CN112856841A - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN112856841A CN112856841A CN202110168928.0A CN202110168928A CN112856841A CN 112856841 A CN112856841 A CN 112856841A CN 202110168928 A CN202110168928 A CN 202110168928A CN 112856841 A CN112856841 A CN 112856841A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
The embodiment of the invention discloses a temperature control device, which comprises: the system comprises a control module, a first circulation module, a second circulation module and a heat exchange module; the first circulation module comprises a first storage device for storing a temperature control agent and a first circulation pipeline communicated with the first storage device, and the second circulation module comprises a second storage device for storing a temperature control liquid and a second circulation pipeline communicated with the second storage device; the control module is used for controlling the temperature of the temperature control agent entering the first storage device according to the temperature of the temperature control liquid in the second circulation pipeline. The temperature of the temperature control agent in the first storage device is controlled in real time through the control module, the temperature control liquid after heat exchange with the temperature control agent is output to the temperature control device to be controlled, and then the temperature of the temperature control device is controlled indirectly through the control of the temperature control agent, so that accurate temperature control of the temperature control device is achieved.
Description
Technical Field
The embodiment of the invention relates to the technical field of temperature control, in particular to temperature control equipment.
Background
With the development of the information age and the advancement of technology, the semiconductor industry developed around chip manufacturing is rapidly developing, the chip manufacturing process is more and more complex, the requirements on the functional performance of processing and testing (such as packaging testing) and supporting equipment thereof are higher and higher, and the requirements on the control precision and stability of temperature are higher and higher.
The traditional temperature control equipment adopts an air cooling or liquefied gas direct evaporation heat absorption mode to cool the packaged test chip.
However, the air cooling or liquefying method has low temperature control precision, and cannot meet the precision requirement on temperature during chip packaging test.
Disclosure of Invention
The invention provides temperature control equipment, which is used for accurately controlling the temperature of a device to be controlled by temperature.
The temperature control equipment provided by the embodiment of the invention comprises a control module, a first circulation module, a second circulation module and a heat exchange module; the first circulation module comprises a first storage device for storing a temperature control agent and a first circulation pipeline communicated with the first storage device, the second circulation module comprises a second storage device for storing a temperature control liquid and a second circulation pipeline communicated with the second storage device, and the first storage device and the second storage device are positioned in the heat exchange module;
the temperature control liquid is used for controlling the temperature of the device to be controlled by temperature;
the control module is respectively connected with the first circulation module and the second circulation module and is used for controlling the temperature of the temperature control agent entering the first storage device from the first circulation pipeline according to the temperature of the temperature control liquid in the second circulation pipeline.
Optionally, the first circulation pipeline includes a first temperature circulation pipeline and a second temperature circulation pipeline; the first temperature circulating pipeline is communicated with an inlet and an outlet of the first storage device, and a first switch is arranged in the first temperature circulating pipeline;
the first switch is used for controlling the flow of the temperature control agent with the first temperature entering the first storage device under the control of the control module;
the second temperature circulating pipeline is internally provided with a processing unit and a second switch, the inlet of the processing unit is communicated with the inlet of the first temperature circulating pipeline, the outlet of the processing unit is communicated with the inlet of the first storage device through the second switch, and the processing unit is used for processing the temperature control agent at a first temperature into the temperature control agent at a second temperature, wherein the first temperature and the second temperature are different in size;
the second switch is used for controlling the flow of the temperature control agent with the second temperature entering the first storage device under the control of the control module;
the control module is used for controlling the opening degrees of the first switch and the second switch according to the temperature of the temperature control liquid in the second circulating pipeline.
Optionally, the second circulation pipeline includes a temperature detection unit;
the temperature detection unit is arranged on the second circulating pipeline and used for detecting the temperature of the temperature control liquid in the second circulating pipeline and transmitting the temperature control liquid to the control module.
Optionally, the second circulation pipeline further comprises a soaking storage unit and a pump body;
the inlet of the soaking storage unit is communicated with the outlet of the second storage device, and the pump body is communicated with the outlet of the soaking storage unit and the outlet of the second circulation pipeline;
the soaking storage unit is used for reducing the temperature difference of the temperature control liquid.
Optionally, the control module is further in communication connection with an upper computer and is used for controlling the first circulation module and the second circulation module according to an instruction of the upper computer.
Optionally, the temperature control agent is a refrigerant, and the processing unit is a condenser.
