CN112838179A

CN112838179A - Display panel and preparation method thereof

Info

Publication number: CN112838179A
Application number: CN202110017572.0A
Authority: CN
Inventors: 景小红
Original assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2021-01-07
Filing date: 2021-01-07
Publication date: 2021-05-25

Abstract

The application discloses a display panel and a preparation method thereof, wherein the method comprises the following steps: preparing a sealing glue bearing structure on a substrate; forming a sealant on the sealant carrying structure; forming a flexible base layer on one side surface of the substrate base plate provided with the sealing glue bearing structure; preparing a display structure layer on the upper surface of the flexible base layer; cutting the flexible base layer; and removing the substrate base plate. The display panel is prepared by the method. This application does not use the mode separation substrate base plate and the flexible basic unit that laser peeled off at the in-process of preparation display panel, avoids the particulate matter that the laser in-process produced to influence display effect.

Description

Display panel and preparation method thereof

Technical Field

The application relates to the field of display, in particular to a display panel and a preparation method thereof.

Background

In the traditional method for manufacturing the flexible OLED display device, a flexible base layer, an array layer preparation process, an evaporation or printing light-emitting layer and an encapsulation layer are coated or attached on substrate glass, and then the flexible base layer is separated from the substrate glass through a laser stripping technology.

In the preparation of the flexible OLED, the manufacturing process of each layer of display structure is firstly completed on the substrate glass, laser is focused on the interface between the flexible base layer and the substrate glass through a laser peeling technology, and partial SI-O bonds and Van der Waals force between the substrate glass and the flexible base layer are broken after absorbing the energy of the laser, so that the substrate glass is separated from the flexible base layer.

In view of the above problems of equipment cost and process difficulty, it is necessary to develop a process method capable of solving the above problems.

Disclosure of Invention

An object of the present application is to provide a display panel and a manufacturing method thereof, which can solve the technical problem that the use performance of the display panel is affected by the residual of particles caused by peeling the substrate and the flexible base layer by laser in the existing flexible display panel manufacturing process.

The preparation method of the display panel comprises the following steps: preparing a sealing glue bearing structure on a substrate; forming a sealant on the sealant carrying structure; forming a flexible base layer on one side surface of the substrate base plate provided with the sealing glue bearing structure; preparing a display structure layer on the upper surface of the flexible base layer; cutting the flexible base layer; and removing the substrate base plate.

Furthermore, in the step of preparing the adhesive tape bearing structure on a substrate, the adhesive tape bearing structure is arranged on the edge side of the substrate, and the adhesive tape bearing structure is annular.

Further, the molding compound bearing structure is an annular groove arranged on the substrate base plate.

Further, the molding compound bearing structure is one of an edge step structure, an edge slope structure or an edge cambered surface structure arranged on the substrate.

Further, in the step of forming a flexible base layer on one side surface of the substrate base plate provided with the sealing glue bearing structure, the substrate base plate is placed in a vacuum or negative pressure environment, a layer of polyimide solution is coated on the upper surface of the substrate base plate to form the flexible base layer, and the flexible base layer is attached to the area surrounded by the sealing glue bearing structure in a vacuum mode.

Furthermore, in the step of preparing the encapsulation bearing structure on a substrate base plate, an exhaust groove is formed in each side edge of the substrate base plate, one end of each exhaust groove is connected to the annular groove and communicated with the annular groove, and the other end of each exhaust groove faces the outer side of the substrate base plate and is used for exhausting.

Further, in the step of cutting the flexible base layer, the flexible base layer is cut along the inner side of the sealing compound in a laser cutting mode, so that the space between the flexible base layer and the substrate base plate is in a vacuum breaking state.

Further, after the step of forming the flexible base layer on the side of the substrate with the glue sealing bearing structure, the preparation method further comprises the following steps: and curing the sealing compound by adopting ultraviolet light.

Further, the step of preparing the display structure layer on the upper surface of the flexible base layer includes: forming an array layer on the upper surface of the flexible base layer; forming a light emitting layer on the upper surface of the array layer; and carrying out packaging treatment on the upper surface of the light-emitting layer to form a packaging layer.

The display panel is prepared by the preparation method of the display panel.

