone rubber belt heating cabin body. The two heating modes are combined, so that the adjustment of the heating time can be controlled, and the rapid change of the temperature in the cabin caused by the direct entering of the normal temperature medium into the cabin can be avoided, so that the temperature control is more accurate.
Further, step S2 includes the following sub-steps:
s21: heating normal-temperature normal-pressure water in a cooling pool to 90 ℃ and pressurizing to 5MPa by sequentially utilizing a first high-frequency induction coil and a low-pressure pump through a heating pipeline to finish primary heating and pressurizing;
s22: heating the liquid subjected to primary heating and pressurization to 150 ℃ by using a second high-frequency induction coil and a high-pressure pump in sequence, and pressurizing to 140MPa to finish secondary heating and pressurization;
in step S3, the safety valve is used to monitor the pipe safety and the pilot operated valve is used to control the flow of liquid.
The beneficial effects of the further scheme are as follows: in the invention, the high-frequency induction coil, the low-pressure pump and the high-pressure pump finish heating and pressurizing the normal temperature and normal pressure water twice, and the hydraulic control valve and the safety valve in the pipeline can control the flow direction of the liquid while ensuring the safety of the pipeline.
Drawings
FIG. 1 is a block diagram of a temperature control system;
FIG. 2 is a circuit diagram of a pressure transmitter;
FIG. 3 is a circuit diagram of a temperature sensor;
FIG. 4 is a circuit diagram of an amplifying circuit in the pressure sensor;
FIG. 5 is a schematic view of a simulated cabin;
FIG. 6 is a circuit diagram of a temperature control unit;
FIG. 7 is a flow chart of a method of temperature control;
in the figure, 1, a cooling pool; 2. a sewage tank; 3. a cooling coil; 4. heating the pipeline; 5-1, a first high-frequency induction coil; 5-2, a second high-frequency induction coil; 6-1, a low-pressure pump; 6-2, a high-pressure pump; 7-1, a first temperature and pressure sensor; 7-2, a second temperature and pressure sensor; 7-3, a third temperature and pressure sensor; 8-1, a first pressure transmitter; 8-2, a second pressure transmitter; 9-1, a first hydraulic control valve; 9-2, a second hydraulic control valve; 9-3, a third hydraulic control valve; 9-4, a fourth hydraulic control valve; 10-1, a first safety valve; 10-2, a second safety valve; 10-3, a third safety valve; 11. simulating a cabin body; 11-1, heating layer; 11-2, a heat conducting layer; 11-3, a heat insulation layer; 11-4, a power supply unit; 11-5, a temperature control unit; 12-1, a first normal temperature pipeline; 12-2, a second normal temperature pipeline; 12-3 and a third normal temperature pipeline.
Detailed Description
The embodiments of the present invention will be further described with reference to the accompanying drawings.
In the embodiment of the invention, the calibration platform is a short name for a deep in-situ fidelity coring five-guarantee capability calibration platform, and the simulation cabin is a short name for a deep in-situ high-temperature high-pressure environment simulation cabin.
As shown in fig. 1, the present invention provides a calibration stage temperature control system, the device comprises a cooling pool 1, a sewage pool 2, a cooling coil 3, a heating pipeline 4, a first high-frequency induction coil 5-1, a second high-frequency induction coil 5-2, a low-pressure pump 6-1, a high-pressure pump 6-2, a first temperature and pressure sensor 7-1, a second temperature and pressure sensor 7-2, a third temperature and pressure sensor 7-3, a first pressure transmitter 8-1, a second pressure transmitter 8-2, a first hydraulic control valve 9-1, a second hydraulic control valve 9-2, a third hydraulic control valve 9-3, a fourth hydraulic control valve 9-4, a first safety valve 10-1, a second safety valve 10-2, a third safety valve 10-3, a simulation cabin 11, a first normal-temperature pipeline 12-1, a second normal-temperature pipeline 12-2 and a third normal-temperature pipeline 12-3;
the cooling coil 3 is fixedly arranged in the cooling pool 1; the input end of the cooling coil 3 is fixedly connected with the simulation cabin body 11 through a second normal temperature pipeline 12-2, and the output end of the cooling coil is fixedly arranged in the sewage pool 2; one end of the heating pipeline 4 and one end of the third normal-temperature pipeline 12-3 are both fixedly arranged in the cooling pond 1; a first high-frequency induction coil 5-1, a low-pressure pump 6-1, a first temperature and pressure sensor 7-1 and a second high-frequency induction coil 5-2 are sequentially and fixedly arranged on the outer wall of the heating pipeline 4; the other end of the heating pipeline 4 is fixedly connected with one end of a first normal temperature pipeline 12-1 through a high-pressure pump 6-2; a second hydraulic control valve 9-2, a first safety valve 10-1, a first pressure transmitter 8-1 and a second temperature and pressure sensor 7-2 are fixedly arranged on the outer wall of a first branch of the first normal temperature pipeline 12-1, and a third hydraulic control valve 9-3, a second safety valve 10-2 and a second pressure transmitter 8-2 are fixedly arranged on the outer wall of a second branch; the other end of the first branch and the other end of the second branch are both fixedly connected with the simulation cabin body 11; the high-pressure pump 6-2 is also fixedly connected with one end of a third normal-temperature pipeline 12-3; the other end of the third normal-temperature pipeline 12-3 is fixedly arranged in the cooling pool 1; a first hydraulic control valve 9-1 and a third temperature and pressure sensor 7-3 are fixedly arranged on the outer wall of the third normal temperature pipeline 12-3; a fourth hydraulic control valve 9-4 is fixedly arranged on the outer wall of the second normal-temperature pipeline 12-2;
the low-pressure pump 6-1, the high-pressure pump 6-2, the first pressure transmitter 8-1 and the second pressure transmitter 8-2 are all in communication connection with a computer.
