CN112859537A - Exposure optical head calibration method and calibration device for exposure machine - Google Patents
Exposure optical head calibration method and calibration device for exposure machine Download PDFInfo
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- CN112859537A CN112859537A CN202110043203.9A CN202110043203A CN112859537A CN 112859537 A CN112859537 A CN 112859537A CN 202110043203 A CN202110043203 A CN 202110043203A CN 112859537 A CN112859537 A CN 112859537A
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- calibration
- exposure
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- plate
- head
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- 230000003287 optical effect Effects 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses an exposure optical head calibration method for an exposure machine, which comprises the following steps: step 1, moving a photosensitive calibration plate to a position below exposure optical heads, and then exposing calibration patterns on the photosensitive calibration plate by all the exposure optical heads; step 2, detecting the calibration pattern on the photosensitive calibration plate through an alignment camera; and 3, calculating the relative positions of all the exposure optical heads according to the detection result in the step 2, and further completing the position calibration of the exposure optical heads at one time.
Description
Technical Field
The invention relates to the technical field of exposure machines, in particular to an exposure optical head calibration method and a calibration device for an exposure machine.
Background
In the technical field of laser direct-writing exposure machines, optical head position calibration is an important process for exposure of laser direct-writing exposure machine equipment. After the device operates for a period of time, the deviation of the position relation of the optical head can cause the problems of non-equal pattern splicing and the like, so that the product is scrapped due to poor exposure, and therefore, the position relation of the optical head needs to be calibrated at intervals. In addition, the PCB requires multiple exposures, each of which is aligned to determine its exact position. However, the calibration of the optical head and the alignment of the PCB require the movement of the exposure optical head and the alignment camera on their movement axes, the exposure optical head has heavy mass, and inevitably generates a large movement error during the movement process, and the data of the exposure optical head and the alignment camera need to provide a reference for the machine table together during the exposure process, thereby generating a systematic error of the exposure machine table caused by the error of the movement axes. Even the accuracy and production cost of the exposed product.
Disclosure of Invention
The present invention is directed to a calibration method and a calibration apparatus for an exposure head of an exposure machine, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
an exposure optical head calibration method for an exposure machine comprises the following steps:
and 3, calculating the relative positions of all the exposure optical heads according to the detection result in the step 2, and further completing the position calibration of one exposure optical head.
As a further scheme of the invention: in the step, all the exposure optical heads simultaneously expose calibration patterns on the photosensitive calibration plate.
As a further scheme of the invention: in which a calibration pattern exposed by the exposure head on the photosensitive calibration plate is captured by the alignment camera moving horizontally over the photosensitive calibration plate.
As a further scheme of the invention: in the step, when the photosensitive calibration plate moves below the exposure optical head, the projection position of the exposure optical head on the photosensitive calibration plate is located in the area of the photosensitive calibration plate where the calibration pattern is not exposed.
As a further scheme of the invention: the photosensitive calibration plate is provided with at least one photosensitive calibration area, and the number of the photosensitive calibration areas is not less than that of the exposure optical heads.
As a further scheme of the invention: the photosensitive calibration area is provided with n × m calibration blocks arranged in a matrix, the coordinates of the calibration blocks are (0,0) - (n, m), the coordinates of the calibration block exposed when the optical head is exposed last time are (x, y), if x < n, the coordinates of the calibration block exposed at the present calibration time are (x +1, y), if x is n and y is m, the coordinates of the calibration block exposed at the present calibration time are (0, y +1), and if x is n and y is m, the photosensitive calibration plate is replaced.
An exposure optical head calibration device for an exposure machine comprises a frame, wherein an exposure optical head, an alignment camera and a sucker are arranged at the upper end of the frame, the exposure optical head and the alignment camera are positioned above the sucker, the alignment camera is horizontally and slidably connected with the frame, the sucker is slidably connected with the frame, and a photosensitive calibration plate is detachably connected to the upper end of the sucker.
As a further scheme of the invention: the alignment camera is horizontally slidably connected to the frame by an alignment shaft.
As a further scheme of the invention: and a support plate is arranged below the sucker and is in sliding connection with the rack through a sliding rail.
As a further scheme of the invention: the sucker is detachably connected with an exposure PCB, and the photosensitive calibration plate and the exposure PCB are distributed on the sucker in the front-back direction.