The technical effect of this application lies in, in whole display panel's preparation in-process, adopts the flexible basic unit of cutting in order to destroy the broken vacuum of encapsulated situation to make flexible basic unit and the smooth separation of substrate base plate. This application does not adopt traditional laser mode of peeling off to separate substrate base plate and flexible basic unit, does not have the particulate matter of laser peeling off in-process naturally and remains, avoids appearing the particulate matter and remains the phenomenon that the back influences show the rete, guarantees the level and smooth of each rete of display panel to and the inseparable laminating between each rete. Meanwhile, the preparation cost of the display panel can be greatly reduced without adopting a laser lift-off technology.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

FIG. 2 is a top view of an encapsulation structure and a substrate according to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of an exemplary embodiment of a molding compound carrier structure;

FIG. 4 is a cross-sectional view of an exemplary embodiment of an encapsulant support structure with an edge step structure;

FIG. 5 is a cross-sectional view of an exemplary embodiment of an adhesive tape carrier structure with an edge bevel structure;

FIG. 6 is a cross-sectional view of an edge cambered surface structure molding compound carrying structure provided in the present application;

FIG. 7 is a schematic view of a position of an encapsulant according to an embodiment of the present disclosure;

FIG. 8 is a schematic representation of the flexible substrate provided in the examples herein after it has been prepared;

FIG. 9 is a schematic diagram illustrating a display structure layer after preparation according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of the cutting of the flexible substrate provided by embodiments of the present application;

FIG. 11 is a schematic view of the flexible base layer separated from the substrate provided by an embodiment of the present application;

fig. 12 is a schematic structural diagram of a display panel according to an embodiment of the present application.

Description of reference numerals:

1. a substrate base plate; 2. sealing glue bearing structure; 3. an exhaust groove; 4. sealing; 5. a flexible base layer; 6. displaying the structural layer; 7. a vacuum adsorption platform;

61. an array layer; 62. a light emitting layer; 63. a packaging layer; 64. and (7) a cover plate.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The embodiment of the application provides a display panel and a preparation method thereof. These will be described in detail below.

As shown in fig. 1 to 11, an embodiment of the present application provides a method for manufacturing a display panel, including steps S1 to S7.

S1, preparing a molding compound carrying structure 2 on a Substrate 1, specifically, providing a Substrate (Substrate Glass)1, where the Substrate 1 is a hard Substrate, generally a Glass Substrate, and has a good supporting function.

Preparing a sealing adhesive bearing structure 2 and an exhaust duct 3 (see fig. 2) on the front surface of the substrate base plate 1, wherein the sealing adhesive bearing structure 2 is arranged on the peripheral edge side of the substrate base plate 1, and the sealing adhesive bearing structure 2 is annular. In the embodiment shown in fig. 3, the molding compound carrier 2 is an annular groove (see fig. 3), and the molding compound carrier 2 is used for carrying molding compound.

The plurality of air discharge grooves 3 are disposed at each side edge of the substrate base plate 1, the air discharge grooves 3 are communicated with the molding compound carrying structure 2, in this embodiment, the air discharge grooves 3 are perpendicular to the molding compound carrying structure 2 (see fig. 2), and the air discharge grooves 3 are used for discharging air subsequently to perform vacuum breaking treatment. In detail, one end of the exhaust groove 3 is connected to and communicates with the annular groove, and the other end of the exhaust groove 3 faces the outside of the substrate base plate 1 for exhausting.

In other embodiments of the present application, the molding compound carrying structure 2 may not be a groove, for example: the molding compound carrying structure 2 may be an edge step structure (see fig. 4) disposed on the substrate 1, as long as it can carry molding compound.

In other embodiments of the present application, the sealant carrying structure 2 can also be an edge bevel structure (see fig. 5) disposed on the substrate base plate 1, and can also carry sealant.

In other embodiments of the present application, the sealant carrying structure 2 can also be an edge-cambered structure (see fig. 6) disposed on the substrate 1, and can also carry sealant.

And cleaning the substrate base plate 1, and cleaning particulate matters generated when the sealing adhesive bearing structure 2 is prepared, so that the substrate base plate 1 is in a clean state.

S2 forming a sealant 4 on the sealant-carrying structure 2 (see fig. 7); for example, dispensing is performed on the molding compound carrying structure 2 to form a molding compound 4, because the molding compound 4 is located on the molding compound carrying structure 2, the molding compound 4 is an annular molding compound, the used glue can be liquid glue or solid glue, and the glue is not limited in this embodiment.