In the embodiment of the present invention, as shown in fig. 1, a filtering system is installed in the wastewater tank 2.
In the invention, the filtering system can filter out silt in the liquid passing through the sample in the simulation cabin, thereby preventing other systems from being damaged.
In the embodiment of the invention, as shown in fig. 1, heat insulation layers are fixedly arranged on the outer walls of the heating pipeline 4, the first normal temperature pipeline 12-1, the second normal temperature pipeline 12-2 and the third normal temperature pipeline 12-3.
In the invention, the outer surface of the liquid pipeline is insulated by the heat insulation layer, so that the heat loss is reduced, and the heat utilization rate is improved.
In the embodiment of the present invention, as shown in fig. 1, the first high-frequency induction coil 5-1 and the low-pressure pump 6-1 form a primary heating and pressurizing unit for heating water at normal temperature and normal pressure to 90 ℃ and pressurizing the water to 5 MPa; the second high-frequency induction coil 5-2 and the high-pressure pump 6-2 form a secondary heating and pressurizing unit which is used for heating water at normal temperature and normal pressure to 150 ℃ and pressurizing the water to 140 MPa.
In the present invention, a high-frequency induction heating coil heating method is adopted, and high-frequency induction is performed by heating a conductor itself by using an induction current (eddy current loss) generated by the conductor under the action of a high-frequency magnetic field and hysteresis loss due to the action of a magnetic field in the conductor. Its advantages are high heat efficiency, low power and saving energy.
In the embodiment of the invention, as shown in fig. 2, the first pressure transmitter 8-1 and the second pressure transmitter 8-2 have the same structure, and both comprise resistors R1-R16, slide varistors RP1-RP3, a capacitor C1, diodes D1-D8, triodes T1-T5, a compound triode T6 and operational amplifiers LM1-LM 2;
the cathode of the diode D1 is connected to the drain of the transistor T1, the collector of the transistor T5, one end of the resistor R8, one end of the resistor R16 and the first stationary end of the slide rheostat RP 2; the source of the triode T1 is connected with one end of the resistor R1; the grid electrode of the triode T1 is respectively connected with the other end of the resistor R1, the negative electrode of the diode D2 and the base electrode of the triode T5; the anode of the diode D2 is connected to the cathode of the diode D3 and one end of the resistor R2; the anode of the diode D3 is connected with the anode of the diode D4; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and the non-inverting input end of the operational amplifier LM 1; the inverting input end of the operational amplifier LM1 is connected with the moving end of the slide rheostat RP 1; the negative power supply end of the operational amplifier LM1 is connected with the emitter of the triode T5, and the output end of the operational amplifier LM1 is connected with one end of the resistor R4; the other end of the resistor R4 is connected with the base electrode of the compound triode T6; the emitter of the compound triode T6 is connected with the first fixed end of the slide rheostat RP 1; the second fixed end of the slide rheostat RP1 is connected with one end of the resistor R5; the collector of the compound triode T6 is respectively connected with one end of the resistor R10 and one end of the resistor R11; the other end of the resistor R10 is connected with the first fixed end of the slide rheostat RP 3; the second fixed end of the slide rheostat RP3 is connected with the other end of the resistor R8, and the moving ends of the slide rheostat RP3 are respectively connected with one end of the capacitor C1 and the non-inverting input end of the operational amplifier LM 2; the inverting input end of the operational amplifier LM2 is respectively connected with the other end of the capacitor C1, the other end of the resistor R11 and one end of the resistor R9; the other end of the resistor R9 is connected with one end of the resistor R15; the other end of the resistor R15 is respectively connected with the other end of the resistor R16, the movable end of the slide rheostat RP2, the second fixed end of the slide rheostat RP2, the negative electrode of the diode D5, the positive power end of the operational amplifier LM2, one end of the resistor R12 and one end of the resistor R13; the output end of the operational amplifier LM2 is connected with one end of a resistor R14; the other end of the resistor R14 is connected with the cathode of the diode D6; the anode of the diode D6 is connected with the cathode of the diode D7; the anode of the diode D7 is connected with the cathode of the diode D8; the anode of the diode D8 is respectively connected with the other end of the resistor R12 and the base of the diode T2; the emitter of the diode T2 is connected with the other end of the resistor R13; the drain electrode of the triode T3 is respectively connected with the anode of the diode D5 and the base electrode of the triode T4; the source of the triode T3 is connected with one end of the resistor R6; the collector of the triode T4 is connected with one end of the resistor R7; the collector of the triode T2, the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R6, the other end of the resistor R7, the positive power supply end of the operational amplifier LM1, the negative electrode of the diode D4 and the positive electrode of the diode D1 are all connected with the power supply end of the temperature control system.
