CN112847107B - Material chemical polishing equipment - Google Patents
Material chemical polishing equipment Download PDFInfo
- Publication number
- CN112847107B CN112847107B CN202110173190.7A CN202110173190A CN112847107B CN 112847107 B CN112847107 B CN 112847107B CN 202110173190 A CN202110173190 A CN 202110173190A CN 112847107 B CN112847107 B CN 112847107B
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- CN
- China
- Prior art keywords
- positioning
- belt wheel
- driven belt
- dust collection
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Abstract
The invention discloses a material chemical polishing device, which relates to the technical field of polishing devices and comprises a rack, wherein a driving motor is fixedly arranged on the rack, a driving belt wheel is fixedly arranged on an output shaft of the driving motor, a driving belt is wound on the driving belt wheel and a driven belt wheel, the top end of the driven belt wheel is fixedly connected with a rotating shaft through a plurality of connecting rods, the rotating shaft is in running fit with the rack, and a grinding ring is fixedly arranged on the inner wall of the driven belt wheel; the rack is also provided with a lifting platform, the top end of the lifting platform is fixedly provided with two sliding rods, the two sliding rods are respectively in sliding fit with a positioning plate, the positioning plate is positioned above the sliding rods and below the driven belt wheel, the positioning plate is provided with a moving plate, two ends of the moving plate are respectively provided with a handle, and the moving plate is also provided with two opposite electric push rods; the bottom of movable plate sets firmly a plurality of locating lever, is provided with the locating hole with the locating lever one-to-one on the locating plate, and the locating lever can insert in the locating hole that corresponds. The invention is convenient to use.
Description
Technical Field
The invention relates to the technical field of polishing equipment, in particular to material chemical polishing equipment.
Background
Material chemistry is a new cross discipline, belongs to an important branch of the fields of modern material science, chemistry and chemical industry, is a basis and a precursor for developing a plurality of high-tech fields, makes a unique contribution in the fields of discovery and synthesis of new materials, development of nanometer material preparation and modification processes, innovation of a characterization method and the like, and has wide application prospect in strategic significance of designing new materials on atomic and molecular levels. Chemical materials need to be polished before being used, and products need to be polished after the materials are chemically made into the products, so that the polishing device needs to be used, and the traditional material chemical polishing device has some problems, such as: when general material chemical polishing equipment is used, the polishing equipment needs to be conveyed into the material chemical polishing equipment by hands, and the material chemical polishing equipment is unsafe, and when the polished object is directly taken, the temperature of the object is high, so that the object is not beneficial to taking.
Disclosure of Invention
The invention aims to provide a material chemical polishing device, which is used for solving the problems in the prior art and is convenient for operators to polish chemical products of materials.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a material chemical polishing device, which comprises a rack, wherein a driving motor is fixedly arranged on the rack, a driving belt wheel is fixedly arranged on an output shaft of the driving motor, a driving belt is wound on the driving belt wheel and a driven belt wheel, the driven belt wheel is in a hollow cylindrical shape, the top end of the driven belt wheel is fixedly connected with a rotating shaft through a plurality of connecting rods, the rotating shaft is in rotating fit with the rack through a bearing, and a grinding ring is fixedly arranged on the inner wall of the driven belt wheel; the sample clamping device is characterized in that a lifting table is further arranged on the rack, two horizontal and parallel slide bars are fixedly arranged at the top end of the lifting table, the two slide bars are respectively in sliding fit with a positioning plate, the positioning plate is positioned above the slide bars and below the driven belt wheel, a moving plate is arranged on the positioning plate, two handles are respectively arranged at two ends of the moving plate, two opposite electric push rods are further arranged on the moving plate, and the two electric push rods can move in opposite directions to clamp a sample; the bottom end of the movable plate is fixedly provided with a plurality of positioning rods, the positioning plates are provided with positioning holes corresponding to the positioning rods one by one, and the positioning rods can be inserted into the corresponding positioning holes; one end of the sliding rod is located in the horizontal projection of the driven belt wheel, and the other end of the sliding rod extends out of the horizontal projection.