Optionally, the temperature control device further comprises at least one branch pipeline, and a temperature control plate body is arranged in each branch pipeline;
pipelines on two sides of the temperature control plate body are respectively communicated with an outlet and an inlet of the second circulating pipeline and are used for transmitting the temperature control liquid to the temperature control plate body and transmitting the temperature control liquid flowing into the temperature control plate body back to the second circulating pipeline;
the temperature control plate body is also contacted with the temperature control device to be controlled and is used for controlling the temperature of the temperature control device to be controlled.
Optionally, the temperature control device is a chip.
Optionally, the temperature control liquid is an electronic fluorination liquid.
Optionally, the second storage device and the second circulation pipeline are both made of stainless steel.
The temperature control equipment provided by the embodiment of the invention comprises a control module, a first circulation module, a second circulation module and a heat exchange module; the first circulation module comprises a first storage device for storing a temperature control agent and a first circulation pipeline communicated with the first storage device, the second circulation module comprises a second storage device for storing a temperature control liquid and a second circulation pipeline communicated with the second storage device, and the heat exchange module comprises the first storage device and the second storage device; the temperature control liquid is used for controlling the temperature of the device to be controlled by temperature; the control module is respectively connected with the first circulation module and the second circulation module and is used for controlling the temperature of the temperature control agent entering the first storage device from the first circulation pipeline according to the temperature of the temperature control liquid in the second circulation pipeline. This embodiment carries out the heat exchange to temperature control agent and temperature control liquid through heat exchange module, and control module real time control enters into the temperature of temperature control agent in first storage device, will carry out temperature control with the temperature control liquid output after the temperature control agent heat exchange to treating temperature control device, and then treats temperature control device's temperature through the control indirect control to temperature control agent temperature, realizes treating temperature control device's accurate temperature control.
Drawings
Fig. 1 is a schematic structural diagram of a temperature control device according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of another temperature control device according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of another temperature control device according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of another temperature control device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a temperature control device according to an embodiment of the present invention, and referring to fig. 1, the temperature control device optionally includes a control module 100, a first cycle module 200, a second cycle module 300, and a heat exchange module 400; the first circulation module 200 includes a first storage device 210 for storing a temperature control agent and a first circulation line 220 communicating with the first storage device 210, the second circulation module 300 includes a second storage device 310 for storing a temperature control liquid and a second circulation line 320 communicating with the second storage device 310, the first storage device 210 and the second storage device 310 are located in the heat exchange module 400;
the temperature control liquid is used for controlling the temperature of the device to be controlled by temperature;
the control module 100 is connected to the first circulation module 200 and the second circulation module 300, respectively, and is configured to control the temperature of the temperature control agent introduced from the first circulation line 220 into the first storage device 210 according to the temperature of the temperature control fluid in the second circulation line 320.
The heat exchange module 400 may be a larger container for accommodating the first storage device 210 and the second storage device 310, fig. 1 exemplarily shows that the first storage device 210 and the second storage device 310 are disposed in a left-right parallel arrangement without crossing, may also be disposed in an up-down parallel arrangement, or the first storage device 210 completely surrounds the second storage device 320, and it should be noted that the first storage device 210 and the second storage device 310 are not communicated with each other, and only perform heat exchange and not perform mass exchange.
The first circulation pipeline 220 is a pipeline through which the temperature control agent circulates, the temperature control agent in the first storage device 210 can be subjected to certain treatment through the first circulation pipeline 220 after the heat exchange is completed, and then enters the first storage device 210 again for heat exchange, and the temperature control agent can be reused through the first circulation pipeline 220. The temperature control agent can be a refrigerant, the temperature control device cools the temperature control device to be treated, the temperature control agent can also be a heating agent, and the temperature control device heats the temperature control device to be treated, and the embodiment is not specifically limited herein.
The second circulation pipeline 320 is a pipeline through which the temperature control liquid flows, the temperature control liquid in the second storage device 310 can be output through the second circulation pipeline 320 after heat exchange is completed, and is used for heating or cooling the device to be temperature controlled, and the temperature control liquid is transmitted back to the second storage device 310 through the second circulation pipeline 320 after heating or cooling is completed, so that the temperature control liquid is recycled.