In the embodiment of the invention, as shown in fig. 1, the first temperature and pressure sensor 7-1, the second temperature and pressure sensor 7-2 and the third temperature and pressure sensor 7-3 have the same structure and comprise temperature sensors and pressure sensors;
as shown in fig. 3, the first temperature and pressure sensor 7-1, the second temperature and pressure sensor 7-2 and the third temperature and pressure sensor 7-3 have the same structure and comprise temperature sensors and pressure sensors;
the temperature sensor comprises resistors R17-R18, a grounding resistor R19, a resistor R20, a grounding capacitor C2-C3, a voltage reference chip IC1 with the model of REF3030, an amplification chip IC2 with the model of AD623 and a temperature sensing chip RT1 with the model of PT 100;
a VIN pin of the chip IC1 is respectively connected with a power supply end of a temperature control system and a grounding capacitor C3; the GND pin of the chip IC1 is grounded; a VOUT pin of the chip IC1 is respectively connected with one end of the resistor R17 and one end of the resistor R18; the B1 pin of the chip RT1 is connected with the + IN pin of the chip IC 2; the B2 pin of the chip RT1 is connected with the other end of the resistor R17; pin A of the chip RT1 is grounded; the-RG pin of the chip IC2 is connected with one end of the resistor R20; the-IN pin of the chip IC2 is respectively connected with the other end of the resistor R18 and the grounding resistor R19; the-Vs pin of chip IC2 is grounded; the + RG pin of the chip IC2 is connected with the other end of the resistor R20; a + Vs pin of the chip IC2 is respectively connected with a grounding capacitor C2 and a power supply end of the temperature control system; the REF pin of chip IC2 is grounded;
as shown in FIG. 4, the amplifying circuit of the pressure sensor comprises resistors R21-R32, slide rheostats RP4-RP5, capacitors C7-C9, triodes Q1-Q2, amplifiers A1-A4 and a diode D9;
the 1 st pin of the amplifier A1 is respectively connected with one end of a resistor R21 and one end of a resistor R22, and the 2 nd pin thereof is respectively connected with one end of a resistor R23 and one end of a resistor R24; the other end of the resistor R21 is respectively connected with the other end of the resistor R23, the first fixed end of the slide rheostat RP5, one end of the capacitor C9, the emitter of the triode Q2 and one end of the resistor R31; the other end of the resistor R22 is respectively connected with the second fixed end of the slide rheostat RP5, the other end of the resistor R24, one end of the capacitor C8, the emitter of the triode Q1, one end of the resistor R32, the 1 st pin of the amplifier A3 and one end of the capacitor C7; the 4 th pin of the amplifier A1 is connected with the movable end of the slide rheostat RP 5; the 3 rd pin of the amplifier A1 is connected with the first fixed end of the slide rheostat RP 4; the movable end of the slide rheostat RP4 is connected with one end of the resistor R27; the other end of the resistor R27 is connected with the 2 nd pin of the amplifier A2; the 1 st pin of the amplifier A2 is respectively connected with one end of a resistor R25 and one end of a resistor R26; the base of the triode Q1 is connected with one end of the resistor R29; the other end of the resistor R29 is respectively connected with the 3 rd pin of the amplifier A3 and the other end of the capacitor C7; the 1 st pin of the amplifier A4 is respectively connected with the other end of the resistor R32, one end of the capacitor C10 and the other end of the resistor R31, and the 3 rd pin of the amplifier A4 is respectively connected with the other end of the capacitor C10 and one end of the resistor R30; the other end of the resistor R30 is connected with the base electrode of the triode Q2; the 2 nd pin of the amplifier A3 is respectively connected with one end of a resistor R28 and the cathode of a diode D9; the collector of the transistor Q2, the second fixed end of the sliding rheostat RP4, the other end of the capacitor C8, the other end of the capacitor C9, the other end of the resistor R28, the anode of the diode D9, the collector of the transistor Q1, the other end of the resistor R25, the other end of the resistor R26 and the 3 rd pin of the amplifier A2 are connected.
In the invention, the temperature and pressure sensor can be arranged at the water outlet end of the water pool and the ultrahigh pressure pump, the water inlet of the cabin body, the inlet of the lower section drill rod cabin, the upper part of the sample cabin close to the sample and the lower part of the sample cabin close to the sample, so as to complete the temperature measurement and control of the water in the cabin. Meanwhile, the cabin body is installed on the cabin wall in a mode of not penetrating through the cabin wall, and the safety of the cabin body is guaranteed.