Preferably, the rack is also fixedly provided with a dust absorption air pump and a dust collection box communicated with an air outlet of the dust absorption air pump; each positioning rod is provided with a through hole coaxial with the positioning rod, the movable plate is provided with dust collection holes corresponding to the through holes one by one, the dust collection holes penetrate through the top surface and the bottom surface of the movable plate, and the dust collection holes are communicated with the corresponding through holes; the locating hole link up the top surface and the bottom surface of locating plate, the bottom of locating hole is connected with branch dust absorption pipe, a plurality of divide the dust absorption pipe all with total dust absorption pipe intercommunication, total dust absorption pipe with the air inlet intercommunication of dust absorption air pump.
Preferably, one end of each connecting rod is fixedly connected with the driven belt pulley, the other end of each connecting rod is fixedly connected with the rotating shaft, and a fan-shaped observation window is arranged between any two adjacent connecting rods; the rotating shaft and the driven belt wheel are fixedly connected with the observation window respectively.
Preferably, the driving pulley and the driven pulley are both horizontal.
Preferably, one end of the sliding rod, which extends out of the horizontal projection, is provided with scale marks.
Preferably, a chuck is fixedly arranged at the free end of the electric push rod.
Compared with the prior art, the invention achieves the following technical effects:
the material chemical polishing equipment is convenient to use, and can greatly facilitate operators to polish chemical products of materials. The material chemical polishing equipment can observe a sample through the observation window in the using process, and the positioning plate can slide along the sliding rail by pulling the handle, so that the movement of the sample is controlled; the dust generated in the polishing process can be quickly sucked out by the dust suction air pump; can take off the movable plate from the locating plate through holding the handle to conveniently take out the sample, thereby when avoiding the polishing to finish, the sample temperature is too high, is unfavorable for the problem of taking.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a material chemical polishing apparatus according to the present invention;
FIG. 2 is a schematic view of a part of the structure of the material chemical polishing apparatus according to the present invention;
FIG. 3 is a schematic diagram of a second partial structure of the material chemical polishing apparatus according to the present invention;
FIG. 4 is a schematic diagram of a third partial structure of the material chemical polishing apparatus according to the present invention;
FIG. 5 is a schematic view of a part of the structure of the material chemical polishing apparatus according to the present invention;
wherein: 100. a material chemical polishing device; 1. a frame; 2. a drive motor; 3. a driving pulley; 4. a transmission belt; 5. a driven pulley; 6. grinding a ring; 7. a connecting rod; 8. an observation window; 9. a rotating shaft; 10. a slide bar; 11. positioning a plate; 12. moving the plate; 13. a handle; 14. a dust collection hole; 15. a dust absorption air pump; 16. a dust collection box; 17. a chuck; 18. positioning holes; 19. positioning a rod; 20. an electric push rod; 21. scale marks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
The invention aims to provide a material chemical polishing device, which is used for solving the problems in the prior art and is convenient for operators to polish chemical products of materials.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1 to 5: the embodiment provides a material chemical polishing device 100, which comprises a frame 1, wherein a driving motor 2 is fixedly arranged on the frame 1, a driving belt pulley 3 is fixedly arranged on an output shaft of the driving motor 2, a driving belt 4 is wound on the driving belt pulley 3 and a driven belt pulley 5, the driven belt pulley 5 is hollow cylindrical, the top end of the driven belt pulley 5 is fixedly connected with a rotating shaft 9 through a plurality of connecting rods 7, the rotating shaft 9 is in rotating fit with the frame 1 through a bearing, a grinding ring 6 is fixedly arranged on the inner wall of the driven belt pulley 5, and the driving belt pulley 3 and the driven belt pulley 5 are both horizontal; one end of each connecting rod 7 is fixedly connected with the driven belt wheel 5, the other end of each connecting rod 7 is fixedly connected with the rotating shaft 9, a fan-shaped observation window 8 is arranged between any two adjacent connecting rods 7, and the observation windows 8 are transparent; pivot 9 and driven pulley 5 link firmly with observation window 8 respectively, and further, sealing connection between observation window 8 and connecting rod 7, pivot 9, the driven pulley 5 is suitable.