S3 forming a flexible substrate 5 (see fig. 8) on a side of the substrate 1 where the molding compound bearing structure 2 is disposed, specifically, placing the substrate 1 in a negative pressure or vacuum environment, coating a layer of polyimide solution on an upper surface of the substrate 1 to form a flexible base layer 5, and forming the flexible base layer 5 to be closely attached to the substrate 1, where it should be noted that the flexible base layer 5 is disposed in an area surrounded by the molding compound bearing structure 2, that is, the flexible base layer 5 completely falls into the area surrounded by the molding compound bearing structure 2, and a gap is still left on a periphery of the flexible base layer 5 and does not completely fill the area surrounded by the molding compound bearing structure 2, so as to facilitate subsequent cutting.

S4, curing the molding compound 4, and curing the molding compound 4 with ultraviolet light, wherein in other embodiments, the curing method may also be thermal curing. The cured sealing adhesive 4 is in a vacuum state in the sealing adhesive bearing structure 2, and the vacuum sealing state is also maintained between the substrate base plate 1 and the flexible base layer 5. However, if the material of the molding compound 4 is glue that does not need to be cured, this step can be omitted and the next step can be performed directly.

S5, preparing a display structure layer 6 on the upper surface of the flexible base layer 5 (see fig. 9), specifically, at this time, the flexible base layer 5 and the substrate 1 are both in a vacuum sealed state, forming an Array layer (Array)61 on the upper surface of the flexible base layer 5, forming a light emitting layer 62 on the upper surface of the Array layer 61, performing an encapsulation process on the upper surface of the light emitting layer 62 to form an encapsulation layer 63, covering a cover plate 64 on the upper surface of the encapsulation layer 63, so as to obtain the display structure layer 6, where the cover plate 64 is used to protect the display structure layer 6 from external friction and collision, and at this time, the display structure layer 6, the flexible base layer 5 and the substrate 1 are all in a vacuum sealed state.

S6 cutting the flexible substrate 5, specifically, absorbing the side of the display structure layer 6 away from the substrate base plate 1 by using a vacuum absorbing platform 7, in this embodiment, absorbing the side of the display structure layer 6 where the cover plate 64 is disposed by using the vacuum absorbing platform 7.

Then, the flexible base layer 5 is cut along the inner side of the annular area surrounded by the sealing compound 4 by means of laser cutting, and the cutting position is as shown by the arrow direction in fig. 10, so that the space between the flexible base layer 5 and the substrate base plate 1 is in a vacuum breaking state, and the vacuum breaking gas can be discharged from the exhaust groove 3, thereby separating the flexible base layer 5 and the substrate base plate 1.

S7 removing the cut substrate board 1 (see fig. 11), specifically, applying an adsorption platform 7 on a side of the substrate board 1 away from the flexible base layer 5, removing the adhesive 4 on the substrate board 1 and the cut remaining flexible base layer 5 through the adsorption platform 7, adsorbing the remaining flexible base layer 5 and the display structure layer 6 through the adsorption platform 7 on the lower surface of the cover plate 64, turning the substrate board 1 and the adhesive 4 together, and turning the substrate board and the display structure layer by 180 ° so that the flexible base layer 5 is located at the bottom, and finally removing the remaining adsorption platform 7, where the obtained part is a display panel (see fig. 12).

In the whole manufacturing process of the display panel, the flexible base layer is cut to break the vacuum in the sealing state, so that the flexible base layer 5 is smoothly separated from the substrate base plate 1. According to the embodiment, the substrate base plate 1 and the flexible base layer 5 are not separated by adopting a traditional laser stripping mode, particles in the laser stripping process are not remained naturally, the phenomenon that the display film layers are affected after the particles are remained is avoided, the smoothness of all the film layers of the display panel and the close attachment between all the film layers are ensured, and the yield in the process of separating the substrate base plate 1 and the flexible base layer 5 is improved. Meanwhile, the preparation cost of the display panel can be greatly reduced without adopting a laser lift-off technology.

As shown in fig. 12, the present embodiment provides a display panel, which is a flexible display panel and includes a flexible base layer 5 and a display structure layer 6.