As shown in FIG. 5, the outer wall of the simulated cabin 11 comprises a heating layer 11-1, a heat conducting layer 11-2, a heat insulating layer 11-3, a power supply unit 11-4 and a temperature control unit 11-5;
a heat conduction layer 11-2 is fixedly arranged between the heating layer 11-1 and the heat insulation layer 11-3; the inner wall of the heat conduction layer 11-2 is fixedly provided with a temperature control unit 11-5; the power supply unit 11-4 is electrically connected with the temperature control unit 11-5; the positive electrode and the negative electrode of the power supply unit 11-4 are respectively connected with the positive electrode and the negative electrode of the heating layer 11-1 through leads; the heating layer 11-1 comprises a silicon rubber heating belt and an alkali-free glass fiber layer; the silicon rubber heating belt is wound on the outer wall of the cabin body of the simulation cabin;
as shown in FIG. 6, the temperature control unit 11-5 includes resistors R41-R44, and a heater RLThermistor RtThe integrated chip IC comprises a sliding rheostat VR1, a rectifier diode D16, a voltage stabilizing diode D17, a bidirectional thyristor V, capacitors C21-C23 and a model NE 555;
the 1 st pin of the chip IC is respectively connected with one end of a resistor R44, a T2 pin of a bidirectional thyristor V, one end of a capacitor C22, one end of a capacitor C23 and the anode of a voltage stabilizing diode D17, and the connection point of the 1 st pin of the chip IC is also connected with the power supply end of a power supply unit (11-5); the No. 2 pin of the chip IC is respectively connected with the other end of the resistor R44 and the thermistor RtIs connected with one end of the connecting rod; thermistor RtThe other end of the slide rheostat VR1 is connected with the first fixed end of the slide rheostat; the 3 rd pin of the chip IC is connected with one end of the resistor R43; the other end of the resistor R43 is connected with a pin D of the bidirectional thyristor V; the 4 th pin of the chip IC is respectively connected with the second fixed end of the slide rheostat VR1, the movable end of the slide rheostat VR1, one end of the resistor R42, the cathode of the voltage stabilizing diode D17, the other end of the capacitor C22, the cathode of the rectifying diode D16 and the 8 th pin of the chip IC; the 5 th pin of the chip IC is respectively connected with the other end of the capacitor C23, the other end of the resistor R42 and the 7 th pin of the chip IC; the anode of the rectifying diode D16 is respectively connected with one end of the capacitor C21 and one end of the resistor R41; the other end of the resistor R41 is connected with the other end of the capacitor C21 and the heater R respectivelyLAnd a power supply unit5, power supply end connection; heater RLAnd the other end thereof is connected to a T1 pin of the triac V.
In the invention, the cabin body is heated by a silicon rubber heating belt for 10 hours, the temperature control precision is +/-1 ℃ when the cabin body and the internal sample are heated to 150 ℃, and the thermal efficiency of the system can be improved. The heat insulation layer can prevent a normal temperature medium from entering the cabin to cause rapid temperature change in the cabin, so that the temperature control is more accurate. The silicone rubber heating belt may be a nichrome wire.
Based on the above system, the present invention further provides a calibration platform temperature control method, as shown in fig. 7, including the following steps:
s1: heating the cabin body for 10 hours by utilizing a silicon rubber heating belt on the outer wall of the simulated cabin body to raise the temperature of the cabin body to 150 ℃ so as to finish the heating of the cabin body;
s2: heating normal-temperature normal-pressure water in a cooling pool to 150 ℃ through a heating pipeline, and pressurizing to 140 MPa;
s3: the heated and pressurized liquid flows out from the lower part of a drill rod of the simulation cabin body through an internal pipeline of the simulation cabin body;
s4: inputting liquid flowing out of the lower part of a drill rod of the simulated cabin body into a cooling pool through a normal-temperature pipeline;
s5: cooling the liquid by using a cooling coil in the cooling pond, and flowing into a sewage pond;
s6: and (4) carrying out silt filtration on the liquid by using a filtration system in the sewage tank, enabling the filtered liquid to flow into the cooling tank, and entering the next cycle to finish temperature control.
As shown in fig. 7, step S2 includes the following sub-steps:
s21: heating normal-temperature normal-pressure water in a cooling pool to 90 ℃ and pressurizing to 5MPa by sequentially utilizing a first high-frequency induction coil and a low-pressure pump through a heating pipeline to finish primary heating and pressurizing;
s22: heating the liquid subjected to primary heating and pressurization to 150 ℃ by using a second high-frequency induction coil and a high-pressure pump in sequence, and pressurizing to 140MPa to finish secondary heating and pressurization;
in step S3, the safety valve is used to monitor the pipe safety and the pilot operated valve is used to control the flow of liquid.
In the invention, the high-frequency induction coil, the low-pressure pump and the high-pressure pump finish heating and pressurizing the normal temperature and normal pressure water twice, and the hydraulic control valve and the safety valve in the pipeline can control the flow direction of the liquid while ensuring the safety of the pipeline.
The working principle and the process of the invention are as follows: the simulation cabin is used as a main body, the temperature control system controls the temperature of the cabin body and the temperature of liquid in each pipeline through a heat insulation device of the cabin body and a liquid inlet and outlet pipeline of a drill rod section at the upper part of the cabin body, the temperature control system and the liquid inlet and outlet pipeline work cooperatively, and a reasonable temperature and pressure control implementation scheme is adopted to realize real-time in-situ environment simulation.
In the specific working process, as shown in fig. 1, normal-temperature and normal-pressure water is heated to 90 ℃ from a cooling pool 1 through a heating pipeline 4; feeding into a low-pressure pump 6-1, and pressurizing to 5MPa (corresponding to the boiling point of water 264 ℃); heating to 150 deg.C, and pressurizing to 140MPa with high-pressure pump 6-2; entering a coring device to drive a coring drill and a pipeline in the cabin; liquid flows out from the lower part of the drill rod part after passing through the pipeline of the cabin body, enters the cooling tank 1 through the cooling coil 3 for cooling, flows into the sewage tank 2, then enters the cooling tank 1 through the filtering system in the sewage tank 2, and enters the next cycle. The whole control mode of the system adopts a remote computer to automatically control the temperature, can set the upper limit line value of the temperature to achieve accurate temperature control, and is provided with a first hydraulic control valve 9-1, a second hydraulic control valve 9-2, a third hydraulic control valve 9-3, a fourth hydraulic control valve 9-4, a first safety valve 10-1, a second safety valve 10-2 and a third safety valve 10-3 to respectively control the safety of a pipeline and the flow direction of liquid.