Compared with the prior art, the invention has the beneficial effects that:
1. the method comprises the steps that a photosensitive calibration plate is arranged on a sucker, exposure optical heads keep fixed in position during calibration, all the optical heads simultaneously explode calibration patterns on the photosensitive calibration plate at one time, then an alignment camera is used for capturing the calibration patterns of the exposure optical heads exploding on the photosensitive calibration plate, and the relative position relation of the exposure optical heads is calculated and calibrated, so that the optical head calibration and PCB alignment can be completed only by means of the movement of an alignment axis in the calibration and alignment process, and the inevitable large movement error of the exposure optical heads in the movement process due to heavy quality is avoided;
2. the photosensitive calibration plate is provided with calibration areas with the same number as that of the exposure optical heads, the calibration areas are internally provided with calibration blocks arranged in a matrix, and the exposure optical heads are exposed in the area of one calibration block when each calibration is performed, so that the exposure optical heads can be exposed and calibrated on the calibration blocks one by moving the photosensitive calibration plate, the exposure optical heads can be exposed and calibrated on the photosensitive calibration plate for multiple times to calibrate patterns, and the cost is effectively reduced;
3. the calibration camera is replaced by the alignment camera, the exposure precision is improved, and the influence on the precision of the machine table caused by the errors of a plurality of motion axes is avoided.
Drawings
Fig. 1 is a schematic structural diagram of the present embodiment.
In the figure: 1-exposure optical head, 2-alignment camera, 3-frame, 4-stepping axis, 5-alignment axis, 6-sucker, 7-photosensitive calibration plate, 8-exposure PCB plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1, an exposure optical head calibration device for an exposure machine comprises a frame 3, an exposure optical head 1, an alignment camera 2 and a sucker 6 are arranged at the upper end of the frame 3, the exposure optical head 1 and the alignment camera 2 are positioned above the sucker 6, the alignment camera 2 is horizontally and slidably connected with the frame 3 through an alignment shaft 5, a support plate is arranged below the sucker 6, the support plate is slidably connected with the frame 3 through a slide rail, a photosensitive calibration plate 7 is detachably connected at the upper end of the sucker 6, an exposure PCB plate 8 is detachably connected to the sucker 6, and the photosensitive calibration plate 7 and the exposure PCB plate 8 are distributed on the sucker 6 in a front-back manner.
In an embodiment, the photosensitive calibration plate 7 can be arranged in an interchangeable manner, at least one photosensitive calibration area is arranged on the photosensitive calibration plate 7, the number of the photosensitive calibration areas is not less than the number of the exposure optical heads, the photosensitive calibration area is provided with n × m calibration blocks arranged in a matrix, and the coordinates of the calibration blocks are (0,0) - (n, m).
An exposure optical head calibration method for an exposure machine comprises the following steps:
All exposure heads 1 then expose the calibration pattern on the photosensitive calibration plate 7 and all exposure heads 1 simultaneously expose the calibration pattern on the photosensitive calibration plate 7.
And 2, moving the photosensitive calibration plate 7 in the step 1 to the position below the alignment camera 2, detecting the calibration pattern on the photosensitive calibration plate 7 through the alignment camera 2, and grabbing the calibration pattern exposed by the exposure optical head 1 on the photosensitive calibration plate 7 through the horizontal movement of the alignment camera 2 above the photosensitive calibration plate 7 in the step 2.
And 3, calculating the relative positions of all the exposure optical heads 1 according to the detection result in the step 2, further completing the position calibration of the exposure optical heads 1 at one time, and exposing the PCB through the exposure optical heads 1 after the calibration is completed.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. An exposure optical head calibration method for an exposure machine is characterized by comprising the following steps:
step 1, moving a photosensitive calibration plate (7) to the position below an exposure optical head (1), and then exposing calibration patterns on the photosensitive calibration plate (7) by all the exposure optical heads (1);
step 2, the photosensitive calibration plate (7) in the step 1 is moved to the position below the alignment camera (2), and the calibration pattern on the photosensitive calibration plate (7) is detected through the alignment camera (2);
and 3, calculating the relative positions of all the exposure optical heads (1) according to the detection result in the step 2, and further completing the position calibration of the one-time exposure optical heads (1).
2. An exposure head calibration method for an exposure machine according to claim 1, wherein all the exposure heads (1) in step (1) expose calibration patterns on the photosensitive calibration plate (7) simultaneously.
3. An exposure head calibration method for an exposure machine according to claim 1, characterized in that in step (2) the calibration pattern of the exposure head (1) exposed on the photosensitive calibration plate (7) is grabbed by moving the alignment camera (2) horizontally over the photosensitive calibration plate (7).