A lifting platform is further arranged on the rack 1 and driven by a hydraulic cylinder, a lifting platform main body is fixedly connected with the free end of a piston rod of the hydraulic cylinder, the piston rod is vertical, and the hydraulic rod drives the lifting platform to move up and down; two horizontal and parallel slide bars 10 are fixedly arranged at the top end of the lifting platform, the two slide bars 10 are respectively in sliding fit with a positioning plate 11, the positioning plate 11 is positioned above the slide bars 10 and below the driven belt wheel 5, a moving plate 12 is arranged on the positioning plate 11, two handles 13 are respectively arranged at two ends of the moving plate 12, two opposite electric push rods 20 are also arranged on the moving plate 12, and the two electric push rods 20 can move in opposite directions so as to clamp a sample; a plurality of positioning rods 19 are fixedly arranged at the bottom end of the moving plate 12, positioning holes 18 corresponding to the positioning rods 19 one by one are formed in the positioning plate 11, and the positioning rods 19 can be inserted into the corresponding positioning holes 18; one end of the sliding rod 10 is positioned in the horizontal projection of the driven belt wheel 5, the other end of the sliding rod extends out of the horizontal projection, and scale marks 21 are arranged at one end of the sliding rod 10, which extends out of the horizontal projection.
The frame 1 is also fixedly provided with a dust absorption air pump 15 and a dust collection box 16 communicated with an air outlet of the dust absorption air pump 15; each positioning rod 19 is provided with a through hole coaxial with the positioning rod 19, the movable plate 12 is provided with dust collection holes 14 corresponding to the through holes one by one, the dust collection holes 14 penetrate through the top surface and the bottom surface of the movable plate 12, and the dust collection holes 14 are communicated with the corresponding through holes; the positioning hole 18 penetrates through the top surface and the bottom surface of the positioning plate 11, the bottom end of the positioning hole 18 is connected with the branch dust suction pipes, the branch dust suction pipes are communicated with the main dust suction pipe, and the main dust suction pipe is communicated with an air inlet of the dust suction air pump 15.
The material chemical polishing apparatus 100 of the present embodiment is used as follows:
firstly, putting down the lifting platform, placing a material chemical sample to be polished between the two electric push rods 20, then starting the two electric push rods 20, and enabling the two electric push rods 20 to push the two chucks 17 to move oppositely until the two chucks 17 clamp the material chemical sample; then the moving plate 12 is placed on the positioning plate 11, the positioning rod 19 is inserted into the corresponding positioning hole 18, and then the handle 13 needs to be pushed to drive the positioning plate 11 to slide along the slide bar 10, so that the material chemical sample is positioned in the horizontal projection of the driven belt wheel 5 and is positioned at the inner side of the horizontal projection of the grinding ring 6; then the lifting platform is lifted until the chemical sample of the material to be polished is level with the grinding ring 6; then, a driving motor 2 is started, the driving motor 2 drives a gear ring to rotate through a driving belt wheel 3, a transmission belt 4 and a driven belt wheel 5, then a positioning plate 11 is moved through a control handle 13, and is adjusted through observing scale marks 21 on a sliding rod 10, so that a polished material chemical sample is slowly contacted with a grinding ring 6 rotating at a high speed, and thus the material chemical sample is ground, in the grinding process, a dust collection air pump 15 is also started, and dust generated in grinding and polishing finally enters a dust collection box 16 through a dust collection hole 14, a positioning rod 19, a positioning hole 18, a branch dust collection pipe, a main dust collection pipe and the dust collection air pump 15.