The invention has the beneficial effects that:
(1) according to the invention, the temperature and pressure sensors are arranged on a plurality of monitoring points in the simulation cabin body and the pipeline, so that the safety of the high-temperature and high-pressure pipeline is ensured, a reliable temperature and pressure control system is provided for the deep in-situ high-temperature and high-pressure environment simulation cabin device, and basic pre-research conditions can be provided for deep in-situ rock mechanics and deep scientific front exploration.
(2) The control system can accurately restore the occurrence environment of deep high temperature and high pressure in the deep in-situ high temperature and high pressure environment simulation cabin, and temperature and pressure regulation and control are carried out through various sensors. Meanwhile, liquid (water and oil) in the system needs to be heated synchronously with the cabin body, so that the high-temperature and high-pressure experimental device can be prevented from being damaged due to temperature difference.
(3) The temperature control system is additionally provided with the filtering device, so that silt in liquid passing through a sample in the simulation cabin can be filtered, and other systems are prevented from being damaged.
(4) The heating mode of the invention mainly comprises two modes of a high-frequency heating pipeline and a silicone rubber belt heating cabin body. The two heating modes are combined, so that the adjustment of the heating time can be controlled, and the rapid change of the temperature in the cabin caused by the direct entering of the normal temperature medium into the cabin can be avoided, so that the temperature control is more accurate.
It will be appreciated by those of ordinary skill in the art that the embodiments described herein are intended to assist the reader in understanding the principles of the invention and are to be construed as being without limitation to such specifically recited embodiments and examples. Those skilled in the art can make various other specific changes and combinations based on the teachings of the present invention without departing from the spirit of the invention, and these changes and combinations are within the scope of the invention.

Claims (9)

1. The calibration platform temperature control system is characterized by comprising a cooling pond (1), a sewage pond (2), a cooling coil (3), a heating pipeline (4), a first high-frequency induction coil (5-1), a second high-frequency induction coil (5-2), a low-pressure pump (6-1), a high-pressure pump (6-2), a first temperature-pressure sensor (7-1), a second temperature-pressure sensor (7-2), a third temperature-pressure sensor (7-3), a first pressure transmitter (8-1), a second pressure transmitter (8-2), a first hydraulic control valve (9-1), a second hydraulic control valve (9-2), a third hydraulic control valve (9-3), a fourth hydraulic control valve (9-4), a first safety valve (10-1), a second safety valve (10-2), a first safety valve (9-4), a second safety valve (10-2), a first safety valve (9), a second safety valve (3), a second temperature-1, A third safety valve (10-3), a simulated cabin body (11), a first normal-temperature pipeline (12-1), a second normal-temperature pipeline (12-2) and a third normal-temperature pipeline (12-3);
the cooling coil (3) is fixedly arranged in the cooling pool (1); the input end of the cooling coil (3) is fixedly connected with the simulation cabin body (11) through a second normal-temperature pipeline (12-2), and the output end of the cooling coil is fixedly arranged in the sewage tank (2); one end of the heating pipeline (4) and one end of the third normal-temperature pipeline (12-3) are both fixedly arranged in the cooling pond (1); a first high-frequency induction coil (5-1), a low-pressure pump (6-1), a first temperature and pressure sensor (7-1) and a second high-frequency induction coil (5-2) are sequentially and fixedly arranged on the outer wall of the heating pipeline (4); the other end of the heating pipeline (4) is fixedly connected with one end of a first normal temperature pipeline (12-1) through a high-pressure pump (6-2); a second hydraulic control valve (9-2), a first safety valve (10-1), a first pressure transmitter (8-1) and a second temperature and pressure sensor (7-2) are fixedly arranged on the outer wall of a first branch of the first normal temperature pipeline (12-1), and a third hydraulic control valve (9-3), a second safety valve (10-2) and a second pressure transmitter (8-2) are fixedly arranged on the outer wall of a second branch; the other end of the first branch and the other end of the second branch are both fixedly connected with the simulation cabin body (11); the high-pressure pump (6-2) is also fixedly connected with one end of a third normal-temperature pipeline (12-3); the other end of the third normal-temperature pipeline (12-3) is fixedly arranged in the cooling pool (1); a first hydraulic control valve (9-1) and a third temperature and pressure sensor (7-3) are fixedly arranged on the outer wall of the third normal temperature pipeline (12-3); a fourth hydraulic control valve (9-4) is fixedly arranged on the outer wall of the second normal-temperature pipeline (12-2);
the low-pressure pump (6-1), the high-pressure pump (6-2), the first pressure transmitter (8-1) and the second pressure transmitter (8-2) are all in communication connection with a computer.
2. Calibration platform temperature control system according to claim 1, characterized in that a filtration system is installed in the sump (2).
3. The calibration platform temperature control system of claim 1, wherein the outer walls of the heating pipeline (4), the first normal temperature pipeline (12-1), the second normal temperature pipeline (12-2) and the third normal temperature pipeline (12-3) are all fixedly provided with heat insulation layers.