The control module 100 may be a single chip, a control chip, or other devices capable of implementing control functions. The control module 100 controls the temperature of the temperature control agent entering the first storage device 210 from the first circulation pipeline 220 after obtaining the temperature of the temperature control liquid in the second circulation pipeline 320, and when the temperature of the temperature control liquid in the second circulation pipeline 320 is higher than a preset value, the temperature of the temperature control agent entering the first storage device 210 is controlled to be lowered, so that the temperature of the temperature control liquid in the second circulation pipeline 320 is lowered, or when the temperature of the temperature control liquid in the second circulation pipeline 320 is lower than the preset value, the temperature of the temperature control liquid entering the first storage device 210 is controlled to be raised, so that the temperature of the temperature control liquid in the second circulation pipeline 320 is raised.
The temperature control equipment provided by the embodiment of the invention comprises a control module, a first circulation module, a second circulation module and a heat exchange module; the first circulation module comprises a first storage device for storing a temperature control agent and a first circulation pipeline communicated with the first storage device, the second circulation module comprises a second storage device for storing a temperature control liquid and a second circulation pipeline communicated with the second storage device, and the heat exchange module comprises the first storage device and the second storage device; the temperature control liquid is used for controlling the temperature of the device to be controlled by temperature; the control module is respectively connected with the first circulation module and the second circulation module and is used for controlling the temperature of the temperature control agent entering the first storage device from the first circulation pipeline according to the temperature of the temperature control liquid in the second circulation pipeline. This embodiment carries out the heat exchange to temperature control agent and temperature control liquid through heat exchange module, and control module real time control enters into the temperature of temperature control agent in first storage device, will carry out temperature control with the temperature control liquid output after the temperature control agent heat exchange to treating temperature control device, and then treats temperature control device's temperature through the control indirect control to temperature control agent temperature, realizes treating temperature control device's accurate temperature control.
Fig. 2 is a schematic structural diagram of another temperature control apparatus according to an embodiment of the present invention, and referring to fig. 2, optionally, the first circulation line 220 includes a first temperature circulation line 221 and a second temperature circulation line 222; the first temperature circulation line 221 communicates with the inlet a1 and the outlet B1 of the first storage device 210, and a first switch T1 is provided in the first temperature circulation line 221;
the first switch T1 is used to control the flow of temperature control agent at a first temperature into the first storage device 210 under the control of the control module 100;
the second temperature circulation line 222 is provided with a processing unit 2221 and a second switch T2, an inlet a2 of the processing unit 2221 is communicated with an inlet A3 of the first temperature circulation line 221, an outlet B2 of the processing unit 2221 is communicated with an inlet a1 of the first storage device 210 through a second switch T2, and the processing unit 2221 is used for processing a temperature control agent at a first temperature into a temperature control agent at a second temperature, wherein the first temperature and the second temperature are different in magnitude;
the second switch T2 is used to control the flow of temperature control agent at the second temperature into the first storage device 210 under the control of the control module 100;
the control module 100 is configured to control the opening degrees of the first switch T1 and the second switch T2 according to the temperature of the temperature control fluid in the second circulation line 320.
Alternatively, the temperature control agent is a refrigerant and the process unit 2221 is a condenser.
When the temperature-controlling agent is a refrigerant, the first circulation line 220 further includes a compressor 223, and the compressor 223 is connected between the outlet B1 of the first storage device 210 and the inlet A3 of the first temperature circulation line 221. The compressor 223 is used for compressing the low-pressure and low-temperature gaseous refrigerant after the heat exchange is completed, and discharging high-temperature and high-pressure gas, so that the first circulation pipeline 220 establishes a high-low pressure difference to provide power for the refrigerant circulation. A common end of the compressor 223 and the first switch T1 may serve as an inlet A3 of the first temperature circulation line 221. The condenser is used to cool the high-temperature and high-pressure gas discharged from the compressor 223 into a normal-temperature and high-pressure liquid. The second temperature circulating line 222 may further include a filter 2222 and a capillary tube 2223, the filter 2222 is connected between the outlet B2 of the processing unit 2221 and the second switch T2 for filtering the temperature control agent liquefied by the condenser, and the capillary tube 2223 is connected between the second switch T2 and the first temperature circulating line 221 for passing the high-pressure liquid refrigerant from the condenser into the low-pressure liquid refrigerant through throttle expansion and then into the first storage device 210.