In the description of the present invention, it should be noted that the terms "vertical", "horizontal", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above description of the embodiments is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (4)
1. A material chemical polishing device is characterized in that: the grinding machine comprises a rack, wherein a driving motor is fixedly arranged on the rack, a driving belt wheel is fixedly arranged on an output shaft of the driving motor, a transmission belt is wound on the driving belt wheel and a driven belt wheel, the driven belt wheel is in a hollow cylindrical shape, the top end of the driven belt wheel is fixedly connected with a rotating shaft through a plurality of connecting rods, the rotating shaft is in running fit with the rack through a bearing, and a grinding ring is fixedly arranged on the inner wall of the driven belt wheel; the automatic polishing machine is characterized in that a lifting table is further arranged on the rack, two horizontal and parallel slide bars are fixedly arranged at the top end of the lifting table, the two slide bars are respectively in sliding fit with a positioning plate, the positioning plate is positioned above the slide bars and below the driven belt pulley, a moving plate is arranged on the positioning plate, two handles are respectively arranged at two ends of the moving plate, two opposite electric push rods are further arranged on the moving plate, the two electric push rods can move in opposite directions to clamp a sample, and the sample is polished by utilizing the inner side wall of the grinding ring; the bottom end of the movable plate is fixedly provided with a plurality of positioning rods, the positioning plates are provided with positioning holes corresponding to the positioning rods one by one, and the positioning rods can be inserted into the corresponding positioning holes; one end of the sliding rod is positioned in the horizontal projection of the driven belt wheel, and the other end of the sliding rod extends out of the horizontal projection;
the frame is also fixedly provided with a dust absorption air pump and a dust collection box communicated with an air outlet of the dust absorption air pump; each positioning rod is provided with a through hole coaxial with the positioning rod, the movable plate is provided with dust collection holes corresponding to the through holes one by one, the dust collection holes penetrate through the top surface and the bottom surface of the movable plate, and the dust collection holes are communicated with the corresponding through holes; the positioning hole penetrates through the top surface and the bottom surface of the positioning plate, the bottom end of the positioning hole is connected with branch dust collection pipes, a plurality of branch dust collection pipes are communicated with a main dust collection pipe, and the main dust collection pipe is communicated with an air inlet of the dust collection air pump;
one end of each connecting rod is fixedly connected with the driven belt wheel, the other end of each connecting rod is fixedly connected with the rotating shaft, and a fan-shaped observation window is arranged between any two adjacent connecting rods; the rotating shaft and the driven belt wheel are fixedly connected with the observation window respectively.
2. The material chemical polishing apparatus according to claim 1, characterized in that: the driving pulley and the driven pulley are both horizontal.
3. The material chemical polishing apparatus according to claim 1, characterized in that: and scale marks are arranged at one end of the sliding rod, which extends out of the horizontal projection.
4. The material chemical polishing apparatus according to claim 1, wherein: and a chuck is fixedly arranged at the free end of the electric push rod.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2021100283693 | 2021-01-02 | ||
| CN202110028369 | 2021-01-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112847107A CN112847107A (en) | 2021-05-28 |
| CN112847107B true CN112847107B (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110173190.7A Active CN112847107B (en) | 2021-01-02 | 2021-02-06 | Material chemical polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112847107B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7281535B2 (en) * | 2004-02-23 | 2007-10-16 | Towa Intercon Technology, Inc. | Saw singulation |
| JP6025325B2 (en) * | 2011-12-19 | 2016-11-16 | 株式会社東京精密 | Wafer grinding method |
| CN204148966U (en) * | 2014-10-22 | 2015-02-11 | 科络普线束技术（绵阳）有限公司 | A kind of Novel wire harness sander |
| CN206253998U (en) * | 2016-12-01 | 2017-06-16 | 重庆市道诚机械有限公司 | Workbench |
| CN106914800A (en) * | 2017-03-08 | 2017-07-04 | 广东科达洁能股份有限公司 | Do the dry polishing system of throwing method and application the method in a kind of pottery brick brick face |
| CN207027116U (en) * | 2017-06-30 | 2018-02-23 | 深圳市深量科技有限公司 | Milling cutter grinder |
| CN209256639U (en) * | 2018-11-01 | 2019-08-16 | 南昌科冠科技有限公司 | A kind of copper rod machining burnishing device |
| CN210060646U (en) * | 2019-06-28 | 2020-02-14 | 同辉电子科技股份有限公司 | Polishing device for silicon carbide wafer |
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2021
- 2021-02-06 CN CN202110173190.7A patent/CN112847107B/en active Active
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| Publication number | Publication date |
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| CN112847107A (en) | 2021-05-28 |
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