4. The calibration platform temperature control system according to claim 1, wherein the first high frequency induction coil (5-1) and the low pressure pump (6-1) form a primary heating and pressurizing unit for heating water at normal temperature and pressure to 90 ℃ and pressurizing to 5 MPa; the second high-frequency induction coil (5-2) and the high-pressure pump (6-2) form a secondary heating and pressurizing unit which is used for heating water at normal temperature and normal pressure to 150 ℃ and pressurizing the water to 140 MPa.
5. The calibration platform temperature control system of claim 1, wherein the first pressure transmitter (8-1) and the second pressure transmitter (8-2) are identical in structure and each comprises a resistor R1-R16, a sliding varistor RP1-RP3, a capacitor C1, a diode D1-D8, a transistor T1-T5, a compound transistor T6, and an operational amplifier LM1-LM 2;
the cathode of the diode D1 is respectively connected with the drain of the triode T1, the collector of the triode T5, one end of the resistor R8, one end of the resistor R16 and the first fixed end of the slide rheostat RP 2; the source electrode of the triode T1 is connected with one end of the resistor R1; the grid electrode of the triode T1 is respectively connected with the other end of the resistor R1, the negative electrode of the diode D2 and the base electrode of the triode T5; the anode of the diode D2 is respectively connected with the cathode of the diode D3 and one end of the resistor R2; the anode of the diode D3 is connected with the anode of the diode D4; the other end of the resistor R2 is respectively connected with one end of a resistor R3 and the non-inverting input end of the operational amplifier LM 1; the inverting input end of the operational amplifier LM1 is connected with the moving end of the slide rheostat RP 1; the negative power supply end of the operational amplifier LM1 is connected with the emitter of the triode T5, and the output end of the operational amplifier LM1 is connected with one end of the resistor R4; the other end of the resistor R4 is connected with the base electrode of the compound triode T6; the emitter of the compound triode T6 is connected with the first fixed end of the slide rheostat RP 1; the second fixed end of the slide rheostat RP1 is connected with one end of the resistor R5; the collector of the compound triode T6 is respectively connected with one end of a resistor R10 and one end of a resistor R11; the other end of the resistor R10 is connected with the first fixed end of the slide rheostat RP 3; the second fixed end of the slide rheostat RP3 is connected with the other end of the resistor R8, and the moving ends of the slide rheostat RP3 are respectively connected with one end of the capacitor C1 and the non-inverting input end of the operational amplifier LM 2; the inverting input end of the operational amplifier LM2 is respectively connected with the other end of the capacitor C1, the other end of the resistor R11 and one end of the resistor R9; the other end of the resistor R9 is connected with one end of a resistor R15; the other end of the resistor R15 is respectively connected with the other end of the resistor R16, the movable end of the slide rheostat RP2, the second fixed end of the slide rheostat RP2, the negative electrode of the diode D5, the positive power end of the operational amplifier LM2, one end of the resistor R12 and one end of the resistor R13; the output end of the operational amplifier LM2 is connected with one end of a resistor R14; the other end of the resistor R14 is connected with the cathode of a diode D6; the anode of the diode D6 is connected with the cathode of the diode D7; the anode of the diode D7 is connected with the cathode of the diode D8; the anode of the diode D8 is respectively connected with the other end of the resistor R12 and the base of the diode T2; the emitter of the diode T2 is connected with the other end of the resistor R13; the drain electrode of the triode T3 is respectively connected with the anode of the diode D5 and the base electrode of the triode T4; the source electrode of the triode T3 is connected with one end of the resistor R6; the collector of the triode T4 is connected with one end of a resistor R7; the collector of the triode T2, the other end of the resistor R3, the other end of the resistor R5, the other end of the resistor R6, the other end of the resistor R7, the positive power supply end of the operational amplifier LM1, the negative electrode of the diode D4 and the positive electrode of the diode D1 are all connected with the power supply end of the temperature control system.