The flexible base layer 5 is made of polyimide material, has good bending property, and is not the second choice of the flexible display panel substrate.

The display structure layer 6 is disposed on one side of the flexible substrate 5, and in this embodiment, the display structure layer 6 is disposed on the upper surface of the flexible substrate 5.

The display structure layer 6 mainly plays a role of driving and displaying.

The display structure layer 6 includes an array layer 61, a light emitting layer 62, an encapsulation layer 63, and a cover plate 64.

The array layer 61 has a plurality of thin film transistors TFT as a main component of a driving circuit in the display panel, and functions as a switching circuit.

The light-emitting layer 62 is disposed on a side of the array layer 61 away from the flexible base layer 5, in this embodiment, the light-emitting layer 62 is disposed on an upper surface of the array layer 61, and the light-emitting layer 62 is used for displaying color light and includes a plurality of light-emitting units, each of which has a sub-pixel therein.

The encapsulating layer 63 is disposed on a side of the light emitting layer 62 away from the array layer 61, in this embodiment, the encapsulating layer 63 is disposed on an upper surface of the light emitting layer 62 to protect the light emitting layer 62 and the array layer 61 and block external water and oxygen.

The cover plate 64 is disposed on a side of the encapsulation layer 63 away from the light emitting layer 62, and in this embodiment, the cover plate 64 is disposed on an upper surface of the encapsulation layer 63 to protect the display structure layer 6 from external friction and collision.

The display panel has the technical effects that the display panel is prepared by the preparation method of the display panel, all film layers in the display panel are flat and smooth, no particulate matter is left, all film layers are tightly attached to each other, and normal luminous display of the display panel is guaranteed.

The display panel and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principle and the embodiment of the present application are explained herein by applying specific examples, and the description of the embodiments above is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A preparation method of a display panel is characterized by comprising the following steps:

preparing a sealing glue bearing structure on a substrate;

forming a sealant on the sealant carrying structure;

forming a flexible base layer on one side surface of the substrate base plate provided with the sealing glue bearing structure;

preparing a display structure layer on the upper surface of the flexible base layer;

cutting the flexible base layer; and

and removing the substrate base plate.

2. The method of claim 1, wherein in the step of forming the molding compound carrier on a substrate,

the sealing glue bearing structure is arranged on the edge side of the substrate base plate and is annular.

3. The method of claim 2, wherein the molding compound carrier is a ring-shaped groove disposed on the substrate.

4. The method of claim 2, wherein the molding compound carrier structure is one of an edge step structure, an edge bevel structure, or an edge arc structure disposed on the substrate.

5. The method for manufacturing a display panel according to claim 2, wherein in the step of forming a flexible base layer on a side of the substrate having the molding compound loading structure,

and placing the substrate base plate in a vacuum or negative pressure environment, coating a layer of polyimide solution on the upper surface of the substrate base plate to form a flexible base layer, and attaching the flexible base layer to the area surrounded by the sealing glue bearing structure in a vacuum manner.

6. The method as claimed in claim 3, wherein in the step of forming the molding compound carrier on a substrate,

and each side edge of the substrate base plate is provided with an exhaust groove, one end of each exhaust groove is connected to the annular groove and communicated with the annular groove, and the other end of each exhaust groove faces the outer side of the substrate base plate and is used for exhausting.

7. The method of manufacturing a display panel according to claim 5, wherein in the step of cutting the flexible base layer,

and cutting the flexible base layer along the inner side of the sealing glue in a laser cutting mode, so that the flexible base layer and the substrate base plate are in a vacuum breaking state.

8. The method for manufacturing a display panel according to claim 1, wherein after the step of forming the flexible base layer on the side of the substrate having the molding compound loading structure, the method further comprises the steps of:

and curing the sealing compound by adopting ultraviolet light.

9. The method for manufacturing a display panel according to claim 1, wherein the step of manufacturing a display structure layer on the upper surface of the flexible base layer comprises:

forming an array layer on the upper surface of the flexible base layer;

forming a light emitting layer on the upper surface of the array layer; and

and carrying out packaging treatment on the upper surface of the luminous layer to form a packaging layer.

10. A display panel prepared by the method for preparing a display panel according to any one of claims 1 to 9.