When the temperature control agent is a refrigerant, the heat exchange module 400 may be an evaporator, and evaporates the refrigerant in the first storage device 210, and the refrigerant evaporates to absorb heat to lower the temperature of the temperature control liquid in the second storage device 310, thereby allowing the refrigerant and the temperature control liquid to perform heat exchange. The refrigerant evaporated into gas after the heat exchange is discharged from the outlet B1 of the first storage device 210, and is transferred back to the first storage device 210 through the first temperature cycle line 221 and the first switch T1, and the temperature of the vapor of the refrigerant discharged from the first switch T1 is the first temperature. The first switch T1 may be a valve.
A part of the vapor of the refrigerant flowing out of the compressor 230 flows into the first storage device 210 through the first switch T1, the other part is condensed into liquid through the condenser, the temperature of the temperature control agent condensed into liquid through the condenser is a second temperature, and the temperature control agent at the second temperature is filtered through the filter 2222 and then flows into the first storage device 210 through the second switch T2 and the capillary tube 2223. Wherein the second switch may be a solenoid valve.
The control module 100 controls the opening of the first switch T1 and the second switch T2 based on the temperature of the temperature control fluid in the second circulation line 320. For example, when the temperature of the temperature control liquid in the second circulation line 320 is higher than the set temperature, the control module 100 controls the first switch T1 to decrease the opening degree thereof, and controls the second switch T2 to increase the opening degree thereof, so that the amount of vapor, i.e., heat, of the temperature control liquid flowing into the first storage device 210 decreases, the amount of liquefied temperature control liquid, i.e., cold, increases, the temperature control liquid in the second circulation line 320 takes more heat after the temperature control liquid in the heat exchange module 400 evaporates, and the temperature of the temperature control liquid in the second circulation line 320 further decreases.
Fig. 3 is a schematic structural diagram of another temperature control apparatus according to an embodiment of the present invention, and referring to fig. 3, on the basis of the above embodiment, optionally, the second circulation pipeline 320 includes a temperature detection unit 321;
the temperature detecting unit 321 is disposed in the second circulation pipeline 320, and is configured to detect the temperature of the temperature control liquid in the second circulation pipeline 320 and transmit the temperature control liquid to the control module 100.
The temperature detection unit 321 may be a temperature sensor, and may detect the temperature of the temperature control liquid in the second circulation line 320 in real time, and upload the detected temperature to the control module 100, and the control module 100 controls the opening degrees of the first switch T1 and the second switch T2 according to the obtained temperature of the temperature control liquid.
With continued reference to fig. 3, optionally, the second circulation line 320 further includes a soaking storage unit 322 and a pump 323;
the inlet a4 of the soaking storage unit 322 communicates with the outlet B3 of the second storage device 310, and the pump body 323 communicates with the outlet B4 of the soaking storage unit 322 and the outlet B5 of the second circulation pipe 320;
the soaking storage unit 322 serves to reduce the temperature difference of the temperature control liquid.
The soaking storage unit 322 further comprises a liquid level switch 3221, the liquid level switch 3221 is used for adjusting the liquid level of the soaking storage unit 322, the soaking storage unit 322 may be a water tank or other device capable of storing a temperature control liquid, the temperature control liquid in the second storage device 310 may have a problem of temperature inconsistency between upper and lower portions of the liquid after heat exchange is completed, and the soaking storage unit 322 may make the temperatures of the upper and lower portions of the temperature control liquid consistent to reduce the temperature difference of the temperature control liquid. The pump body 323 is used for transferring the temperature control liquid in the soaking storage unit 322 to the outlet B5 of the second circulation pipeline 320, and heating or cooling the temperature control device.
The second circulation line 320 further includes a flow rate detecting unit 324, a temperature control fluid switch T3, a pressure detecting unit 325, and an input line 326, wherein the flow rate detecting unit 324 is connected between the pump body 323 and an outlet B5 of the second circulation line 320 and is configured to detect a flow rate of the temperature control fluid flowing out of the second circulation line 320, the flow rate detecting unit 324 may be a flow rate sensor, the temperature control fluid switch T3 is connected between the flow rate detecting unit 324 and the input line 326 and is configured to control the flow rate of the temperature control fluid at the outlet B5 of the second circulation line 320, and the pressure detecting unit 325 may be a pressure sensor disposed in the second circulation line 320 and configured to detect a pressure in the second circulation line 320 and upload the pressure to the control module 100. The input line 326 is connected between the temperature control device and the inlet a5 of the second storage device 310, and is used for transmitting the temperature control liquid after the temperature control of the temperature control device to be controlled back to the second storage device 310 for recycling.