6. The calibration platform temperature control system of claim 1, wherein the first, second and third thermo-pressure sensors (7-1, 7-2, 7-3) are identical in structure and each comprise a temperature sensor and a pressure sensor;
the temperature sensor comprises resistors R17-R18, a grounding resistor R19, a resistor R20, a grounding capacitor C2-C3, a voltage reference chip IC1 with the model of REF3030, an amplification chip IC2 with the model of AD623 and a temperature sensing chip RT1 with the model of PT 100;
a VIN pin of the chip IC1 is respectively connected with a power supply end of a temperature control system and a grounding capacitor C3; the GND pin of the chip IC1 is grounded; a VOUT pin of the chip IC1 is respectively connected with one end of a resistor R17 and one end of a resistor R18; the B1 pin of the chip RT1 is connected with the + IN pin of the chip IC 2; the B2 pin of the chip RT1 is connected with the other end of the resistor R17; the A pin of the chip RT1 is grounded; the-RG pin of the chip IC2 is connected with one end of a resistor R20; the-IN pin of the chip IC2 is respectively connected with the other end of the resistor R18 and the grounding resistor R19; the-Vs pin of the chip IC2 is grounded; the + RG pin of the chip IC2 is connected with the other end of the resistor R20; the + Vs pin of the chip IC2 is respectively connected with a grounding capacitor C2 and a power supply end of a temperature control system; the REF pin of the chip IC2 is grounded;
the amplifying circuit of the pressure sensor comprises resistors R21-R32, slide rheostats RP4-RP5, capacitors C7-C9, triodes Q1-Q2, amplifiers A1-A4 and a diode D9;
the 1 st pin of the amplifier A1 is respectively connected with one end of a resistor R21 and one end of a resistor R22, and the 2 nd pin thereof is respectively connected with one end of a resistor R23 and one end of a resistor R24; the other end of the resistor R21 is respectively connected with the other end of the resistor R23, the first fixed end of the slide rheostat RP5, one end of the capacitor C9, the emitting electrode of the triode Q2 and one end of the resistor R31; the other end of the resistor R22 is respectively connected with the second fixed end of the slide rheostat RP5, the other end of the resistor R24, one end of the capacitor C8, the emitter of the triode Q1, one end of the resistor R32, the 1 st pin of the amplifier A3 and one end of the capacitor C7; the 4 th pin of the amplifier A1 is connected with the movable end of a slide rheostat RP 5; the 3 rd pin of the amplifier A1 is connected with the first fixed end of a slide rheostat RP 4; the movable end of the slide rheostat RP4 is connected with one end of the resistor R27; the other end of the resistor R27 is connected with the 2 nd pin of the amplifier A2; the 1 st pin of the amplifier A2 is respectively connected with one end of a resistor R25 and one end of a resistor R26; the base electrode of the triode Q1 is connected with one end of the resistor R29; the other end of the resistor R29 is respectively connected with the 3 rd pin of the amplifier A3 and the other end of the capacitor C7; the 1 st pin of the amplifier A4 is respectively connected with the other end of the resistor R32, one end of the capacitor C10 and the other end of the resistor R31, and the 3 rd pin of the amplifier A4 is respectively connected with the other end of the capacitor C10 and one end of the resistor R30; the other end of the resistor R30 is connected with the base electrode of the triode Q2; the 2 nd pin of the amplifier A3 is respectively connected with one end of a resistor R28 and the cathode of a diode D9; the collector of the triode Q2, the second fixed end of the sliding rheostat RP4, the other end of the capacitor C8, the other end of the capacitor C9, the other end of the resistor R28, the anode of the diode D9, the collector of the triode Q1, the other end of the resistor R25, the other end of the resistor R26 and the 3 rd pin of the amplifier A2 are connected.
7. The calibration platform temperature control system of claim 1, wherein the outer wall of the simulated nacelle (11) comprises a heating layer (11-1), a heat conducting layer (11-2), a thermal insulating layer (11-3), a power supply unit (11-4), and a temperature control unit (11-5);
a heat conduction layer (11-2) is fixedly arranged between the heating layer (11-1) and the heat insulation layer (11-3); a temperature control unit (11-5) is fixedly arranged on the inner wall of the heat conduction layer (11-2); the power supply unit (11-4) is electrically connected with the temperature control unit (11-5); the positive electrode and the negative electrode of the power supply unit (11-4) are respectively connected with the positive electrode and the negative electrode of the heating layer (11-1) through leads; the heating layer (11-1) comprises a silicon rubber heating belt and an alkali-free glass fiber layer; the silicon rubber heating belt is wound on the outer wall of the cabin body of the simulation cabin;
the temperature control unit (11-5) comprises resistors R41-R44 and a heater RLThermistor RtThe integrated chip IC comprises a sliding rheostat VR1, a rectifier diode D16, a voltage stabilizing diode D17, a bidirectional thyristor V, capacitors C21-C23 and a model NE 555;
the 1 st pin of the chip IC is respectively connected with one end of a resistor R44, a T2 pin of a bidirectional thyristor V, one end of a capacitor C22, one end of a capacitor C23 and the anode of a voltage stabilizing diode D17, and the connection point of the 1 st pin of the chip IC is also connected with the power supply end of a power supply unit (11-5); the No. 2 pin of the chip IC is respectively connected with the other end of the resistor R44 and the thermistor RtIs connected with one end of the connecting rod; the thermistor RtThe other end of the slide rheostat VR1 is connected with the first fixed end of the slide rheostat; the 3 rd pin of the chip IC is connected with one end of a resistor R43; the other end of the resistor R43 is connected with a pin D of the bidirectional thyristor V; the 4 th pin of the chip IC is respectively connected with the second fixed end of the slide rheostat VR1, the movable end of the slide rheostat VR1, one end of the resistor R42, the cathode of the voltage stabilizing diode D17, the other end of the capacitor C22 and the rectifier diode D16The negative electrode is connected with the 8 th pin of the chip IC; the 5 th pin of the chip IC is respectively connected with the other end of the capacitor C23, the other end of the resistor R42 and the 7 th pin of the chip IC; the anode of the rectifying diode D16 is respectively connected with one end of a capacitor C21 and one end of a resistor R41; the other end of the resistor R41 is respectively connected with the other end of the capacitor C21 and the heater RLIs connected with the power supply end of the power supply unit (5); the heater RLAnd the other end thereof is connected to a T1 pin of the triac V.