4. An exposure head calibration method for an exposure machine according to claim 1, wherein in the step (1), when the photosensitive calibration plate (7) is moved below the exposure head (1), the projection position of the exposure head (1) on the photosensitive calibration plate (7) is located in the area of the photosensitive calibration plate (7) where the calibration pattern is not exposed.
5. An exposure head calibration method for exposure machines according to claim 1, characterized in that at least one photosensitive calibration plate (7) is provided with at least one photosensitive calibration area, and the number of the photosensitive calibration areas is not less than the number of the exposure heads.
6. An exposure head calibration method for an exposure machine according to claim 5, wherein the photosensitive calibration area is provided with n × m calibration blocks arranged in a matrix, the coordinates of the calibration blocks are (0,0) - (n, m), the coordinates of the calibration block exposed when the optical head was last exposed are (x, y), if x < n, the coordinates of the calibration block exposed at this time are (x +1, y), if x ═ n and y < m, the coordinates of the calibration block exposed at this time are (0, y +1), and if x ═ n and y ═ m, the photosensitive calibration plate (7) is replaced.
7. An exposure optical head calibration device for an exposure machine according to any one of claims 1 to 6, characterized by comprising a frame (3), wherein an exposure optical head (1), an alignment camera (2) and a sucker (6) are arranged at the upper end of the frame (3), the exposure optical head (1) and the alignment camera (2) are positioned above the sucker (6), the alignment camera (2) is horizontally and slidably connected with the frame (3), the sucker (6) is slidably connected with the frame (3), and a photosensitive calibration plate (7) is detachably connected at the upper end of the sucker (6).
8. An exposure head calibration device for exposure machines according to claim 7, characterized in that the alignment camera (2) is horizontally slidably connected to the frame (3) by an alignment axis (5).
9. An exposure head calibration device for exposure machines according to claim 7, wherein a support plate is arranged below the suction cup (6), and the support plate is slidably connected with the frame (3) through a slide rail.
10. An exposure head calibration device for exposure machine according to claim 7, wherein the chuck (6) is detachably connected with an exposure PCB (8), and the photosensitive calibration plate (7) and the exposure PCB (8) are distributed back and forth on the chuck (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110043203.9A CN112859537B (en) | 2021-01-13 | 2021-01-13 | Exposure optical head calibration method and calibration device for exposure machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110043203.9A CN112859537B (en) | 2021-01-13 | 2021-01-13 | Exposure optical head calibration method and calibration device for exposure machine |
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| Publication Number | Publication Date |
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| CN112859537A true CN112859537A (en) | 2021-05-28 |
| CN112859537B CN112859537B (en) | 2023-02-10 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11329953A (en) * | 1998-05-20 | 1999-11-30 | Canon Inc | Scanning aligner and aligning method |
| US20050128454A1 (en) * | 2003-12-15 | 2005-06-16 | Hideki Ina | Exposure method and apparatus |
| JP2010109220A (en) * | 2008-10-31 | 2010-05-13 | Nikon Corp | Maskless exposure device and maskless exposure method |
| US20120019793A1 (en) * | 2010-07-26 | 2012-01-26 | Samsung Electronics Co., Ltd. | Exposure apparatus including the exposure head and control method thereof |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN111983896A (en) * | 2020-03-09 | 2020-11-24 | 广东安达智能装备股份有限公司 | High-precision alignment method for 3D exposure machine |
-
2021
- 2021-01-13 CN CN202110043203.9A patent/CN112859537B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11329953A (en) * | 1998-05-20 | 1999-11-30 | Canon Inc | Scanning aligner and aligning method |
| US20050128454A1 (en) * | 2003-12-15 | 2005-06-16 | Hideki Ina | Exposure method and apparatus |
| JP2010109220A (en) * | 2008-10-31 | 2010-05-13 | Nikon Corp | Maskless exposure device and maskless exposure method |
| US20120019793A1 (en) * | 2010-07-26 | 2012-01-26 | Samsung Electronics Co., Ltd. | Exposure apparatus including the exposure head and control method thereof |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN111983896A (en) * | 2020-03-09 | 2020-11-24 | 广东安达智能装备股份有限公司 | High-precision alignment method for 3D exposure machine |
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| CN112859537B (en) | 2023-02-10 |
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Denomination of invention: A calibration method and calibration device for exposure heads used in exposure machines Effective date of registration: 20231218 Granted publication date: 20230210 Pledgee: China Construction Bank Co.,Ltd. Hefei government culture new area sub branch Pledgor: Hefei Xinqi microelectronics equipment Co.,Ltd. Registration number: Y2023980072089 |