The outlet B5 of the second circulation line 320 includes a first outlet B51 and a second outlet B52, the temperature control liquid after heat exchange in the second storage device 310 can be directly transferred to the first outlet B51 for output, but temperature difference between the temperature control liquids at the upper and lower parts of the second storage device 310 cannot be eliminated, the temperature control liquid after heat exchange in the second storage device 310 is transferred to the second outlet B52 through the soaking storage unit 322, the pump 323, and output, temperature difference between the temperature control liquids at the upper and lower parts of the second storage device 310 can be reduced, and temperature control accuracy of the device to be temperature controlled is higher. Meanwhile, the control module 100 may adjust the opening degree of the temperature control liquid switch T3 according to the temperature of the device to be temperature controlled, and further control the flow rate of the temperature control liquid at the outlet B5 of the second circulation line. For example, when the temperature of the device to be temperature controlled is higher than the set temperature, the control module 100 controls the opening of the temperature control liquid switch T3 to decrease, so that the temperature control liquid flowing into the input pipeline 326 decreases, the flow rate of the temperature control liquid flowing into the outlet B5 of the second circulation pipeline increases, and the temperature of the device to be temperature controlled decreases.
With continued reference to fig. 3, optionally, the control module 100 is further communicatively connected to the upper computer 500, and is configured to control the first cycle module 200 and the second cycle module 300 according to an instruction of the upper computer 500.
The control module 100 transmits the temperature of the temperature control device and the pressure value obtained by the pressure detection unit 325 to the upper computer, if the temperature exceeds or is lower than the safe temperature value or the pressure value is too high to exceed the safe pressure value, the upper computer sends a shutdown instruction to the control module 100, and the control module 100 controls all switches of the first circulation module 200 and the second circulation module 300 to be closed, so that the shutdown operation is realized, the safety interlocking is realized, and the occurrence of accidents is avoided. Meanwhile, the control module 100 can also receive instructions such as the start of work of the upper computer and the like, control the first circulation module 200 and the second circulation module 300 to execute corresponding actions, and have better remote interaction performance.
Fig. 4 is a schematic structural diagram of another temperature control device according to an embodiment of the present invention, and referring to fig. 4, optionally, the temperature control device further includes at least one branch pipeline, and a temperature control plate 610 is disposed in each branch pipeline;
the pipelines on both sides of the temperature control plate body 610 are respectively communicated with the outlet B5 and the inlet a6 of the second circulation pipeline 320, and are used for transmitting the temperature control liquid to the temperature control plate body 610 and transmitting the temperature control liquid flowing into the temperature control plate body 610 back to the second circulation pipeline 320;
the temperature control plate 610 is also in contact with the device 700 to be temperature controlled, and is used for controlling the temperature of the device 700 to be temperature controlled.
The branch pipeline includes at least one liquid distribution pipe 620 and one liquid collection pipe 630, fig. 4 exemplarily shows a case including two liquid distribution pipes 620 and two temperature control plate bodies 610, each liquid distribution pipe 620 is connected to one temperature control plate body 610, the temperature control liquid flows into the temperature control plate body 610 correspondingly connected to the liquid distribution pipe 620 through the two liquid distribution pipes 620, the temperature of the device 700 to be controlled contacting with each temperature control plate body 610 is raised or lowered, the temperature control liquid flows out through the temperature control plate body 610 after the temperature raising or lowering is completed, and the temperature control liquid flowing out from the two temperature control plate bodies 610 is retransmitted back to the second storage device 310 through the liquid collection pipe 630 so as to be reused.
A plurality of branch pipelines and a plurality of temperature control plate bodies 610 can simultaneously heat up or cool down a plurality of temperature control devices 700 to be treated, thereby improving the working efficiency.
With continued reference to fig. 3, optionally, the device to be temperature controlled is a chip.
The temperature of the packaging or testing environment of the chip needs to be accurately controlled in the packaging or testing process, the temperature of the packaging or testing environment is generally required to be within +/-0.002 ℃/5min of a set temperature range, and the control module 100 controls the first circulation module 200 and the second circulation module 300 according to the temperature of the device to be temperature controlled, so that the temperature of the device to be temperature controlled is kept stable.
Optionally, the temperature control liquid is an electronic fluorination liquid.
The electron fluorination liquid does not have conductivity, when treating that temperature control device is the chip, even temperature control equipment appears revealing, during temperature control liquid infiltration chip, can not influence the performance of chip yet, avoids taking place the electric shock accident simultaneously.