8. A method for controlling the temperature of a calibration platform is characterized by comprising the following steps:
s1: heating the cabin body for 10 hours by utilizing a silicon rubber heating belt on the outer wall of the simulated cabin body to raise the temperature of the cabin body to 150 ℃ so as to finish the heating of the cabin body;
s2: heating normal-temperature normal-pressure water in a cooling pool to 150 ℃ through a heating pipeline, and pressurizing to 140 MPa;
s3: the heated and pressurized liquid flows out from the lower part of a drill rod of the simulation cabin body through an internal pipeline of the simulation cabin body;
s4: inputting liquid flowing out of the lower part of a drill rod of the simulated cabin body into a cooling pool through a normal-temperature pipeline;
s5: cooling the liquid by using a cooling coil in the cooling pond, and flowing into a sewage pond;
s6: and (4) carrying out silt filtration on the liquid by using a filtration system in the sewage tank, enabling the filtered liquid to flow into the cooling tank, and entering the next cycle to finish temperature control.
9. The calibration platform temperature control method of claim 8, wherein the step S2 comprises the sub-steps of:
s21: heating normal-temperature normal-pressure water in a cooling pool to 90 ℃ and pressurizing to 5MPa by sequentially utilizing a first high-frequency induction coil and a low-pressure pump through a heating pipeline to finish primary heating and pressurizing;
s22: heating the liquid subjected to primary heating and pressurization to 150 ℃ by using a second high-frequency induction coil and a high-pressure pump in sequence, and pressurizing to 140MPa to finish secondary heating and pressurization;
in step S3, the safety valve is used to monitor the safety of the pipeline, and the pilot-controlled valve is used to control the flow of the liquid.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114458204A (en) * 2022-01-26 2022-05-10 四川大学 Control system for operation of fidelity corer
CN115097881A (en) * 2022-06-15 2022-09-23 四川大学 Calibration platform rapid cooling system and control method thereof
CN115263738A (en) * 2022-06-15 2022-11-01 四川大学 Sectional ultrahigh-pressure large-flow circulation system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222140A (en) * 1986-01-06 1987-09-30 ジ−イ−オ− オペレ−タ− コ−ポレ−シヨン Continuous gas and vapor monitor
CN202266217U (en) * 2011-08-28 2012-06-06 中国石油集团长城钻探工程有限公司 Heat-preserving and pressure-maintaining coring tool
CN103712834A (en) * 2014-01-02 2014-04-09 中国科学院武汉岩土力学研究所 Indoor truth-preserving sampling, sample storage and analysis device and method based on deep well sampling
US20170003260A1 (en) * 2013-01-09 2017-01-05 Earth Networks, Inc. Network for measuring greenhouse gases in the atmosphere
CN107703037A (en) * 2017-08-30 2018-02-16 中国石油天然气股份有限公司 For HTHP Natural Gas Migration And Accumulation visual detection device and method
CN108801404A (en) * 2018-06-14 2018-11-13 中国三峡建设管理有限公司 Be in the milk unit stream gauge calibration device and method
CN111137957A (en) * 2019-12-31 2020-05-12 河海大学常州校区 Gas-liquid-solid three-phase pulse discharge electrical characteristic research experimental device and method thereof
CN112211579A (en) * 2020-10-29 2021-01-12 张新定 Natural gas hydrate core sampling equipment for natural gas exploration

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222140A (en) * 1986-01-06 1987-09-30 ジ−イ−オ− オペレ−タ− コ−ポレ−シヨン Continuous gas and vapor monitor
CN202266217U (en) * 2011-08-28 2012-06-06 中国石油集团长城钻探工程有限公司 Heat-preserving and pressure-maintaining coring tool
US20170003260A1 (en) * 2013-01-09 2017-01-05 Earth Networks, Inc. Network for measuring greenhouse gases in the atmosphere
CN103712834A (en) * 2014-01-02 2014-04-09 中国科学院武汉岩土力学研究所 Indoor truth-preserving sampling, sample storage and analysis device and method based on deep well sampling
CN107703037A (en) * 2017-08-30 2018-02-16 中国石油天然气股份有限公司 For HTHP Natural Gas Migration And Accumulation visual detection device and method
CN108801404A (en) * 2018-06-14 2018-11-13 中国三峡建设管理有限公司 Be in the milk unit stream gauge calibration device and method
CN111137957A (en) * 2019-12-31 2020-05-12 河海大学常州校区 Gas-liquid-solid three-phase pulse discharge electrical characteristic research experimental device and method thereof
CN112211579A (en) * 2020-10-29 2021-01-12 张新定 Natural gas hydrate core sampling equipment for natural gas exploration

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DONGYU WU, ET AL: "Experimental study on a pressure-coring technology based on a freeze-core valve for marine hydrate-bearing sediment sampling", 《JOURNAL OF NATURAL GAS SCIENCE AND ENGINEERING》 *
INADA N,YAMAMOTO K: "Data report:Hybrid Pressure Coring System tool review and summary of recovery result from gas-hydrate related coring in the Nankai Project", 《MARINE AND PETROLEUM GEOLOGY》 *
余波 等: "深部岩层原位保真取心主动保温系统创新设计", 《工程设计学报》 *
谢和平 等: "深部岩石原位"五保"取芯构想与研究进展", 《岩石力学与工程学报》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114458204A (en) * 2022-01-26 2022-05-10 四川大学 Control system for operation of fidelity corer
CN115097881A (en) * 2022-06-15 2022-09-23 四川大学 Calibration platform rapid cooling system and control method thereof
CN115263738A (en) * 2022-06-15 2022-11-01 四川大学 Sectional ultrahigh-pressure large-flow circulation system

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