Optionally, the second storage device and the second circulation pipeline are both made of stainless steel.
When the temperature control liquid is the electronic fluorination liquid, the flowing pipeline of the electronic fluorination liquid and the material of the second storage device for storing the electronic fluorination liquid are made of stainless steel, so that the temperature control liquid is heat-resistant and corrosion-resistant, the joint is preferably welded, and the equipment is ensured not to have leakage risk.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A temperature control apparatus, comprising: the system comprises a control module, a first circulation module, a second circulation module and a heat exchange module; the first circulation module comprises a first storage device for storing a temperature control agent and a first circulation pipeline communicated with the first storage device, the second circulation module comprises a second storage device for storing a temperature control liquid and a second circulation pipeline communicated with the second storage device, and the first storage device and the second storage device are positioned in the heat exchange module;
the temperature control liquid is used for controlling the temperature of the device to be controlled by temperature;
the control module is respectively connected with the first circulation module and the second circulation module and is used for controlling the temperature of the temperature control agent entering the first storage device from the first circulation pipeline according to the temperature of the temperature control liquid in the second circulation pipeline.
2. The temperature control apparatus according to claim 1, wherein the first circulation line includes a first temperature circulation line, a second temperature circulation line; the first temperature circulating pipeline is communicated with an inlet and an outlet of the first storage device, and a first switch is arranged in the first temperature circulating pipeline;
the first switch is used for controlling the flow of the temperature control agent with the first temperature entering the first storage device under the control of the control module;
the second temperature circulating pipeline is internally provided with a processing unit and a second switch, the inlet of the processing unit is communicated with the inlet of the first temperature circulating pipeline, the outlet of the processing unit is communicated with the inlet of the first storage device through the second switch, and the processing unit is used for processing the temperature control agent at a first temperature into the temperature control agent at a second temperature, wherein the first temperature and the second temperature are different in size;
the second switch is used for controlling the flow of the temperature control agent with the second temperature entering the first storage device under the control of the control module;
the control module is used for controlling the opening degrees of the first switch and the second switch according to the temperature of the temperature control liquid in the second circulating pipeline.
3. The temperature control apparatus according to claim 1, wherein the second circulation line includes a temperature detection unit;
the temperature detection unit is arranged on the second circulating pipeline and used for detecting the temperature of the temperature control liquid in the second circulating pipeline and transmitting the temperature control liquid to the control module.
4. The temperature control apparatus according to claim 3, wherein the second circulation line further includes a soaking storage unit and a pump body;
the inlet of the soaking storage unit is communicated with the outlet of the second storage device, and the pump body is communicated with the outlet of the soaking storage unit and the outlet of the second circulation pipeline;
the soaking storage unit is used for reducing the temperature difference of the temperature control liquid.
5. The temperature control device according to claim 4, wherein the control module is further in communication connection with an upper computer, and is configured to control the first and second circulation modules according to an instruction of the upper computer.
6. The temperature control apparatus according to claim 2, wherein the temperature control agent is a refrigerant, and the process unit is a condenser.
7. The temperature control apparatus according to claim 1, further comprising at least one branch line, each of the branch lines having a temperature control plate body provided therein;
pipelines on two sides of the temperature control plate body are respectively communicated with an outlet and an inlet of the second circulating pipeline and are used for transmitting the temperature control liquid to the temperature control plate body and transmitting the temperature control liquid flowing into the temperature control plate body back to the second circulating pipeline;
the temperature control plate body is also contacted with the temperature control device to be controlled and is used for controlling the temperature of the temperature control device to be controlled.
8. The temperature control apparatus according to claim 1, wherein the device to be temperature controlled is a chip.
9. The temperature control apparatus of claim 8, wherein the temperature control liquid is an electronic fluoride liquid.
10. The temperature control apparatus according to any one of claims 1 to 9, wherein the second storage device and the second circulation line are both made of stainless steel.
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| CN202110168928.0A CN112856841A (en) | 2021-02-07 | 2021-02-07 | Temperature control device |
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| CN202110168928.0A CN112856841A (en) | 2021-02-07 | 2021-02-07 | Temperature control device |
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| WO2020174530A1 (en) * | 2019-02-25 | 2020-09-03 | Ａｔｓジャパン株式会社 | Refrigerant control system and cooling system |
| WO2020261749A1 (en) * | 2019-06-26 | 2020-12-30 | 伸和コントロールズ株式会社 | Temperature control device and temperature regulation device |
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